Upload
others
View
1
Download
0
Embed Size (px)
Citation preview
The mis to c
desifrom
induenhrel
machA
IntConfMechthe wProb
M
In1. Messa
2. About4. About5. Memb6. Contri7. Repor8. Forthc9. Adver
CoDr. G. SSecretarTel: (044) 2
Fax: (044)
E‐mail: seWeb Site: h
Vo
ObjectivesActiviti
main objectivcontribute to ign at all levem academic rstrial initiativ
hancing the quliability of indhines. With thAMM organiternational & ference on Mahanisms, iNaCworkshops onblems on Mac
Mechanisms, IPregularly
nside This age from the Edi
t the AMM t the IFToMM bers in the Newsibuted Article rt of an Event coming Events rtisement
ontact DeSaravana Kuy, AMM 2257 4736 (O)
2257 4732
ecretary@ammhttp://www.amm
olume 8
s and ies
ve of AMM mechanical
els starting esearch to
ves, thereby uality and digenous his in view, ses the National
achines and CoMM, and n Industrial chines and PRoMM y.
Issue itor-in-Chief
etails umar
mindia.org mindia.org
As
8, No. 3
Volume Machineswhile theVice Presresponsib Dr. G. Saoffice bea One articlthis issueRobotics events arprogrammcommunit The conghappily pl I earnestl2016 issuBulletin oalso reque I wish to out this is I again uJournal ofMachines
ssoci
8, No. 3, Js and Mechae Independensident (East
bility to bring
arvana Kumaarers of the A
le on “3D Pe. Also theis included
round the me. Hope thety.
ratulatory nolaced within
ly request Aue. Construof the AMMested.
express myssue of the B
urge the mef the AMM s and Mecha
iatio
Mess
July 2016 ianisms (AMMnce Day of t) is out of g out this iss
ar, the SecretAMM have c
rinting” writreport of tin this issu
globe with ese would be
ote of achievn issue by the
AMM membuctive suggeM that can be
y sincere graBulletin.
embers of thcan be thougnisms comm
on fo
age from
issue of theM) is being India is knostation, the
sue.
tary, Dr. C. cooperated a
tten by Dr. Gthe 3rd Nati
ue along withthe Call
e of interest
ving an Awae Secretary,
bers to contestions, come published
atitude to all
he AMM toght of in nea
munity furthe
or MaM
Ne
m the Ed
e Bulletin opublished wocking at the Editor-in-C
Amarnath, tas usual to br
G. Sarvana Kional Worksth the annouto participato the Mach
ard by the TAMM.
tribute articlmments for
as a separat
l concerned
o think whear future to per.
achinMechews B
ditor-in-
of the Assowithin this rahe door. As Chief has to
the Presidentring out this
Kumar is pushop on Aduncements oate in the hines and M
Team of IIT B
les for the Nimproveme
te regular co
for their hel
ether an Intpromote the
Prof.SanEditor–
nes ahanisBulle
Jul
-Chief
ociation of ainy season
the Zonal o take the
t and other s issue.
ublished in dvances in of different
respective Mechanisms
Bombay is
November ent of the olumn, are
lp to bring
ternational activity of
ntanuDas–in–Chief
andsmsetin
y 2016
The AMM headquarter is currently located at the Department of Engineering Design, IIT Madras. A new set of office bearers have taken charge of the affairs of AMM. AMM invites both individual and corporate membership from Indian academia, research organizations and industry. Membership benefits and other information about AMM are available at www.ammindia.org. The body of Zonal Vice Presidents (ZVPs) is active over the past several years with representations from the four corners of the country. They are playing the role of nodal agencies so as to decentralise the AMM official activities and to organise workshops under the aegis of AMM to popularise the mechanism science in their respective regions. They also form the editorial team of this news bulletin. AMM invites contributory articles from its members and others working in the various fields of mechanisms science for this quarterly news bulletin. Interested people can contact the editorial team.
Office Bearers of the AMM: Prof. C. Amarnath (President) Retired Professor, Department of Mechanical Engineering, Indian Institute of Technology, Bombay, Powai, Mumbai 400076, INDIA Phone: + 91 80 2368 2151 Email: [email protected]
Prof. Ashitava Ghosal (Vice President) Department of Mechanical Engineering, Indian Institute of Science, Bangalore 560 012, INDIA. Phone: +91 80 2293 2956 Email: [email protected] Web: http://www.mecheng.iisc.ernet.in/~asitava
Dr. G. Saravana Kumar (Secretary) Department of Engineering Design, Indian Institute of Technology, Madras, Chennai 600036, INDIA. Phone: + 91 (44) 2257 4736 Email: [email protected] Web: http://ed.iitm.ac.in/~gsaravana
Dr. Palaniappan Ramu (Treasurer) Department of Engineering Design, Indian Institute of Technology, Madras, Chennai 600036, INDIA. Phone: + 91 (44) 2257 4738 Email: [email protected] Web: http://ed.iitm.ac.in/~palramu
About the Association of Machines and Mechanisms (AMM)
Dr. Santanu Das (Editor-in-Chief, News Bulletin)
Professor and Head, Department of Mechanical Engineering Kalyani Government Engineering College, Kalyani- 741235, West Bengal, INDIA
Phone: +91 9433956050
Email: [email protected] Dr. Shankar Sehgal, (Zonal Vice President [ZVP] North) Assistant Professor, Mechanical Engineering Department, Room No. 102, Block 2, U.I.E.T., Sector-25 Panjab University, Chandigarh- 160 014. INDIA Phone: +91 95010 24161 E-mail: [email protected] Dr. R. Ranganath, (ZVP, South) Spacecraft Mechanisms Group, ISRO Satellite Centre, Bangalore-560017, INDIA Phone: +91 (80) 25082417 Email: [email protected]
Dr. Ranjit Kumar Barai, (ZVP, East) Associate Professor, Control System Laboratory, Electrical Engineering Department, Jadavpur University, Kolkata- 700 032, INDIA Phone: +91 (33) 24139270 Email: [email protected] Dr. Shital S. Chiddarwar (ZVP, West) Assistant Professor, Dept of Mechanical Engineering Visvesvaraya National Institute of Technology, Nagpur, INDIA Phone: +91 9561050130 Email: [email protected]
“… the only purpose of science is to ease the hardship of human existence.”
--- B. Brecht (From : The Life of Galileo)
Editorial Team of the News Bulletin
4
Aban
bout thend Mac
e Internchine Sc
nationacience
l Federa (IFToMM
ation foM)
or the Prromotio
on of Meechanis
sm
5
Congratulations!! We are happy to note that the Dr. P. K. Patwardhan Technology Development Award for the year 2015 is conferred upon the following technology development effort :
'A Remotely Operated Ground Vehicle (Rover) for Indian Army'
by Prof. Anirban Guha and team of the Department of Mechanical Engineering, IIT Bombay. This is based on the recommendations of the Award Committee. The award carries a citation and a cash incentive of Rs. 25,000/- and will be presented during the Teachers’ Day function scheduled to be held at IIT Bombay during September, 2016. The Team consists of Prof. Anirban Guha, Prof. C. Amarnath, Prof. B. Seth, Prof. K. Kurien Issac and Mr. Abhay Kharade (Project Staff). The Secretary, Association of Machines and Mechanisms
Member in the News
6
3D Printers
Dr. G. Saravana Kumar Associate Professor, Department of Engineering Design, IIT Madras, Chennai 600036
Email: [email protected] Abstract: Arising as a new manufacturing technology, additive manufacturing (AM) or 3D printing has caught the attention of every engineering discipline from automotive to biomedical engineering. These systems are based on a layered manufacturing technique where a 3D CAD model of the object is decomposed into cross-sectional layer representation and built in an automated fabrication machine to form physical objects. This article briefs some aspects of AM, along with some details to building a 3D printer based on open source hardware and software.
1. Introduction to 3D Printing Process 3D printing allows to quickly fabricate complex-shaped, three-dimensional parts directly from CAD models. This means that the designers have the choice of making from concept design a physical model for viewing, studying and testing as well as for manufacturing. It involves slicing the CAD model of an object into thin slices, which can be fabricated by using many solid free form manufacturing process. The advantages of these manufacturing process is that they build complex 3D objects based on automatic process planning from CAD models, use generic machines that do not need part specific fixtures or tools and require no or minimum human intervention. Unlike CNC machines, which remove material to obtain a desired shape, 3D printing systems are additive in nature. Implementation of this layered manufacturing for modern manufacturing has been realized due to the development of many technologies, including CAD, laser material processing, printing, precision motion controllers along with some traditional technologies like powder metallurgy, welding, CNC machining and lithography. Approximately three decades ago, the art of building 3D objects by layers was significantly advanced by 3D Systems Inc., a US based company [1] based on the concept of realizing 3D shapes by photo curing polymers using lasers also popularly known as Stereo-Lithography. Today many other systems are available that build layered objects by lamination of sheet material (Helisys [2]), binding powders (DTM [3] and EOS [4]) or extrusion of thermoplastics (Stratasys [5]) to name a few. The availability of vast number of patented process has ensured that many materials can be processed providing designers with alternatives to realize physical prototypes and end use parts. Recent advances in selective laser melting using laser and electron beam as power sources has enabled printing production grade metallic components for end use application in aerospace, biomedical and automotive applications [4,6]. 2. Process Sequence of 3D Printing The 3D printing process essentially starts with the creation of a computer model of the object and ends with the realization of physical prototype of the object. The complete process can be sequenced into sub process and are further enumerated and described briefly (illustration in figure 1).
Contributed Article
7
Geometof 3D psolid-mbe consreverse Data Coto a 3Dformat convertdimensiindicateresults mid-linusing so Part Buand extrdefects to the Arequires Post-proThese orequired
3. RepR Fused dLtd. [5]are of eFDM Textrudinthis techbecomeCommuparts, Rhardwarillustratextrudeprint beand z aextrudeonto the
tric Modelinprinting pro
modeling pacstructed froengineering
onversion aD printing shas become
ted into an Sional triange which sidin loss of ae node closome comme
uilding: Thisracting the and repairi
AM machins no or mini
ocessing: Inoperations ind.
Rap: Open
deposition m] in 1990s. excellent mTechnology ng thermophnology, an
e the mostunity. SinceRepRap selre, assembted in figuer. The meced. The elecaxis and oner is response bed where
ng: Creatingocess. The sckages avaiom Computg, etc., depe
and Checkinsystem prime a de factoSTL format
gles represene of the tria
accuracy as sure errors (ercial correc
s process stslice informing them, ad
ne. The macimal human
n the post-pnclude rem
Figure 1
Source 3D
modelling (FFDM build
mechanical, build obje
lastic filamnd the RepRt widely-ue many parlf-replicates
bly instructiure 3. The chanical assctronics conne for extrusible for feee the part is
g an accurasolid model ilable for dted Tomogending upon
ng: Geometrmarily throuo standard ft. The STL nting the paangle conta
well as pro(holes) and ction softwa
tarts with plmation fromdding the p
chine then bn interventio
processing smoval of sup
Schematic
D Printer
FDM) technds parts withthermal andects layer b
ment. RepRaRap project sed 3D pr
rts of RepRs by makinion, printinhardware
sembly consnstitutes of Auder), limiteding filam made. The
ate and compshould be
eveloping sgraphy (CT)n the need.
ric data of augh the STLfor interfaci
is a facetedart shape. Tins the partone to errortruncation eare and the
lacing the Sm it, checkinpart-buildingbuilds the pon.
stage, some pports and e
of 3D print
nology was h productiod chemical by layer froap was the f
started the rinter amon
Rap are madng a kit ong parts isconsists of
sists of the Arduino cont switches
ment throughre are sever
plete solid mwatertight.
solid model), Magnetic
a model is trL (Stereo-Ling with AMd format anThe verticest mass. Thers. The typierrors. The file is repai
STL file forng the slicesg parameterart describe
skilled manexcess mate
ing process
developed on-grade the
qualities. 3om the verfirst of the open-sourcng the glode from plaof itself. As available f electronicsupport fra
ntroller, stepand heating
h a nozzle aral open sou
model is a gThere are s
ls. Geometrc Resonanc
ransferred fLithographyM systems. nd consists os of the tria translationical errors avalidity of
ired.
r the optimu for any opers, if any, aed by the fi
nual operatirial, if any,
s chain
and implemermoplastic3D printingry bottom ulow-cost 3D
ce 3D printeobal membastic and R
A complete from Rep
cs, mechaname, x, y anpper motorsg for the pand meltingurce STL to
general prerseveral comric models cce Imaging
from a CADy) file formThe solid mof connecte
angle are orn from CADare flipped STL file is
um part orieen curves an
and sendingle, and this
ions are per and post-c
mented by Ss, so things
g machines up by heatD printers ber revolutiobers of th
RepRap prindocumenta
Rap wiki nical assemnd z drive as (three to dprint platforg it as it's deo G-code co
requisite mmercial can also
(MRI),
D system mat. This model is ed three-dered to
D to AM normal, verified
entation, nd other
g the file process
rformed. uring, if
Stratasys s printed that use
ting and based on n. It has e Maker
nts those ation of [7] and
mbly and axis and
drive x, y rm. The eposited
onverters
8
availabltools likto printi
Figu
Referen [1] 3D[2] H[3] D[4] EO[5] St[6] A[7] Re[8] U[9] Fr
le that can ke FreeCADing physica
ure 2 A Rep
nces
D Systems. elisys Inc., TM CorporOS GmbH. tratasys Inc
Arcam AB, hepRap, http
Ultimaker CureeCAD, htt
------
be used wD [9], it hasal parts.
pRap printer
USA. http:/http://www
ration. http:/http://www., http://ww
http://www.p://reprap.orura Softwartp://www.fr
--------------
with RepRaps become p
r assembledsampl
//www.3dsyw.helisys.com
//www.dtmw.eos.info/ ww.stratasys
arcam.com/rg/wiki/Repe, http://sofreecadweb.o
---------------
p, as an exapossible for
d using Purse printed pa
ystems.comm
m-corp/
.com /
pRap ftware.ultimorg/
-----x--------
ample Curaeveryone to
sa i3 Reworart.
m/
maker.com/
--------------
a [8]. With o have acce
rk parts [6] a
--------------
open sourcess to 3D m
along with
---
ce CAD modeling
a
9
R
The 3rd SocietyinaugurJuly 20RoorkeEngineeProf. AThe toprobotic plannin More tacademgraduatand Dev
Report
eport o
National Wy of India (Rrated by Pro016. Resoure, IIT Maders (DRDO
Ashitava Ghpics covered
vision and ng, visual se
than 60 pamic institutete students fvelopment O
t of Eve
n the 3r
Workshop onRSI) was heof. Ashok Krce persons
dras, IIT JoO), and expehosal (IISc.,d during the
applicationervoing, and
articipants es, engineefrom variouOrganisatio
nts
rd NatioR
n Advanceseld at IIT MKumar Mishs included odhpur, IIScerts from pr, Bangalore two days ons, autonomd reinforcem
attended trs from in
us institutes.on, New Del
onal WoRobotic
s in RoboticMadras on 18
hra, Dean (eminent fa
c., Texas (rivate induse)and Mr. Aof the worksmous systemment learnin
the workshndustry, sci. The worklhi.
orkshopcs
cs, organize8th and 19th
(academic Raculty fromA&M) Unitries. Keyn
Alok Mukheshop includems, soft robng.
hop. Particiientists fromshop was sp
p on Ad
ed by IIT MJuly 2016.
Research), Im IIT Delhiiversity, sciote lectureserjee (R&Ded kinematiotics, mobi
ipants inclum R&D eponsored by
dvances
Madras and RThe workshIIT Madrasi, IIT Kanpientists froms were deliv
D Engineersics of manipile robotics,
uded facultestablishmeny Defence R
in
Robotics hop was
s on 18th pur, IIT m R&D vered by s, Pune). pulators, , motion
ty from nts, and Research
10
Forthcoming Events
11
12
Forthcoming Events
13
14
Forthcooming
W
Events
Website: htttp://www.m
mtm-robotics
s-2016.igm..rwth-aache
en.de/
15
Forthcoming Events
16
Forthhcomingg Eventss
17
Forthcoming Events
18
EdEdEd
A
ditorial Boaditor-in-Chieditorial Mem
RecurDsolutionsfirst Multlinear finparadigm Today, RdisciplinaOptimiza
Advertis
ard ef: Prof. S
mbers: Prof. SDr. R.
Prof. RProf. S
Dyn, bases. Startingi-Flexible
nite elemem in the fie
RecurDyary CAE ation, all in
sement
Santanu Das,Shankar SehgRanganath, SRanjit KumarShital S. Chid
ed on mug with justBody Dyn
ent methoeld of mult
yn continusoftware
n a single
Fun(Co
301 Od
t
Kalyani Govgal, Panjab USpacecraft Mr Barai, Jadavdarwar, VNIT
http://ww
ulti-body dt multi-bonamics (Mods into itti-physics
ues to leathat integframewor
nction Bayontact: B. deon Plaz
New
vernment EnUniversity, ChMechanisms vpur UniversT, Nagpur [Z
ww.functio
dynamics,ody dynamMFBD) to its numeriCAE.
ad the mugrates MFrk.
y Dynam Sridhar -za, II Sectw Delhi 11
gineering Cohandigarh [ZGroup, ISROity, Kolkata [ZVP West]
onbay.co.k
is the CAmics in 20integrate mical integr
ulti-physicFBD, Lub
mics (I) Pv- 98110 6tor, 10, D10075
ollege, Kalyanonal Vice Pre Satellite Cen[ZVP East]
kr
AE softwa004, Recmulti-bodyrator, whi
cs CAE fiebrication, C
vt. Ltd. 8096) waraka,
ni esident (ZVPntre, Bangalo
are for mcurDyn by dynamicich opene
eld by creControl, a
P) North] ore [ZVP Sou
multi-physicbecame thcs and noed the ne
eating inteand Desig
uth]
cs he n-
ew
er-gn