METAMOTIONR r0.3 PRODUCT SPECIFICATION v0 · 2019-07-04 · V0.5 Page 11 MbientLab Inc. MetaMotionR Product Specification 3.6 Ambient Light Sensor The Ambient Light Sensor LTR-329ALS-01

V0.5 © Mbientlab Inc.

MbientLab Inc. MetaMotionR Product Specification

METAMOTIONRr0.3

PRODUCT

SPECIFICATIONv0.5

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MetaMotionR r0.3 Wearable and connected devices product solution

Product Specification v0.5

Key Features

• Nordic Semiconductor nRF52832 BLE SoC • 2.4 GHz transceiver • ARM® Cortex™-M4F 32 bit processor • 512 kB flash program memory • 64 kB RAM

• Winbond W25Q64JV 64Mbit NOR Flash Extended Log Memory • Bosch® BMI160 6-Axis Accelerometer/Gyroscope

• ±2g/±4g/±8g/±16g selectable scale • 125/250/500/1000/2000 degrees/sec • Industry Leading 900uA active current gyro

• Bosch® BMM150 3-Axis Magnetometer • Bosch® BMP280 Digital Pressure Sensor

• 30 to 110 kPa range • 0.16 Pa resolution

• Lite-On® LTR-329ALS-01 Ambient Light Sensor • 0.01 to 64k lux range

• Firmware-enabled 9-axis sensor fusion • Lithium Ion/Polymer battery charger • Micro-USB rechargeable • Bright RGB LED • Miniature push-button switch • High current / haptic driver • Accurate Thermistor Temperature Sensor

• I/O Expansion • Digital I2C Bus • 4 Analog/Digital Pins • 3 Digital Pins

• Tiny 26mm x 17mm x 2.5mm form factor

• Form factor compatible with MetaWearRG/RPro

• FCC, IC, CE certification

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Table of Contents1Introduction............................................................................................................................................5

2ProductOverview...................................................................................................................................5

2.1BlockDiagram..................................................................................................................................5

2.2PinAssignments...............................................................................................................................6

2.3PinFunctions....................................................................................................................................8

2.4ModuletoSoCPinMapping............................................................................................................9

3CircuitandSensorDetails.....................................................................................................................10

3.1HighCurrent/HapticDriveCircuit..................................................................................................10

3.2NORFlash.......................................................................................................................................10

3.3Humidity/BarometricPressureSensor.........................................................................................10

3.4Accelerometer/Gyroscope...........................................................................................................10

3.5Magnetometer...............................................................................................................................10

3.6AmbientLightSensor.....................................................................................................................11

3.7MechanicalSwitch.........................................................................................................................11

3.8ThermistorTemperatureCircuit....................................................................................................11

3.9RGBLEDCircuit..............................................................................................................................11

4AbsoluteMaximumRatings..................................................................................................................13

5OperatingConditions............................................................................................................................13

6ElectricalSpecifications.........................................................................................................................13

6.1GeneralPurposeI/O(GPIO)Specifications....................................................................................13

6.2OscillatorSpecifications(OSC).......................................................................................................13

6.3SAADC(ADC)Specifications...........................................................................................................15

6.4TemperatureSensor(TEMP)Specifications...................................................................................15

6.5HighCurrentDriver(HCD)Specifications.......................................................................................15

6.6Accelerometer(ACCEL)Specifications...........................................................................................16

6.7Gyroscope(GYRO)Specifications...................................................................................................16

6.8Magnetometer(MAG)Specifications............................................................................................16

6.9Pressure(BAROMETER)Specifications..........................................................................................17

6.10LED(LED)Specifications...............................................................................................................17

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6.11AmbientLight(ALS)Specifications...............................................................................................17

6.12NORFlash(NOR)Specifications...................................................................................................18

6.13SensorFusion(SF)Specifications.................................................................................................18

7MechanicalSpecifications.....................................................................................................................19

9RevisionHistory....................................................................................................................................20

10RegulatoryStatements.......................................................................................................................21

10.1NorthAmerica..............................................................................................................................21

10.2EuropeanUnion...........................................................................................................................22

10.3Warning.......................................................................................................................................22

10.4WEEEandRoHS............................................................................................................................22

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1 Introduction MetaMotionRisacompletedevelopmentandproductionplatformforwearableandconnecteddeviceapplications.Itfeaturestheultra-lowpowernRF52832SoC,providingenergyefficientsmartphonecommunicationandcentralprocessing.MetaMotionRintegratesthisradiowithhighvaluesensorsandarechargeablebatteryarchitectureintoaminiatureformfactor.Allcircuitshavebeendesignedfromthegroundupwithenergyefficiencyinmind.

2 Product Overview 2.1 Block Diagram

Figure 1 Block Diagram

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2.2 Pin Assignments

Figure 2 Front Pin Assignments

Figure 3 Back Pin Assignments

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2.3 Pin Functions

Pin PinName Function Description

PowerSupply

1 VUSB Power PositivesupplyalternativetomicroUSBport.2 VBAT Power Positivebatteryconnection.3 VGND Power Groundconnectionintendedforbattery.

DigitalPeripheralBus

4 VGND Power Supplementarygroundforperipheralexpansion.5 SDA DigitalI/O I2Cserialdata.6 SCL DigitalI/O I2Cserialclock.7 V3V Power Regulated3Voutputforperipheralexpansion.

Analog/HighCurrentDriverBus

8 D0A0

DigitalI/OAnalogI/O GeneralpurposeI/Oandanaloginput.

9 D1A1


10 HCD HighCurrentDriver Switchforsinkinghighcurrentperipherals.

11 V3V Power Regulated3Voutputforhighcurrentperipheral.

SurfaceMountExtraBreakout

12D2A2


13D3A3


14 D4 DigitalI/O GeneralpurposeI/O.15 D5 DigitalI/O GeneralpurposeI/O.16 D6 DigitalI/O GeneralpurposeI/O.SWDDebugHeader 18 V3V Power Systemsupplyfordebugger.19 VGND Power Systemgroundfordebugger.20 SWDIO/nRESET Debug SWDdebuggerI/Olineandsystemreset.21 SWDCLK Debug SWDdebuggerclockline.

Table 1 Pin Functions

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2.4 Module to SoC Pin Mapping

ModulePin

nF52832Pin Function Description

GPIO

D0/A0 P0.02 GPIO GeneralpurposeI/Oandanaloginput.D1/A1 P0.05 GPIO GeneralpurposeI/Oandanaloginput.D2/A2 P0.31 GPIO GeneralpurposeI/Oandanaloginput.D3/A3 P0.04 GPIO GeneralpurposeI/Oandanaloginput.D4 P0.15 GPIO GeneralpurposeI/O.D5 P0.17 GPIO GeneralpurposeI/O.D6 P0.21 GPIO GeneralpurposeI/O.

HighCurrent/HapticDriver

HCD P0.10 Haptic OpendrainMOSFETpull-down.I2C SDA P0.18 SerialBus I2Cserialdata.SCL P0.19 SerialBus I2Cserialclock.InternalModulePins P0.06 Switch MicroPushButton.ActiveLow. P0.16 5VPresent Activehighindicatorofanattachedpowersource. P0.30 BatteryVoltage AnalogvoltageatVBAT*(10.0/14.02)

P0.20 BatteryCharging Opendrain,activelowindicatorthatthechargerisactive.

P0.07 ThermistorEn ActiveHighEnableforThermistor P0.03 ThemistorVoltage VoltageoutputfromThermistorVoltageDivider P0.25 Acc/GyroInterrupt INT1PinofBMI160. P0.11 Acc/GyroInterrupt INT2PinofBMI160. P0.28 Acc/GyroSCK SCKPinofBMI160,BMM150,W25Q64FV. P0.26 Acc/GyroMISO MISOPinofBMI160,BMM150,W25Q64FV. P0.27 Acc/GyroMOSI MOSIPinofBMI160,BMM150,W25Q64FV. P0.29 Acc/GyronCS nCSPinofBMI160. P0.23 MagInterrupt INTPinofBMM150. P0.22 MagDataReady DRDYPinofBMM150. P0.24 MagnCS nCSPinofBMM150 P0.09 NORFlashnCS nCSPinofW25Q64FV. P0.08 NORFlashnWP nWPPinofW25Q64FV. P0.13 LEDRednEn CurrentSinkforRedLEDChannel. P0.14 LEDGreennEn CurrentSinkforGreenLEDChannel.

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P0.12 LEDBluenEn CurrentSinkforBlueLEDChannel.Table 2 Module Pin Mapping

3 Circuit and Sensor Details 3.1 High Current/Haptic Drive Circuit

Figure 4 Haptic Driver Circuit

The haptic drive circuit features a logic level gate drive N-Channel MOSFET, and a flyback diode to 3V for switching inductive loads.

3.2 NOR Flash

The NOR Flash W25Q64JV is attached to the shared SPI bus, with dedicated nCS and nWP pins as detailed in the SoC mapping table.

3.3 Humidity / Barometric Pressure Sensor

The Barometric Pressure Sensor BMP280 or the Humidity and Barometric Pressure Sensor BME280 is attached to the shared I2C bus at slave address 0x77.

3.4 Accelerometer / Gyroscope

The 6-axis accelerometer and gyroscope sensor BMI160 attached via the SPI bus, with pin numbers detailed in the module to SoC mapping table.

3.5 Magnetometer

The 3-axis magnetometer BMM150 is attached via the SPI bus, with pin numbers detailed in the module to SoC mapping table.

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3.6 Ambient Light Sensor

The Ambient Light Sensor LTR-329ALS-01 is attached to the shared I2C bus at slave address 0x29.

3.7 Mechanical Switch

The GPIO internal pullup resistor should be used with the mechanical switch, which is active low.

3.8 Thermistor Temperature Circuit

Figure 5 Thermistor Temperature Circuit

The thermistor circuit features a voltage divider and active high enable for power saving. Details on the sensor characteristics can be found in the data sheet for part number NCP15XH103F03RC.

3.9 RGB LED Circuit

Figure 6 RGB LED Circuit

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The RGB LED channels are driven by an active low PWM signal from the SoC. The resistance values have been chosen to approximately match intensity at 100 percent duty cycle. The high current bit should be set on the GPIOs to sink up to 5mA.

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4 Absolute Maximum Ratings Spec Description Min. Typ. Max. Units

VUSB USBchargingvoltage. -0.3 +7.0 VVBAT Lithiumbatteryvoltage. -0.3 +6.0 VVGND Groundvoltage 0 VVIO I/OPinVoltage -0.3 +3.3 VTMAX StorageTemperature -40 125 °C

Table 3 Absolute Maximum Ratings

5 Operating Conditions Spec Description Min. Typ. Max. Units

VUSB USBchargingvoltage. 4.0 5.0 6.0 VVBAT Lithiumbatteryvoltage. 3.0 3.7 4.2 VTA Operatingtemperature. -40 25 85 °CIIDLE Idlecurrentconsumption. 20 50 uA

Table 4 Operating Conditions

6 Electrical Specifications 6.1 General Purpose I/O (GPIO) Specifications

Spec Description Min. Typ. Max. UnitsVIH Inputhighvoltage. 2.1 3.0 VVIL Inputlowvoltage. 0 0.9 VVOH Outputhighvoltage. 2.6 3.0 VVOL Outputlowvoltage. 0 0.4 VRPU Pull-upresistance. 11 13 16 kΩRPD Pull-downresistance. 11 13 16 kΩ

Table 5 General Purpose I/O (GPIO) Specifications 6.2 Oscillator Specifications (OSC)

Spec Description Min. Typ. Max. Units

fHF,NOM Highfrequencycrystalfrequency 32 MHzfHF,TOL Highfrequencycrystaltolerance ±40 ppmfLF,NOM Lowfrequencyoscillatorfrequency 32.768 kHz

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fHF,TOL Lowfrequencyoscillatortolerance ±250 ppmTable 6 Crystal Oscillator Specifications

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6.3 SAADC (ADC) Specifications

Spec Description Min. Typ. Max. UnitsDNL10b Differentialnon-linearity(10bitmode). <1 LSBINL10b Integralnon-linearity(10bitmode). 1 LSBVOS Offseterror. ±2 LSBVREF_INT Internalreferencevoltage. -3 0.6V +3 %tADC10b Sampleconversiontime. <2 µstACQ Sampleacquisitiontime.Configurable. 3 40 µsfMAX Maximumsamplingrate. 200 kHz

Table 7 SAADC Specifications 6.4 Temperature Sensor (TEMP) Specifications


TRANGE Temperaturesensorrange. -40 85 °CTACC Temperaturesensoraccuracy. -5 +5 °CTRES Temperaturesensorresolution. 0.25 °CTTHM_RANGE Thermistorsensorrange. -40 85 °CTTHM_ACC Thermistorsensoraccuracy. -1 +1 °CTTHM_RES Thermistorsensorresolution. 0.125 °C

Table 8 Temperature Sensor (TEMP) Specifications 6.5 High Current Driver (HCD) Specifications


ION,SS25 Steadystateoncurrentat25°C. 310 mAION,SS85 Steadystateoncurrentat85°C. 220 mAPON,SS Steadystatepowerdissipation. 280 mWION,PULSE Pulsedcurrentfor10µs. 1.4 ARON Onstateresistance. 2 5 ΩIOFF,LEAK Offstateleakage. 1 nAVCLAMP Clampingdiodevoltagethreshold. 3.3 V

Table 9 High Current Driver (HCD) Specifications

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6.6 Accelerometer (ACCEL) Specifications


Measurementrange. ±2 ±16 g

Resolution. 2048 16384 counts/gfDATA Datasamplefrequency. 0.78 1600 HzI12.5 Lowdataratecurrent(3.125Hz). 5 uAI100 Middataratecurrent(100Hz). 24 uAI1600 Highdataratecurrent(1600Hz). 180 300 uAISTANDBY Standbycurrent. 3 10 uA

Table 10 Accelerometer (ACCEL) Specifications 6.7 Gyroscope (GYRO) Specifications


Measurementrange. ±125 ±2000 °/s

Resolution. 16 262 counts/°fDATA Datasamplefrequency. 25 3200 HzIGYRO Gyroactivecurrent.AllDataRates. 850 900 uA

ISTANDBYStandbycurrent.IncludedinAccelStandbyCurrent.

Table 11 Gyroscope (GYRO) Specifications

6.8 Magnetometer (MAG) Specifications


Measurementrange. ±1200 ±1300 uT

HeadingAccuracy. ±2.5 °fDATA Datarate. 25 300 HzISTANDBY Standbycurrent. 1 3 uA

Table 12 Magnetometer (MAG) Specifications

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6.9 Pressure (BAROMETER) Specifications


Measurementrange. 30 110 kPa

Resolutioninultrahighresolutionmode. 0.16 PafDATA Datasamplefrequencyatmaxdatarate. 157 Hz

IACTIVEActivecurrent.Datarateandoversamplingsensitive. 0.14 650 uA

ISTANDBY Standbycurrent. 0.1 0.3 uAIPEAK Peakcurrentduringmeasurement. 720 1120 uA

Table 13 Pressure (BAROMETER) Specifications 6.10 LED (LED) Specifications

Spec Description Min. Typ. Max. UnitsIRGB Drivecurrentperchannel. 2 4 5 mAλRPEAK Redpeakwavelength. 624 nmλGPEAK Greenpeakwavelength. 525 nmλBPEAK Bluepeakwavelength. 470 nmIvR Redluminousintensity. 12 60 mcdIvG Greenluminousintensity. 15 60 mcdIvB Blueluminousintensity. 10 60 mcd ViewingAngle 120 °

Table 14 LED (LED) Specifications 6.11 Ambient Light (ALS) Specifications


Measurementrange. 0.01 64k lux

Resolution. 16 bitfDATA Datasamplefrequency. 0.5 20 HzIPEAK Peakactivecurrent. 220 uAISTANDBY Standbycurrent. 5 uA

Table 15 Ambient Light (ALS) Specifications

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6.12 NOR Flash (NOR) Specifications


Powerdowncurrent. 1 25 uA

Writecyclespersector. 100,000 cycles

Dataretention 20 yearsIREAD Readcurrent. 15 mAIPROGRAM Programcurrent. 20 25 mAIERASE Erasecurrent. 20 25 mAtSSE SubsectorErasetime. 60 400 mstCE ChipErasetime. 20 100 s

Table 16 NOR Flash (NOR) Specifications

6.13 Sensor Fusion (SF) Specifications


fNDOF NDoFoperatingfrequency. -1% 100 +1% HzfIMUPLUS IMUPlusoperatingfrequency. -1% 100 +1% HzfCOMPASS Compassoperatingfrequency. -1% 25 +1% HzfM4G M4Goperatingfrequency. -1% 50 +1% Hz

Table 17 Sensor Fusion (SF) Specifications

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7 Mechanical Specifications

Figure 7 Module dimensions in mm

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9 Revision History Date Version ChangeDescriptionNovember21,2016 0.5 InitialDraft

Table 18 Revision History

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10 Regulatory Statements 10.1 North America

UnitedStates:FederalCommunicationsCommission

FCCCOMPLIANCESTATEMENT:Thisdevicecomplieswithpart15oftheFCCRules.Operationissubjecttothefollowingtwoconditions:(1)Thisdevicemaynotcauseharmfulinterference,and(2)thisdevicemustacceptanyinterferencereceived,includinginterferencethatmaycauseundesiredoperation.ThisequipmenthasbeentestedandfoundtocomplywiththelimitsforaClassBdigitaldevice,pursuanttoPart15ofFCCRules.Theselimitsaredesignedtoprovidereasonableprotectionagainstharmfulinterferenceinaresidentialinstallation.Thisequipmentgenerates,uses,andcanradiateradiofrequencyenergy.Ifnotinstalledandusedinaccordancewiththeinstructions,itmaycauseharmfulinterferencetoradiocommunications.However,thereisnoguaranteethatinterferencewillnotoccurinaparticularinstallation.Ifthisequipmentdoescauseharmfulinterferencetoradioortelevisionreception,whichcanbedeterminedbytuningtheequipmentoffandon,theuserisencouragedtotryandcorrecttheinterferencebyoneormoreofthefollowingmeasures:• Reorientorrelocatethereceivingantenna.• Increasethedistancebetweentheequipmentandthereceiver.• Connecttheequipmenttooutletonacircuitdifferentfromthattowhichthereceiverisconnected.• Consultthedealeroranexperiencedradio/TVtechnicianforhelp.FCCID:2ACEB-MMCCanada:IndustryCanada

ICCOMPLIANCESTATEMENT:ThisdevicecomplieswithIndustryCanadalicence-exemptRSSstandard(s).Operationissubjecttothefollowingtwoconditions:(1)thisdevicemaynotcauseinterference,and(2)thisdevicemustacceptanyinterference,includinginterferencethatmaycauseundesiredoperationofthedevice.CetappareilestconformeavecIndustrieCanadaexemptsdelicencestandardRSS(s).L‘utilisationdecedispositifestautoriséeseulementauxconditionssuivantes:(1)ilnedoitpasproduiredebrouillageet

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(2)l’utilisateurdudispositifdoitêtreprêtàacceptertoutbrouillageradioélectriquereçu,mêmesicebrouillageestsusceptibledecompromettrelefonctionnementdudispositif.ICID:12118A-MMC10.2 European Union

EuropeanUnion:CEdirective

STATEMENT:Hereby,MbientLabdeclaresthatMetaMotionRisincompliancewiththeessentialrequirementsandotherrelevantprovisionsofDirective2014/53/EC:• ETSIEN300328V2.1.1:• ETSIEN301489-1V2.1.1(2017-02),• ETSIEN301489-17V3.1.1(2017-02),• EN55032:2012/AC:2013,• EN55024:2010:• EN62368-1:2014/AC:2015:TheEUDeclarationofConformitycanbefoundat:www.mbientlab.com/documentation10.3 Warning

ThechangesormodificationsnotexpresslyapprovedbyMbientLabcouldvoidtheuser’sauthoritytooperatetheequipment.ATTENTION:MetaMotionR’sbatterylifecanbeshortenedwithheavyuse.METAMOTIONRISNOTATOYORMEDICALDEVICE.WARNING:chokinghazard-smallparts.10.4 WEEE and RoHS

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Thesymbolontheproductoritspackagingsignifiesthatthisproducthastobedisposedseparatelyfromordinaryhouseholdwastesatitsendoflife.Pleasekindlybeawarethatthisisyourresponsibilitytodisposeelectronicequipmentatrecyclingcenterssoastohelpconservenaturalresources.EachcountryintheEuropeanUnionshouldhaveitscollectioncentersforelectricalandelectronicequipmentrecycling.Forinformationaboutyourrecyclingdropoffpoint,pleasecontactyourlocalrelatedelectricalandelectronicequipmentwastemanagementauthorityortheretailerwhereyouboughttheproduct.• DonotdisposeoftheMetaMotionRwithhouseholdwaste.• DisposalofthepackagingandyourMetaMotionRshouldbedoneinaccordancewithlocal

regulations.• Batteriesarenottobedisposedofinmunicipalwastestreamandrequireseparatecollection.

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METAMOTIONR r0.3 PRODUCT SPECIFICATION v0 · 2019-07-04 · V0.5 Page 11 MbientLab Inc. MetaMotionR Product Specification 3.6 Ambient Light Sensor The Ambient Light Sensor LTR-329ALS-01