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Seminar on

Microsystems Packaging—The New Economic Driver

Funded by: Innovation and Technology Commission (ITC) The Government of the Hong Kong SAR

Organised by: PCB Technology Centre Advanced Manufacturing Technology Research Centre Department of Industrial and Systems Engineering The Hong Kong Polytechnic University

Supported by:

IEE (HK), Specialised Section in Manufacturing and Systems Engineering

The Hong Kong Productivity Council

Date: 16 December 2002 (Monday) Time: Seminar 6:30 p.m. — 8:00 p.m. Dinner 8:00 p.m. — 9:30 p.m.

Venue: Seminar M103, 1/F., Li Ka Shing Tower The Hong Kong Polytechnic University Hung Hom, Kowloon, Hong Kong Dinner The High Table, 15/F., Li Ka Shing Tower The Hong Kong Polytechnic University Hung Hom, Kowloon, Hong Kong

Fee: Seminar Free Dinner HK$85.00

Contact Person:

Introduction

Should you have any queries, please feel free to contact Miss Carrie Cheung at (852) 2766-7974. Web-site: http://www.ise.polyu.edu.hk/pctech

Registration Form

Speaker Profile

Professor Bernard Hon is the holder of the first Chair of Manufacturing Systems at the University of Liverpool since 1990. Previously, he has held academic appointments at Birmingham, Bath and Dundee Universities. He is the Founding Director of the Product Innovation and Development Centre and the Merseyside TCS Centre. Apart from serving in the National Technology Foresight Programme in the UK, he has also advised Australia, India, Singapore and US government bodies on research and development in manufacturing. Professor Hon, originally from Hong Kong, is a regular visitor to Hong Kong higher education institutions.

Microsystem technology is becoming mature and numerous micro-machining, micro-fabrication, micro-moulding techniques are at our disposal. Examples of successful products today include inkjet, CD read/write head and car sensors. While its potential is enormous, its applications are still patchy and limited. In a major recent survey, the North West Development Agency (NWDA) has identified that a key aspect for the promotion and exploitation of Microsystems is packaging technologies. This presentation will discuss the current market situation, advances in Microsystems, application domains, the role of packaging and the proposed North West Microsystems Packaging Centre.

Programme

Time Topics Speakers

6:30 p.m. Registration

6:45 p.m. Welcoming Address Prof. T.C. Lee Associate Professor, ISE Dept., PolyU

6:50 p.m. Seminar Prof. Bernard Hon The University of Liverpool

7:45 p.m. Q & A Prof. Bernard Hon The University of Liverpool

8:00 p.m. Dinner The High Table, 15/F., Li Ka Shing Tower, The Hong Kong Polytechnic University

Microsystems Packaging - The New Economic Driver To : Miss Carrie Cheung PCB Technology Centre, Department of Industrial and Systems Engineering The Hong Kong Polytechnic University Phone : (852) 2766 7974 Fax: (852) 2362 9787 I will attend Seminar (Free) Seminar and Dinner (HK$85.00) ☛ Seats for seminar are limited to 25. All seats are allocated on first-come-first-served basis. ☛ No refunds will be made for cancellation or ‘no-show’ participants. (please √ where appropriate)

Registration and Payment Method Please complete and return the Registration Form either by mail or by fax on or before 14 December 2002. Please make your cheque payable to “The Hong Kong Polytechnic University” and mail to Room DE003, PCB Technology Centre, Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong. # Please delete as appropriate.

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Professor Bernard Hon Professor, Department of Engineering, University of Liverpool