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Lead - Free , Lead - Free , UnfortunateUnfortunate Reality Reality Lead - Free , Lead - Free , UnfortunateUnfortunate Reality Reality
Presented by
Lawrence Weber
Senior Electronics EngineerTobyhanna Army Depot
…Facing Its Challenges
ISO 9001:2000/14001:2004 FacilityShingo Award Winner
Presentation ContentPresentation ContentPresentation ContentPresentation Content
✔ Part 1 - The Challenge✔ Part 2. - Great Expectations ✔ Part 3. - Brave New World
ISO 9001:2000/14001:2004 FacilityShingo Award Winner
Part 1 - The Challenge Part 1 - The Challenge Part 1 - The Challenge Part 1 - The Challenge
✔ Clear and Present Danger✔ Avionics Study ✔ Problems✔ Lead-Free Depot View
ISO 9001:2000/14001:2004 FacilityShingo Award Winner
1a. Clear and Present Danger 1a. Clear and Present Danger 1a. Clear and Present Danger 1a. Clear and Present Danger
✔ World market swings manufacturers toward:● ROHs (Restriction on Hazardous Substances)● Lead-Free coated products compliancy
✔ Electronic Short-Term Reliability consumer market swamps High Reliability Military market
✔ ROHs- imposed standards shift industry quickly to change part coating, solder alloy and board design practices
✔ Lead acid Batteries -88% of problem – exempt✔ Alloy changes to Part/Board go unopposed as substitutions
occur✔ Coating and soldering formulations remain nonstandard✔ Catastrophic failures dropping satellites identified✔ Reliability issues emerge as causes
ISO 9001:2000/14001:2004 FacilityShingo Award Winner
1b. Avionics Study - Hits Home 1b. Avionics Study - Hits Home 1b. Avionics Study - Hits Home 1b. Avionics Study - Hits Home
✔ CO. SOLDER/OPERATION● 5% of (42) have/will convert from lead by 2008● 50% of (42) solder choice unsettled
✔ CO. OEM SOURCES● Part Source - Asian only 30% are 100% Tin-Lead US only 10% are 100% Tin-Lead● Part Purchase - (2) 95-100% lead free by 2008 (40) 20- 50% lead free by ___
✔ SOURCE OVERALL PROD (NA, EUR,ASIA)● Part finishes 87% NOT Tin-Lead (est.) ● PWB finishes 88% NOT Tin-Lead (est.)● ORDERS (drawn from above sources):
– Military/ High Rel orders are only 1.1%– Other 98.9%
✔ PART ID● ID with part #s , markings, symbols or vendor certificates
✔ PWB ASSEMBLY● 40% Separate Lines● 30% Combine Lines● 30% Not Sure
Mfg / Delivery Changes Expected( JCAA Study* Surveyed 42 companies delivering High Rel and Consumer parts )
* Final Report
ISO 9001:2000/14001:2004 FacilityShingo Award Winner
1c. The Problems1c. The Problems1c. The Problems1c. The Problems
✔ Soldering● New processes & equipment● 35 C increase in processing
temp● Thermal stress of PCB & parts
✔ Conductive crystalline structure✔ Few microns to over 5mm length
Tin Whiskers
Select Picture above to Start Video
✔ Solder Joint Reliability● Less robust in severe
environments● Incompatibility between alloys● Cannot mix tin-lead and lead-free
solder
✔ Tin Plague● Metal disintegrates into
powder● Low temperature
phenomenon (<13C)
ISO 9001:2000/14001:2004 FacilityShingo Award Winner
1d. Pure Tin Failures1d. Pure Tin Failures1d. Pure Tin Failures1d. Pure Tin Failures
✔ 6 Satellites✔ 5 Navy Missiles
1985-1992✔ F-15 Radar✔ Patriot Missile✔ Heart Pacemakers✔ Communications
Equipment✔ Data Processing
Equipment✔ Power Switching
Equipment
ISO 9001:2000/14001:2004 FacilityShingo Award Winner
1e. LEAD-FREE DEPOT VIEW 1e. LEAD-FREE DEPOT VIEW as s as seen by theeen by the … …
1e. LEAD-FREE DEPOT VIEW 1e. LEAD-FREE DEPOT VIEW as s as seen by theeen by the … …
R - eliability Hi-Rel vs Short-Term-Rel E - xemption Limited, with Review
A - ccountability Unprepared Supply L - ogistics Impacts source/support
I - nspections Assurance required
S - ituations Life Cycle challenge
T - esting Incomplete
ISO 9001:2000/14001:2004 FacilityShingo Award Winner
Part 2. - BRAVE NEW WORLD Part 2. - BRAVE NEW WORLD with Great Expectations with Great Expectations
Part 2. - BRAVE NEW WORLD Part 2. - BRAVE NEW WORLD with Great Expectations with Great Expectations
✔ Lead-Free-Included Repair Plan✔ Quality Spot-Check✔ Source Chain Management✔ Repair / Operational Cost Avoidance
ISO 9001:2000/14001:2004 FacilityShingo Award Winner
2a. Lead-Free Included Repair Plan 2a. Lead-Free Included Repair Plan 2a. Lead-Free Included Repair Plan 2a. Lead-Free Included Repair Plan
Focused Lead-Free Awareness and Quality Spot Checks
✔ Training on LF/NLF✔ XRF Screen for Lead Parts ✔ Screen for ROHs labels ✔ Surface Test for lead ✔ Repair/Replace LF,NLF✔ Verify Repair✔ Final Test
Focused Lead-Free Scrutiny
Targeted ✔ Inspection
Points ✔ Monitor ✔ Repair
ISO 9001:2000/14001:2004 FacilityShingo Award Winner
2b. 2b. Source Chain Management Source Chain Management for Hi-Rel Electronic Parts for Hi-Rel Electronic Parts2b. 2b. Source Chain Management Source Chain Management for Hi-Rel Electronic Parts for Hi-Rel Electronic Parts
…. some unexpected part source.
This board’s repair parts may come from… WHY CERTIFY?
- ITS NOT ROCKET SCIENCE ! - Given: 1) Trusted sources 99% reliable to avoid LF 2) Other sources only 90% reliable to avoid LF 3) 1000 orders placed for High Rel Leaded Part
METHOD A. Using only Trusted source we get: 990 - As required 10 - ( could have LF)
METHOD B. Using Trusted 90% and Other 10% we get 891- As required from Trusted 9 - ( could have LF) from Trusted 90 - As required from Other 10 - ( could have LF) from Other
Total 981 as required 19 - ( could have LF )
RESULT>> We have nearly DOUBLED chances of getting LF by using a slightly less reliable source for only 10% of the orders .
WHAT TO DO
Impose tight rein on High Rel Electronic part source suppliers. Certify! RESULTS Traceable Certification Chain. assures High Reliability parts are “as expected”, particularly during the change-over to Lead-Free (LF). BOGUS parts discouraged from entering the supply chain
ISO 9001:2000/14001:2004 FacilityShingo Award Winner
2c. Repair/Operational 2c. Repair/Operational Cost AvoidanceCost Avoidance
2c. Repair/Operational 2c. Repair/Operational Cost AvoidanceCost Avoidance
Avoids field and long term failures as well as cost of added testing, and multiple faults isolation.
✔ Locates unexpected mixed -metallurgy
( Lead-free w/ Leaded)
✔ Separates Lead and Lead- Free circuit boards repairs
✔ Tracks Lead-Free repairs
ISO 9001:2000/14001:2004 FacilityShingo Award Winner
Part 3 - The Brave New World Part 3 - The Brave New World Part 3 - The Brave New World Part 3 - The Brave New World
✔ Adapted/New Technology✔ Observations✔ Recommendations✔ Opportunity✔ GOAL
ISO 9001:2000/14001:2004 FacilityShingo Award Winner
3a. 3a. Adapted / New TechnologyAdapted / New Technology3a. 3a. Adapted / New TechnologyAdapted / New Technology
✔ Advanced XRF (X-RAY Fluorescence Detector)
● Hand held ● Scanning and spectrum
recognition● Tuned to likely damaging
alloy mix● Detects low percentage
Bismuth alloys
✔ Advanced LEAD SWAB ● Ignores “trace” amounts
of metals● Self Contained Chemical
test● Long term stability of
indicator● Safe/ Odorless● Reduced costs – for
expected high volume ● Reduced cost
✔ Lead Substitute Tin-Alloy Material
● Alloyable with Tin● Lead-like Behavior● Metal-Like Outer Electron
Shell● Elementally a Non- Metal
✔ Repair Marker for Lead-free ● Detectable Dye● Field -Scannable● Stable Long term● Conformal Coating-
Compatible✔ High Rel Part./Board
Certification ● Physical Mark or Stamp● Standardized DOD wide● Difficult to counterfeit● Close held/registered use
✔ Tin Whisker Removal System ● Breaks off /Collects
whiskers● Applied to any circuit-board● ESD safe● Minimize Vibration ● >95% confidence level
✔ Auto Re-dip Process* ● Lead Solder Re-dip of Tin
Coatings● Robotic handling of various
part types● ESD safe
✔ Adv XRF SCANNER✔ Adv LEAD SWAB✔ LEAD SUBSTITUTE✔ REPAIR MARKER✔ HIGH-REL PART/BD
CTFY✔ TIN WHISKER
REMOVAL✔ AUTO RE-DIP
PROCESS
WANTED for LEAD-FREE!WANTED for LEAD-FREE!
*Ref - Final Report on the Transformational
Manufacturing Technology Initiative (TMTI)
ManTech Research Project S1057:
Tin Whisker Mitigation
The Use of Robotic Solder Dipping to Replace
Electronic Part Surfaces Finishes of Pure Tin
with a Tin-Lead Finish
ISO 9001:2000/14001:2004 FacilityShingo Award Winner
3b. Observations3b. Observations3b. Observations3b. Observations
Q. What about short term commercial usage reliability? A. So far High Tin content alloys appear effective but only observed in short-term commercial applications. Q. What about long term usage for military high reliability? A. It is an expected problem. Metal crystal growth promotes a SHORT-CIRCUIT because, features are decreasing in size Longer time to grow across shorter
gaps leads to stress- induced crystal growth. With extended use and, it also causes an OPEN CIRCUIT repair with mixed Alloys leads to brittle fracture planes.
Unfortunately, growth may go on unobserved for years; Tin Whisker damage can occur anywhere in the production, test,
shipment or field use of equipment.
Q. Can we guarantee no whiskers will occur with any High Tin content alloy? A. No. No Tenable scheme exists to guarantee that a whisker cannot form
… but now, as of JULY 1, 2006, changes to remove Lead from finishes and solder are demanded for world sales!
Non-leaded solder or coatings allows Lead-Free parts to find their way into High Reliability applications.
There WILL BE an increased likelihood of SHORTS and OPENS in High Rel parts over long terms!
50+ years of Tin/Lead solder50+ years of Tin/Lead solder methods methods have been have been successful, …successful, …
ISO 9001:2000/14001:2004 FacilityShingo Award Winner
Recommendation - Recommendation - Depot IPTDepot IPTRecommendation - Recommendation - Depot IPTDepot IPT
✔ TECHNOLOGY SUPPORT● Advanced Lead
Swab● Advanced XRF● Lead Substitute● Repair Marker● High-Rel Certif.
Mark● Auto Re-Dip
✔ LOGISTICS OVERHAUL● Improve DOD
Source● Track Supply
chain● Report
Discrepancies● Track Failures● Qualify
Sources● Certify
Sources
✔ LEAD FREE INCLUSION● Expect Lead-
Free● Repair
Differently● Avoid Mixing
Lead-Free Process Integration Support Team
OBJECTIVES
ISO 9001:2000/14001:2004 FacilityShingo Award Winner
OpportunityOpportunityOpportunityOpportunity
Tobyhanna Army Depot has currently identified accelerating opportunity costs to control the inclusion of Lead Free and mitigate damages of approximately:
$ X.XX Million /yr
ISO 9001:2000/14001:2004 FacilityShingo Award Winner
Lead-Free supplier process conversion rate since 2006 is projected to be 5% by 2008
SustainmentSustainmentSustainmentSustainment
Current Trends …Lead free ghosts… “They’re here..”
NEWS FLASH --- MAY 2007 -- Intel Corporation today announced that its future processors are going 100 percent lead-free.
while functioning within a Lead-Free Reality.. Is the GOAL.
The Present Value opportunity cost to remove lead-free intrusion will likely double by 2010 - Proactive approach is paramount.