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MEMS-Based Systems Solutions
Review and Overview
with a
Focus on Current and Emerging Applications
Roger Grace
Roger Grace Associates
Microtech 2011
June 16, 2011
Boston, Massachusetts
Outline• Definition
• Functional Requirements
• Situational Analysis
• Commercialization Report Card
• Drivers for Adoption
• Research Methodology
• Case Studies
• Critical Success Factors
• Commercialization Opportunities
• Summary and Conclusions
Attention
This is a business strategy/commercialization/ applications
presentation that has been created to validate that there are great
opportunities to create wealth and serve society vis-à-vis MEMS-
Based Systems Solutions/Smart Systems Integration NOW.
Carpe diem!!!!
Roger Grace Associates Overview• Founded in 1982,a pioneer in the MEMS strategic marketing and analysis
sector
• Clients include the “who’s who” of industrial and government organizations
worldwide
• Headquartered in Naples, Florida/ San Francisco, California
• Focus on MEMS/Semiconductors and Capital Equipment
• Capabilities include
– Custom market research
– Market strategy development
– M&A due diligence
– Integrated marketing communications
• Promotion
• Positioning and Branding
• New product launches
Definition• Traditional “MEMS” and “MST” are not typically systems…they are
in fact devices
• “MEMS-Based System Solutions” (MBSS) are an integration of
MEMS-based sensors/actuators/structures with other functionalities
e.g. signal processing, networking delivered in a package and
optimized for a customer application/solution “(R. Grace)
MEMS-Based Systems Solutions
MEMS FRONT
END
•Sensor(s)
•Actuator(s)
•Structure(s)
SIGNAL
CONDITIONING
ELECTRONICS
•ASICs
•DSP
•Microcontroller
POWER/CONTROL
ELECTRONICS
•Energy Harvesting
•Battery
BACK END
•COMMUNICATIONS
ELECTRONICS
•Wireless
•Non-wireless
•Networked
Design for Manufacturing and Test
Co-Design
Systems Engineering
FUNCTIONS
DESIGN
PRINCIPLES
PACKAGING/INTERCONNECTS
Monolithic/Heterogeneous
MEMS-Based System Solutions
MEMS FRONT
END
•Sensor(s)
•Actuator(s)
•Structure(s)
SIGNAL
CONDITIONING
ELECTRONICS
•ASICs
•DSP
•Microcontroller
FUNCTIONS
Monolithic/Heterogeneous
MEMS-Based System Solutions
MEMS FRONT
END
•Sensor(s)
•Actuator(s)
•Structure(s)
SIGNAL
CONDITIONING
ELECTRONICS
•ASICs
•DSP
•Microcontroller
POWER/CONTROL
ELECTRONICS
•Energy Harvesting
•BatteryFUNCTIONS
Monolithic/Heterogeneous
MEMS-Based System Solutions
MEMS FRONT
END
•Sensor(s)
•Actuator(s)
•Structure(s)
SIGNAL
CONDITIONING
ELECTRONICS
•ASICs
•DSP
•Microcontroller
POWER/CONTROL
ELECTRONICS
•Energy Harvesting
•Battery
BACK END
•COMMUNICATIONS
ELECTRONICS
•Wireless
•Non-wireless
•Networked
FUNCTIONS
Monolithic/Heterogeneous
MEMS-Based System Solutions
MEMS FRONT
END
•Sensor(s)
•Actuator(s)
•Structure(s)
SIGNAL
CONDITIONING
ELECTRONICS
•ASICs
•DSP
•Microcontroller
POWER/CONTROL
ELECTRONICS
•Energy Harvesting
•Battery
BACK END
•COMMUNICATIONS
ELECTRONICS
•Wireless
•Non-wireless
•Networked
FUNCTIONS
PACKAGING/INTERCONNECTS
Monolithic/Heterogeneous
MEMS-Based System Solutions
MEMS FRONT
END
•Sensor(s)
•Actuator(s)
•Structure(s)
SIGNAL
CONDITIONING
ELECTRONICS
•ASICs
•DSP
•Microcontroller
POWER/CONTROL
ELECTRONICS
•Energy Harvesting
•Battery
BACK END
•COMMUNICATIONS
ELECTRONICS
•Wireless
•Non-wireless
•Networked
Systems Engineering
FUNCTIONS
DESIGN
PRINCIPLES
PACKAGING/INTERCONNECTS
Monolithic/Heterogeneous
MEMS-Based System Solutions
MEMS FRONT
END
•Sensor(s)
•Actuator(s)
•Structure(s)
SIGNAL
CONDITIONING
ELECTRONICS
•ASICs
•DSP
•Microcontroller
POWER/CONTROL
ELECTRONICS
•Energy Harvesting
•Battery
BACK END
•COMMUNICATIONS
ELECTRONICS
•Wireless
•Non-wireless
•Networked
Co-Design
Systems Engineering
FUNCTIONS
DESIGN
PRINCIPLES
PACKAGING/INTERCONNECTS
Monolithic/Heterogeneous
MEMS-Based System Solutions
MEMS FRONT
END
•Sensor(s)
•Actuator(s)
•Structure(s)
SIGNAL
CONDITIONING
ELECTRONICS
•ASICs
•DSP
•Microcontroller
POWER/CONTROL
ELECTRONICS
•Energy Harvesting
•Battery
BACK END
•COMMUNICATIONS
ELECTRONICS
•Wireless
•Non-wireless
•Networked
Design for Manufacturing and Test
Co-Design
Systems Engineering
FUNCTIONS
DESIGN
PRINCIPLES
PACKAGING/INTERCONNECTS
Monolithic/Heterogeneous
SUBJECT 98 99 00 01 02 03 04 05 06 07 08 09 10
R&D A A A A A A- A- A- A- A- B+ B
Marketing C- C C+ C+ C+ C C C+ C+ C+ C+ C
Market Research C B- B- B- B B B+ B- B B B B+
Design For Manufacturing C+ B- B B B B B C+ B- B B+ A-
Established Infrastructure C+ B B+ A A A A A- A- A- B+ B+
Industry Association INC INC INC B B+ B+ B+ B B B+ B B
Standards INC INC INC INC C B- B- B- C+ C C C
Management Expertise C C C+ C+ C+ C+ C+ B- B- B B B
Venture Capital Attraction C B- B+ A C C- C C+ C+ C C- D
Creation Of Wealth C B- B+ A C C- C- C- C- C C- D+
Industry Roadmap N/A B- B B+ A- A A B B- C+ C- C-
Profitability C- C- C- C- C- C- C- C C+ C C- D+
Employment INC INC INC INC INC C C C+ C+ C+ C C-
Cluster Development INC INC INC INC INC B B+ B+ B B- C+ C+
Overall Grade B B B- B- C+ C+
MEMS COMMERCIALIZATION REPORT CARD
SUBJECT 98 99 00 01 02 03 04 05 06 07 08 09 10
R&D A A A A A A- A- A- A- A- B+ B
Marketing C- C C+ C+ C+ C C C+ C+ C+ C+ C
Market Research C B- B- B- B B B+ B- B B B B+
Design For Manufacturing C+ B- B B B B B C+ B- B B+ A-
Established Infrastructure C+ B B+ A A A A A- A- A- B+ B+
Industry Association INC INC INC B B+ B+ B+ B B B+ B B
Standards INC INC INC INC C B- B- B- C+ C C C
Management Expertise C C C+ C+ C+ C+ C+ B- B- B B B
Venture Capital Attraction C B- B+ A C C- C C+ C+ C C- D
Creation Of Wealth C B- B+ A C C- C- C- C- C C- D+
Industry Roadmap N/A B- B B+ A- A A B B- C+ C- C-
Profitability C- C- C- C- C- C- C- C C+ C C- D+
Employment INC INC INC INC INC C C C+ C+ C+ C C-
Cluster Development INC INC INC INC INC B B+ B+ B B- C+ C+
Overall Grade B B B- B- C+ C+
MEMS COMMERCIALIZATION REPORT CARD
SUBJECT 98 99 00 01 02 03 04 05 06 07 08 09 10
R&D A A A A A A- A- A- A- A- B+ B
Marketing C- C C+ C+ C+ C C C+ C+ C+ C+ C
Market Research C B- B- B- B B B+ B- B B B B+
Design For Manufacturing C+ B- B B B B B C+ B- B B+ A-
Established Infrastructure C+ B B+ A A A A A- A- A- B+ B+
Industry Association INC INC INC B B+ B+ B+ B B B+ B B
Standards INC INC INC INC C B- B- B- C+ C C C
Management Expertise C C C+ C+ C+ C+ C+ B- B- B B B
Venture Capital Attraction C B- B+ A C C- C C+ C+ C C- D
Creation Of Wealth C B- B+ A C C- C- C- C- C C- D+
Industry Roadmap N/A B- B B+ A- A A B B- C+ C- C-
Profitability C- C- C- C- C- C- C- C C+ C C- D+
Employment INC INC INC INC INC C C C+ C+ C+ C C-
Cluster Development INC INC INC INC INC B B+ B+ B B- C+ C+
Overall Grade B B B- B- C+ C+
MEMS COMMERCIALIZATION REPORT CARD
SUBJECT 98 99 00 01 02 03 04 05 06 07 08 09 10
R&D A A A A A A- A- A- A- A- B+ B
Marketing C- C C+ C+ C+ C C C+ C+ C+ C+ C
Market Research C B- B- B- B B B+ B- B B B B+
Design For Manufacturing C+ B- B B B B B C+ B- B B+ A-
Established Infrastructure C+ B B+ A A A A A- A- A- B+ B+
Industry Association INC INC INC B B+ B+ B+ B B B+ B B
Standards INC INC INC INC C B- B- B- C+ C C C
Management Expertise C C C+ C+ C+ C+ C+ B- B- B B B
Venture Capital Attraction C B- B+ A C C- C C+ C+ C C- D
Creation Of Wealth C B- B+ A C C- C- C- C- C C- D+
Industry Roadmap N/A B- B B+ A- A A B B- C+ C- C-
Profitability C- C- C- C- C- C- C- C C+ C C- D+
Employment INC INC INC INC INC C C C+ C+ C+ C C-
Cluster Development INC INC INC INC INC B B+ B+ B B- C+ C+
Overall Grade B B B- B- C+ C+
MEMS COMMERCIALIZATION REPORT CARD
Situational Analysis• Design for manufacture and test and infrastructure development are
key elements for the successful commercialization of MBSS
• Both of these “grades” have progress favorably from their 1998
levels
• With the commoditization of many MEMS sensors for autos and
games, companies have learned to optimize their design for high
volume manufacture just to keep competitive (Darwinian)
• There is sufficient infrastructure in place with good history from a
device supplier, signal conditioning supplier, software developers,
wafer foundries and a host of packaging strategies including wafer
scale and chip stacking to create a low barrier to entry for potential
suppliers
• Companies owning unique IP for MEMS devices are realizing that
in-house vertical integration / value add significantly increases profit
margin e.g. HP, Polychromix(Thermo-Fisher)
Drivers for Adoption• Broad availability of commoditized devices
• Novel implementations of unique sensors/actuators/structures
• Need for product differentiation
• Commercial availability of low cost signal conditioning/ processing/
memory…ASICs ,DSPs, Flash, E2PROM
• Evolution of wafer level packaging /TSV/films
• Desire to maximize value added and maximize profit margin
• Continuous price reduction of MBSS components
• Relatively low barrier to entry for prospective suppliers
Research Methodology• In-person and telephone interviews
• Conducted in the November 2009 to August 2010 time frame
including visits to:
– Photonics West-San Francisco California-Jan. 2010
– Pittcon-Orlando, Florida-Feb. 2010
– American Chemical Society-Boston, MA-Aug. 2010
Tire Pressure Monitor• Supplier: Schrader Electronics
• System comprised of custom designed
piezoresistive pressure sensor,
custom design ASIC with
microcontroller core,OTS motion
sensor, RF chip and antenna, Lithium
ion battery on a PC board in a plastic
package mounted in valve stem
• Key specs
– -40 to 125 degree C temp range
– 500-600 r.p.m. rotation
– 1000’s of g’s
– Lifetime of 150,000 mi./ 6-10 yrs.
• First introduced in 1995
• Volume production >40Million units in
2009
Navigation System(AHRS)• Supplier: Crossbow
Technologies, California
• (Outsourced OTS gyros/accels
and custom DSP (Kallman
filtering,flash,E2 memory)
• Significant algorithm
development effort/major
defensible IP
• Custom package minimizes
shock and vibration effects
• Application: Attitude heading
and reference System (AHRS)
for private aircraft
• Introduced in 1995
Gesture Recognition Controller
• Supplier: Movea, California
US/France/China(mfg.)
• Founded in 1989 as Gyration
• Outsources OTS. 3-axis gyros, 3-
axis ,accelerometers ,ASICs,
microcontrollers
• Market sectors served:– Sports and fitness( “virtual coach” for
swimming, running, yoga)
– Healthcare and wellness (range of
motion analyzer)
– Consumer pointing (computer mice, TV
controllers
– “65 market sectors for pointing
products”
Human-Machine Interface Device• Supplier: Hillcrest Labs,
Maryland US
• Outsourced OTS 3- axis
accelerometers,1/2 axis
gyros,32- bit DSP and other
ICs
• In-house proprietary
algorithm development
• Board size 0.9 x 0.9 in.
• Full production in 2004
• Applications include hand-
held air pointing cursor
control for TVs and games
Toy• Supplier: MEMSIC,
Massachusetts US
• In-house monolithic thermally
activated two-axis
accel,amplifier,A/D
converter,heater control
circuit,temp. comp.,trimming
fuse,and I2C digital interface
• OTS microcontroller with
programmable interface and
memory, battery, LEDs, plastic
wand package
• Strong co-design effort
• Featured at 2008 Olympics
Micro Gas Chromatograph
SAW LIGA-GC PP-PC
BYPASS SAW
SAMPLE IN
OUT TO PUMP
2-WAY
VALVE
• Supplier: Defiant Systems,
New Mexico ,US
• In-house development of
critical components…collector,
column , SAW detector
• Key specs:
• Size 5.25x7.5x2.25 in.
• Weight 1.6 lbs.
• Battery life 4 hrs /9v
• RS 232 interface
• Applications include nerve
agent detection, pesticide
detection, EPA regulatory
monitoring
• Status: in devel./early proto.
Micro Gas Chromatograph• Supplier: University of
Michigan-Wireless Integrated
Microsystems Center (WIMS),
Michigan ,US
• Part of NSF/ERC Center
founded in 2000
• Platform strategy features low
loss ASICs and wireless IC
• Applications include
environmental monitoring,
homeland security, food
processing, bio markers
• Expected to reach
commercialization by 2015
Inertial Measurement Unit (IMU)• Supplier: MilliSensor Systems and
Actuators, Massachusetts USA
• Monolithic IMU with six
accelerometers(two accelerometers
per axis) and three gyros(each with a
single degree of freedom)
• Measures six degrees of freedom
• Gyro bias stability:20-100 degree/hr.
• Accelerometer bias stability: 0.5-1.0
mg
• Application focus currently is for
military guidance and navigation
systems
• Currently under development
Seismic Platform• Supplier: HP, California/Oregon ,US
• In-house design of high performance two-
axis accelerometer, battery, power
management chip,
microcontroller,memory, wireless
chip,housing/package…”measurement
engine”
• Key specs:
– < 50 mw./axis power
– < 100 ng /square root hertz
– >130 dB dynamic range
– 0-250 Hz BW
– 7 mm. x 7 mm. die/package
• Current application massive distributed
sensing array for land-based oil and gas
exploration (Shell),future applications
include structural and machine health
condition monitoring
H.P. – Shell Oil/Gas Exploration
MEMS
Accelerometer
Chip
Node
Wireless Mesh Network
System Development and Management
“In-Field” Data Storage
Imaging and Printing Group
Pro curve
Enterprise Business
FTIR Spectrometer• Supplier: Block Engineering
• Hand-held Fourier-Transform
• Spectrometer..”Chem Pen”
• Uses Sandia National Labs
SUMMiT V process for the
MEMS
• Currently funded through DOD
R$D…$6 M US
• Projected availability in 2013
• Large volume pricing of $1000
• Applications include chemical
warfare agent detection,
environmental monitoring,
hazardous materials analysis
Micro Gas Chromatograph• Supplier: Thermo-Fisher
(formerly c2v..Netherlands)
• MEMS engine
• Introduced 2009
• Applications include process
control petrochemical analysis
• Currently part of a rack
mounted solution with plans for
miniaturization to a hand held
instrument
NIR Spectrometer• Supplier: Thermo-Fisher
Scientific (formerly
Polychromix)
• MEMS engine license from
MIT
• Sandia National Laboratory
license of SUMMiT IV process
• Introduced Fall 2009
• Totally self contained hand-
held measurement system
including display, power
supply, application algorithms,
• Selling price of $15 K to $20 K
NIR Spectrometer• OEM Spectrometer Engine and
Anavo Portable NIR Analyzer
• System consists of a tunable
laser based spectrometer,
integrated wavelength and
amplitude reference, extended
range photodetector, and control
and processing electronics
– Portable NIR system also
includes a diffuse reflectance
sample interface and LCD screen
with on board libraries for
Qualitative ID or Quantitative
measurement
• Key Specifications
– SNR of 5500:1
– 3cm-1 Resolution
– Millisecond measurement speed
– 1300-1800nm Wavelength range
34Courtesy Axsun Technologies
Telecom Optical Channel Monitor• MEMs Tunable Compact Optical
Spectrum Analyzer (OSA)
• System consists of a tunable Filter
with integrated Photodiode and
Wavelength Reference, and control
and processing electronics
– Scans through Dense Wavelength
Division Multiplexed Laser Channels
and reports Optical Power,
Wavelength and SNR
• Key Specifications
– Covers C or L Bands or 1 module
covers C+L (1520-1610nm)
– High Spectral Resolution (< 1pm)
and Dynamic Range (30dB)
– Compatible with 10Gb/s, 40Gb/s
and 100Gb/s and advanced
modulation techniques
– 25 Year Life
• More than 30,000 shipped
– > 400 Million device hours of
operation35
Courtesy Axsun Technologies
Wireless Sensor Node for Structural
Analysis• Investigator: Univ.of Michigan
(Prof. Gerry Lynch)
• Supported by US NIST for
bridges and DOD for structural
ship hull monitoring
• Current implementation uses
off the shelf accelerometers
and strain gages
• Currently deployed on many
bridges in the US and US
Navy ship
• Research areas include chip
stacking, energy harvestesr,
low loss CMOS circuitry and
wireless transmitters
Swept Laser Engines for Optical Imaging• OEM Tunable Laser Engines for
Optical Coherence Tomography
(OCT)
• System consists of a wide band
tunable laser, Interferometer and
Balanced Detection, with
Associated Control, Processing and
high-speed Data Acquisition
Electronics
• Key Specifications
– SNR of 105 dB
– 100nm Tuning Range
– 1310nm or 1060nm Wavelength
– Up to 100kHz tuning speed
– Long coherence length for deep
imaging
• Applications in Ocular imaging,
Coronary Artery imaging, Cancer
Detection, Endoscopy, etc.
37
Swept
Laser5
95
Delay
50/50
K-Clock
(to DAQ)
Interferometer
signal (to DAQ)
From Sample Arm
From Ref. Arm
Sweep Trigger
(to DAQ)
Laser Output
50/5050/50
From power
tap
Optional Safety
Shutdown Circuit
Axsun Swept Source OCT Engine
Balanced
Detector
OCT Retina Image OCT Anterior Chamber Image
Lens
Iris
Cornea
Courtesy Axsun Technologies
Leverage Analysis Company Product MEMS
Device
Device
Cost
Solution
Cost (BOM)
Selling
Price
Leverage
Ratio
H.P. Seismic
Sensor
Accel. $60. N/A N/A Immense!!!
Thermo-
Fisher
NIR
Spectro
meter
Optical
mirror
$100 $1350 $17,000 170:1
Thermo-
Fisher
Micro GC Microfluidic
chip
$150 $1500 $25,000 166:1
Axsun NIR Spectro
meter
Optical
mirror
$135 $1700 $16,000 118:1
Hillcrest
Labs
Motion
analyzer
Accels.
Gyros
$10 $25 $75 7.5
Business Case• Many MEMS/MST devices have become commoditized over the
past couple of years…accelerometers, microphones, pressure
sensors
• Smart Systems Solutions offers a “way out” of this fighting for
market share and continuously declining prices and gross margin
• Value added to the basic front end vis-à-vis
intelligence/communication/packaging is a solution
RECENT / CURRENT DEALS
Company
Acquired
Product Acquiring
Company
Acquisition Price Date
Polychromix FT-IR Spectrometer Thermo Fisher $28 million Q-2,2010
c2v Microfluidic
Chromatograph
Thermo Fisher Undisclosed Q-1,2010
AMS MEMS Foundry Plures Technologies Undisclosed Q-4, 2010
Jyve Location and activity –
based solutions
Fairchild
Semiconductor
Undisclosed Q-4, 2010
Verreon Glass-based technologies
/ displays
Qualcom $5 million Q-2, 2010
Crossbow MEMSIC MEMS Modules $18 million Q-4, 2009
Kionix Rohm Accelerometers Undisclosed Q-4, 2009
Silicon Clocks Silicon Labs Oscillators Undisclosed Q-2, 2010
Akustica Microphones Bosch Undisclosed Q-3, 2009
HandyLabs Microfluidic Systems Becton Dickinson Undisclosed Q-4, 2009
DEAL STRATEGY
• The big question….Go IPO???? or sell to strategic partner????
• Predominance of acquisition approach over IPO in past
• Limited number of IPO’s to date– MEMSIC
– MEMSCAP (France)
– Microvision
• Acquired companies get 3.0-3.5 X multiple on sales (typically)…e.g.
Ahura/Thermo Fisher
• However companies have been acquired pre-revenue…e.g. Verreon
• Are we seeing another “feeding frenzy” on acquiring companies who can
support the portable electronics business similar to the optical telecom
scenario????
• Next possible deal…Invensense?
PROGNOSTICATIONS
(next 12 months)
• Venture capital will continue to be elusive:
– Worldwide economic status remains uncertain
– Limited number of new startups
– Possible failure to fund advanced rounds
– Industrial funding partners will continue to make strategic
investments/acquisitions…e.g. CardioMEMS …keep your eyes and ears tuned
for some other upcoming news!
– Limited number of IPOs…e.g. Invensense…will it go?
• Recent increased M&A activity e.g. Kionix, Akustica, LV Sensors, Sunion, Miradia,
HandyLabs, Polychromix, c2v, TI / Attleboro MA, …??????
• 2011 market to grow at 17-19 % over 2010 (sales)
• Continued participation of traditional semi players in the market
• Wafer scale packaging/chip stacking and TSV continue their widespread adoption
• Higher value added/systems solution approach adoption
– Establish product differentiation/competitive advantage
– Minimize commoditization
Critical Success Factors
• Availability of commoditized front ends e.g. inertial sensors
• Creation of enabling MEMS devices e.g. Micro GC, Micro LC,
Spectrometers
• Selection of the right ASIC/DSP partner
• Software/algorithm application development expertise
• Adoption of Co-Design principles
• Packaging/connectivity and test expertise
• Adopt lessons learned from successful implementations e.g.
Polychromix,C2V (both recently acquired by Thermo
Fisher))…”those that forget the past are condemned to relive
it”…George Santayana, Age of Reason (1916-1918)
• and most importantly…”think outside the chip”
Summary and Conclusions• Much excellent work has been done in the R&D labs on integration, especially
monolithic functionality
• The commoditization of MEMS e.g. inertial and pressure sensors has enabled
system solutions in a variety of high volume consumer products
• The emergence of low cost integration of smart systems in the photonics and
microfluidics sectors will enable a new set of industrial, medical and consumer
applications
• There are currently numerous and significant success stories to establish the
feasibility of the proposed business models
– Commoditized front ends with proprietary software and packaging
– Enabling front ends integrated into systems and packages
• We expect to see a proliferation of the “systems solutions” approach in the
immediate future since they bring numerous benefits to their users including:
enhanced robustness and faster time to market while providing the suppliers with
extended leverage of their technology and higher product differentiation and
maximized gross margins.
• Think “blue ocean” versus “red ocean” strategies
Critical Success Factors
• Availability of commoditized front ends e.g. inertial sensors
• Creation of enabling MEMS devices e.g. Micro GC, Micro LC,
Spectrometers
• Selection of the right ASIC/DSP partner
• Software development expertise
• Adoption of Co-Design principles
• Packaging/connectivity and test expertise
• Adopt lessons learned from successful implementations e.g.
Polychromix,C2V…”those that forget the past are condemned to
relive it”…George Santayana, Age of Reason (1916-1918)
• and most importantly…”think outside the chip”
Commercialization Opportunities
• Point of care diagnostics(bio/inertial)
• Portable micro analytical systems(chem/bio)
– Environmental monitoring
– In-situ process control and monitoring
– Homeland security/military threat monitoring
– “Non-lab” medical analysis
• Wireless autonomous systems (inertial/temp./pressure)
– Structural/machine health monitoring
• Navigation/guidance/motion(inertial)
– Smart munitions
– Toys/games
– Medical
Summary and Conclusions• Much excellent work has been done in the R&D labs on integration, especially
monolithic functionality
• The commoditization of MEMS e.g. inertial and pressure sensors has enabled
system solutions in a variety of high volume consumer products
• The emergence of low cost integrated MEMS-based solutions in the photonics and
microfluidics sectors will enable a new set of industrial, medical and consumer
applications
• There are currenntly numerous and significant success stories to establish the
feasibility of the proposed business models
– Commoditized front ends with proprietary software and packaging
– Enabling front ends integrated into systems and packages
• We expect to see a proliferation of the “systems solutions” approach in the
immediate future since they bring numerous benefits to their users including:
enhanced robustness and faster time to market while providing the suppliers with
extended leverage of their technology and higher product differentiation and
maximized gross margins.
References• R. Grace, MEMS/MST Based Systems Solutions:Think Outside the
Chip, ST News, Nov. 2009, www.rgrace.com
• R. Grace, Thinking Outside the Chip: MEMS-Based Systems
Solutions, Small Times, Nov./Dec. 2008, www.rgrace.com
• R. Grace, MEMS Based Systems Solutions: Thinking Outside the
Chip, Euro-Asia Semiconductor, Dec. 2008/Jan. 2009,
www.rgrace.com
• R. Grace, Thinking Outside the Chip for MEMS Design Success,
Electronic Products, Feb. 2010, www.rgrace.com
• R. Grace, Think Outside the Chip, Embedded Systems Design, May
25, 2010, www.rgrace.com
• S. Senturia, MEMS Enabled Products: A Growing Market Segment,
www.polychromix.com
Upcoming Conferences of Interest
MEMS Industry Group (MIG) Executive Congress,
Monterey CA, Nov.2-3, 2011
www.memsindustrygroup.com
Sensor Tech Forum
Boston MA, Oct. 10-12, 2011
www.sensortechfoprum.com
Smart Systems Integration Conference
Zurich Switzerland, March 20-21, 2012
Acknowledgements• Polychromix
• Schrader
• Hillcrest Labs
• HP
• University of Michigan- Wireless Integrated MicroSystems Center
(WIMS)
• MEMSIC
• Movea
• Defiant Technologies
• Fraunhofer Chemnitz ENAS
• Crossbow Technologies
• Integrated Sensing and Systems (ISSYS)
• Millisensor Systems and Actuators (MSSA)
• C2V
• Boston Micromachines
.
• THANK YOU / DANKE / MERCI / HSIEH
HSIEH / SHOKRUN / GRAZIE /
OBRIGADO / EFHARISTOU/GRACIAS