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MO. RIY. MO.
-~ .J ( )7t"/ ·~·? (::J ) ' / / 1,./."-·J' '•·J iJ'-- d
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ATM-1120
PAGI OP
DATE 22 March 1973
LEAM THERMAL ANOMALY INVESTIGATION REPORT
Prepared by: A D. Perkins
Approved byG:) ~~cko, D. Fithian
MO. IIIEV. NO.
~TM-1120
Learn Thermal Anomaly Investigation PAGI 2 OP
OATI 22 March 1973
1. 0 Introduction and Anomaly Description
An investigation was conducted to determine why the temperature of the Lunar Ejecta and Meteorites Experiment (LEAM) exceeded the math model predictions when operating on the lunar surface.
The LEAM was deployed on the lunar surface at approximately 0200 hours GMT, on December 12, 1972. The experiment was operated briefly to verify that it had suffered no damage during the translunar flight and landing. The power was then removed until the dust covers could be released, after detonation of the Lunar Seismic Profiling Experiment (LSP) explosive charges. The temperature, as measured on temperature sensor AJ 11, at noon, in this configuration, was 1760F which exceeded the preferred maximum operating temperature of 15 OOF. (AJ 11, Survival Temperature Monitor, is a temperature sensor located on the experiment internal structure under the radiator plate and which is monitored by the ALSEP at all times.)
When the temperature decreased to 160°F, after lunar noon, the experiment was operated for a short time to allow the mirror cover to be released. A distinct increase in cooling rate was observed after this event. The experiment was finally turned on, on December 23rd. after an attempt, appro:xdmately 24 hours earlier, which had to be terminated when the temperature reached 1500F.
The period between December 23 and December 28 was used to gather background science data with the dust covers on. The command to release the sensor covers was transmitted at 19. 57. 30 GMT on the 28th of December 1972, and verification of squib firing was obtained from the experiment. The temperature profile before and after the command was cyclic, varying between the upper and lower limits of the temperature controller (0°F and 9°F nominal). The period of the temperature cycle did not change after the command, indicating that the covers may not have released, even though the squibs had fired.
~., .. ~~Dhl•lan
NO. I.V. MO.
ATM-1120
Learn Thermal Anomaly Investigation PAGI 3 OP
DATE 22 March 197 3
The temperature at sunrise on the second lunar day increased at an extreme rate of up to 16°F until the experiment was turned off at 1650F. The profile then exhibited peaks of 192. 5°F and 186. 5°F at sun angles of approximately 45 and 115 degrees, respectively, with a minimum of 163°F at 85 degrees. The experiment was returned to the operate mode at 130°F.
To satisfy a request from the Principal Investigator, the experiment was turned off for a period of eighty minutes around optical sunset at the site. This was done in support of his dust transport theory. The temperature during the following night. was considerably colder than during the previous one, being at -200F with the heater on continuously.
The off/ on technique was repeated at optical sunrise on the third lunar day. The temperature profile was significantly different to that of the second day, being some 45°F cooler at 15 degrees sun angle, allowing the experiment to remain on approximately 24 hours longer. The temperature remained cooler. than previously until around 80 degrees sun angle when the second day profile was followed for the remainder of the third lunar day/night cycle.
The investigation described below was conducted to establish the cause of the anomaly and to recommend an operational plan for the experiment based on the requirements of the Principal Investigator and reliability considerations.
2. 0 Task Description
The investigation was performed by the LEAM Program Of:fice, the ALSEP Thermal Design Group and ALSEP Reliability Group, with assistance from the ALSEP Systems Group.
The tasks performed are summarized below.
A. Prepare a list of potential causes of the anomaly. B. Analyze each potential cause, in detail. C. Review the test history of all LEAM models for details
of configuration, environments and results.
iATM-llZO Learn Thermal Anomaly Investigation
PAGI 4 OP
DATI ZZ March 197 3
D. Review the film development program for results and selection criteria.
E. Correlate thermal math model with lunar temperature profile to give insight into the problem and predictions of temperatures in the continuous mode of operation.
F. Perform reliability analyses to determine advisability of operating up to various temperatures and advantages of turning off at temperature peaks.
G. Prepare a test plan for the Qualification model. H. Prepare an operational plan for the experiment during
future lunations.
3. 0 Results of Investigation
The results of the study were presented at a meeting with personnel from MSC, Houston, on 13 March 1973. A copy of the presentation material is enclosed as a part of this document.
4. 0 Conclusions
The following conclusions were reached as a result of the study.
A. No single, definite, cause can be associated with the anomaly. The most probable cause is a combination of lunar surface and site effects, including a complicated method of dust transport.
B. The LEAM thermal performance cannot be clearly explained using the detailed math model. A good correlation has been obtained with a simple, 5 node, model which allows good predictions of operating temperatures at the radiator plate. The observed relationship between radiator and electronics temperatures is used to predict their operating profiles.
C. The original thermal analysis and testing performed before flight has not been invalidated by any information found during the study.
NO. ltiV. NO.
ATM-1120
Leam ThermalAnomaly Investigation PAGI
5 OP
DATI 22 March 197 3
D. The LEAM may be operated continuously throughout the lunar cycle. The maximum temperature predicted in this mode is 212°F at the electronics. The reliability is shown to decrease from an original prediction of 80o/o probability of successful operation for two years to one of 61 o/o if operated in this mode.
E. No action items resulted from the meeting with NASA personnel, therefore, the material presented is considered adequate to satisfy the requirements of the study.
Attachments: Meeting Minutes Presentation Material
Minutes of the LEAM Anomaly Meeting
ATTENDANCE - (On separate list)
Agenda (Attached)
MINUTES Dolt of MHt11J 3/13/73
"LEAM Anomaly Investigation" - handout documenting results of Bendix study efforts on the LEAM problem issued to each attendee.
In LEAM analysis it was assumed that sensors would not contribute to heat load, therefore, only IR simulation was used in testing. Predicted maximum temperature level of 1500:F was re-evaluated for the final Apollo 17 landing site - no changes were made in maximum temperature prediction. It is noted that the actual operating temperatures do not follow the pre-mission predictions in either level or profile.
The instrument thermal/mechanical design was reviewed from sketches in the handout. The electronics assembly is enclosed in a multilayer thermal bag which is enclosed in a fiberglass box - openings for sensor inputs are provided. The AJ-11 sensor is immediately underneath the internal support assembly adjacent to the heater control sensor.
Predicted forward film temperature max is about 275-300°F. Melting temperature for the Parylene-c is 536~ (per Union Carbide) thermal properties for all areas/elements of the experiment were reviewed. Comments concerning Sl3G paint-material is very stable and does not degrade due to long expoaure to solar input.
Thermal performance after mirror cover removal command tenQs to confirm that mirror cover did retract. Thermal performance after sensor cover removal command indicates that the sensor cover did not retract at that time; however, following warm-up at sunrise of the next day, performance indicates that sensor covers did deploy.
The rapid increase in temperature immediately after sunrise on the second morning indicates a heat load from the environment - proba~ly the east sensor. A similar load exists in the west sensor in the lunar afternoon. There is some thought .that the sensor covers are only partially deployed. There is a history of similar problems on a roll-up type device on the Apollo 9 LM window covers. In that case, after exposure to temperature extremes, the role-up device would not deploy. The LEAM cover is essentially the same as the covers used on CPLEE where no problems were encountered.
In summary, the difference in thermal performance may be caused by a delayed (or partial) sensor cover deployment. The variation from one lunar day to another may be caused by accretion of lunar dust on the east, and to a lesser extent on the west, sensor film (and grid) produced by a dust trans-port from charge differences between the lunar surface and the sensor at sunrise. It is postulated that the surfacP may be charged to a negative 200 to 500 volts while the sensor/grid are at -3v/-7v when the experiment is ON. Based on this, a tentative operational plan calls for t.he ex~riment to be off during sunrise.
tlallllille ............. ft
Minutes of the LEAM Anomaly Meeting
(continued)
P e 2
MINUTES
Configuration differences between DVT model and Qual/Flight were reviewed. There are no differences between the Qual and Flight models. All changes made from the DVT model test results were verified by test.
A thermal math model (3rd day) has been derived which correlates'with 1 unar performance. Based on this model, electronics temperature is predicted to reach a maximum of 21~ at a solar angle of ~ 120.degrees.
Review of potential causes. (Each of the following was considered during the LEAM study.)
1. Actual thin film thermal/optical properties different from those assumed in· model-agreement of four different sources of fUm optical pr~ty measurements tend to rule this out. Melting temperature (536 F) was not reached.
2. Boost failure of film8 (accoustical/Pressure vibration induced). Review of Pioneer experience and ALSEP test data and experiment venting tend to rule this out.
3. Anomalous deployment. Air-to-ground transcript, crew debriefing and photos confirm good deployment.
4. Experiment misleveling/misalignment caused by cover release. Force is much too small to move experiment to any degree.
5. Failure of covers to release - complete or partial. Temperature plots indicate sensor covers did not retract when squibbs were fired. May have deployed on second lunar day.
6. Heater on during day - telemetry confirms that this is not the case. Heater status changed as expected~ Also, system reserve power confirmed heater on/off change.
7. Taurus Littrow site effects - the surface temperature is somewhat above pre-mission predictions however this cannot explain the LEAM performance.
8. Dust accretion on sensor and/ or radiator. Second and third day indicates east sensor optical properties have changed. Dust accretion could explain this change.
9. Errors in telemetered temperature data. Evaluation of telemetry data and calibration confirm correct TM.
Minutes of the LEAM Anomaly Meeting
(continued)
Page 3
MINUTES Date of MHIIII 3-13-73
Reliability considerations for fUture experime1•t operation were presented. A full family of curves were presented which show probability of meetas the 24 month operating life versus a variety of operating t~peratures and configurations. It is noted that probability of success (Ps) is reduced with higher operating temperatures, however, (for example) with operation at l00°C the Ps for 24 months is 6?%: at 400c the Ps for 24 months is 80%. These percentages (except for the 4o0c curve) are based on a temperature·profile which contains 160 hrs. of operation at maximum temperature; 150 hours at a lower temperature and the remainder at 4o0c. Based on reliability considerations& the instrument can be operated at a temperature profile which peaks at 100 C.
Bendix presented a test plan including instrumentation requirements for the test. The test is not recommended at· this time but may be indicated by future performance data.
Recommendations for fUture instrument operation:
1. Continue present operating plan for this current lunar cycle. (See SMEAR - Apollo l 7 - ALSEP #41) ..
'<
2. Consideration will be given to leaving the instrument on during sunset on 23 March, pending results of the PI. analysis of S'l'DN data.
3. NASA will refine the sunrise/sunset predictions for the Apollo 17 site.
4. No actions are pending from BxA as a result of this meeting.
Original signed by:
Warren Tosh J. R. Bates S. J. Ellison E. Granholm 0. E. Berg D. Perkins
Distribution:
Attendees w. Eichelma.n B. J. Rusky D. Fithian T. Fenske R. Mercer
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LE.AM ANCMALY MEETING
3/13/73 ATTENDANCE
John B. Hanley NASA HQ/SM (202) 755-1602 John Lowery ED2/NASA ext. 3872 Robert Miley TDX/Bendix ext. 5067 Erik A. Granholm BxA (313) 665-7766 ext. 8111 James R. Bates TN3/JSC ext. 2711 John Lobb P1'14/JSC ext. 2074 otto E. Berg · GSFC-NASA ( 301) 982-5920 R. s. Harris, Jr. NASA/ES3 ext. 5589 S. J. Ellison BxA ( 313) 665-7766
· Edward S. S. Morrison NASA PD9/GE ext. 3966 Derek Perkins BxA A. E. Eckermann NASA/NB5 (Boeing) 488-0910
W. Tosh BxA Earl Smith NASA/NB5 483-2868
. '
LEAM Anomaly Meeting
Agenda
1. Introduction: Problem definition.
2. Description of experiment, thermal properties, films and coatings.
3. Review of flight temperature profile to date.
4. Description of anomaly investigation and results
a. Review of test history, including environments and differences between DVT,- Qual and Flight models.
b. Review of film development and selection.
c. Attempts to correlate thermal math model with lunar temperature profile.
d. Outline of potential causes.
e. Discussion of potential causes.
5. Summary of reliability studies.
6. RecaDII'Iendations for further evaluations on test.s.
7. Discussion of future experiment operational plan.
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LUNAR EJECTA AND METEORITE EXPERIMENT DESCRIPTION
The experiment consists of two dual film sensors facing UP and EAST,
respectively, and a single film sensor facing WEST. The sensors and electronics
are housed in an aluminum internal structure which acts as structural support
and electrical shielding.
The sensor and electronic assembly, called the Internal Structure and
Sensor Assembly, is housed in a thermal bag which, in turn, is mounted in an
outer housing. Legs are attached to the outer housing and are used to support the
experiment in the deployed configuration. A radiator plate, with second
surface mirrors, is attached to the Internal structure and ALSEP interface
bracket. The thermal bag is integral with the ALSEP interface bracket.
The complete Internal structure, thermal bag and radiator assembly
is attached to the outer structure via four clevis joints.
The radiator is covered by a thermal mask which protects all of the
top surface except the sensor and required mirror radiator.
Electrical connection is made between the experiment and ALSEP
using a flat cable via a short manganin wire assembly.
The sensors are protected by dust covers which are released by
earth commands. The mirror cover is released by a pair of squibs,
independently of the sensor covers (l) which are released by a separate pair
of squibs. One, only, of each pair of squibs is required to release the
respective covers.
The experiment and its thermal properties are detailed in the attached
Figures and Tables.
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Experiment Thermal Properties
1. External Structure: - Painted on outside with Sl3G thermal paint (ars IE H = 0. 210. 9). Inside surfaces covered with aluminized tape.
2. Internal Structure: - Sensor cavities painted with 3M Velvet Coat (£H = 0. 9). Surfaces facing superinsulation bag covered with aluminized tape.
3. Radiator: - Five square inches of second surface mirrors exposed to space (Q 11fH = • 071. 80) and mounted to a 60 mil aluminum plate. s .
4. Radiator Masking: Twenty-one layers of 114 mil aluminized Mylar separated by 20 layers of silk separators. Blanket enclosed by single layers of 2 mil aluminized Teflon. Outer layer has Teflon side out ( C{s I [ .H = • 201. 69) and inner layer has aluminized side facing exper1ment (E H = • 05).
5. Corner Support Masking: Same construction as above •.
6. Thermal Bag: Forty-one layers of 114 mil aluminized (both sides) Mylar separated by 40 layers of silk separators. Outside layer is 5 mil aluminized Kapton with aluminized side out. Inside layer is 2 mil aluminized Kapton with aluminized surface facing internal structure. ( cH = • 05)
7. Up and East Sensor Forward Films: A laminate consisting of 3050 angstroms of Parylene coated with 700 angstroms of aluminum covered by 3250 angstroms of silicon oxide (cxs IE'H = • 251. 1 ).
8. Up and East Sensor Rear Films: Three mil molybdenum foil sand blasted (c H = • 06).
9. West Sensor Film: Three mil molybdenum foil coated with vacuum deposited aluminum (~s/cH = • 10/. 03).
10. Up and East Sensor Outboard Suppressor Grids: Outside face covered with aluminized tape.
II. East Sensor Film Shields: Faced with aluminized tape (76o/o) and Sl3G paint (24%) (average ~It: H = .124/. 254).
12. West Sensor Suppressor Grid: Outside face covered with alwninum tape (76%) and Sl3G paint (24%).
13. Up and East Sensor Frames with Visibility of Sun: Painted with Sl3G.
14. West Sensor Frames: Covered with aluminum tape (76%) and Sl3G paint (24%).
15. Grid and Film Frames with NO Visibility of Sun: Painted with 3M velvet coat.
16. External Hardware Including the Bubble Level, UHT Socket, and Legs: Painted with Sl3G.
17. DustCovers:
Mirrors: Two, 2 mil aluminized Teflon layers bonded with aluminum surfaces together. Two negator springs placed between layers.
East Sensor: Identical to mirror cover.
Up and West Sensor: Identical to mirror cover except that outer layer is 1 mil aluminized Kapton. A white plastic adhesive strip is used for the alignment marking area.
Heater distribution for the qualification model is as follows:
1. East Sensor Nominal
A 0. 60 watt heater located on the internal structure behind the East sensor rear electronics.
2. West Sensor Nominal: A I. 90 watt heater located on the rear of the West Sensor electronics shield.
3. West Sensor Survival: A I. 15 watt heater located next to 2 (above).
4. Radiator Nominal: A 0. 60 watt heater located on the internal structure near the radiator and south of the central electronics.
5. Radiator Survival: A 0. 3 watt heater located next to 4 (above).
6. Structure Survival: A resistor dissipating 0. 35 watts located on terminal board.
Parylene Film VacuUin Deposited with AlUininum
SOLAR ABSORPTANCE
Angle of Solar Incidence Absorptance (degrees) (CX s)
20 • 218
45 • 293
60 • 306
75 • 334
EMITTANCE
Directional Emittance I Hemispherical Emittance
A= 20° 45° A= 60° -----------r ( f H)
A= A= 68° I
o.oss o. 11 0 0.156 0.194 0.133
LEAM Power Dissipation
Power (Watts) Notes
Functional 2.99 @ +150°F I .;
3. 18 @ +680F I l
3.40 @ -22°F I I l
Heater 3.20 (0-9°F) Control Range I Total 6.6 (3. 4 + 3. 2) Watts I
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Contingency 0.21 Commandable I
I. 8 Fixed + 3. 2 Controllej Standby 4. 96 j
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« /~
Historical Summary of LEAM Experiment Development Program
The following is a chronological listing of the major tests performed on the LEAM experiment during the development programs. The significant meetings held during the period are also identified.
1. 16-17 February 1971, Preliminary Design Review
2. March 1971, Design Verification Test Model, Phase I, Thermal Test
3. 15-18 June 1971, Critical Design Review
4. June-July 1971, DVT Model, Phase II, Mechanical Test
5. November 1971, Program Review
6. February 1972, Program Review
7. May 1972, Flight Model, Acceptance Vibration
8. May-June 1972, Qual. Model, Thermal Vacuum Test, System Level
9. June 1972, Qual. Model, Vibration Tests, System Level
10. June 1972, Thermal Design Review at Bendix and MSC
11. July 1972, Flight Model, Thermal Vacuum Test, System Level
12. 18-20 September 1972, Customer Acceptance Review (CARR}
13. 20-21 September 1972, Qual. Model Acceptance Review (QAR}
14. September 1972, Taurus -Littrow Site Evaluation
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7
Lunar Ejecta and Meteorites Experiment
Configuration Differences
1) Design Verification Test Model to Qual and Flight Models.
a) Redesign of the interface bracket from fiberglass instead of titanium.
b) Movement of the squib attach points to the external structure.
c) Movement of the bubble level away from the interface bracket.
d) Redesign of the East and West sensor openings to cover the frame edges.
e) Redesign of the masking to cover the thermal bag flange which is now part of the interface bracket.
0
f) Front film thickness increased to 3050 A parylene.
g) Front film frame has foam strips added to both sides.
h) Thermal mask over radiator changed to leave 5 square inches of mirror uncovered.
i) Dual sensor suppressors changed to aluminum tape on outer frame.
j) Sensor wiring changed to manganin on outer frame.
k) Bottom of outer structure changed from aluminum to Sl3G paint.
2) Qual Model to Flight Model - No differences.
Test Verification
All changes were verified during Qual and Flight Acceptance testing and
Qual design limit testing.
Film Development Criteria
Objectives
The objectives of the program, as defined by the Statement of Work were:
a. To develop a thin Parylene C film laminate and structural attachment which will withstand the prelaunch, test, storage and trans lunar flight environments, and perform normally for two years under lunar environmental conditions.
b. To develop a thin Parylene C film laminate and structural attachment which will yield a maximum supply of ions and electrons when impacted by hypervelocity microparticles.
c. To develop a thin Parylene C film laminate and structural and attachment which will satisfy (a) and (b) and result in the smallest mass cross section; thus minimizing the microparticle kinetic energy threshold for penetration of the film.
4. 0 Conclusions
The conclusions made from the evaluations are that:
a. The deposit should be 3000 to 4000 Angstrom units thickness of Silicon oxide over 600 to 700 Angstrom units of Aluminum on a 2800 to 3300 Angstrom units thick Parylene substrate. The laminate is to be mounted on a 97% transparent, beryllium copper grido The aluminum and Silicon oxide are to be vacuum deposited while the Parylene C and grid are free standing on frames. This laminate has the optical and thermal properties required to endure the lunar environment and to allow thermal control of the experiment electronics.
b. A support grid is required to provide mechanical strength and to provide thermal conductivity from the film to the film support frame.
c. The deposition provides adequate ionized plasma upon impact by a hypervelocity particle.
d. Free standing deposition resulting in slightly wrinkled . film is desirable for low temperature survival.
Film Assembly - See attached Figures.
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Internal Memorandum
13 Feb 1973
Distribution
S. J. Ellison
LetterNo. 73-252-03
LEAM Thermal Anomaly - Reliability Analysis
Aerospace Systems Division
Ann Arhnr. Mictuuan
The objective of this reliability analysis for the LEAM operational profile is to delineate the temperature/time conditions of reliable operation.
The failure rates for the LEAM experiment as well as the reliability mathematical model were taken from the documents previously submitted by the subcontractor, i.e. time zero.
The thermal profile used as the basis for this analysis is shown in Figure 1 - the power on analysis curve. For analytical simplicity, this curve has been modified by ignoring the small dip at the 900 sun angle. Figure 2 represents graphically the temperature/time relationship of the modified thermal profile for one lunar 'cycle. The first 160 hours shown in Figure 2 represent the time at maximum temperature between 500 and 1300 sun angle. This worst case condition is shown in Figure 2 at 1250 C for 160 hours. The next portion of the curve has been averaged out at lOOOC for 150 hours. The remaining 390 hours of the lunar cycle have been averaged out at 400C based on the failure rates for lunar night and lunar day temperatures.
Table 1 tabularizes the K factors that were applied against the time zero failure rates at various temperatures, i.e. 40°C, lOOOC and 1250C in order to calculate the failure rates at these temperatures.
Figure 3 depicts the probability of successful operation at temperatures of 400C, Ioooc, uooc, 1150C and 125oc. The 400C curve is a prediction based upon the expected thermal profile prior to LEAM anomaly experienced on the Lunar Surface. Essentially, this is the time zero reliability prediction for successful operation. The other curves are based upon the new thermal profile with maximum temperatures as shown.
Comparing the 125°C to the 40°C curve at the 6th lunar cycle (the probability of operating for six lunar cycles), we see that the
: Page 2 73-252-03 13 Feb 1973
reliability decreases from 94o/o to 83%. However, the change from 100°C to 1250C is rather small, i.e. 88% to 83%. Figure 4 delineates the probability of success for degraded operation at 12soc, i.e. the probability of no failures other than loss of a single sensor and housekeeping. If we compare the P
8 for "Less single sensor and
housekeeping" to the P 5 at 12soc in Figure 3, we find that the reliab~lity for six cycles increase from 83% to 90%. The differential is even more significant for two years of operation.
Figure 5 is a reverse reliability curve, i. e. it shows the probability of successfully completing two years of operation if successful at a particular cycle in time. This P S for two years is read directly from the cycle completion point. For example, if after operating successfully at 100°C for six cycles, the probability of successfully completing two years of operation (i.e. another 18 months) at 125°C is seen to be 56%. The PS for two years of operation after ten months of success is seen to be 63%.
Figure 6 - dotted line curve, shows the P5
of the LEAM if the power is shut off between the 50° and 130° sun angle. The PS for six cycles goes from approximately 83% to 93%.
Figure 7 shows the LEAM system failure rate curve based on stresses for each part and associated temperature.
SJE/db
Distribution D. Perkins J. McNaughton E. Granholm P. McGinnis B. Rusky T. Fenske
S. J. Ellison
•.
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~ 0 'IS. ·go
-·- ·- -· ... -- ---··---· ·-- --- .: -;c:.:.t -s-- 7 .J
LEAM Temperatures and Time at Temperature - one lunar day
255°F for soo Sun Angle or 80° x 2 hrs /°F = 160 hrs.
255°F '::!:::: 125°C
250° 180°F = 70 = 35°F 2 2
Average 180 + 35 = 215 ~ 100°C
30o Angle x 2 hr/°F = 60 hrs.
45° Angle x 2 hr/°F = 90 hrs.
40°C for :::::::: 390 hrs.
Tl = 125°C t1 = 160 hrs.
Tz = 100°C t 2 = 150 hrs.
T3 = 40°C t 3 = 390 hrs.
to = 17520 hrs.
.,.
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LL:
- -o- -
!1113L £. 2 LEAM Failure Rate ('A) Temperature K Factors
Stress -~omponent Level ).40 'A 100 KIOO )...125 KI25
Resistors: Film RNR MIL-R-55182B 0.5 0.218 0.440 2 0.645 3 Film RLR MIL-R-39017 o.s 0.288 0.715 2.5 3.4 W /W PWR MIL-R- 39007 o.s 0.240 0.402 1.6 o.soo 2 Comp. RCR MIL-R- 39008 o.s 0.025 1.000 40.0 40 WW Accurate MlL-R- 39005 0.5 0.158 0.370 2. 3 0.710 4.5
Capacitors: Solid Tantalum MIL-C- 39003 (CSR) 0.5 0.0400 0.143 3. 5 0.265 6.6 Sintered Tantalum MIL-C-39006 0.5 0.0014 0.0145 10 0.112 8 Paper MIL-C-14157D (CPU) o.s 0.040 0.040 1 o. 064 I. 6 Glass MIL-C-23269A o.s 0.0016 0.025 15 0.080 50 Ceramic MIL-C-39014 (CKR) 0.5 0.006 0.054 9 0.125 20 Foil Tantalum MIL-C-39006 (KSR} 0.5 0.025 0.081 3.2 0.190 7. 6 MICA MIL-C-39001 0.5 0.017 0.017 1 o. 017 1
Diodes (. 1 w and Zener .25 .85 3. 5 1 5 > 1 w 5. 0 10
Transistors: PNP ~25 .85 4.0 1 7.0 NPN .25 .85 3.0 4
Micro Ckts. • 25 • 85 4 1 7
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Page 12
T/181.£ 2... LEAM CONTINUOUS OPERATION
P 5 Total System for Max Temperature (°C)
LUNAR CYCLE 40 100 110 115 120 125
1 • 9905 • 9794 • 9755 • 9708 • 9697 • 9683
3 • 9718 • 9396 • 9283 • 9151 • 9118 • 9080
6 • 9445 • 8829 • 8618 • 8375 • 83i4 • 8245
9 • 9179 • 8296 • 8001 • 7665 • 7581 • 7487
12 • 8921 • 7796 • 7428 • 7015 • 6913 .6798
15 • 8670 • 7325 • 6896 • 6420 • 6304 • 6173
18 • 8426 • 6883 • 6402 • 5879 • 5748 • 5605
21 • 8189 .6468 • 5944 • 5377 • 5241 • 5090
24 • 7959 • 6078 • 5518 • 4921 • 4779 • 4622
P5
Co
nti
nu
ou
s O
pera
tio
n a
t 4
0°C
LUN
AR
T
ota
l C
YC
LE
S
yst
em
L
ess
HK
L
ess
S
S
1 •
99
05
3
• 9
91
4
• 99
37
3 •
97
18
0
97
46
•
9813
6 •
94
45
•
94
99
•
96
30
9 •
91
79
•
92
58
•
94
50
12
• 89
21
• 9
02
3
• 927
3
15
• 8
67
0
• 8
79
4
• 91
00
18
• 84
26
• 85
71
• 8
93
0
21
• 8
18
9
• 8
35
3
• 87
63
24
•
79
59
•
8141
•
86
00
1B
LE
3
LE
AM
-
DE
GR
AD
ED
MO
DE
. P
5 C
on
tin
uo
us
Op
era
tio
n a
t 1
25
°C
To
tal
Less
HK
& S
S
Sy
stem
L
ess
HK
.
Less
SS
L
ess
HK
& S
S
• 9
94
4
• 9
68
3
• 9
71
2
• 9
79
7
0 98
21
• 9
83
4
• 9
08
0
• 91
62
.94
04
•
94
73
• 96
71
• 8
34
5
• 9
39
4
• 8
84
5
• 8
97
4
.95
11
.7
48
7
• 76
91
• 8
31
8
• 85
01
• 9
35
4
.67
98
•
70
46
•
78
23
•
80
54
.91
99
.6
17
3
• 64
56
•
73
58
• 7
62
9
• 9
04
7
• 5
60
5
• 5
91
5
.69
20
•
72
28
• 8
89
7
• 5
09
0
• 5
41
9
• 65
08
• 6
84
7
• 8
75
0
• 46
22
.4
96
5
• 612
1 • 6
48
6
~ OQ " .... c...
LUNAR CYCLE
1
3
6
9
12
15
18
21
24
TABLE 4
LEAM DEGRADED MODE
P S Altered Oper Cycle*
TOTAL SYSTEM
• 9885
• 9660
• 9332
• 9014
• 8708
• 8412
• 8126
• 7849
• 7579
LESS HK
• 9904
• 9713
• 9435
• 9164
• 8902
• 8646
• 8398
• 8157
• 7924
LESS ss
• 9944
• 9834
• 9670
• 9510
• 9352
• 9197
• 9045
• 8894
• 8746
Altered Oper Cycle - Off at 50° Sun Angle
On at 130° Sun Angle
LESS HK & SS
• 9969
• 9909
• 9819
• 9730
• 9642
• 9555
• 9468
• 9382
• 9297
Page 14
LE
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Instrumentation for LEAM Thermal Vacuum Test
In addition to the standard flight temperature sensor the following instrumentation is required:
1. Twelve thermocouples attached in accordance with Bendix drawing 2373193.
2. Additional thermocouples attached to points indicated below:
a. Up Sensor.
(i) Outer forward grid frame, west edge (ii) Forward film frame, outer edge
b. East Sensor
(i) Outer forward grid frame, bottom edge (ii) Forward film frame, outer edge
c. West Sensor
(i) Grid frame, bottom edge
d. (i) Thermal bag, inside, North (ii) Thermal bag, outside, North
e. Center of Second surface mirror, under insulation mask.
