Metalor Technologies Japan · PDF fileIMEX 210 is a plating solution that reduces nickel corrosion and has a good adhesion to the substrate. IMEX-510D is a plating solution, which

Metalor Technologies (Japan) Corporation

P r o d u c t C a t a l o g u e

2

METALOR, It's a synonym of processes

for high quality precious metals.

Electronics technology, such as cellular phones, personal computers, televisions,

automobiles, airplanes, etc., plays an important role in every scenes of our life, from our office to home,

and in accordance with the significant change and advancement in this information society,

the technology is also making advances everyday.

Advancement of "surface finishing technology" is necessary for high integration

of electronic circuits and high-density mounting technology, which are at the core of these technologies.

Metalor Technologies (Japan) Corporation provides the precious metal processes contributing

to this technology (precious metal surface finishing chemicals and machines).

Metalor Technologies (Japan) Corporation also has several overseas offices: Singapore, Taiwan, South Korea,

Shanghai, etc. including Japan,and continues to provide high-quality precious metal surface finishing chemicals

and machines to meet the diversifying needs of the markets and increasing globalization.

Cyanide -free gold-plating process

Cyanide gold-plating process

Electroless gold-plating process

Alloy plating process

Cyanide silver-plating process

Pre-treatment or after- treatment agents

Stripper

Platinum-plating process

Palladium-plating process

Rhodium-plating process

Ruthenium-plating process

(Electrolytic) gold-plating process for decorative parts

Plating Machine For Lead Frames

Connector Plating Machine

Carrier Type Plating Machine

Washer

Electroplating Machine

Electroless Plating Machine

Etching Machine

Other Plating Machines

Analysis And Prototyping For Plating

PROCESS

EQUIPMENT

SERVICE

■メタローテクノロジーズジャパン（株）様／会社案内（英語版）／P.02-03／4C／仕上がりサイズ：W297mm×H210mm　2011.06.16

P r o d u c t C a t a l o g u e

2

METALOR, It's a synonym of processes

for high quality precious metals.

Electronics technology, such as cellular phones, personal computers, televisions,

automobiles, airplanes, etc., plays an important role in every scenes of our life, from our office to home,

and in accordance with the significant change and advancement in this information society,

the technology is also making advances everyday.

Advancement of "surface finishing technology" is necessary for high integration

of electronic circuits and high-density mounting technology, which are at the core of these technologies.

Metalor Technologies (Japan) Corporation provides the precious metal processes contributing

to this technology (precious metal surface finishing chemicals and machines).

Metalor Technologies (Japan) Corporation also has several overseas offices: Singapore, Taiwan, South Korea,

Shanghai, etc. including Japan,and continues to provide high-quality precious metal surface finishing chemicals

and machines to meet the diversifying needs of the markets and increasing globalization.

Cyanide -free gold-plating process

Cyanide gold-plating process

Electroless gold-plating process

Alloy plating process

Cyanide silver-plating process

Pre-treatment or after- treatment agents

Stripper

Platinum-plating process

Palladium-plating process

Rhodium-plating process

Ruthenium-plating process

(Electrolytic) gold-plating process for decorative parts

Plating Machine For Lead Frames

Connector Plating Machine

Carrier Type Plating Machine

Washer

Electroplating Machine

Electroless Plating Machine

Etching Machine

Other Plating Machines

Analysis And Prototyping For Plating

PROCESS

EQUIPMENT

SERVICE


PROCESS

4 5

NCF Series

ECF Series

K-130

K-200

K-130(AF)

K-200WT

K-44

K-700

K-720D

K-440

PROCESS

EL-GOLD#20

ATOMEX

ATOMEX-PC

IMEX 210

IMEX-510D

SUPER MEX Series

K-185ST

K-186SB

FINE BARRIER 7000

K-186J

K-188

K-77

K-76

K-100

CYANIDE-FREE GOLD-PLATING PROCESS

CYANIDE GOLD-PLATING PROCESS

STRIKE SOLUTIONPURE GOLD

PCB, FPCCHARACTERISTICS

APPLICATIONSBATH

TEMPERATURE（℃）

METAL PURITY（％）

CURRENTDENSITY

（A/dm2）

CURRENTEFFICIENCY（％）

DEPOSITION RATE（μm/min）

CONTENT（g/ℓ）

HARDNESS（Vickers）

TYPE OFBATH（pH）

PROCESS

CONNECTOR

SEMICONDUCTORWAFER

LEAD FRAME

ELECTRONICCOMPONENTS

DECORATION


APPLICATIONSBATH



CURRENTDENSITY

（A/dm2）



CONTENT（g/ℓ）


TYPE OFBATH（pH）

PROCESS

CONNECTOR

SEMICONDUCTORWAFER

LEAD FRAME


DECORATION


APPLICATIONSBATH



CURRENTDENSITY

（A/dm2）



CONTENT（g/ℓ）


TYPE OFBATH（pH）

PROCESS

CONNECTOR

SEMICONDUCTORWAFER

LEAD FRAME


DECORATION


APPLICATIONSBATH



CURRENTDENSITY

（A/dm2）



CONTENT（g/ℓ）


TYPE OFBATH（pH）

PROCESS

CONNECTOR

SEMICONDUCTORWAFER

LEAD FRAME


DECORATION

For cyanide-free series strike plating


Direct strike plating on copper wiring

Bright finishes

Bright finishes

Matt finishes

Bright finishes, application for wiring


Semi-bright finishes


Semi-bright finishes, high current density

Good adhesion

Good adhesion

Anti-fungus properties

Anti-fungus properties and good operation

Gold-plating for bonding

Direct gold-plating on copper for bonding

IC frames, LSI and package applications

ELECTROLESS GOLD-PLATING PROCESS

ALLOY PLATING PROCESS

Autocatalytic gold-plating on coppersubstrate

Standard process for immersion gold-plating

Direct gold-plating on copper substrate

Gold-plating for copper or copper type substrate for reduced Ni corrosion

Direct gold-plating on copper substrate, low gold content type

Cyanide-free series immersion gold-plating solution

Cyanide-free series immersion gold-plating solution with low gold content


Cyanide-free series autocatalytic gold-plating solution

Cyanide-free series autocatalytic gold-plating solution with high-speed


Suitable for Ni barrier specifications

Conditions vary in accordance withapplications


Suitable for lead-free connector specifications

Au-Ni Alloy plating solution

For rack and barrel plating


EL-GOLD#20 is a gold-plating solution that can be thick-plated on copper substrate.

ATOMEX is an immersion gold-plating solution for nickel substrate.

ATOMEX-PC is an immersion gold-plating solution used to plate gold on copper substrate.

SUPER MEX series is a cyanide-free autocatalytic gold plating process. Customers can select immersion gold plating processes or thick autocatalytic plating processes.

K-185ST is cobalt type hard gold plating process with high performance. It is used for printed circuit boards, flexible circuit boards and connectors.

K-186SB is a cobalt type hard gold plating solution for selective plating, which can eliminate excess plating related to solution leakage.

FINE BARRIER 7000 is a cobalt type hard gold plating solution for selective plating, which can eliminate excess plating related to solution leakage.

K-186J is cobalt type hard gold plating process with high performance. It is used for printed circuit boards, flexible circuit boards and connectors. (suitable for lead-free soldering)

K-188 offers stable Au/Ni alloy gold plating and is suitable for connectors used for improved heat resistance.

K-77 is acid bright gold plating process, suitable for electronic and industrial components which needs solid adherence and wear resistance.

IMEX 210 is a plating solution that reduces nickel corrosion and has a good adhesion to the substrate.

IMEX-510D is a plating solution, which is used for applying gold plating on copper substrate.

K-76 is an acid bright gold plating solution with superior electrodeposition performance.

K-100 is an acid gold strike plating process, most suitable for decorative parts.

NCF Series, non-cyanide electrolytic gold plating process is a high purity plating process used as pre-treatment process for gold and precious metal plating and strike gold plating applications.

ECF Series, non-cyanide electrolytic gold plating process, is a weak alkali-type, high-purity and cyanide-free plating process. Photo-resist damage is low, enabling fine pattern surface treatment. Customers may choose bright or matt finishes.

K-130 is a gold-plating solution, which exhibits an excellent adhesion and suitable for strike and thin plating for electronics components and decorative parts.


K-130(AF) offers long range operations because it has stronger anti-fungus properties compared to conventional strike plating processes.

K-200WT is low pH type strike gold plating solution which has stable operation, and also has anti-fungus properties.

K-44 is a pure gold-plating for barrel plating for decorative parts, printed circuit boards, etc.

K-700 is a pure gold-plating process with improved thickness uniformity for electrodeposition.

K-720D is a pure gold-plating for direct gold plating on copper substrates, and it prevents copper contamination in the plating solution and improves life of solution.

K-440 is a high speed acid gold-plating process suitable for high-purity and heat resistance deposit and also when jet spot plating machining is required.

FINE BARRIER 7000


PROCESS

4 5

NCF Series

ECF Series

K-130

K-200

K-130(AF)

K-200WT

K-44

K-700

K-720D

K-440

PROCESS

EL-GOLD#20

ATOMEX

ATOMEX-PC

IMEX 210

IMEX-510D

SUPER MEX Series

K-185ST

K-186SB

FINE BARRIER 7000

K-186J

K-188

K-77

K-76

K-100

CYANIDE-FREE GOLD-PLATING PROCESS

CYANIDE GOLD-PLATING PROCESS

STRIKE SOLUTIONPURE GOLD


APPLICATIONSBATH



CURRENTDENSITY

（A/dm2）



CONTENT（g/ℓ）


TYPE OFBATH（pH）

PROCESS

CONNECTOR

SEMICONDUCTORWAFER

LEAD FRAME


DECORATION


APPLICATIONSBATH



CURRENTDENSITY

（A/dm2）



CONTENT（g/ℓ）


TYPE OFBATH（pH）

PROCESS

CONNECTOR

SEMICONDUCTORWAFER

LEAD FRAME


DECORATION


APPLICATIONSBATH



CURRENTDENSITY

（A/dm2）



CONTENT（g/ℓ）


TYPE OFBATH（pH）

PROCESS

CONNECTOR

SEMICONDUCTORWAFER

LEAD FRAME


DECORATION


APPLICATIONSBATH



CURRENTDENSITY

（A/dm2）



CONTENT（g/ℓ）


TYPE OFBATH（pH）

PROCESS

CONNECTOR

SEMICONDUCTORWAFER

LEAD FRAME


DECORATION



Direct strike plating on copper wiring

Bright finishes

Bright finishes

Matt finishes





Semi-bright finishes, high current density

Good adhesion

Good adhesion

Anti-fungus properties

Anti-fungus properties and good operation

Gold-plating for bonding

Direct gold-plating on copper for bonding

IC frames, LSI and package applications

ELECTROLESS GOLD-PLATING PROCESS

ALLOY PLATING PROCESS

Autocatalytic gold-plating on coppersubstrate

Standard process for immersion gold-plating

Direct gold-plating on copper substrate

Gold-plating for copper or copper type substrate for reduced Ni corrosion

Direct gold-plating on copper substrate, low gold content type


Cyanide-free series immersion gold-plating solution with low gold content



Cyanide-free series autocatalytic gold-plating solution with high-speed



Conditions vary in accordance withapplications


Suitable for lead-free connector specifications

Au-Ni Alloy plating solution



EL-GOLD#20 is a gold-plating solution that can be thick-plated on copper substrate.

ATOMEX is an immersion gold-plating solution for nickel substrate.

ATOMEX-PC is an immersion gold-plating solution used to plate gold on copper substrate.

SUPER MEX series is a cyanide-free autocatalytic gold plating process. Customers can select immersion gold plating processes or thick autocatalytic plating processes.

K-185ST is cobalt type hard gold plating process with high performance. It is used for printed circuit boards, flexible circuit boards and connectors.

K-186SB is a cobalt type hard gold plating solution for selective plating, which can eliminate excess plating related to solution leakage.

FINE BARRIER 7000 is a cobalt type hard gold plating solution for selective plating, which can eliminate excess plating related to solution leakage.

K-186J is cobalt type hard gold plating process with high performance. It is used for printed circuit boards, flexible circuit boards and connectors. (suitable for lead-free soldering)

K-188 offers stable Au/Ni alloy gold plating and is suitable for connectors used for improved heat resistance.

K-77 is acid bright gold plating process, suitable for electronic and industrial components which needs solid adherence and wear resistance.

IMEX 210 is a plating solution that reduces nickel corrosion and has a good adhesion to the substrate.

IMEX-510D is a plating solution, which is used for applying gold plating on copper substrate.

K-76 is an acid bright gold plating solution with superior electrodeposition performance.

K-100 is an acid gold strike plating process, most suitable for decorative parts.

NCF Series, non-cyanide electrolytic gold plating process is a high purity plating process used as pre-treatment process for gold and precious metal plating and strike gold plating applications.

ECF Series, non-cyanide electrolytic gold plating process, is a weak alkali-type, high-purity and cyanide-free plating process. Photo-resist damage is low, enabling fine pattern surface treatment. Customers may choose bright or matt finishes.



K-130(AF) offers long range operations because it has stronger anti-fungus properties compared to conventional strike plating processes.

K-200WT is low pH type strike gold plating solution which has stable operation, and also has anti-fungus properties.

K-44 is a pure gold-plating for barrel plating for decorative parts, printed circuit boards, etc.

K-700 is a pure gold-plating process with improved thickness uniformity for electrodeposition.

K-720D is a pure gold-plating for direct gold plating on copper substrates, and it prevents copper contamination in the plating solution and improves life of solution.

K-440 is a high speed acid gold-plating process suitable for high-purity and heat resistance deposit and also when jet spot plating machining is required.

FINE BARRIER 7000


PROCESS

6 7

Silver Bright

N Bright

AG-30

S-900 Series

SP-4000

AG-10

LED BRIGHT AG-20, AG-20

EL-Ag#31

Super Dip, Power Dip

Pre Dip S

After Treatment Agent B

TBO-100

X-10, X-50

Chemistrip XO

Chemistrip NB

PROCESS

Pt-250

Pt-745

PD-LF-100

PD-LF-800

PD-LF-810

PD-LF-820

PD Strike

PALLNIC Series

RH-F

RH-W

RH-FW

RH-221

RH-225M

CYANIDE SILVER-PLATING PROCESS

PALLADIUM-PLATING PROCESS

RHODIUM-PLATING PROCESS

PLATINUM-PLATING PROCESS

PRE-TREATMENT ORAFTER-TREATMENT AGENTS STRIPPER


APPLICATIONSBATH



CURRENTDENSITY

（A/dm2）



CONTENT（g/ℓ）


TYPE OFBATH（pH）

PROCESS

CONNECTOR

SEMICONDUCTORWAFER

LEAD FRAME


DECORATION


APPLICATIONSBATH



CURRENTDENSITY

（A/dm2）



CONTENT（g/ℓ）

HARDNESS（Knoop）

TYPE OFBATH（pH）

PROCESS

CONNECTOR

SEMICONDUCTORWAFER

LEAD FRAME


DECORATION


APPLICATIONSBATH



CURRENTDENSITY

（A/dm2）



CONTENT（g/ℓ）

HARDNESS（Knoop）

TYPE OFBATH（pH）

PROCESS

CONNECTOR

SEMICONDUCTORWAFER

LEAD FRAME


DECORATION


APPLICATIONSBATH



CURRENTDENSITY

（A/dm2）



CONTENT（g/ℓ）


TYPE OFBATH（pH）

PROCESS

CONNECTOR

SEMICONDUCTORWAFER

LEAD FRAME


DECORATION

Bright and hard silver plating solution (additive agent only)


Bright and soft application (additive agent only)

Low cyanide high-speed silver plating solution for lead frame

Low cyanide high-speed silver platingsolution for lead frame




Bright silver plating solution (additive agent only)

Autocatalytic thick silver plating solution

Powder

Powder

Powder

Powder

Immersion time

Immersion time

Liquid

Liquid

Liquid

Liquid

Liquid

Liquid

Anti-immersion agent for silver plated lead frame



Anti-tarnish agent for copper and copper alloy substrate

Chemicals for preventingepoxy bleed out (EBO)

Chemicals for preventing epoxy bleed out (EBO)

Silver stripperfor lead frame


Stripping agentfor selectivegold plating

Stripping agentfor copperstrike plating

For sulfuric acid type

For phosphoric acid type

For sulfuric acid type for decorative

For sulfuric acid type for industrial

For low stress thick plating

For Pd-PPF

For Pd-PPF

For thin plating Pd-PPF


Pd strike solution

Pd/Ni alloy plating solution (Ni:10g/L)



High speed jet-type (Ni:10g/L)

Weak acidic strike plating

Alkaline thick plating

Pt-250 is weak acidic platinum plating process, suitable for thin plating electronic components which require heat and corrosion resistance.

PD-LF-800 is a high-purity palladium plating solution and the plating has stable solderability.

PD-LF-810 is a thin-plating with good solderability, and suitable for Pd-PPF.


Pd strike solution. Can be adjusted according to requirements.

RH-W is dense and hard plating with bright white deposit.

RH-FW is a sulfuric acid rhodium plating solution with white bright deposit.

Pt-745 is a platinum plating process suitable for electronic components, electric contact parts, electrode, and arts and crafts.

PD-LF-100 is a high purity palladium plating process with neutral and weak alkaline.

PALLNIC Series is an alloy plating process made from palladium and nickel, most suitable for products such as printed circuit boards, terminals and connectors.

RH-F is a sulfuric acid type rhodium plating solution. Its electrodeposits are elaborate and have whitish brightness, most suitable for thin plating of decorative parts.

RH-221 is an acidic plating process suitable for electronic components with excellent physical performance.

RH-225M is a sulfuric acid rhodium plating process. It has low stress deposit for various electric contact parts.

Used for lead switches because it gives mirror-bright appearance and hard deposit.

N Bright achieves bright deposit. Three times harder than normal silver plating. These characteristics make it suitable for electric contact parts requiring wear resistance.

A weak alkaline type high speed plating process and widely used as selective silver plating process for lead frame.

SP-4000 is widely used as a spot silver plating solution for lead frame and can be used with a wider current density range and maintaining stable operation.

AG-30 is a silver plating additive agent for soft deposit by rack plating.

AG-10 is suitable for lead switches; it gives mirror-bright appearance and hard deposit.

LED BRIGHT AG-20, AG-20 is a silver plating additive agent with semi-bright to mirror-bright deposit for LED applications.

This alkaline autocatalytic silver plating process is suitable for electronic components.

Super Dip and Power Dip are anti-immersion agents to prevent immersion of silver onto copper lead frame for silver plating.

Pre Dip S is a post-treatment agent for effectively preventing discoloration of copper lead frame after silver plating.

After treatment agent B effectively prevents epoxy bleed out of silver paste.

TBO-100 is an after-treatment agent for effectively preventing epoxy bleed out of silver paste.

X-10 and X-50 are electrolytic strippers for selective silver plating on copper lead frame.

Chemistrip XO is a chemical stripper, which can avoid damage to selective silver strike plating deposits on iron, nickel substrate and iron-nickel alloy substrates.

Chemistrip NB is a gold chemical stripper for effectively removing parts of gold plating for selective gold plating connector.

CHARACTERISTICSBATH

TEMPER-ATURE（℃）

CONTENT PRO-PERTY

TREAT-MENTTIME

（sec）PROCESS

APPLI-CATIONSLEAD FRAME

APPLICATIONS

CHARACTER-ISTICS

BATHTEMPERATURE（℃）

ADDITIONDENSITY

SITUA-TION

CURRENTDENSITY

（A/dm2）PROCESS STRIPPING RATE

（sec/μm）

TYPE OFBATH（pH）

LEAD FRAME

CONNECTOR

LED BRIGHT AG-20 Bright and hard silver plating solution for LED (additive agent only)


PROCESS

6 7

Silver Bright

N Bright

AG-30

S-900 Series

SP-4000

AG-10

LED BRIGHT AG-20, AG-20

EL-Ag#31

Super Dip, Power Dip

Pre Dip S

After Treatment Agent B

TBO-100

X-10, X-50

Chemistrip XO

Chemistrip NB

PROCESS

Pt-250

Pt-745

PD-LF-100

PD-LF-800

PD-LF-810

PD-LF-820

PD Strike

PALLNIC Series

RH-F

RH-W

RH-FW

RH-221

RH-225M

CYANIDE SILVER-PLATING PROCESS

PALLADIUM-PLATING PROCESS

RHODIUM-PLATING PROCESS

PLATINUM-PLATING PROCESS

PRE-TREATMENT ORAFTER-TREATMENT AGENTS STRIPPER


APPLICATIONSBATH



CURRENTDENSITY

（A/dm2）



CONTENT（g/ℓ）


TYPE OFBATH（pH）

PROCESS

CONNECTOR

SEMICONDUCTORWAFER

LEAD FRAME


DECORATION


APPLICATIONSBATH



CURRENTDENSITY

（A/dm2）



CONTENT（g/ℓ）

HARDNESS（Knoop）

TYPE OFBATH（pH）

PROCESS

CONNECTOR

SEMICONDUCTORWAFER

LEAD FRAME


DECORATION


APPLICATIONSBATH



CURRENTDENSITY

（A/dm2）



CONTENT（g/ℓ）

HARDNESS（Knoop）

TYPE OFBATH（pH）

PROCESS

CONNECTOR

SEMICONDUCTORWAFER

LEAD FRAME


DECORATION


APPLICATIONSBATH



CURRENTDENSITY

（A/dm2）



CONTENT（g/ℓ）


TYPE OFBATH（pH）

PROCESS

CONNECTOR

SEMICONDUCTORWAFER

LEAD FRAME


DECORATION



Bright and soft application (additive agent only)

Low cyanide high-speed silver plating solution for lead frame





Bright silver plating solution (additive agent only)

Autocatalytic thick silver plating solution

Powder

Powder

Powder

Powder

Immersion time

Immersion time

Liquid

Liquid

Liquid

Liquid

Liquid

Liquid




Anti-tarnish agent for copper and copper alloy substrate

Chemicals for preventingepoxy bleed out (EBO)

Chemicals for preventing epoxy bleed out (EBO)



Stripping agentfor selectivegold plating

Stripping agentfor copperstrike plating

For sulfuric acid type

For phosphoric acid type

For sulfuric acid type for decorative

For sulfuric acid type for industrial

For low stress thick plating

For Pd-PPF

For Pd-PPF



Pd strike solution




High speed jet-type (Ni:10g/L)

Weak acidic strike plating

Alkaline thick plating

Pt-250 is weak acidic platinum plating process, suitable for thin plating electronic components which require heat and corrosion resistance.

PD-LF-800 is a high-purity palladium plating solution and the plating has stable solderability.



Pd strike solution. Can be adjusted according to requirements.

RH-W is dense and hard plating with bright white deposit.

RH-FW is a sulfuric acid rhodium plating solution with white bright deposit.

Pt-745 is a platinum plating process suitable for electronic components, electric contact parts, electrode, and arts and crafts.

PD-LF-100 is a high purity palladium plating process with neutral and weak alkaline.

PALLNIC Series is an alloy plating process made from palladium and nickel, most suitable for products such as printed circuit boards, terminals and connectors.

RH-F is a sulfuric acid type rhodium plating solution. Its electrodeposits are elaborate and have whitish brightness, most suitable for thin plating of decorative parts.

RH-221 is an acidic plating process suitable for electronic components with excellent physical performance.

RH-225M is a sulfuric acid rhodium plating process. It has low stress deposit for various electric contact parts.

Used for lead switches because it gives mirror-bright appearance and hard deposit.

N Bright achieves bright deposit. Three times harder than normal silver plating. These characteristics make it suitable for electric contact parts requiring wear resistance.

A weak alkaline type high speed plating process and widely used as selective silver plating process for lead frame.

SP-4000 is widely used as a spot silver plating solution for lead frame and can be used with a wider current density range and maintaining stable operation.

AG-30 is a silver plating additive agent for soft deposit by rack plating.

AG-10 is suitable for lead switches; it gives mirror-bright appearance and hard deposit.

LED BRIGHT AG-20, AG-20 is a silver plating additive agent with semi-bright to mirror-bright deposit for LED applications.

This alkaline autocatalytic silver plating process is suitable for electronic components.

Super Dip and Power Dip are anti-immersion agents to prevent immersion of silver onto copper lead frame for silver plating.

Pre Dip S is a post-treatment agent for effectively preventing discoloration of copper lead frame after silver plating.

After treatment agent B effectively prevents epoxy bleed out of silver paste.

TBO-100 is an after-treatment agent for effectively preventing epoxy bleed out of silver paste.

X-10 and X-50 are electrolytic strippers for selective silver plating on copper lead frame.

Chemistrip XO is a chemical stripper, which can avoid damage to selective silver strike plating deposits on iron, nickel substrate and iron-nickel alloy substrates.

Chemistrip NB is a gold chemical stripper for effectively removing parts of gold plating for selective gold plating connector.

CHARACTERISTICSBATH

TEMPER-ATURE（℃）

CONTENT PRO-PERTY

TREAT-MENTTIME

（sec）PROCESS

APPLI-CATIONSLEAD FRAME

APPLICATIONS

CHARACTER-ISTICS

BATHTEMPERATURE（℃）

ADDITIONDENSITY

SITUA-TION

CURRENTDENSITY

（A/dm2）PROCESS STRIPPING RATE

（sec/μm）

TYPE OFBATH（pH）

LEAD FRAME

CONNECTOR

LED BRIGHT AG-20 Bright and hard silver plating solution for LED (additive agent only)


PROCESS

8

EQUIPMENT

9

RU-33

Black RU-LB

Yamabuki Series

Light Gold

K-100

K-76

K-81

K-84

K-130

K-200

N-205

(ELECTROLYTIC) GOLD-PLATING PROCESS FOR DECORATIVE PARTS

RUTHENIUM-PLATING PROCESSPCB, FPCCHARACTERISTICS

APPLICATIONSBATH



CURRENTDENSITY

（A/dm2）



CONTENT（g/ℓ）


TYPE OFBATH（pH）

PROCESS

CONNECTOR

SEMICONDUCTORWAFER

LEAD FRAME


DECORATION


APPLICATIONSBATH



CURRENTDENSITY

（A/dm2）



CONTENT（g/ℓ）


TYPE OFBATH（pH）

PROCESS

CONNECTOR

SEMICONDUCTORWAFER

LEAD FRAME


DECORATION

True gold color strike type, decorative

Green gold color strike type, decorative

Reddish gold color strike, decorative

Whitish gold color strike, decorative

Hamilton gold color strike, decorative

True gold color strike, decorative

Au or Co series

Hamilton gold color thick plating type

Light yellow gold color, decorative

Acidic pure gold

Acidic pure gold

Gold plating directly for stainless steel

For switch contact

Black type for decorative plating

Gold plating solution for thin plating decoration, 18K, 20K, 23K and 24K versions are available.

K-100 is an acidic gold strike plating process, most suitable for decorative parts.

K-76 is an acidic bright gold plating solution.

A bright gold thin-plating solution.

K-81 is an alkaline plating process, suitable for various areas such as high performance decorative parts, precision products and electronic and industrial components.

K-84 is a thick type decorative acid alloy plating process, suitable for products such as watch cases and watch bands.

K-130 is a gold plating solution that offers stable deposit adhesion.

K-200 is an acidic gold strike plating process. Bath control is easy and it is best for various areas from electronic and industrial components to high performance decorative parts.

N-205 can be directly used for gold plating on stainless steel, most suitable for decorative parts.

RU-33 is an acid high-purity ruthenium plating solution. Most suitable for electric contact parts and wear resistant components with excellent physical performance.

Black RU-LB is a ruthenium plating solution for black decoration.

MITOMO SEMICONENGINEERING CO.REEL TO REEL PLATING MACHINE

Mitomo Semicon Engineering Co. offers its own product lines, which are designed and produced in accordance to meet demands for high-mix, low-volume production. Our concept is to produce moduled equipment which is "easy to use", "easy to change production" and "easy to maintain". We offer tailor made products for each customer.

CONNECTOR PLATING MACHINE CARRIER TYPE PLATING MACHINE WASHER

PLATING MACHINE FOR LEAD FRAMES

CONNECTOR Ni-AuSOLDERING PLATINGMACHINE

CONNECTOR Ni-AuSOLDERING PLATINGMACHINE (U-TURN)

CARRIER TYPE ELECTROLESSCOPPER PLATING MACHINE WASHER FOR LEAD FRAMES

SILVER SPOT PLATINGMACHINE FOR LEAD FRAMES

SILVER SPOT PLATINGMACHINE FOR LEAD FRAMES(4 STRANDS)

SILVER SPOT PLATINGMACHINE FOR CUT-STRIPLEAD FRAMES

PALLADIUM PLATINGMACHINE FOR LEAD FRAMES

There is no pin damage by using special positioning structures not using "pilot pin". Using positioning structures by graphic processing realizes high-accuracy plating, and the plating accuracy is improved by using a laser-processed mask.※Machine specifications are determined according to customers requirements.

A spot plating machine with 2 x 2 strands for manufacturing of a wide variety of products in small quantities. Two strands of one side of the machine improve the maintenance performance.※Machine specifications are determined according to customers requirements.

Using a servomotor allows for smooth operations. The machine is equipped with a special plating jig, which can be changed easily, and which doesn’t require adjustment. Easy handling by touch panel.※Machine specifications are determined according to customers requirements.

The special structure improves the thickness uniformity of plating. A large capacity of power dispatching is possible because of the in-water structure. Easy maintenance by compact design.※Machine specifications are determined according to customers requirements.

Improved loading and unloading operation by easy switching of the reel. The control BOX is equipped, so you can operate the machine by monitoring the control panel. Almost all connector types can be partially plated by using a variety of partial plating cells.※Machine specifications are determined according to customers requirements.

By using a U-turn system space-saving can be achieved. Improved loading and unloading operation by easy switching of the reel. Almost all connector types can be partially plated by using a variety of partial plating cells.※Machine specifications are determined according to customers requirements.

Using an AC servomotor allows for smooth operations together with increased produc-tivity by using multiple carriers.※Machine specifications are determined according to customers requirements.

The washer for lead frames is equipped with four-line simultaneous loading and independent unloading for each line. For manufacturing of a wide variety of products in small quantities, and easy maintenance by compact design.※Machine specifications are determined according to customers requirements.


PROCESS

8

EQUIPMENT

9

RU-33

Black RU-LB

Yamabuki Series

Light Gold

K-100

K-76

K-81

K-84

K-130

K-200

N-205

(ELECTROLYTIC) GOLD-PLATING PROCESS FOR DECORATIVE PARTS

RUTHENIUM-PLATING PROCESS


APPLICATIONSBATH



CURRENTDENSITY

（A/dm2）



CONTENT（g/ℓ）


TYPE OFBATH（pH）

PROCESS

CONNECTOR

SEMICONDUCTORWAFER

LEAD FRAME


DECORATION


APPLICATIONSBATH



CURRENTDENSITY

（A/dm2）



CONTENT（g/ℓ）


TYPE OFBATH（pH）

PROCESS

CONNECTOR

SEMICONDUCTORWAFER

LEAD FRAME


DECORATION

True gold color strike type, decorative

Green gold color strike type, decorative

Reddish gold color strike, decorative

Whitish gold color strike, decorative

Hamilton gold color strike, decorative

True gold color strike, decorative

Au or Co series

Hamilton gold color thick plating type

Light yellow gold color, decorative

Acidic pure gold

Acidic pure gold

Gold plating directly for stainless steel

For switch contact

Black type for decorative plating

Gold plating solution for thin plating decoration, 18K, 20K, 23K and 24K versions are available.

K-100 is an acidic gold strike plating process, most suitable for decorative parts.

K-76 is an acidic bright gold plating solution.

A bright gold thin-plating solution.

K-81 is an alkaline plating process, suitable for various areas such as high performance decorative parts, precision products and electronic and industrial components.

K-84 is a thick type decorative acid alloy plating process, suitable for products such as watch cases and watch bands.

K-130 is a gold plating solution that offers stable deposit adhesion.

K-200 is an acidic gold strike plating process. Bath control is easy and it is best for various areas from electronic and industrial components to high performance decorative parts.

N-205 can be directly used for gold plating on stainless steel, most suitable for decorative parts.

RU-33 is an acid high-purity ruthenium plating solution. Most suitable for electric contact parts and wear resistant components with excellent physical performance.

Black RU-LB is a ruthenium plating solution for black decoration.

MITOMO SEMICONENGINEERING CO.REEL TO REEL PLATING MACHINE

Mitomo Semicon Engineering Co. offers its own product lines, which are designed and produced in accordance to meet demands for high-mix, low-volume production. Our concept is to produce moduled equipment which is "easy to use", "easy to change production" and "easy to maintain". We offer tailor made products for each customer.

CONNECTOR PLATING MACHINE CARRIER TYPE PLATING MACHINE WASHER

PLATING MACHINE FOR LEAD FRAMES

CONNECTOR Ni-AuSOLDERING PLATINGMACHINE

CONNECTOR Ni-AuSOLDERING PLATINGMACHINE (U-TURN)

CARRIER TYPE ELECTROLESSCOPPER PLATING MACHINE WASHER FOR LEAD FRAMES

SILVER SPOT PLATINGMACHINE FOR LEAD FRAMES

SILVER SPOT PLATINGMACHINE FOR LEAD FRAMES(4 STRANDS)

SILVER SPOT PLATINGMACHINE FOR CUT-STRIPLEAD FRAMES

PALLADIUM PLATINGMACHINE FOR LEAD FRAMES

There is no pin damage by using special positioning structures not using "pilot pin". Using positioning structures by graphic processing realizes high-accuracy plating, and the plating accuracy is improved by using a laser-processed mask.※Machine specifications are determined according to customers requirements.

A spot plating machine with 2 x 2 strands for manufacturing of a wide variety of products in small quantities. Two strands of one side of the machine improve the maintenance performance.※Machine specifications are determined according to customers requirements.

Using a servomotor allows for smooth operations. The machine is equipped with a special plating jig, which can be changed easily, and which doesn’t require adjustment. Easy handling by touch panel.※Machine specifications are determined according to customers requirements.

The special structure improves the thickness uniformity of plating. A large capacity of power dispatching is possible because of the in-water structure. Easy maintenance by compact design.※Machine specifications are determined according to customers requirements.

Improved loading and unloading operation by easy switching of the reel. The control BOX is equipped, so you can operate the machine by monitoring the control panel. Almost all connector types can be partially plated by using a variety of partial plating cells.※Machine specifications are determined according to customers requirements.

By using a U-turn system space-saving can be achieved. Improved loading and unloading operation by easy switching of the reel. Almost all connector types can be partially plated by using a variety of partial plating cells.※Machine specifications are determined according to customers requirements.

Using an AC servomotor allows for smooth operations together with increased produc-tivity by using multiple carriers.※Machine specifications are determined according to customers requirements.

The washer for lead frames is equipped with four-line simultaneous loading and independent unloading for each line. For manufacturing of a wide variety of products in small quantities, and easy maintenance by compact design.※Machine specifications are determined according to customers requirements.


EQUIPMENT

10 11

SERVICE

MITOMO SEMICONENGINEERING CO.PLATING MACHINE FOR SEMICONDUCTOR-WAFERS

Mitomo Semicon Engineering Co. is a world pioneer in plating machine for semiconductor-wafers. We have sold more than 100 units to the worldwide market. Adding not only jet-type plating machine but also dip- type plating machine to our product line, we offer plating machines meeting customers' requirements.

ELECTROPLATING MACHINE ANALYSIS AND PROTOTYPING FOR PLATING

ELECTROPLATING MACHINE ELECTROLESS PLATING MACHINE ETCHING MACHINE OTHER PLATING MACHINES

RACK TYPE SEMIAUTOMATICCOMPLEX PLATING MACHINE

ELECTROLESS AUTOMATICPLATING MACHINE

ETCHING MACHINE FORGOLD BUMP(MANUAL TYPE / AUTO TYPE)

OTHER PLATING MACHINESFOR SUCH AS300 MM WAFER

PLATING MACHINE FORGALLIUM ARSENIC

AU 14CUP-TYPEPLATING MACHINE

CU 14CUP-TYPEPLATING MACHINE

IN-DRAFT TYPEONE CUP-TYPEPLATING MACHINE

Machine for consistent plating of copper, nickel, solder, etc. Using a rack type machine achieves operations under greater diversity of conditions. Variety of plating solutions can be used, because each processing tank can be customized. The motions of pretreatment, rinsing, plating, rinsing, plating, etc. can be done automatically. Most advanced machine for complex plating.

Machine for electroless nickel and immersion gold plating. Automatic processing from the electroless nickel to the immersion gold by one carrier batch. Automatic processing by setting each processing tank for complex pre-treatment of the electroless plating process.

Etching machine for gold plating with a set of carriers. Efficient etching process. Compact and user-friendly design. Etching machine for copper plating is also available.

We produce other plating machines for 300 mm wafer. Any type of machines are available for custom-made including both rack type and cup type. We can produce plating machines to respond to all types of materials, shapes (round or angle) and sizes, etc.

Machine for plating of 6-inch gallium-arsenic wafers. Technology to prevent damaging very brittle gallium arsenic wafers is featured. The picture above shows a machine with 4 cups, and up to 27 cups are available.

Standard machine used for gold plating from the top of 8-inch silicon wafers. Excellent maintenance performance and low running cost. All machine parts are our company's product from the power supply to the operation software, as well as the body. The international standard machine with easy conversion into plating of 6-inch silicon wafers.

Machine for wiring from the top of 8-inch wafers and copper plating. Includes pre-treatment machine as standard equipment, and user-friendly. Face-down type machines achieve excellent operation and maintenance performance with little loss of plating solu-tion, and low running cost. Easy conversion into plating of 6-inch silicon wafer.

Multipurpose wafer plating machine for one wafer processing. A variety of specifications are available by custom-made. Responds to machines for from 2-inch to 8-inch silicon wafers and includes QDR washing tank, static tank, vacuum tweezers, and hand shower as standard equipments. Same structure as our mass production machines, so plating conditions and other technologies in this machine can be applied to mass production machines. Only small amount of solution to be used.

As a part of technical service for customers, we have established a service system for sample plating, analysis service and material characteristics analysis service.

TESTING AND EVALUATION SERVICE ANALYSIS SERVICE CHARACTERIZATION ANDANALYSIS SERVICE

We offer sample plating service for initial evaluation necessary for customers to carry out process evaluation. In addition to sample plating production for wafers, we offer sampling and feedback of sampling of printed circuit boards and connectors.

We maintain our support system to address issues at customer sites making full use of analysis equipment.

We offer analysis services, including chemical composition analysis of plating deposits, elemental analysis and analysis of crystal orientation and crystal structure analysis of very small cross sections.


EQUIPMENT

10 11

SERVICE

MITOMO SEMICONENGINEERING CO.PLATING MACHINE FOR SEMICONDUCTOR-WAFERS

Mitomo Semicon Engineering Co. is a world pioneer in plating machine for semiconductor-wafers. We have sold more than 100 units to the worldwide market. Adding not only jet-type plating machine but also dip- type plating machine to our product line, we offer plating machines meeting customers' requirements.

ELECTROPLATING MACHINE ANALYSIS AND PROTOTYPING FOR PLATING

ELECTROPLATING MACHINE ELECTROLESS PLATING MACHINE ETCHING MACHINE OTHER PLATING MACHINES

RACK TYPE SEMIAUTOMATICCOMPLEX PLATING MACHINE

ELECTROLESS AUTOMATICPLATING MACHINE

ETCHING MACHINE FORGOLD BUMP(MANUAL TYPE / AUTO TYPE)

OTHER PLATING MACHINESFOR SUCH AS300 MM WAFER

PLATING MACHINE FORGALLIUM ARSENIC

AU 14CUP-TYPEPLATING MACHINE

CU 14CUP-TYPEPLATING MACHINE

IN-DRAFT TYPEONE CUP-TYPEPLATING MACHINE

Machine for consistent plating of copper, nickel, solder, etc. Using a rack type machine achieves operations under greater diversity of conditions. Variety of plating solutions can be used, because each processing tank can be customized. The motions of pretreatment, rinsing, plating, rinsing, plating, etc. can be done automatically. Most advanced machine for complex plating.

Machine for electroless nickel and immersion gold plating. Automatic processing from the electroless nickel to the immersion gold by one carrier batch. Automatic processing by setting each processing tank for complex pre-treatment of the electroless plating process.

Etching machine for gold plating with a set of carriers. Efficient etching process. Compact and user-friendly design. Etching machine for copper plating is also available.

We produce other plating machines for 300 mm wafer. Any type of machines are available for custom-made including both rack type and cup type. We can produce plating machines to respond to all types of materials, shapes (round or angle) and sizes, etc.

Machine for plating of 6-inch gallium-arsenic wafers. Technology to prevent damaging very brittle gallium arsenic wafers is featured. The picture above shows a machine with 4 cups, and up to 27 cups are available.

Standard machine used for gold plating from the top of 8-inch silicon wafers. Excellent maintenance performance and low running cost. All machine parts are our company's product from the power supply to the operation software, as well as the body. The international standard machine with easy conversion into plating of 6-inch silicon wafers.

Machine for wiring from the top of 8-inch wafers and copper plating. Includes pre-treatment machine as standard equipment, and user-friendly. Face-down type machines achieve excellent operation and maintenance performance with little loss of plating solu-tion, and low running cost. Easy conversion into plating of 6-inch silicon wafer.

Multipurpose wafer plating machine for one wafer processing. A variety of specifications are available by custom-made. Responds to machines for from 2-inch to 8-inch silicon wafers and includes QDR washing tank, static tank, vacuum tweezers, and hand shower as standard equipments. Same structure as our mass production machines, so plating conditions and other technologies in this machine can be applied to mass production machines. Only small amount of solution to be used.

As a part of technical service for customers, we have established a service system for sample plating, analysis service and material characteristics analysis service.

TESTING AND EVALUATION SERVICE ANALYSIS SERVICE CHARACTERIZATION ANDANALYSIS SERVICE

We offer sample plating service for initial evaluation necessary for customers to carry out process evaluation. In addition to sample plating production for wafers, we offer sampling and feedback of sampling of printed circuit boards and connectors.

We maintain our support system to address issues at customer sites making full use of analysis equipment.

We offer analysis services, including chemical composition analysis of plating deposits, elemental analysis and analysis of crystal orientation and crystal structure analysis of very small cross sections.


OUTLINE

13


April 1, 2011

310,000,000yen

Kenji Kasuga

【Head Office】Shinagawa East One Tower 9F2-16-1, Kohnan, Minato-ku, Tokyo 108-0075[Switchboard] TEL：81-3-6863 -3385 FAX：81-3-6863-3565[Sales Dept.] TEL：81-3-6863 -3386 FAX：81-3-6863-3387

【Numazu Plant】678 Ipponmatsu, Numazu-City,Shizuoka 410-0314[Switchboard] TEL：81-55-967-9641 FAX：81-55-968-0986[ R & D ] TEL：81-55-966-1271 FAX：81-55-966- 6192

（1）Manufacturing, processing, and selling of all salts and all solutions that related to plating

（2）Manufacturing, processing, and selling of Industrial paste（3）Collect precious metals by refining the material that contains

precious metals（4）Design, manufacturing and selling of plating processing equipment,

transportation equipment and other mechanical devices（5）Design, manufacturing and selling of instruments and metallic mold

used to equipment described in the preceding (4)（6）Maintenance, repair, remodeling and installation of mechanical

devices and instruments（7）All the related businesses that relates directly or indirectly to the

aboveNote: The above items include the business activities of our subsidiaries.

Mitomo Semicon Engineering Co, Ltd.Metalor Coatings (Singapore)Pte Ltd.Metalor Coatings (Taiwan)Corp.Metalor Coatings(Shanghai)Co, Ltd.Metalor Coatings (Korea)Corp.

［Company Name］［Foundation］［Capital］［President & Representative Director］［Address］

［Purpose of business］

［Subsidiary］

ORGANIZATIONAL STRUCTURE

C o m p a n y O v e r v i e w

AdvancedCoatingsDivision

Electrotechnics

Division

Refining

Division

OUTLINE


HISTORY

GLOBAL NETWORK


MitomoSemicon

EngineeringCo, Ltd.

MetalorCoatings

(Singapore)Pte Ltd.

MetalorCoatings(Taiwan)

Corp.

MetalorCoatings

(Shanghai)Co, Ltd.

MetalorCoatings(Korea)Corp.


OUTLINE

13


April 1, 2011

310,000,000yen

Kenji Kasuga

【Head Office】Shinagawa East One Tower 9F2-16-1, Kohnan, Minato-ku, Tokyo 108-0075[Switchboard] TEL：81-3-6863 -3385 FAX：81-3-6863-3565[Sales Dept.] TEL：81-3-6863 -3386 FAX：81-3-6863-3387

【Numazu Plant】678 Ipponmatsu, Numazu-City,Shizuoka 410-0314[Switchboard] TEL：81-55-967-9641 FAX：81-55-968-0986[ R & D ] TEL：81-55-966-1271 FAX：81-55-966- 6192

（1）Manufacturing, processing, and selling of all salts and all solutions that related to plating

（2）Manufacturing, processing, and selling of Industrial paste（3）Collect precious metals by refining the material that contains

precious metals（4）Design, manufacturing and selling of plating processing equipment,

transportation equipment and other mechanical devices（5）Design, manufacturing and selling of instruments and metallic mold

used to equipment described in the preceding (4)（6）Maintenance, repair, remodeling and installation of mechanical

devices and instruments（7）All the related businesses that relates directly or indirectly to the

aboveNote: The above items include the business activities of our subsidiaries.

Mitomo Semicon Engineering Co, Ltd.Metalor Coatings (Singapore)Pte Ltd.Metalor Coatings (Taiwan)Corp.Metalor Coatings(Shanghai)Co, Ltd.Metalor Coatings (Korea)Corp.

［Company Name］［Foundation］［Capital］［President & Representative Director］［Address］

［Purpose of business］

［Subsidiary］


C o m p a n y O v e r v i e w

AdvancedCoatingsDivision

Electrotechnics

Division

Refining

Division

OUTLINE


HISTORY

GLOBAL NETWORK


MitomoSemicon

EngineeringCo, Ltd.

MetalorCoatings

(Singapore)Pte Ltd.

MetalorCoatings(Taiwan)

Corp.

MetalorCoatings

(Shanghai)Co, Ltd.

MetalorCoatings(Korea)Corp.


GLOBAL NETWORK

14 15

HISTORY

Foundation of a « Preliminary Rolling Factory » at Le Locle by Martin de Pury & Cie

Take over of the factory by the Banque du Locle

Take over of the Banque du Locle by the Swiss Bank Corporation (SBC)

Foundation of Métaux Précieux SA Metalor, SBC’s subsidiary

Majority ownership taken over by private investors

Acquisition of Microfil SA

Introduction of the new company name Metalor Technologies

Acquisition of Englehard-CLAL chemicals business

Sale of the Medical Division

Spin-off of Dental Division

Purchase of JM Hong Kong gold and silver refining assets

Majority ownership taken over by Astorg Partners a French private equity firm

Acquisition of AMI Doduco’s activities in the Americas

Closure of Watches and Jewelry Division

Acquisition of NECC’s coating activities in Japan

Foundation of Metalor Technologies(Japan)Corp.

1852

1864

1918

1936

1998

1999

2 001

2002

2003

2005

2007

2009

2010

2 011

Metalor Electrotechnics

USA Corp.

MetalorTechnologies

SA

Metalor Finance SA

Metalor Techn. Operations (Mexico)

S.A. de C.V.

MetalorTechnologies

USA Corp.

MetalorElectrotechnics

(Puerto Rico), LLC

MetalorTechnologies(Iberica) SA

MetalorTechnologies(Sweden) AB

MetalorTechnologiesFrance S.A.S.

MetalorTechnologies(Italy) S.R.L.

MetalorTechnologies(Suzhou) Ltd.

MetalorTechnologies (Japan) Corp.

MitomoSemicon

EngineeringCo, Ltd.

MetalorTechnologies

(Hong Kong) Ltd.

MetalorTechnologies(Singapore)

Pte Ltd.

MetalorTechnologies

(UK) Ltd.

Metalor Technologies International SA

Metalor USA Refining Corp. Peru Branch

Netherlands Branch Thailand Branch Taiwan Branch

Metalor Techn. Services (Mexico)

S.A. de C.V.

Metalor Coatings(Singapore)

Pte Ltd.

Metalor Coatings(Taiwan) Corp.

Metalor Coatings(Shanghai)

Co, Ltd.

Metalor Coatings(Korea) Corp.


GLOBAL NETWORK

14 15

HISTORY

Foundation of a « Preliminary Rolling Factory » at Le Locle by Martin de Pury & Cie

Take over of the factory by the Banque du Locle

Take over of the Banque du Locle by the Swiss Bank Corporation (SBC)

Foundation of Métaux Précieux SA Metalor, SBC’s subsidiary

Majority ownership taken over by private investors

Acquisition of Microfil SA

Introduction of the new company name Metalor Technologies

Acquisition of Englehard-CLAL chemicals business

Sale of the Medical Division

Spin-off of Dental Division

Purchase of JM Hong Kong gold and silver refining assets

Majority ownership taken over by Astorg Partners a French private equity firm

Acquisition of AMI Doduco’s activities in the Americas

Closure of Watches and Jewelry Division

Acquisition of NECC’s coating activities in Japan

Foundation of Metalor Technologies(Japan)Corp.

1852

1864

1918

1936

1998

1999

2 001

2002

2003

2005

2007

2009

2010

2 011

Metalor Electrotechnics

USA Corp.

MetalorTechnologies

SA

Metalor Finance SA

Metalor Techn. Operations (Mexico)

S.A. de C.V.

MetalorTechnologies

USA Corp.

MetalorElectrotechnics

(Puerto Rico), LLC

MetalorTechnologies(Iberica) SA

MetalorTechnologies(Sweden) AB

MetalorTechnologiesFrance S.A.S.

MetalorTechnologies(Italy) S.R.L.

MetalorTechnologies(Suzhou) Ltd.

MetalorTechnologies (Japan) Corp.

MitomoSemicon

EngineeringCo, Ltd.

MetalorTechnologies

(Hong Kong) Ltd.

MetalorTechnologies(Singapore)

Pte Ltd.

MetalorTechnologies

(UK) Ltd.

Metalor Technologies International SA

Metalor USA Refining Corp. Peru Branch

Netherlands Branch Thailand Branch Taiwan Branch

Metalor Techn. Services (Mexico)

S.A. de C.V.

Metalor Coatings(Singapore)

Pte Ltd.

Metalor Coatings(Taiwan) Corp.

Metalor Coatings(Shanghai)

Co, Ltd.

Metalor Coatings(Korea) Corp.



Documents

Metalor Technologies Japan · PDF fileIMEX 210 is a plating solution that reduces nickel corrosion and has a good adhesion to the substrate. IMEX-510D is a plating solution, which