Message froM the ChairMan & Ceothor.inemi.org/webdownload/annual_report/2007_AR.pdf · 2 iNEMI 2007 Annual Report Message froM the ChairMan & Ceo 2007 was a year of significant turmoil

2 iNEMI 2007 Annual Report

Message froM the ChairMan & Ceo ■

2007 was a year of significant turmoil as energy prices, currency fluctuations, and credit tightening threatened to slow the global economy. In spite of these challenges, the economy and our industry maintained reasonable growth over the year. Prismark projects semiconductor revenues of $258 billion for 2007, which represents an increase of 3.8 % over 2006, and this growth would help propel the worldwide sales of electronics hardware to $1.25 trillion this year. Electronic solutions are enabling significant societal change in areas such as communication, medicine, and security. These products and services are more ubiquitous than ever before, and we find them integrated into virtually everything around us (banking, shopping, clothing, household appliances, exercise equipment, furniture, etc.). As this occurs, the expectations of product reliability and up time are increasing at the same time that price performance is improving.

Migration of manufacturing continues its march to Asia, Eastern Europe, and beyond. A recent IPC-sponsored report from BPA discusses the prospects of Africa as a major potential market and a location of electronics manufacturing. There is increasing support to find ways to encourage innovation as the only logical competitive response to globalization, free trade, and commoditization. However, significant challenges exist for orchestrating innovation in today’s widely distributed technology centers of expertise.

While we have had active collaborations in Asia and Europe for several years, we took a major step forward in 2007 by opening offices in both these regions in order to complement and strengthen our existing industry efforts. We welcome Haley Fu and Grace O’Malley to the staff of iNEMI. For the second year in a row, we attracted more new members from Asia and Europe than we did from North America.

As we mined the 2007 Roadmap to identify new collaborative efforts, we also emphasized innovation by creating a separate document on the research needs and priorities of our industry. Both the 2007 Technical Plan and the 2007 Research Priorities documents are available to members. In order to focus our limited resources, we are emphasizing three major thrust areas for collaboration: energy and the environment, medical electronics, and miniaturization. Due to the increased complexity that this scope entails, we have strengthened our project/program management processes to ensure that our industry-led efforts are efficient, predictable, and successful. In the past, many of our environmental projects were tactical in nature – responding to emerging regulations and/or market requirements. In 2008 we will be exploring the possibility of creating a major collaborative program on sustainability as our industry embraces the concept of corporate social responsibility.

iNEMI is completely dependent on the support and participation of our members. Our efforts address common needs and challenges, and member companies can gain the greatest value by participating in iNEMI initiatives to fill their specific needs and to develop business opportunities. Your continued participation is crucial to the successes that we collectively enjoy.

Sincerely,

Nasser Grayeli, Ph.D.Chairman, iNEMI Board of DirectorsVice President Technology & Manufacturing, Intel

Jim McElroyCEO & Executive Director iNEMI

Nasser Grayeli

Jim McElroy


spanning the globe ■The past several years have seen continuing migration of high-volume electronics manufacturing to lower cost regions such as China, India, Vietnam, and Eastern Europe. This migration is also driven by the significant market growth opportunities that these emerging markets offer. On the other hand, North America and Europe continue to represent areas of strength for new technology, product, and service creation in segments such as consumer, telecom, medical, automotive, and defense electronics. As a result, leadership companies are continually adjusting their processes to a globally distributed environment and must be assured of strong development and manufacturing supply chains around the world.

Significant progress was made during 2007 on the next phase of iNEMI’s global expansion. This year, we opened an office in Shanghai and added a team member in Europe. Haley Fu, Ph.D., is handling operations in Asia, and Grace O’Malley is representing us in Europe (from her home base in Ireland). Our goal is to globalize iNEMI’s membership, using these regional centers to attract leading electronics companies from the local regions. We are also building formal alliances with regional organizations to further leverage our efforts.

In China, a 12-member steering committee will be facilitating and coordinating all iNEMI technical activities for the region. They have established three technical subcommittees (see organization chart), under which deployment activities will be organized. Our first regional

ZHU Jian, Alcatel Shanghai Bell Co., Ltd., Chair, iNEMI China Steering Committee

Grace O’Malley, Manager of Operations-Europe

Haley Fu, Manager of Operations-Asia

China CollaborationAll member organizations

in China

iNEMI China Steering Committee

Responsible for facilitating and coordinating all iNEMI technical activities in China

iNEMI StaffDr. Haley Fu

Coordinates with the Steering Committee, is responsible for

communications, membership development, technical

facilitation

Manufacturing & Assembly

TechnologiesScott Xiao, Solectron

Component & Substrate

TechnologiesLIU Xinqiang, Intel

Materials Technologies

HOU Weixing, 3M China Ltd.

Technical Subcommittees


The iNEMI China Collaboration group has been actively meeting for three years. The group is shown here at their September 21 meeting held at Huawei in Shenzhen. They are (left to right): Scott Xiao, Solectron; Kelvin Tsang, Jim Kenny, and LI Ya Quan, Cookson Electronics – Enthone; HOU Weixing, 3M; Charlotte Hao, IPC; Jason Cheung and Wallace Wang, Henkel Electronics; Haley Fu, iNEMI; Nelson Cham, Rambo Chemicals (H.K.) Ltd.; Daniel Tan, Celestica; Leesha Peng, IPC; Keith Wong, Rambo Chemicals (H.K.) Ltd.; Simon Lee, Rohm & Haas; Rosaline Yim Wah Kwok, Rambo Chemicals (H.K.) Ltd.; ZHU Jian, Alcatel-Bell; and Sunny Liu, ZHOU Xin, and CAO Xi, Huawei.

Charting future teChnology ■The 2007 iNEMI Roadmap was delivered to our members in December 2006, and released to industry in February 2007. In one of the most successful roll-outs to date, we proactively disseminated information worldwide through a series of activities that lasted throughout much of the year. iNEMI staff and several of the roadmap chairs made more than 15 roadmap presentations on three continents (North America, Europe and Asia). To further broaden our reach, we published 14 articles based on roadmap information, nine of which ran as a regular series in two leading electronics industry publications. This outreach activity significantly increased the value of the iNEMI Roadmap by propogating information throughout the supply chain and building industry consensus on the trends and challenges that must be addressed.

In the first half of 2007, we mined the roadmap to identify significant technology and/or infrastructure gaps. A new, more rigorous process was used this cycle, involving a series of gap analysis meetings with the Technology Integration Groups (TIGs) and significant involvement

deployment project is currently being formed. It is an initiative that will address solder paste deposition issues (see page 12 for additional information).

While we have organized a number of efforts in both Asia and Europe in the past several years, we are confident that the addition of dedicated local resources will help accelerate our regional collaborative results. The initial focus is to expand roadmap participation in both of these regions as well as to develop regional deployment projects and/or involve participants from Europe and Asia in existing projects.


from the iNEMI Technical Committee (TC). The roadmap identified more than 300 gaps and, through the new process, the TC formulated a disposition for each gap. Also as part of the mining process, we published the iNEMI Technical Plan, which prioritizes the gaps that the TIGs will address, and the 2007 Research Priorities, which prioritizes research needs in order to focus limited R&D resources for greatest return (see page 5 for additional discussion).

An excellent example of the iNEMI Roadmap being used as a guideline for funding can be seen in the European Union (EU), where funding to develop a roadmap for printed electronics is contingent on the recipients working with iNEMI and the EU-based Organic Electronics Association (OE-A) to build on the roadmaps already created by these two organizations. iNEMI’s printed electronics roadmap focuses on supply chain development, while the OE-A roadmap is product focused. Combined, the two would provide significant value for stakeholders. iNEMI and OEA have had discussions about cooperating on future roadmapping efforts.

We ended the year by starting the roadmapping cycle over again. We kicked off the European effort for the 2009 Roadmap at Productronica in November (Munich, Germany). Participants from European firms and research institutes again committed to contributing to the 2009 edition to help ensure a global perspective.

Significant progress has been made in the deployment of RFID at higher levels of tracking (e.g., containers, pallets, etc.). While more improvements are needed in these areas, a number of efforts are focused on making the necessary progress. Conversely, item-level tagging (ILT) is still in a nascent state with many remaining challenges and open questions. There are some efforts underway in the ILT area, but the focus seems to be primarily on retail scenarios with little emphasis on the infrastructure and technology issues that must be addressed if ILT is to be ubiquitous across the supply chain. In order to fully leverage the benefits of ILT, utilization should begin within the manufacturing process and be operational throughout storage, shipment, product integration, distribution, etc.

In 2007, iNEMI brought together companies with manufacturing and logistics expertise in electronics hardware to develop a technology roadmap that

Steve Brown, Celestica, and Dan Gamota, Motorola, Co-Chairs, RFID Item-Level Tag Initiative

iNEMI’s proven roadmapping methodology,

typically used for mature electronics

technologies, works equally well for

revolutionary technologies, such as printed

electronics. As printed electronics

transitions from R&D to high-volume

manufacturing, development of a well-

structured supply chain is critical for success.

iNEMI’s 2007 Organic and Printed Electronics

Roadmap provides a consensus-based

“map” for building this supply chain.

Daniel Gamota, Director

Printed Electronics Group

Motorola, Inc.

RFID Item-Level Tag Initiative

clarifies the requirements for item-level tagging. This roadmap identifies gaps that must be addressed in order to accelerate widespread deployment and thus achieve the desired improvements in quality, cost, and delivery.

The ILT roadmap was nearing completion at year end, and iNEMI is sponsoring a workshop in February (at the RFID Smart Labels USA 2008 conference) to solicit industry feedback and input. An updated version of the ILT roadmap will be included as a section in the 2009 iNEMI Roadmap.


Research Priorities

Once the 2007 Roadmap was published, we began work on the 2007 Research Priorities. This document identifies R&D priorities for the next 10 years by combining findings from the 2007 iNEMI Roadmap with R&D needs identified through gap analysis meetings.

It is only through effective prioritization of limited R&D resources that the electronics industry will be able to maintain the technology leadership that it has enjoyed for the past 50 years. iNEMI’s Research Priorities are developed to aid this prioritization, facilitating more focused investments for an improved rate of return. This information not only helps iNEMI focus its deployment projects on high-impact areas where the consortium can make a difference in the marketplace, it also assists corporate research labs, government funding agencies, and academic research centers in focusing their resources on the most critical challenges.

More than 90 research needs were identified in the 2007 iNEMI Roadmap. iNEMI’s Research Committee grouped

foCusing teChnology investMents ■

iNEMI teamed with member company Celestica to organize the Celestica-iNEMI Technology Forum in May of this year. Celestica invited their key customers and suppliers to this two-day event, which was held in Toronto. Presentations by industry experts provided forum attendees with insight into key trends affecting electronics manufacturing, as identified by the latest iNEMI and IPC roadmaps.

Presentations from select iNEMI projects demonstrated how collaborative efforts have helped close gaps identified in previous roadmaps. The forum also provided the latest information on lead-free manufacturing processes and allowed Celestica to showcase results from its environmental development program.

“We saw this forum as a great opportunity to share information with our customers,“ said Pete Tomaiuolo,

Celestica’s Director of Technology Development and the host of the event. “Attendee feedback was overwhelmingly positive – there is definitely a hunger out there for this type of discussion.”

Celestica/iNEMI Forum

Celestica organizers of the Celestica-iNEMI Technology Forum were (left to right): Pete Tomaiuolo, Tatiana Berdinskikh, Irene Sterian, Thilo Sack and Kristy Bailey.


these needs into five research areas — manufacturing processes, system integration (IT and technology integration), energy and the environment, materials and reliability, and design — and identified the top priorities for each area.

Nanotechnology

The 2007 Roadmap anticipates that nanotechnology will be a very disruptive technology over the next decade. With R&D responsibility shifting from OEMs to the EMS companies and their suppliers, government, academia, and industry consortia need to formulate new ways to adopt and develop emerging technologies — such as nanotechnology — into the manufacturing process. These new approaches will have to be consistent with viable business and funding models required to create new industrial infrastructures.

Nanotechnology-based low-temperature or room-temperature assembly processes have the potential to improve field reliability, streamline manufacturing, and reduce cost by allowing the use of a much broader portfolio of materials. Two iNEMI nanotechnology research projects were active during 2007. Both projects are attempting to lower the assembly processing temperatures found in today’s electronics manufacturing, and are using two very different applications of nanotechnologies to do so.

The Pb-Free Nano-Solder Project is using nano-scale SAC alloy particles to suppress the melting point temperature of Pb-free solders. The project team has been particularly active in the last year and has demonstrated the consolidation of nano-SAC alloy well below 190°C using the phenomenon of stored surface energy to increase the reactivity of the alloy particles.

Melting point and coalescence behavior were characterized by Purdue University, using a prototype nano-solder paste with tin and tin alloy nanoparticles from MetaMateria and flux provided by Indium Corporation. Melting point characterization showed significant melting point depression overall. Differential

scanning calorimetry data also showed more consistent melting point reduction due to more uniform particle size distribution. Tin and SAC alloy nanoparticles with flux were thermally characterized (using differential scanning calorimetry) and shown to melt at temperatures below 183°C. Furthermore, partial coalescence was seen in the first prototype nano-solder pastes.

The Nano-Attach Project, which is a “Warm Assembly” initiative, is addressing opportunities to use nanotechnologies to lower the processing temperature of electronic assemblies through enhanced adhesives and carbon nanotube hook-and-loop interconnects. Electronic assembly currently relies on high-temperature processes such as soldering or curing of adhesives. These processes typically result in undesired thermal excursions placed on the components and boards, which can lead to reliability risks and the need to restrict materials choices to those that can survive the required temperature excursions. With the move to higher temperature Pb-free assembly processes, this problem has only become more critical.

Recent studies on the mechanisms used by biological species, such as geckos, to adhere to surfaces have provided the inspiration for an alternative solution. Researchers have begun to demonstrate synthetic geckos, comprised of dense arrays of nanometer-scale pillars, with appreciable adhesion strengths. The capability to mimic

The Nano-Attach Project is a cutting-edge application of nanotechnology to improve electronics manufacturing by lowering the process temperature. It will be a critical tool in the future to allow us to attach temperature-sensitive components with higher reliability in the lead-free environment.

Alan Rae, Ph.D. Vice President of Innovations

NanoDynamics, Inc.

Andrew Skipor, Motorola, Chair, Pb-Free Nano-Solder Project

Hope Chik, Motorola, Chair, Nano-Attach Project


Deployment initiatives for 2007 have focused primarily on three areas: medical electronics, energy and the environment, and miniaturization. In 2006, our members defined these areas as being the highest priorities for deployment activities, and that input has guided our development of new initiatives this year.

As the past several roadmaps have shown, the lines between product sectors are blurring and the resulting convergence of market segments is increasing the demands on performance, cost, and harmonization of interface standards. At the same time, innovation is needed for market growth. We believe that the technology to support iNEMI’s three thrust areas will address both the converging markets and new emerging markets.

During 2007 seven new projects and initiatives were started. All of these new projects utilized the new iNEMI project management system. This new process provides a better management structure and greater project support, with an emphasis on value to members and delivery of results that are both relevant and timely. We

also added staff support to aid in the development and initiation of new projects.

Highlights of iNEMI’s 2007 deployment activities are discussed below. We want to thank the many men and women who lead and work on our numerous project teams. Without your efforts, we could not succeed.

Medical Electronics

Emerging markets and disruptive products often generate unique requirements to achieve the cost, size, weight, or reliability requirements to create a new market. It is beneficial to develop technology from the existing base of knowledge to address these new market opportunities. An example of such a market is the diverse medical electronics market. Segments of this market require enhanced reliability (implanted devices), while other segments require lower cost (consumer products). Two iNEMI projects are addressing reliability for medical electronics, focusing on those areas where a collaborative approach can yield effective solutions. The Medical Components Reliability Specifications Project is continuing its efforts to create a minimum set of requirements for electronic components used in life-critical applications. Industry-standard guidelines for testing, extrapolation analysis, materials, and processing of components will make it possible for manufacturers to achieve proven quality, reliability, and consistency from electronic components. Establishing commonly

Closing teChnology Knowledge gaps ■

Roadmaps and gap analyses help to identify areas that need to be addressed, but it is the cooperative effort at the project level where members really receive value. iNEMI offers a unique “umbrella” where the entire supply chain can work together non-competitively toward the benefit of all.

Bill Barthel, Manager Manufacturing Technology Development

Plexus Corp.

the gecko’s structures could not be possible without the progress made in the field of nanotechnology.

The iNEMI Nano-Attach Project, which launched in early 2007, is evaluating the feasibility of employing these or other dry adhesives, which enable low- or room-temperature processes, for electronic assembly. The project team first identified the requirements necessary

for nano-attach technology to replace solder for a number of different electronic components and processes. In doing so, they identified many other assembly processes (outside the electronics industry) that would also benefit from nano-attach technology. The team began evaluating the available nano-attach technologies and, from this, started identifying technology gaps.

GO

AL

Facilitate electronics technology development and deployment that will enable the medical electronics community to provide the patient and medical community with seamless end-to-end solutions for improved health management.


accepted practices will also allow suppliers greater access to the market (because requirements are standardized rather than differing from customer to customer).

During 2007, the project team designed and began fabrication of a test vehicle that will allow them to test and extrapolate methodologies for the various commodity categories on which they plan to focus. The first test vehicle will provide data on capacitors.

The project is also developing a “use conditions” matrix that defines requirements according to condition. The components used in medical devices may be subject to a wide range of electrical, environmental, temperature and mechanical stresses, not only while in use but also during storage, manufacturing assembly, manufacturing test, and transit. The conditions during these various stages of manufacture can influence the reliability of the component in service.

The team made significant progress on research of existing standards, such as AEC-Q200 and EIA-469, regarding their applicability for medical component reliability use. In addition, the DOE was finalized and several open issues resolved, including component handling procedures for procurement, testing and failure analysis, test equipment modifications, and test vehicle design and procurement.

The iNEMI Medical Substrates Project was launched this year to investigate characteristics of substrates used for implantable medical electronics and other life-critical devices. Initially, the project will identify and analyze specifications for substrates used in implantable medical electronics and determine if there are gaps that need further attention. The project will then investigate

the effects of feature size, harsh cleaning, bend radius cracking and mechanical fatigue, and low strain-stress high cycle fatigue on flexible circuits. The team plans to develop guidelines that will assist manufacturers in better defining specifications for the substrate materials, board architectures and design rules used in implantable medical devices.

Energy & the Environment

The 2007 iNEMI Roadmap points out that, to remain competitive, the electronics industry must continue to keep pace with emerging material restrictions, end-of-life requirements, customer preferences for energy-efficient products, and holistic design requirements. As environmental legislation proliferates around the globe, harmonization through international standardization is essential. Equally important is the need for industry to harmonize its technical responses, which will often mean taking a proactive approach to environmental challenges.

The iNEMI Halogen-Free Project is such an effort. It is proactively developing guidelines for standardized materials, manufacturing, assembly, and test for “halogen-free” printed wiring boards.

The European Union’s RoHS Directive prohibits the use of polybrominated biphenyls (PBBs) and polybrominated diphenyl ethers (PBDEs) in non-exempt electronic equipment. These compounds are typically used as flame retardants, and some of these substances have been shown to present risks to human health and the environment. Although

Anthony Primavera, Boston Scientific, Chair, Medical TIG and Medical Components Reliability Specifications Project

Stephen Tisdale, Intel, Chair, Halogen-Free Project, Phase II and Co-chair, Pb-Free Alloy Alternatives

Thomas Jacob, Dyconex, Chair, Medical Substrates Project

Scott Zellmer, Micro Systems Engineering, Co-chair, Medical Components Reliability Specifications Project

GO

AL Provide low-cost electronic assembly processes

that encompass environmental attributes, meet current and future regulations, and are sustainable and energy efficient.


PBBs and PBDEs are not used in circuit board materials, stakeholders are beginning to urge the electronics industry to take a precautionary stance on the use of other non-regulated halogenated organic substances, such as brominated epoxies used in circuit board applications.

The Halogen-Free Project is investigating alternatives to halogenated substances, along with the feasibility of each. In Phase I, which was completed this year, the project team identified market segment requirements, candidate materials, key performance characteristics, and test criteria. In Phase II, the group has begun testing to validate electrical and mechanical properties, and is also validating material suppliers and PCB manufacturing infrastructure capabilities, as well as estimating costs. Results will be published to members in Phase III.

iNEMI continues to have several projects that are helping members with the transition to lead-free products. One of the most active in 2007 was the High-Reliability RoHS Task Force. This group is made up of OEMs and EMS providers who are either taking the Pb exemption under, or are out of scope of, the RoHS Directive. These are all manufacturers that produce high-reliability products and are concerned about the quickly changing supply base, continued access to tin-lead components (especially BGAs), and their ability to ensure product reliability after the eventual transition to Pb-free.

In March, the group sponsored a workshop on availability of SnPb-compatible BGAs. This workshop, hosted by member Hewlett-Packard in Cupertino, brought together decision-makers from OEMs, EMS providers, and the BGA component supply base to discuss how they could work together to support SnPb-compatible BGAs, assist with questions of long-term reliability, and/or develop other solutions to address general availability concerns. The workshop successfully educated the supply base as well as the user community to the business as well as technology challenges that must be addressed in order to achieve a Pb-free transition with acceptable risk levels.

In May, the Task Force issued a position statement calling for unique part numbers for BGA components to differentiate any Pb-free ball metallurgies other than SAC 305 or SAC 405, including low silver, added dopants such as nickel, and other SAC (or non-SAC) alloy compositions.

The Task Force has also been identifying and prioritizing the remaining “knowledge gaps” for Pb-free processing, and identified two areas where they have proposed projects, which are currently in development: Pb-Free Alloy Alternatives and Pb-Free Early Failures. The Alloy Alternatives effort will further address the issues around the proliferation of lead-free alloys. The project plans

Mike Davisson, Agilent Technologies, Co-chair, High-Reliability RoHS Task Force

Thilo Sack, Celestica, Co-chair, High-Reliability RoHS Task Force

Joe Smetana, Alcatel-Lucent, Co-chair, High-Reliability RoHS Task Force

iNEMI has proven to be an effective venue

for driving solutions to common industry

problems that require broad collaboration

across the industry. The diversity of its

member companies allows the consortium

to draw on the strength of the entire

industry. An example of this principle in

action is the industry’s move toward

halogen-free materials. iNEMI is paving the

way by sponsoring an industry-wide

collaborative effort to develop a

comprehensive understanding of the

capabilities and limitations of halogen-free

materials. This will benefit the entire

industry and accelerate the transition to

halogen-free.

Mostafa Aghazadeh, Vice President Technology & Manufacturing Group

Intel Corporation


to provide guidance and technical information to industry that will help make Pb-free alloy proliferation easier to manage. This could include, for example, developing standard guidelines regarding which alloy changes require a part number change or guidelines on data requirements for assessing new alloys.

The project has drafted a statement of work and the first step is to gather as much relevant data as exists in the industry today on the use and reliability of alternate Pb-free alloys. The team will also identify critical knowledge gaps related to new Pb-free alloys.

The Early Failures group will investigate the causes of unexpected early failures that have been found in some Pb-free reliability studies. The hypothesis is that there may be something fundamentally different about SAC solder joints that may lead to early failures. The project

team has been reviewing existing data and is proposing testing with large sample sizes to attempt to isolate early failures and causes. Discussions continue on how to best approach this testing effort.

Another issue related to the transition to Pb-free products is tin whiskers. iNEMI has had three very active — and successful — projects addressing various aspects of the tin whisker problem. The Tin Whisker Accelerated Test Project identified tests to predict whisker formation, the

Being part of a team working on a common

problem/solution definitely leverages our

company’s resources with those of the iNEMI

project teams. Working on the lead-free and

tin whisker projects has allowed us to get

considerably more evaluation and science

done than if we were working alone.

Richard D. Parker, Lead Technologist Advanced Assembly Technologies

Delphi Electronics & Safety

In October of this year, Wiley-IEEE Press published the book Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing. Based on the results of iNEMI’s more than six-year study into lead-free electronics, this book provides full coverage of the issues surrounding the implementation of Pb-free solder into electronic board assembly. It features chapters by some of the industry’s leading experts on Pb-free processing and covers such topics as solder material properties, reliability testing, lead-free rework, tin whisker mitigation strategies, and more.

This book is the result of the commitment and dedication of many iNEMI members. It represents contributions from several hundred researchers at more than 100 companies, universities, and government agencies. Through collaborative projects, iNEMI members were able to benefit from the combined efforts of many industry experts working together for the common good, thus minimizing the investment of any particular company. While this information is now being made available to the industry, iNEMI members have enjoyed the results as they became available

during the projects as well as through end-of-project reports.

Special thanks go to the editors for their hard work and the long hours spent in pulling this book together. They are: Edwin Bradley (Motorola), Carol Handwerker (Purdue University), Jasbir Bath (Solectron), Richard Parker (Delphi Electronics and Safety) and Ron Gedney (iNEMI, retired).

Special recognition goes to Dr. Iwona Turlik, who retired from Motorola and the iNEMI Board of Directors in 2007, for convincing the Board to focus on the RoHS transition as a major thrust area for the organization. In hindsight, this decision significantly strengthened the organization and increased the value received by many member companies.

iNEMI Lead-Free Book Published

Greg Henshall, Hewlett-Packard Company, Chair, Pb-Free Alloy Alternatives


Tin Whisker Modeling Project focused on identifying the root causes of whiskers, and the Tin Whisker User Group developed guidelines for minimizing risk of failure from tin whiskers in high-reliability electronic applications. All three projects made significant contributions to industry’s understanding of, and tools for managing, tin whiskers.

The three original tin whisker projects have now been completed and, in 2007, we organized the Tin Whisker Project, Phase II. This latest project combines teams from, and extends the results of, the Modeling and Test projects. This latest effort is continuing to develop tests that will accelerate whisker growth, using theories formulated by the previous projects to explain the formation of tin whiskers. They are also conducting experiments to test those theories.

The team is now working on understanding the stress states in tin films as a function of time and will try to correlate to whisker growth. The long-term goal is to simplify or accelerate tin whisker testing methods and correlate to field experiences. The team is also looking at methods to control tin whiskers, and is working to develop “flexure beam” as an in-process control “tool.”

Also nearing completion at year-end was the Pb-Free BGAs in SnPb Assemblies Project. This project is on track to complete all testing by the end of 2007 and to publish results to members in early 2008. This effort has been identifying the process parameters required for assembling Pb-free SnAgCu BGAs under the temperature constraints of a conventional SnPb process (i.e., using traditional SnPb paste for assembly).

As the supply chain converts to lead-free, availability of SnPb components becomes increasingly constrained. Manufacturers assembling products exempted from RoHS requirements who want to continue using a SnPb process may be forced to solder Pb-free SnAgCu BGA solder ball terminations in a SnPb soldering process. Before doing so, however, they need to be assured there will be no significant impact on yield or reliability.

The iNEMI project team focused on identifying an appropriate process window for assembling Pb-free SAC BGAs in a SnPb assembly process, determining the quality of the mixed-alloy solder joints, and understanding the reliability of mixed-alloy solder joints (SnAgCu in SnPb), and understanding their reliability.

This 72-micron whisker grew from the side of a lead on a 16-pin SOIC after 8000 hours of isothermal testing (100°C at a relative humidity of 60%). It occurred in an area that was not heavily corroded. The ICs in this test group had lead-frames of C194 copper, 10 microns of matte tin plating, and were not reflowed. (Photo courtesy of Delphi Electronics & Safety)

Jack McCullen, Intel, Co-chair, Tin Whisker Project, Phase II

John Osenbach, LSI, Co-chair, Tin Whisker Project, Phase II

Richard Parker, Delphi Electronics & Safety, Chair, Tin Whisker Project, Phase II

Mark Kwoka, Intersil, Co-chair, Tin Whisker Project, Phase II

Robert Kinyanjui, Sanmina-SCI, Chair, Pb-Free BGAs in SnPb Assemblies Project

Quyen Chu, Jabil, Co-chair, Pb-Free BGAs in SnPb Assemblies Project


Some key findings include:The larger the package/ball volume, the lower the �degree of mixing observed. CTBGA132 (0.5mm Pitch) showed a 100% mixing at 210°C and 60 seconds time above liquidus.Doubling the time above liquidus (from 60 to 120 �seconds), increases the degree of mixing. For the small packages (reduced SAC solder ball volume), �increased paste volume corresponds to increased degree of mixing. However, for the largest package (SBGA600) no significant change in mixing was observed.Increasing the peak temperature from 210°C to 215°C led �to a significant increase in the degree of mixing (almost double) for the 1.0mm pitch package.

Preliminary results were reported to members in a webinar in early October and at the fall Council of Members meeting. The team plans to develop a “generic” process guideline and risk assessment for assembling Pb-free BGAs in a SnPb assembly process, which will be distributed to members prior to being presented at APEX 2008.

Miniaturization

The demands of electronic system miniaturization affect most aspects of electronics manufacturing, driving the need for advanced materials — with enhanced electrical, thermal, and mechanical properties — and for advanced manufacturing processes. Miniaturization also has an impact on packaging technologies, test methodologies, and design. And, of course, nanotechnology is expected to play a major role in miniaturization.

In addition to our nanotechnology projects (see page 6), iNEMI launched three other projects this year that address challenges related to miniaturization.

One of the challenges presented by relentless miniaturization is the loss of physical access to test points. During 2007, iNEMI organized the Board & Systems Manufacturing Test TIG (Technology Integration Group) and the first project in this new TIG is the Functional Test Coverage Assessment Project. This new initiative is attempting to develop a standard framework for assessing functional test coverage that will allow reliable comparison of test coverage among different test environments, test conditions and different assessors.

This project is being driven by the challenges of globalization. A test may be developed in North America, for example, and the knowledge and methodologies for testing must be transferred to Asia where the product is actually manufactured. The team is currently compiling usage models of functional test coverage to help define an overall framework.

The second new project is the Board Coplanarity in SMT Project. This group will be developing standards to enable the measurement of board land coplanarity during reflow to ensure high-quality, high-yield SMT processes for the next generation of BGA components and boards. They plan to conduct experiments to understand and develop coplanarity standards, and will reconcile board and component requirements with JEDEC and JEITA.

A third project is currently being organized in China (iNEMI’s first regional deployment project). The Solder Paste Deposition Project will investigate solutions to depositing different volumes of solder paste on the same board. As board density increases and components become smaller, fine-pitch components (which require smaller volumes of solder paste) often appear next to larger components (which require more paste) and a single-thickness stencil cannot satisfy all of the components in the same printing process. In these situations, a step stencil is the least expensive and most popular solution. However, the challenge is in determining the proper distance between the various components because the step stencil may affect the thickness of the solder paste deposition, especially for miniature and fine-pitch components located around the step.

The Solder Paste Deposition Project proposes to investigate the keep-out distances of step stencils and output the design rules, identify new paste deposition technologies for high-density layouts, and compare and evaluate the feasibility of identified technologies.

Rosa Reinosa, Hewlett-Packard, Chair, & JJ Grealish, Intel, Co-chair, Board & Systems Manufacturing Test TIG

GO

AL

Enable maximum product value in the smallest possible form factor.


Board of Directors

Chairman: Nasser Grayeli, Intel CorporationMarc Benowitz, Alcatel-LucentKatharine Frase, IBM Software GroupByung Joon Han, STATS ChipPAC Ltd.Monroe Huang, Delphi Electronics & SafetySundar Kamath, Sanmina-SCI CorporationMinoru Okamoto, Tyco Electronics CorporationJeroen Schmits, Universal Instruments CorporationMike Toben, Rohm and Haas Electronic MaterialsIwona Turlik, Motorola, Inc.Ex-officio Board MembersBill Anderson, NISTFrederick F. Kuhlman, Delphi Electronics & SafetyJim McElroy, iNEMIRobert C. Pfahl, Jr., iNEMI

Technical Committee

Co-chair: Frederick F. Kuhlman, Delphi Electronics & SafetyCo-chair: Robert C. Pfahl, Jr., iNEMIMulugeta Abtew, Sanmina-SCI CorporationMostafa Aghazadeh, Intel CorporationBill Ballard, 3MBill Barthel, Plexus Corp.Mario Bolanos, Texas Instruments CorporationTai-Yu Chou, FoxconnTom Cipielewski, JabilMike Davisson, Agilent TechnologiesDan Gamota, MotorolaKoen Gieskes, Universal Instruments CorporationBarbara Goldstein, NISTLeslie Guth, Alcatel-LucentCarol Handwerker, Purdue University, Co-Chair, Research CommitteeMahadevan Iyer, Georgia Institute of TechnologySherwin Kahn, Alcatel-LucentSunny Liu, Huawei Technologies Company, Ltd.Alan Rae, NanoDynamics, Inc., Director of Research and Chair, Research CommitteeRob Rix, Tyco ElectronicsMichael Roesch, Hewlett-Packard CompanyPeter Tomaiuolo, Celestica, Inc.Jie Xue, Cisco Systems, Inc.Ex-officio Technical Committee MembersAlan Allan, Intel Corporation, ITRS RepresentativeDavid Godlewski, iNEMI, Staff Manager of PlanningChuck Richardson, iNEMI, Director of Roadmapping

Research Committee

Chair: Alan Rae, NanoDynamics, Inc.Co-Chair: Carol Handwerker, Purdue UniversitySecretary: Robert C. Pfahl, Jr., iNEMIBill Ballard, 3MDan Gamota, Motorola, Inc.Barbara Goldstein, NISTMahadevan Iyer, Georgia Institute of TechnologyMartin Rausch, Intel CorporationD.H.R. Sarma, Delphi Electronics & Safety

China Steering Committee

Chair: ZHU Jian, Alcatel Shanghai Bell Co., Ltd.Secretary: Haley Fu, iNEMICAO Xi, HuaweiHenry Ding, 3MSimon Lee, Rohm & HaasGeorge Lim, CelesticaJim Liu, MotorolaLIU Xinqiang, IntelDave Martin, Tyco ElectronicsZambri Samsudin, JabilSHI Dong-Wei, AgilentScott Xiao, Solectron – SuzhouSky Yang, Delphi

China Technology Groups

Manufacturing/Assembly TechnologiesChair: Scott Xiao, Solectron – Suzhou

Component/Substrate TechnologiesChair: LIU Xinqiang, Intel Products – Shanghai

Materials TechnologiesChair: HOU Weixing, 3M China Limited

2009 Roadmap Product Emulator Groups (PEGs)AutomotiveJim Spall, Delphi

Consumer/Portable ProductsSusan Noe, 3M

Medical ProductsAnthony Primavera, Boston Scientific

2007 ■ ineMi organization


Netcom (Network, Data, Telecom)John Duffy, Cisco Systems, Inc.

Office/Large Business SystemsChair is open

2009 Roadmap Technology Working Groups (TWGs)Board AssemblyDongkai Shangguan, Flextronics; Ravi Bhatkal, Cookson Electronics; Dave Geiger, Flextronics

ConnectorsJohn MacWilliams, Consultant

Energy Storage and Conversion SystemsRalph Brodd, Broddarp of Nevada

Environmentally Conscious ElectronicsFrank Rossman, Jabil

Final AssemblySteve Davidson, Delphi; Reijo Tuokko, Tampere University of Technology

Interconnect Substrates – CeramicHoward Imhof, Metalor Technologies USA; Ton Schless, SIBCO LLC

Interconnect Substrates – OrganicJack Fisher, Consultant; Henry Utsunomiya, Consultant

Mass Data StorageTom Coughlin, Coughlin Associates; Roger Hoyt, Consultant

Modeling, Simulation & Design ToolsYi-Shao Lai, Advanced Semiconductor Engineering, Inc.; SB Park, State University of New York at Binghamton

OptoelectronicsRob Suurmann, Celestica; William Ring, WSR

Organic and Printed Electronics TechnologyDan Gamota, Motorola; Jan Obrzut, NIST; John Szczech, Motorola Labs; Jie Zhang, Motorola

PackagingBill Bottoms, NanoNexus; Bill Chen, ASE

Passive ComponentsPhilip Lessner, KEMET Electronics

Product Lifecycle Information ManagementEric Simmon, NIST

RF Components and SubsystemsKen Harvey, Teradyne; John Barr, Agilent Technologies; Steve Kenney, Georgia Institute of Technology; Vijay Nair, Intel Corporation; Eric Strid, Cascade MicroTech

Semiconductor TechnologyPaolo Gargini, Intel; Alan Allan, Intel

SensorsChair is open

Solid State IlluminationMarc Chason, Consultant

Test, Inspection & MeasurementMichael Reagin, Delphi; Michael J. Smith, Teradyne

Thermal ManagementCarl Fisher, 3M

Technology Integration Groups (TIGs) and ProjectsBoard Assembly TIGIan Williams, Intel

Board Coplanarity in SMTJohn Davignon, Intel

Pb-Free Alloy AlternativesGreg Henshall, Hewlett-Packard; Stephen Tisdale, Intel

Pb-Free BGAs in SnPb Assemblies ProjectRobert Kinyanjui, Sanmina-SCI; Quyen Chu, Jabil Circuit, Inc.

Pb-Free Component and Board Finish Reliability (in conjunction with Substrates TIG)Omar Bchir, Intel; Richard Coyle, Alcatel-Lucent

Pb-Free Nano-Solder ProjectAndrew Skipor, Motorola Labs

Warm Assembly ProjectsNano-Attach Project �Hope Chik, Motorola Labs


Board and Systems Manufacturing Test TIGRosa Reinosa, Hewlett-Packard; JJ Grealish, Intel Corporation

Functional Test Coverage Assessment ProjectTony Taylor, Intel Corporation

Environmentally Conscious Electronics TIGChair is open

Halogen-Free Project, Phase II (in conjunction with Substrates TIG)Stephen Tisdale, Intel

High-Reliability RoHS Task ForceMike Davisson, Agilent Technologies; Thilo Sack, Celestica; Joe Smetana, Alcatel-Lucent

Pb-Free Rework Optimization ProjectJasbir Bath, Solectron; Craig Hamilton, Celestica

Pb-Free Wave Soldering ProjectDenis Barbini, Vitronics Soltec; Paul Wang, Microsoft

Tin Whisker Project, Phase IIRichard Parker, Delphi; Mark Kwoka, Intersil Corp; Jack McCullen, Intel; John Osenbach, LSI

Medical TIGAnthony Primavera, Boston Scientific

Medical Components Reliability Specifications ProjectAnthony Primavera, Boston Scientific; Scott Zellmer, Micro Systems Engineering, Inc.

Medical SubstratesThomas Jacob, Dyconex

Optoelectronics TIGChair is open

Fiber Connector End-Face Inspection Project, Phase IITatiana Berdinskikh, Celestica; Brian Roche, Cisco Systems

Substrates TIGHamid R. Azimi, Intel

Halogen-Free Project, Phase II (in conjunction with Environmentally Conscious Electronics TIG)Stephen Tisdale, Intel

IPC-2581 Industry Adoption Initiative Dana Korf, Sanmina-SCI

Pb-Free Component and Board Finish Reliability (in conjunction with Board Assembly TIG)Omar Bchir, Intel; Richard Coyle, Alcatel-Lucent

Thermal Management TIGVadim Gektin, Sun Microsystems; Ravi Prasher, Intel

Emerging InitiativesRFID Item-Level Tag InitiativeSteve Brown, Celestica; Dan Gamota, Motorola

MeMbership ■iNEMI’s strength springs from the enhanced strength of our members as a collective whole, and our success is solely dependent on their participation. That is why we endeavor to attract industry leaders — companies that are focused on the future and have the vision and resolve to help shape the course of the electronics industry. The following companies joined iNEMI this year: Dyconex; Endicott Interconnect Technologies, Inc. (EIT); Huawei Technologies Co., Ltd.; MED-EL Elektromedizinische Geräte GmbH, and Test Research, Inc.

2007 iNEMI Council of Members3MAeAAgile Software CorporationAgilent Technologies, Inc.Albemarle CorporationAlcatel-LucentAMR Research, Inc.

AnalogicAsymtekBoston Scientific CRMCelestica, Inc.Center for Innovative Technology (CIT)Ciba

Cisco Systems, Inc.Linksys �Scientific Atlanta, Inc. �

Cookson ElectronicsAlpha �Enthone �Semiconductor Products �

Dassault Systemes – ENOVIA MatrixOneDelphi Electronics & SafetyDyconex AGE2openElectronic Industries Alliance (EIA)


Endicott Interconnect Technologies, Inc. (EIT)ERSA North AmericaFCIFoxconnFrancisco Partners

Hover-Davis �Universal Instruments �Vitronics Soltec �

Georgia Institute of TechnologyHenkelHewlett-Packard CompanyHuawei Technologies Co., Ltd.IBM CorporationIndium Corporation of America

Integrated Electronics Engineering Center (IEEC), SUNY-BinghamtonIntel CorporationIPC–Association Connecting Electronics IndustriesJabil Circuit, Inc.KesterKLA-TencorMED-EL CorporationMicrosoftMicro Systems Engineering, Inc.Ministère du Développement économique, de l’Innovation

et de l’Exportation (Province of Quebec)Motorola, Inc.

Symbol Technologies, Inc. �NanoDynamics, Inc.National Center for Manufacturing Sciences (NCMS)National Institute of Standards and Technology (NIST)Nihon Superior Co., Ltd.PCNAlertPlexus Corp.PTCPurdue UniversityRambo Chemicals (HK) Ltd.

Rohm and Haas Electronic MaterialsSanmina-SCI CorporationSenju Comtek Corp.Siemens Product Lifecycle Management Software, Inc. (formerly UGS)Solectron CorporationSpeedline TechnologiesSTATS ChipPACSun Microsystems, Inc. Teradyne, Inc.Test Research, Inc.Texas InstrumentsTyco Electronics

Contact Us

United States2214 Rock Hill Road, Suite 110Herndon, Virginia 20170-4214Phone: +1 703-834-0330Fax: +1 703-834-2735

AsiaRoom 1409, Cimic Tower800 Shang Cheng RoadPudong, Shanghai, China 200120Phone: +86 21 5835 3839Fax: +86 21 5835 9791

EuropeSandville House, Friarstown, GrangeKilmallock, Co. Limerick, IrelandPhone: +353-87-9040-363Fax: +353-61-351-935

[email protected]

BIOTRONIK’S Philos®II DR-T, a state-of-the-art pacemaker with wideband IEGM recordings and BIOTRONIK Home Monitoring® Service for efficient therapy management. Photo courtesy of BIOTRONIK.

MOTORAZR V3 ultra-thin design with MPEG4 video playback, Bluetooth® wireless technology, digital camera and more. Photo courtesy of Motorola.

Processors on an Intel 45nm Hafnium-based high-k metal gate ‘’Penryn’’ wafer, photographed with a pin. Using an entirely new transistor formula, these processors incorporate 410 million transistors for each dual core chip, and 820 million for each quad core chip. Photo courtesy of Intel Corporation.

Delphi Corporation’s NAV200 Portable GPS Navigation system, offering a unique blend of advanced navigation and entertainment, with the Real-Time Traffic Kit, which displays up-to-date information about traffic flow, incidents, weather, and construction zones.

Photo Credits (cover photos)

Documents

Message froM the ChairMan & Ceothor.inemi.org/webdownload/annual_report/2007_AR.pdf · 2 iNEMI 2007 Annual Report Message froM the ChairMan & Ceo 2007 was a year of significant turmoil