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MC-Line

fl exibilityThe Obducat Microcluster Systems can accommo-date modules like HMDS vapor prime, photoresist deposition, photoresist development, soft bake, hard bake, coolplate, smartEBR, wafer fl ipper, ergonomic wafer load and unload modules.

The confi guration can handle wafers from Ø 2” (50 mm) up to Ø 12” (300 mm) or substrates from 2” x 2” to 9” x 9”.

Automatic Systems

Applications ■ MEMS ■ Packaging ■ LED ■ Compound semiconductor ■ Square substrates ■ Discrete devices ■ smartEBR system for fl at, square

or cleaved edge cleaning

The Obducat Microcluster Systems are designed to meet our customers needs for a clean, reliable, high volume throughput. It is also a cost effective photolithographic processing tool with outstanding fl exibility for different materials and applications.

High fl exibility and ideal confi guration for process and production needs combined with excellent uniformity and process repeatability.

Features ■ Priming (HMDS) ■ Resist deposition

• Closed cover spin coating using our process approved Rotation Covered Chuck Technology (RCCT)

• Open bowl spin coating• Spray coating

■ Developer with spray or puddle nozzle ■ Hotplates up to 450°C & coolplates ■ HMDS (vapor prime) hotplates ■ Wafer fl ip station ■ Simple change of chucks for different substrate sizes ■ 100 % edge handling guaranteed

MC 204MC 204

MC 208

MC-Line

Automatic SystemsThe Obducat Microcluster Systems are designed to meet our customers needs for a clean, reliable, high volume throughput. It is also a cost effective photolithographic processing tool with outstanding fl exibility for different materials and applications.

High fl exibility and ideal confi guration for process and production needs combined with excellent uniformity

components

process modulesCoater module

■ RCCTTM (Rotation Covered Chuck Technology)

■ Brushless digital servo motor

■ Bowl clean assembly

■ Speed up to 3.000 rpm cover closed, 6.000 rpm cover open

■ 100 % edge handling; exclusion zone < 4 mm

■ Single or double side coating

■ No thermal effect on glass substrates

■ EBR nozzle

■ Programmable dispense arm

■ Temperature controlled resist up to point of use

■ Up to 6 different dispense lines

■ Low and high viscosity resist production for best uniformity

■ With thin wafer processing capabilities

Open bowl coater module ■ Brushless digital servo motor

■ Bowl clean assembly

■ Speed up to 10.000 rpm (no load)

■ EBR nozzle

■ Programmable dispense arm

■ Temperature controlled resist up to point of use

■ Up to 6 different dispense lines

■ Wide range of pumps, syringes and CPD system

RCCT coater

Open bowl coater

Developer

Developer module ■ Brushless digital servo motor

■ Speed up to 10.000 rpm (no load)

■ Programmable dispense arm

■ Spray, puddle or fl ood nozzle

■ Temperature controlled media support

■ Solvent or aqueous media

■ Up to 6 different media lines

WFP (Wafer fl ip station) patented

■ Wafer fl ip station to fl ip wafer

■ Module for double side wafer coating

■ Programmable speed

■ Sensor controlled

■ For different wafer sizes

■ 100 % edge handling; exclusion zone < 4 mm

■ Contact material PEEK

HMDS, Hot & Coolplate module ■ 100 % edge handling; exclusion zone < 4 mm

■ HMDS vapor prime vacuum hotplate

■ Programmable temperature range up to 300°C (as option up to 450°C)

■ Nitrogen purge

■ Programmable proximity or proximity balls

Hotplate stack

process modules

Developer & Roboter handling

Wafer fl ip (WFP) station

smartEBR (Edge Bead Removal) ■ EBR system to clean wafer with notches

■ Cleaved wafer edge cleaning

■ Square substrates cleaning

■ Thin and thick resist cleaning

■ Sensor controlled cleaning

■ EBR up to 10 mm from edge freely programmable

■ Nitrogen protected EBR flow

Controller ■ Standard PC for operating and recipe storage

■ 21“ flat touch screen monitor on ergonomic arm

■ Ethernet interface for connection to intranet for first level service communication

■ Log file tracking

■ Unlimited process recipe and flow recipe storage

■ Easy to operate user interface Windows based

■ SECS / GEM interface as option

Chucks ■ Many different chucks available

■ Vacuum chuck

■ 100 % edge handling; exclusion zone < 4 mm

■ Low contact chuck

■ Bernoulli chuck (only developer-cleaner)

■ Centrifugal force chuck (only developer-cleaner)

process modules

components

Coolplate

MC208 Roboter handling

smartEBR

Conroller Screen

■ Stainless steel frame

■ Transparent doors for safe process observation

■ Cleanroom design for ISO 4 (class 10)

■ Centrally positioned 3-axis fi eld approved high speed robot or linear double handling robot

■ 3 up to 8 process modules plus I/O station

■ All system components integrated into the main cabinet

■ All components easy to reach for maintenance and service

■ Time saving and stress reduced “on the fl y” touch-less substrate centering

system design

Voltage: 3 x 400 VAC / N / PE, 50 - 60 Hz, 16 - 32 A

Compressed air (CDA): 8 bar

Vacuum: -0,8 bar

Nitrogen (optional): 4,0 bar

DI-water (optional): 4,0 bar

requirements

MC

-Lin

eTE

CH

NIC

AL

DAT

A

Obducat Europe GmbHRobert-Gerwig-Str. 9 . 78315 Radolfzell . GermanyFon +49 7732 97 898-0 . Fax +49 7732 97 898-99 . sales@obducat.com www.obducat.com

Automatic Systems ■ MC 204Approx.: 1.200 mm x 1.200 mm x 2.013 mm(W x D x H) (47,2” x 47,2” x 79,1”)

Sample confi guration1 x Coater1 x Developer6 x HotplateCentrally positioned 3-axis robot

system dimensions

MC-Automatic-Datasheet 170831 / Subject to change without prior notice. *Pictures could show standard equipment plus options.

REMARK (some of the mentioned features are available as options and could be added to the standard basic confi guration)

1 x HMDS1 x Coolplate2 x I/O Station

■ MC 205Approx.: 2.505 mm x 1.730 mm x 2.096 mm(W x D x H) (98,6” x 68,1” x 82,5”)

Sample confi guration1 x Coater2 x Developer2 x CoolplateLinear system on 2 x 2 link robot

8 x Hotplate2 x I/O Station1 x smartEBR

■ MC 208Approx.: 1.430 mm x 1.730 mm x 2.013 mm(W x D x H) (56,3” x 68,1” x 79,1”)

Sample confi guration 2 x Coaters 2 x Developer18 x HotplateLinear system on 2 x 2 link robot

2 x HMDS8 x Coolplate4 x I/O Station