Microelectronic Packaging Education for the 21st Century

Objective• Develop new courses to be developed by Faculty

to be shared globally to educate students and industry professionals

Achieve By• Collaboration between universities, government,

professional society and industry

Partners• IEEE/CPMT and PRC/NSF

Microelectronic Packaging Education for the 21st Century

PRC/NSF IEEE/CPMT

Total Funding $240K $120K

Funding Level: 1997 through 2000

Project Title Lead Prof. University Funding

Year Thin Film Substrate Virtual Laboratory

Gary May Georgia Tech

1 & 2

Thermal Management Avi Bar-Cohen U. of Minnesota 1 & 2 Signal Integrity Jose Schutt-Aine U. of Illinois 1

PCB Interconnects N.J. Rao Indian Inst. Science

2

Electrical Design Bruce C. Kim Arizona State U. 2 & 3

PWB Virtual Laboratory Z. Illyefalvi-Vitez Technical U. of Budapest

2

Sensors Gabor Harsanyi Technical U. of Budapest

3

Conductive Adhesives James Morris State University of New York

3

Systems Cost Analysis Peter Sandborn U. of Maryland 3

Microelectronic Packaging Education for the 21st Century

Thin Film Substrate Virtual Laboratory (Gary May)

• http://www.ece.gatech.edu/research/labs/vc/packaging OR http://cpmt.org

Description

• Course contents: clean room environment; process theory, steps and flow chart; interconnect design and testing

• Provides: theory, lecture notes, video, graphics, familiarity with process techniques

• Target group: undergraduate and graduate students, engineers new to the subject area

Usage

• Site is regularly used to accompany the lecture and lab portions of the senior level “Electronics Packaging Substrate Fabrication” course offered at GaTech.

Status

• Complete

Signal Integrity(Jose Schutt-Aine)

• http://natcsi.ece.uiuc.edu OR http://cpmt.orgDescription

• Course contents:CAD tools on crosstalk simulation and lossy interconnect

• Course provides: Simulation tools, taped lectures

• Target group: Graduate students and engineers working in signal integrity

Usage

• Once the material is completed it can be used as an individual module to teach signal integrity concepts in system level packaging courses

Status

• Some sections are incomplete

Thermal Management(Avi Bar-Cohen, Yogendra Joshi, Sushil Bhavnani)

• http://www.me.umn.edu/courses/me5348/outline.html

Description

• Multi-institutional project - U of Minnesota, U. of Maryland and Auburn University

• Course contents: conduction in PCBs and chip packages; convection cooling of PCBs and electronic systems; heat sinks; passive immersion cooling; failures and reliability; strain,stress and fatigue; thermoelectric cooling; heat pipes.

• Course provides: lecture material, exercises, case study projects, lectures on CD

• Target group: course is provided simultaneously at all three campuses during the spring semester to mostly graduate students and limited UG students.

Usage & Status

• Complete. The course material can be used as a semester long course or modules.

Electrical Design(Bruce Kim)

• http://cpmt.orgDescription

• Course contents: interconnect modeling, embedded passives, simultaneous switching noise, CAD tools on crosstalk simulation and lossy interconnect

• Target group: graduate students

Status

• Most sections of the web site is under construction

PWB Virtual Laboratory(Zsolt Illyevalfi-Vitez)

• http://www.ett.bme.hu/vlab OR http://cpmt.orgDescription• Course content: PWB technology; thin and thick film technology; laser

technology; surface mount technology, computer integrated manufacturing technology

• Course provides: Information on the available equipment in the lab, processes and results with animation and graphics

• Target group: graduate students Usage• The site is used by the graduate students of the Technical University of

Budapest Status• Apart from a few sites under construction most of the course is

complete

Cost-Based Design/Analysis(Peter Sandborn, Cynthia Murphy)

• http://www.enme.umd.edu/ESCML

Description

• Course content: Lectures and on-line models for computing yields through various process steps.

• Course provides: Web-based calculators, for student use; lectures for use by professors and students

• Target group: graduate students

Usage

• The site is used by the graduate students of the University of Maryland

Status

• Several lectures now available; several calculators are open for others to use

PCB Interconnects(NJ Rao)

Status

• Under construction

Future Directions• Finish courses that are not completed to date• Initial product is CD-ROM, for some courses, convert

into multi-media by Sync-O-Mat software and post on web.

• Update the completed courses periodically• Add new courses in strategic areas

– RF– Optoelectronics– Wafer level packaging– Integral passives– Reliability

Strategic Course Topics

Recommendations

Funding Year CPMT PRC

1998-2000 $120K $240K

2001 $40K $20K*

2002 $30K $30K**

Total $190K $290K

* PRC committed** PRC willing to commit if CPMT does