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LTC3305
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For more information www.linear.com/LTC3305
TYPICAL APPLICATION
FEATURES DESCRIPTION
Lead-Acid Battery Balancer
The LTC®3305 balances up to 4 lead-acid batteries connected in series. It is intended to be used in conjunction with a separate pre-existing battery charger as part of a high performance battery system. All voltage monitoring, gate drive, and fault detection circuitry is integrated.
The LTC3305 employs an auxiliary battery or an alternative storage cell to transfer charge to or from each individual battery in the stack. A mode pin provides two operating modes, timer mode and continuous mode. In timer mode, once the balancing operation is completed, the LTC3305 goes into a low power state for a programmed time and then periodically rebalances the batteries. In continuous mode, the balancing operation continues even after the batteries are balanced to their programmed termination voltage.
The LTC3305 is available in a thermally enhanced 38-lead TSSOP package.
4-Battery Balancer with Programmed High and Low Battery Voltage Faults
Battery Voltages Converge Over Time
APPLICATIONS
n Single IC Balances Up to Four 12V Lead-Acid Batteries in Series
n All NFET Designn Stackable to Balance Larger Series Battery Packsn Standalone Balancing Operation: Requires No
External μP or Additional Control Circuitryn Balancing Current Limited by External PTC Thermistorn Continuous Mode and Timer Moden Programmable UV and OV Fault Thresholdsn Programmable Termination Time and Termination
Voltagen Thermally Enhanced 38-Lead TSSOP Package
n Telecom Backup Systemsn Home Battery Powered Backup Systemsn Industrial Electric Vehiclesn Energy Storage Systems (ESS)n Medical Equipment
L, LT, LTC, LTM, Linear Technology and the Linear logo are registered trademarks of Linear Technology Corporation. All other trademarks are the property of their respective owners.
BATTERY 4BATTERY 3BATTERY 2BATTERY 1
TIME3305 TA01a
16
14
12
10
8
6
4
2
0
BATT
ERY
VOLT
AGE
(V)
VREGEN1EN2MODETERM1TERM2
DONE
BATXBATYCTON
CTOFF
CTBAT
VL
VH
GND
LTC3305
AUXN
AUXP
V1
V2
V3
V4
CM CP
BOOST
NGATE1-9
ISET
UVFLTOVFLT
BALPTCFLT
10µF25V
10µF25V
10µF25V
10nF
100nF
10nF
27.4k
6.04k
1.33k
100k EACH
249Ω
6.04k
3.01k
6.04k
6.04k
42.2k
12.1k
10µF25V
10µF25V
9
6.04k
6.04k
6.04k
6.04k
1µF6V
10µF25V
NGATE5
NGATE6
NGATE7
NGATE8
NGATE9
3305 TA01
PTC
AUX10µF25V
NGATE4
NGATE3
NGATE2
NGATE1
BAT4
BAT3
BAT2
BAT1+
+
+
+
+
ICHARGE BATTERYSTACK
CHARGER
CHARGERSUPPLY
LTC3305
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For more information www.linear.com/LTC3305
PIN CONFIGURATIONABSOLUTE MAXIMUM RATINGS
Stack Voltage, V4 to GND .........................................68VBattery Voltages, V4 to V3, V3 to V2, V2 to V1, V1 to GND .................................................. –0.3V to 20VAuxiliary Cell Voltage, AUXP to AUXN ........ –0.3V to 20VVREG Voltage ................................................ –0.3V to 6VVH, VL Voltage ..... –0.3V to Lesser of 6V or (VREG+0.3V)UVFLT, OVFLT, PTCFLT, BAL, DONE, BATX, BATY Voltage ............................................... –0.3V to 6VEN1, EN2, MODE, TERM1, TERM2 Voltage ................ –0.3V to Lesser of 6V or (VREG+0.3V)NGATE1, NGATE2, NGATE3, NGATE4, NGATE8, NGATE9
Voltage .............. –0.3V to Lesser of 68V or (V4+0.3V)NGATE5, NGATE6, NGATE7
Voltage .............. (Greater of –0.3V or BOOST–68V) to (BOOST+0.3V)*
UVFLT, OVFLT, PTCFLT, BAL, DONE, BATX, BATY Current .........................................................10mAISET Current ..............................................................1mACP, CM Current.......................................................50mAOperating Junction Temperature Range (Notes 2, 3) ............................................ –40°C to 125°CStorage Temperature Range .................. –65°C to 150°CLead Temperature (Soldering, 10 sec) ................... 300°C
*The BOOST voltage is generated by the LTC3305 and is typically 8.45V higher than V4.
(Note 1)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
TOP VIEW
FE PACKAGE38-LEAD PLASTIC TSSOP
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
BOOST
V4
V3
AUXP
AUXN
V2
V1
NGATE1
NGATE2
NGATE3
NGATE4
NGATE5
NGATE6
NGATE7
NGATE8
NGATE9
BATX
BATY
OVFLT
CM
CP
NC
MODE
EN1
EN2
TERM1
TERM2
VREG
ISET
VH
VL
CTBAT
CTON
CTOFF
PTCFLT
DONE
BAL
UVFLT
39GND
θJA = 28°C/W
EXPOSED PAD (PIN 39) IS GND, MUST BE SOLDERED TO PCBNC = No Connect
ORDER INFORMATION
LEAD FREE FINISH TAPE AND REEL PART MARKING* PACKAGE DESCRIPTION TEMPERATURE RANGE
LTC3305EFE#PBF LTC3305EFE#TRPBF LTC3305 FE 38-Lead Plastic TSSOP –40ºC to 125°C
LTC3305IFE#PBF LTC3305IFE#TRPBF LTC3305 FE 38-Lead Plastic TSSOP –40ºC to 125°C
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.For more information on lead free part marking, go to: http://www.linear.com/leadfree/ For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/. Some packages are available in 500 unit reels through designated sales channels with #TRMPBF suffix.
(http://www.linear.com/product/LTC3305#orderinfo)
LTC3305
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For more information www.linear.com/LTC3305
ELECTRICAL CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
VBAT Individual Battery Voltage l 4 16 V
V4 Voltage at the Top of the Battery Stack l 12 64 V
VREG Regulator Output Voltage IVREG = 200µA l 2.4 2.5 2.6 V
VREG,UV Regulator Undervoltage Threshold Regulator Voltage Falling l 1.7 2.1 V
Hysteresis 125 mV
Maximum Guaranteed Load Current VREG > VREG,UV l 3 mA
Regulator Short Circuit Current Limit VREG = 0V 8 15 22 mA
Shutdown Current Measured at V4, BOOST-V4 = 0V Measured at V3, V2, V1, AUXP, BOOST
l
16 33 0
50 1
µA µA
Supply Current While Balancing Battery 1 (Notes 4, 5)
Measured at V4 Measured at V3 Measured at V2 Measured at V1
900 0 0
150
1350 1 1
225
µA µA µA µA
Supply Current While Balancing Battery 2 (Notes 4, 5)
Measured at V4 Measured at V3 Measured at V2 Measured at V1
–70
900 0
150 –45
1350 1
225
µA µA µA µA
Supply Current While Balancing Battery 3 (Notes 4, 5)
Measured at V4 Measured at V3 Measured at V2 Measured at V1
–70
900 150 –45 0
1350 225
1
µA µA µA µA
Supply Current While Balancing Battery 4 (Notes 4, 5)
Measured at V4 Measured at V3 Measured at V2 Measured at V1
–70
1050 –45 0 0
1575 1 1
µA µA µA µA
Supply Current While Balancing any Battery Measured at AUXP Measured at AUXN
–195
165 –130
245 µA µA
Supply Current in OFF State (MODE = 0) Measured at V4, BOOST-V4 = 0V Measured at V3, V2, V1, AUXP, BOOST
100 0
150 1
µA µA
Boost Pin Current While Balancing any Battery (Notes 4, 5)
220 330 µA
VISET ISET Servo Voltage 50µA< IISET< 150µA l 1.18 1.2 1.22 V
IVH, IVL Current Out of VH and VL Pins IISET = 100µA l 31.3 33.3 35.3 µA
INGATE Current For External NMOS Turn On (Note 5) Leakage Current in Shutdown
NGATE3 Current, IISET = 100µA All Other NGATE Currents, IISET = 100µA EN1 = EN2 = 0
l
l
l
2.0 1.0 –2
2.2 1.1
2.4 1.2 2
mA mA µA
Current Programmable Range NGATE3 Current All Other NGATE Currents
l
l
1 0.5
3 1.5
mA mA
VBAT,UV Undervoltage Falling Battery Threshold (Note 6) VL = 0.4V VL = 1.6V
l
l
3.9 15.6
4 16
4.1 16.4
V V
Undervoltage Hysteresis 120 mV
Undervoltage Falling Programmable Range l 4 16 V
VBAT,OV Overvoltage Rising Battery Threshold (Note 6) VH = 0.4V VH = 1.6V
l
l
3.9 15.6
4 16
4.1 16.4
V V
Overvoltage Hysteresis 150 mV
Overvoltage Rising Programmable Range l 4 16 V
The l denotes the specifications which apply over the specified operating junction temperature range, otherwise specifications are at TA = 25°C. (Note 2) V1 = 13.2V, V2 = 26.4V, V3 = 39.6V, V4 = 52.8V, AUXP - AUXN = 13.2V, RISET = 12.1kΩ
LTC3305
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For more information www.linear.com/LTC3305
The l denotes the specifications which apply over the specified operating junction temperature range, otherwise specifications are at TA = 25°C. (Note 2) V1 = 13.2V, V2 = 26.4V, V3 = 39.6V, V4 = 52.8V, AUXP - AUXN = 13.2V, RISET = 12.1kΩ
Note 1. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime.Note 2. The LTC3305 is tested under pulsed load conditions such that TJ ≈ TA. The LTC3305E is guaranteed to meet specifications from 0ºC to 85ºC junction temperature. Specifications over the –40ºC to 125ºC operating junction temperature range are assured by design, characterization and correlation with statistical process controls. The LTC3305I is guaranteed over the –40°C to 125°C operating junction temperature range. Note that the maximum ambient temperature consistent with these specifications is determined by specific operating conditions in conjunction with board layout, the rated package thermal impedance, and other environmental factors. The junction temperature (TJ, in °C) is calculated from the ambient temperature (TA, in °C) and power dissipation (PD, in Watts) according to the formula: TJ = TA + (PD • θJA), where θJA (in °C/W) is the package thermal impedance.
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
PTC Fault Threshold |BAT-AUXP| Falling 0.8 1 1.2 V
Hysteresis 100 mV
VTERMINATE |BAT-AUXP| for Which Balancing Is Terminated TERM2 = 0, TERM1 = 0 TERM2 = 0, TERM1 = 1 TERM2 = 1, TERM1 = 0 TERM2 = 1, TERM1 = 1
l
l
l
l
5.0 17.5 40 85
12.5 25 50
100
20.0 32.5 60
115
mV mV mV mV
Minimum (BOOST-V4) Voltage for Operation l 6.7 6.95 7.2 V
Hysteresis 180 mV
Maximum (BOOST-V4) Voltage Regulated l 8.45 8.75 V
Hysteresis 200 mV
RNMOS Charge Pump NMOS Switch ON Resistance Measured at 10mA 20 Ω
RPMOS Charge Pump PMOS Switch ON Resistance Measured at 10mA 55 Ω
tBAT Maximum Time a Single Battery Stays Connected to the Auxiliary Battery
CTBAT = 10nF 4.5 5 5.5 sec
tON Maximum Stack Balancing Termination Time MODE = 0, CTON = 10nF 0.43 0.48 0.53 hrs
tOFF Off Time After Stack Balance Termination MODE = 0, DONE = 0, CTOFF = 10nF 0.43 0.48 0.53 hrs
VIH Digital Input High Voltage EN1, EN2, MODE, TERM1, TERM2 Pins l 1.2 V
VIL Digital Input Low Voltage EN1, EN2, MODE, TERM1, TERM2 Pins l 0.4 V
IIH, IIL Leakage Current EN1, EN2, MODE, TERM1, TERM2 Pins; 2.5V at Pin
l –1 1 µA
VOL Output Low Voltage BATX, BATY, BAL, DONE, UVFLT, OVFLT, PTCFLT Pins; 3mA Into Pin
l 27.5 150 mV
IOH Output High Leakage Current BATX, BATY, BAL, DONE, UVFLT, OVFLT, PTCFLT Pins; 6V at Pin
1 µA
Thermal Shutdown Threshold (Note 7) Rising Temperature 155 °C
Thermal Shutdown Hysteresis 10 °C
Note 3. Continuous operation above the specified maximum operating junction temperature may result in device degradation or failure.Note 4. The NGATE pin currents are not included in this number.Note 5. The NGATE5, NGATE6, NGATE7 pin currents are drawn from the BOOST pin. All other NGATE pin currents are drawn from the V4 pin. The NGATE pin currents add to the currents drawn by V4 and BOOST.Note 6. The voltage programmed at the VH and VL pins are gained up to set the undervoltage and overvoltage thresholds of each battery. Note 7: This IC includes overtemperature protection intended to protect the device during momentary overload conditions. The maximum junction temperature may be exceeded when overtemperature protection is active. Continuous operation above the specified maximum operating junction temperature may result in device degradation or failure.
ELECTRICAL CHARACTERISTICS
LTC3305
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For more information www.linear.com/LTC3305
TYPICAL PERFORMANCE CHARACTERISTICS
INGATE vs IISET INGATE vs Temperature
IISET (µA)
I NGA
TE (m
A)
3305 G07
0.4
1.21.11.00.90.80.70.60.5
1.31.41.51.61.71.8
50 60 70 80 90 100 110 120 130 140 150
ALL NGATE PIN CURRENTS
AND NGATE3 CURRENT 2
V4 = 52.8V, VNGATE = 0V
UV Threshold vs Temperature
TEMPERATURE (°C)
I NGA
TE (m
A)
3305 G08
1.00
1.16
1.14
1.12
1.10
1.08
1.06
1.04
1.02
1.18
1.20
–55 –35 –15 5 25 45 65 85 105 125
ALL NGATE PIN CURRENTS AND NGATE3 CURRENT
V4 = 52.8V, VNGATE = 0V, RISET = 12kΩ2
TEMPERATURE (°C)
BATT
ERY
VOLT
AGE
(V)
3305 G09
4.75
4.80
5.20
5.15
5.05
5.10
5.00
4.90
4.95
4.85
5.25
–55 –35 –15 255 45 65 10585 125
RISING
FALLING
RISET = 12.1kRVL = 15k
TA = 25°C, unless otherwise noted.
OFF State Current vs Temperature
TEMPERATURE (°C)
I V4
(µA)
3305 G05
75
95
90
85
80
100
105
110
115
120
125
–55 –35 –15 5 25 45 65 85 105 125
V4 = 64V
V4 = 52.8V
V4 = 12V
VISET vs Temperature
TEMPERATURE (°C)
V ISE
T (V
)
3305 G06
1.180
1.190
1.185
1.195
1.200
1.205
1.210
1.215
1.220
–55 –35 –15 5 25 45 65 85 105 125
Shutdown Current vs Temperature
VREG,UV vs Temperature
TEMPERATURE (°C)
V REG
,UV
(V)
3305 G03
1.5
1.7
1.6
1.8
1.9
2.0
2.1
2.3
2.4
2.2
2.5
–55 –35 –15 5 25 45 65 85 105 125
RISING
FALLING
TEMPERATURE (°C)
I V4
(µA)
3305 G04
15
20
25
35
30
40
45
50
55
–55 –35 –15 5 25 45 65 85 105 125
V4 = 64V
V4 = 52.8V
V4 = 12V
VREG Line and Load Regulation VREG vs Temperature
TEMPERATURE (°C)
V REG
(V)
3305 G02
2.00
2.05
2.10
2.15
2.20
2.25
2.30
2.35
2.40
2.45
2.50
2.55
–55 –35 –15 5 25 45 65 85 105 125
IVREG = 3mA, V4 = 12VIVREG = 1mA, V4 = 52.8VIVREG = 0.2mA, V4 = 52.8V
CURRENT (mA)
V REG
(V)
3305 G01
0.0
0.40.2
0.60.81.01.21.41.61.82.02.22.42.62.83.0
0 3 6 9 12 15
V4 = 12V
V4 = 52.8V
LTC3305
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For more information www.linear.com/LTC3305
TYPICAL PERFORMANCE CHARACTERISTICS
25mV Termination Threshold vs Temperature
UV and OV Programming Gain
OV Threshold vs Temperature
12.5mV Termination Threshold vs Temperature
Maximum Battery Current During PTC Fault Condition
PTC Fault Threshold vs Temperature
UV Threshold vs Temperature
TEMPERATURE (°C)
BATT
ERY
VOLT
AGE
(V)
3305 G10
9.5
10.3
10.2
9.9
10.1
10.0
9.8
9.6
9.7
10.4
10.5
–55 –35 –15 255 45 65 10585 125
RISING
FALLING
RISET = 12.1kRVL = 30.1k
TEMPERATURE (°C)
I V1
(µA)
3305 G15
425
475
465
455
445
435
485
495
505
515
525
–55 –35 –15 255 45 65 10585 125
V1 = 13.2V, AUXN = AUXP = GND
TEMPERATURE (°C)
V TER
MIN
ATE
(mV)
3305 G16
2.5
18.5
16.5
14.5
12.5
10.5
8.5
6.5
4.5
20.5
22.5
–55 –35 –15 255 45 65 10585 125
TEMPERATURE (°C)
|V1-
AUXP
| (m
V)
3305 G14
900
1075
1100
1125
1150
1050
1000
1025
950
975
925
1175
1200
–55 –35 –15 255 45 65 10585 125
RISING
V1 = 13.2V, AUXN = GND
FALLING
VL OR VH (V)
V BAT
,UV/
V L o
r VBA
T,OV/
V H (V
/V)
3305 G13
9.5
10.0
10.1
10.2
10.3
9.9
9.7
9.8
9.6
10.4
10.5
0.4 0.5 0.6 1.11.00.90.7 0.8 1.2 1.3 1.51.4 1.6
UV GAIN
OV GAIN
TEMPERATURE (°C)
BATT
ERY
VOLT
AGE
(V)
3305 G12
14.4
14.9
15.0
15.1
15.2
14.8
14.6
14.7
14.5
15.3
15.4
–55 –35 654525–15 5 85 105 125
RISET = 12.1kRVH = 45.3k
RISING
FALLING
OV Threshold vs Temperature
TEMPERATURE (°C)
BATT
ERY
VOLT
AGE
(V)
3305 G11
7.20
7.55
7.60
7.65
7.50
7.40
7.35
7.30
7.45
7.25
7.70
–55 –35 654525–15 5 85 105 125
RISET = 12.1kRVH = 22.6k
RISING
FALLING
50mV Termination Threshold vs Temperature
TEMPERATURE (°C)
V TER
MIN
ATE
(mV)
3305 G17
15
31
29
27
25
23
21
19
17
33
35
–55 –35 –15 255 45 65 10585 125TEMPERATURE (°C)
V TER
MIN
ATE
(mV)
3305 G18
40
56
54
52
50
48
46
44
42
58
60
–55 –35 –15 255 45 65 10585 125
TA = 25°C, unless otherwise noted.
LTC3305
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For more information www.linear.com/LTC3305
TYPICAL PERFORMANCE CHARACTERISTICS
Boost Charge Pump Start-Up
Minimum Boost Voltage vs Temperature
100mV Termination Threshold vs Temperature tON, tOFF vs Temperature
tBAT vs Temperature VOL vs Temperature
VREG Start-Up
100µs/DIV
500mV/DIV
CVREG = 2.2µF
0V
3305 G245ms/DIV
CH2, 0V5V/DIV
CH1, 0V2V/DIV
VOLTAGE ACROSS CBOOST
VOLTAGE ACROSS CFLY
3305 G25
TEMPERATURE (°C)
V OL
(mV)
I = 3mA
3305 G23
15.0
40.0
37.5
35.0
32.5
30.0
27.5
25.0
22.5
20.0
17.5
42.5
45.0
–55 –35 –15 255 45 65 10585 125TEMPERATURE (°C)
TIM
E (S
ECON
DS)
CTBAT = 10nF (COG)
3305 G22
4.5
5.3
5.2
5.1
5.0
4.9
4.8
4.7
4.6
5.4
5.5
–55 –35 –15 255 45 65 10585 125
TEMPERATURE (°C)
TIM
E (H
OURS
)
V4 = 52.8VCTON = CTOFF = 10nF (COG)
3305 G21
0.450
0.505
0.500
0.495
0.490
0.485
0.480
0.475
0.470
0.465
0.460
0.455
0.510
–55 –35 –15 255 45 65 10585 125TEMPERATURE (°C)
V BOO
ST-V
4 (V
)
3305 G20
6.5
7.0
6.9
6.8
6.7
6.6
7.1
7.2
–55 –35 –15 255 45 65 10585 125
RISING
FALLING
TEMPERATURE (°C)
V TER
MIN
ATE
(mV)
3305 G19
90
104
106
98
100
102
96
92
94
108
110
–55 –35 –15 255 45 65 10585 125
TA = 25°C, unless otherwise noted.
LTC3305
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For more information www.linear.com/LTC3305
PIN FUNCTIONSBOOST (Pin 1): Charge Pump Output. Decouple with a 10µF capacitor to V4.
V4 (Pin 2): Positive terminal of Battery 4 connects to this pin. Battery 4 is connected between V4 and V3. Decouple with at least a 10µF capacitor to V3.
V3 (Pin 3): Positive terminal of Battery 3 connects to this pin. Battery 3 is connected between V3 and V2. Decouple with at least a 10µF capacitor to V2.
AUXP (Pin 4): Positive terminal of the auxiliary cell con-nects to this pin. Decouple with at least a 10µF capacitor to AUXN.
AUXN (Pin 5): Negative Terminal of the auxiliary cell con-nects to this pin.
V2 (Pin 6): Positive terminal of Battery 2 connects to this pin. Battery 2 is connected between V2 and V1. Decouple with at least a 10µF capacitor to V1.
V1 (Pin 7): Positive terminal of Battery 1 connects to this pin. Battery 1 is connected between V1 and GND. Decouple with at least a 10µF capacitor to GND.
NGATE1 (Pin 8): NMOS1 Gate. Connect to the gate terminal of external NMOS switch.
NGATE2 (Pin 9): NMOS2 Gate. Connect to the gate terminal of external NMOS switch.
NGATE3 (Pin 10): NMOS3 Gate. Connect to the gate ter-minal of external NMOS switch.
NGATE4 (Pin 11): NMOS4 Gate. Connect to the gate ter-minal of external NMOS switch.
NGATE5 (Pin 12): NMOS5 Gate. Connect to the gate ter-minal of external NMOS switch.
NGATE6 (Pin 13): NMOS6 Gate. Connect to the gate ter-minal of external NMOS switch.
NGATE7 (Pin 14): NMOS7 Gate. Connect to the gate ter-minal of external NMOS switch.
NGATE8 (Pin 15): NMOS8 Gate. Connect to the gate ter-minal of external NMOS switch.
NGATE9 (Pin 16): NMOS9 Gate. Connect to the gate ter-minal of external NMOS switch.
BATX (Pin 17): This pin along with BATY indicates which battery in the stack is currently being balanced and to which the fault outputs apply. Open Drain Output.
BATY (Pin 18): This pin along with BATX indicates which battery in the stack is currently being balanced and to which the fault outputs apply. Open Drain Output.
OVFLT (Pin 19): Overvoltage Fault. This pin is pulled low when an overvoltage fault condition is detected on a bat-tery. Open Drain Output.
UVFLT (Pin 20): Undervoltage Fault. This pin is pulled low when an undervoltage fault condition is detected on a battery. Open Drain Output.
BAL (Pin 21): Balancing Indicator. This pin is pulled low while the balancing operation is being performed and is in its high impedance state when the part is disabled or the part is in the sleep state. Open Drain Output.
DONE (Pin 22): Done Indicator. This pin is pulled low when all the batteries in the stack are balanced. This pin is in its high impedance state in shutdown. Open Drain Output.
PTCFLT (Pin 23): PTC Fault. This pin is pulled low when the voltage across the PTC thermistor exceeds 1V. It is in its high impedance state at all other times. Open Drain Output.
CTOFF (Pin 24): A capacitor from this pin to GND programs the retry time in timer mode. Connect to GND if MODE = 1.
CTON (Pin 25): A capacitor from this pin to GND programs the maximum time for the balancing operation in timer mode. Connect to GND if MODE = 1.
CTBAT (Pin 26): A capacitor from this pin to GND programs the maximum time an individual battery in the stack is con-nected to the auxiliary cell during the balancing operation.
VL (Pin 27): Low Voltage Fault Threshold. A resistor from this pin to GND programs the low voltage fault threshold for each battery in the series stack. Works in conjunction with the ISET pin.
VH (Pin 28): High Voltage Fault Threshold. A resistor from this pin to GND programs the high voltage fault threshold for each battery in the series stack. Works in conjunction with the ISET pin.
LTC3305
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ISET (Pin 29): Reference Current Pin that Servos to 1.2V. A resistor from this pin to GND programs the gate charge current for the external NMOS switches. The reference current is also used to program the undervoltage and overvoltage thresholds.
VREG (Pin 30): Low Voltage Regulated Output. An inter-nally generated voltage of 2.5V is always present at this pin. The voltage at this pin may be overdriven by a higher external voltage up to 5.5V. This pin has limited current sink capability and will not pull down a higher externally applied voltage. All logic input pins must be referenced to this pin. Decouple with a 1µF capacitor to GND.
TERM2 (Pin 31): Termination Threshold Select. This pin along with TERM1 is used to set the voltage difference between the battery and auxiliary cell at which a battery is deemed balanced. High input impedance pin, do not float.
TERM1 (Pin 32): Termination Threshold Select. This pin along with TERM2 is used to set the voltage difference between the battery and auxiliary cell at which a battery is deemed balanced. High input impedance pin, do not float.
EN2 (Pin 33): Enable Input. The state of the EN1 and EN2 pins is used to indicate the number of batteries in the stack. With both pins at GND, the part is in shutdown. High input impedance pin, do not float.
EN1 (Pin 34): Enable Input. The state of the EN1 and EN2 pins is used to indicate the number of batteries in the stack. With both pins at GND, the part is in shutdown. High input impedance pin, do not float.
MODE (Pin 35): Mode Select. When held high, continuous mode is selected. When held low, timer mode is selected. High input impedance pin, do not float.
No Connect (Pin 36): This pin is not connected internally. Solder this pin to a pad electrically isolated from all other circuit nodes.
CP (Pin 37): Positive Terminal of Charge Pump Flying Capacitor. Connect a 10µF capacitor from this pin to CM for charge pump operation.
CM (Pin 38): Negative Terminal of Charge Pump Flying Capacitor. Connect a 10µF capacitor from this pin to CP for charge pump operation.
GND (Pin 39): The exposed pad is ground and must be soldered to PCB ground for electrical connectivity and rated thermal performance.
PIN FUNCTIONS
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BLOCK DIAGRAM
37
2
3
6
7
29
28
27
31
32
4
5
38
8
9
10
11
12
13
14
15
16
24
25
26
30
33
34
35
17
18
19
20
21
22
23
GND
CP
CM
NGATE1
V4
V3
V2
V1
ISET
VH
VL
TERM2
TERM1
AUXP
AUXN
NGATE2
NGATE3
NGATE4
NGATE5
NGATE6
NGATE7
NGATE8
NGATE9
CTOFF
CTON
CTBAT
VREG
EN2
36NO CONNECT
EN1
MODE
BATX
BATY
BAL
OVFLT
UVFLT
DONE
PTCFLT
1
GATE DRIVE
BOOST
CHARGEPUMP
LOWVOLTAGE
REGULATOR
TERMINATIONSENSE
COMPARATOR
CONTROLLOGIC
BANDGAP
REFERENCE1.2V
THERMALSHUTDOWN OT
3305 BD
MIRROR V4
UV/OV
TIMERS
39
+–
MUX
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OPERATIONThe LTC3305 balancer is intended to be used in conjunc-tion with a separate pre-existing battery stack charger as part of a high performance battery system. The balancing operation itself is stand-alone and can operate independent of whether the battery stack is being charged, discharged, or both. That being said, because the LTC3305 balances voltages, it works best if the voltage readings are stable, which is more true when the battery stack is not being charged or discharged. Nevertheless, it will properly bal-ance the battery voltages when the stack is being concur-rently charged and/or discharged, since the voltage across the batteries will average out over time as the LTC3305 repeatedly cycles through them. Like all balancers, the LTC3305 will slightly net-discharge the stack in the absence of a separate charger.
The LTC3305 balances batteries using an auxiliary cell or an alternate storage cell as a charge reservoir. External NMOS switches are controlled in a preprogrammed sequence to connect each battery in the stack to an auxiliary cell. Charge is transferred to or from the auxiliary cell when it is connected to a battery.
The LTC3305 can operate in one of two modes program-mable via the MODE pin.
Timer Mode (MODE = 0)
The balancing operation begins once the CBOOST capacitor is charged to at least 6.95V. The BAL pin is pulled low, indicating that the part is enabled and balancing the bat-tery stack.
The termination voltage, VTERMINATE, is the difference in voltage between the auxiliary cell and the battery connected to the auxiliary cell for which a battery is considered to be balanced. VTERMINATE is programmed via the TERM1 and TERM2 pins to one of four preset voltages as shown in Table 1. Table 1. Termination Voltages
TERM1 TERM2 VTERMINATE
0 0 ±12.5mV
1 0 ±25mV
0 1 ±50mV
1 1 ±100mV
The balancing operation begins with the negative terminal of the auxiliary cell connected to the negative terminal of BAT1, the lowest battery in the stack. Referring to Figure 1, the bottom switches N1 and N9 that connect the negative terminal of BAT1 to the auxiliary cell’s negative terminal are first turned on. To turn on an external NMOS switch, the current source at the NGATE pin connected to the gate of the external NMOS is turned on and a gate source voltage is developed across an external resistor.
After an internally set delay of 35ms, the voltages across the auxiliary cell and BAT1 are compared by the termina-tion sense comparator.
If the voltage difference between the auxiliary cell and BAT1 is less than the selected termination voltage, the battery is deemed to be balanced with respect to the auxiliary cell and the bottom switches are turned off by turning off the corresponding NGATE pin currents. The next battery in the stack is then connected to the auxiliary cell.
Figure 1. External Switch Arrangement for a 4- Battery Balancing Application
NGATE5
N5
N4
N6
NGATE4BAT4
N3B
NGATE3
NGATE2N3A
BAT3
BAT2
BAT1
3305 F01
+
+
+
+
+AUX
PTC
NGATE6
NGATE1-9
LTC3305
AUXP
AUXN N2
N7
N8
N9
NGATE7
NGATE8 NGATE1
N1NGATE9
9
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OPERATION
Table 2. Top and Bottom Switch Arrangement
EN1, EN2BATTERY BEING
BALANCEDTOP
SWITCHESBOTTOM
SWITCHES
1,1 (4 Bat App)
Battery 1 N2, N7 N1, N9
Battery 2 N3, N6 N2, N8
Battery 3 N4, N7 N3, N9
Battery 4 N5, N6 N4, N8
1,0 (3 Bat App)
Battery 1 N2, N7 N1, N8
Battery 2 N4, N6 N2, N9
Battery 3 N5, N7 N4, N8
0,1 (2 Bat App)
Battery 1 N7 N9
Battery 2 N5 N8
If the voltage difference between the auxiliary cell and BAT1 is greater than the selected termination voltage, the top NMOS switches N2 and N7 that connect the positive terminal of BAT1 to the auxiliary cell’s positive terminal through the PTC thermistor are turned on. After a second internally set delay of 35ms, the termination sense com-parator starts monitoring the voltages across the auxiliary cell and the battery. The battery stays connected to the auxiliary cell until the voltage difference decreases to VTERMINATE or a tBAT timeout occurs (tBAT is the maximum time that a battery remains connected to the auxiliary cell and is programmed by a capacitor on the CTBAT pin). This timer is reset each time the auxiliary cell is connected to a different battery.
At this point, all switches are turned off and the next bat-tery in the stack is connected to the auxiliary cell. After the switches have been turned off, an internal 40ms delay provides a break-before-make time after which the nega-tive terminal of the next battery in the stack is connected to the negative terminal of the auxiliary cell via its bottom switches. Table 2 shows the top and bottom switches used to connect each battery for different battery stack configurations. When only the bottom switches are on, there is a conduction path between the auxiliary cell and the battery through the body diodes of the top switches. Current will flow through this conduction path if the aux-iliary cell and the battery are more than two diode drops apart. The current is limited by the PTC resistor.
In this fashion each battery in the stack is connected to the auxiliary cell and the batteries in the stack will be balanced.
An internal clamp circuit protects the LTC3305 when the voltage difference between the battery being balanced and the auxiliary cell is greater than 1V. With a 13.2V difference, the clamp draws 475µA of current. In the worst case scenario, a 16V difference may appear between the auxiliary cell and a battery. The internal clamp draws 600µA of current in this scenario.
In the state when both the top and bottom side switches are turned on, the PTCFLT pin will be pulled low if the voltage difference between the battery being balanced and the auxiliary cell is greater than 1V. If during the balancing operation the voltage difference becomes less than 1V, the PTCFLT pin returns to its high impedance state.
The BATX and BATY pins indicate which battery in the stack is currently connected to the auxiliary cell as shown in Table 3. In shutdown, the BATX and BATY pins are in a High Z state and the BAL pin is also in a High Z state.
Table 3. State of BATX and BATY Pins STATE OF OPERATION BATX BATY
Battery 1 Connected High Z High Z
Battery 2 Connected High Z 0
Battery 3 Connected 0 0
Battery 4 Connected 0 High Z
Once all batteries in the stack are balanced the DONE pin is pulled low, the BAL pin is in its high impedance state and the part is put in a low power OFF state.
A four-battery stack is deemed balanced when the ter-mination sense comparator detects VTERMINATE on five consecutive cycles that connect each of the batteries to the auxiliary cell using the bottom switches only.
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In timer mode, a capacitor at the CTON pin programs the maximum time, tON, that the balancing operation can run for. The balancing operation is terminated either when the batteries in the stack are deemed to be balanced or a tON time out occurs. After the balancing operation has been terminated, the LTC3305 is put in a low power OFF state for a fixed time, tOFF. The tOFF time is programmed by a capacitor at the CTOFF pin. In the OFF state, the BAL pin is put in its high impedance state. Once tOFF times out, the LTC3305 is put back in its ON state and the balancing operation begins again. The tON timer may be defeated by tying the CTON pin to GND. In this scenario, the LTC3305 will enter the OFF state only when all the batteries in the stack are deemed to be balanced.
Continuous Mode (MODE = 1)
In the continuous mode of operation the part functions in much the same way as in timer mode with the following differences.
1. There is no ON or OFF state. The CTON and CTOFF pins must be tied to GND in continuous mode. The balanc-ing operation continues even if the stack is in balance. The balancing operation is terminated only if the part is put in shutdown. The BAL pin is always pulled low in continuous mode.
2. In timer mode, if the termination comparator senses that a battery is balanced to the auxiliary cell with only the bottom plates connected, the balancing operation on that battery is terminated. This is not the case in continuous mode. In continuous mode the top switches are turned on and the balancing operation on a battery is terminated only by a tBAT time out. Since the auxiliary cell remains connected to the battery until a tBAT time out occurs, its voltage can change before it connects to the next battery in the stack. As a result, when the stack is balanced and the DONE pin is pulled low, the voltages across the individual batteries in the stack may differ by more than the programmed VTERMINATE. In the worst case when the capacity of the auxiliary cell is much smaller than the battery, the individual battery
OPERATIONvoltages could differ by up to twice the programmed VTERMINATE when balanced.
Charge Pump Operation
The LTC3305 uses external NMOS devices as switches to connect a battery to the auxiliary cell. The LTC3305 has a charge pump that generates the higher voltage required to turn on some of the external NMOS switches.
Two external capacitors CFLY and CBOOST, two diodes D1 and D2, and resistors R1 and R2 are required for charge pump operation as shown in Figure 2. When the LTC3305 is enabled, the charge pump is turned on. CFLY initially charges with a current ICHG through external diode D1, resistor R1, and the internal NMOS switch N1 to GND. When CFLY is charged to 10.5V, an internal comparator switches the internal NMOS switch off and turns on switch P1. CFLY connects to CBOOST through diode D2, resistor R2 and the internal PMOS switch P1. Charge is transferred from CFLY to CBOOST with a current IDISCHG. When CFLY is discharged to 9.5V, it is disconnected from CBOOST, recharged back up to 10.5V, and then reconnected to CBOOST. In this fashion the voltage across CBOOST is built up.
Figure 2. Charge Pump Operation
ICHG
R1
R2
D1
D2
V4
P1
N1BOOST
CBOOST
3305 F02
CFLY
CM CP
IDISCHG
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OPERATIONOnce the CBOOST capacitor has 6.95V across it, balancing begins. When CBOOST is charged to 8.45V, the charge pump operation is disabled and CFLY remains connected to CBOOST. Charge pump operation resumes when CBOOST discharges to 8.25V.
Undervoltage and Overvoltage Fault Detection
The undervoltage and overvoltage thresholds can be programmed using the resistor at the ISET pin in con-junction with resistors at the VL and VH pins. The voltage present at the VL or VH pin programs the corresponding fault threshold to 10× that voltage for each battery in the stack. An internal amplifier accurately gains up the voltage at the VL and VH pins and shifts the threshold voltage to the appropriate battery common mode level. The VL and VH pins have a programming range from 0.4V to 1.6V. The internal undervoltage and overvoltage comparators may not trip correctly for a program voltage outside this range. An internal clamp prevents the thresholds from being programmed to greater than 20V.
When an undervoltage or overvoltage fault condition is detected, the corresponding UVFLT or OVFLT pin is pulled to GND. The balancing operation is not interrupted during this time. If an undervoltage or overvoltage fault condition goes away during the balancing operation, the correspond-ing fault pin returns to its high impedance state.
If the undervoltage and overvoltage fault detection is not needed, the VL and VH pins must be tied to GND. The UVFLT and OVFLT pins may either be tied to GND or left floating.
Low Voltage Regulator
The LTC3305 has an always on regulator that provides 2.5V at the VREG pin. The VREG pin may be driven externally up to 5.5V. The VREG pin cannot sink current and will not pull down an externally applied voltage. The regulator can source up to 3mA of current. If more than 3mA of current
is drawn from the regulator, the VREG voltage will drop below its undervoltage threshold, disabling the LTC3305 and terminating the balancing operation. The balancing operation restarts when the regulator recovers from its undervoltage state. In short circuit, the VREG current is limited to 15mA. The VREG pin should be decoupled with at least a 1µF capacitor to GND.
Thermal Shutdown
The LTC3305 has an overtemperature detect circuit that shuts down the balancing operation when the internal silicon junction temperature exceeds 155°C. The LTC3305 resumes balancing when the temperature drops to 145°C. In thermal shutdown, the low voltage regulator remains powered.
Balancing Battery Stacks with Two or Three Batteries
The LTC3305 can also be configured to balance battery stacks of two or three batteries. The state of the enable pins tells the LTC3305 to select the correct switch sequencing. For a two battery stack, the LTC3305 must be enabled with EN1 = 0 and EN2 = 1. For a three battery stack, the LTC3305 must be enabled with EN1 = 1 and EN2 = 0. The external NMOS switch arrangements for a two-battery and three-battery application are shown in Figures 3 and 4 respectively. If pin NGATE6 is unused, it must be con-nected to the BOOST pin. All other unused NGATE pins must be connected to V4 as shown in Figures 3 and 4.
A two battery stack is deemed balanced if the termination sense comparator senses the voltage difference between the auxiliary cell and the battery is less than VTERMINATE on three successive cycles when the auxiliary cell and a battery are connected using only the bottom switches.
In the case of a three battery stack, four successive cycles are required to deem the stack balanced.
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Figure 3. Two-Battery Application Showing External Switch Arrangement
4
4
BAT2
22µF25V
10µF25V
249Ω 1.33k
6.04k
10µF25V
10µF25V
10µF25V
6.04k
6.04k
6.04k
D2
D1
BAT1
3305 F03
AUX
AUXP
LTC3305
NGATE5, 7, 8, 9
NGATE1-4
NGATE6
BOOST
V1
V2
V3
V4
AUXN
GND
PTC
+
VREGEN1
EN2MODE
TERM1TERM2
DONE
BATXBATYCTON
CTOFF
CTBAT
VL
VH
ISET
UVFLTOVFLT
BALPTCFLT
10nF
100k EACH
100nF
22nF
27.4k
42.2k
12.1k
1µF6V
+
+
NGATE5
ALL NMOS DEVICES = SiR882DPD1, D2 = CMMSH1-100
CM CP
NGATE7
NGATE8
NGATE9
OPERATION
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Figure 4. Three-Battery Application Showing External Switch Arrangement
10µF25V
10µF25V
10µF25V
10µF25V
10µF25V
249Ω
D1
D2
6.04k
6.04k
6.04k
6.04k6.04k
6.04k
6.04k
6.04k
1.33k
3305 F04
AUXP
LTC3305
NGATE1, 2, 4-9
BOOST
V1
V2
V4
V3NGATE3
AUXNGND
VREGEN1EN2
MODE
TERM1TERM2
DONE
BATXBATYCTON
CTOFF
CTBAT
VL
VH
ISET
UVFLTOVFLT
BALPTCFLT
1µF6V
CM CP
8
BAT2
BAT3+
+
+BAT1
AUX+PTC
10nF
100k EACH
100nF
22nF
10µF25V
27.4k
42.2k
12.1k
NGATE6
NGATE8
NGATE7
NGATE9
NGATE1
NGATE2
NGATE4
NGATE5
ALL NMOS SWITCHES = SiR882DPD1, D2 = CMMSH1-100
OPERATION
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Selecting the PTC Thermistor
A PTC thermistor is a type of resistor with a Positive Tem-perature Coefficient that serves as a protection device by limiting its current above a certain threshold. The PTC device limits the peak current that transfers charge between the auxiliary cell and the battery. When the voltage across the PTC is small, the power dissipated in the PTC is small and the PTC resistance remains constant. As the voltage across the PTC increases, power dissipation in the PTC increases which causes the PTC temperature to rise. When the tem-perature reaches the Curie Temperature, further increases in voltage will cause the PTC resistance to increase rapidly, which limits the current through the device and thus limits the power dissipation in the PTC. This behavior is shown in the PTC Current Voltage Characteristics in Figure 5a. In this fashion the PTC serves to protect the external NMOS switches from operating outside of their SOA region.
As seen in the PTC Current Voltage Characteristics in Figure 5a, when the PTC has a small voltage or a high voltage across it, the current flowing through it is small. For small voltages, this is OK since the battery and the auxiliary cell are close to balance. For high voltages, this slows down balancing. To increase balance currents at high voltages a power resistor can be placed in parallel with the PTC device, as shown in Figure 5b. Additionally, multiple PTC resistors may be connected in parallel to increase current flow at all voltages.
PTC devices are manufactured in two styles: ceramic and poly fuse. Only a ceramic style PTC device should be used in this application. Poly fuse devices have a very limited number of lifetime trip cycles and are not suitable in a balancing application.
The PTC must be selected such that power dissipation through the external NMOS switches never exceeds their rated SOA power dissipation value. Refer to Table 4 for a list of recommended PTC thermistors.
APPLICATIONS INFORMATION
Table 4. Recommended Ceramic PTC Thermistors
PART NUMBER MANUFACTURER VOLTAGERESISTANCE
(Ω)
PTGL7SARR47M1B51B0 Murata 16V 0.47
PTGLASARR27M1B51B0 Murata 16V 0.27
PTGLESARR15M1B51B0 Murata 16V 0.15
PTGL12AR1R2H2B51B0 Murata 30V 1.2
2381 663 51121 Vishay 30V 0.7
2381 663 51321 Vishay 30V 0.5
2381 664 52021 Vishay 30V 0.3
VOLTAGE →
CURR
ENT
→
3305 F05a
CURIE POINT
VOLTAGE →
CURR
ENT
→
3305 F05b
PTC RESISTOR IN PARALLEL WITH A RESISTOR
SINGLE PTC RESISTOR
RESISTOR ONLY
PTC Current Voltage Characteristics
Increasing Current at Large Voltage
Figure 5. PTC Behavior
(a)
(b)
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APPLICATIONS INFORMATIONSelecting the Auxiliary Cell
The auxiliary cell must be capable of sourcing and sink-ing current and withstand the maximum voltage of any individual battery in the stack. The ESR of the auxiliary cell must be small compared to the PTC thermistor. Any voltage dropped across the auxiliary cell ESR appears as an offset voltage at the input of the termination comparator.
The auxiliary cell used may be a lead-acid battery, a stacked supercapacitor, or a low leakage, high voltage capacitor. When using a supercapacitor stack, the voltage across each individual supercapacitor must not exceed its rated operating voltage.
Figure 6a shows a battery stack made of 4 batteries, each with a nominal capacity of 50Ah, but with a 10% capacity mismatch. With no balancing, the stack capacity is determined by the weakest battery in the stack and is limited to 45Ah.
In Figure 6b, a small capacity auxiliary cell, such as a supercapacitor stack, is used to balance the battery stack. When balanced the stack capacity can be made to approach the nominal capacity of 50Ah despite the 10% mismatch.
In Figure 6c, the auxiliary cell has the same capacity as the batteries in the stack. Each of the batteries in Figure 6c has a nominal capacity of only 40Ah but the stack capac-ity approaches 50Ah since the auxiliary cell supplements
the capacity of the battery stack. Using a large capacity auxiliary cell supplements stack capacity. Smaller capac-ity batteries may be used in the stack which helps reduce system costs.
Precharging the Auxiliary Cell
When using stacked supercapacitors or a single high volt-age capacitor as the auxiliary cell, the auxiliary cell may be initially discharged with a voltage of 0V. At startup, a large voltage exists across the PTC resistor, which will cause the PTC resistance to increase. This limits the cur-rent and hence the charge transfer between the auxiliary cell and the battery it is connected to. The auxiliary cell will be charged very slowly with an indeterminate time, as it sequentially connects to each battery in the stack. Once the auxiliary cell has been charged to a point where the PTC device operates as a low resistance device, the balancing process is sped up.
A more time efficient solution is to precharge the auxiliary cell to the average voltage of the batteries in the stack. Figure 7a shows a circuit using a high voltage buck regulator to precharge the auxiliary cell to V4/4 volts. NMOS devices N2A and N2B eliminate a parasitic charging path from BATTERY1 to the auxiliary cell when AUXN is connected to GND through N10. Figures 7b and 7c are scope photos showing a complete precharging and balancing operation.
55Ah(+10%)
50Ah
45Ah(–10%)
STACK CAPACITY=45Ah
(a)
STACK CAPACITY≈50Ah
(b)
50Ah
55Ah(+10%)
50Ah
45Ah(–10%)
4Ah(AUX)
50Ah
PTC
STACK CAPACITY≈50Ah
(c)
44Ah(+10%)
40Ah
36Ah(–10%)
40Ah(AUX)
40Ah
PTC
Figure 6. Increasing Stack Capacity with an Auxiliary Cell
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APPLICATIONS INFORMATION
Figure 7. Precharging the Auxiliary Cell Using the LTC3630A and LTC1440
BAT1, BAT2, BAT3, BAT4, AUXP-AUXN = 2V/DIVAUXN = 10V/DIV; START, EN_3305 = 5V/DIV
TIME = 20s/DIV
AUXP-AUXN = 2V/DIVAUXN = 10V/DIV; START, EN_3305 = 5V/DIV
TIME = 5s/DIV
(a)
VREG
EN1EN2
TERM2MODE
TERM1
DONE
BATXBATYCTON
CTOFF
CTBAT
VL
VH
GND
LTC3305
AUXN
AUXP
V1
V2
V3
V4
CM
10µF25V
10µF25V
1µF6V
1.33k
249Ω
6.04k
6.04k
D1, D2 = CMMSH1-100D3 = CMMSH2-80
N1A, N1B, N2, N3A, N3B, N4, N5, N6, N7, N8, N9, N10 - SiR882DP
CPBOOST
D1
D2
NGATE1-9
ISET
UVFLTOVFLT
BALPTCFLT
10µF25V
10µF25V
10µF25V
100µH
10µF25V
9
V+
V–
VIN
NGATE5
N5
NGATE6
NGATE7
NGATE8
NGATE9
N10N11
N9
N8
N7
N6
N11, N12 = FDV301N
3305 F07
PTC
AUX
12.1k
42.2k
27.4k
10nF
10nF
100nF
10µF25V
NGATE4
3.01k
6.04k
174k
6.04k
N2A N2B
N3A
N4
N3B
6.04k
6.04k
6.04k
6.04k
NGATE3
NGATE2
NGATE1
BAT4+
+
+
+
BAT3
IN– OUTREF
HYST
GND
LTC1440
IN+
5.11M D4, D5, D6 = 1N914
D3
D4
D5
D6
365k
BAT2
BAT1
SW
SSFBO ISET
VPROG1VPROG2
LTC3630A
GNDFB
RUN
S
RQ
QD
CLKSTART
+
2.2µF100V
N12
2.21M
365k2.21M
681k
40.2k
2.43M
N1
(b) (c)
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APPLICATIONS INFORMATIONSelection of External NMOS Switches
The external NMOS switches must be capable of with-standing a reverse voltage equal to the battery stack volt-age. They should also be capable of carrying DC current up to the PTC thermistor trip point. The maximum power dissipated in the NMOS should not cause it to operate outside of its Safe Operating Area. Refer to Table 5 for a list of recommended NMOS switches.
Programming NMOS Turn On
The NMOS switches are turned on by developing a voltage across an external resistor from the gate to the source. The current through the resistor is delivered from the NGATE pins and is programmed by the current at the ISET pin. The internal current sources that provide the NGATE pin currents operate from the V4 and BOOST supplies as shown in the Block Diagram. The BOOST pin voltage is regulated at 8.45V greater than V4. It is recommended that the gate turn on voltage be set to no more than 7.5V. The current flowing through the gate turn on resistor connected to the NGATE3 pin is given by:
INGATE3 =
26.4VRISET
The current flowing through the other NGATE pins is given by:
INGATE =13.2VRISET
The NGATE3 current has a programmed range from 1mA to 3mA. All other NGATE currents have a programmed range from 500µA to 1.5mA.
The NGATE current initially charges the gate capacitor of the NMOS device to turn it on. The external gate source resistor maintains a constant gate to source voltage on
the NMOS device. Programming a higher current reduces the NMOS device turn on time. Programming a large gate source voltage reduces the on resistance of the NMOS device. During turn off, the gate capacitor discharges through the gate source resistor.
Programming Undervoltage and Overvoltage Thresholds
Referring to the Block Diagram, the voltage at the ISET pin is servoed to 1.2V. An external resistor, RISET, from this pin to GND programs a current which is divided down and mirrored to the VL and VH pins. The ISET pin current has a programmed range from 50µA to 150µA.
The ISET pin current is given by:
IISET =
1.2VRISET
The current out of the VL and VH pins is given by:
IVL = IVH = IISET
3 External resistors RVL from the VL pin to GND and RVH from the VH pin to GND program the undervoltage and overvoltage thresholds for each battery. The undervolt-age threshold for a battery is given by:
VBAT,UV = 4V • RVL
RISET The overvoltage threshold for a battery is given by:
VBAT,OV = 4V • RVH
RISET Programming the tBAT Parameter
The tBAT parameter is programmed using a capacitor from the CTBAT pin to GND. tBAT is given by:
tBAT = 5sec• CTBAT
10nF A C0G type capacitor is recommended due to its superior temperature characteristics.
Programming the tON and tOFF Parameters
The tON parameter is programmed by a capacitor from the CTON pin to GND. tON is given by:
tON = 0.48hrs• CTON
10nF
Table 5. Recommended NMOS Switches PART NUMBER MANUFACTURER IDS(MAX) VDC(MAX)
SiR882DP Vishay 60A 100V
SiS892DN Vishay 25A 100V
IPD70N10S3-12 Infineon 70A 100V
IPB35N10S3L-26 Infineon 35A 100V
RJK1051DPB Renesas 60A 100V
RJK1054DPB Renesas 92A 100V
LTC3305
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For more information www.linear.com/LTC3305
APPLICATIONS INFORMATIONThe tOFF parameter is programmed by a capacitor from the CTOFF pin to GND. tOFF is given by:
tOFF = 0.48hrs• CTOFF
10nF
C0G type capacitors are recommended due to their superior temperature characteristics.
In the continuous operation mode (MODE = 1), the CTON and CTOFF pins are unused and should be connected to GND.
Selecting Charge Pump Components
Referring to Figure 2, recommended values for R1, R2 and CFLY are 249Ω, 1.33k & 10µF respectively for all ap-plications. For applications in which V4 is no lower than 32V a 10µF capacitor is recommended for CBOOST. For applications which may have lower voltages at V4, the recommended value for CBOOST is 22µF. Schottky diodes with a breakdown voltage larger than the maximum V4 voltage are recommended for diodes D1 and D2.
Selecting Decoupling Capacitors
Decoupling capacitors of at least 10µF must be placed across each battery, from the BOOST pin to V4 and from the AUXP pin to the AUXN pin. These capacitors must be placed as close as possible to the LTC3305. The capacitors must be capable of withstanding the maximum voltage across each battery. Capacitors with an X5R or X7R type dielectric should be used.
Thermal Considerations and Limiting On-Chip Power Dissipation
Excessive on-chip power dissipation will cause the LTC3305 to enter thermal shutdown. It is important to understand the source of the power dissipation and how power dissipation can be reduced. The two contributions of on-chip power dissipation on the LTC3305 that may be controlled by the user are the loading on the low voltage regulator and the power dissipated through the current sources that provide the NGATE pin currents.
The low voltage linear regulator provides a 2.5V output. Any current provided by the regulator will cause power
dissipation in the internal switch connected from V4 to VREG, which causes die temperature to increase. In Figure 8, an external switching regulator generates a 3.3V rail that back drives the VREG pin and provides power to the external microprocessor and other low voltage circuits. There is no on-chip loading on the VREG pin and thus no on chip power dissipation in the low voltage regulator.
In Figure 8, external resistors R1, R2, R3, R4, and R5 are in series with the on-chip current sources that provide NGATE pin current. These resistors reduce the voltage across the on-chip current sources and thus reduce on-chip power dissipation. As an example, the current source at NGATE1 delivers current from the V4 pin. When this current source is turned on, the voltage across it is V4-VNGATE1. For a typical application with V4 = 52.8V, programmed INGATE = 506µA and VNGATE1 = 6.12V, the on-chip power dissipated in the current source is 23mW. In Figure 8, resistor R1 operates with approximately 30.5V across it. The on-chip power dissipated in the current source is reduced to ap-proximately 8mW. In similar fashion resistors R2, R3, R4, and R5 reduce the on-chip power dissipation on the respective current sources. When choosing these resistors it is recommended to have the internal current sources biased with at least 6V across them under all operating conditions. Power dissipation through the on-chip current sources may be further reduced by programming a lower gate current through the NGATE pins.
Balancing Battery Stacks with more than Four Batteries
To balance battery stacks that have more than four batter-ies, multiple LTC3305 devices may be stacked together. In this scenario, it is recommended that each LTC3305 be run in continuous mode and at least one battery in each sub-stack of four is common to two LTC3305s. Each LTC3305 needs an auxiliary cell for the balancing opera-tion. Figure 9 shows an eight battery stack being balanced using three LTC3305 devices connected together. Figure 10 shows a stack of six batteries being balanced using two LTC3305 devices. To balance a battery stack with n batteries, the minimum number of LTC3305 devices required is [(n-1)/3] rounded up to the nearest integer. In this calculation, each LTC3305 is assumed to be used in a four-battery configuration and at least one battery interleaves two LTC3305 devices.
LTC3305
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For more information www.linear.com/LTC3305
APPLICATIONS INFORMATION
Figure 8. 4-Battery Application with External Resistors to Limit Power Dissipation
VREGEN1EN2
TERM2
MODETERM1
DONE
BATXBATY
CTON
CTOFF
CTBAT
VL
VH
GND
LTC3305
AUXN
AUXP
V1
V2
V3
V4
CM
10µF25V
10µF25V
1.33k
249Ω
12.1k
12.1k
CPBOOST
D1
D2
NGATE1-9
ISET
UVFLTOVFLT
BALPTCFLT
10µF25V
10µF25V
10µF25V
10µF25V
10µF25V
9
ALL NMOS SWITCHES = SiR882DPD1, D2 = CMMSH1-100
3.3V
100k EACH
LTC3630ABUCK REGULATOR
MICROPROCESSOR
NGATE5
NGATE6
NGATE7
NGATE8
NGATE9 3305 F08
PTC = PTGL13AROR8H2B71B0
AUX
23.7k
93.1k
59k
10nF
100nF
10nF
NGATE4
6.04k
12.1k
12.1k12.1k
12.1k
12.1k
12.1k
12.1k
R4
20k
R5
NGATE3
NGATE2
NGATE1
BAT4
BAT3
10k
R3
37.4k
R2
R1
60.4k
BAT2
BAT1
+
+
+
+
+
When multiple LTC3305 devices are stacked, the logic out-put pins may need to be level shifted and ground referred. In Figure 9, optical isolators are used for level shifting.
Figure 11 shows an application in which an eight battery stack is balanced using two LTC3305 devices and two auxiliary cells. BAT1, BAT2, BAT3, and BAT4 are balanced to each other using the lower LTC3305 whereas BAT5, BAT6, BAT7, and BAT8 are balanced to each other by the upper LTC3305.
PCB Considerations
In operation the LTC3305 can dissipate large amounts of power which can increase die temperature and cause the part to enter thermal shutdown. The exposed pad of LTC3305 must be well soldered to the PCB to provide adequate heat sinking. The exposed pad also provides an electrical GND to the LTC3305.
The no-connect pin on the LTC3305 must be soldered to a pad on the PCB and must be electrically isolated from any other circuit node.
The trace that connects the AUXP pin to the positive terminal of the auxiliary source must be as close to the auxiliary source positive terminal as possible. Otherwise the trace impedance adds to the ESR of the auxiliary cell which manifests itself as an offset at the internal termina-tion comparator.
The V1, V2, V3 and V4 traces must be Kelvin connected directly to the battery terminal and must not share a com-mon trace through which high balance current will flow. Any voltage drop in these traces also manifests itself as an offset voltage at the termination comparator input.
LTC3305
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APPLICATIONS INFORMATION
Figure 9. Three LTC3305 Devices Connected to Balance Eight Lead-Acid Batteries
3305 F07
VREG
EN1EN2MODETERM1TERM2
DONE
BATXBATY
CTON
CTOFF
CTBAT
VL
VH
GND
LTC3305
AUXN
AUXP
V1
V2
V3
V4
CM
10µF25V
10µF25V
5.49k
5.49k
CP
BOOST
NGATE1-9NGATE1C-9C
ISET
UVFLTOVFLT
BALPTCFLT
10µF25V
10µF25V
10µF25V
10µF25V
9
NGATE5C
NGATE6C
NGATE7C
NGATE8C
NGATE9C
PTC
AUX3
20k
32.4k
8.06k
10nF
NGATE4C
D5
249Ω 1.33k
D6
+
+
+
+
+
+
+
+
2.74k
5.49k5.49k
5.49k
5.49k
5.49k
NGATE3C
NGATE2C
NGATE1C
BAT8
BAT7
5.49kBAT6
BAT5
BAT4
BAT3
BAT2
BAT1
1µF6V
2.43k
CPC1301G
CPC1301G
TOµP
2.43k 2.43k 2.43k 2.43k 2.43k 2.43k
100k 100k 100k 100k 100k 100k 100k
VREG
EN1EN2MODETERM1TERM2
DONE
BATXBATY
CTON
CTOFF
CTBAT
VL
VH
GND
LTC3305
AUXN
AUXP
V1
V2
V3
V4
CM
10µF25V
10µF25V
5.49k
5.49k
CP
BOOST
NGATE1-9NGATE1A-9A
ISET
UVFLTOVFLT
BALPTCFLT
10µF25V
10µF25V
10µF25V
10µF25V
9
NGATE5A
NGATE6A
NGATE7A
NGATE8A
NGATE9A
PTC
AUX1
8.06k
10nF
NGATE4A
2.74k
5.49k5.49k
5.49k
5.49k
5.49k
NGATE3A
NGATE2A
NGATE1A
5.49k
1µF6V
3.3V
VREG
EN1EN2MODETERM1TERM2
DONE
BATXBATY
CTON
CTOFF
CTBAT
VL
VH
GND
LTC3305
AUXN
AUXP
V1
V2
V3
V4
CM
10µF25V
10µF25V
5.49k
5.49k
CP
BOOST
NGATE1-9NGATE1B-9B
ISET
UVFLTOVFLT
BALPTCFLT
10µF25V
10µF25V
10µF25V
10µF25V
9
NGATE5B
NGATE6B
NGATE7B
NGATE8B
NGATE9B
PTC
AUX2
20k
32.4k
8.06k
10nF
NGATE4B
2.74k
5.49k5.49k
5.49k
5.49k
5.49k
NGATE3B
NGATE2B
NGATE1B
5.49k
1µF6V
32.4k
20k
D3
D4
D1
D2
+
TOµP
100k 100k 100k 100k 100k 100k 100k
2.43k 2.43k 2.43k 2.43k 2.43k 2.43k 2.43k
TOµP
100k 100k 100k 100k 100k 100k 100k
249Ω 1.33k
249Ω 1.33k
ALL NMOS DEVICES = SiR882DPD1, D2, D3, D4, D5, D6 = CMMSH1-100
10µF25V
10µF25V
10µF25V
+
+
LTC3305
243305fb
For more information www.linear.com/LTC3305
APPLICATIONS INFORMATION
Figure 10. Two LTC3305 Devices Connected to Balance Six Lead-Acid Batteries with AND’d DONE Indicator
VREGEN1EN2
TERM2
MODETERM1
DONE
BATXBATY
CTON
CTOFF
CTBAT
VL
VH
GND
LTC3305
AUXN
AUXP
V1
V2
V3
V4
CM
10µF25V
10µF25V
1.33k
6.04k
6.04k
ALL NMOS DEVICES = SiR882DPD1, D2, D3, D4 = CMMSH1-100
CP
BOOSTD3
249Ω
D4
NGATE1-9
ISET
UVFLTOVFLT
BALPTCFLT
10µF25V
10µF25V
10µF25V
10µF25V
NGATE5B
NGATE6B
NGATE7BNGATE1B-9B
NGATE8BNGATE1B
NGATE9B
3305 F08
PTC
AUX2
27.4k
10nF
10µF25V
42.2k
12.1k
NGATE4B
3.01k
6.04k
6.04k
9
6.04k
6.04k
6.04k
NGATE3B
NGATE2B BAT5
475k
1µF6V
10µF25V
475k
475Ω
6.04k
BAT6+
+
+
+
+
+
+
+
BAT4
BAT3VREGEN1EN2
TERM2
MODETERM1
DONE
BATXBATY
CTON
CTOFF
CTBAT
VL
VH
GND
LTC3305
AUXN
AUXP
V1
V2
V3
V4
CM
10µF25V
10µF25V
1.33k249Ω
6.04k
6.04k
CP
BOOSTD1
D2
NGATE1-9
ISET
UVFLTOVFLT
BALPTCFLT
10µF25V
10µF25V
10µF25V
10µF25V
NGATE5A
NGATE6A
NGATE7ANGATE1A-9A
NGATE8ANGATE1A
NGATE9A
PTC
9
AUX1
27.4k
10nF
42.2k
12.1k
NGATE4A
3.01k
6.04k
6.04k
6.04k
6.04k
6.04k
NGATE3A
NGATE2A BAT2
1µF6V
6.04k
BAT1
LTC3305
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APPLICATIONS INFORMATION
100k
10nF
12.1k
VREGEN1EN2
TERM2
MODETERM1
DONE
BATXBATY
CTON
CTOFF
CTBAT
VL
VH
GND
LTC3305
AUXN
AUXP
V1
V2
V3
V4
CM CPBOOST
ISET
UVFLTOVFLT
BALPTCFLT
249Ω
10µF25V
10µF25V
10µF25V
10µF25V
10µF25V
10µF25V
10µF25V
D3
D4
1.33k
1µF6V
NGATE1-99
NGATE1B-9B
PTC
AUX2+
10µF25V
NGATE6B
NGATE7B
NGATE8B
NGATE9B
ALL NMOSDEVICES = SiR892DPD1, D2, D3, D4 = CMMSH1-100
6.04k
6.04k
6.04k
6.04k
NGATE5B6.04k
BAT8+
+
+
+
+
+
+
+
+
BAT7
BAT6
BAT5
NGATE4B6.04k
NGATE2B6.04k
NGATE1B6.04k
NGATE3B3.01k
100k
10nF
12.1k
VREGEN1EN2
TERM2
MODETERM1
DONE
BATXBATY
CTON
CTOFF
CTBAT
VL
VH
GND
LTC3305
AUXN
AUXP
V1
V2
V3
V4
CM CPBOOST
ISET
UVFLTOVFLT
BALPTCFLT
249Ω
10µF25V
10µF25V
10µF25V
10µF25V
10µF25V
D1
D2
1.33k
1µF6V
NGATE1-99
NGATE1A-9A
PTC
AUX1
3305 F11
NGATE6A
NGATE7A
NGATE8A
NGATE9A
6.04k
6.04k
6.04k
6.04k
NGATE5A6.04k
BAT4
BAT3
BAT2
BAT1
NGATE4A6.04k
NGATE2A6.04k
NGATE1A6.04k
NGATE3A3.01k
10µF25V
Figure 11. Eight Battery Balancer Using Two LTC3305 Devices
LTC3305
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For more information www.linear.com/LTC3305
PACKAGE DESCRIPTIONPlease refer to http://www.linear.com/product/LTC3305#packaging for the most recent package drawings.
4.75(.187)
REF
FE38 (AA) TSSOP REV C 0910
0.09 – 0.20(.0035 – .0079)
0° – 8°
0.25REF
0.50 – 0.75(.020 – .030)
4.30 – 4.50*(.169 – .177)
1 19
20
REF
9.60 – 9.80*(.378 – .386)
38
1.20(.047)MAX
0.05 – 0.15(.002 – .006)
0.50(.0196)
BSC0.17 – 0.27
(.0067 – .0106)TYP
RECOMMENDED SOLDER PAD LAYOUT
0.315 ±0.05
0.50 BSC
4.50 REF
6.60 ±0.10
1.05 ±0.10
4.75 REF
2.74 REF
2.74(.108)
MILLIMETERS(INCHES) *DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
NOTE:1. CONTROLLING DIMENSION: MILLIMETERS2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
SEE NOTE 4
4. RECOMMENDED MINIMUM PCB METAL SIZE FOR EXPOSED PAD ATTACHMENT
6.40(.252)BSC
FE Package38-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1772 Rev C)Exposed Pad Variation AA
LTC3305
273305fb
For more information www.linear.com/LTC3305
Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
REVISION HISTORYREV DATE DESCRIPTION PAGE NUMBER
A 09/15 Added timer mode section.Modified Figure 6 schematic.Modified Figure 8 schematic.Modified Figure 9 schematic.
13162223
B 03/16 Updated Feature bulleted items and descriptionUpdated Application schematicEnhanced Operation section
11
11
LTC3305
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For more information www.linear.com/LTC3305
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VREGEN1EN2
TERM2
MODETERM1
DONE
BATXBATY
CTON
CTOFF
CTBAT
VL
VH
GND
LTC3305
AUXN
AUXP
V1
V2
V3
V4
CM
10µF25V
10µF25V
1.33k249Ω6.04k
6.04k
D1, D2 = CMMSH1-100
CP
BOOST
D1
D2
NGATE1-9
ISET
UVFLTOVFLT
BALPTCFLT
10µF25V
10µF25V
10µF25V
10µF25V
10µF25V
9
1µF6V
NGATE5
NGATE6
NGATE7
NGATE8
NGATE9 3305 TA02
PTC
AUX
12.1k
10nF
NGATE4
3.01k
6.04k
6.04k
6.04k
6.04k
6.04k
6.04k
NGATE3
NGATE2
NGATE1
ALL NMOSDEVICES = SiR882DP
BAT4+
+
+
+
BAT3
BAT2
BAT1
100Ω
+
A Minimum Component Application in Which an LED is Used to Display Status
LT 0316 REV B • PRINTED IN USALinear Technology Corporation1630 McCarthy Blvd., Milpitas, CA 95035-7417(408) 432-1900 ● FAX: (408) 434-0507 ● www.linear.com/LTC3305 LINEAR TECHNOLOGY CORPORATION 2015