Leaders and Innovators in C-SAM® Solutions · 2019-12-06 · Our advanced C-SAM technology is the most relied upon worldwide for inspecting and finding defects in a wide range of

www.nordsonsonoscan.com

Leaders and Innovators in C-SAM® Solutions

Sonoscan Brochure v4c.indd 1 11/01/2019 20:14

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2007Thickness Measurement Module & Automated Flip Chip Analysis Functions released

2008ASF™ (Acoustic Surface Flatness) measurement mode (patents issued)

2009First automated C-SAM for 300mm wafer inspection

2010FastLine P300™ manual screening system for manufacturing floor (patent issued) ------- PolyGate™ platform released with the P300™ system

2011Gen6™

laboratory system introduced with PolyGate™ platform

2012SonoSimulator™ released for Stacked Die analysis

2013First WaterPlume™ feature for dry inspection of IGBT Power Modules

2014Introduced next generation FACTS™ instrument

2005VRM™ (Virtual Rescanning Mode) and FDI™ (Frequency Domain Imaging) (patents issued)

2006Nordson SONOSCAN China Lab Opens & CSA™ (Cavity Seal Analysis) for automated seal integrity evaluation

2015Global Tool Matching™

------- Quantitative Dynamic Z™

2016New Jumbo C-SAM J610

2018Nordson Acquires SONOSCAN

------- The Gen7 C-SAM is launched with Windows® 10 and dual 4K monitors

Nordson SONOSCAN® has a worldwide reputation of being the most trusted authority on the application of Acoustic Microscopy (AM) technology for nondestructive inspection and analysis using our C-SAM® (C-Mode Scanning Acoustic Microscope) solutions. Our systems are recognized as the benchmark for accuracy and quality and, through our SonoLab® division, customers benefit from the unmatched expertise.

Superior Technology

We provide customers with superior acoustic microscope tools and technology to help build higher quality products. As a provider of a full range of analytical and testing services for clients that need immediate problems solved.

We deliver:

• Expertise in Acoustic Microscopy

• Outstanding image resolution

• Incredibly accurate results

Unsurpassed Laboratory Expertise

SonoLab, a division of Nordson SONOSCAN, is the world’s largest inspection service specializing in AM. Staffed by dedicated applications engineers, SonoLab has more experience in AM applications than any other resource. This expertise is available to customers for assistance with compatibility and screening projects and as an independent third-party resource.

Leaders in Nondestructive Internal Inspection Setting the Pace and Industry Standard

Nordson SONOSCAN invented the commercial field of Acoustic Microscopy (AM), in particular C-SAM

tools. Our scientists and engineers work closely with our application development team to continually develop advanced systems and techniques for evolving technologies. The result is unrivaled technology, supported by more than 20 U.S. and foreign patents, adding value and confidence for users.

AM Adds Value at Every Stage of a Product’s Lifecycle

• Research and Development

• Qualification

• In-Line Process Control

• Quality Control

• Failure Analysis

• Reliability

Industry Leaders Rely on Us

Reputations are built on quality. That’s why the world’s best-known companies rely on Nordson SONOSCAN for their AM needs. We partner with:

• All of the top ten global semiconductor companies

• Nine of the top ten automotive semiconductor companies

• Seven of the top ten defense contractors

• Four of the top five MEMS manufacturers

• Seven of the top ten 300mm wafer companies

• All of the top five semiconductor memory manufacturers

Join the best-known multinational corporations who have selected us for their nondestructive inspection needs.

Today, we work with numerous organizations to help develop qualification standards that improve component reliability. Many of these standards have been researched, authored or partially authored by our engineers. These include:

• IPC/JEDEC J-STD-020

J-STD-035

J-STD-075

• MEMS STANDARD

SEMI MS8-0309

• MILITARY PERFORMANCE SPECIFICATION

MIL-PRF-123

MIL-PRF-31033

MIL-PRF-32535

MIL-PRF-49470

• AEROSPACE (NASA & ESA) PEM-INST-001 (NASA/TP–2003–212244)

ESA/ESCC Basic Specification No. 25200

NASA S-311-P829

• MIL/AERO STANDARD GEIA-STD-0006

• MILITARY STANDARD MIL-STD-883, METHOD 2030

MIL-STD-1580B

REQUIREMENT 16.5.1.3

1975Shipped the first-ever commercial acoustic microscope, SLAM™

1977Opened main applications development laboratory

1984First analog C-SAM® acoustic microscope developed under “Star-Wars” contract

1987Digital C-SAM acoustic microscope developed (patents issued)

1988C-SAM Balanced Scanner developed (patent issued)

1989Acoustic Impedance Polarity Detection (AIPD) (patent issued)

1993First C-SAM installed for Si to Si bond research

1997230 MHz transducer technology developed for Flip Chip ------- Autoloader for Controlled Immersion Inspection Mechanism developed (patent issued) ------- FACTS2™ (Fast Automated C-SAM Tray Scanning System) (patent issued)

2002Automated system for wafer inspection and small part hold-down (patents issued)

2004Turbo speed developed for high frequency and high resolution applications

Timeline

Inspect With Confidence

We uphold the dual core values of a dedication to AM and a passion for quality results. Our advanced C-SAM technology is the most relied upon worldwide for inspecting and finding defects in a wide range of samples – especially wherever the bonding between layers or the integrity of the materials themselves is of critical importance.

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Acoustic Microscopy’s most notable benefit is its ability to find hidden defects within assemblies and materials that can occur during manufacturing or reliability testing.

The image quality produced by an acoustic microscope is critically dependent upon the imaging lens. Since the transducer/lens is such an important component, we manufacture these elements ourselves.

7 10 25 30 40 50 100

Nordson SONOSCAN’s technologies offer many advantages:

• Locates hidden flaws before they lead to failures

• Detects delaminations as thin as 200 angstroms

• Isolates material property variations

• Measures material density, porosity, inclusions, cracks and voids

• Assesses thermal, impact and fatigue damage

• Assesses interface adhesion and delamination

• Nondestructive

Unlike other nondestructive techniques, such as x-ray and infrared imaging, acoustic microscopy is highly sensitive to the elastic properties of the materials it passes through. Ultrasound waves may be absorbed, scattered or reflected by the material changes that they encounter, and they are especially sensitive to air gaps.

Nordson SONOSCAN® offers various imaging modes, allowing an operator to gain the ideal viewing perspective based on the orientation of the feature within the sample. In addition, our proprietary advanced features deliver the optimum images, highest efficiencies and most accurate results.

These capabilities make C-SAM tools the preferred AM method for finding and characterizing physical defects that occur during the manufacturing process or during reliability testing. Delaminations, voids and cracks can be identified and analyzed more effectively using acoustic microscopy than with any other inspection method.

The off-the-shelf transducers found in other AM equipment can’t match our unique, proprietary characteristics. Nordson SONOSCAN transducers are specifically developed for C-SAM analysis by our transducer lab located near Chicago, Illinois. Staffed by some of the world’s most knowledgeable acoustic scientists and engineers, our transducers are carefully developed and manufactured to deliver maximum image clarity and quality data.

We offer the broadest range of standard and custom designed transducers. We also have the expertise to optimize the design parameters for specific applications. Nordson SONOSCAN transducers include, but are not limited to, the following design parameters:

Nordson SONOSCAN develops and manufactures these critical components with unique, proprietary characteristics. Available in standard or custom, application specific designs

Test results demonstrating extremely small details deep within silicon (as measured in microns)

Actual subsurface image, 3 micron lines

• 5MHz

• 10MHz

• 15MHz

• 20MHz

• 25MHz

• 30MHz

• 50MHz

• 75MHz

• 100MHz

• 120MHz

• 150MHz

• 180MHz

• 230MHz

• 300MHz

• 400MHz

• 0.5

• 1

• 2

• 4

• 8

• 10

• 1.0mm

• 2.54mm

• 3.8mm

• 6.4mm

• 8.0mm

• 9.5mm

• 12.7mm

• 15.9mm

• 19.1mm

• 25.4mm

• 31.8mm

• 50.8mm

• 127.0mm

Frequencies (MHz) Available

Focal Length (FL) AvailableF# (FL/D) Available

Transducers

Flip Chip 300 MHz image showing void (red) in underfill

Quality control is critical. Therefore, all Nordson SONOSCAN transducers undergo a detailed quality and calibration test to verify resolution and ensure optimal performance. Our transducers can deliver high quality AM images and result in verified superior resolution.

UltrasonicTransducer

CrackDelamination

Interfaces

Ultrasound Path In/Out

A-Scan C-Scan

Voids

3D virtual volumetric view with scan diagram superimposed

C-SAM®–The Leading AM Technology Image Quality Advantages




Precision Instruments

The FastLine Acoustic Microscope is specifically designed to accelerate inspection throughput in manual screening of microelectronic devices on the manufacturing floor. With an integrated design to minimize footprint and a unique carrier system which allows one JEDEC style tray or reference tray to be scanned while a second tray is safely loaded, FastLine is the new platform for efficient component screening.

The FACTS2 delivers state-of-the-art, automated in-line inspection for quality and process control. Simultaneously inspecting two trays and utilizing multiple scan heads, the DF2400 improves throughput between two and seven times that of previous tools. FACTS2 automatically inspects parts in JEDEC trays or Auer Boat carriers. The FACTS2 can also handle lead frame strips, IGBT power modules, multi-layer ceramic chip capacitors, flip chips and other components. Equipped with our industry preferred Sonolytics software platform, FACTS2 is the ideal solution for production environments.

Highest Quality

Our AM instruments are built with the highest level of quality. To ensure that all instruments measure up to Nordson SONOSCAN’s rigid specifications, every system undergoes rigorous testing before shipment to ensure reliability, longevity and superior performance.

Suitable for a Wide Range of Applications

From component analysis, to high-speed wafer inspection, to intensive laboratory analysis, to efficient manual screening capabilities, our instruments meet our customers’ needs. So whether you’re seeking equipment for a scientific, production or specialty use, we offer a wide range of styles, models and options that deliver the best solution.

Designed for Efficiency

Nordson SONOSCAN instruments deliver results. Ergonomic and smart designs minimize operator fatigue and maximize throughput. Proprietary hardware such as our Waterfall Transducer™ and Inertially Balanced Scanning Mechanism™ allow for higher-speed scanning and yield the highest levels of productivity and return on investment.

From the laboratory to the production floor, Nordson SONOSCAN®’s advanced Acoustic Microscope (AM) tools and technology help build higher quality products. We manufacture our own instruments in our state-of-the-art production and engineering facility near Chicago, Illinois.

Selected Features:

• Unique carrier system to maximize throughput (patent issued)

• Precise positioning, faster scanning and automated analysis

• Visual PolyGate™ technology for simple and instant multiple-depth imaging with up to 100 gates

• Multi-Language OS and intuitive Sonolytics™ Operator Interface

• Ergonomic features for operator comfort and efficiency

• Minimal footprint for optimum use on the manufacturing floor

Selected Features:

• Global Tool Matching™

• SECS-II/GEM (SEMI E30) and SMEMA compliant

• Non-immersion scanning using WaterFall™ and/or WaterPlume™ Transducers

• Automated Data Analysis Package

• Vacuum Hold Down option to stabilize small parts in place during scan

• Separate drying chamber with up to four oscillating air knives and optional heated air

• Numerous configuration options including JEDEC trays, Auer boats and IGBT modules

Production Instruments

FastLine™ P300

Facts2™ DF2400

Superior Technologies

Nordson SONOSCAN’s proprietary signal processing algorithms provide the most reliable and accurate assessments. A wide variety of analysis functions help quantify the defect significance, and a wide range of color maps accentuate features within the AM image. In addition, proprietary and patented technologies such as Virtual Rescanning Mode (VRM™) provide exceptional advantages and unique capabilities.

Expert Support

Customers have access to more than 20 dedicated and highly experienced AM applications engineers. This remarkable pool of talent provides a level of training, support and service that is unmatched in the industry.




The AW Series are fully automated C-SAM systems designed for wafer applications. Maximum sensitivity and high-throughput are delivered for the evaluation of bonded wafer applications (SOI, MEMS, LED, 2.5D & 3D). The AW Series can detect voids and features smaller than 5 microns in diameter between two wafers and delaminations between wafers as thin as 200 Angstroms.

With two or more scan heads, a staging station and a drying station, the AW is designed to efficiently scan two wafers while drying the previously scanned wafers.

The Gen7 C-SAM is the highest performing and highest resolution acoustic microscope. Taking the best from its predecessor, the Gen6™ (such as, cutting-edge technology, advanced features, aesthetics and ergonomics), the Gen7 goes beyond the D9600 and takes acoustic imaging to the highest level. It delivers the broadest range of capabilities available for nondestructive failure analysis, process development, R&D, high-reliability qualification or medium-volume screening. The Gen7 is the one machine that can meet your present and future needs.

Selected Features:

• Maintains focus for warped wafers using the Quantitative Dynamic Z™ option

• SECS-II/GEM/SEMI 300mm Standards compliant

• Fully automated inspection of wafers from 100mm to 300mm

• Non-immersion scanning using WaterFall™ Transducer

• Industry leading Data Analysis package

• BOLTS standard load port for FOUPs, SMIF Pod, FOSB or open cassettes

• Self-contained water and vacuum unit options

Selected Features:

• PolyGate™ technology with Multi-Gate™ and Probing-Gate™ functions capable of single and multi-focus imaging

• Up to 100 gates per channel

• Windows®7 Ultimate for multi-language and 64 bit capabilities

• Precise scanning with tower mounted scan reference platform and sample fixture

• Optional Digital Image Analysis (DIA™), water recirculation, Waterfall™ transducer and inline temperature control

All the D9600 Features PLUS the Following Advanced Features:

• SonoSimulator™ for multilayer analysis

• Virtual Rescanning Mode (VRM™)

• 400 MHz capable

• Windows®10

• Digital Image Analysis (DIA™)

• Inertially Balanced Scanning

• Dual 4k resolution monitors

• Wrap, straight or narrow cabinet options

• Real time Frequency Domain Imaging (FDI™)

Representing the latest in C-SAM® acoustic micro imaging technology, the D9600 delivers the unrivaled accuracy and robustness that you would expect from Nordson SONOSCAN® instruments, plus improved electronics and software that raises the performance level for laboratory acoustic microscopes. Specifically designed to serve as a general purpose tool for failure analysis, process development, material characterization and low volume production inspection, the capabilities of the D9600 are truly unmatched.

The J610 is a semi-automated instrument capable of scanning PCB panels and samples up to 610mm (24”) wide, or accommodating up to six JEDEC trays of components at one time. The J610 delivers the robustness and accuracy of the D9600 lab instrument, but with very large area coverage capabilities. Plus, the analysis can be performed without operator assistance, freeing your personnel for other duties while the inspection is in progress.

Laboratory Systems Specialty Systems

Selected Features:

• Extra-large inertially balanced linear scanner

• AutoScan™ for fast, repeated analysis of specific regions of interest

• Digital Image Analysis (DIA™) sets automatic accept/reject criteria

• Temperature control options to maintain precise water temperature

• Quantitative B-Scan mode (Q-BAM™) provides a virtual cross-sectional view

• Sonolytics™ interface in Windows®7 Ultimate for multi-language and 64 bit capabilities

D9600

Gen7™

AW Series

J610




Digitally Stored A-Scan Data

Advanced Features

SonoSimulator™ Global Tool Matching™

Quantitative Dynamic Z (Q-DZ™) WaterPlume™

Virtual Rescanning Mode (VRM™) Visual PolyGate™

Frequency Domain Imaging (FDI™) Time Domain Imaging (TDI™)

Acoustic Surface Flatness (ASF™) Quantitative B-Scan Analysis Mode (Q-BAM™)

Digital Image Analyzer (DIA™) Simultaneous Transmission and Reflection (STaR™)

Without Q-Dynamic Z

With Q-Dynamic Z

Simplifies and accelerates the task of generating C-SAM® images on components constructed with multiple thin layers, such as Stacked Die packages.

Q-DZ uses collected data to instantly adjust the height of the transducer allowing the scanner to follow the shape of a non-flat surface to keep a constant focus time of flight during the scan, resulting in an optimal image.

VRM collects and digitally stores comprehensive acoustic data, enabling a complete analysis of a sample, even when it is no longer available or destroyed.

Global matching will produce the same result using the same recipe settings on any tool at any location worldwide.

In addition to non-immersion WaterFall™ technology, WaterPlume inspects the sample from underneath by means of a column of water. With the help of gravity the water stays below the sample keeping the sensitive top surface dry.

Allows you to select up to 100 gates/depths of interest in a single recipe. There are several modes of PolyGate, such as Multi-Gate/Single Focus (MG/SF) and Probing-Gate/Single Focus (PG/SF), plus Multi-Focus variants that ensure in-focus data while retaining polarity and amplitude data.

Allows you to select any single frequency or a range of frequencies to capture and utilize for imaging. FDI brings out subtle details that are not easily detected with conventional pulse-echo methods.

Provides surface flatness and warpage images plus quantitative measurements of the flatness, while obtaining C-SAM images of internal features.

Uses advanced algorithms to quantify the C-SAM data allowing you to perform quantitative analysis to accurately and automatically accept/reject a part per your criteria.

Another way of expressing an image that utilizes an echo (amplitude & polarity) arrival “time” as a reference, such as standard A-Scan, B-Scan and C-Mode type images.

Q-BAM is a calibrated, nondestructive cross-section image in the X-Z plane of a sample, which is completely in focus through the entire Z depth and contains both amplitude and polarity data.

STaR simultaneously captures both a reflective mode and a complete through-the-package view.




Nordson SONOSCAN®’s wide variety of acoustic imaging modes helps you to thoroughly investigate a sample. The optimum viewing perspective, or imaging mode, is based on the orientation of a feature within a sample. In addition, multiple imaging modes are often used to provide an even more complete evaluation and to verify defects revealed in another mode.

A-Scan – Digital waveform display of what the transducer sees. The A-Scan is the foundation of creating and interpreting C-SAM® images.

C-Mode – Created by focusing and collecting amplitude and polarity information from a particular X-Y plane at a selected depth in the sample.

Bulk-Scan – Provides information on bulk material properties and discontinuities indicating features or flaws.

PolyGate™ & Multi-Scan – View multiple levels within a device simultaneously.

Q-BAM™ – A nondestructive, multi-focus, cross-sectional view of a sample. It ensures in-focus data while retaining polarity and amplitude data.

B-Scan – A nondestructive, single-focus, cross-sectional view of a sample.

Surface-Scan – A near surface scan that reveals surface and near surface defects.

z

y

x

C-ModeA-Scan Bulk-Scan

Q-BAM™

Multi-Scan

THRU-Scan™

RECEIVING TRANSDUCER

Surface-Scan

Tray-Scan

3-V™

B-Scan

Sphere-Scan

3D TOF

SLAM

Laser Scanning

R-Scan

Tray-Scan

UltraBoard™

Planewave Transducer

STAR™

Receiving Transducer

z

y

x


Q-BAM™

Multi-Scan

THRU-Scan™


Surface-Scan

Tray-Scan

3-V™

B-Scan

Sphere-Scan

3D TOF

SLAM

Laser Scanning

R-Scan

Tray-Scan

UltraBoard™


STAR™


z

y

x


Q-BAM™

Multi-Scan

THRU-Scan™


Surface-Scan

Tray-Scan

3-V™

B-Scan

Sphere-Scan

3D TOF

SLAM

Laser Scanning

R-Scan

Tray-Scan

UltraBoard™


STAR™


z

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x


Q-BAM™

Multi-Scan

THRU-Scan™


Surface-Scan

Tray-Scan

3-V™

B-Scan

Sphere-Scan

3D TOF

SLAM

Laser Scanning

R-Scan

Tray-Scan

UltraBoard™


STAR™


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Q-BAM™

Multi-Scan

THRU-Scan™


Surface-Scan

Tray-Scan

3-V™

B-Scan

Sphere-Scan

3D TOF

SLAM

Laser Scanning

R-Scan

Tray-Scan

UltraBoard™


STAR™


z

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Q-BAM™

Multi-Scan

THRU-Scan™


Surface-Scan

Tray-Scan

3-V™

B-Scan

Sphere-Scan

3D TOF

SLAM

Laser Scanning

R-Scan

Tray-Scan

UltraBoard™


STAR™


z

y

x


Q-BAM™

Multi-Scan

THRU-Scan™


Surface-Scan

Tray-Scan

3-V™

B-Scan

Sphere-Scan

3D TOF

SLAM

Laser Scanning

R-Scan

Tray-Scan

UltraBoard™


STAR™


z

y

x


Q-BAM™

Multi-Scan

THRU-Scan™


Surface-Scan

Tray-Scan

3-V™

B-Scan

Sphere-Scan

3D TOF

SLAM

Laser Scanning

R-Scan

Tray-Scan

UltraBoard™


STAR™


z

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Q-BAM™

Multi-Scan

THRU-Scan™


Surface-Scan

Tray-Scan

3-V™

B-Scan

Sphere-Scan

3D TOF

SLAM

Laser Scanning

R-Scan

Tray-Scan

UltraBoard™


STAR™


z

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Q-BAM™

Multi-Scan

THRU-Scan™


Surface-Scan

Tray-Scan

3-V™

B-Scan

Sphere-Scan

3D TOF

SLAM

Laser Scanning

R-Scan

Tray-Scan

UltraBoard™


STAR™


z

y

x


Q-BAM™

Multi-Scan

THRU-Scan™


Surface-Scan

Tray-Scan

3-V™

B-Scan

Sphere-Scan

3D TOF

SLAM

Laser Scanning

R-Scan

Tray-Scan

UltraBoard™


STAR™


z

y

x


Q-BAM™

Multi-Scan

THRU-Scan™


Surface-Scan

Tray-Scan

3-V™

B-Scan

Sphere-Scan

3D TOF

SLAM

Laser Scanning

R-Scan

Tray-Scan

UltraBoard™


STAR™


z

y

x


Q-BAM™

Multi-Scan

THRU-Scan™


Surface-Scan

Tray-Scan

3-V™

B-Scan

Sphere-Scan

3D TOF

SLAM

Laser Scanning

R-Scan

Tray-Scan

UltraBoard™


STAR™


mm

AutoScan™ – Programs the system to inspect multiple parts in a tray, on a PWB or anywhere within the available scan area automatically, even if the parts are different.

THRU-Scan™ – An acoustic image through the entire thickness of the sample is captured, providing a complete view of the part.

3V™ – Generates a three-dimensional view of a component from captured acoustic images.

3D TOF – By tracking the transit time from a reference to an internal feature or defect, a topographic image is created of the internal structure.

Multi-Axis Scan™ – Special fixturing allows C-SAM to image spherical and curved surface samples.

R-Scan™ – Effectively unwraps a cylindrical sample. As data is being captured from side to side the sample is also being rotated to access the entire area of interest.

STaR™ – Creates images in both the reflection and transmission modes simultaneously, providing the complete through-the-part view and level-specific information on defects and feature depth.

Acoustic Microscopes are relied upon for finding defects in a wide range of samples - wherever the bonding between layers or the integrity of the materials themselves is critically important. A variety of applications have benefited from SonoLab® services:

Microelectronics• Plastic Encapsulated

Microcircuits

• Ceramic Chip Capacitors

• Die Attach

• Chip Scale Packages (CSPs)

• Flip Chips

• Stacked Dies & 3D Integration

• Ball Grid Arrays (BGAs/CBGAs)

• Tape Automated Bond (TAB)

• Hybrids, MCMs, SIPs

• Flex Circuits

• Printed Circuit Boards (PCBs)

• Smart Cards

• Bonded Wafers

• Thermo Electric Coolers (TECs)

• Power Modules

• Counterfeit Devices

Composites• Fiberglass

• Polymers

• Graphite

• Metal Matrix

• Hybrid

• Other

Materials

• Glass

• Ceramics

• Plastics

• Adhesives

• Metals

• X-ray Target Medical• Materials

• Devices

Microelectromechanical Systems (MEMS)• Bonded Wafers

• Fabrication Process Evaluation

• Zero Level Packaging

• Cavity Seal Analsyis

• Packaging

• Sensors

• IMEMS

• MOEMS

• Lab-on-Chips

• BioChips

• Microarrays

Solar Energy

• Thin Film

• Polymer-Based

• Silicon

How Acoustic Microscopy (AM) and X-ray Differ

AM and x-ray are complementary techniques that are frequently found in the same laboratories, but they reveal different features.

X-rays can be used to see inside a sample based upon material density differences. Denser materials are more absorptive to x-rays, but because air has such low density, delaminations, cracks and disbonds can be missed. Also, common x-ray systems operate in a through-transmission mode and provide a composite image of the entire sample thickness, rather than layer specific data.

Acoustic Microscopy imaging, however, shows differences in material continuity and is very sensitive to the presence of even the smallest air gaps, making inspection for the integrity of bonding between layers a unique advantage. In addition to visualizing interior features of samples, Nordson SONOSCAN’s C-SAM® systems produce images on a layer-by-layer basis. Images can be made in a reflection mode, which requires access to only one surface of a sample or in a through-transmission mode.

AM transmission and reflection identifies delamination

X-ray transmission is unaffected by delamination

Military, Aerospace and Automotive• High-Rel

Qualification

• Upscreening COTS

• Qualification

• Lead-free Devices

• Counterfeit Devices

Packaging Seals• Food

• Medical

• Pharma

• Other Hermetic HB/SSL LEDs• Multi-Layer Wafers

• LED Modules

• LED Drivers

Imaging Modes Applications




ME – Power Die

ME – Bonded Wafer

ME – Plastic Encapsulated Microcircuit

MEMS – Wafer Cavity Seal Analysis

ME – Stacked Die

ME – PCB to Metal StiffenerME – Ceramic Chip Capacitor

ME – Ball Grid Array

Critical delaminations (red and yellow areas) are revealed The red feature near the center is

from a void in the die attach

ME – Thermo Electric Cooler

The bright white features within the dark rectangles indicate voids at the direct bond copper (DBC) to ceramic substrate interface, which can block heat transfer

This inspection revealed delaminations and voids (bright white areas) within the active area

The red areas within the image indicate voids and delaminations between the die and substrate

There are two basic concerns about stack die, delamination and cracked die. This 3D reconstruction reveals delamination between die

The bright white areas indicate voids in the attachment material used between the PCB and stiffener

Applications

The integrity of these MEMS cavity seals (gray boxes) is compromised - too thin of a seal width for some devices or nonexistent, incomplete perimeter seal, for others

MEMS – Bonded Wafer

The regularly spaced red features are intentional air cavities that contain the actual MEMS devices. The remaining red areas are defects

White areas indicate voids and delaminations detected between the wafers

ME – Flip Chip

The bright white areas observed in this flip chip image are voids in the underfill, which can lead to electrical failure

ME – Power Module

The red areas are voids and delaminations between the die and heat sink

Hidden defects within an electronic package can often lead to catastrophic failure of the device.

Internal defects such as delaminations, cracks and voids within ceramic chip capacitors can lead to product failure.

Flip chip devices are routinely inspected for underfill, bump and silicon quality.

This three-dimensional image also includes a cross-sectional view through the center of this BGA. Depth information is gained from these views.

The ability to actively transfer heat makes thermo electric coolers (TECs) useful devices in a variety of applications.

Evaluating the bond quality in wafer pairs can uncover delaminated and voided regions that can lead to yield loss.

To ensure that MEMS operate properly the integrity of the cavity seal is vital. Any breach of the hermetic cavity is a reliability issue.

For some high reliability PCB applications stiffeners and heat sinks are added. The bond quality between the PCB and stiffener is critical to its reliability.

This image is from a BGA package containing a two-die stack.

The ability to transfer heat from the die to the heat sink will often characterize how long a power device will function.

Similar to power modules and devices, individual power die must have adequate bonding to allow proper heat transfer and performance.

Delaminations and voids can compromise the hermeticity of these devices.




Materials – Metal Foam to Metal (Bond Quality)

Foil SealIGBTs

Materials – FRP Composites (Impact Damage)

Materials – Cylindrical / Multi-Axis

Materials – Ceramic Ball Bearing (Near Surface Cracks) / Multi-Axis

Solar – Thin Film

A missing interconnect can be seen in the center of the grid, along with delaminations in the lower left

Three of the nine power die within this IGBT module show delaminated corners (white areas)

The bright white areas along the outer perimeter show several leak paths across the width of the seal

Improper bonding between layers within this SSL LED wafer is indicated by the yellow/red areas

Materials – FRP Composite Integrity

The bright white areas indicate voids and cracks - stress points that can lead to mechanical failure, as happened here

The variation in the bond quality between these 20 die and the substrate indicates poor production process control, leading to premature failure of the SSL LED module

Materials – Ceramic Composites

Unlike the C-SAM® image of the ceramic disc on the front cover, this image indicates a near surface crack (black and gray shadows)

The petal shaped feature outlines the extent of the internal impact damage and the red indicates delamination between layers at this depth within the polymer/glass laminate

The white regions within the intended solder bonds (black/gray) indicate delaminations and voids between the outer and inner tubes

The analysis of the metal foam to metal sheet interface indicates a bond area of 39%, which matches the expected foam density

The black “smile” shaped feature indicates the location of a crack near the surface of this ceramic ball bearing

Solar – Concentrator

The red areas indicate gaps in the cell-to-solder interface, which could cause loss of efficiency or failure of the structure

SSL LED – Wafers SSL LED – Chip Bond

Applications

The thin film cell structure is a multi-layered composite, where each layer must be interconnected and uniformly deposited and bonded.

The key reliability issue is the proper transfer of the excess solar thermal energy, requiring a consistent bond between the solar cell and the heat sink.

High-brightness, SSL LEDs require proper heat transfer from the LED chip to achieve optimum performance and to prevent premature failure.

The quality of the bond between layers of an SSL LED wafer will determine the yield of that wafer and the number of useable die from it.

IGBTs, like other power devices, require adequate bonding between layers with the proper thickness tolerance for good heat transfer and reliable performance.

In medical devices and pharmaceutical packaging, a seal is often used to keep the device or cavity contents sterile and contaminant-free.

The mechanical strength of a composite can affect its performance.

Ceramic and powdered metal parts can be inspected for internal and near surface defects that may cause premature failure.

Metallic composite structures, such as metal foam/metal sheet, require adequate bonding between layers to ensure the integrity and strength of the structure.

Cylindrical parts can be inspected by incrementally rotating the sample, collecting x-axis and degree of rotation data, like removing the label from a can.

Evaluation is not limited to flat surfaces. With the proper fixturing and data collection, spherical and curved surfaces can be imaged for near surface and internal defects.

Unlike other materials, polymer composites can look perfectly good on the outside with hidden impact damage internally.




SonoLab offers standard and custom programs to fit specific requirements, including:

• Component qualification to industry standards

• Materials characterization and evaluation

• High-capacity screening and lot reclamation

• Failure analysis and constructional analysis

• Inspection and audit services

• Custom training

ACCREDITEDCERT # 3558

SonoLab®, a division of Nordson SONOSCAN®, is the world’s largest inspection service specializing in Acoustic Microscopy (AM) imaging. Staffed by dedicated applications engineers, SonoLab provides more experience in AM applications than any other resource.

An ISO/IEC 17025 Accredited Testing Lab

Leading companies worldwide achieve the highest quality by trusting their parts to the professionals who invented C-SAM® technology. Working exclusively with Nordson systems and technologies, SonoLab’s industry leading engineers use patented features such as Virtual Rescanning Mode™ (VRM)—an application that allows you to rescan your component even after it’s been destroyed—to provide customers with the most effective AM analysis and training services available.

SonoLab personnel provide contract customers with detailed illustrated reports, plus verbal consultation regarding a component’s internal features, failure mechanism or accept/reject criteria. This expertise is available to customers for assistance with compatibility and screening projects and as an independent third-party resource.

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Local Presence and ServicesExperience the confidence that comes from having the resources of the world’s Acoustic Microscope leader at your service.

Specifications subject to change without prior notice.Copyright © Nordson SONOSCAN® 2019. Other products and company names mentioned are trademarks or trade names of their respective companies.

Nordson SONOSCAN products are patent protected and covered by the patents listed at https://sonoscan.com/why-sonoscan/patent-list

BR-SONOS-0119-V1

www.nordsonsonoscan.com

Nordson SONOSCAN®, Corporate Headquarters 2149 E. Pratt Blvd., Elk Grove Village, IL 60007

Phone: +1 847 437 6400Fax: +1 847 437 1550

[email protected]

Equipment Sales and Service SonoLab®

Americas

Elk Grove Village (HQ) +1 847 437 6400

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Silicon Valley +1 847 437 6400

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Southwest+1 480 342 9400

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China+ 86 139 1600 1947

[email protected]+86 21 3866 9152 Ext 881

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EMEA+44 1296 317800

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Japan+81 3 3599 5920

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Korea+82 31 736 8321

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South East Asia+63 917 866 4930

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Taiwan+886 2 2902 1860

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• Reliable instruments for production and laboratory

• Technical consultation and training

• World-leading lab services

• Quality transducers and components

• After-market parts and repairs

• Local service and support

Sonoscan Brochure v4c.indd 20 11/01/2019 20:15

Documents

Leaders and Innovators in C-SAM® Solutions · 2019-12-06 · Our advanced C-SAM technology is the most relied upon worldwide for inspecting and finding defects in a wide range of