Micromechatronics products

Cooling Solution

Active Cooling Motor -fan

Piezo Fan

Microblower

Passive Cooling Natural Convection

ES: Now, MP:2011/Q1~

ES: Now, MP:2010/Q3~

Application of Micromechatronics Products

MicropumpMicrovalve

CPU

Next Generation Energy System

Fuel Cell

Air Cooling DeviceDMFC

(Direct methanol Fuel Cell)

Microblower

Piezo Fan

Air Pump application

NETTOP PCNETBOOK

Small/Mobile Equipment

Micro ProjectorLED

LightningSecurity Camera

Air Fresh Toys/Game, etc

Profile of Microblower

Thermal technology is increasing its importance, especially in small/compact electronic equipments.Customers are looking for a smaller cooling device than DC fan.

Feature- Small and thin (20201.8mm)- High output pressure (1kPa)- Low power consumptionApplication-Air cooler for compact equipmentssuch as DVC, DSC, and UMPC, etc

-Air pump for Fuel Cell, Gas Sensor,Ionizer, Fragrance, etc.

Gas Sensor

(ex. Reflow Checker)

LED Cooling

(ex. Micro-projector)

PC Cooling

(ex. Net Top Book)

P/N: MZB1001T**

Confidential

Air Cooling & Air pumpMicroblower Technology

Item Specification

Driving Frequency 25KHz

Air flow 0.8l/min(@15Vpp

Static pressure 1.5kPa

Size(Excl Nozzle Height)

20x20x1.85mm(Nozzle Height 1.6mm

Feature of Microblower

1.sucking in

2.ejecting

top panel

diaphragm

intake channel Ventura nozzle

pumping room

Air flow

Inlet

Outlet

Piezo Element

Pumping room

Air flow

Inlet

Outlet

Piezo Element

Pumping room

Inlet

Outlet

Piezo Element

Pumping room

Principle of operation

1.sucking in

2.ejecting

top panel

diaphragm

intake channel Ventura nozzle

pumping room

Air flow with high velocity generates lower pressure to suck airaround, which makes real net flow ( Bernouillis theorem )

High velocity -> Low pressure -> Suck air around -> Push out to outlet

P-Q CharacteristicsP

ress

ure

(kP

a)

Flow rate (L/min)

Features

Flow rate

20~30m/s

High Flow Rate : Local cooling, Diffusion

High Pressure : Air Pump, Cooling Narrow pitch Mounting

Cooling methods

Vertical Horizontal -1 Horizontal -2

- Minimizing mounting area- Certain distance is necessary to enhance cooling performance. (Cooling only by the amount of flowing from the blower if the distance is too close)

- Cooling effect is enhanced if there is some space above a material.- Effect of increasing Net amount of flowing.- Making thermal boundary thinner owing to flowing speed. - Not so adequate for low profile mounting.

-Cooling effect is enhanced if there is some space above a material.- Lower profile mounting is possible.- Attachment is necessary.

Vertical Horizontal -1 Horizontal -2

- Minimizing mounting area- Certain distance is necessary to enhance cooling performance. (Cooling only by the amount of flowing from the blower if the distance is too close)

- Cooling effect is enhanced if there is some space above a material.- Effect of increasing Net amount of flowing.- Making thermal boundary thinner owing to flowing speed. - Not so adequate for low profile mounting.

-Cooling effect is enhanced if there is some space above a material.- Lower profile mounting is possible.- Attachment is necessary.

Attachment

Some space

Piezoelectric vibrator

Water

Tank

Water PipeSuck up by capillary tube

(made with fiber)

Current

Microblower

Tube

Pressure

New Method w/ Microblower

Water supply is not stable

due to capillary effectWater supply is stable and

quick start can be achieved.

Application of Microblower

Spot Cooling for PA/IC with Microblower

Piezo Microblower

20.0x20.0x1.65mmIC or PA

Microblower

Substrate

Tem

pera

ture

(S

urfa

ce o

f hea

t sou

rce)

Time

ConditionHeat Source:2W

T=4.8mm

T=9.5mm

T

Example of (Cooling Memory Module)

Out flowing gate0.8 x 0.8

Attachment20 x 20 x 2.4

MicroBlower

Heat sink

Substrate

IC(DRAM)

BlowerAttachment (20 x 20 x 2.4)

Blower and attachment

1.6

0.8Out flowing gate

Attachment

Heat sink

Example of the method to make flowing direction toward a substrate using minimum thickness of attachment.

Blower

Configuration

Test Result

We can see around 17k temp. lower in open space

Power: 6.8W

-17K

lower

Rhs=6.3[K/W]

Rhs=3.8[K/W]40% lower

Thermal temp. of surface of Heat sink

(Before blower operation)

Thermal temp. of surface of heat sink

(Blower is under operation)

Thermal resistance

Aspiration of hot air from deep area to cool down

Example : handmade attachment (Microblower +air pipe)

Aspiration of hot air

Hot AirHeat Source

Heat So

urce

air pipe

Attachment (Microblower inside)

Appearance of Microblower

OutletNozzle

Flow rate L/min

Pres

sure

kPa

0

0.5

1

1.5

2

0 2 4 6

[mm]

5Vpp

10Vpp

15Vpp

20Vpp

0

0.2

0.4

0.6

0.8

1

1.2

1.4

1.6

0 2 4 6

[mm]

[L/m

in]

5Vpp

10Vpp

15Vpp

20Vpp

Air

Flow

[L

/min

]

Nozzle Height[min]

Pre

ssur

e [

KP

a]

Nozzle Height[min]

0

10

20

30

40

50

0 0.5 1 1.5

[L/min]

1m

[dB

A]

5mm

4mm

3mm

2.3mm

1.6mm

Noi

se L

evel

[ d

B]

Air Flow [L/Min]

Test Result

MICROBLOWER Driver

19

Micromechatronics Business Development Dept.

Control Board Type2(USB TypeControl Board Type1

MICROBLOWER's Driver Board

Can be controlled through DC supply

Can be controlled easily through PC USB

P/N:MZBD001 Note: only for evaluation purpose (we dont have this product in mass-production.)

-+

DC Power Supply (+12~+22V)

Driver & Oscillator CircuitMICROBLOWER

MICROBLOWER Sample (How to connect)

To PCs USB Connector (5V)

Driver & Oscillator Circuit& DC ConverterMICROBLOWER

20Vp-p

21Micromechatronics Business Development Dept.

P-Q()P-Q characteristic (Typical value)

0.00

0.50

1.00

1.50

2.00

2.50

3.00

0.00 0.20 0.40 0.60 0.80 1.00 1.20 1.40(L/min)Flow rate

(kP

a)S

tatic

pre

ssur

e

20Vp-p15Vp-p10Vp-p

0

5

10

15

20

25

10 12 14 16 18 20 22

/V

/V

p-p

DC Supplys Voltage

MIC

RO

BLO

WER

VO

LTAG

E (V

p-p)

MICROBLOWER Sample (How to apply voltage)

DC Power Supply (12~22V)

Driver & Oscillator Circuit

R6 15

R5 1.5K

C51u

C41u

C6

100p

R7

270K

Q1/A

Q1/B

R8

100

J1CON2

1 2

J2

CON4

1234

R9

0

-

+ U2

LM7321MA

3

26

74

R4 100K

R3 100K

Driver Circuit (Type1)

Driver Part List

Microblower Reliability Testing

On-going reliability

Expected failure mode: Crack of piezo-element (Fatigue breakdown)

Amplitude Apply Voltage

=> 15000hr by now

END

Profile of MicroblowerFeature of MicroblowerPrinciple of operationP-Q CharacteristicsFeaturesCooling methodsExample of (Cooling Memory Module)Test Result