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1 Engineering | April 2010 | © Bosch Sensortec GmbH 2009. All rights reserved, also regarding any disposal, exploitation, reproduction, editing,
distribution, as well as in the event of applications for industrial property rights.
Bosch Sensortec
MicroNanoTec
Forum “Innovations for Industry”
2010 April 19th Hannover, Germany
Oliver Schatz, CTO Bosch Sensortec
MEMS Sensors:
From Automotive
to
CE Applications
2
Forum "Innovations for Industry"
Engineering | April 2010 | © Bosch Sensortec GmbH 2009. All rights reserved, also regarding any disposal, exploitation, reproduction, editing,
distribution, as well as in the event of applications for industrial property rights.
Bosch Sensortec
MEMS Sensors: From Automotive to Consumer Electronic Applications
� Introduction
� Overview technologies
� Function principle and applications of MEMS sensors
� Future trends and applications in Consumer Electronics
� Outlook and summary
3
Forum "Innovations for Industry"
Engineering | April 2010 | © Bosch Sensortec GmbH 2009. All rights reserved, also regarding any disposal, exploitation, reproduction, editing,
distribution, as well as in the event of applications for industrial property rights.
Bosch Sensortec
MEMS Sensor Market
Source: Yole Dévelopement 2008
RF MEMS
Micromirror/-display
Microphone
Gyroscope
Accelerometer
Inkjet head
Pressure sensor
Microfluidics
4
Forum "Innovations for Industry"
Engineering | April 2010 | © Bosch Sensortec GmbH 2009. All rights reserved, also regarding any disposal, exploitation, reproduction, editing,
distribution, as well as in the event of applications for industrial property rights.
Bosch Sensortec
Challenges of MEMS (1/2)� Dedicated processes and equipment
HF vapor etch
Frequency Damping
Sensitivity Capacitance
Frequency Damping
Sensitivity Capacitance
Anodic wafer
bonding
DRIE
� Processes with contamination risks to ICs
� Combined design and control of mechanical and electrical parameters
Source: Semitool Source: Tegal
Source: EVG 1 mm
Anisotropic
etching (KOH)
20 µm20 µm
5
Forum "Innovations for Industry"
Engineering | April 2010 | © Bosch Sensortec GmbH 2009. All rights reserved, also regarding any disposal, exploitation, reproduction, editing,
distribution, as well as in the event of applications for industrial property rights.
Bosch Sensortec
Challenges of MEMS (2/2)� Controlling the influence of mechanical stress in the package
� Testing of physical parameters
� Robustness and media compatibility (e.g. for pressure or flow sensors)
air mass sensor pressure sensor
6
Forum "Innovations for Industry"
Engineering | April 2010 | © Bosch Sensortec GmbH 2009. All rights reserved, also regarding any disposal, exploitation, reproduction, editing,
distribution, as well as in the event of applications for industrial property rights.
Bosch Sensortec
Market drivers for MEMS sensors
Automotive applications
1. high functional requirements
(high accuracy, self test,
advanced safety concepts)
2. high reliability/quality
(15 years, < 1 ppm, extreme
environmental conditions)
3. low price
(< 3 EUR)
Consumer applications
1. small size
(~ 3 x 3 x 0,9 mm³)
2. ultra-low power consumption
(≤ 200 µA)
3. low price
(< 1 EUR)
7
Forum "Innovations for Industry"
Engineering | April 2010 | © Bosch Sensortec GmbH 2009. All rights reserved, also regarding any disposal, exploitation, reproduction, editing,
distribution, as well as in the event of applications for industrial property rights.
Bosch Sensortec
MEMS Sensors: From Automotive to Consumer Electronic Applications
� Introduction
� Overview technologies
� Function principle and applications of MEMS sensors
� Future trends and applications in Consumer Electronics
� Outlook and summary
8
Two fundamental ways doing micromachining
Volume Micromachining
� Building structures through wafer etching
� Structures from mono-crystalline silicon
� Sensor size reduction limited
Surface Micromachining
� Structures generated by applying different layers of
polysilicon
� Good alignment with standardized semiconductor
processes
� Sensor size can be reduced significantly
Surface Micromachining opens up a new world for sensors.
Forum "Innovations for Industry"
Engineering | April 2010 | © Bosch Sensortec GmbH 2009. All rights reserved, also regarding any disposal, exploitation, reproduction, editing,
distribution, as well as in the event of applications for industrial property rights.
Bosch Sensortec
20 µm20 µm
1 mm
9
Forum "Innovations for Industry"
Engineering | April 2010 | © Bosch Sensortec GmbH 2009. All rights reserved, also regarding any disposal, exploitation, reproduction, editing,
distribution, as well as in the event of applications for industrial property rights.
Bosch Sensortec
Bosch-team wins German Future Prize
of the Federal President 2008„Smart Sensors for Consumer Electronics, Industrial
and Medical Technologies“
10
Surface micromachining: Bosch-team develops five new
key technologies for series-production.
� Growth of extremely thick layers of polysilicon
� High-precision and fast deep etching - „Bosch process“
� Gas phase etching for release of the structures
� Encapsulation for hermetical sealing
� APSM process – exact vacuum cavities in silicon
Sensors fulfill requirements of consumer electronics
� Sensors considerably smaller and less expensive
� Sensors with less power consumption
Forum "Innovations for Industry"
Engineering | April 2010 | © Bosch Sensortec GmbH 2009. All rights reserved, also regarding any disposal, exploitation, reproduction, editing,
distribution, as well as in the event of applications for industrial property rights.
Bosch Sensortec
Surface micromachining – the key
Automotive electronics Consumer electronics
11
Surface micromachining: Bosch-team develops five new
key technologies for series-production
� Growth of extremely thick layers of polysilicon.
Surface Micromachining
Forum "Innovations for Industry"
Engineering | April 2010 | © Bosch Sensortec GmbH 2009. All rights reserved, also regarding any disposal, exploitation, reproduction, editing,
distribution, as well as in the event of applications for industrial property rights.
Bosch Sensortec
12
Five Key processes (1/5)
� Growth of extremely thick layers of polysilicon.
Thickness of structures tailor-made.
Forum "Innovations for Industry"
Engineering | April 2010 | © Bosch Sensortec GmbH 2009. All rights reserved, also regarding any disposal, exploitation, reproduction, editing,
distribution, as well as in the event of applications for industrial property rights.
Bosch Sensortec
Silicon
Oxide
Epi-Poly
Epi-Poly
Silicon
Oxide
13
Surface micromachining: Bosch-team develops five new
key technologies for series-production
� Growth of extremely thick layers of polysilicon.
� High-precision and fast deep etching („Bosch process“).
Surface Micromachining
Forum "Innovations for Industry"
Engineering | April 2010 | © Bosch Sensortec GmbH 2009. All rights reserved, also regarding any disposal, exploitation, reproduction, editing,
distribution, as well as in the event of applications for industrial property rights.
Bosch Sensortec
14
Five key processes (2/5)
� High-precision and fast deep etching („Bosch process“).
The base process of surface micromachining worldwide
Forum "Innovations for Industry"
Engineering | April 2010 | © Bosch Sensortec GmbH 2009. All rights reserved, also regarding any disposal, exploitation, reproduction, editing,
distribution, as well as in the event of applications for industrial property rights.
Bosch Sensortec
15
Forum "Innovations for Industry"
Engineering | April 2010 | © Bosch Sensortec GmbH 2009. All rights reserved, also regarding any disposal, exploitation, reproduction, editing,
distribution, as well as in the event of applications for industrial property rights.
Bosch Sensortec
DRIE – The “BOSCH process”
� Deep RIE of silicon trenches
� Licensed to many companies worldwide
� “European Inventor of the Year 2007” Andrea Urban and Dr. Franz Lärmer
16 Engineering | April 2010 | © Bosch Sensortec GmbH 2009. All rights reserved, also regarding any disposal, exploitation, reproduction, editing,
distribution, as well as in the event of applications for industrial property rights.
DRIE – the BOSCH process
Forum "Innovations for Industry"
Bosch Sensortec
� Deep RIE of silicon trenches
� Alternating etch- (SF6) and
passivation cycles (C4F8)
� High aspect ratio ( >>10:1 )
� High anisotropy
(underetch <<2 % of etch depth)
� High etch rate
17
Surface micromachining: Bosch-team develops five new
key technologies for series-production
� Growth of extremely thick layers of polysilicon.
� High-precision and fast deep etching („Bosch process“).
� Gas phase etching for release of the structures.
Surface Micromachining
Forum "Innovations for Industry"
Engineering | April 2010 | © Bosch Sensortec GmbH 2009. All rights reserved, also regarding any disposal, exploitation, reproduction, editing,
distribution, as well as in the event of applications for industrial property rights.
Bosch Sensortec
18
Five Key Processes (3/5)
� Gas phase etching for release of the structures.
Forum "Innovations for Industry"
Engineering | April 2010 | © Bosch Sensortec GmbH 2009. All rights reserved, also regarding any disposal, exploitation, reproduction, editing,
distribution, as well as in the event of applications for industrial property rights.
Bosch Sensortec
With this process the structures become movable.
19
Surface micromachining: Bosch-team develops five new
key technologies for series-production
� Growth of extremely thick layers of polysilicon.
� High-precision and fast deep etching („Bosch process“).
� Gas phase etching for release of the structures.
� Encapsulation for hermetical sealing.
Surface Micromachining
Forum "Innovations for Industry"
Engineering | April 2010 | © Bosch Sensortec GmbH 2009. All rights reserved, also regarding any disposal, exploitation, reproduction, editing,
distribution, as well as in the event of applications for industrial property rights.
Bosch Sensortec
20
Five Key Processes (4/5)
� Encapsulation for hermetical sealing
Forum "Innovations for Industry"
Engineering | April 2010 | © Bosch Sensortec GmbH 2009. All rights reserved, also regarding any disposal, exploitation, reproduction, editing,
distribution, as well as in the event of applications for industrial property rights.
Bosch Sensortec
cap
acceleration sensor
Construction of compact elements
21
Surface micromachining: Bosch-team develops five new
key technologies for series-production
� Growth of extremely thick layers of polysilicon.
� High-precision and fast deep etching („Bosch process“).
� Gas phase etching for release of the structures.
� Encapsulation for hermetical sealing.
� APSM process – exact vacuum cavities in silicon.
Surface Micromachining
Forum "Innovations for Industry"
Engineering | April 2010 | © Bosch Sensortec GmbH 2009. All rights reserved, also regarding any disposal, exploitation, reproduction, editing,
distribution, as well as in the event of applications for industrial property rights.
Bosch Sensortec
22
Five Key Processes (5/5)
� APSM process – exact vacuum cavities in silicon
The core of „ASPM process“ is porous silicon
Forum "Innovations for Industry"
Engineering | April 2010 | © Bosch Sensortec GmbH 2009. All rights reserved, also regarding any disposal, exploitation, reproduction, editing,
distribution, as well as in the event of applications for industrial property rights.
Bosch Sensortec
cavity
23
Forum "Innovations for Industry"
Engineering | April 2010 | © Bosch Sensortec GmbH 2009. All rights reserved, also regarding any disposal, exploitation, reproduction, editing,
distribution, as well as in the event of applications for industrial property rights.
Bosch Sensortec
APSM technology advantages
New surface micromachining technique
� Reduced size: bond frames not necessary
� Fabrication of monocrystalline Si membranes
� Full flexibility with size and shape of the membrane
CMOS compatible process
� High synergy between MEMS and ASIC
� No process media that are difficult for a CMOS fab
� Fully integrated process flow in a CMOS wafer fab
� Integrated pressure sensor
24
Surface micromachining: Bosch-team develops five new
key technologies for series-production
� Growth of extremely thick layers of polysilicon.
� High-precision and fast deep etching („Bosch process“).
� Gas phase etching for release of the structures.
� Encapsulation for hermetical sealing.
� APSM process – exact vacuum cavities in silicon.
Surface Micromachining
Forum "Innovations for Industry"
Engineering | April 2010 | © Bosch Sensortec GmbH 2009. All rights reserved, also regarding any disposal, exploitation, reproduction, editing,
distribution, as well as in the event of applications for industrial property rights.
Bosch Sensortec
25
Forum "Innovations for Industry"
Engineering | April 2010 | © Bosch Sensortec GmbH 2009. All rights reserved, also regarding any disposal, exploitation, reproduction, editing,
distribution, as well as in the event of applications for industrial property rights.
Bosch Sensortec
MEMS Sensors: From Automotive to Consumer Electronic Applications
� Introduction
� Overview technologies
� Function principle and applications of MEMS sensors
� Future trends and applications in Consumer Electronics
� Outlook and summary
26
Movable structures…
� … to measure acceleration and tilt
Forum "Innovations for Industry"
Engineering | April 2010 | © Bosch Sensortec GmbH 2009. All rights reserved, also regarding any disposal, exploitation, reproduction, editing,
distribution, as well as in the event of applications for industrial property rights.
Bosch Sensortec
Acceleration sensor
27
Forum "Innovations for Industry"
Engineering | April 2010 | © Bosch Sensortec GmbH 2009. All rights reserved, also regarding any disposal, exploitation, reproduction, editing,
distribution, as well as in the event of applications for industrial property rights.
Bosch Sensortec
MEMS sensors – automotive applications� Airbag Systems
� Acceleration sensors for occupant protection
� Engine Management
� Pressure sensors for engine management
� Vehicle Dynamics Control (VDC)
� Acceleration and angular rate sensors for VDC
� Driver Information
� Angular rate sensor for navigation systems
28
Movable structures…
� … to measure angular velocity
Forum "Innovations for Industry"
Engineering | April 2010 | © Bosch Sensortec GmbH 2009. All rights reserved, also regarding any disposal, exploitation, reproduction, editing,
distribution, as well as in the event of applications for industrial property rights.
Bosch Sensortec
30
Movable structures…
� … to measure pressure
Forum "Innovations for Industry"
Engineering | April 2010 | © Bosch Sensortec GmbH 2009. All rights reserved, also regarding any disposal, exploitation, reproduction, editing,
distribution, as well as in the event of applications for industrial property rights.
Bosch Sensortec
membrane
31
Automobile applications
e.g. Motor management
� Highest accuracy over temperature and lifetime
� Integrated, single chip solution
� stable single-crystalline membrane
� Diagnosis capability
� Small SMD package
Forum "Innovations for Industry"
Engineering | April 2010 | © Bosch Sensortec GmbH 2009. All rights reserved, also regarding any disposal, exploitation, reproduction, editing,
distribution, as well as in the event of applications for industrial property rights.
Bosch Sensortec
new
(APSM)
old
(KOH)
Consumer electronics applications
e.g. Altitude measurement
� High absolute accuracy
� Extremely high precision
� Very small, robust LCC8 ceramic package
� Ultra-low current consumption
� Digital I2C interface
Pressure sensors for automotive and CE applications
32
Forum "Innovations for Industry"
Engineering | April 2010 | © Bosch Sensortec GmbH 2009. All rights reserved, also regarding any disposal, exploitation, reproduction, editing,
distribution, as well as in the event of applications for industrial property rights.
Bosch Sensortec
MEMS Sensors: From Automotive to Consumer Electronic Applications
� Introduction
� Overview technologies
� Function principle and applications of MEMS sensors
� Future trends and applications in Consumer Electronics
� Outlook and summary
33
…the key for versatile new applications
� Sensors considerably smaller
� Sensors with much less power consumption
� Sensors less expensive
� Sensors fulfil the requirements of
consumer electronics
Surface Micromachining…
Forum "Innovations for Industry"
Engineering | April 2010 | © Bosch Sensortec GmbH 2009. All rights reserved, also regarding any disposal, exploitation, reproduction, editing,
distribution, as well as in the event of applications for industrial property rights.
Bosch Sensortec
34
Forum "Innovations for Industry"
Engineering | April 2010 | © Bosch Sensortec GmbH 2009. All rights reserved, also regarding any disposal, exploitation, reproduction, editing,
distribution, as well as in the event of applications for industrial property rights.
Bosch Sensortec
Evolution of requirements (1/2)
Packages of acceleration sensors
PLCC28
(Automotive)
1996
SOIC16w
(Automotive)
2002
4x4 LGA
(CE)
2006
SOIC14n
(Automotive)
2006
3x3 QFN
(CE)
2007
2x2 LGA
(CE)
2010
35
Forum "Innovations for Industry"
Engineering | April 2010 | © Bosch Sensortec GmbH 2009. All rights reserved, also regarding any disposal, exploitation, reproduction, editing,
distribution, as well as in the event of applications for industrial property rights.
Bosch Sensortec
Evolution of requirements (2/2)
Packages acceleration sensors
0
20
40
60
80
100
120
140
1995 2000 2005 2010
Pa
cka
ge
fo
otp
rin
t (m
m²)
Automotive
CE
36
Forum "Innovations for Industry"
Engineering | April 2010 | © Bosch Sensortec GmbH 2009. All rights reserved, also regarding any disposal, exploitation, reproduction, editing,
distribution, as well as in the event of applications for industrial property rights.
Bosch Sensortec
MEMS sensors – the senses for mobile devices
� Mobile phones, PDAs
� Intuitive menu input through
motion and position change
� Gaming and toys
� New gaming experience through motion interaction
� Mobile computing
� Data protection by free-fall detection
� Sports and fitness
� Monitoring through step-counting and altimetry
37
Forum "Innovations for Industry"
Engineering | April 2010 | © Bosch Sensortec GmbH 2009. All rights reserved, also regarding any disposal, exploitation, reproduction, editing,
distribution, as well as in the event of applications for industrial property rights.
Bosch Sensortec
Use cases for MEMS sensors in mobile phones
User Interface
• Tap control
• Gaming input
• Menu navigation
Position Detection
• Upside down
• Portrait / landscape
Pedestrian navigation
• Speed & distance estimation
• Altitude detection
• Location based services
Motion Detection
• Step counting
• Activity monitoring
• Power management
38
Forum "Innovations for Industry"
Engineering | April 2010 | © Bosch Sensortec GmbH 2009. All rights reserved, also regarding any disposal, exploitation, reproduction, editing,
distribution, as well as in the event of applications for industrial property rights.
Bosch Sensortec
MEMS Sensors: From Automotive to Consumer Electronic Applications
� Introduction
� Overview technologies
� Function principle and applications of MEMS sensors
� Future trends and applications in Consumer Electronics
� Outlook and summary
39
Forum "Innovations for Industry"
Engineering | April 2010 | © Bosch Sensortec GmbH 2009. All rights reserved, also regarding any disposal, exploitation, reproduction, editing,
distribution, as well as in the event of applications for industrial property rights.
Bosch Sensortec
Bosch – leading the market in MEMS sensors
0
50
100
150
200
250
300
350
400
450
500
RO
BER
T BO
SC
H
STM
ICR
OELE
CTR
ON
ICS
FRE
ESC
ALE
DEN
SO
AN
ALO
G D
EVIC
ES
INFIN
EON
(inc
l.Sen
sono
r)S
ENS
ATAP
ANA
SON
IC
SC
HN
EID
ER
ELE
CTR
IC
KN
OW
LES
AC
OU
STICS
Sa
les
(M
$)
Source: iSupply estimation, 2008
revenues for TOP50 MEMS
suppliers, shown here: TOP10
MEMS sensor suppliers
Fo
un
dry
40
Forum "Innovations for Industry"
Engineering | April 2010 | © Bosch Sensortec GmbH 2009. All rights reserved, also regarding any disposal, exploitation, reproduction, editing,
distribution, as well as in the event of applications for industrial property rights.
Bosch Sensortec
1 billion MEMS sensors produced*
0
500
1000
1995 1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008
Ac
cu
mu
late
d p
rod
uc
tio
n v
olu
me
(m
io.)
*Bosch total MEMS production (automotive and consumer)
41
Forum "Innovations for Industry"
Engineering | April 2010 | © Bosch Sensortec GmbH 2009. All rights reserved, also regarding any disposal, exploitation, reproduction, editing,
distribution, as well as in the event of applications for industrial property rights.
Bosch Sensortec
Future of MEMS
� New applications are arising
MEMS autofocus
Micromirror for microprojection systems
Source: Microvision
Source: SiimpelSource: IMEC
Energy Harvester
Source: STM, CEA
Micro Fuel Cell
42
Forum "Innovations for Industry"
Engineering | April 2010 | © Bosch Sensortec GmbH 2009. All rights reserved, also regarding any disposal, exploitation, reproduction, editing,
distribution, as well as in the event of applications for industrial property rights.
Bosch Sensortec
Summary
Automotive
� MEMS is main driver for sensor development
� Permanent enhancements of MEMS technology enables
miniaturization of components and new functions
� Continuous development of new device generations
Consumer electronics
� MEMS is enabling technology for new functions in CE
� Key factors: size, power consumption, price
� In future large variety of new applications in many areas
43
Forum "Innovations for Industry"
Engineering | April 2010 | © Bosch Sensortec GmbH 2009. All rights reserved, also regarding any disposal, exploitation, reproduction, editing,
distribution, as well as in the event of applications for industrial property rights.
Bosch Sensortec
Thank you for your attention!