Lead Free SMD Film Capacitors - Munich 15/11/2006 1 Lead Free SMD Film Capacitors November 2006 Francesco Bergamaschi - Product Manager [email protected]

Lead Free SMD Film Capacitors - Munich 15/11/2006

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Lead Free SMD Film Capacitors

November 2006

Francesco Bergamaschi - Product Manager

[email protected]


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Outline

- Lead Free status: reflow process main trends

and Arcotronics choice

- Arcotronics Lead Free SMD series overview

- Lead Free processes / Hybrid processes


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Lead Free status Reflow process main trends

- Reflow alloy : Sn – Cu (0.7%) – Ag (1.5% – 3.5%)

- Tmax during reflow = 245 – 260 °C

- Hybrid processes: soldering with Lead Rich solder alloy and Lead Free components is widespread in this transition period towards a totally Lead Free process.


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• Arcotronics has developed a complete range of Lead Free SMD Film capacitors, not only general purpose but also specific capacitors.

• This was possible thanks to the availability of different dielectrics.

Lead Free statusArcotronics choice


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• Arcotronics choice was to develop SMD Lead Free Film Capacitors in PEN (LDE series) and PPS (LDB series).

• These plastic dielectrics have the best features to design components able to withstand the Lead Free reflow soldering temperatures (melting point).



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SMD Lead Free series manifacturing process was designed to have components not only able to withstand the high reflow process temperatures but also to have good solderability performances:

• New thermal treatment

• Terminations milling



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Nickel barrier and pure tin (100%) on end terminations



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Arcotronics Lead Free SMD series

LDE series – PEN dielectric

- Available sizes: 12.06 to 60.54

- Capacitance values: 1000 pF to 4.7 µF

- Rated voltage: 50 Vdc to 1000 Vdc (new series)


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LDE series – new 1000 Vdc series

- Available sizes: 22.20 to 60.54


- 250 VAC withstanding

- ITU K20 & K21 compliant


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LDB series – PPS dielectric

- Available sizes: 12.06, 12.10 and 18.12


- Rated voltage: 16 and 50 Vdc

- 2% tolerance available


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Soldering recommendations

-Max. time over 217°C = 150 sec

-Max. temperature ramp rate = 3 °C / sec (heating)

6 °C / sec (cooling)

-Tmax on the component body = in line with JEDEC 020C July ‘04

with some limitations

-Max. time between Tmax

and Tmax – 5 °C = 40 sec (Tmax up to 250 °C)

10 sec (Tmax > 250 °C)



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Lead Free processes / Hybrid processes

Lead Rich reflow process was well standardized

Lead Free reflow process is definitely not standardized

The Lead Free components have to meet in the best possible way all the different process characteristics


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In the Lead Free reflow process, the following designs are not standardized:

• landing areas materials• reflow alloy• reflow profiles• PCB material



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The choice of a pure tin deposition was made by Arcotronics as it was found to be the best compromise between all these different processes.

Furthermore, the Lead Free reflow is still not so widespread. Hybrid process are implemented most of the times.



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Not all active neither passive components are ready for the Lead Free process (mainly because of the higher Tmax with respect to the Lead Rich process).

The choice of a pure Sn deposition has shown to be compatible with the Hybrid processes that are running (Lead Rich solder alloy with Lead Free and Lead Rich components).


Documents

Lead Free SMD Film Capacitors - Munich 15/11/2006 1 Lead Free SMD Film Capacitors November 2006 Francesco Bergamaschi - Product Manager [email protected]