MA SERIES OF POWERED RUGGED ATR ENCLOSURESFor Convection and Conduction Cooled Electronic Hardware

Product Information and Applications Guide

RUGGED COTS ATR ENCLOSURES

With the drive from the electronics defence industryfor cost effective system solutions, commercial-off-the-shelf (COTS) products are being sought across theproject spectrum, including the area of rugged systempackaging equipment. Mektron Systems specialise inthe design, development and manufacture of turnkeybus-based system enclosures for commercial throughto military applications. Mektron Systems’ experiencewithin the military COTS sector has culminated in thetried and tested MA Series (Mektron ATR) ofcompact, rugged system enclosures that offeroutstanding quality and versatility for packagingvirtually any commercial bus architecture.

The MA Series of rugged COTS ATR (Air TransportRack) enclosures is versatile and affordable andcaters for a large number of configurable options byadapting the standard or by full customisation. Theyprovide substantial cost savings over full MIL-Specenclosures without having to compromise quality orperformance.

This family of turnkey powered rugged enclosures hasbeen developed to operate under a wide variety ofextreme environmental conditions and designed tomeet the majority of military specifications for landmobile, seagoing and airborne ATR applications.

They are ideally suited for the safe and reliabledeployment of commercial, industrial and military-grade electronic hardware in hostile environments. Anextensive range of transportable electronic enclosuresand transit cases augment Mektron Systems’ fullyintegrated packaging service to the defence industry.

Typical rugged COTS ATR enclosures

YOUR DESIRE IS OUR OBJECTIVE – RIGHT FIRST TIME

FM 39724

MPL International

FEATURES AND BENEFITS

• Substantial cost savings over full MIL-Spec enclosures

• Suitable for airborne, seagoing and land mobile applications

• Comprehensive range of standard ARINC sizes plus custom variants

• VME, VME64 Ext’s, CompactPCI, PC, Multibus II & proprietary buses

• Direct forced-air cooled solutions

• Indirect forced-air cooled solutions

• Conduction cooled solutions

• Fabricated models utilise Mektron’s patented ‘Crush-Fold’ technology

• Conduction cooled models utilise Mektron’s patented ‘High Integrity Frame’

• Indirect cooled models utilise Mektron’s patented ‘Heat Exchanger’ technology

• Mounting trays and support structures

• Shock and vibration isolation

• High altitude fan capability

• Mektron’s climatic control and monitoring option

• Single- and three-phase AC or DC input options

• Comprehensive test history and deployment record

• Unsurpassed defence and avionics engineering experience

• Solutions to full military specifications

• Mektron’s benchmark levels of workmanship

• Full hardware/software integration

ATR SYSTEM ENCLOSURES

Look no further, you will not find a company better equippedand experienced when it comes to ATR form factor basedsystem enclosures.

Mektron Systems’ highly acclaimed and endorsed range ofATR enclosure products offers System Integrators, DefenceContractors and OEMs alike, a rapid, risk free and highlycost effective route to market, whatever the operationalenvironment and regardless of hardware architecture.

Totally unequalled in the industry, Mektron Systems canprovide ATR based solutions suitable for direct forced-aircooling, indirect forced-air cooling and conduction cooling.

Commercial boards – hostile environment No Problem! – Call Mektron Systems

DescriptionMektron Systems’ extensive family of ATR system enclosures isprimarily designed for avionics tray mounting, however, they can beeasily adapted to suit other types of support /mounting structures.

Solutions exist to enable the safe, reliable and cost effectivedeployment of commercial, industrial or military-grade convectioncooled hardware in onerous airborne, naval or land mobile (vetronics)applications. Additionally, full military-grade conduction cooledrequirements can also be accommodated with Mektron’s extendedand uniquely versatile family of conduction cooled ATR enclosures.

This comprehensive and unequalled range of ATR enclosures hasevolved as a direct result of the company’s widely acknowledged

pro-active COTS stance, coupled with extensiveapplications experience gained throughinvolvement in major international air, sea and land defence projects.

The MA Series of turnkey powered ruggedCOTS system enclosures conform to ARINCspecifications and offer outstanding qualityand versatility for VME, VME64 Extensions,CompactPCI, VXI, Multibus II, PC, SUNbus and proprietary hardware use.

These enclosures are available in various casesizes from 1/4 ATR to 11/2 ATR and are suitablefor horizontal or vertical / top board loadapplications. Custom sizes and mountingoptions are also available. A flexible building

block approach enables a comprehensive array of application specificoptions to be incorporated. Completely assembled, harnessed andconfigured to customer requirements these enclosures form idealrugged system packaging solutions for immediate deployment indevelopment or target environments.

General Construction and FeaturesGenerally, all direct and indirect cooled ATR enclosures are fabricatedfrom 2mm or 3mm sheet aluminium with locking bushes being usedthroughout to ensure fixing integrity. Internal to the enclosure is arugged hard-mounted cardframe that can be shock and vibrationisolated if required. Constructed from high tensile strength extrusionswith screwed-down one-piece aluminium card guides, the cardframeis configurable for either top or side board loading.

The latest EMC design principles and practices are employed therebyguaranteeing an inherently good EMC performance. These enclosuresalso incorporate Mektron Systems’ own innovative ‘Crush-Fold’technology for extremely effective EMC integrity. This cost-effectivepatented technique providesgreatly enhanced strength andrigidity and superior EMCperformance with minimalfastener count and enhancedaesthetics. All panel interfaces arefully gasketed for optimum EMCand hermetic performance and allexternal connectors used areEMC tight.

Indirect Forced-Air CoolingA technique pioneered and patented by MektronSystems for ATR use, whereby the ambient air is isolatedfrom the air circulating inside the enclosure. The heatdissipated within the enclosure is pumped out via an

active or passive air-to-air heat exchanger. Suitable for the thermalmanagement of commercial, industrial or military-grade convectioncooled hardware in environments containing moisture laden orcontaminated ambient air.

This range of indirect forced-air cooled ATR enclosures has beendeveloped to enable the safe and cost effective deployment ofelectronic hardware in hostile ambient air conditions. High altitude fan options are available for operation at greater than 10,000 feet.

Direct Forced-Air CoolingThis is the most commonly used form of forced-aircooling, whereby ambient air is forced by the use of fansover the heat dissipating electronic hardware. Ideallysuited for the thermal management and effective

deployment of convection cooled commercial, industrial or military-grade hardware, providing that the ambient air is not laden withunfriendly or harmful contaminants such as moisture and salt fog.High altitude fan options are available for operation at greater than10,000 feet.

DIrect forced-air cooled ATRs can accommodate a number of thermalmanagement options, including front-to-back evacuation /pressurisedforced air, or a combination of both to give a ‘push-pull’ arrangement.The range can also be specially adapted for externally generatedducted forced-air via avionics mounting tray / plenum assembly. TheseATRs are fitted with honeycomb EMI filters and provision can bemade for air filtration if required.

Conduction CooledThese enclosures are frequently used for very onerousmilitary applications. The heat generated within theenclosure is strategically conducted through to the outersurfaces and ambient air is then used to cool these

surfaces. Certain applications may necessitate an external fan tomove the ambient air over the enclosure’s outer surfaces. Generallythese enclosures are hermetically sealed.

This family of conduction cooled ATR enclosures is manufactured fromprecision-machined aluminium and incorporate a versatile and patented‘High Integrity Frame’ construction technique; a revolutionary newapproach offering scalability, weight savings, excellent thermalefficiency, inherently high levels of manufacturing flexibility combinedwith significant cost benefits and reduced lead times.

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DIRECT

CONDUCTION

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INDIRECT

INDIRECT FORCED-AIR COOLED ATR ENCLOSURES FOR VME/EUROCARD ARCHITECTURESFor safe and reliable deployment of electronic hardware in moisture laden air conditions

DescriptionThe MA Series of indirect forced-air cooled ATR enclosureshas been developed to enable the safe, reliable and costeffective deployment of electronic hardware in moistureladen air conditions and is particularly suitable for the

thermal management of convection cooled commercial, industrial or military-grade hardware. Ambient air is isolated from the aircirculating inside the unit and the heat dissipated within is pumpedout via an active or passive air-to-air heat exchanger.

Mektron Systems has an unsurpassed and proven track record in theuse of airborne indirect system cooling technology; a technology thatis destined to become more common place as defence and civilequipment OEMs strive for safe and cost-effective deploymentmethods for COTS hardware.

As with all of Mektron’s ATR enclosure solutions, shock and vibrationisolation is available if required, along with high altitude fan optionsfor operation at greater than 10,000 feet.

Features and Benefits• Insulates internal electronic hardware from ambient atmosphere• Incorporates Mektron’s patented ATR ‘Heat Exchanger’ technology• Substantial cost savings over full MIL-Spec enclosures• Can be designed to meet most MIL / DEF.STAN specifications• VME, VME64 Ext’s, CompactPCI, Multibus II & proprietary buses • Mektron Systems’ military pedigree backplane options • DIN, IEC and IEEE 1101.10 compatible • 2mm / 3mm aluminium construction with locking bushes• Incorporates Mektron’s patented ‘Crush-Fold’ technology • Facility for shuttlised drives and /or embedded devices • Comprehensive range of power supply options• Wiring to DEF.STAN 61-12 Part 18 (limited toxicity)• High altitude fan capability• Excellent EMC performance to MIL-STD-461 and DEF.STAN 59-41

and TEMPEST• EMC tested – results available• Solutions to ARINC 404A specification• Top or side board loading• Hard-mounted or shock /vibration isolated rugged cardframe• DC, AC single- and three-phase power supply solutions to

MIL-STD-704D

Options• Full hardware and software integration• Shuttlised power supplies, drives and fans for quick MTTR• Drive provisions – hard-mounted or shock /vibration isolated• Special support /mounting structures • Mechanical iterations• EMC viewing window• Redundant power supplies• Quick access EMC panel to drives • Fan-fail indication and alarm generation• Climatic monitoring, control and alarm generation• Enclosure heaters• Bespoke colour scheming and silk screen printing• Hot Swap SCSI devices• I/O wiring and connector schemes• Composite transit /operating case• Other options available – consult Mektron Systems

Theory of OperationAs with direct forced-air convection cooling techniques the coolingmedium is air, however, the primary difference is that air internal tothe enclosure is isolated from the ambient conditions, instead ofambient air being directed into and through the enclosure. The airsealed within the confines of the enclosure is re-circulated underpressure over the heat dissipating hardware and an air-to-air heatexchanger that comprises a coldsink inside the enclosure and aheatsink external to the enclosure. Accordingly, the heated air insidethe enclosure is absorbed into the coldsink and dissipated into theheatsink and thereafter dumped to the ambient air on the outside.

This method of achieving thermal management is dependent on anumber of key factors, including, ambient air temperature, hardwaremaximum operating temperature and internal heat load. In essenceeach application has to be evaluated on an individual basis to ensureoptimum tuning of the thermal management system.

The heat exchanger can be either a ‘passive’ or ‘active’ device,depending on the above key parameters. An active heat exchangerwould generally include thermoelectric cooling devices sandwichedbetween the coldsink and heatsink elements. A thermoelectric cooler(TEC) is a small heat pump which has the advantage of no movingparts. Taking advantage of the Peltier Effect, these devices operate on direct current and may be used for heating or cooling simply byreversing the direction of current flow.

Typical indirect forced-air cooled ATR enclosure

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EXTERNAL FAN

HEATSINK

ELECTRONICHARDWARE

HIGH PRESSUREINTERNAL FAN

REAR

COLD SINK

FRONT

Cooling diagram showing airflow path for a typical indirect forced-aircooled VME/Eurocard ATR enclosure

INDIRECT

DIRECT FORCED-AIR COOLED ATR ENCLOSURES FOR VME/EUROCARD ARCHITECTURESFor safe and reliable deployment of electronic hardware in moisture free air conditions

DescriptionThe MA Series of direct forced-air cooled ATR enclosureshas been developed to enable the safe, reliable and costeffective deployment of electronic hardware in moisture

free air conditions. These enclosures, the first of their kind, weredeveloped specifically for deployment in very harsh environments andhave been used in many land, sea and air applications. Subsequently,over a number of years, Mektron Systems has gained substantialexperience developing many different types of enclosures for use in awide range of onerous environments. This has culminated in a familyof ATR solutions of unquestionable quality and cost effectiveness.Mektron’s solutions have been supplied into most of the majorinternational defence companies around the world.

Options• Full hardware and software integration

• Special support / mounting structures

• Mechanical iterations

• EMC viewing window

• Hot Swap SCSI devices

• Air filtration

• Enclosure heaters

• Quick access EMCpanel to drives

• Redundant powersupplies

• Fan-fail indication andalarm generation

• Climatic monitoring,control and alarm generation

• I/O wiring and connector schemes

• Bespoke colour scheming and silk screen printing

• Shuttlised power supplies, drives and fans for quick MTTR

• Drive provisions – hard-mounted or shock / vibration isolated

• Composite transit / operation case

• Other options available – consult Mektron Systems

Features and Benefits• Substantial cost savings over full MIL-Spec enclosures

• Comprehensive range of standard /custom ARINC sizes

• Tried and tested deployment history

• Can be designed to meet most MIL / DEF.STAN specifications

• VME, VME64 Ext’s, CompactPCI, Multibus II & proprietary buses

• Mektron Systems’ military pedigree backplane options

• Custom mounting options

• DIN, IEC and IEEE 1101.10 compatible

• 2mm / 3mm aluminium construction with locking bushes

• Incorporates Mektron’s patented ‘Crush-Fold’ technology

• Facility for shuttlised drives and/or embedded devices

• Honeycomb EMI air inlet /exhaust filters

• Cardframe inset options

• Cabling to DEF.STAN 61-12 Part 18 (limited toxicity)

• High altitude fan capability

• Excellent EMC performance to MIL-STD-461, DEF.STAN 59-41 and TEMPEST

• EMC tested – results available

• Meets ARINC 404A specification

• Designed for commercial, industrial and military-grade convectioncooled VME /Eurocard hardware

• Top or side board loading

• Hard-mounted or shock/vibration isolated rugged cardframe

• DC, AC single- and three-phase power supply solutions to MIL-STD-704D

• Evacuation, pressurised or ducted external forced-air cooling

Typical directforced-aircooled ATRenclosure forVME / Eurocard

slot 1 slot 3 slot 4 slot 10 slot 12

airfl

ow fp

m

0

100

200

300

400

500

600

700

800

Average Minimum Maximum

PSU MODULES WITH HEATSINKS

REARFRONT

VME CARD CAGE FAN

FAN

BACKPLANE

DIRECT

MPL International

Cooling diagram showing airflow path for a typical direct forced-aircooled ATR enclosure for VME/Eurocard

Airflow graph for a direct forced-air cooled 1 ATR Long / Tall 12-slot ATR enclosure

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DIRECT FORCED-AIR COOLED MULTI-PLATFORM ATR ENCLOSURES FOR PC & SUNBUS For safe and reliable deployment of electronic hardware in moisture free air conditions

Typical direct forced-air cooled Multi-Platform ATR enclosure

DescriptionThe MA Series of direct forced-air cooled Multi-PlatformATR enclosures has been developed to provide a safe,robust and cost effective operating environment for PC,

SUNbus and proprietary electronics in moisture free air conditions.Moreover, with Mektron’s enviable and acclaimed deployment history,the highest level of operational integrity is guaranteed. This range ofMulti-Platform ATR enclosures is fabricated from 2mm/ 3mm sheetaluminium and incorporates Mektron’s patented ‘Crush-Fold’technique for optimum strength, rigidity, EMC performance, aestheticsand reduced fastener count. Locking bushes are used throughout.

Faced with the prospect of deploying commercial-grade electronichardware in hostile environments, there are always a number of keyissues to be seriously considered. Typically, these include EMC, activehardware ruggedisation measures, shock/vibration, temperature,altitude and power characteristics etc. Mektron Systems has a wealthof experience in the deployment of commercial-grade electronichardware in hostile environments. With this impressive pedigree as abackground the customer is assured of due diligence, sound adviceand practical cost effective solutions.

Courtesy Aerosystems International

Features and Benefits• Substantial cost savings over full MIL-Spec enclosures• Tried and tested deployment history• Can be designed to meet most MIL / DEF.STAN specifications• ISA /PCI, SUNbus Ultra SPARC and proprietary buses • Custom mounting options• 2mm / 3mm aluminium construction with locking bushes• Incorporates Mektron’s patented ‘Crush-Fold’ technology • Facility for shuttlised drives and/or embedded devices • Honeycomb EMI air inlet /exhaust filters• Cabling to DEF.STAN 61-12 Part 18 (limited toxicity)• High altitude fan capability • Excellent EMC performance to MIL-STD-461, DEF.STAN 59-41

and TEMPEST• EMC tested – results available• Solutions to ARINC 404A specification• Designed for commercial-grade convection cooled hardware• Hard-mounted or shock /vibration isolated rugged rack• DC, AC single- and three-phase power supply solutions to

MIL-STD-704D and BS3G100• Evacuation, pressurised or ducted external forced-air cooling

Options• Full hardware and software integration• Special support /mounting structures • Mechanical iterations• EMC viewing window• Quick access EMC panel to drives • Redundant power supplies• Air filtration• Hot Swap SCSI devices• I/O wiring and connector schemes• Enclosure heaters• Fan-fail indication and alarm

generation• Climatic monitoring, control and alarm generation• Bespoke colour scheming and silk screen printing• Shuttlised power supplies, drives and fans for quick MTTR• Drive provisions – hard-mounted or shock /vibration isolated• Active hardware ruggedisation and evaluation service• Composite transit / operation case• Other options available – consult Mektron Systems

REAR

FRONT

POWER SUPPLYMODULES

DAUGHTER CARDCLAMPS

FAN

DRIVE BAYACCESS DOOR

ISA / PCI DAUGHTERCARDS

TRAY

ANTI-VIBRATIONMOUNT

BACKPLANE

MPL International

DIRECT

Cooling diagram showing airflow path for a typical direct forced-aircooled multi-platform ATR enclosure

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TYPICAL SPECIFICATIONS FOR MEKTRON SYSTEMS ATR ENCLOSURES

CONVECTION COOLED ATR ENCLOSURES

Properties Limits Appropriate Standards

Operating –40°C to +85°C MIL-STD-810ETemperature

Storage –40°C to +85°CTemperature

EMC With MIL-C-38999 MIL-STD-461Dconnectors fitted DEF.STAN 59-41

BS3G100TEMPEST

Power Inputs 28V DC MIL-STD-704A and -704E115V / 400 Hz Single-Phase MIL-STD-1275A115V / 400 Hz Three-Phase DEF.STAN 61-5 (Naval)

MIL-STD-1399 (Naval)EN50155 / RIA12 (Railway)

Wiring Limited Toxicity MIL-C-24643DEF.STAN 61-12 Part 18DEF.STAN 66-31

Mechanical Arinc 404A

IP Rating Direct cooling up to IP65Indirect cooling up to IP53

Vibration 15 to 2,000 Hz MIL-STD-810Eat 0.1g2 / Hz (RMS ~ 12g) Method 514.4 Category 5

MIL-STD-167DEF.STAN 66-31

Shock 20g for 11mS MIL-STD-810EMethod 516.4 Proc I & VI

Acceleration 13.5g MIL-STD-810EMethod 513.4 Proc I & II

Altitude 10,000 ft standard chassis MIL-STD-810E50,000 ft with high altitude fan

Humidity Up to 95% RH MIL-STD-810EMethod 507.3 Procedure III

Salt Fog 5% for 48 Hours MIL-STD-810EMethod 509.3

Fungal Growth No Growth MIL-STD-810EMethod 508.4

Thermal Shock Rapid change over Storage MIL-STD-810E& Operational Temperature Method 503.3 Procedure Irange

Sand & Dust Sand @ 95 ft /sec (29m/sec) MIL-STD-810EDust @ 29 ft /sec (8.9m/sec) Method dependant on filter

material

Epoxy Paint Resistant to contaminants MIL-C-22750FFinish DTD-5555A

CONDUCTION COOLED ATR ENCLOSURES

Properties Limits Appropriate Standards

Operating –55°C to +70°C MIL-STD-810ETemperature

Storage –62°C to +95°C Method 501.3 Procedure IITemperature Method 502.3 Procedure II

EMC CE01, CE03, MIL-STD-461DCS01, CS02, CS06 DEF.STAN 59-41RE01, RE02 BS3G100RS01, RS02, RS03 TEMPEST

Power Inputs 28V DC MIL-STD-704A and -704E115V / 400 Hz Single-Phase MIL-STD-1275A115V / 400 Hz Three-Phase DEF.STAN 61-5 (Naval)

MIL-STD-1399 (Naval)EN50155 / RIA12 (Railway)

Wiring Limited Toxicity MIL-C-24643DEF.STAN 61-12DEF.STAN 66-31

Mechanical Arinc 404AComplies with IEEE 1101.2

IP Rating IP68 MIL-STD-810EIM Immersion Method 512.3 Procedure I

Vibration 15 to 2,000 Hz MIL-STD-810Eat 0.1g2 / Hz (RMS ~ 12g) Method 514.4 Category 5

MIL-STD-167DEF.STAN 66-31

Shock 20g for 11mS MIL-STD-810EMethod 516.4 Proc I & VI

Acceleration 13.5g MIL-STD-810EMethod 513.4 Proc I & II

Altitude 50,000 ft MIL-STD-810EMethod 500.3 Procedure II

Humidity 95% NC for 240 Hours MIL-STD-810EMethod 507.3 Procedure III

Salt Fog 5% for 48 Hours MIL-STD-810EMethod 509.3

Fungal Growth No Growth MIL-STD-810EMethod 508.4

Thermal Shock Rapid change over Storage MIL-STD-810E& Operational Temperature Method 503.3 Procedure Irange

Sand & Dust Sand @ 5700 ft /min MIL-STD-810EDust @ 1750 ft /min Method 510.3 Proc I & II

Epoxy Paint Resistant to contaminants MIL-C-22750FFinish DTD-5555A

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CONDUCTION COOLED ATR ENCLOSURES FOR VME/EUROCARD ARCHITECTURESFor safe and reliable deployment of electronic hardware in hostile conditions

DescriptionThe MA Series of conduction cooled ATR enclosures is a non-compromise solution for harsh military use andprovides the highest level of environmental protectionfor VME and Eurocard electronic hardware that exceeds

the requirements of MIL-STD-810 and MIL-E5400. This family ofenclosures has evolved as a direct result of the company’sinvolvement in numerous major defence programmes whereequipment is required to operate in extremely hostile and demandingenvironments, particularly in fixed and rotary wing aircraft and landmobile vehicles.

Mektron Systems has pioneered an innovative ‘High Integrity Frame’construction technique (Patent File No. 9906082.4), which offerssignificant cost benefits, configuration flexibility and reduced leadtimes over traditional construction and fabrication productionmethods. Optimum thermal efficiency is achieved irrespective of the ambient airflow direction by utilising a specifically designedaerodynamic surface profile on the external panels.

A full range of standard size ARINC enclosures is available while therevolutionary construction technique allows for rapid semi- or full-custom design iterations.

Total flexibility and product integrity is assured by the incorporationof Mektron’s specially developed military-grade VME backplanes.Available in a number of slot sizes, conformally coated and fitted with stiffener bars, each backplane incorporates special topside userdefinable I /O breakout connector arrays for additional flexibility andsimplified wiring.

An extensive array of military-grade power supply options providesfor a wide range of output power budgets and prime power inputrequirements that can be met without compromise. Mektron Systemscan also provide I /O wiring and interconnect schemes along with fullsystem and software integration.

Features and Benefits• Withstands the most severe & hostile environments

• Designed for conduction cooled VME boards

• Lower cost than traditional construction techniques

• Mektron’s versatile and patented ‘HighIntegrity Frame’ design

• Complies with IEEE 1101.2

• Lightweight construction

• High efficiency thermal management

• AC single / three-phase or DC input

• Military VME, VME64 Extensions andCompactPCI backplanes

• P2/ P0 I/O breakout system forsimplified wiring

• Exceeds MIL-STD-810 and MIL-E5400

• Flexible and adaptable

• Semi- or full-customisation

Options• Full hardware and software integration

• Custom iterations

• Customised backplane

• Drive provisions – hard-mounted or shock/vibration isolated

• Bespoke colour scheming and silk screen printing

• Full I /O interconnection schemes and integration

• Flexi-circuit I /O schemes

• Special support /mounting structures

• Composite transit case

• Shuttlised drives and PSU for rapid MTTR

• Other options available – consult Mektron Systems

‘High Integrity Frame’ TechnologyConduction cooled enclosures are generallyassociated with expensive manufacturingtechniques as they are often designed in away that does not easily accommodatechange or practical scalability. Conventionalmethods of this type of manufacture caninclude wire erosion from a solid block,casting or bolted /dip braised machinedsections.

Mektron’s tried and tested ‘High IntegrityFrame’ technology (Patent File No. 9906082.4)overcomes all of these complexities without compromising thermal

efficiency or structural strength. Mektron’s revolutionary approachinvolves the use of a modular, high tensile strength skeletalframe which is precision-machined from aluminium andconsists of a number of interlocking sections thatincorporate EMC and hermetic gasket channels. Theassembled frame is held together with locking dowel pins.Special outer panels with an aerodynamically profiledsurface are then fixed to the frame.

This innovative technology combines low mass,excellent thermal efficiency and inherently high levels of

manufacturing flexibility with significant cost benefits and reducedlead times.

Conduction Cooled 1/2 ATR Enclosure (Terrington Systems)

Mektron’s ‘High Integrity Frame’ construction technique

CONDUCTION

Interlocking sections

Standard ATR Dimensions TableARINC SPECIFICATION 404A VME BOARD CAPACITY

CONVECTION COOLED CONDUCTION COOLEDATR Size Approx Volume Width (W) Length (L1) Length (L2) Max Height (H) Max Horizontal (Side) Vertical (Top) Horizontal (Side) Vertical (Top)

Board Load Board Load Board Load Board LoadIn3 Litre ±.03in ±.76mm ±.04in ±1.0mm in mm in mm Max No. Slots Max No. Slots Max No. Slots Max No. Slots

1/4 Short 215 3.52 2.25 57.15 12.52 318.0 12.62 320.5 7.62 193.5 n / a 1 slot n / a 1 slot1/4 Long 335 5.49 2.25 57.15 19.52 495.8 19.62 498.3 7.62 193.5 n / a 1 slot n / a 1 slot1/2 Short 470 7.70 4.88 123.95 12.52 318.0 12.62 320.5 7.62 193.5 n / a 5 slots n / a 5 slots1/2 Long 725 11.88 4.88 123.95 19.52 495.8 19.62 498.3 7.62 193.5 n / a 5 slots n / a 5 slots3/4 Short 720 11.80 7.50 190.50 12.52 318.0 12.62 320.5 7.62 193.5 n / a 8 slots n / a 8 slots3/4 Long 1120 18.36 7.50 190.50 19.52 495.8 19.52 493.8 7.62 193.5 n / a 8 slots n / a 8 slots1 Short 975 15.98 10.12 257.05 12.52 318.0 12.62 320.5 7.62 193.5 8 slots 12 slots 8 slots * 8 slots1 Long 1510 24.75 10.12 257.05 19.52 495.8 19.62 498.3 7.62 193.5 8 slots 12 slots 8 slots * 15 slots1 1/2 2295 37.62 15.38 390.65 19.52 495.8 19.62 498.3 7.62 193.5 8 slots 18 slots 8 slots * n / a

Notes: 1. Requires ‘Tall Box’ height dimension up to 296.88mm (10.625in) * When utilising ‘Tall Box’2. Where the maximum ‘H’ dimension shown is insufficient for equipment reasons, it is suggested that the ‘Tall Box’ maximum maximum = 13 slots

‘H’ dimension of 296.88mm (10.625in) be adhered to as specified in ARINC characteristic 561 INS

W + 0.14"(3.56mm) MAX

W + 0.14"(3.56mm) MAXL2 + 2.57" (65.28mm) MAX

L1

L2W

H

H +

0.0

63"

(1.6

0mm

) MAX

Dimensions of Standard ATR Unit

Mechanical Fragility Factors for Typical COTS System ComponentsVariation of atmospheric pressureand temperature with altitude

COMPONENT VIBRATING VIBRATING SHOCK SHOCKOPERATING NON-OPERATING OPERATING NON-OPERATING

VME Backplane 5 g – 20 g rms 5 g – 20 g rms 100 g 100 g

10 Hz – 2000 Hz 10 Hz – 2000 Hz 6 ms 6 ms

2 g Sinusoidal 2 g Sinusoidal

Convection Cooled 5 Hz – 500 Hz 5 Hz – 500 Hz 12 g – 20 g Peak 12 g – 20 g Peak

VME Daughter Boards 0.002 g2 / Hz (Random) 0.002 g2 / Hz (Random) Sawtooth, 11 ms Sawtooth, 11 ms

10 Hz – 2000 Hz 10 Hz – 2000 Hz

Conduction Cooled 0.1 g2 / Hz 0.1 g2 / Hz 40 g 40 g

VME Daughter Boards 5 Hz – 2000 Hz 5 Hz – 2000 Hz Sawtooth, 11 ms Sawtooth, 11 ms

– Military-Grade

Hard Disk Drive 0.1 g, 5 Hz – 32 Hz 0.1 g, 5 Hz – 28 Hz 5 g 75 g

0.5 g, 32 Hz – 400 Hz 4 g, 28 Hz – 400 Hz

Floppy Disk Drive 0.5 g, 5 Hz – 55 Hz 5 g, 5 Hz – 55 Hz 0.5 g 40 g

CD ROM 0.3 g, 5 Hz – 300 Hz 2 g, 7 Hz – 300 Hz 10 g 50 g

0.15 mm Peak 0.15mm Peak

Open Frame Power 10 Hz – 55 Hz 10 Hz – 55 Hz > 10 g > 10 g

Supply 2 g, 55 Hz – 500 Hz 2 g, 55 Hz – 500 Hz 10 ms 10 ms

ALTITUDE

Feet Metres

–820 –2500 0

820 2501,640 5002,461 7503,281 1,0004,921 1,5006,562 2,0008,202 2,5009,843 3,000

11,483 3,50013,123 4,00016,404 5,00019,685 6,00022,966 7,00026,247 8,00029,528 9,00032,808 10,00049,213 15,00065,617 20,00082,021 25,00098,415 30,000

104,987 32,000

AIR PRESSURE

mbar PA

1,030 104,3651,000 101,325

971 98,358942 95,461914 92,635887 89,876835 84,560785 79,501737 74,692692 70,121649 65,780609 61,660533 54,048466 47,218406 41,105352 35,652304 30,801262 26,500120 12,11255 5,52926 2,59412 1,1979 889

TEMPERATURE

Deg C Deg F

17 6215 5913 5612 5310 509 475 412 36

–1 30–4 24–8 18

–11 12–17 1–24 –11–30 –23–37 –34–43 –46–50 –58–57 –70–57 70–52 –61–47 –52–45 –48

Tel: +44 (0) 1234 272677 Fax: +44 (0) 1234 272688

CUSTOMISATION IS STANDARD

In addition to offering a comprehensive, versatile and flexible rangeof standard system ATR enclosure products, Mektron Systemsspecialise in addressing industry’s need for customised solutions.To Mektron Systems customisation is standard as the majority ofenclosure work undertaken is tailored to the individual applicationrequirements of our customers. Whether modifying an existingstandard product or generating a totally new bespoke design, ourunquestionable high levels of service and support ensures a costeffective and timely outcome – Right First Time!

Input / Output Wiring and Interconnect Schemes Mektron Systems offers a comprehensive and cost effective wiring and interconnection integration service from prototype through toproduction quantities. Backed up by numerous customer plaudits and unsolicited written references you can be assured of the highestpossible workmanship anddocumentation standards.Utilising standard equipmentwire, limited toxicity or otherspecial military-grade cablesin conjunction withcommercial or military styleconnectors, Mektron Systemscan provide a true ‘turnkey’solution from wiring listcompilation, flexi-circuit andtransition card design through to 100% continuity and short circuitATE testing. AC / DC wiring is to defence standards and utilises limitedtoxicity cable (DEF.STAN 61-12 and 66-31). Various I/O options areavailable including rear enclosure to tray DPX style connectors.

Power Supply SolutionsMektron Systems can offer a comprehensive range of power supplyoptions that can be tailored specifically to meet the wide ranging anddemanding application requirements of the MA Series of rugged ATRenclosures. The flexibility of these enclosures can accommodatealmost any version of MIL-Spec or commercial power supply in therange of 200- to 1600-watt, AC single / three-phase 45 to 440Hz inputor DC input. Provision can also be made for redundant N+1 or hot swap plug-in power supply solutions for quick MTTR. Optionscan include AC and DC power rail monitoring and alarm generation.Mektron Systems offer a wealth of experience in the choice andintegration of cost effective enclosure power systems for COTSairborne, seagoing and land mobile applications.

Electronics Hardware and Software IntegrationAugmenting Mektron’s comprehensive ‘one-stop-shop’ service toindustry is the company’s impressive integration capabilities. Underthe auspices of BS EN ISO9001, the customer’s choice of hardwareand software can be fully integrated and dynamically exercised to a mutually agreed Factory Acceptance Test (FAT) schedule. MektronSystems continually receives written plaudits for its extensiveintegration activities and performance achievements.

Type Approval TestingMany of Mektron’s ATR enclosure designs have been throughextensive ‘Type Approval Testing’. Accordingly, valuable analogy /read-across data is available. However, particularly for customapplications, Mektron Systems can organise and project manage fullqualification test programmes.

Typical Mektron Systems designed customATR enclosures

Typical value added services

Input /Output wiring and interconnectschemes

Quality and TestAll of Mektron Systems’ standard and custom system enclosuresundergo a comprehensive test and inspection schedule coveringevery facet of system build, function and safety, guaranteeingcomplete product integrity. A full test / inspection report, C of C and D of C comes with every system.

WarrantyAll of our system enclosures are covered by a 12-month warranty fromthe date of shipment. The warranty covers all mechanical items,backplanes, power supplies, cooling fans, components, cables,connectors and switches but does not cover faults attributed to misuse.

A wide range of power supply solutions

Tel: +44 (0) 1234 272677 Fax: +44 (0) 1234 272688

ActiveBoard

Hardware

OperatingSystem

I / O Wiringand

Interconnect

IntelligentClimatic

Controller

DriveDevices

FactoryAcceptanceTest (FAT)

EnvironmentalTesting

EMCTesting

DESIGN AND ENGINEERING

Design and Analysis Tools The cornerstone of Mektron’s ‘Right First Time’ ethos is thecompany’s progressive training and investment programme in ‘stateof the art’ design and analysis tools. For example, software toolsinclude; 3D interactive solid modelling, stress analysis, thermalanalysis /CFD (Computational Fluid Dynamics), reliability /MTBFcalculation, EMC, circuit design, simulation and PCB layout.

OPTIONS AND ACCESSORIES

High Altitude FansSome aerospace applications need fans to operate in an unpressurisedenvironment up to altitudes of 50,000 feet or more. As altitudeincreases the air density decreases, this has two effects on a fan forwhich the choice of fan must compensate.

Firstly, as air density decreases, the work that the fanhas to do reduces. As a result, the speed of the fan willincrease generating additional heat from the motor.To compensate, high altitude fans are designed toensure that adequate heat can be dissipated to copewith such operation.

Fans are essentially constant volumetric devices, so asair density decreases, the air mass flow through a standard fan willdecrease. Since most fan applications are to provide cooling airflow,and cooling capacity is proportional to mass flow, this can cause asystem problem. To deal with this, high altitude fans compensate forlower air densities by increasing their speed. Although they don’tprovide a constant mass flow, they approximate to it much moreclosely than a standard fan.

High altitude fans are specifically designed to run at rotation speedsof up to 23,000 RPM and incorporate high quality bearings, highquality grease (operating temp. –55°C to +100°C) and an additionalgrease reservoir. Metal housings and rotors are used to producebetter thermal management from fan to surrounding fixings. Bearingsare semi-sealed to prevent salt fog and moisture ingress.

These fans are designed in accordance with MIL-Q-23071 and arequalified and tested in accordance with MIL-STD-801. Power optionsinclude 28V DC, 115V AC, single- or three-phase, 50, 200 or 400 Hz,all compliant to MIL-STD-704.

Intelligent Climatic ControlThe Climatic Control Module has been developedby Mektron Systems to enable the use ofcommercial electronic hardware, typicallyoperating over the range of 0°C to +50°C, inotherwise extreme temperature environments.This innovative and compact device has helpedconsiderably with the deployment of COTShardware in military and associated applications.

Mektron’s airflowmeasurement and

analysis equipment

Shock and Vibration IsolationMektron Systems can advise, recommend and implement shock andvibration isolation solutions, whether internal or external, to theenclosure.

“Do I need shock and/or vibration isolation?” is a frequently askedquestion. In essence the answer is dependent on information relatingto the operational function of the unit, test shock and vibrationconditions, and relevant hardware fragility factors of the componentsused.

It follows, therefore, that should the unwanted effects of shock andvibration be minimised, the isolation system must be carefully tunedin accordance with input characteristics, desired outputcharacteristics and the equipment’s mass and centre of gravity.

Occasionally, however, not all of the necessaryinput data is available. In such cases MektronSystems’ extensive experience can play animportant role in advising and, if necessary,evaluating hardware fragility.

An ATR enclosure is particularly well suited toexternal isolation through its mounting tray /support structure. Mektron Systems offers a fullrange of standard and custom mounting trayssuitable for effective shock /vibration isolation.

Typical vibration response graph showing input vibration relative toattenuated output after isolation (calculated output)

Vibration Response Chart (Calculated)

1.00E-08

1.00E-07

1.00E-06

1.00E-05

1.00E-04

1.00E-03

1.00E-02

1.00E-01

1.00E+00

1.00E+01

10 100 1000Frequency Hz

Rand

om V

ibra

tion

PSD

g2 /Hz

Input Vibration

Attentuated Output

Typical high altitude fan

Climatic Control Module

Power up from cold

Is temp. within boardspec (Tc)?

Is external / prime input heater power available?

Is temp. within PSUspec?Apply power to heaters

Is temp. within boardspec (Tc)?

Apply power to card

Turn heaters off at Tc + 10°C*

Set fans to run to Lineartemp. control mode

Apply power to:a) cardb) cage

Do nothing

Apply power to heater element only

Is temp. within board spec (Tc)?

Is Load > Heater Load?

Run fans at slow speed

Apply heater power tillTa = Tc +(10°C / Power diff)*

Set fans to run to Linear temp.control mode

NN

N

N

N

N

Y

Y

Y

Y YY

*Chassis specific values

Thermal management flow process of Intelligent Climatic Control ModuleMounting tray with isolation mounts

Tel: +44 (0) 1234 272677 Fax: +44 (0) 1234 272688

VME and VME64 Extensions COTS BackplanesMektron Systems has a complete range of high performance VME andVME64 Extensions backplanes that have been designed specificallyfor ruggedised military COTS as well as for use with any benigncommercial or industrial application. It is believed that thesebackplanes are industry’sfirst and only COTS VMEbackplane family designedprimarily for militaryapplications. They offeroutstanding quality,versatility and costeffectiveness for any VMEproject.

The range is comprehensiveand is available with slotwidths from 1- through 21-slot. Irrespective of VMEformat, be it standard VME,VME64 Extensions or amixed configuration of both, the sophisticated design enables thesebackplanes to be manufactured from the same ten-layer controlledimpedance motherboard and then allows them to be configured tocustomer requirements at the assembly stage. Custom designiterations can also be incorporated.

The advanced design of these backplanes also enables anyenvironmental build level from full ruggedised MIL-Spec to

commercial industrial standard, all from the same bareboards that are released to MIL-P-55110 and are thenpopulated from stock. This combined approach offersoptimum configurational flexibility and significantlyreduced lead times whilst ensuring cost competitiveness.

Utilising industry proven and established Pressfitconnector technology, Mektron Systems’ backplane rangecan be populated with any permutation of 3- or 5-row J1/J2 or ‘A’ / ’B’ style PO connectors.

Ruggedised build level backplanes use high specification componentsand are conformally coated. For high quality and reliability thecommercial build levelbackplanes are also fittedwith high specificationcomponents. The completerange is available withautomatic Bus Grant andIACK switching options.

All VME64 Extensionbackplanes, as well as allruggedised Military COTS versions, are fitted with vertical stiffenerbars that greatly alleviate the higher insertion / extraction forces

associated with the high density two-part connectors andprovide added rigidity. The advanced design also allowsthese stiffener bars to be utilised for enhanced powerdistribution.

Mektron Systems’ rugged backplanes are designed toexceed the specification requirements of MIL-STD-810Ewith an operating temperature of –55°C to +105°C, andthe ability to withstand shock to 40g for 11ms andvibration to 0.1g2/ Hz (12g RMS approx).

Support Structures and Mounting TraysMektron Systems offer many varied standard and custom supportstructures, mounting trays and avionic equipment trays for itsversatile range of ATR enclosures as well as many diverseelectromechanical and thermal interface systems. All of theseadditional items have been designed specifically for a wide range of fixed /rotary wing aircraft, land mobileand seagoing applications.

The company has great experience inproviding unique technology-basedsolutions to enclosure interfacingproblems. For instance, experience hasshown that shock and vibration isolatorsmust be selected in accordance with anumber of key system and environmentalparameters.

Mass Storage DevicesThe deployment and choice of mass storage devices for use in hostileenvironments is a matter for careful consideration. Mektron Systemshas a wealth of experience in this field and can offer proven highintegrity mass storage solutions, tailored to each specific application.Use of Mektron’s tried and tested techniques can mitigate theunwanted effects of adverse shock/vibration and climatic conditions,

enabling the useof cost effective,commercial-grade devices.A host ofsolutions areavailablewhether,embedded, hotswap shuttlisedor remote.

Composite Transportable Enclosures and Transit CasesA central feature of Mektron Systems’ comprehensive packagingservice to the defence industry is the supply of an extensive range oftransportable electronic enclosures and transit cases that have beendesigned specifically to protect valuable equipment from the hazardsencountered during transportation and the demands of harshenvironments.

These lightweight composite constructionenclosures and cases can be supplied asstandalone products or as part of anintegrated packaging solution. Hundreds ofusers worldwide have trusted the survivaland operational efficiency of theirequipment to this excellent range oftransportable enclosures and transit cases.

The company offers a broad line ofstandard transit cases, containers, and 19” rack mount enclosures,including EMI /RFI shielded products, and has the ability to producevirtually any custom application. This range can accommodate a widevariety of electronic solutions and incorporates excellent survivabilityand longevity with built in resistant to projectile impact. The units arehermetically sealed and have full MIL-Spec test history.

Unsurpassed military COTS pedigree

nequalled versatility

nequalled versatility

ARINC 404A tray with hold downsand isolation mounts

Composite enclosures / transit cases

Conformal coating inspection room

Mass storage device mounts

Tel: +44 (0) 1234 272677 Fax: +44 (0) 1234 272688

Mektron Systems Limited Miltron Systems Inc.Unit 8, Bedford Business Centre, Mile Road P O Box 377, North Easton, MA 02356-0377, USABedford, Bedfordshire MK42 9TW, UK Telephone: +1 508 238 7003Telephone: +44 (0)1234 272677 Fax: +1 508 238 6532Fax: +44 (0)1234 272688 E-mail: sales@miltron.comE-mail: info@mektron.co.uk Website: www.miltron.comWebsite: www.mektron.co.uk

Data subject to alteration ©Copyright 2000 Mektron Systems Limited E & OE Miltron Systems Inc. is a subsidiary of Mektron Systems Limited

S Y S T E M S I N C .

EMCTESTED

FM 39724

Mektron EMC has it’s own high

investment pre-compliance testfacility which isbacked up by asecond-to-none

consultancy serviceassuring a pro-active

and constructiveapproach to EMC

conformity.

EMC & TESTING FACILITY

Mektron Systems’ extensive system enclosure and hardwareintegration experience coupled with an enviable pedigree ofinvolvement in major international programmes has required thecompany to perform exacting EMC integrity testing. Importantly, thewealth of test history available represents fully hardware/softwareconfigured solutions and is therefore truly representative and hencefar more meaningful than just “screening effectiveness” figures, astypically quoted.

Accordingly, every Mektron Systems solution is designed from dayone in accordance with proven good EMC practice. For exampleMektron Systems has world-wide patent protection for its innovative‘Crush-Fold’ technology. A process that provides a cost effective, highstrength, superior EMC seal with minimal fastener count. The ‘Crush-Fold’ is now incorporated in many of Mektron Systems’ commercialand military grade enclosures supplied to customers who demand thehighest standards of EMI shielding.

Mektron Systems supply a widerange of powered enclosures,backplanes, rugged displays, consoles,conduction and convection cooled ATRenclosures and system packagingproducts in 19” technology as well ascomposite transportable electronicenclosures and transit cases. Busessupported include VME, VME64Extensions, CompactPCI, VXI, Multibus II,SUNbus, PC and proprietary. MektronSystems also offers a full hardware andsoftware integration service.

COMPANY OVERVIEW

Mektron Systems Limited specialise in the design, developmentand manufacture of standard and custom turnkey bus-based

system enclosures for commercial andmilitary applications.

Since its foundation in 1995 MektronSystems has swiftly established itself as a highly successful and distinguishedspecialist in the systems packaging market.The company’s immediate and continuingsuccess can be attributed to its highlyfocused and extensively experienced team

of engineers coupled with the ability to supply exactly what the discerningcustomer wants.

Mektron Systems Limited is an approvedsupplier to a rapidly growing number ofinternational blue chip commercial anddefence companies and has extensiveinvolvement in a number of majordefence programmes. Mektron Systems has full BS EN ISO 9001accreditation and is a recognised authority on EMC, has 100% testand inspection, CE conformity and a “right first time” ethos – allof which enables it to continually exceed customers’ expectations.

Mektron’s ‘Crush-Fold’ Technology.A process that provides a cost-

effective, high strength, superior EMCseal requiring minimal fasteners.

Patent No. 9721660.0Mektron Systems’ EMC Test Facility