ICInsights

Detailed Fab Facility Specifications

Capacity by Minimum Process Geometry

Capacity by Technology Type

Capacity by Wafer Size

Detailed Analysis and Forecast of theIC Industry's Wafer Fab Capacity

Capacity by Geographic Region

Capacity by IC Device Type

Global Wafer CapacityCompany • Fab Name and Location • Date Opened • Wafer Size and

Capacity • Process(es) • Minimum Geometry • Product(s)

To learn more about other market research services and publicationsoffered by IC Insights, visit our website at www.icinsights.com

ORDER FORM – Global Wafer Capacity 2015-2019

THE IC INDUSTRY'S MOST RESPECTED MARKET RESEARCH FIRM

DID YOU KNOW?The top 15 300mm wafer capacity leaders now hold 97% of the world’s

300mm fab capacity, essentially comprising the entire future total available

market (TAM) for leading-edge IC fabrication equipment and materials!

Number of Companies with Fabs is Shrinking

200mm FabOwners

(Max in 2007)

200mm FabOwners

(Current)

300mm FabOwners

(Max in 2008)

7661

29

300mm FabOwners

(Current)

Potential450mm Fab

Owners

22

9

INCLUDES:

Detailed profiles of

the companies most

likely to build

450mm wafer fabs!

INCLUDES TWO SPECIAL ADDENDUMSPotential 450mm Wafer Manufacturer Profiles

Profiles of the

world's leading IC

manufacturers, with

extra emphasis placed

on each company’s

potential for building

450mm wafer fabs.

1 ORDER OPTIONS (choose one)

� Individual User $4,290 x 1 = $ ______ Includes PDF files, Internet access, individual-user license.

Additional Users $695 ea. x ___ = $ ______

� Multi-User Corporate License $6,990 x 1 = $ ______ Includes PDF files, Internet access, redistribution license for company-wide use.

TOTAL: = $ ______

4 SUBMIT ORDER

� � �

FAX: +1-480-348-9745 PHONE: +1-480-348-1133

MAIL: IC Insights, Inc.

13901 North 73rd Street, Suite 205

Scottsdale, Arizona 85260 USA

THANK YOU!

3 SHIPPING ADDRESS

PAYMENT METHOD (choose one)2

� ACH Transfer Domestic customers, contact us for details.

� Wire Transfer International customers, contact us for details.

� Credit Card � American Express � MasterCard � Visa

Card # _____________________________________Exp___________

Cardholder Name __________________________________________

Signature ________________________________________________ � � FOR SECURITY REASONS, DO NOT SEND CREDIT CARD INFORMATION BY E-MAIL � �

� Company Check Drawn on U.S. bank and payable in U.S. funds.

� Purchase Order P.O. # ______________________________________

� Order will not be processed before payment or receipt of purchase order.

Billing address the same? � Yes or � No � If not, please attach billing address

Name ________________________________________

Title/Position __________________________________

Company _____________________________________

Address ______________________________________

Suite/Mail Stop _________________________________

City __________________________________________

State/Prov ____________________________________

Zip/Postal Code ________________________________

Country ______________________________________

Phone ________________________________________

Fax __________________________________________

E-Mail ________________________________________

Is this the end-user? � Yes or � No (N/A for multi-user license)

� If not, please attach end-user contact information

2015-2019

SOME OF THE MORE THAN 60 CHARTS AND TABLES

The most comprehensive examination of the IC industry's wafer fab capacity

A detailed breakdown of wafer capacity in 2014 and projections for each year through 2019

106 Manufacturers Included in the Data Compilation

Annual IC Industry Wafer Capacity History and Forecast

Worldwide Annual Installed Capacity Trends

Changes in Worldwide Annual Capacity Volume

Installed Wafer Capacity Leaders

Capacity Leaders' Shares of Total WW Capacity

Capacity Leaders per Geographic Region

Worldwide Installed Capacity by Geographic Region

Regional Installed Capacity by Wafer Size

Installed Capacity for Each Wafer Size by Region

Installed Capacity Forecast by Geographic Region

Worldwide Installed Capacity by Wafer Size

Installed Capacity Leaders per Wafer Size

300mm Wafer Fab Count

300mm Wafer Capacity Leaders

“Power” Ranking of the 300mm Wafer Capacity Leaders

300mm Wafer Capacity Leaders Forecast

Number of Companies with 200mm vs. 300mm Fabs

Potential 450mm Wafer Players

Installed Capacity Forecast by Wafer Size

Worldwide Installed Capacity by Process Technology

Regional Installed Capacity by Process Technology

Worldwide Installed Capacity by Minimum Geometry

Regional Installed Capacity by Minimum Geometry

Installed Capacity Leaders per Minimum Geometry

Installed Capacity Forecast by Minimum Geometry

Historical Wafer Capacity by Dimensions

Worldwide Installed Capacity by Product Type

IC Devices Contained Within Each Product Category

Foundry Capacity by IC Device Type

Regional Installed Capacity by Product Type

Installed Capacity Forecast by Product Type

Major changes continue with the IC manufacturing base! Over the past seven years, the landscape of the IC

fabrication industry has changed dramatically. IC manufacturers have done whatever they could to survive by closing older

fabs, adopting the fabless or fab-lite business

model, and consolidating.

The number of companies able to afford the

cost of a new advanced fab continues to

dwindle, causing greater reliance on

foundries for production capacity. While the

foundries have served the industry very well,

such high reliance on so few manufacturers

has caused some uneasiness in the industry.

This situation will become even more

precarious when the 300mm-to-450mm

wafer transition takes place in the second

half of this decade.

The newly updated Global Wafer Capacity

report is an ideal tool for understanding the "new realities" of the market. This study will greatly assist IC material and

equipment suppliers in creating long-term strategic marketing plans, especially when it comes to determining which IC

manufacturers stand the best chance to remain in the business of fabricating ICs.

The Global Wafer Capacity report is based on IC Insights' proprietary database that lists about 370 individual IC fabrication

facilities representing 106 companies.

This study offers a detailed breakdown of the

IC industry's wafer fab capacity as it stood at

the end of 2014 and then forecasts capacity

for each year through 2019. The data were

compiled, summarized, and extended into the

future using both bottom-up and top-down

research methodologies. Surveys of hundreds

of fabs from around the world formed the

basis for analyzing the IC industry's current

capacity status. Future projections were

based on both survey results and IC Insights'

overall economic forecast for the IC industry.

Use this study to find:

� Capacity, wafer start, utilization forecasts

� IDM vs. fabless vs. fab-/asset-lite strategies

� Rankings of companies with highest capacity

� Capacity forecasts for Taiwan, Korea, China

� 300mm wafer fab count and specifications

� Forecasts for leading-edge (<20nm) capacity

. . . and more!

Wafer Size300mm, 200mm, 150mm, 125mm, 100mm

Minimum Geometry≥0.4µ, <0.4µ–≥0.2µ, <0.2µ–≥80nm, <80nm–≥40nm,<40nm–≥20nm, <20nm

Technology TypeCMOS, BiCMOS/BCD, Bipolar

Geographic Region/CountryAmericas, Europe, Japan, Korea, Taiwan, China, ROW

IC Device TypeAnalog, Memory, Logic, Microcomponent, Foundry

DATA ARRANGED IN SEVERAL CATEGORIES

SOME OF THE MORE THAN 60 CHARTS AND TABLES

The most comprehensive examination of the IC industry's wafer fab capacity

A detailed breakdown of wafer capacity in 2014 and projections for each year through 2019

106 Manufacturers Included in the Data Compilation

Annual IC Industry Wafer Capacity History and Forecast

Worldwide Annual Installed Capacity Trends

Changes in Worldwide Annual Capacity Volume

Installed Wafer Capacity Leaders

Capacity Leaders' Shares of Total WW Capacity

Capacity Leaders per Geographic Region

Worldwide Installed Capacity by Geographic Region

Regional Installed Capacity by Wafer Size

Installed Capacity for Each Wafer Size by Region

Installed Capacity Forecast by Geographic Region

Worldwide Installed Capacity by Wafer Size

Installed Capacity Leaders per Wafer Size

300mm Wafer Fab Count

300mm Wafer Capacity Leaders

“Power” Ranking of the 300mm Wafer Capacity Leaders

300mm Wafer Capacity Leaders Forecast

Number of Companies with 200mm vs. 300mm Fabs

Potential 450mm Wafer Players

Installed Capacity Forecast by Wafer Size

Worldwide Installed Capacity by Process Technology

Regional Installed Capacity by Process Technology

Worldwide Installed Capacity by Minimum Geometry

Regional Installed Capacity by Minimum Geometry

Installed Capacity Leaders per Minimum Geometry

Installed Capacity Forecast by Minimum Geometry

Historical Wafer Capacity by Dimensions

Worldwide Installed Capacity by Product Type

IC Devices Contained Within Each Product Category

Foundry Capacity by IC Device Type

Regional Installed Capacity by Product Type

Installed Capacity Forecast by Product Type

Major changes continue with the IC manufacturing base! Over the past seven years, the landscape of the IC

fabrication industry has changed dramatically. IC manufacturers have done whatever they could to survive by closing older

fabs, adopting the fabless or fab-lite business

model, and consolidating.

The number of companies able to afford the

cost of a new advanced fab continues to

dwindle, causing greater reliance on

foundries for production capacity. While the

foundries have served the industry very well,

such high reliance on so few manufacturers

has caused some uneasiness in the industry.

This situation will become even more

precarious when the 300mm-to-450mm

wafer transition takes place in the second

half of this decade.

The newly updated Global Wafer Capacity

report is an ideal tool for understanding the "new realities" of the market. This study will greatly assist IC material and

equipment suppliers in creating long-term strategic marketing plans, especially when it comes to determining which IC

manufacturers stand the best chance to remain in the business of fabricating ICs.

The Global Wafer Capacity report is based on IC Insights' proprietary database that lists about 370 individual IC fabrication

facilities representing 106 companies.

This study offers a detailed breakdown of the

IC industry's wafer fab capacity as it stood at

the end of 2014 and then forecasts capacity

for each year through 2019. The data were

compiled, summarized, and extended into the

future using both bottom-up and top-down

research methodologies. Surveys of hundreds

of fabs from around the world formed the

basis for analyzing the IC industry's current

capacity status. Future projections were

based on both survey results and IC Insights'

overall economic forecast for the IC industry.

Use this study to find:

� Capacity, wafer start, utilization forecasts

� IDM vs. fabless vs. fab-/asset-lite strategies

� Rankings of companies with highest capacity

� Capacity forecasts for Taiwan, Korea, China

� 300mm wafer fab count and specifications

� Forecasts for leading-edge (<20nm) capacity

. . . and more!

Wafer Size300mm, 200mm, 150mm, 125mm, 100mm

Minimum Geometry≥0.4µ, <0.4µ–≥0.2µ, <0.2µ–≥80nm, <80nm–≥40nm,<40nm–≥20nm, <20nm

Technology TypeCMOS, BiCMOS/BCD, Bipolar

Geographic Region/CountryAmericas, Europe, Japan, Korea, Taiwan, China, ROW

IC Device TypeAnalog, Memory, Logic, Microcomponent, Foundry

DATA ARRANGED IN SEVERAL CATEGORIES

ICInsights

Detailed Fab Facility Specifications

Capacity by Minimum Process Geometry

Capacity by Technology Type

Capacity by Wafer Size

Detailed Analysis and Forecast of theIC Industry's Wafer Fab Capacity

Capacity by Geographic Region

Capacity by IC Device Type

Global Wafer CapacityCompany • Fab Name and Location • Date Opened • Wafer Size and

Capacity • Process(es) • Minimum Geometry • Product(s)

To learn more about other market research services and publicationsoffered by IC Insights, visit our website at www.icinsights.com

ORDER FORM – Global Wafer Capacity 2015-2019

THE IC INDUSTRY'S MOST RESPECTED MARKET RESEARCH FIRM

DID YOU KNOW?The top 15 300mm wafer capacity leaders now hold 97% of the world’s

300mm fab capacity, essentially comprising the entire future total available

market (TAM) for leading-edge IC fabrication equipment and materials!

Number of Companies with Fabs is Shrinking

200mm FabOwners

(Max in 2007)

200mm FabOwners

(Current)

300mm FabOwners

(Max in 2008)

7661

29

300mm FabOwners

(Current)

Potential450mm Fab

Owners

22

9

INCLUDES:

Detailed profiles of

the companies most

likely to build

450mm wafer fabs!

INCLUDES TWO SPECIAL ADDENDUMSPotential 450mm Wafer Manufacturer Profiles

Profiles of the

world's leading IC

manufacturers, with

extra emphasis placed

on each company’s

potential for building

450mm wafer fabs.

1 ORDER OPTIONS (choose one)

� Individual User $4,290 x 1 = $ ______ Includes PDF files, Internet access, individual-user license.

Additional Users $695 ea. x ___ = $ ______

� Multi-User Corporate License $6,990 x 1 = $ ______ Includes PDF files, Internet access, redistribution license for company-wide use.

TOTAL: = $ ______

4 SUBMIT ORDER

� � �

FAX: +1-480-348-9745 PHONE: +1-480-348-1133

MAIL: IC Insights, Inc.

13901 North 73rd Street, Suite 205

Scottsdale, Arizona 85260 USA

THANK YOU!

3 SHIPPING ADDRESS

PAYMENT METHOD (choose one)2

� ACH Transfer Domestic customers, contact us for details.

� Wire Transfer International customers, contact us for details.

� Credit Card � American Express � MasterCard � Visa

Card # _____________________________________Exp___________

Cardholder Name __________________________________________

Signature ________________________________________________ � � FOR SECURITY REASONS, DO NOT SEND CREDIT CARD INFORMATION BY E-MAIL � �

� Company Check Drawn on U.S. bank and payable in U.S. funds.

� Purchase Order P.O. # ______________________________________

� Order will not be processed before payment or receipt of purchase order.

Billing address the same? � Yes or � No � If not, please attach billing address

Name ________________________________________

Title/Position __________________________________

Company _____________________________________

Address ______________________________________

Suite/Mail Stop _________________________________

City __________________________________________

State/Prov ____________________________________

Zip/Postal Code ________________________________

Country ______________________________________

Phone ________________________________________

Fax __________________________________________

E-Mail ________________________________________

Is this the end-user? � Yes or � No (N/A for multi-user license)

� If not, please attach end-user contact information

2015-2019

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