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Live at Power-Up PLD Effects on System Design August 2005

Live at Power-Up - Microsemi

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Page 1: Live at Power-Up - Microsemi

Live at Power-UpPLD Effects on System Design

August 2005

Page 2: Live at Power-Up - Microsemi

Table of Contents

2 Live at Power-Up

System Design Trends . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3Circuits and Applications Requiring Short Initialization Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3Live at Power-Up Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3Programmable Logic Device Alternatives . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4Power-Up Device Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5System Functionality Difference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12Level 0 LAPU Contributes to Cost Savings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13Conclusion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

List of FiguresLive at Power-Up Devices Active During System Voltage Power Ramp-Up and Before Power-Up . . . 4Programmable Logic Technologies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5Power-Up Device Classification. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6Power-Up Behavior of SRAM FPGA and NVM (Antifuse) FPGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8Power-Up Behavior of Hybrid SRAM FPGA and NVM (Flash) FPGA . . . . . . . . . . . . . . . . . . . . . . . . . . 9Power-Up to Operation Time – NVM vs. SRAM FPGAs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10Power-Up to Operation Time - NVM vs. Hybrid SRAM FPGAs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 System Implementation Using Level 2 SRAM FPGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12System Implementation Using Level 0 Nonvolatile FPGA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

List of TablesProgrammable Logic Device Power-Up Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7The LAPU Cost Difference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Page 3: Live at Power-Up - Microsemi

System Design TrendsAs systems become more complex, pressure to reduce cost and shorter design cycles are the drivers for higher efficiency, modularity, and simplicity of systems. When a certain feature is required in the application, designers usually scan the market for possible solutions that could meet system requirements. Once they narrow down the selection to those solutions that satisfy the design needs, they choose between the alternatives on the basis of cost and design simplicity.

Circuits and Applications Requiring Short Initialization TimeOnce power is applied to a typical system, system components must be initialized and system supervisory tasks are performed, such as setting up the microprocessor environment, performing critical system startup tasks, and controlling operation during power ramp-up until system voltages are stable. In a complex system, system supervisory tasks may include configuring memory blocks; system initialization tasks might include decoding of the microcontroller address bus, synthesizing and distributing various clocks to multiple system components, distributing resets or enable signals, managing bus activity transmissions to avoid data glitches, and performing time critical tasks to minimize processor initialization time. Some applications require fast system initialization time to allow immediate operation. Examples include medical and industrial applications that perform critical operations, such as life assistance equipment. Battery-operated portable applications with frequent power-up and power-down cycles require short initialization time to increase product usability for the user. Other critical operation applications that require instant operation after power-up are automotive engine startup control and military applications such as missile startup control.

Live at Power-Up DevicesA system is composed of multiple components with inter-dependencies, and the designer's task is to make sure these components all work together. It is vital to choose live at power-up devices for the system’s critical path in order to achieve efficient system operation. As illustrated in Figure 1 on page 4, live at power-up devices are operational before the system voltage has reached its minimum level, which is defined as the power-up stage, as opposed to devices that are operational only after power-up. For example, choosing a live at power-up device that has an integrated phased-locked loop (PLL) for clock distribution tasks, not only reduces overall system startup time, but also eliminates the need for a standalone PLL to perform this function.Selecting live at power-up devices for the critical system startup path minimizes overall application startup time, cost, size, and reduces design complexity.

Live at Power-Up 3

Page 4: Live at Power-Up - Microsemi

Programmable Logic Device AlternativesProgrammable Logic Devices (PLDs) have experienced dramatic growth contributed by their benefits of short time-to-market, in-system programming (ISP) capability, ease of use, and rapid prototyping. The transition to advanced technologies has resulted in a dramatic cost reduction for PLDs, which are increasingly replacing live at power-up Application Specific Integrated Circuits (ASICs) in system designs. When a PLD is required in the system, designers should not ignore the live at power-up attribute of the chosen PLD. This decision could unnecessarily increase the size and cost of the system. PLDs require configuration memory to initialize the device for operation. There are differing technologies for configuring PLD solutions available in the market. PLDs based on nonvolatile memory technologies, such as Flash, EEPROM, and antifuse, store their configuration on chip. This eliminates the need to download the configuration, making these devices readily available for operation in a similar way to Application Specific Standard Products (ASSPs) and ASICs.Other technologies, such as the volatile SRAM-based programmable logic devices, wake up in an unknown state and require configuration from an external, nonvolatile memory device on each power-up cycle. In addition, there are Hybrid SRAM devices that have an SRAM FPGA architecture and a nonvolatile configuration memory on-chip. These Hybrid FPGAs must be loaded internally on each power-up cycle. Only after the device is loaded with the configuration, can it start operating according to the customer application. After each power-down or power supply "brownout," the Hybrid device loses its configuration and needs to be loaded again in the next power-up cycle. Figure 2 on page 5 describes the PLD technology alternatives, which include SRAM, EEPROM, Flash and antifuse, with respect to their external or internal configuration component.Live at power-up PLDs simplify the design effort required, and can help initialize and set up the system environment and prepare for microcontroller and other system operations, hence shortening system initialization time. Setup activities such as configuring system memories, providing a consistent and reliable power-up sequence for components on the system board, distributing clocks to devices, and managing interfaces and bus activity, help make the design more efficient, reduce component count, and reduce power consumption.

Figure 1: Live at Power-Up Devices Active During System Voltage Power Ramp-Up and Before Power-Up

Time

Power Up

Vo

ltag

e

System Voltage

Power On

LAPU Non-LAPU

Time

Power Up

Vo

ltag

e

System Voltage

Power On

4 Live at Power-Up

Page 5: Live at Power-Up - Microsemi

Power-Up Device ClassificationActel is using a device classification system that helps designers identify the power-up behavior of semiconductor devices in a system. This classification system helps designers choose the appropriate programmable logic components for their applications, taking into account operation and functionality during power-up stages of the system.Figure 3 on page 6 shows a typical system power-up operation from the moment a voltage is applied (power-on), to the point where the voltage reaches the lower operational limit of the system voltage, and finally the system is initialized. For the purpose of simplification, the classification uses a single system voltage to reflect system operation. After power-on, which is the first time power is applied to the system, the voltage starts to ramp-up. System components that have a low voltage trigger point can start operating and help in system initialization, power management, critical system tasks, providing clocks, and reset signals. Devices that are operational between power-on and power-up (the time at which the applied voltage has reached the lower limit of system voltage and is stable) are considered as supporting Level 0 live at power-up (LAPU). Devices that meet Level 0 LAPU are nonvolatile memory (NVM) PLDs, ASICs,

Figure 2: Programmable Logic Technologies

or

EEPROMNonvolatile SPLD/CPLD – EEPROM

Flash/AntifuseNonvolatile Memory (NVM) FPGAs

SRAMVolatile SRAM FPGAs with externalconfiguration memory(Boot PROM or Flash MCU)

SRAMHybrid FPGAs/CPLDs – Volatile SRAM FPGAfabric loaded from on-chip NVM

EEPROMSPLD/CPLD

PROM

MCU

NVM

NVM

NVMFPGA

SRAMFPGA

SRAMFPGA/CPLD

Blue – EEPROM (Nonvolatile Memory)Green – Flash/Antifuse (Nonvolatile Memory)Purple – SRAM (Volatile Memory)

Live at Power-Up 5

Page 6: Live at Power-Up - Microsemi

and some ASSPs. Devices that require a configuration download or require a higher minimum system voltage level to operate are classified as Level 1 LAPU as they are operational only after power-up. These are usually ASSPs or other devices that help in configuring the memories or interfaces to the main processors. Once the system environment is initialized and clocks, resets, interfaces, and memories are ready, the processor (MCU/CPU) can start to function and access the peripherals it requires. These devices support Level 2 as they are operational after the system is initialized, i.e., the system components are functional and processors can start operating.

Figure 3: Power-Up Device Classification

6 Live at Power-Up

Page 7: Live at Power-Up - Microsemi

Table 1 shows laboratory tests and datasheet analysis done for several PLDs to determine actual power-up timing. The data presented supports the LAPU classification differentiation for each technology. Note Flash and antifuse nonvolatile FPGAs are the only FPGAs that are classified as Level 0 LAPU as well as the SPLDs, which have EEPROM technology. Figure 4 on page 8 shows NVM (antifuse) FPGA AX250 (Actel’s Axcelerator®) I/Os operating prior to system power-on. The SRAM FPGA XC3S200 (Xilinx Spartan-3) takes more than 200 ms for the part to load its configuration and begin I/O operation. NVM FPGAs are classified as Level 0 LAPU, which is typically 4,000 times faster than the SRAM FPGA, which are classified as Level-2 LAPU. Table 1: Programmable Logic Device Power-Up Timing1

FamilyPower-Up Time(est./test)

Live at Power-Up (LAPU) Classification

Actel FPGA Flash ProASIC3 50 µs 0

Actel FPGA Antifuse 60 µs 0

SPLD (EEPROM) 22V10 70 µs 2 0

CPLD (EEPROM) MAX7000 70 µs 2 0

Hybrid CPLD MAX® IICoolRunner® II

200 µs 1

Lattice FPGA LatticeXP >1 ms 3 1

Xilinx® FPGA Spartan® II/IIE and Spartan3 XC3S200

>200 ms 2

Altera® FPGA Cyclone™, Cyclone II >200 ms 4 2

Notes:1. FPGA/PLD core voltage ramp-up 100 µs2. Estimated time3. Based on the company statement 4. Best case conditions taken from the datasheet

Live at Power-Up 7

Page 8: Live at Power-Up - Microsemi

Figure 4: Power-Up Behavior of SRAM FPGA and NVM (Antifuse) FPGA

SRAM FPGA Power-Up BehaviorOperational hundreds of milliseconds after power-up. Meets Level 2 classification.

Nonvolatile Antifuse FPGA Power-Up BehaviorOperational before power-up. Meets Level 0 classification.

8 Live at Power-Up

Page 9: Live at Power-Up - Microsemi

Figure 5 shows the NVM (Flash) FPGA A3PE600 (Actel's ProASIC3/E) I/Os operating prior to system power-up. The Hybrid SRAM FPGA EPM1270 (Altera's MAX-II) takes more than 200 µs to load its configuration and start functioning.Hybrid (SRAM plus NVM) FPGAs must be configured after every power-up cycle and meet Level 1 live after power-up. Flash FPGAs meet Level 0 live at power-up regardless of the ramp-up time and are typically 20 to 40 times faster.

Figure 5: Power-Up Behavior of Hybrid SRAM FPGA and NVM (Flash) FPGA

Hybrid (SRAM plus NVM) FPGA Power-Up BehaviorActive hundreds of nanoseconds after power-up. Meets Level 1 classification.

Nonvolatile Flash FPGA Power-Up BehaviorOperational before power-up. Meets Level 0 classification.

Live at Power-Up 9

Page 10: Live at Power-Up - Microsemi

Figure 6 shows a comparison of time to operation between NVM FPGAs and SRAM FPGA for different ramp-up times, which clearly indicates the superiority of NVM FPGAs, for all ramp-up rates.

Note: Actel's devices were always operational BEFORE power-up.Figure 6: Power-Up to Operation Time – NVM vs. SRAM FPGAs

Time I/Os Become Active

0 50 100 150 200 250 300

0.1

1

10

100

Ram

p-U

p T

ime

Time (ms)

ProASIC3/EAxceleratorSpartan3

10 Live at Power-Up

Page 11: Live at Power-Up - Microsemi

Figure 7 shows a comparison of power-up operation time to ramp-up time ratio for different ramp-up times between NVM FPGAs and SRAM Hybrid FPGAs. The ratio used in this diagram clearly indicates a faster operation time for all NVM FPGAs ramp-up rates.

The nonvolatile FPGAs tested are always operational prior to power-up and the time from power-on to operation is not dependent on device logic size. On the other hand, SRAM and Hybrid devices have a longer power-on to operation time because the device configuration size is dependent on the logic density of the device. Therefore, the differences between NVM and SRAM is even more significant with large density devices. Based on the LAPU classification defined and the devices tested, power-up time for Level 0 LAPU NVM FPGAs is 4,000 times faster than that of SRAM FPGAs, and 20 to 40 times faster than that of Hybrid FPGAs.

Figure 7: Power-Up to Operation Time – NVM vs. Hybrid SRAM FPGAs

0%

50%

100%

150%

200%

250%

0.1 1 10

Ramp-Up Time (ms)

Pow

er-U

p T

ime/

Ram

p-U

p T

ime

(%)

Time to Power-Up as a Percentage of Ramp-Up Time

ProASIC3/E

MAX-II

Live at Power-Up 11

Page 12: Live at Power-Up - Microsemi

System Functionality DifferenceSystem architecture is impacted by the PLD's LAPU level supported, as can be seen in Figure 8 and Figure 9 on page 13. Figure 8 illustrates a system implementation with SRAM FPGA that is loaded from external flash, and describes the system's power-up sequence step by step.The system is operational after hundreds of milliseconds, as it takes time for the SRAM device to load its configuration and start operating.

Figure 8: System Implementation Using Level 2 SRAM FPGA

Power-Up Sequence

1. Power-On (applied)

2. Regulate power, clock

3. Apply reset and provide clocks to devices

4. SPLD address memory for MCU

5. Power-up (stable)

6. Components initialized

7. MCU wakes up and starts initializing

8. MCU operational

9. FPGA configuration loaded from MCU

10. FPGA operational

MCU

FlashMemory

SRAMFPGA

Address/data Decode SPLD

XtalOsc.

ResetController(CPLD)

ClockGeneration

PLL/Dividers

Address/Data

Address/Data

Address/Data

Config.ASSP MCU

FlashMemory

SRAMFPGA

Address/Data Decode SPLD

XtalOsc.

ResetController(CPLD)

ClockGeneration

PLL/Dividers

ASSP

Time

0 ns

100 µs

>200 ms

12 Live at Power-Up

Page 13: Live at Power-Up - Microsemi

Figure 9 illustrates system implementation with NVM FPGAs and the system's power-up sequence. The system is operational after 50 µs instead of hundreds of milliseconds, as there is no need to configure the nonvolatile FPGA upon power-up.

Level 0 LAPU Contributes to Cost Savings In addition to the system simplification benefits, the LAPU function also contributes to reducing the number of components used on board, decreasing power consumption, reducing total system cost, and increasing reliability. For SRAM-based FPGAs, significant additional circuitry may be needed. In addition to a boot PROM and/or additional system memory for unsecure configuration code, a live at power-up CPLD may be needed for system configuration and supervisory tasks. Clock and reset signal generation is also required upon power-up to help initialize components on board. These issues add complexity and cost to the system design and slow down the development process.Nonvolatile FPGAs help to simplify board and system design, and reduce cost, as illustrated in Table 2 on page 14.

Figure 9: System Implementation Using Level 0 Nonvolatile FPGA

Power-Up Sequence

1. Power-On (applied)

2. Regulate power, clock

3. Actel FPGA is live, I/Os active FPGA appliesreset and providesclocks to devices

4. FPGA initializes memory

5. Power-Up (stable)

6. Components initialized

7. MCU wakes up and starts initializing

8. MCU is operational

MCU

Memory

ActelFPGA

ClockSource

ClockReset ASSP

MCU

Memory

ActelFPGA

ClockSource

ASSP

Time

0 ns

100 µs

50 µs

Live at power-up (Level 0)

Live after power-up (Level 1)

Live after system initialized (Level 2)

Live at Power-Up 13

Page 14: Live at Power-Up - Microsemi

The average system cost using Level 2 LAPU SRAM FPGA could be as much as three times the system cost of using Level 0 LAPU nonvolatile FPGA.

ConclusionLevel 0 live at power-up FPGAs address design requirements by serving applications that require short initialization time and instant availability of product features to the end user. Level-0 LAPU FPGAs make the system available to the microprocessor at power-up. Nonvolatile FPGAs can perform microprocessor address decoding, and the FPGA's PLLs are immediately available. This leads to the elimination of external CPLDs, additional oscillator and reset handling circuitry, and results in an efficient and simplified system design. Level 0 LAPU FPGAs also reduces the total cost of ownership through the reduction of components, which results in reduced inventory and increased end-product reliability, as parts not included on the printed circuit board (PCB) cannot fail.Actel is the only FPGA provider that supports Level-0 LAPU class for its FPGAs using nonvolatile technologies. Actel Level 0 LAPU FPGAs are orders of magnitude faster to power-on than their nearest competitors. Level 0 LAPU is an enabling technology for control during power-up, which helps in simplifying design, reducing cost, and contributing to efficient use of resources.

Table 2: The LAPU Cost Difference

Comparing Value FPGA Total System Cost (High Volume Design) SRAM ProASIC3

FPGA Unit Cost – 125KSG $2.25 to $3.00 $2.75

SPI Serial Flash(e.g. Atmel AT45DB DataFlash)

$0.60 $0.00

Startup Clock ManagementClock Generator (MPC9229FA-ND)

$1.25 $0.00

Live at Power-Up CPLD(CY37032P44-125AC) System supervisory, Enable signals, etc.

$0.75 $0.00

3x Unit Cost – LAPU SRAM Penalty $4.85 to $5.60 $2.75

14 Live at Power-Up

Page 15: Live at Power-Up - Microsemi

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www.ac

© 2005 A s are the p

lace

re information, visit our website at www.actel.com

tel.com

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