MachXO2 Pico De velopment Kitdatasheet.elcodis.com/pdf2/65/35/653574/lcmxo2-1200ze-p...MachXO2 Pico De velopment Kit User s Guide Downloaded from Elcodis.com electronic components

July 2011Revision: EB61_01.3

MachXO2 Pico Development Kit

User’s Guide

Downloaded from Elcodis.com electronic components distributor

http://elcodis.com/parts/5639244/LCMXO2-1200ZE-P-EVN.html

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MachXO2 Pico Development KitLattice Semiconductor User’s Guide

IntroductionThank you for choosing the Lattice Semiconductor MachXO2™ Pico Development Kit.

This guide describes how to begin using the MachXO2 Pico Development Kit, an easy-to-use platform for rapidly prototyping system control designs using MachXO2 PLDs. Along with the evaluation board and accessories, this kit includes the pre-loaded Pico SoC Demo (Environment Scanning Demonstration Design) that demonstrates board diagnostic functions including ultra-low power, LCD driver, I/O control, current measuring, time stamps and data logging to non-volatile memory using the 8-bit LatticeMico8™ microcontroller .

The contents of this user’s guide include demo operation, top-level functional descriptions of the various portions of the evaluation board, descriptions of the on-board connectors, switches, a complete set of schematics and the bill of materials for the MachXO2 Pico Evaluation Board.

Note: Static electricity can severely shorten the lifespan of electronic components. See the MachXO2 Pico Devel-opment Kit QuickSTART Guide for handling and storage tips.

FeaturesThe MachXO2 Pico Development Kit includes:

• MachXO2 Pico Evaluation Board – The MachXO2 Pico Evaluation Board features the following on-board com-ponents and circuits:

– MachXO2 LCMXO2-1200ZE PLD device in a 132-ball csBGA package. The board is designed for density migration, allowing a lower density MachXO2 device to be assembled on the board.

- Part number LCMXO2-1200ZE-P-EVN is populated with the R1 silicon. Part number LCMXO2-1200ZE-P1-EVN is populated with the Standard silicon. The demos have been targeted for a specific version of silicon and are not interchangeable. For more information on the R1 to Standard migration refer to AN8086, Designing for Migration from MachXO2-1200-R1 to Standard (Non-R1) Devices.

– 4 Mbit SPI Flash memory– Current sensor circuits using Delta-Sigma ADC– LCD driven with PWM analog output circuitry– Expansion header for JTAG, SPI, I2C and PLD I/Os– 4 capacitive touch sense buttons– Standard USB cable for device programming– RS-232/USB and JTAG/USB interface– RoHS-compliant packaging and process – USB or 2032 battery powered

• Pre-loaded Reference Designs and Demo – The kit includes a pre-loaded Pico SoC Demo design that inte-grates several Lattice reference designs including: the LatticeMico8 microcontroller, master WISHBONE bus controller, soft delta-sigma ADC, SPI master controller, UART peripheral, Embeded Block RAM and additional control functions.

• USB connector Cable – A mini B USB port provides power, a communication and debug port via a USB-to-RS-232 physical channel and programming interface to the MachXO2 JTAG port.

• Battery – A 2032 coin battery can provides an alternate source of power.

• QuickSTART Guide – Provides information on connecting the MachXO2 Pico Evaluation Board, installing Win-dows hardware drivers, and running the Pico SoC Demo.

Figure 1 shows the top side of the MachXO2 Pico Evaluation Board with comments on the specific features that are designed in the board.



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Figure 1. MachXO2 Pico Evaluation Board, Top Side

USBInterface

Socket

2x16GPIO

Header

LCDScreen

MachXO2-1200ZE

I2C Temperature

SensorCoin BatterySlot

SPI FlashMemory

CapacitiveTouch SenseButtons

Push-button

MachXO2 DeviceThis board features a MachXO2 PLD with a 1.2V core supply. The PLD is packaged in a 132-ball csBGA which pro-vides a migration path to devices ranging from 640 LUTs to 4340 LUTs. A complete description of this device can be found in the MachXO2 Family Handbook.

Software RequirementsYou should install the following software before you begin developing designs for the evaluation board:

• Lattice Diamond™ 1.2 (or higher)

• ispVM™ System 17.9.1 (or higher)

Demonstration DesignLattice provides the Pico SoC Demo design programmed in the board. The design utilizes the MachXO2 in the con-text of low power applications.

The Pico SoC Demo illustrates the use of the LatticeMico8 microcontroller, associated peripherals and firmware to provide a low power system featuring voltage/current measurement, data logging to nonvolatile memory, I/O con-trol, embedded block RAM utilization, UART communication, capacitive touch sense buttons and a LCD controller.

• The LatticeMico8 executable program initializes the peripherals that are embedded in the SoC design. During ini-tialization, the LatticeMico8 uploads the user menu on the Terminal of a PC.

• Users interact with LatticeMico8 and the board through the Terminal of a PC or through the capacitive touch sense buttons.



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Figure 2. Pico SoC Demo Block Diagram

MachXO2 Pico Evaluation Board

MachXO2-1200ZE

UART LCDCapacitive TouchSense Buttons

LatticeMico8Microcontroller

MasterSPI

SoftADC

MasterI2C

SPIFlash

AnalogSignal

PC

I2CTemp

Sensor

EmbeddedBlock RAM

Power management is handled in two phases by the MachXO2 Pico Evaluation Board system:

1. MachXO2 Function – After the reset is de-asserted, LatticeMico8 initializes the peripherals embedded in the MachXO2 device and uploads the user menu onto the HyperTerminal window of a PC.

Figure 3. HyperTerminal User Menu

2. Users interact with LatticeMico8 microcontroller and the board by selecting the available options in the Hyper-Terminal menu. The available options are:

• ‘m’ – This option re-displays the main menu anytime during the demonstration. PICO is displayed on the LCD screen.

• ‘i’ – This option measures the Icc using a Delta Sigma. The result is displayed to the terminal and the LCD. Board button 3 performs the same function but results are only displayed to the LCD.

• ‘o’ – This option measures Icco using Delta Sigma. The result is displayed to the terminal and the LCD. Pressing board button 2 performs the same function but results are only displayed to the LCD.



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• ‘s’ – This option reads the device ID of the SPI Flash on the board. The results are displayed to the terminal and the LCD.

• 't' - This option reads the I2C temperature sensor on the board. The result is displayed to the Terminal and to the LCD. Button 4 on the board performs the same function but the result is only displayed on the LCD

• 'r' This option samples the capacitive touch buttons on the board and displays the data in the terminal.

• "0-9" - These values will echoed to the terminal and displayed on the LCD

• 'l' - This option will read the Icc, Icco, and Temperature and log it to the SPI flash memory. The WRITE page pointer will increment when 'l' is pressed. The initial value of the page pointer after power up is a 0. Button 1 on the board performs the same function the LCD will display 8888

• 'd' - This option will read the data from the SPI Flash device and display to to the Terminal window. The READ page pointer will increment when 'd' is pressed. The intial value of the page pointer after a power up is 0.

• 'c' - This option will clear (reset) the WRITE and READ page pointers

• 'e' - This selection will perform a bulk-erase of the Flash memory in the SPI Flash device and will clear (reset) the WRITE and READ page pointers.

Setting up the BoardDrivers and FirmwareBefore you begin, you will need to obtain the necessary hardware drivers for Windows from the Lattice web site.

1. Browse to www.latticesemi.com/alpha-mxo2-pico-kit and locate the hardware device drivers for the USB inter-face.

2. Download the ZIP file to your system and unzip it to a location on your PC.

Linux Support:

The USB interface drivers for the evaluation board are included in Linux kernel 2.4.20 or greater, including distribu-tions compatible with Lattice Diamond design software (Red Hat Enterprise v.3, v.4 or Novell SUSE Enterprise v.10).

The Pico SoC Demo is preprogrammed into the MachXO2 Pico Evaluation Board, however over time it is likely that your board will be modified.

To download the demo source files and reprogram the MachXO2 Pico Evaluation Board:

1. Download the demo appliction source code from www.latticesemi.com/alpha-mxo2-pico-kit.

2. Use .\Environment_Scanning_demo\project\impl1\Environment_Scanning_demo_impl1.jed to restore the Environment Scanning demonstration design.

Connecting to the MachXO2 Pico Evaluation Board1. Connect the evaluation board to your PC using the USB cable provided. The USB connector on the board

includes reference designator J1. Once the connection is made, a blue LED with reference designator D2 will illuminate.

2. If you are prompted “Windows may connect to Windows Update”, select No, not this time from available options and click Next to proceed with the installation.

3. Choose the Install from specific location (Advanced) option and click Next.

4. Select Search for the best driver in these locations and click the Browse button to browse to the Windows driver folder created earlier. Select the CDM 2.04.06 WHQL Certified folder and click OK.



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5. Click Next. A screen will display as Windows copies the required driver files. Windows will display a message indicating that the installation was successful.

Programming the MachXO2Using ispVM System software, users can scan and perform JTAG operations, including programming, with the MachXO2 device.

Setting Up Windows HyperTerminalYou will use a terminal program to communicate with the evaluation board. The following instructions describe the Windows HyperTerminal program which is found on most Windows PCs. You may use another terminal program but setup will be somewhat different. Windows 7 does not include HyperTerminal. Tera Term has been verified to work with Windows 7. For Linux, Minicom is a good alternative.

Note: This step uses the procedure for Windows XP users. Steps may vary slightly if using another Windows ver-sion.

1. From the Start menu, select Control Panel > System. The “System Properties” dialog appears.

2. Select the Hardware tab and click Device Manager. The “Device Manager” dialog appears.

Figure 4. Device Manager – COM Port

3. Expand the Ports (COM & LPT) entry and note the COM port number for the USB Serial Port.

4. From the Start menu, select Programs > Accessories > Communications > HyperTerminal. The HyperTer-minal application and a “Connection Description” dialog appear.



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Figure 5. New Connection – COM Port

5. Specify a Name and Icon for the new connection. Click OK. The “Connect To” dialog appears.

6. Select the COM port identified in Step 3 from the Connect using: list. Click OK.

Figure 6. Selecting the COM Port

7. The “COMn Properties” dialog appears where “n” is the COM port selected from the list.

8. Select the following Port Settings and click OK.Bits per second: 115200Data bits: 8Parity: NoneStop bits: 1Flow control: None



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Figure 7. COM Port Properties

9. The HyperTerminal window appears.

10. From the MachXO2 Pico Evaluation Board, press the reset push-button with reference designator S1. The Pico SoC demo main menu appears.

Setting Up Linux MinicomMinicom is a terminal program found with most Linux distributions. It can be used to communicate with the MachXO2 Pico Evaluation Board.

To setup Minicom:

1. Check active serial ports:

#dmesg | grep tty

Note the tty label assigned to the USB port

2. From a command prompt, start Minicom:

#minicom –s

The configuration menu appears.

3. Highlight Serial port setup and press Enter. Serial port settings appear.

4. Press A (Serial Device). Specify the active serial device noted in Step 1 and press Enter.

5. Press E (Bps/Par/Bits). Specify 115200, None, 8 and press Enter.

6. Press F (Hardware Flow Control). Specify None and press Enter.

7. Press Esc. The configuration menu appears.

8. Select Save setup as dfl. Minicom saves the port setup as the new default.

9. Select Exit. The Minicom interface appears.

10. From the evaluation board, press the S1 push-button (GSR). The Pico SoC demo main menu appears.



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Ordering Information

Description Ordering Part NumberChina RoHS Environment-Friendly

Use Period (EFUP)

MachXO2 Pico Development Kit LCMXO2-1200ZE-P-EVN

Technical Support AssistanceHotline: 1-800-LATTICE (North America)

+1-503-268-8001 (Outside North America)e-mail: [email protected]: www.latticesemi.com

Revision HistoryDate Version Change Summary

February 2011 01.0 Initial release.

April 2011 01.1 Updated Pico Evaluation Board Top Side diagram, Pico SoC Demo block diagram, HyperTerminal User Manual information, Appendix A and Appendix B.

June 2011 01.2 Added Appendix C.

July 2011 01.3 Updated Features list with information on migration from MachXO2-1200-R1 to Standard (non-R1) devices.

© 2011 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.



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Appendix A. SchematicFigure 8. USB 5V, MachXO2 Power Rails, 3.0V Battery, 1.2V Rail and Current Monitors

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Figure 9. Current Sense Amplifiers, Power Enable Mux

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13

4S2

14

VC

C2

1S1

15

D1

16

U20

ST

G36

93Q

TRU

20

ST

G36

93Q

TR

1S2

1

123S

EL

3

2S1

4D

25

2S2

6

GN

D11

3S1

7

D3

8

3S2

9

4SE

L10

4S1

12

D4

13

4S2

14

VC

C2

1S1

15

D1

16

C30

0.04

7uF

DI

C30

0.04

7uF

DI

R52

50 DI

0.1%

R52

50 DI

0.1%

R89

0 DI

R89

0 DI

R41

50 DI

0.1%

R41

50 DI

0.1%

C19

0.04

7uF

DI

C19

0.04

7uF

DI

R50

1k DI

1%R50

1k DI

1%

R51

2k DI

0.1%

R51

2k DI

0.1%

C24

0.1u

FD

I

C24

0.1u

FD

I

R49

0 DI

R49

0 DI

R96

0 DI

R96

0 DI

R97

0 DI

R97

0 DI

R81

500

DI

1%R81

500

DI

1%

R40

0 DI

R40

0 DI

R58

1k DI

1%R58

1k DI

1%

R92

1k DI

1%R92

1k DI

1%

R57

2k DI

0.1%

R57

2k DI

0.1%



12


Figure 10. USB to JTAG and I2C for the MachXO2

5 5

4 4

3 3

2 2

1 1

DD

CC

BB

AA

EE

SK

EE

DA

TA

SH

LD_D

ebug

EE

CS

+5V

_US

B

+3.

3V

+3.

3Vor

Bat

+3.

3V

VC

C18

FT

+3.

3V

+3.

3V

+3.

3V

+3.

3V

PW

R_E

NA

BLE

b[p

g1]

US

B_S

CL

[pg4

,5]

US

B_T

CK

[pg5

]

US

B_T

DI

[pg5

]

US

B_T

DO

[pg5

]

US

B_T

MS

[pg5

]

US

B_S

DA

[pg4

,5]

BD

BU

S1

[pg5

]

BD

BU

S2

[pg5

]

BD

BU

S0

[pg5

]

BD

BU

S3

[pg5

]

BD

BU

S4

[pg5

]

BD

BU

S5

[pg5

]

BD

BU

S6

[pg5

]

BD

BU

S7

[pg5

]

US

B_1

2MH

Z[p

g4]

Dat

e:

Siz

eS

chem

atic

Rev

ofS

heet

Titl

e

Latti

ce S

emic

ondu

ctor

App

licat

ions

Em

ail:

tech

supp

ort@

Latti

cese

mi.c

omP

hone

(50

3) 2

68-8

001

-or-

(80

0) L

AT

TIC

E

Boa

rd R

ev

Pro

ject

Frid

ay, M

arch

4, 2

011

B

63

US

B t

o JT

AG

and

I2C

for

the

XO

2

MA

CH

XO

2 P

ico

Boa

rdEA

Dat

e:

Siz

eS

chem

atic

Rev

ofS

heet

Titl

e

Latti

ce S

emic

ondu

ctor

App

licat

ions

Em

ail:

tech

supp

ort@

Latti

cese

mi.c

omP

hone

(50

3) 2

68-8

001

-or-

(80

0) L

AT

TIC

E

Boa

rd R

ev

Pro

ject

Frid

ay, M

arch

4, 2

011

B

63

US

B t

o JT

AG

and

I2C

for

the

XO

2

MA

CH

XO

2 P

ico

Boa

rdEA

Dat

e:

Siz

eS

chem

atic

Rev

ofS

heet

Titl

e

Latti

ce S

emic

ondu

ctor

App

licat

ions

Em

ail:

tech

supp

ort@

Latti

cese

mi.c

omP

hone

(50

3) 2

68-8

001

-or-

(80

0) L

AT

TIC

E

Boa

rd R

ev

Pro

ject

Frid

ay, M

arch

4, 2

011

B

63

US

B t

o JT

AG

and

I2C

for

the

XO

2

MA

CH

XO

2 P

ico

Boa

rdEA

US

B C

on

nec

tio

n

M93C46-WMN6TP Manuf:ST Micro

Digi-Key Part Number 497-5090-1-ND

FT

2232

Con

trol

led

Hig

h =

JT

AG

Low

= I2

C

R34

0 DI

R34

0 DI

FTD

I Hig

h-S

peed

US

B

F

T223

2H

FT

2232

HL

U23

DIFT

DI H

igh-

Spe

ed U

SB

F

T223

2H

FT

2232

HL

U23

DIVR

EG

IN50

VR

EG

OU

T49

DM

7

DP

8

RE

F6

RE

SE

T#

14

EE

CS

63

EE

CLK

62

EE

DA

TA

61

OS

CI

2

OS

CO

3

TE

ST

13

AD

BU

S0

16

AD

BU

S1

17

AD

BU

S2

18

AD

BU

S3

19

VPHY4

VPLL9

VCORE12

VCORE37

VCORE64

VCCIO20

VCCIO31

VCCIO42

VCCIO56

AGND 10

GND 1

GND 5

GND 11

GND 15

GND 25

GND 35

GND 47

GND 51PW

RE

N#

60

SU

SP

EN

D#

36

AD

BU

S4

21

AD

BU

S5

22

AD

BU

S6

23

AD

BU

S7

24

AC

BU

S0

26

AC

BU

S1

27

AC

BU

S2

28

AC

BU

S3

29

AC

BU

S4

30

AC

BU

S5

32

AC

BU

S6

33

AC

BU

S7

34

BD

BU

S0

38

BD

BU

S1

39

BD

BU

S2

40

BD

BU

S3

41

BD

BU

S4

43

BD

BU

S5

44

BD

BU

S6

45

BD

BU

S7

46

BC

BU

S0

48

BC

BU

S1

52

BC

BU

S2

53

BC

BU

S3

54

BC

BU

S4

55

BC

BU

S5

57

BC

BU

S6

58

BC

BU

S7

59

L3

600o

hm 5

00m

A

L3

600o

hm 5

00m

A12

R4

10k

SM

/R_0

603

R4

10k

SM

/R_0

603

R31

0 DI

R31

0 DI

R1

10k

SM

/R_0

603

R1

10k

SM

/R_0

603

R11

0 DI

R11

0 DI

C12 0.1u

FD

I

C12 0.1u

FD

I

R43

0 DI

R43

0 DI

U22 S

TG

3693

QT

R

U22 S

TG

3693

QT

R

1S2

1

123S

EL

3

2S1

4D

25

2S2

6

GN

D11

3S1

7

D3

8

3S2

9

4SE

L10

4S1

12

D4

13

4S2

14

VC

C2

1S1

15

D1

16

C3

0.1u

FC

30.

1uF

R55

0 DI

R55

0 DI

C56

18pF

DI

C56

18pF

DI

R7

100k

DI

R7

100k

DI

R14

0 DI

R14

0 DI

R20

0 DI

R20

0 DI

R98

12k

DI

R98

12k

DI

R8

0 DI

R8

0 DI

C9

0.1u

F DI

C9

0.1u

F DI

R26

2.2k

R26

2.2k

C13 4.7u

FD

I

C13 4.7u

FD

I

U1

M93

C46

-WM

N6T

P

SO

IC-8

DI

U1

M93

C46

-WM

N6T

P

SO

IC-8

DI

CS

1

SK

2

DIN

3

DO

UT

4

VC

C8

NC

7

OR

G6

GN

D5

C6

10nF

DI

SM

/C_0

603

C6

10nF

DI

SM

/C_0

603

R56

0 DI

R56

0 DI

R3

10k

SM

/R_0

603

R3

10k

SM

/R_0

603

C58

0.1u

FD

I

C58

0.1u

FD

IR

15

0 DI

R15

0 DI

R36

3.3k

DN

I

R36

3.3k

DN

I

R35

0 DI

R35

0 DI

C57

0.1u

F DI

C57

0.1u

F DI

R47

0 DI

R47

0 DI

C5

10nF

DI

C5

10nF

DI

R16

0 DI

R16

0 DI

R13

0 DI

R13

0 DI

C55

18pF

DI

C55

18pF

DI

L1 Fer

rite_

bead

SM

/R_0

603

DI

L1 Fer

rite_

bead

SM

/R_0

603

DI

C51

3.3u

FD

I

C51

3.3u

FD

I

R30

2.2k

DI

R30

2.2k

DI

J1U

SB

_MIN

I_B

DI

TY

PE

_B

J1U

SB

_MIN

I_B

DI

TY

PE

_B

VC

C1

D-

2

D+

3

GN

D5

NC

4

CA

SE

7

CA

SE

8

CA

SE

9

CA

SE

6

MH

110

MH

211

X3

12M

HZ

DI

X3

12M

HZ

DI1

13

3

G1

2G

24

C54

0.1u

FD

I

C54

0.1u

FD

I

R21

0 DI

R21

0 DI



13


Figure 11. MachXO2 Banks 0-1, LCD, I2C Temperature

5 5

4 4

3 3

2 2

1 1

DD

CC

BB

AA

Tm

p_I2

C_A

LER

T

LCD

_CO

M0

LCD

_CO

M1

LCD

_CO

M2

LCD

_CO

M3

LCD

_5LC

D_6

LCD

_9LC

D_1

0

LCD

_11

LCD

_12

LCD

_7LC

D_8

LCD

_CO

M1

LCD

_CO

M0

LCD

_CO

M0_

LP

LCD

_CO

M1_

LP

LCD

_CO

M2

LCD

_CO

M2_

LP

LCD

_CO

M2_

LPLC

D_C

OM

3_LP

LCD

_7_L

PLC

D_8

_LP

LCD

_5_L

PLC

D_6

_LP

LCD

_11_

LPLC

D_1

2_LP

LCD

_9_L

PLC

D_1

0_LP

LCD

_CO

M0_

LPLC

D_C

OM

1_LP

Tm

p_I2

C_A

LER

T

LCD

_CO

M3

LCD

_CO

M3_

LP

LCD

_5_L

P

LCD

_6_L

P

LCD

_5

LCD

_6

LCD

_7_L

P

LCD

_7

LCD

_10_

LP

LCD

_10

LCD

_11_

LP

LCD

_12_

LP

LCD

_11

LCD

_12

LCD

_8_L

P

LCD

_8

LCD

_9_L

P

LCD

_9

PW

R_I

2CS

PI

PW

R_I

2CS

PI

PW

R_I

2CS

PI

US

B_S

DA

[pg3

,5]

US

B_S

CL

[pg3

,5]

XO

2_T

DO

[pg5

]

XO

2_T

MS

[pg5

]X

O2_

TC

K[p

g5]

XO

2_T

DI

[pg5

]US

B_1

2MH

Z[p

g3]

US

B_S

DA

[pg3

,5]

US

B_S

CL

[pg3

,5]

PR

OT

O_C

10[p

g5]

PR

OT

O_B

13[p

g5]

PR

OT

O_A

13[p

g5]

Dat

e:

Siz

eS

chem

atic

Rev

ofS

heet

Titl

e

Latti

ce S

emic

ondu

ctor

App

licat

ions

Em

ail:

tech

supp

ort@

Latti

cese

mi.c

omP

hone

(50

3) 2

68-8

001

-or-

(80

0) L

AT

TIC

E

Boa

rd R

ev

Pro

ject

Frid

ay, M

arch

4, 2

011

B

64

XO

2 B

ank

0-1,

LC

D,

I2C

Tem

p

MA

CH

XO

2 P

ico

Boa

rdEA

Dat

e:

Siz

eS

chem

atic

Rev

ofS

heet

Titl

e

Latti

ce S

emic

ondu

ctor

App

licat

ions

Em

ail:

tech

supp

ort@

Latti

cese

mi.c

omP

hone

(50

3) 2

68-8

001

-or-

(80

0) L

AT

TIC

E

Boa

rd R

ev

Pro

ject

Frid

ay, M

arch

4, 2

011

B

64

XO

2 B

ank

0-1,

LC

D,

I2C

Tem

p

MA

CH

XO

2 P

ico

Boa

rdEA

Dat

e:

Siz

eS

chem

atic

Rev

ofS

heet

Titl

e

Latti

ce S

emic

ondu

ctor

App

licat

ions

Em

ail:

tech

supp

ort@

Latti

cese

mi.c

omP

hone

(50

3) 2

68-8

001

-or-

(80

0) L

AT

TIC

E

Boa

rd R

ev

Pro

ject

Frid

ay, M

arch

4, 2

011

B

64

XO

2 B

ank

0-1,

LC

D,

I2C

Tem

p

MA

CH

XO

2 P

ico

Boa

rdEA

Lo

wP

ass

Filt

er

4 C

har

LC

D

Tem

per

atu

re S

enso

rS

lave

Ad

dr

1001

010

R17

0 DI

R17

0 DI

C32

0.01

uFD

I

C32

0.01

uFD

I

R87

5.49

kD

I

R87

5.49

kD

I

C40

0.01

uFD

I

C40

0.01

uFD

I

Bank0

LCM

XO

2-12

00-C

SB

GA

132

U10

A

Bank0

LCM

XO

2-12

00-C

SB

GA

132

U10

A

PT

9AA

2

PT

9BB

3

PT

10A

A3

PT

10B

C4

TD

OA

4

TD

IB

4

PT

11A

B5

PT

11B

C6

TC

KB

6

TM

SA

6

PT

12A

/PC

LKT

0_1

A7

PT

12B

/PC

LKC

0_1

B7

PT

12C

/SC

L/IO

2/P

CLK

T0_

0C

8

PT

12D

/SD

A/IO

3/P

CLK

C0_

0B

8

PT

15A

C9

PT

15B

A9

PT

15C

B9

PT

15D

/PR

OG

RA

MN

C10

PT

16A

A10

PT

16B

C11

PT

16C

A11

PT

16D

B12

PT

17A

C12

PT

17B

A12

PT

17C

/INIT

NB

13

PT

17D

/DO

NE

A13

C28

0.01

uFD

I

C28

0.01

uFD

I

C33

0.01

uFD

I

C33

0.01

uFD

I

R76

5.49

kD

I

R76

5.49

kD

I

R83

5.49

kD

I

R83

5.49

kD

I

C34

0.01

uFD

I

C34

0.01

uFD

I

R77

5.49

kD

I

R77

5.49

kD

I

R84

3.3k

DI

R84

3.3k

DI

C36

0.01

uFD

I

C36

0.01

uFD

I

R62

5.49

kD

I

R62

5.49

kD

I

C37

0.01

uFD

I

C37

0.01

uFD

I

R86

5.49

kD

I

R86

5.49

kD

I

R72

5.49

kD

I

R72

5.49

kD

I

R63

5.49

kD

I

R63

5.49

kD

I

R80

3.3k

DI

R80

3.3k

DI

U7

LCD

-S40

1M16

KR

U7

LCD

-S40

1M16

KR

CO

M0

1

CO

M1

2

CO

M2

3

CO

M3

4

1D,1

E,1

G,1

F5

DP

1,1C

,1B

,1A

6

2D,2

E,2

G,2

F7

DP

2,2C

,2B

,2A

8

3D,3

E,3

G,3

F9

DP

3,3C

,3B

,3A

10

4D,4

E,4

G,4

F11

CO

L,4C

,4B

,4A

12

C29

0.01

uFD

I

C29

0.01

uFD

I

Bank1

LCM

XO

2-12

00-C

SB

GA

132

U10

B

Bank1

LCM

XO

2-12

00-C

SB

GA

132

U10

B

PR

2AB

14

PR

2BC

13

PR

2CC

14

PR

2DD

12

PR

3AE

12

PR

3BE

14

PR

4AE

13

PR

4BF

12

PR

4CF

13

PR

4DF

14

PR

5AG

12

PR

5BG

14

PR

5C/P

CLK

T1_

0G

13

PR

5D/P

CLK

C1_

0H

12

PR

8AJ1

2

PR

8BJ1

4

PR

8CJ1

3

PR

8DK

12

PR

9AK

13

PR

9BK

14

PR

9CL1

4

PR

9DM

13

PR

10A

M12

PR

10B

M14

PR

10C

N13

PR

10D

N14

C39

0.01

uFD

I

C39

0.01

uFD

I

R78

10k

DI

R78

10k

DI

U5

TM

P10

1D

I

U5

TM

P10

1D

I

VC

C4

GN

D2

AD

D0

5S

CL

1

SD

A6

ALE

RT

3

R82

5.49

kD

I

R82

5.49

kD

I

C20

0_1u

F

DI

C20

0_1u

F

DI

R22

0 DI

R22

0 DI

C43

0.01

uFD

I

C43

0.01

uFD

I

R74

5.49

kD

I

R74

5.49

kD

IC31

0.01

uFD

I

C31

0.01

uFD

I

R23

0 DI

R23

0 DI

R68

5.49

kD

I

R68

5.49

kD

I

R67

5.49

kD

I

R67

5.49

kD

I

C42

0.01

uFD

I

C42

0.01

uFD

I



14


Figure 12. MachXO2 Banks 2-3, Capacitor Pads, Expansion Header, SPI

5 5

4 4

3 3

2 2

1 1

DD

CC

BB

AA

Cap

Btn

2C

apB

tn1

Cap

Btn

3C

apB

tn4

Pus

hBtn

PR

OT

O_K

1P

RO

TO

_K3

XO

2_S

PI_

CLK

XO

2_S

PI_

OU

T

XO

2_S

PI_

IN

XO

2_S

PI_

CS

0

PR

OT

O_B

1P

RO

TO

_B2

PR

OT

O_C

1P

RO

TO

_C3

PR

OT

O_C

2P

RO

TO

_D1

PR

OT

O_M

7P

RO

TO

_N8

Cap

Btn

1

Cap

Btn

4C

apB

tn3

Cap

Btn

2

Pus

hBtn

PR

OT

O_K

1P

RO

TO

_K3

PR

OT

O_M

7P

RO

TO

_N8

PR

OT

O_B

1P

RO

TO

_B2

PR

OT

O_C

1P

RO

TO

_C3

PR

OT

O_C

2P

RO

TO

_D1

XO

2_S

PI_

INX

O2_

SP

I_C

LK

XO

2_S

PI_

OU

T

XO

2_S

PI_

CS

0

XO

2_S

PI_

INX

O2_

SP

I_C

LK

XO

2_S

PI_

OU

T

XO

2_S

PI_

CS

0

XO

2_S

PI_

SN

XO

2_S

PI_

SN

XO

2_S

PI_

INX

O2_

SP

I_C

LK

XO

2_S

PI_

OU

T

XO

2_S

PI_

CS

0

VC

CIO

_EX

T

VC

CIO

_EX

TV

CC

IO_E

XT

VC

CIO

_EX

T

VC

CIO

_EX

T

VC

CIO

_EX

T

+3.

3Vor

Bat

PW

R_I

2CS

PI

DS

Vre

fVcc

[pg2

]D

SIn

Vcc

[pg2

]

DS

Out

Vcc

[pg2

]

DS

Vre

fVcc

o[p

g2]

DS

InV

cco

[pg2

]

DS

Out

Vcc

o[p

g2]

EnA

MP

[pg2

]E

nI2C

SP

I[p

g2]

BD

BU

S2

[pg3

]B

DB

US

3[p

g3]

BD

BU

S4

[pg3

]B

DB

US

5[p

g3]

BD

BU

S6

[pg3

]B

DB

US

7[p

g3]

BD

BU

S1

[pg3

]B

DB

US

0[p

g3]

XO

2_T

DO

[pg4

]U

SB

_TD

O[p

g3]

US

B_T

DI

[pg3

]

XO

2_T

CK

[pg4

]X

O2_

TM

S[p

g4]

XO

2_T

DI

[pg4

]

US

B_T

CK

[pg3

]U

SB

_TM

S[p

g3]

US

B_S

DA

[pg3

,4]

US

B_S

CL

[pg3

,4] PR

OT

O_B

13[p

g4]

PR

OT

O_A

13[p

g4]

PR

OT

O_C

10[p

g4]

Dat

e:

Siz

eS

chem

atic

Rev

ofS

heet

Titl

e

Latti

ce S

emic

ondu

ctor

App

licat

ions

Em

ail:

tech

supp

ort@

Latti

cese

mi.c

omP

hone

(50

3) 2

68-8

001

-or-

(80

0) L

AT

TIC

E

Boa

rd R

ev

Pro

ject

Frid

ay, M

arch

4, 2

011

B

65

XO

2 B

ank

2-3,

Cap

Pad

s, E

xpan

sion

Hea

der,

SP

I

MA

CH

XO

2 P

ico

Boa

rdEA

Dat

e:

Siz

eS

chem

atic

Rev

ofS

heet

Titl

e

Latti

ce S

emic

ondu

ctor

App

licat

ions

Em

ail:

tech

supp

ort@

Latti

cese

mi.c

omP

hone

(50

3) 2

68-8

001

-or-

(80

0) L

AT

TIC

E

Boa

rd R

ev

Pro

ject

Frid

ay, M

arch

4, 2

011

B

65

XO

2 B

ank

2-3,

Cap

Pad

s, E

xpan

sion

Hea

der,

SP

I

MA

CH

XO

2 P

ico

Boa

rdEA

Dat

e:

Siz

eS

chem

atic

Rev

ofS

heet

Titl

e

Latti

ce S

emic

ondu

ctor

App

licat

ions

Em

ail:

tech

supp

ort@

Latti

cese

mi.c

omP

hone

(50

3) 2

68-8

001

-or-

(80

0) L

AT

TIC

E

Boa

rd R

ev

Pro

ject

Frid

ay, M

arch

4, 2

011

B

65

XO

2 B

ank

2-3,

Cap

Pad

s, E

xpan

sion

Hea

der,

SP

I

MA

CH

XO

2 P

ico

Boa

rdEA

Cap

acit

ive

To

uch

Pad

s

GS

R/W

ake

fro

m S

tan

db

y

Part Number:EVQ Q2K03W

Panasonic SMD

Hea

der

Pac

kage

: SO

IC8

(WID

E)

Pac

kage

: UD

FN

4MB

it S

PI

U12

Cap

Tou

ch

U12

Cap

Tou

ch

Cap

Btn

1

R93

100k

DN

I

R93

100k

DN

I

R33

0D

IR

330

DI

Bank2

LCM

XO

2-12

00-C

SB

GA

132

U10

C

Bank2

LCM

XO

2-12

00-C

SB

GA

132

U10

C

PB

20D

/SI/S

ISP

I/IO

0P

13P

B20

C/S

NN

12

PB

20B

P12

PB

20A

M11

PB

18D

P11

PB

18C

M10

PB

18B

N10

PB

18A

M9

PB

15D

N9

PB

15C

P9

PB

15B

M8

PB

15A

P8

PB

11B

/PC

LKC

2_1

N8

PB

11A

/PC

LKT

2_1

M7

PB

11D

N7

PB

11C

P7

PB

9B/P

CLK

C2_

0P

6P

B9A

/PC

LKT

2_0

N6

PB

9DM

5P

B9C

N5

PB

6D/S

O/S

PIS

O/IO

1N

4P

B6C

/MC

LK/C

CLK

M4

PB

6BP

4P

B6A

N3

PB

4DM

3P

B4C

/CS

SP

INP

3

PB

4BN

2P

B4A

P2

C48

0.1u

FD

NI

C48

0.1u

FD

NI

R37

68D

IR

3768

DI

C50

0.1u

FD

NI

C50

0.1u

FD

NI

U3

HE

AD

ER

16X

2

U3

HE

AD

ER

16X

2

2 4 6 8 10 12 14 16 18 20 22 24 26 28 30

1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 3132

R44

10k

DIR44

10k

DI

R48

0D

IR

480

DI

U13

Cap

Tou

ch

U13

Cap

Tou

ch

Cap

Btn

1

C10

0_1u

FD

IC10

0_1u

FD

I

S1

Glo

balR

eset

PC

B F

ootp

rint =

SM

T_S

W

DI

S1

Glo

balR

eset

PC

B F

ootp

rint =

SM

T_S

W

DI

14

23

R94

100k

DN

I

R94

100k

DN

I

R70

0 DI

R70

0 DI

R88

100k

DN

I

R88

100k

DN

I

C49

0.1u

FD

NI

C49

0.1u

FD

NI

U9

AT

25D

F04

1A-S

H-B

U9

AT

25D

F04

1A-S

H-B

S1

Q2

W3

Vss

4

Vcc

8

D5

C6

Res

et7

R25

10k

DI

R25

10k

DI

U14

Cap

Tou

ch

U14

Cap

Tou

ch

Cap

Btn

1

U17

AT

25D

F04

1A-M

H

U17

AT

25D

F04

1A-M

H

S1

Q2

W3

Vss

4

Vcc

8

D5

C6

Res

et7

C47

0.1u

FD

NI

C47

0.1u

FD

NI

R69

0 DI

R69

0 DI

C11

0.1u

FD

I

C11

0.1u

FD

I

U11

Cap

Tou

ch

U11

Cap

Tou

ch

Cap

Btn

1

R71

0 DI

R71

0 DI

R2

0D

IR

20

DI

R90

100k

DN

I

R90

100k

DN

I

Bank3

LCM

XO

2-12

00-C

SB

GA

132

U10

D

Bank3

LCM

XO

2-12

00-C

SB

GA

132

U10

D

PL1

0DM

2P

L10C

M1

PL1

0BL3

PL9

B/P

CLK

C3_

0K

3P

L9A

/PC

LKT

3_0

K1

PL8

DK

2P

L8C

J3

PL8

BJ2

PL8

AJ1

PL5

DH

3P

L5C

H1

PL5

B/P

CLK

C3_

1H

2P

L5A

/PC

LKT

3_1

G3

PL4

DF

3P

L4C

F1

PL4

BF

2P

L4A

E3

PL3

DE

2P

L3C

E1

PL3

B/P

CLK

C3_

2D

1P

L3A

/PC

LKT

3_2

C2

PL2

D/L

_GP

LLC

_IN

C3

PL2

C/L

_GP

LLT

_IN

C1

PL2

B/L

_GP

LLC

_FB

B2

PL2

A/L

_GP

LLT

_FB

B1

R32

0D

IR

320

DI

R95

0 DI

R95

0 DI

R66

0 DI

R66

0 DI



15


Figure 13. MachXO2 Power

5 5

4 4

3 3

2 2

1 1

DD

CC

BB

AA

VC

C_I

O

VC

C_C

OR

EV

CC

_CO

RE

VC

C_I

O

Dat

e:

Siz

eS

chem

atic

Rev

ofS

heet

Titl

e

Latti

ce S

emic

ondu

ctor

App

licat

ions

Em

ail:

tech

supp

ort@

Latti

cese

mi.c

omP

hone

(50

3) 2

68-8

001

-or-

(80

0) L

AT

TIC

E

Boa

rd R

ev

Pro

ject

Frid

ay, M

arch

4, 2

011

B

66

XO

2 P

ower

MA

CH

XO

2 P

ico

Boa

rdEA

Dat

e:

Siz

eS

chem

atic

Rev

ofS

heet

Titl

e

Latti

ce S

emic

ondu

ctor

App

licat

ions

Em

ail:

tech

supp

ort@

Latti

cese

mi.c

omP

hone

(50

3) 2

68-8

001

-or-

(80

0) L

AT

TIC

E

Boa

rd R

ev

Pro

ject

Frid

ay, M

arch

4, 2

011

B

66

XO

2 P

ower

MA

CH

XO

2 P

ico

Boa

rdEA

Dat

e:

Siz

eS

chem

atic

Rev

ofS

heet

Titl

e

Latti

ce S

emic

ondu

ctor

App

licat

ions

Em

ail:

tech

supp

ort@

Latti

cese

mi.c

omP

hone

(50

3) 2

68-8

001

-or-

(80

0) L

AT

TIC

E

Boa

rd R

ev

Pro

ject

Frid

ay, M

arch

4, 2

011

B

66

XO

2 P

ower

MA

CH

XO

2 P

ico

Boa

rdEA

Bo

ard

Lo

go

sB

oar

d M

ou

nti

ng

Ho

les

G4

Latti

ce L

ogo

DI

G4

Latti

ce L

ogo

DI1

C41

0.1u

FD

I

C41

0.1u

FD

I

G5

E-F

riend

ly

DI

G5

E-F

riend

ly

DI1

C46

0.1u

FD

I

C46

0.1u

FD

I

G6

WE

EE

DI

G6

WE

EE

DI1

MH

10

M_H

OLE

1D

IIW

_MN

T0

MH

10

M_H

OLE

1D

IIW

_MN

T0

1

C35

0.1u

FD

I

C35

0.1u

FD

I

MH

9

M_H

OLE

1D

IIW

_MN

T0

MH

9

M_H

OLE

1D

IIW

_MN

T0

1

C44

0.1u

FD

I

C44

0.1u

FD

I

MH

11

M_H

OLE

1D

IIW

_MN

T0

MH

11

M_H

OLE

1D

IIW

_MN

T0

1

MH

12

M_H

OLE

1D

IIW

_MN

T0

MH

12

M_H

OLE

1D

IIW

_MN

T0

1

LCM

XO

2-12

00-C

SB

GA

132

U10

E

LCM

XO

2-12

00-C

SB

GA

132

U10

E

GN

DL2

GN

DG

2

GN

DD

2

GN

DB

11

GN

DD

13

GN

DH

13

VC

CP

14

VC

CA

1

NC

C7

GN

DA

5

VC

CA

14

GN

DL1

3

GN

DP

10

GN

DP

5

VC

CN

1

VC

CIO

0C

5

VC

CIO

0A

8

VC

CIO

0B

10

VC

CIO

1L1

2

VC

CIO

1H

14

VC

CIO

1D

14

VC

CIO

2N

11

VC

CIO

2M

6

VC

CIO

2P

1

VC

CIO

3L1

VC

CIO

3D

3

VC

CIO

3G

1C

380.

1uF

DI

C38

0.1u

FD

I

C45

0.1u

FD

I

C45

0.1u

FD

I



16


Appendix B. Bill of MaterialsItem Quantity Reference Part Footprint Populate Vendor Part Number Description

1 2 C10,C20 0_1uF SM/C_0603 DI Panasonic ECJ-1VB1C104K 0.1uF surface mount cap

2 3 C1,C2,C21 1uF SM/C_0603 DI Panasonic ECJ-2YB1A105K 1uF surface mount cap

3 2 C5,C6 10nF SM/C_0603 DI Panasonic ECG ECJ-1VB1C104K 10nF SMC

4 1 J1 USB_MINI_B TYPE_B DI Hirose UX60-MB-5ST USBType-BMiniConnector

5 35 R2,R8,R11,R13,R14,R15,R16,R17,R20,R21,R22,R23,R31,R32,R33,R34,R35,R40,R43,R47,R48,R49,R55,R56,R64,R65,R66,R69,R70,R71,R75,R89,R95,R96,R97

0 SM/R_0603 DI Panasonic ECG ERJ-3GEY0R00V Resistor 0.0 SMD 0603

6 5 R50,R58,R60,R79,R92 1k SM/R_0603 DI Vishay/Dale CRCW06031K00FKEA Resistor 1k SMD 0603

7 8 R1,R3,R4,R25,R27,R29,R44,R78

10k SM/R_0603 DI Vishay/Dale CRCW060310K0FKEA 10K 0603 SMT resistor

8 1 R59 10k SM/R_0603 DNI Vishay/Dale CRCW060310K0FKEA 10K 0603 SMT resistor

9 1 U1 M93C46-WMN6TP SOIC-8 DI STMicroelectronics M93C46-WMN6TP IC 1K EEPROM 8-SOIC

10 1 U5 TMP101 SM/SOT23_6 DI TI TMP101NA/250 IC TEMP SENSOR DIG SOT-23-6

11 1 R19 1M SM/R_0603 DI PanasonicECG ERJ-3GEYJ105V RES 1.0M1/10W5%

12 1 R53 1M SM/R_0603 DNI PanasonicECG ERJ-3GEYJ105V RES 1.0M1/10W5%

13 1 U17 AT25DF041A-MH UDFN DNI Atmel AT25DF041A-MH IC FLASH 4MBIT 70MHZ 8SOIC

14 4 MH9,MH10,MH11,MH12 M_HOLE1 IW_MNT0 DI 3M SJ-5003 (BLACK) BUMPON HEMISPHERE .44X.20 BLACK

15 6 R38,R42,R46,R51,R57,R61 2k SM/R_0603 DI Susumu Co Ltd RG1608P-202-B-T5 RES 2.0K OHM 1/10W .1% 0603 SMD

16 1 BT1 Batt_Cell_Holder BA2032_Battery_Holder

DI Linx Technologies Inc BAT-HLD-001 HOLDER BATTERY 20MM COIN CR2032

17 16 C3,C9,C11,C12,C24,C25,C26,C35,C38,C41,C44,C45,C46,C54,C57,C58

0.1uF SM/C_0603 DI TDK Corporation C1608X7R1E104K CAP CER .10UF 25V X7R 10% 0603

18 4 C47,C48,C49,C50 0.1uF SM/C_0603 DNI TDK Corporation C1608X7R1E104K CAP CER .10UF 25V X7R 10% 0603

19 12 C28,C29,C31,C32,C33,C34,C36,C37,C39,C40,C42,C43

0.01uF SM/C_0603 DI TDK Corporation C1608X7R1H103K CAP CER 10000PF 50V X7R 10% 0603

20 1 C23 0.33uF SM/C_0603 DI TDK Corporation C1608X7R1A334K CAP CER .33UF 10V X7R 0603

21 1 C7 6.8uF SM/C_1206 DI AVX Corporation TAJA685K020RNJ CAP TANTALUM 6.8UF 20V 10% SMD

22 1 C8 10uF SM/C_0805 DI Nichicon TAJA685K020RNJ CAP TANTALUM 10UF 6.3V 20% SMD

23 1 D2 Blue SM/D_0603 DI Lite-On Inc LTST-C190TBKT LED 468NM BLUE CLEAR 0603 SMD

24 1 L1 Ferrite_bead SM/R_0603 DI Laird-Signal Integrity Products

MI0603J600R-00 FERRITE 1A 60 OHM 0603 SMD

25 1 U2 MCP1703T-1202E/CB SOT-23A-3 DI Microchip Technology MCP1703T-1202E/CB IC REG LDO 1.2V 200MA SOT-23A

26 3 R5,R7,R28 100k SM/R_0603 DI Panasonic - ECG ERJ-3GEYJ104V RES 100K OHM 1/10W 5% 0603 SMD

27 4 R88,R90,R93,R94 100k SM/R_0603 DNI Panasonic - ECG ERJ-3GEYJ104V RES 100K OHM 1/10W 5% 0603 SMD

28 1 R54 4.7k SM/R_0603 DI Panasonic - ECG ERJ-3EKF4701V RES 4.70K OHM 1/10W 1% 0603 SMD

29 2 R26,R30 2.2k SM/R_0603 DI Panasonic - ECG ERJ-3GEYJ222V RES 2.2K OHM 1/10W 5% 0603 SMD

30 4 R39,R41,R45,R52 50 SM/R_0603 DI Vishay/Dale TNPW060349R9BEEA RES 49.9 OHM 1/10W 0.1% 0603

31 2 R81,R91 500 SM/R_0603 DI Panasonic - ECG ERJ-3EKF4990V RES 499 OHM 1/10W 1% 0603 SMD



17


32 1 R98 12k SM/R_0603 DI Panasonic - ECG ERA-3AEB123V RES 12K OHM 1/10W .1% 0603 SMD

33 3 Q1,Q3,Q4 IRLML6402PbF SM/SOT23_123 DI International Rectifier IRLML6402TRPBF MOSFET P-CH 20V 3.7A SOT-23

34 1 Q2 IRF240 SM/SOT23_123 DI International Rectifier IRLML2502TRPBF MOSFET N-CH 20V 4.2A SOT-23

35 1 S1 GlobalReset SMT_SW DI Panasonic - ECG EVQ-Q2K03W SWITCH LT 6MM 130GF H=3.1MM SMD

36 1 U8 NCP1117 SOT-223_checkpins

DI STMicroelectronics NCP1117ST33T3G IC REG LDO 1A 3.3V SOT223

37 1 U3 HEADER 16X2 Header16x2 DNI Samtec Inc TLW-108-06-G-D CONN HEADER .100" 16POS DL GOLD

38 2 C19,C30 0.047uF SM/C_0603 DI TDK Corporation C1608X7R1H473K CAP CER 47000PF 50V X7R 10% 0603

39 2 R18,R85 1 SM/R_0603 DI Vishay/Dale CRCW06031R00FKEA RES 1.00 OHM 1/10W 1% 0603 SMD

40 1 D3 NSR0530P2T5G SM/SOD_923 DNI ON Semiconductor NSR0530P2T5G DIODE SCHOTTKY 30V 0.5A SOD-923

41 1 R24 20 SM/R_0603 DNI Panasonic - ECG ERJ-3GEYJ200V RES 20 OHM 1/10W 5% 0603 SMD

42 2 R80,R84 3.3k SM/R_0603 DI Rohm Semiconductor MCR03EZPJ332 RES 3.3K OHM 1/10W 5% 0603 SMD

43 1 R36 3.3k SM/R_0603 DNI Rohm Semiconductor MCR03EZPJ332 RES 3.3K OHM 1/10W 5% 0603 SMD

44 1 U10 LCMXO2-1200-CSBGA132 CSBGA132 DI Lattice LCMXO2-1200-CSBGA132

LCMXO2-1200-CSBGA132

45 1 U7 LCD-S401M16KR LCD-S401M16KR

DI Lumex Opto/Components Inc

LCD-S401M16KR LCD custom order from [email protected]

46 12 R62,R63,R67,R68,R72,R74,R76,R77,R82,R83,R86,R87

5.49k SM/R_0603 DI Panasonic - ECG ERJ-3EKF5491V RES 5.49K OHM 1/10W 1% 0603 SMD

47 1 R37 68 SM/R_0603 DI Panasonic - ECG ERJ-3GEYJ680V RES 68 OHM 1/10W 5% 0603 SMD

48 2 C55,C56 18pF SM/C_0603 DI TDK Corporation C1608C0G1H180J CAP CER 18PF 50V C0G 5% 0603

49 1 C51 3.3uF SM/C_0603 DI TDK Corporation C1608X5R0J335K CAP CER 3.3UF 6.3V X5R 0603

50 1 C13 4.7uF SM/C_0603 DI TDK Corporation C1608X5R0J475K CAP CER 4.7UF 6.3V X5R 0603

51 1 L3 600ohm 500mA FB0603 DI Murata Electronics North America

BLM18AG601SN1D FERRITE CHIP 600 OHM 500MA 0603

52 1 U23 FT2232HL tqfp64_0p5_12p2x12p2_h1p6

DI Future FT2232H R USB UART/FIFO

53 1 X3 12MHZ crystal_4p_3p2x2p5

DI TXC CORPORATION 7M-12.000MAAJ-T CRYSTAL 12.000 MHZ 18PF SMD

54 3 U20,U21,U22 STG3693QTR QFN DI STMicroelectronics STG3693QTR IC SWITCH QUAD SPDT 16QFN

55 1 U15 LMP7708 MSOP DI STMicroelectronics LMP7708MM/NOPB IC AMP PREC R-R OUT DUAL 8-MSOP

56 2 C22,C27 220pF SM/C_0603 DI TDK Corporation C1608X7R1H221K CAP CER 220PF 50V X7R 10% 0603

57 1 U9 AT25DF041A-SH-B AT25DF041A-SOIC-8

DI Atmel AT25DF041A-SH-B IC FLASH 4MBIT 70MHZ 8SOIC

58 1 G4 Lattice Logo LOGO300_1000 DI

59 1 G5 E-Friendly EFRIENDLY_400_SM

DI

60 1 G6 WEEE WEEE_SM DI

61 4 TP1,TP2,TP3,TP4 TP LOGO300_1000 DI

62 4 U11,U12,U13,U14 CapTouch CapTouch

Item Quantity Reference Part Footprint Populate Vendor Part Number Description



18


Appendix C. Other Features

SPI Programming

• In order to support SPI programing of the MachXO2 device the zero ohm resistors (R71, R70, R66, R69) will have to be removed

• Once removed, the SPI programming pins can be accessed via the header U3 (XO2_SPI_OUT, XO2_SPI_IN, XO2_SPI_CLK, XO2_SPI_SN)

– Programming is supported using Diamond Programmer\ispVM or using an external processor



Documents

MachXO2 Pico De velopment Kitdatasheet.elcodis.com/pdf2/65/35/653574/lcmxo2-1200ze-p...MachXO2 Pico De velopment Kit User s Guide Downloaded from Elcodis.com electronic components