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© 2009 Microchip Technology Inc. DS00049BB Packaging Specification

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Page 1: Microchip Packaging Specificationedge.rit.edu/edge/P10022/public/team_docs/parts... · 3/26/2009  · OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION,

© 2009 Microchip Technology Inc. DS00049BB

PackagingSpecification

Page 2: Microchip Packaging Specificationedge.rit.edu/edge/P10022/public/team_docs/parts... · 3/26/2009  · OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION,

DS00049BB-page ii © 2009 Microchip Technology Inc.

Information contained in this publication regarding deviceapplications and the like is provided only for your convenienceand may be superseded by updates. It is your responsibility toensure that your application meets with your specifications.MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS ORIMPLIED, WRITTEN OR ORAL, STATUTORY OROTHERWISE, RELATED TO THE INFORMATION,INCLUDING BUT NOT LIMITED TO ITS CONDITION,QUALITY, PERFORMANCE, MERCHANTABILITY ORFITNESS FOR PURPOSE. Microchip disclaims all liabilityarising from this information and its use. Use of Microchipdevices in life support and/or safety applications is entirely atthe buyer’s risk, and the buyer agrees to defend, indemnify andhold harmless Microchip from any and all damages, claims,suits, or expenses resulting from such use. No licenses areconveyed, implicitly or otherwise, under any Microchipintellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, PIC32 logo, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.

All other trademarks mentioned herein are property of their respective companies.

© 2009, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.

Printed on recycled paper.

Note the following details of the code protection feature on Microchip devices:• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of ourproducts. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such actsallow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.

Page 3: Microchip Packaging Specificationedge.rit.edu/edge/P10022/public/team_docs/parts... · 3/26/2009  · OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION,

© 2009 Microchip Technology Inc. DS00049BB-page iii

Packaging Index

CERAMIC SIDE-BRAZED DUAL IN-LINE FAMILY

8-Lead Ceramic Side Brazed Dual In-Line with Window (JW) – .300" Body ....................................................114-Lead Ceramic Side Brazed Dual In-Line with Window (JW) – .300" Body ..................................................228-Lead Ceramic Side Brazed Dual In-Line with Window (JW) – .300" Body ..................................................3

CERAMIC DUAL IN-LINE [CERDIP] FAMILY

8-Lead Ceramic Dual In-Line (JA) – .300" Body [CERDIP]...............................................................................48-Lead Ceramic Dual In-Line with Window (JW) – .300" Body [CERDIP] ........................................................514-Lead Ceramic Dual In-Line (JD) – .300" Body [CERDIP].............................................................................614-Lead Ceramic Dual In-Line with Window (JW) – .300" Body [CERDIP] ......................................................716-Lead Ceramic Dual In-Line (JE) – .300" Body [CERDIP].............................................................................818-Lead Ceramic Dual In-Line with Window (JW) – .300" Body [CERDIP] ......................................................920-Lead Ceramic Dual In-Line with Window (JW) – .300" Body [CERDIP] ....................................................1024-Lead Ceramic Dual In-Line (JG) – .600" Body [CERDIP] ..........................................................................1128-Lead Ceramic Dual In-Line (JN) – .600" Body [CERDIP]...........................................................................1228-Lead Ceramic Dual In-Line with Window (JW) – .300" Body [CERDIP] ....................................................1328-Lead Ceramic Dual In-Line with Window (JW) – .600" Body [CERDIP] ....................................................1440-Lead Ceramic Dual In-Line (JK) – .600" Body [CERDIP]...........................................................................1540-Lead Ceramic Dual In-Line with Window (JW) – .600" Body [CERDIP] ....................................................16

CERAMIC CHIP CARRIER [CERQUAD] FAMILY

68-Lead Ceramic Leaded (CL) Chip Carrier with Window – Square [CERQUAD] .........................................1784-Lead Ceramic Leaded (CL) Chip Carrier with Window – Square [CERQUAD] .........................................18

SMALL-OUTLINE TRANSISTOR FAMILY

3-Lead Plastic Transistor Outline (TO) [TO-92] ...............................................................................................193-Lead Plastic Transistor Outline (ZB) [TO-92]................................................................................................203-Lead Plastic Small Outline Transistor Header (MB) [SOT-89] .....................................................................215-Lead Plastic Small Outline Transistor Header (MT) [SOT-89] .....................................................................223-Lead Plastic Transistor Outline (AB) [TO-220] .............................................................................................235-Lead Plastic Transistor Outline (AT) [TO-220]..............................................................................................245-Lead Plastic Thin Small Outline Transistor (OS) [TSOT] .............................................................................253-Lead Plastic Small Outline Transistor (TT) [SOT-23] ...................................................................................263-Lead Plastic Small Outline Transistor (NB) [SOT-23]...................................................................................273-Lead Plastic Small Outline Transistor (CB) [SOT-23A] ................................................................................283-Lead Plastic Small Outline Transistor (DB) [SOT-223] ................................................................................303-Lead Plastic Small Outline Transistor (DB) [SOT-223]

(Land Pattern or Package Footprint)............................................................................................................315-Lead Plastic Small Outline Transistor (DC) [SOT-223] ................................................................................325-Lead Plastic Small Outline Transistor (DC) [SOT-223]

(Land Pattern or Package Footprint)............................................................................................................334-Lead Plastic Small Outline Transistor (RC) [SOT-143] ................................................................................34

Page 4: Microchip Packaging Specificationedge.rit.edu/edge/P10022/public/team_docs/parts... · 3/26/2009  · OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION,

DS00049BB-page iv © 2009 Microchip Technology Inc.

Packaging Index

4-Lead Plastic Small Outline Transistor (RC) [SOT-143](Land Pattern or Package Footprint)............................................................................................................35

5-Lead Plastic Small Outline Transistor (OT) [SOT-23]...................................................................................365-Lead Plastic Small Outline Transistor (CT) [SOT-23]...................................................................................376-Lead Plastic Small Outline Transistor (CH) [SOT-23] ..................................................................................386-Lead Plastic Small Outline Transistor (OT) [SOT-23]...................................................................................393-Lead Plastic Small Outline Transistor (LB) [SC70].......................................................................................403-Lead Plastic Small Outline Transistor (LB) [SC70]

(Land Pattern or Package Footprint)............................................................................................................415-Lead Plastic Small Outline Transistor (LT) [SC70] .......................................................................................425-Lead Plastic Small Outline Transistor (LT) [SC70]

(Land Pattern or Package Footprint)............................................................................................................436-Lead Plastic Small Outline Transistor (LT) [SC70] .......................................................................................456-Lead Plastic Small Outline Transistor (LT) [SC70]

(Land Pattern or Package Footprint)............................................................................................................47Leadless Wedge Module Plastic Small Outline Transistor (WM) [SOT-385] ..................................................48

DOUBLE DECA-WATT PACKAGE [DDPAK] FAMILY

3-Lead Plastic (EB) [DDPAK]...........................................................................................................................495-Lead Plastic (ET) [DDPAK] ...........................................................................................................................507-Lead Plastic (EK) [DDPAK]...........................................................................................................................527-Lead Plastic (EK) [DDPAK]

(Land Pattern or Package Footprint)............................................................................................................53

PLASTIC DUAL IN-LINE [PDIP] FAMILY

8-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]....................................................................................548-Lead Plastic Dual In-Line (PA) – 300 mil Body [PDIP] .................................................................................5514-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]..................................................................................5614-Lead Plastic Dual In-Line (PD) – 300 mil Body [PDIP]...............................................................................5716-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]..................................................................................5816-Lead Plastic Dual In-Line (PE) – 300 mil Body [PDIP] ...............................................................................5918-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]..................................................................................6020-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]..................................................................................6124-Lead Plastic Dual In-Line (P) – 600 mil Body [PDIP]..................................................................................6224-Lead Plastic Dual In-Line (PG) – 600 mil Body [PDIP]...............................................................................6324-Lead Skinny Plastic Dual In-Line (SP) – 300 mil Body [SPDIP].................................................................6424-Lead Skinny Plastic Dual In-Line (PF) – 300 mil Body [SPDIP].................................................................6528-Lead Skinny Plastic Dual In-Line (SP) – 300 mil Body [SPDIP].................................................................6628-Lead Skinny Plastic Dual In-Line (PJ) – 300 mil Body [SPDIP] .................................................................6728-Lead Plastic Dual In-Line (P) – 600 mil Body [PDIP]..................................................................................6828-Lead Plastic Dual In-Line (PI) – 600 mil Body [PDIP].................................................................................6940-Lead Plastic Dual In-Line (P) – 600 mil Body [PDIP]..................................................................................7040-Lead Plastic Dual In-Line (PL) – 600 mil Body [PDIP] ...............................................................................7164-Lead Shrink Plastic Dual In-Line (SP) – 750 mil Body [PDIP]....................................................................72

Page 5: Microchip Packaging Specificationedge.rit.edu/edge/P10022/public/team_docs/parts... · 3/26/2009  · OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION,

© 2009 Microchip Technology Inc. DS00049BB-page v

Packaging Index

PLASTIC LEADED CHIP CARRIER [PLCC] FAMILY

20-Lead Plastic Leaded Chip Carrier (L) – Square [PLCC].............................................................................7328-Lead Plastic Leaded Chip Carrier (L) – Square [PLCC].............................................................................7428-Lead Plastic Leaded Chip Carrier (LI) – Square [PLCC]............................................................................7532-Lead Plastic Leaded Chip Carrier (L) – Rectangle [PLCC] ........................................................................7644-Lead Plastic Leaded Chip Carrier (L) – Square [PLCC].............................................................................7744-Lead Plastic Leaded Chip Carrier (LW) – Square [PLCC] .........................................................................7868-Lead Plastic Leaded Chip Carrier (L) – Square [PLCC].............................................................................7968-Lead Plastic Leaded Chip Carrier (LS) – Square [PLCC] ..........................................................................8084-Lead Plastic Leaded Chip Carrier (L) – Square [PLCC].............................................................................81

PLASTIC SMALL-OUTLINE [SOIC/SOIJ] FAMILY

8-Lead Plastic Small Outline (SN) – Narrow, 3.90 mm Body [SOIC] ..............................................................828-Lead Plastic Small Outline (SN) – Narrow, 3.90 mm Body [SOIC]

(Land Pattern or Package Footprint)............................................................................................................838-Lead Plastic Small Outline (OA) – Narrow, 3.90 mm Body [SOIC]..............................................................848-Lead Plastic Small Outline (OA) – Narrow, 3.90 mm Body [SOIC]..............................................................8514-Lead Plastic Small Outline (SL) – Narrow, 3.90 mm Body [SOIC].............................................................8614-Lead Plastic Small Outline (SL) – Narrow, 3.90 mm Body [SOIC]

(Land Pattern or Package Footprint)............................................................................................................8714-Lead Plastic Small Outline (OD) – Narrow, 3.90 mm Body [SOIC]............................................................8814-Lead Plastic Small Outline (OD) – Narrow, 3.90 mm Body [SOIC]

(Land Pattern or Package Footprint)............................................................................................................8916-Lead Plastic Small Outline (SL) – Narrow, 3.90 mm Body [SOIC].............................................................9016-Lead Plastic Small Outline (SL) – Narrow, 3.90 mm Body [SOIC]

(Land Pattern or Package Footprint)............................................................................................................918-Lead Plastic Small Outline (SM) – Medium, 5.28 mm Body [SOIJ] .............................................................928-Lead Plastic Small Outline (SM) – Medium, 5.28 mm Body [SOIJ]

(Land Pattern or Package Footprint)............................................................................................................9316-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC] ...............................................................9416-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC]

(Land Pattern or Package Footprint)............................................................................................................9516-Lead Plastic Small Outline (OE) – Wide, 7.50 mm Body [SOIC] ...............................................................9616-Lead Plastic Small Outline (OE) – Wide, 7.50 mm Body [SOIC]

(Land Pattern or Package Footprint)............................................................................................................9718-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC] ...............................................................9818-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC]

(Land Pattern or Package Footprint)............................................................................................................9920-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC] .............................................................10024-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC] .............................................................10124-Lead Plastic Small Outline (OG) – Wide, 7.50 mm Body [SOIC].............................................................10228-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC] .............................................................10328-Lead Plastic Small Outline (OI) – Wide, 7.50 mm Body [SOIC]...............................................................104

Page 6: Microchip Packaging Specificationedge.rit.edu/edge/P10022/public/team_docs/parts... · 3/26/2009  · OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION,

DS00049BB-page vi © 2009 Microchip Technology Inc.

Packaging Index

PLASTIC QUAD FLATPACK [QFN] AND PLASTIC DUAL FLATPACK [DFN] FAMILY

6-Lead Plastic Dual Flat, No Lead Package (MA) – 2x2x0.9 mm Body [DFN] .............................................1056-Lead Plastic Dual Flat, No Lead Package (ME) – 2x3x0.9 mm Body [DFN] .............................................1066-Lead Plastic Dual Flat, No Lead Package (MH) – 3x3x0.9 mm Body [DFN] .............................................1078-Lead Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN] .............................................1088-Lead Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN]

(Land Pattern or Package Footprint)..........................................................................................................1098-Lead Plastic Dual Flat, No Lead Package (MF) – 6x5 mm Body [DFN-S]

PUNCH SINGULATED ............................................................................................................................. 1108-Lead Plastic Dual Flat, No Lead Package (MF) – 3x3x0.9 mm Body [DFN] .............................................1128-Lead Plastic Dual Flat, No Lead Package (MF) – 3x3x0.9 mm Body [DFN]

(Land Pattern or Package Footprint)..........................................................................................................1138-Lead Plastic Dual Flat, No Lead Package (MD) – 4x4x0.9 mm Body [DFN] .............................................1158-Lead Plastic Dual Flat, No Lead Package (MD) – 4x4x0.9 mm Body [DFN]

(Land Pattern or Package Footprint)..........................................................................................................1178-Lead Plastic Dual Flat, No Lead Package (MF) – 6x5 mm Body [DFN-S].................................................1188-Lead Plastic Dual Flat, No Lead Package (MF) – 6x5 mm Body [DFN-S]

(Land Pattern or Package Footprint)..........................................................................................................1198-Lead Plastic Dual Flat, No Lead Package (MN) – 2x3x0.75 mm Body [TDFN].........................................1208-Lead Plastic Dual Flat, No Lead Package (MN) – 2x3x0.75 mm Body [TDFN]

(Land Pattern or Package Footprint)..........................................................................................................1218-Lead Plastic Dual Flat, No Lead Package (MU) – 2x3x0.5 mm Body [UDFN] ..........................................1228-Lead Plastic Dual Flat, No Lead Package (MU) – 2x3x0.5 mm Body [UDFN]

(Land Pattern or Package Footprint)..........................................................................................................12310-Lead Plastic Dual Flat, No Lead Package (MF) – 3x3x0.9 mm Body [DFN] ...........................................12410-Lead Plastic Dual Flat, No Lead Package (MF) – 3x3x0.9 mm Body [DFN]

(Land Pattern or Package Footprint)..........................................................................................................12516-Lead Plastic Dual Flat, No Lead Package (MG) 3x3x0.9 mm Body [QFN]..............................................12616-Lead Plastic Quad Flat, No Lead Package (ML) – 4x4x0.9 mm Body [QFN]..........................................12816-Lead Plastic Quad Flat, No Lead Package (ML) – 4x4x0.9 mm Body [QFN]

(Land Pattern or Package Footprint)..........................................................................................................12920-Lead Plastic Quad Flat, No Lead Package (ML) – 4x4x0.9 mm Body [QFN]..........................................13020-Lead Plastic Quad Flat, No Lead Package (ML) – 4x4x0.9 mm Body [QFN]

(Land Pattern or Package Footprint)..........................................................................................................13120-Lead Plastic Quad Flat, No Lead Package (MQ) – 5x5x0.9 mm Body [QFN] .........................................13224-Lead Plastic Quad Flat, No Lead Package (MJ) – 4x4 mm Body [QFN] .................................................13424-Lead Plastic Quad Flat, No Lead Package (MJ) – 4x4 mm Body [QFN]

(Land Pattern or Package Footprint)..........................................................................................................13528-Lead Plastic Quad Flat, No Lead Package (MK) – 4x4 mm Body [QFN] ................................................13628-Lead Plastic Quad Flat, No Lead Package (MK) – 4x4 mm Body [QFN]

(Land Pattern or Package Footprint)..........................................................................................................13728-Lead Plastic Quad Flat, No Lead Package (MQ) – 5x5 mm Body [QFN] ................................................13828-Lead Plastic Quad Flat, No Lead Package (MQ) – 5x5 mm Body [QFN]

(Land Pattern or Package Footprint)..........................................................................................................13928-Lead Plastic Quad Flat, No Lead Package (ML) – 6x6 mm Body [QFN]

with 0.55 mm Contact Length ....................................................................................................................140

Page 7: Microchip Packaging Specificationedge.rit.edu/edge/P10022/public/team_docs/parts... · 3/26/2009  · OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION,

© 2009 Microchip Technology Inc. DS00049BB-page vii

Packaging Index

28-Lead Plastic Quad Flat, No Lead Package (ML) – 6x6 mm Body [QFN]with 0.55 mm Contact Length (Land Pattern or Package Footprint) .........................................................141

28-Lead Plastic Quad Flat, No Lead Package (MM) – 6x6x0.9 mm Body [QFN-S]with 0.40 mm Contact Length ....................................................................................................................142

28-Lead Plastic Quad Flat, No Lead Package (MM) – 6x6x0.9 mm Body [QFN-S]with 0.40 mm Contact Length (Land Pattern or Package Footprint) .........................................................143

40-Lead Plastic Quad Flat, No Lead Package (ML) – 6x6x0.9 mm Body [QFN]with 0.40 mm Contact Length ....................................................................................................................144

44-Lead Plastic Quad Flat, No Lead Package (ML) – 8x8 mm Body [QFN].................................................14644-Lead Plastic Quad Flat, No Lead Package (ML) – 8x8 mm Body [QFN]

(Land Pattern or Package Footprint)..........................................................................................................14764-Lead Plastic Quad Flat, No Lead Package (MR) – 9x9x0.9 mm Body [QFN] .........................................14964-Lead Plastic Quad Flat, No Lead Package (MR) – 9x9x0.9 mm Body [QFN]

(Land Pattern or Package Footprint)..........................................................................................................15164-Lead Plastic Quad Flat, No Lead Package (MR) – 9x9x0.9 mm Body

with 5.40x5.40 Exposed Pad [QFN]...........................................................................................................15228-Lead Plastic Ultra Thin Quad Flat, No Lead Package (MV) – 4x4x0.5 mm Body [UQFN] ......................154

PLASTIC MICRO SMALL-OUTLINE [MSOP] FAMILY

8-Lead Plastic Micro Small Outline Package (MS) [MSOP] ..........................................................................1568-Lead Plastic Micro Small Outline Package (MS) [MSOP]

(Land Pattern or Package Footprint)..........................................................................................................1578-Lead Plastic Micro Small Outline Package (UA) [MSOP]...........................................................................15810-Lead Plastic Micro Small Outline Package (MS) [MSOP] ........................................................................16010-Lead Plastic Micro Small Outline Package (MS) [MSOP]

(Land Pattern or Package Footprint)..........................................................................................................16110-Lead Plastic Micro Small Outline Package (UN) [MSOP] ........................................................................162Plastic Shrink Small-Outline [SSOP] Family16-Lead Plastic Shrink Small Outline Narrow Body (QR) – .150" Body [QSOP] ..........................................16320-Lead Plastic Shrink Small Outline (SS) – 5.30 mm Body [SSOP]........................................................... 16424-Lead Plastic Shrink Small Outline (SS) – 5.30 mm Body [SSOP]............................................................16528-Lead Plastic Shrink Small Outline (SS) – 5.30 mm Body [SSOP]............................................................166

PLASTIC THIN SHRINK SMALL-OUTLINE [TSSOP] FAMILY

8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP] .....................................................1688-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP]

(Land Pattern or Package Footprint)..........................................................................................................16914-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP] ...................................................17014-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP]

(Land Pattern or Package Footprint)..........................................................................................................17116-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP] ...................................................17316-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP]

(Land Pattern or Package Footprint)..........................................................................................................17520-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP] ...................................................176

Page 8: Microchip Packaging Specificationedge.rit.edu/edge/P10022/public/team_docs/parts... · 3/26/2009  · OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION,

DS00049BB-page viii © 2009 Microchip Technology Inc.

Packaging Index

20-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP](Land Pattern or Package Footprint)..........................................................................................................177

PLASTIC THIN SMALL-OUTLINE [TSOP] AND VERY SMALL OUTLINE [VSOP] FAMILY

28-Lead Plastic Thin Small Outline (TS) – 8x20 mm [TSOP]........................................................................17928-Lead Plastic Very Small Outline (VS) – 8x13.4 mm Body [VSOP] ..........................................................180

PLASTIC LOW-PROFILE QUAD FLATPACK [LQFP] FAMILY

32-Lead Plastic Low-Profile Quad Flatpack (PL) – 7x7x1.4 mm Body, 2.0 mm [LQFP]...............................181

PLASTIC METRIC-QUAD FLATPACK [MQFP] FAMILY

44-Lead Plastic Metric Quad Flatpack (PQ) – 10x10x2 mm Body, 3.20 mm [MQFP] ..................................18244-Lead Plastic Metric Quad Flatpack (PQ) – 10x10x2 mm Body, 3.20 mm [MQFP]

(Land Pattern or Package Footprint)..........................................................................................................18344-Lead Plastic Metric Quad Flatpack (KW) – 10x10x2 mm Body, 3.20 mm [MQFP] .................................18464-Lead Plastic Metric Quad Flatpack (BU) – 14x14x2.7 mm Body, 3.20 mm [MQFP] ...............................18664-Lead Plastic Metric Quad Flatpack (BU) – 14x14x2.7 mm Body, 3.20 mm [MQFP]

(Land Pattern or Package Footprint)..........................................................................................................187

PLASTIC THIN-QUAD FLATPACK [TQFP] FAMILY

32-Lead Plastic Thin Quad Flatpack (PT) – 7x7x1.0 mm Body, 2.00 mm [TQFP] .......................................18944-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1 mm Body, 2.00 mm [TQFP] ......................................19044-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1 mm Body, 2.00 mm [TQFP]

(Land Pattern or Package Footprint)..........................................................................................................19164-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1 mm Body, 2.00 mm [TQFP] ......................................19264-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1 mm Body, 2.00 mm [TQFP]

(Land Pattern or Package Footprint)..........................................................................................................19364-Lead Plastic Thin Quad Flatpack (PF) – 14x14x1 mm Body, 2.00 mm [TQFP] ......................................19464-Lead Plastic Thin Quad Flatpack (PF) – 14x14x1 mm Body, 2.00 mm [TQFP]

(Land Pattern or Package Footprint)..........................................................................................................19580-Lead Plastic Thin Quad Flatpack (PT) – 12x12x1 mm Body, 2.00 mm [TQFP] ......................................19680-Lead Plastic Thin Quad Flatpack (PT) – 12x12x1 mm Body, 2.00 mm [TQFP]

(Land Pattern or Package Footprint)..........................................................................................................19780-Lead Plastic Thin Quad Flatpack (PF) – 14x14x1 mm Body, 2.00 mm [TQFP] ......................................19880-Lead Plastic Thin Quad Flatpack (PF) – 14x14x1 mm Body, 2.00 mm [TQFP]

(Land Pattern or Package Footprint)..........................................................................................................199100-Lead Plastic Thin Quad Flatpack (PT) – 12x12x1 mm Body, 2.00 mm [TQFP] ....................................200100-Lead Plastic Thin Quad Flatpack (PT) – 12x12x1 mm Body, 2.00 mm [TQFP]

(Land Pattern or Package Footprint)..........................................................................................................201100-Lead Plastic Thin Quad Flatpack (PF) – 14x14x1 mm Body, 2.00 mm [TQFP] ....................................202100-Lead Plastic Thin Quad Flatpack (PF) – 14x14x1 mm Body, 2.00 mm [TQFP]

(Land Pattern or Package Footprint)..........................................................................................................203

Page 9: Microchip Packaging Specificationedge.rit.edu/edge/P10022/public/team_docs/parts... · 3/26/2009  · OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION,

© 2009 Microchip Technology Inc. DS00049BB-page ix

Packaging Index

CHIP SCALE [CSP] FAMILY

4-Lead Chip Scale Package (CS) – 2x2 Ball Pattern [CSP]..........................................................................2054-Lead Chip Scale Package (CS) – 2x2 Ball Pattern [CSP]

(Land Pattern or Package Footprint)..........................................................................................................2075-Lead Chip Scale Package (CS) – 2x1x2 Ball Pattern [CSP]......................................................................2095-Lead Chip Scale Package (CS) – 2x1x2 Ball Pattern [CSP]

(Land Pattern or Package Footprint)..........................................................................................................2118-Lead Chip Scale Package (CS) – 3x2x3 Ball Pattern [CSP]......................................................................2138-Lead Chip Scale Package (CS) – 3x2x3 Ball Pattern [CSP]

(Land Pattern or Package Footprint)..........................................................................................................215

BALL GRID ARRAY [XBGA] FAMILY

121-Lead Plastic Thin Profile Ball Grid Array (BG) – 10x10x1.10 mm Body [XBGA] ...................................216

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DS00049BB-page x © 2009 Microchip Technology Inc.

Packaging Index

NOTES:

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© 2009 Microchip Technology Inc. DS00049BB-page 1

Packaging Diagrams and Parameters

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Page 12: Microchip Packaging Specificationedge.rit.edu/edge/P10022/public/team_docs/parts... · 3/26/2009  · OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION,

DS00049BB-page 2 © 2009 Microchip Technology Inc.

Packaging Diagrams and Parameters

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Page 13: Microchip Packaging Specificationedge.rit.edu/edge/P10022/public/team_docs/parts... · 3/26/2009  · OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION,

© 2009 Microchip Technology Inc. DS00049BB-page 3

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DS00049BB-page 4 © 2009 Microchip Technology Inc.

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© 2009 Microchip Technology Inc. DS00049BB-page 5

Packaging Diagrams and Parameters

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DS00049BB-page 6 © 2009 Microchip Technology Inc.

Packaging Diagrams and Parameters

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© 2009 Microchip Technology Inc. DS00049BB-page 7

Packaging Diagrams and Parameters

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DS00049BB-page 8 © 2009 Microchip Technology Inc.

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© 2009 Microchip Technology Inc. DS00049BB-page 9

Packaging Diagrams and Parameters

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DS00049BB-page 10 © 2009 Microchip Technology Inc.

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© 2009 Microchip Technology Inc. DS00049BB-page 13

Packaging Diagrams and Parameters

28-Lead Ceramic Dual In-Line with Window (JW) – .300" Body [CERDIP]

Notes:1. Pin 1 visual index feature may vary, but must be located within the hatched area.2. § Significant Characteristic.3. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

Units INCHESDimension Limits MIN NOM MAX

Number of Pins N 28Pitch e .100 BSCTop to Seating Plane A – – .200Ceramic Package Height A2 .140 – .175Standoff § A1 .015 – –Shoulder to Shoulder Width E .308 – .325Ceramic Package Width E1 .280 .288 .296Overall Length D 1.442 1.450 1.470Tip to Seating Plane L .125 – .200Lead Thickness c .008 – .014Upper Lead Width b1 .045 – .065Lower Lead Width b .015 – .023Overall Row Spacing E2 .325 – .410Window Width W1 .130 .140 .150Window Length W2 .290 .300 .310

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DS00049BB-page 14 © 2009 Microchip Technology Inc.

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Packaging Diagrams and Parameters

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Packaging Diagrams and Parameters

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Packaging Diagrams and Parameters

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Packaging Diagrams and Parameters

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Page 30: Microchip Packaging Specificationedge.rit.edu/edge/P10022/public/team_docs/parts... · 3/26/2009  · OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION,

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Packaging Diagrams and Parameters

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Packaging Diagrams and Parameters

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Packaging Diagrams and Parameters

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Packaging Diagrams and Parameters

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Packaging Diagrams and Parameters

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Land Pattern (Footprint)

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Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

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A1

A3E2

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CH3 x 45°CH1 x 45°

CH2 x 45°

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DCH2 x 45°D1

NOTE 1 N 1 2 3

E

E1

CH1 x 45°

CH3 x 45°

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A3

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b1

A2c

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DCH2 x 45°D1

NOTE 1 N 1 2 3

E

E1

CH1 x 45°

CH3 x 45°

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A3

E2b

b1

A2c

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CH3 x 30°

A

A3

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CH1 x 45°CH3 x 45°

A1

A3

E2

b1b

A A2

D2

e

c

NOTE 1 N 1 2 3

E

E1

D

D1

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DS00049BB-page 78 © 2009 Microchip Technology Inc.

Packaging Diagrams and Parameters

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CH2 x 45°

CH1 x 45°CH3 x 45°

A1

A3

E2

b1b

A A2

D2

e

c

NOTE 1 N 1 2 3

E

E1

D

D1

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Packaging Diagrams and Parameters

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A3

E2

bb1

A A2

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D1

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e

D2

c

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Packaging Diagrams and Parameters

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A A2

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D2

c

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Land Pattern (Footprint)

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Packaging Diagrams and Parameters

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Packaging Diagrams and Parameters

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Packaging Diagrams and Parameters

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Packaging Diagrams and Parameters

8-Lead Plastic Dual Flat, No Lead Package (MD) – 4x4x0.9 mm Body [DFN]

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Packaging Diagrams and Parameters

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Packaging Diagrams and Parameters

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Land Pattern (Footprint)

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Land Pattern (Footprint)

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DS00049BB-page 126 © 2009 Microchip Technology Inc.

Packaging Diagrams and Parameters

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

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© 2009 Microchip Technology Inc. DS00049BB-page 127

Packaging Diagrams and Parameters

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

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DS00049BB-page 128 © 2009 Microchip Technology Inc.

Packaging Diagrams and Parameters

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© 2009 Microchip Technology Inc. DS00049BB-page 129

Land Pattern (Footprint)

16-Lead Plastic Quad Flat, No Lead Package (ML) – 4x4x0.9 mm Body [QFN] Land Pattern

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

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DS00049BB-page 130 © 2009 Microchip Technology Inc.

Packaging Diagrams and Parameters

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© 2009 Microchip Technology Inc. DS00049BB-page 131

Land Pattern (Footprint)

20-Lead Plastic Quad Flat No Lead Package (ML) – 4x4 mm Body [QFN] Land PatternWith 0.40 mm Contact Length

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

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DS00049BB-page 132 © 2009 Microchip Technology Inc.

Packaging Diagrams and Parameters

NOTES:20-Lead Plastic Quad Flat, No Lead Package (MQ) – 5x5x0.9 mm Body [QFN]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

Microchip Technology Drawing C04-120A

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© 2009 Microchip Technology Inc. DS00049BB-page 133

Packaging Diagrams and Parameters

NOTES:

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DS00049BB-page 134 © 2009 Microchip Technology Inc.

Packaging Diagrams and Parameters

24-Lead Plastic Quad Flat, No Lead Package (MJ) – 4x4x0.9 mm Body [QFN]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

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© 2009 Microchip Technology Inc. DS00049BB-page 135

Land Pattern (Footprint)

24-Lead Plastic Quad Flat, No Lead Package (MJ) – 4x4 mm Body [QFN] Land Pattern

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

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DS00049BB-page 136 © 2009 Microchip Technology Inc.

Packaging Diagrams and Parameters

28-Lead Plastic Quad Flat, No Lead Package (MK) – 4x4x0.9 mm Body [QFN]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

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© 2009 Microchip Technology Inc. DS00049BB-page 137

Land Pattern (Footprint)

28-Lead Plastic Quad Flat, No Lead Package (MK) – 4x4x0.9 mm Body [QFN] Land Pattern

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

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DS00049BB-page 138 © 2009 Microchip Technology Inc.

Packaging Diagrams and Parameters

28-Lead Plastic Quad Flat, No Lead Package (MQ) – 5x5x0.9 mm Body [QFN]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

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© 2009 Microchip Technology Inc. DS00049BB-page 139

Land Pattern (Footprint)

28-Lead Plastic Quad Flat, No Lead Package (MQ) – 5x5 mm Body [QFN] Land PatternWith 0.55 mm Contact Length

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

Microchip Technology Drawing C04-2140A

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DS00049BB-page 140 © 2009 Microchip Technology Inc.

Packaging Diagrams and Parameters

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Land Pattern (Footprint)

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DS00049BB-page 142 © 2009 Microchip Technology Inc.

Packaging Diagrams and Parameters

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Land Pattern (Footprint)

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DS00049BB-page 144 © 2009 Microchip Technology Inc.

Packaging Diagrams and Parameters

40-Lead Plastic Quad Flat, No Lead Package (ML) – 6x6x0.9 mm Body [QFN]with 0.40 mm Contact Length

Notes:1. Pin 1 visual index feature may vary, but must be located within the hatched area.2. Package is saw singulated.3. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.REF: Reference Dimension, usually without tolerance, for information purposes only.

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

Units MILLIMETERSDimension Limits MIN NOM MAX

Number of Pins N 40Pitch e 0.50 BSCOverall Height A 0.80 0.90 1.00Standoff A1 0.00 0.02 0.05Contact Thickness A3 0.20 REFOverall Width E 6.00 BSCExposed Pad Width E2 4.50 4.65 4.80Overall Length D 6.00 BSCExposed Pad Length D2 4.50 4.65 4.80Contact Width b 0.18 0.25 0.30Contact Length L 0.30 0.40 0.50Contact-to-Exposed Pad K 0.20 – –

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Microchip Technology Drawing C04-118C

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© 2009 Microchip Technology Inc. DS00049BB-page 145

Packaging Diagrams and Parameters

NOTES:

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DS00049BB-page 146 © 2009 Microchip Technology Inc.

Packaging Diagrams and Parameters

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© 2009 Microchip Technology Inc. DS00049BB-page 147

Land Pattern (Footprint)

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DS00049BB-page 148 © 2009 Microchip Technology Inc.

Packaging Diagrams and Parameters

NOTES:

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© 2009 Microchip Technology Inc. DS00049BB-page 149

Packaging Diagrams and Parameters

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

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DS00049BB-page 150 © 2009 Microchip Technology Inc.

Packaging Diagrams and Parameters

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

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© 2009 Microchip Technology Inc. DS00049BB-page 151

Land Pattern (Footprint)

64-Lead Plastic Quad Flat, No Lead Package (MR) – 9x9x0.9 mm Body [QFN]With 0.40 mm Contact Length

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

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DS00049BB-page 152 © 2009 Microchip Technology Inc.

Packaging Diagrams and Parameters

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

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© 2009 Microchip Technology Inc. DS00049BB-page 153

Packaging Diagrams and Parameters

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

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DS00049BB-page 154 © 2009 Microchip Technology Inc.

Packaging Diagrams and Parameters

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

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© 2009 Microchip Technology Inc. DS00049BB-page 155

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Land Pattern (Footprint)

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Packaging Diagrams and Parameters

NOTES:

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Packaging Diagrams and Parameters

16-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

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DS00049BB-page 174 © 2009 Microchip Technology Inc.

Packaging Diagrams and Parameters

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Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

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Land Pattern (Footprint)

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Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

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Land Pattern (Footprint)

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

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Packaging Diagrams and Parameters

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Packaging Diagrams and Parameters

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© 2009 Microchip Technology Inc. DS00049BB-page 201

Land Pattern (Footprint)

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DS00049BB-page 202 © 2009 Microchip Technology Inc.

Packaging Diagrams and Parameters

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© 2009 Microchip Technology Inc. DS00049BB-page 203

Land Pattern (Footprint)

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DS00049BB-page 204 © 2009 Microchip Technology Inc.

Packaging Diagrams and Parameters

NOTES:

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© 2009 Microchip Technology Inc. DS00049BB-page 205

Packaging Diagrams and Parameters

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

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DS00049BB-page 206 © 2009 Microchip Technology Inc.

Packaging Diagrams and Parameters

4-Lead Chip Scale Package (CS) – [CSP]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

Notes:1. Orientation reference feature may vary, but must be located within the hatched area.2. Package is saw singulated.3. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.REF: Reference Dimension, usually without tolerance, for information purposes only.

4. Package size varies with specific devices. Please contact your local Microchip representative for specific details.Microchip Technology Drawing C04-6005A Sheet 2 of 2

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© 2009 Microchip Technology Inc. DS00049BB-page 207

Land Pattern (Footprint)

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

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DS00049BB-page 208 © 2009 Microchip Technology Inc.

Packaging Diagrams and Parameters

NOTES:

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© 2009 Microchip Technology Inc. DS00049BB-page 209

Packaging Diagrams and Parameters

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

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DS00049BB-page 210 © 2009 Microchip Technology Inc.

Packaging Diagrams and Parameters

5-Lead Chip Scale Package (CS) – [CSP]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

Notes:1. Orientation reference feature may vary, but must be located within the hatched area.2. Package is saw singulated.3. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.REF: Reference Dimension, usually without tolerance, for information purposes only.

4. Package size varies with specific devices. Please contact your local Microchip representative for specific details.Microchip Technology Drawing C04-6004A Sheet 2 of 2

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© 2009 Microchip Technology Inc. DS00049BB-page 211

Land Pattern (Footprint)

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

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DS00049BB-page 212 © 2009 Microchip Technology Inc.

Packaging Diagrams and Parameters

NOTES:

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© 2009 Microchip Technology Inc. DS00049BB-page 213

Packaging Diagrams and Parameters

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

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DS00049BB-page 214 © 2009 Microchip Technology Inc.

Packaging Diagrams and Parameters

8-Lead Chip Scale Package (CS) – [CSP]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

Notes:1. Orientation reference feature may vary, but must be located within the hatched area.2. Package is saw singulated.3. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.REF: Reference Dimension, usually without tolerance, for information purposes only.

4. Package size varies with specific devices. Please contact your local Microchip representative for specific details.Microchip Technology Drawing C04-6001A Sheet 2 of 2

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© 2009 Microchip Technology Inc. DS00049BB-page 215

Land Pattern (Footprint)

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

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DS00049BB-page 216 © 2009 Microchip Technology Inc.

Packaging Diagrams and Parameters

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

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© 2009 Microchip Technology Inc. DS00049BB-page 217

Packaging Diagrams and Parameters

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

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DS00049BB-page 218 © 2009 Microchip Technology Inc.

Packaging Diagrams and Parameters

NOTES:

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© 2009 Microchip Technology Inc. DS00049BB-page 219

Packaging

APPENDIX A: REVISION HISTORY

Revision AE (September 2005)The following is the list of modifications:

1. Added Appendix A: Revision History.2. Revised dimensions D2 and E2 in the 8-Lead

Plastic, No Lead (MC) 2x3x0.9 mm body (DFN)– Saw Singulated package diagram

3. Corrected graphic format in all packagingdiagrams.

4. Added the following Packages:• 16-Lead Plastic Small Outline Narrow Body

(QSOP)• 4-Lead Plastic Small Outline Transistor

(SOT-143)• 3-Lead Plastic Small Outline Transistor

(SOT-223)• 32-Lead Thin Quad Flatpack 7x7x1mm Body

1.0/0.10 Lead Form (TQFP)• 3-Lead SC-70 package diagram corrected.

5. The following package diagrams were replaced:• Drawing C04-142 replaced by C04-128

(5-Lead Small Outline Transistor) (TSOT)• Drawing C04-300 replaced by C04-132

(24-Lead Plastic Shrink Small Outline) (SSOP)

6. Added Part Number Designators DB, RC andQR to Part Number Suffix Designations table.

Revision AF (January 2006)The following is the list of modifications:

1. Revised 28-Lead Plastic Shrink Small Outline(SS) – 209 mil body, 5.30 mm (SSOP)

2. Revised 28-Lead Plastic Quad Flat No Lead(MM) 6x6x0.9 mm body (QFN-S) with 0.40 mmContact Length (Saw Singulated)

Revision AG (July 2006)The following is the list of modifications:

1. Revised 8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)

2. Added 40-Lead Plastic Quad Flat, No Lead(MM) 6x6x0.9 mm Body (QFN) with 0.40 mmContact Length (Saw Singulated

3. Added 3-Lead Plastic Transistor Outline (AB)(TO-220)

4. Removed Drawing No. C04-300 as it does notexist.

5. Revised 28-Lead Plastic Shrink Small Outline(SS) – 209 mil Body, 5.30 mm (SSOP)

6. Revised 20-Lead Plastic Shrink Small Outline(SS) – 209 mil Body, 5.30 mm (SSOP)

7. Revised 14-Lead Plastic Small Outline (SL) –Narrow, 150 mil (SOIC)

8. Revised 64-Lead Plastic Thin Quad Flatpack(PF) – 14x14x1 mm Body, 1.0/0.10 mm LeadForm (TQFP)

9. Revised 80-Lead Plastic Thin Quad Flatpack(PF) – 14x14x1 mm Body, 1.0/0.10 mm LeadForm (TQFP)

10. Revised Part Number Suffix Designations

Revision AH (August 2006)The following is the list of modifications:

1. Revised 28-Lead Plastic Quad Flat No Lead(ML) 6x6 mm Body (QFN) with 0.55 mm ContactLength (Saw Singulated)

Revision AJ (September 2006)The following is the list of modifications:

1. Revised 8-Lead Plastic Dual Flat, No LeadPackage (MC) - 2x3x0.9 mm Body [DFN]

2. Revised 8-Lead Plastic Dual Flat, No LeadPackage (MF) - 6x5 mm Body (DFN-S) – PunchSingulated

3. Revised 8-Lead Plastic Dual Flat, No LeadPackage (MF) - 3x3x0.9 mm Body [DFN]

4. Revised 8-Lead Plastic Dual Flat, No LeadPackage (MD) - 4x4x0.9 mm Body [DFN]

5. Revised 8-Lead Plastic Dual Flat, No LeadPackage (MF) - 6x5 mm Body [DFN-S]

6. Revised 10-Lead Plastic Dual Flat, No LeadPackage (MF) - 3x3x0.9 mm Body [DFN]

7. Revised 16-Lead Plastic Quad Flat, No LeadPackage (ML) - 4x4x0.9 mm Body [QFN]

8. Revised 20-Lead Plastic Quad Flat, No LeadPackage (ML) - 4x4x0.9 mm Body [QFN]

9. Revised 28-Lead Plastic Quad Flat, No LeadPackage (ML) - 6x6 mm Body [QFN] With 0.55mm Contact Length

10. Revised 28-Lead Plastic Quad Flat, No LeadPackage (MM) - 6x6x0.9 mm Body [QFN-S]With 0.40 mm Contact Length

11. Revised 40-Lead Plastic Quad Flat, No LeadPackage (MM) 6x6x0.9 mm Body [QFN] With0.40 mm Contact Length

12. Revised 44-Lead Plastic Quad Flat, No LeadPackage (ML) - 8x8 mm Body [QFN]

13. Revised 8-Lead Plastic Micro Small OutlinePackage (MS) [MSOP]

14. Revised 10-Lead Plastic Micro Small OutlinePackage (MS) [MSOP]

Revision AK (January 2007)The entire Packaging Specification has been updated.

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PackagingRevision AL (February 2007)Packages were revised. Telcom package designatorswere added where the designators vary from Microchipdesignators.

1. Revised 3-Lead Plastic Transistor Outline(TO or ZB) [TO-92]

2. Revised 3-Lead Plastic Small Outline Transistor(TT or NB) [SOT-23]

3. Revised 3-Lead Plastic Small Outline Transistor(CB or NB) [SOT-23A]

4. Revised 3-Lead Plastic Small Outline Transistor(DB) [SOT-223]

5. Revised 5-Lead Plastic Small Outline Transistor(DB) [SOT-223]

6. Revised 4-Lead Plastic Small Outline Transistor(RC) [SOT-143]

7. Revised 5-Lead Plastic Small Outline Transistor(OT or CT) [SOT-23]

8. Revised 6-Lead Plastic Small Outline Transistor(CH) [SOT-23]

9. Revised 8-Lead Plastic Dual In-Line (P or PA)300 mil Body [PDIP]

10. Revised 14-Lead Plastic Dual In-Line (P or PD)300 mil Body [PDIP]

11. Revised 16-Lead Plastic Dual In-Line (P or PE)300 mil Body [PDIP]

12. Revised 24-Lead Plastic Dual In-Line (P or PG)600 mil Body [PDIP]

13. Revised 24-Lead Skinny Plastic Dual In-Line(SP or PF) 300 mil Body [SPDIP]

14. Revised 28-Lead Skinny Plastic Dual In-Line(SP or PJ) 300 mil Body [SPDIP]

15. Revised 28-Lead Plastic Dual In-Line (P or PI)600 mil Body [PDIP]

16. Revised 40-Lead Plastic Dual In-Line (P or PL)600 mil Body [PDIP]

17. Revised 20-Lead Plastic Leaded Chip Carrier(L) Square [PLCC]

18. Revised 28-Lead Plastic Leaded Chip Carrier(L or LI) Square [PLCC]

19. Revised 32-Lead Plastic Leaded Chip Carrier(L) Rectangle [PLCC]

20. Revised 44-Lead Plastic Leaded Chip Carrier(L or LW) Square [PLCC]

21. Revised 68-Lead Plastic Leaded Chip Carrier(L or LS) Square [PLCC]

22. Revised 84-Lead Plastic Leaded Chip Carrier(L) Square [PLCC]

23. Revised 8-Lead Plastic Small Outline(SN or OA) Narrow, 3.90 mm Body [SOIC]

24. Revised 14-Lead Plastic Small Outline(SL or OD) Narrow, 3.90 mm Body [SOIC]

25. Revised 16-Lead Plastic Small Outline (SL)Narrow, 3.90 mm Body [SOIC]

26. Revised 8-Lead Plastic Small Outline (SM)Medium, 5.28 mm Body [SOIJ]

27. Revised 16-Lead Plastic Small Outline(SO or OE) Wide, 7.50 mm Body [SOIC]

28. Revised 18-Lead Plastic Small Outline (SO)Wide, 7.50 mm Body [SOIC]

29. Revised 20-Lead Plastic Small Outline (SO)Wide, 7.50 mm Body [SOIC]

30. Revised 24-Lead Plastic Small Outline(SO or PF) Wide, 7.50 mm Body [SOIC]

31. Revised 28-Lead Plastic Small Outline(SO or OI) Wide, 7.50 mm Body [SOIC]

32. Revised 8-Lead Plastic Micro Small OutlinePackage (MS or UA) [MSOP]

33. Revised 10-Lead Plastic Micro Small OutlinePackage (MS or UN) [MSOP]

34. Revised 16-Lead Plastic Shrink Small OutlineNarrow Body (QR) .150" Body [QSOP]

35. Revised 64-Lead Plastic Metric Quad Flatpack(KU) 14x14x2.7 mm Body, 3.20 mm Footprint[MQFP]

36. Revised 44-Lead Plastic Metric Quad Flatpack(KW) 10x10x2.0 mm Body, 3.9 mm Footprint[PQFP]

Revision AM (March 2007)Four Microchip and Telcom package designators werecorrected and one package was removed.

1. Revised 6-Lead Plastic Small Outline Transistor(CH) [SOT-23] to (CH or OT)

2. Revised 3-Lead Plastic Small Outline Transistor(CB or NB) [SOT-23A] to (CB)

3. Revised 44-Lead Plastic Metric Quad Flatpack(PQ) [MQFP] to (PQ or KW)

4. Revised 64-Lead Plastic Metric Quad Flatpack(KU) [MQFP] to (BU)

5. Deleted 44-Lead Plastic Metric Quad Flatpack(KW) – 10x10x2.0 mm Body, 3.9 mm Foot-print [PQFP]

Revision AN (March 2007)16-Lead Plastic Shrink Small Outline Narrow Body(QR) .150” Body [QSOP]: the nominal pitch value forthe package is corrected to “.025.” This correctionrevises MCHP Drawing C04-024B to C04-024C.

Packages with a Microchip and a Telcom designatorare represented on separate pages, rather than havingboth designators on a single page.

Revision AP (April 2007)Revised 40-Lead Ceramic Dual In-Line with Window(JW) .600” Body [CERDIP]. The E-1 MAX dimensionhas changed from “.540” to “.583”. This correctionrevises MCHP Drawing C04-014B to C04-014C.

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PackagingRevision AQ (July 2007)Revised 5-Lead Plastic Small Outline Transistor [SOT-223] package designator from (DB) to (DC). This cor-rection revises MCHP Drawing C04-137A toC04-137B.

Revision AR (September 2007)Land patterns have been added for the following 13packages:

8-Lead Plastic Small Outline (SN) – Narrow, 3.90 mmBody [SOIC]28-Lead Plastic Quad Flat, No Lead Package (ML) –6x6 mm Body [QFN]with 0.55 mm Contact Length28-Lead Plastic Quad Flat, No Lead Package (MM) –6x6x0.9 mm Body [QFN-S]with 0.40 mm Contact Length44-Lead Plastic Quad Flat, No Lead Package (ML) –8x8 mm Body [QFN]44-Lead Plastic Metric Quad Flatpack (PQ) – 10x10x2mm Body, 3.20 mm [MQFP]64-Lead Plastic Metric Quad Flatpack (BU) –14x14x2.7 mm Body, 3.20 mm [MQFP]44-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1mm Body, 2.00 mm [TQFP]64-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1mm Body, 2.00 mm [TQFP]64-Lead Plastic Thin Quad Flatpack (PF) – 14x14x1mm Body, 2.00 mm [TQFP]80-Lead Plastic Thin Quad Flatpack (PT) – 12x12x1mm Body, 2.00 mm [TQFP]80-Lead Plastic Thin Quad Flatpack (PF) – 14x14x1mm Body, 2.00 mm [TQFP]100-Lead Plastic Thin Quad Flatpack (PT) – 12x12x1mm Body, 2.00 mm [TQFP]100-Lead Plastic Thin Quad Flatpack (PF) – 14x14x1mm Body, 2.00 mm [TQFP]

Please refer to the Packaging Index for page numbers.

Notes: Packaging outline drawings and land patterndrawings appear on facing pages.

The last three digits of a package outline drawingnumber will always correspond to the last three digits ofthe land pattern drawing number.

The Microchip drawing number for any land patternbegins with the following characters: C04-2xxx.

Revision AS (January 2008)The following packages are new:

• Drawing 0129B, 8-Lead Plastic Dual Flat, No Lead Package (MN) - 2x3x0.75 mm Body [TDFN] on page 156.

• Drawing 136B, 8-Lead Plastic Dual Flat, No Lead Package (MU) - 2x3x0.5 mm Body [UDFN] on page 158.

Land patterns have been added for the followingpackages:

• Drawing 2032A, 3-Lead Plastic Small Outline Transistor (DB) Footprint [SOT-223] on page 33.

• Drawing 2137A, 5-Lead Plastic Small Outline Transistor (DC) Footprint [SOT-223] on page 35.

• Drawing 2031A, 4-Lead Plastic Small Outline Transistor (RC) Footprint [SOT-143] on page 37.

• Drawing 2057A, 8-Lead Plastic Small Outline (SN) Narrow, 3.90 mm Body Footprint [SOIC] on page 79.

• Drawing 2057A, 8-Lead Plastic Small Outline (OA) Narrow, 3.90 mm Body Footprint [SOIC] on page 81.

• Drawing 2056A, 8-Lead Plastic Small Outline (SM) Medium, 5.28 mm Body Footprint [SOIJ] on page 86.

• Drawing 2123A, 8-Lead Plastic Dual Flat, No Lead Package (MC) 2x3x0.9 mm Body Footprint [DFN] on page 99.

• Drawing 2062A, 8-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body Footprint [DFN] on page 103.

• Drawing 2131A, 8-Lead Plastic Dual Flat, No Lead Package (MD) 4x4x0.9 mm Body Footprint [DFN] on page 105.

• Drawing 2063A, 10-Lead Plastic Dual Flat, No Lead Package (MF) 3x3x0.9 mm Body Footprint [DFN] on page 109.

• Drawing 2129A, 8-Lead Plastic Dual Flat, No Lead Package (MN) - 2x3x0.75 mm Body Footprint [TDFN] on page 157.

• Drawing 2136A, 8-Lead Plastic Dual Flat, No Lead Package (MU) - 2x3x0.5 mm Body Footprint [UDFN] on page 159.

Corrections have been made to the followingpackages:

• Drawing 123C, 8-Lead Plastic Dual Flat, No Lead Package (MC) 2x3x0.9 mm Body [DFN] on page 98.

• Drawing 131D, 8-Lead Plastic Dual Flat, No Lead Package (MD) 4x4x0.9 mm Body [DFN] on page 104.

• Drawing 2116A, 80-Lead Plastic Thin Quad Flat-pack (PF) 14x14x1 mm Body, 2.00 mm Footprint [TQFP] on page 151.

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PackagingRevision AT (June 2008)Revised 24-Lead Plastic Small Outline [SOIC], Wide,7.50 mm Body package designator from (PF) to (OG)on page 104.

The following packages are new:

• Drawing 0143A, 24-Lead Plastic Quad Flat, No Lead Package (MJ) 4x4 mm Body [QFN] on page 130.

• Drawing 0144A, 28-Lead Plastic Quad Flat, No Lead Package (MK) 4x4 mm Body [QFN] on page 132.

• Drawing 0140A, 28-Lead Plastic Quad Flat, No Lead Package (MQ) 5x5 mm Body [QFN] on page 134.

• Drawing 0145A, 8-Lead Chip Scale Package (CS) 3x2x3 Ball Pattern [CSP] on page 182.

Land patterns have been added for the followingpackages:

• Drawing 2060A, 3-Lead Plastic Small Outline Transistor (LB) Footprint [SC70] on page 43.

• Drawing 2061A, 5-Lead Plastic Small Outline Transistor (LT) Footprint [SC70] on page 45.

• Drawing 2015A, 7-Lead Plastic (EK) Footprint [DDPAK] on page 51.

• Drawing 2065A, 14-Lead Plastic Small Outline (SL) Narrow, 3.90 mm Body Footprint [SOIC] on page 89.

• Drawing 2065A, 14-Lead Plastic Small Outline (OD) Narrow, 3.90 mm Body Footprint [SOIC] on page 91.

• Drawing 2108A, 16-Lead Plastic Small Outline (SL) Narrow, 3.90 mm Body Footprint [SOIC] on page 93.

• Drawing 2102A, 16-Lead Plastic Small Outline (SO) Wide, 7.50 mm Body Footprint [SOIC] on page 97.

• Drawing 2102A, 16-Lead Plastic Small Outline (OE) Wide, 7.50 mm Body Footprint [SOIC] on page 99.

• Drawing 2051A, 18-Lead Plastic Small Outline (SO) Wide, 7.50 mm Body Footprint [SOIC] on page 101.

• Drawing 2122A, 8-Lead Plastic Dual Flat, No Lead Package (MF) 6x5 mm Body Footprint [DFN-S] on page 119.

• Drawing 2127A, 16-Lead Plastic Quad Flat, No Lead Package (ML) 4x4x0.9 mm Body Footprint [QFN] on page 127.

• Drawing 2126A, 20-Lead Plastic Quad Flat, No Lead Package (ML) 4x4x0.9 mm Body Footprint [QFN] on page 129.

• Drawing 2143A, 24-Lead Plastic Quad Flat, No Lead Package (MJ) 4x4 mm Body Footprint [QFN] on page 131.

• Drawing 2144A, 28-Lead Plastic Quad Flat, No Lead Package (MK) 4x4 mm Body Footprint [QFN] on page 133.

• Drawing 2140A, 28-Lead Plastic Quad Flat, No Lead Package (MQ) 5x5 mm Body Footprint [QFN] on page 135.

Revision AU (June 2008)Updated 8-Lead Plastic Small Outline (SM) Medium5.28 mm Body Footprint [SOIJ] on page 95.

Revision AV (September 2008)Added Drawing 0139A, 20-Lead Plastic Quad Flat, NoLead Package (MQ) 5x5x0.9 mm Body [QFN] onpage 124.

Revision AW (October 2008)Revised 40-Lead Plastic Quad Flat, No Lead Package(MM) 6x6x0.9 mm Body [QFN] on page 136, correctingthe package designator from (MM) to (ML).

Revision AX (January 2009)Added Drawing 149A, 64-Lead Plastic Quad Flat, NoLead Package (ML) 6x6x0.9 mm Body [QFN] on page140. This package is presented on 2 pages to facilitatea more explicit specification through the addition ofgeometric dimensioning and tolerancing (GD&T) infor-mation. GD&T symbols and rules are described anddefined in the ASME Y14.5M-1994 standard(www.asme.org).

Revision AY (March 2009)Revised Drawing 0131E, 8-Lead Plastic Dual Flat, NoLead Package (MD) 4x4x0.9 mm Body [DFN] to thenew two-page format. It is shown on pages 115-116.

Also revised Drawing 149B, 64-Lead Plastic Quad FlatNo Lead Package (MR) 9x9x0.9 mm Body [QFN] onpages 147-148. A corresponding land pattern (2149A),in the list below, was added.

The following packages are new:

• Drawing 151A, 6-Lead Plastic Small Outline Transistor (LT) [SC70] on pages 45-46.

• Drawing 2151A, 6-Lead Plastic Small Outline Transistor (LT) Footprint [SC70] on page 47.

• Drawing 2149A, 64-Lead Plastic Quad Flat, No Lead Package (MR) 9x9x0.9 mm Body Footprint [QFN] on page 149.

• Drawing 068A,16-Lead Plastic Thin Shrink Small Outline (ST) 4.4 mm Body [TSSOP] on page 161-162.

• Drawing 2068A, 16-Lead Plastic Thin Shrink Small Outline (ST) 4.4 mm Body Footprint [TSSOP] on page 163.

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Packaging• Drawing 6005A, 4-Lead Chip Scale Package (CS)

2x2 Ball Pattern [CSP] on pages 191-192.• Drawing 8005A, 4-Lead Chip Scale Package (CS)

2x2 Ball Pattern Footprint [CSP] on page 193.• Drawing 6004A, 5-Lead Chip Scale Package (CS)

2x1x2 Ball Pattern [CSP] on pages 195-196.• Drawing 8004A, 5-Lead Chip Scale Package (CS)

2x1x2 Ball Pattern Footprint [CSP] on page 197.• Drawing 6001A, 8-Lead Chip Scale Package (CS)

3x2x3 Ball Pattern [CSP] on pages 199-200. This package was designated Drawing 145A in the last version of the packaging specification (00049AX).

• Drawing 8001A, 8-Lead Chip Scale Package (CS) 3x2x3 Ball Pattern Footprint [CSP] on page 201.

• Drawing 6003A, 20-Lead Chip Scale Package (CS) 4x5 Special Array Pattern [CSP] on pages 203-204.

• Drawing 8003A, 20-Lead Chip Scale Package (CS) 4x5 Special Array Pattern Footprint [CSP] on page 205.

• Drawing 6002A, 28-Lead Chip Scale Package (CS) 7-6-7-6-7 [CSP] on pages 207-208.

• Drawing 8002A, 28-Lead Chip Scale Package (CS) 7-6-7-6-7 Footprint [CSP] on page 209.

• Appendix B: Control Dimensions (inspection information) on page 217.

Revision AZ (April 2009)The following drawings were removed:

• Drawing 6003A, 20-Lead Chip Scale Package (CS) 4x5 Special Array Pattern [CSP] on pages 203-204.

• Drawing 8003A, 20-Lead Chip Scale Package (CS) 4x5 Special Array Pattern Footprint [CSP] on page 205.

• Drawing 6002A, 28-Lead Chip Scale Package (CS) 7-6-7-6-7 [CSP] on pages 207-208.

• Drawing 8002A, 28-Lead Chip Scale Package (CS) 7-6-7-6-7 Footprint [CSP] on page 209.

Appendix B: “Control Dimensions” was modified toinclude the item “Foot Angle” under B.1 “On SurfaceMount Devices (SMD)” on page 209.

Revision BA (April 2009)The following drawing is new:

• Drawing 142A, 16-Lead Plastic Quad Flat, No Lead Package (MG) 3x3x0.9 mm Body [QFN] on pages 126-127.

The following drawing was corrected:

• Drawing 2051A, 18-Lead Plastic Small Outline (SO) Wide, 7.50 mm Body Footprint [SOIC] on page 99. The second page of this drawing was incorrectly labeled as Drawing 2015A.

Note 4 on the following drawings has been modified torefer interested parties to a Microchip representative,instead of a data sheet, for details about the package:

• Drawing 6005A, 4-Lead Chip Scale Package (CS) 2x2 Ball Pattern [CSP] on page 194.

• Drawing 6004A, 5-Lead Chip Scale Package (CS) 2x1x2 Ball Pattern [CSP] on page 198.

• Drawing 6001A, 8-Lead Chip Scale Package (CS) 3x2x3 Ball Pattern [CSP] on page 202.

Revision BB (August 2009)The following drawings are new:

• Drawing 0154A, 64-Lead Plastic Quad Flat, No Lead Package (MR) 9x9x0.9 mm Body with 5.40x5.40 Exposed Pad [QFN] on pages 152-153.

• Drawing 0152A, 28-Lead Plastic Ultra Thin Quad Flat, No Lead Package (MV) 4x4x0.5 mm Body [UQFN] on pages 154-155.

• Drawing 2111A, 8-Lead Plastic Micro Small Outline Package (MS) Footprint [MSOP] on page 157.

• Drawing 2021A, 10-Lead Plastic Micro Small Outline Package (MS) Footprint [MSOP] on page 161.

• Drawing 2086A, 8-Lead Plastic Thin Shrink Small Outline (ST) 4.4 mm Body Footprint [TSSOP] on page 169.

• Drawing 2087A, 14-Lead Plastic Thin Shrink Small Outline (ST) 4.4 mm Body Footprint [TSSOP] on page 171.

• Drawing 2088A, 20-Lead Plastic Thin Shrink Small Outline (ST) 4.4 mm Body Footprint [TSSOP] on page 177.

• Drawing 148A, 121-Lead Plastic Thin Profile Ball Grid Array (BG) 10x10x1.10 mm Body [XBGA] on pages 216-217.

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Packaging

DS00049BB-page 224 © 2009 Microchip Technology Inc.

NOTES:

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Packaging

APPENDIX B: CONTROL DIMENSIONS

Microchip inspects the first lot of every new package.Thereafter, one lot of each package, from eachassembly site, shall be inspected yearly.

The following dimensions shall be inspected on alltypes of packages:

- Package Length- Package Width- Package Height- Lead or Contact Width- Lead or Contact Pitch

The following packages contain dimensions that shallbe added to the inspection described above.

B.1 On Surface Mount Devices (SMD)- § Lead Coplanarity1

- § Standoff*

- Molded Package Length (if different from overall package length)

- Side Flash- Foot Angle

B.2 Through-Hole- § Lead Span*

B.3 Surface Mount Devices And Through Hole

- Molded Package Width- Molded Package Thickness

B.4 DFN and QFN Only- Contact Length- Contact to Exposed Pad- Exposed Pad Length- Exposed Pad Width

1 The § symbol denotes a significantcharacteristic specified in the control plan.

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DS00049BB-page 226 © 2009 Microchip Technology Inc.

PackagingNOTES:

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© 2009 Microchip Technology Inc. DS00049BB-page 227

INTRODUCTIONIn addition to packaged devices, Microchip TechnologyInc. devices are available in wafer and die form. Allproducts sold in die or wafers have been characterizedand qualified according to the requirements of Micro-chip Technology Inc. Specifications SPI-41014, “Char-acterization and Qualification of Integrated Circuits”and QCI-39000, “Worldwide Quality ConformanceRequirements”.

PRODUCT INTEGRITYProduct supplied in die or wafer form is fully tested andcharacterized. Die and wafers are inspected to Micro-chip Technology Inc. Specification, QCI-30014.

PACKAGING OPTIONSDie/wafer products are available as individual Die inWaffle Pack, Whole Wafers or as Sawn Wafer onFrame. As a standard, all die on a wafer are tested andInk Dots are used to indicate the bad die on a wafer.Inkless wafers with electronic wafer maps are alsoavailable upon request. To acquire individual electronicwafer maps, customers can request a password-pro-tected account on a Microchip FTP site where theirwafer maps are stored and easily downloaded.

Various wafer thicknesses are available, which include8, 11, 15 and 29 mils for unground wafers. Standardwafer thickness varies from product to product, socontact your Microchip Sales Office for details.

ORDERING INFORMATIONDie sales must be initiated by contacting your Microchip Sales Office. To order or to obtain information (on pricing ordelivery) for a specific device, use one of the following part numbers.

DEVICE_NUMBER is the base part number of the device that you require, the S specifies Die in Waffle Pack, a W spec-ifies a Whole Wafer and WF specifies Sawn Wafer on Frame. Whole wafers specified as NBG are shipped as inkedwafers with no backgrind (29 mils) and those specified as NBI are shipped with no backgrind and without Ink.

As further clarification, the manufacturing process is sometimes indicated with a three digit suffix added at the end ofthe part number. For example, a wafer from the 160K process will use the suffix 16K, one from the 150K process willuse 15K and one from the 121K process will use 12K.

CAUTIONSome EEPROM devices use EPROM cells fordevice configuration. Exposure to ultraviolet lightmust be avoided. Exposure to ultraviolet light maycause the device to operate improperly.Extreme care is urged in the handling and assemblyof these products since they are susceptible todamage from electro-static discharge.

Standard Thickness Die/Wafer EEPROM ExamplesDEVICE_NUMBER/S Die in Waffle Pack 24LC01B-I/SDEVICE_NUMBER/W Whole Wafers 24LC01B-I/WDEVICE_NUMBER/WF Sawn Wafer on Frame 24LC01B-I/WF

No Backgrind WafersDEVICE_NUMBER/WNBG Whole Wafers with Ink 24LC01B-I/WNBGDEVICE_NUMBER/WNBI Whole Wafers without Ink 24LC01B-I/WNBI

Standard Die/Wafers with Manufacturing Process Included in Part NumberDEVICE_NUMBER/SXXX Die in Waffle Pack 24LC01B-I/S15KDEVICE_NUMBER/WXXX Whole Wafers 24LC01B-I/W15KDEVICE_NUMBER/WFXXX Sawn Wafer on Frame 24LC01B-I/WF15K

Overview of Microchip Die/Wafer Support

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Overview of Microchip Die/Wafer Support

DS00049BB-page 228 © 2009 Microchip Technology Inc.

ELECTRICAL SPECIFICATIONSThe functional and electrical specifications of Microchipdevices in die form are identical to those of a packagedversion. Please refer to individual data sheets for complete details.

DIE MECHANICAL SPECIFICATIONSRefer to the individual data sheet for thesespecifications.

BOND PAD COORDINATESThe die figures have associated bond pad coordinates.These coordinates assist in the attaching of the bondwire to the die. All the dimensions of these coordinatesare in micrometers (μm) unless otherwise specified.The origin for the coordinates is the center of the die,as shown in Figure 1. Refer to the specific die datasheet for each device for openings and pitch.

FIGURE 1: DIE COORDINATE ORIGIN

The die is capable of thermosonic gold or ultrasonicwire bonding. Die meet the minimum conditions ofMIL-STD 883, Method 2011 on “Bond Strength(Destructive Bond Pull Test)”. The Bond Pad metallization is silicon doped aluminum.

SUBSTRATE BONDINGSubstrate bonding may be required on certain productfamilies. For more information, refer to the specific diedata sheet for that product.

SHIPPING OPTIONSDie Form (/S)Microchip product in die form can be shipped in wafflepack. The waffle pack has sufficient cavity area torestrain the die, while maintaining their orientation. Lintfree paper inserts are placed over the waffle packs, andeach pack is secured with a plastic locking clip. Groupsof waffle packs are assembled into sets for shipment. Alabel with lot number, quantity and part number isattached.

These waffle packs are hermetically sealed in bags.

Wafer Form (/W)Products may also be shipped in wafer form (see order-ing information). Wafers are uncut and shipped in awafer tub. The tub is padded with non-conductive foam.Lint free paper inserts are placed around each wafer. Alabel with lot number, quantity and part number isattached.

Sawn Wafer on Frames (/WF)Products may also be shipped on wafer frames. Wafersare mounted on plastic frames and 100% sawnthrough. Sawn wafer on frames may be shipped in bulk(25 wafers per carrier) or as a single wafer in a carrier.A label with lot number, quantity and part number isattached with each shipment.

Storage ProceduresTemperature and humidity greatly affect the storage lifeof die. It is recommended that the die be used as soonas possible after receipt.

Upon receipt, the sealed bags should be stored in acool and dry environment (25°C and 25% relativehumidity). In these conditions, sealed bags have a shelflife of 12 months. Temperatures or humidities greaterthan these will reduce the storage life.

Once a bag containing waffle packs has been opened,the devices should be assembled and encapsulatedwithin 48 hours (assuming 25°C and 25% humidity).

Origin (0,0)

DIE

Bottom Left(x,y) † Top Right

(x,y) †† All dimensions in μm unless specified otherwise.

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Packaging

© 2009 Microchip Technology Inc. DS00049BB-page 229

NOTES:

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AMERICASCorporate Office2355 West Chandler Blvd.Chandler, AZ 85224-6199Tel: 480-792-7200 Fax: 480-792-7277Technical Support: http://support.microchip.comWeb Address: www.microchip.comAtlantaDuluth, GA Tel: 678-957-9614 Fax: 678-957-1455BostonWestborough, MA Tel: 774-760-0087 Fax: 774-760-0088ChicagoItasca, IL Tel: 630-285-0071 Fax: 630-285-0075ClevelandIndependence, OH Tel: 216-447-0464 Fax: 216-447-0643DallasAddison, TX Tel: 972-818-7423 Fax: 972-818-2924DetroitFarmington Hills, MI Tel: 248-538-2250Fax: 248-538-2260KokomoKokomo, IN Tel: 765-864-8360Fax: 765-864-8387Los AngelesMission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608Santa ClaraSanta Clara, CA Tel: 408-961-6444Fax: 408-961-6445TorontoMississauga, Ontario, CanadaTel: 905-673-0699 Fax: 905-673-6509

ASIA/PACIFICAsia Pacific OfficeSuites 3707-14, 37th FloorTower 6, The GatewayHarbour City, KowloonHong KongTel: 852-2401-1200Fax: 852-2401-3431Australia - SydneyTel: 61-2-9868-6733Fax: 61-2-9868-6755China - BeijingTel: 86-10-8528-2100 Fax: 86-10-8528-2104China - ChengduTel: 86-28-8665-5511Fax: 86-28-8665-7889China - Hong Kong SARTel: 852-2401-1200 Fax: 852-2401-3431China - NanjingTel: 86-25-8473-2460Fax: 86-25-8473-2470China - QingdaoTel: 86-532-8502-7355Fax: 86-532-8502-7205China - ShanghaiTel: 86-21-5407-5533 Fax: 86-21-5407-5066China - ShenyangTel: 86-24-2334-2829Fax: 86-24-2334-2393China - ShenzhenTel: 86-755-8203-2660 Fax: 86-755-8203-1760China - WuhanTel: 86-27-5980-5300Fax: 86-27-5980-5118China - XiamenTel: 86-592-2388138 Fax: 86-592-2388130China - XianTel: 86-29-8833-7252Fax: 86-29-8833-7256China - ZhuhaiTel: 86-756-3210040 Fax: 86-756-3210049

ASIA/PACIFICIndia - BangaloreTel: 91-80-3090-4444 Fax: 91-80-3090-4080India - New DelhiTel: 91-11-4160-8631Fax: 91-11-4160-8632India - PuneTel: 91-20-2566-1512Fax: 91-20-2566-1513Japan - YokohamaTel: 81-45-471- 6166 Fax: 81-45-471-6122Korea - DaeguTel: 82-53-744-4301Fax: 82-53-744-4302Korea - SeoulTel: 82-2-554-7200Fax: 82-2-558-5932 or 82-2-558-5934Malaysia - Kuala LumpurTel: 60-3-6201-9857Fax: 60-3-6201-9859Malaysia - PenangTel: 60-4-227-8870Fax: 60-4-227-4068Philippines - ManilaTel: 63-2-634-9065Fax: 63-2-634-9069SingaporeTel: 65-6334-8870Fax: 65-6334-8850Taiwan - Hsin ChuTel: 886-3-6578-300Fax: 886-3-6578-370Taiwan - KaohsiungTel: 886-7-536-4818Fax: 886-7-536-4803Taiwan - TaipeiTel: 886-2-2500-6610 Fax: 886-2-2508-0102Thailand - BangkokTel: 66-2-694-1351Fax: 66-2-694-1350

EUROPEAustria - WelsTel: 43-7242-2244-39Fax: 43-7242-2244-393Denmark - CopenhagenTel: 45-4450-2828 Fax: 45-4485-2829France - ParisTel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79Germany - MunichTel: 49-89-627-144-0 Fax: 49-89-627-144-44Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781Netherlands - DrunenTel: 31-416-690399 Fax: 31-416-690340Spain - MadridTel: 34-91-708-08-90Fax: 34-91-708-08-91UK - WokinghamTel: 44-118-921-5869Fax: 44-118-921-5820

WORLDWIDE SALES AND SERVICE

03/26/09