MICRO MILL µMill for IC Package Preparation

• Manufacture Gaskets for any Acid Decapsulator

• Design Custom Fixtures for any Acid Decapsulator

• Mechanical IC Package Decapsulation

• Remove Heat Sinks

• Pre-cavitate Packages • Expose Die

THE TECHNOLOGY -

The original functions of the µMill were the production of accessories for acid decapsulating systems. In this role the μMill rapidly designs and cuts gaskets and alignment plates of various custom designs via an intuitivehand held controller input protocol. Rapid gasket and alignment platemanufacture is critical to accomodate the high throughput of package decapsulation necessary in Failure Analysis Laboratories. Why wait for accessories when you can make them on site as needed.

Functionality of the µMill has been further expanded to allow a wide rangeof mechanical plastic package processes to be performed, as is shown in this start up screen of the Handheld Interface

Making gaskets for acid decapsulation -

There are 6 options for making gaskets. These are shown here from the µMill menu that is displayed whenMACHINE A GASKET is selected from the Main Menu.

Key measurements of the IC package to be decapsulated are entered into the Handheld Controller. To extend the life of gaskets by improving acid resistance all gasket material supplied by RKD has been subjected to their proprietary <7 Treatment (sub 7 treatment)1

Making alignMent plates for acid decapsulation -

Selecting MAKE ALIGN PLATE from the Main Menu will bring up the Alignment Plate Screen. This screen allows the entry of data specific to making alignment plates. Making alignment plates requires installing the Plate Holding Fixture and requires a different end mill from making gaskets For advanced operations, the μMill can be connected to a Personal Computer via a standard serial port. Complex gasket or various custom device machining operations can be performed through direct G Code execution from the PC. The simple interface allows fast set up time to create all of these accessories. From set up into the controller interface to finished product, items can be made in as little as 5 minutes.

1 Left Coast Instruments Technical Bulletin 3003 “ <Treatment of Gasket Material - Increased Acid Resistance”

µMILL - Gasket Menu

µMILL - Main Menu Display

MAIN MENU MACHINE A GASKET MAKE ALIGN PLATE MAKE HOLDING FIXTURE MECH DECAPSULATE REMOVE HEAT SINK SAVE / RECALL PROG

SPECIAL FUNCTIONS

MAKE ALIGN PLATE X PACK DIM = .315 Y PACK DIM = .315 X OFFSET = .000 Y OFFSET = .000 LIP THICK = .020 X THRU DIM = .157 Y THRU DIM = .157 ENTR UP STO MM DEL DWN RCL INCH

µMILL - Alignment Plate Menu

THE BASICS - The µMill (MicroMill) is a computer controlled precision, micro-machining tool designed to perform a wide range of IC package sample preparation functions. The ability to encompass multiple functions into a single Mill is possible only because of RKD’s innovative software control. Flexible, yet simple software allows wide range of milling functions to be performed, with no operator knowledge of either G Code or Speeds and Feeds.

All three axes of the µMill are driven using open stepper motors to correspond to machine control (G) code received from the handheld user interface

The main processor within the mill monitors the travel limit switches and the Safety Cover Interlock.

MACHINE A GASKET MAKE DEF. GASKET MAKE POCKET GASKET MAKE SQUARE GASKET MAKE BACK GASKET MAKE STEP GASKET RETURN TO MENU

MECHANICAL PACKAGE DECAPSULATION -

Making package Holding fixtures -

reMoving Heat sinks -

Selecting MAKE HOLDING FIXTURE from the Main Menu will bring up this holding fixture screen.

This screen allows entry of data specific to making holding fixtures.

For Mechanical Package Decapsulation functions the IC package is firmly held in a Holding fixture. Holding fixtures are easily made with the µMill. They consist of a shallow cavity machined into a Holding Fixture blank. For efficient machining, grinding and polishing precise alignment of the package relative to the µMill Z axis is essential. The Holding Fixture is inserted into the µMill stage assembly ensuring that the part is always centered.Rotational accuracy is assured by a pin and key slot under the Holding Fixture blank.

MAKE HOLDING FIXTURE X PACK DIM = .315 Y PACK DIM = .315 PACK HEIGHT = .020

ENTR UP STO MM DEL DWN RCL INCH

µMILL - Holding Fixture Menu

pre-cavitation of plastic ic packages & exposing die -

Nothing could be easier than package decapsulation with the μMill. After entering the dimensions of the die and (and die offsets if necessary) all that is needed is to enter a depth value to define the depth of the cavity to be milled into the plastic.

The next menu screen asks for the end mill to be lowered using theZ- button until it touches the package surface - setting this as a zero point. Then pressing the Z ZERO button automatically starts the decap process. Mechanical decapsulation will automatically stop after milling to the depth value set earlier.

MECHANICAL DECAPSULATE MOVE TOOL DOWN UNTIL TOOL TOUCHES PART

ZERO TO CONTINUE Z TOOL POS = .400

END PROCESS Z– Z+ Z- Z

ZEROµMILL - Mechanical Decapsulation

Selecting REMOVE HEAT SINK displays the menu shown here.

The Dimensions of the Heat Sink, including offset dimensions (if any)are determined in the same way that described above for milling a package.

During removal of a Heat Sink the screen shown below is displayed.

The tool is moved down into the part using the Z + and Z - buttons. Pressing STOP / RESUME stops the spindle motor and withdraws the cutting tool (end mill) from the part to allow for removing dust and shavings. Pressing STOP / RESUME again start the process.

When the desired depth has been reached, the Z ZERO button sets the current tool position to Zero. This allows returning to the same tool position when multiple parts are being processed.

REMOVE HEAT SINK X H.S. DIM= .315 Y H.S. DIM= .315 X OFFSET= .000 Y OFFSET= .000

ENTR UP STO MMDEL DWN RCL INCH

REMOVE HEAT SINK

MOVE TOOL DOWN UNTIL DESIRED DEPTH IS REACHED

REMOVE DUST AS REQUIRED

Z TOOL POS = .400END PROCESS Z+ Z ++STOP/RESUME Z - Z ZERO

µMILL - Heat Sink / Die Flag Removal

µMILL - Heat Sink / Die Flag Removal

LEFT COAST INSTRUMENTSP.O. Box 2217, Aptos, California, 95001-2217, USA

Tel: +1 831 684 9224 Fax:+1 831 661 0211email info@lcinst.com

http://www.leftcoastinstruments.com

GENERAL SPECIFICATIONS-

Dimensions (w x d x h) 14.5 x 13.0 x 14.0 368 x 330 x 355 mm Weight approx. 40 lbs (18 Kg) Power requirements 90 to 250 VAC 49 to 61 Hz at 4 amps maximum Interface 9 pin “D-sub” RS-232 serial port

MECHANICAL SPECIFICATIONS - X axis travel 3.000 inches (76.20 mm) Y axis travel 3.000 inches (76.20 mm) Z axis travel 3.000 inches (76.20mm) (2.000 inches with tool installed)

Maximum feed rate 20 inches per minute (508.00 mm) Resolution 0.00025 inches (6.35 microns) Repeatability 0.0005 inches (12.50 microns) Spindle Speed 0 to 6000 RPM Spindle Orthagonality +/- 0.0015 inches (measured over a 3 inch diameter circle) Spindle Run Out +/- 0.00025 inches Tool Height Variation with X & Y axis full travel +/- 0.001 inches Home position repeatability +/- 0.001 inches

Tool holder Industry Standard 0.125 inch shank tool holder (3.175mm) (optional 3/32” tool holder & 3mm metric tool holder available) Tool preset height 0.700 inches (17.78mm)

SOFTWARE SIZE LIMIT SPECIFICATIONS - DefinitionHole-maximumsize 0.800diagonal(20.32mm)for1inch(25.40mm)diametergaskets Maximum pocket package size 2 package corners need to be on gasket Maximum heatsink size 2.000 X 2.000 inches (50.80 x 50.80mm)

Maximum alignment plate hole 2.250 wide 1.750 high (57.15 x 44.45mm) Maximum die size for back side 2.000 X 2.000 inches (50.80 x 50.80mm)

CERTIFICATIONS & INDUSTRY COMPLIANCES - CE RoHS SEMI S-2 SEMI S-2, 93

WARRANTY - Subject to RKD Engineerings Standard Terms and Conditions of sale. All parts are warranted for a period of twelve (12) months to be free of defects in material and workmanship when used under normal operation