LED Industry

Reliability TestingEnvironmental Test, Electrical Test, Lighting Test

X-ray Inspection X-ray

Failure Analysis (FA)Thermal, EMMI/InGaAs, OBIRCH

Texturing (Surface Morphology)Optical profiler, SEM, TEM

Film Type and Thickness MeasurementSEM/EDX, TEM/EDX

Cell StructureSEM/EDX, TEM/EDX

Crystalline Defects (Dislocations)X-S TEM, P-V TEM

Depth Profiling of Elemental AnalysisTEM/EDX, SIMS

Contamination AnalysisAuger, XPS

Reliability TestingEnvironmental Test, Electrical Test, Lighting test

Reliability TestingESD, Latch-up, Wire Bonding

X-ray Inspection X-ray

Failure Analysis (FA)Thermal, EMMI/InGaAs,OBIRCH

Defect Localization by EMMI/InGaAs, OBIRCH

EMMI/InGaAs, OBIRCH for FA Application

Texturing (Surface Morphology)Optical Profiler, SEM

Optical profiler

Top view SEM

Texturing (Surface Morphology)Optical Profiler, SEM

Surface morphology of LED die surface roughnessafter RIE etching or ion bombardment.

Chip Structure and Film ThicknessSEM, DB-FIB, TEM

X-S view SEM

Precise X-S view by DB-FIB

Chip Structure and Film ThicknessSEM, DB-FIB, TEM

X-S view TEM

Chip Structure and Film ThicknessSEM, DB-FIB, TEM

Crystalline Defects (Dislocations)X-S TEM, P-V TEM

TEM Imaging(Dislocations in epitaxial butter layer)

X-S & P-V TEM at requested areato observe the dislocation density and its spatial distribution.

X-S

-P-V

-P-V

-P-V

Depth Profiling of Elemental AnalysisTEM/EDX, SIMS

TEM/EDX Line Profile – Blue LED – MQW and Superlattice

Elemental Depth profile by SIMS

Backside SIMS is also feasible now.MA-tek can deliver 5-10 samples of backside SIMS analysis per day.

In% in superlattice can be defected down to 0.2at%