Lead-free/RoHS Roadmap Lee Laboratories & Electrofont

Lead-free/RoHS Roadmap

Lee Laboratories & Electrofont

Lee Laboratories Pte. Ltd.

Our Company shall adopt an efficient, far-sighted and thorough (EFT)Environmental Policy through six (LEELAB) key areas:

• Legislation and other requirements must be met在法律条规与其他条件下符合要求

• Encourage the use of more environmental-friendly materials, equipment and technology

鼓励使用对环境更友好的材料，设备和技术• Ensure that activities does not create any nuisance to

our neighbours确保操作状态不会给邻里造成任何不满

• Lessen the quantity of pollutants discharged减少污染排释量

• Awareness must be promoted among employees, suppliers, customers and the general public

促进员工，供应商，顾客和众对此项环保条例的悟解• Best practices are key ingredients to enhance our

company’s environmental image最佳的实践是提高公司的环境形象的关键

Our Company shall adopt an efficient, far-sighted and thorough (EFT)Environmental Policy through six (LEELAB) key areas:

• Legislation and other requirements must be met在法律条规与其他条件下符合要求

• Encourage the use of more environmental-friendly materials, equipment and technology

鼓励使用对环境更友好的材料，设备和技术• Ensure that activities does not create any nuisance to

our neighbours确保操作状态不会给邻里造成任何不满

• Lessen the quantity of pollutants discharged减少污染排释量

• Awareness must be promoted among employees, suppliers, customers and the general public

促进员工，供应商，顾客和众对此项环保条例的悟解• Best practices are key ingredients to enhance our

company’s environmental image最佳的实践是提高公司的环境形象的关键



New environmentally friendly materials will be introduced to meet customer requirements and demands of the European Union Directive (2002/95/EC) on the Restriction of the Use of Hazardous Substances (RoHS)


Managing DirectorLee Choo

Managing DirectorLee Choo

Wern Pin/NicholasWern Pin/Nicholas

SALESSALES

LEE LABLEE LAB

Yang ZhengYang Zheng

Design & Development


CrystalCrystal

QA & ProductQA & Product

Factory ManagerJason Foo

Factory ManagerJason Foo

Sook FungSook Fung

PurchasingPurchasing

ElectrofontElectrofont

IreneIrene

Sample Build Co-ordinatorSample Build Co-ordinator

Kwang Yiang – SMTBernie – COB

Eddie - FA

Kwang Yiang – SMTBernie – COB

Eddie - FA

ProductionProduction

Yang ZhengYang Zheng




Time Perioda) April 2004 to May 2004

b) May 2004 onwards

Action- Start ROHS plan discussion- Decides on which project involves(Eg. 817, 994, 998, 999, etc)-Vendor benchmarking for solder paste/solder wire/flux-Vendor benchmarking for facilities(Eg. Lead-free soldering iron-Discussion of materials used and facilities(Eg. AVL components and SMT machine

- Discussion and preparation of ROHS Project documents(Eg. Bill of materials, Process Spec., QA insp. Spec., Design Testing Spec., etc)- ROHS Compliance Components Request

ROHS Project Time Schedule


Cont. May 2004 onwards

- Samples request for lead-free solder paste/solder wire/flux-Compliation of components ROHS declaration/Temp. profile/Test Report/Material Safety Data Sheet(MSDS)- Compliation of lead-free solder paste/solder wire documents(Eg. Reliability test report/Temp. profile)-Reliability test on ROHS compliance samples(E.g 994, 998, 817, etc)


Sample Builda) Jan 2005

b) Jan 2005 - Feb 2005

c) April 2005

Mass Production• July 2005 • Aug 2005

- A-994-03 & A-994-04 using MultiCORE lead-free solder past paste

- A-998-03,A-999-03 & A-1000-03 using ASAHI lead-free solder paste

- MG 817 AU-LA-01 using ASAHI lead-free solder paste

-A-994-04 ROHS Compliance PCBA shipment-MG 817AU-LA-01 ROHS Compliance modules shipment

Sample Build Evaluation For Optrex Europe


a) Jun 2005

b) Jun 2005

c) Nov 2005 - Dec 2005

• MG 1089FU-SEW-01 using MULTI-CORE lead-free solder paste

• A-997-04 using ASAHI lead-free solder paste

• Plan for sample build for MG 973 FU-SLY-7

Sample Build Evaluation For Leica


April 2005 to Nov 2005 • Manual soldering using SENJU lead-free solder wire for project 1019, 1020, 1022, 1025, 1069, 1071, 1072, 1073, 1074, 1075, 1076, 1077, 1078, 1080, 1081, 1082, 1084 & 1085

Sample Build Evaluation For Optrex Japan


Nov 2005 - Dec 2005 -> Plan for sample build for:• MG 978 (Sumitomo)• MG 938 (Applera Holdings)• MG 830 (Eltech)

Sample Build Planning For Other Customers(Sumitomo, Applera Holdings, Eltech)


6.0 Solder Paste Vendor

6.1 Process Spec. Requirement

Asahi Solder Paste

Multicore Solder Paste

Qualitek Solder Paste

Pre-heat 100-150 Deg.C 130-165 Deg.C 100-140 Deg.C Time 50-80 secs 60-120 secs 60-90 secs

Soaking 150-207 Deg.C 165-217 Deg.C 140-170 Deg.C Time 30-80 secs 15-30 secs 60-90 secs

Reflow 207 Deg.C 217 Deg.C 217 Deg.C Time 30-60 secs 30-45 secs 60-90 secs

Peak Temp

Min:220 Max:235 Min:230 Max:250 Min:235 Max:249


7.0 SMT Process Guidelines

7.1 Paste Storage

Storage temp. : 5 to 10 deg. C.

7.2 Production Working Environment

Temp. : 20 to 25 deg. C. Humidity : Less than 60% RH

7.3 Paste Preparation

Thawing time : 4 to 8 hrs. Stirring Time : 60sec approx.

7.4 Paste Printing Stencil Thickness : 6 mils (0.15mm) preferred for fine pitch IC Printing Speed : 20 to 150mm / sec Squeegee Pressure : TBD.

7.5 Paste Printing Guidelines

Condition Preferred Acceptable Reject Remarks Paste alignment to pad 100% <25% out >25% out Smeared paste 0% 0% any smeared Insufficient paste 0% 75% coverage < 75% coverage No paste Any Solder paste height 6 mils > 4.5 mils < 4.5 mils Not done at

the moment.

7.6 Paste Printing Visual Inspection

Pls. refer to Judgment Criteria QA-JC-SMT-01.


8.0 SMT Component Mounting

Condition Preferred Acceptable Reject Remarks Parts loading onto Feeder

Refer to SMT product loading list

Parts mounting onto PCB

Refer to BOM / SMT product loading list

Parts mounting onto pad

100% <25% out >25% out

Paste slumping > 0.3mm min 0.3 mm

< 0.3 mm Distance between two nearest paste.


9.0 Reflow Process Reflow oven temperature & conveyor speed setting will be determined

after profiling and will vary from product to product depending on the size

of the boards and complexity of the component mount upon it.

9.1 Reflow Profile

Condition Setting Ramp Up Rate 1 - 3 C/sec Pre Heat 120 - 165 C (50-100 secs) Soak Time TBD Dwell Time (time above melting pt) 30 -90 secs Peak Temp 230 -250 C Cooling Rate 2 - 4C/sec

Lee Laboratories Pte. Ltd.9.2 Post Reflow Guidelines

Condition Preferred Acceptable Reject Remarks Solder short NA NA Any Insufficient solder 0% < 25% > 25% Dry solder NA - Any

Solder balls NA < = 0.13mm ; max.5/600mm2

> 0.13mm ; > 5/600mm2

All solder balls are entrapped or encapsulated with no clean flux residue.

No wetting NA Any Dull solder NA Any Reflow profile

not optimize. Solder crack NA Any Component crack NA Any Component not

suitable for high temp.

Wrong/missing component

NA Any

Wrong orientation/polarity

NA Any

Alignment out 0% < 25% out > 25% out PCB warpage NA Any PCB delamination NA Any

9.3 Post Reflow Visual Inspection

Pls. refer to Judgment Criteria QA-JC-LFS-01.


10.0 Manual Soldering Visual Inspection Pls. refer to Judgment Criteria QA-JC-LFS-01.

11.0 Lead Free Label Indication To differentiate for Lead free modules / PCB Assembly, we will indicate in our

date code label “YYWWxxx_LF” which means YY – Year, WW – Workweek,

xxx – Operator code, LF – Lead free.

At Outer Carton, under remark column “ROHS Compliance” will be indicated for

at least 1st 3 shipments.


Business /Customer Order

Business /Customer Order SalesSales Lee Laboratories / Electrofont

Internal ReviewLee Laboratories / Electrofont

Internal Review

AdminSupportAdmin

Support

ProcessOrder

ProcessOrder

DeliveryDelivery

CustomerCustomer

ProductDesign

ProductDesign

EngineeringSupport

EngineeringSupport

ManufacturingManufacturing

MaterialControl

MaterialControl

Production& MaterialPlanning

Production& MaterialPlanning

RequireDesign?

RequireManufacturing?

Lee Laboratories Electrofont

Yes

No

Yes

No

ProcessDevelopProcessDevelop

RFQ

SourcingSourcing

Customer Requirement

Documents

Lead-free/RoHS Roadmap Lee Laboratories & Electrofont