Embed Size (px)
Citation preview
LPKF LDS Technology For Innovative MEMS Packaging
LDS technology is able to increase options for the layout: Inner and outer layers can be utilized, walls can be used as a circuit carrier and through-hole plating can be created in a cost-efficient and safe manner. The LDS method uses lasers to apply conductor structures onto plastic bodies, which are later chemically metallized. The process creates the smooth metal surfaces required for reliable assembly, even for gold finishes.
Ever smaller components require more and more precise connection technologies. This holds true
in particular for micro-electro-mechanical components (MEMS). Here, sensorics and processing
electronics are combined into extremely tight spaces.
3D Solutions for Compact Chip Stacking
LDS through-hole plating at a diameter of 240 μm (70° angle).
On the left through-hole plating created with injection molding,
on the right a hole drilled by laser. With certain plastic materials
through-hole plating is done directly as part of the laser process.
Easy stacking of dies due to three dimensional MEMS housing. LDS eliminates the traditional process of making bumps because these are made directly during the molding process. They are activated and plated together with the conductive tracks. A high packing density results from the slight pitch and the option of also using the outside of the housing or package for tracks.
Sensor and evaluation electronics combined: The 3D-LDS housing
carries the components in different levels (stacking) to ensure a
compact MEMS package
Changes to the circuit layout can be easily implemented by amending the path of the laser. LPKF LDS techno-logy thus opens up additional platform strategies for sensor packages. With suitable chip sets and circuit layouts, different products are developed on the basis of a common injection molded component. The LPKF LDS process allows assembly with unhoused chips, e. g., through wire bonding or flip-chip technology.
The LDS Process
Pressure sensor for industrial applications. The ASIC is integrated;
mechanical connections are part of the package (Manufacturer:
Harting AG)
3. Metallization is done with an
additive build-up of the tracks
typically up to 15 μm with the
help of electroless copper
baths.
4. In the final step the
dispensing of glue or solder
paste and the pick and place
of components are done with
innovative pick-and-place
systems.
2. A physical-chemical reaction,
induced by the laser, forms
metallic nuclei. These act
as a catalyst for reductive
copper plating. In addition to
activation, the laser creates a
microscopically rough surface
in which the copper is firmly
anchored during metallization.
1. The parts to be laser structured
are produced using 1-shot
injection molding with an LDS
thermoplastic or thermoset
grade. As an alternative, metal
parts can be prepared with LDS
PowderCoating, for even better
thermal conductivity.
LPK
F A
G, 1
0043
218
-200
814
-EN
Phot
os m
ay a
lso
show
opt
iona
l acc
esso
ries
.
ww
.jenk
o-s
tern
berg
.de
© LPKF Laser & Electronics AG, LPKF reserves the right to modify the specifications and other product information without giving notice. Systems and products supplied by LPKF and its subsidiaries are covered by valid or pending US and other foreign patents. Product names are only used for identification and could be trademarks or registered brand names of the companies involved.
Worldwide Support for Laser Direct StructuringWherever they are in the world, users of LPKF systems can be supported from our application centers in Germany, the USA, Japan and China. At these centers, users have access to LPKF’s extensive experience in laser material processing and the laser direct structuring process. User training for technical employees and special consulting services complete the offer from the world market leader in laser systems for structuring three-dimensional molded interconnect devices. LPKF will gladly provide application reports and further information on request.
LPKF Laser & Electronics AG sells and markets products and provides support in more than 50 countries. Find your local representative at www.lpkf.com.
Worldwide (LPKF Headquarters)
LPKF Laser & Electronics AG Osteriede 7 30827 Garbsen Germany
Phone +49 (5131) 7095-0 [email protected] www.lpkf.com
North / Central America
LPKF Laser & Electronics North America
Phone +1 (503) 454-4200 [email protected] www.lpkfusa.com
China
LPKF Tianjin Co., Ltd.
Phone +86 (22) 2378-5318 [email protected] www.lpkf.cn
Hong Kong
LPKF Laser & Electronics (Hong Kong) Ltd.
Phone +852-2545-4005 [email protected] www.lpkf.com
Japan
LPKF Laser & Electronics K.K. Japan
Phone +81 (0) 45 650 1622 [email protected] www.lpkf.jp
South Korea (Application Center)
LPKF Laser & Electronics Korea Ltd.
Phone +82 (31) 689 3660 [email protected] www.lpkf.com
The global LPKF network for service and distribution: Headquarters LPKF Group LPKF Distributors
