Upload
others
View
1
Download
0
Embed Size (px)
Citation preview
La5Ca9Cu24O41 Layers as 1D Heat Spreaders for
Thermal Management Solutions
Charis Orfanidou
Overview
2
• Thermal Management Problem
& Solution – The Idea
• The La5Ca9Cu24O41 material
• Equations
• Set up problem, Mesh & Results
• Conclusions
R. Viswanath et al., Intel Technology Journal, Q3, 2000
Hot Spot
• Operating System Flux
Spots, Hot Spots
• Operating at high T more possibilities to
failure
Thermal Management Problem
3
Charis Orfanidou 4
Thermal Management Solution – The Idea
The La5Ca9Cu24O41 material
c
b
a
Thermal Conductivity
5
at Room Temperature:
κa = κb ≈ 1 W/m·K
&
κc ≈ 100 W/m·K
La5Ca9Cu24O41 layer c-axis oriented :
Thermally Conducting but electrically insulating
C. Hess et al., Physical Review B, vol.64, 2001
Equations
6
The heat conduction was modeled by solving the steady state, two-dimensional heat conduction equation:
A normal heat flux is applied at the top of the silicon operating elements using Fourier’s law:
Qy = heat flux T = absolute temperature
κx, κy = local values of thermal conductivity
Charis Orfanidou 7
Set up problem
x
y
8
Mesh
• Free Triangular
• 3074 elements
Set up problem
9 Charis Orfanidou
300 K
Silicon (3,4μm)
Operating elements (50nm x 50nm) Si
Heat Flux: 108 W/m2
Silicon Sub (500μm)
1μm
Set up problem
10 Charis Orfanidou
Silicon
Silicon
Silicon
La5Ca9Cu24O41
Set up problem
11 Charis Orfanidou
La5Ca9Cu24O41 (3,4μm)
Silicon Substrate (500μm)
300 K
Hot Spot: 1010 W/m2 heat flux, adjacent operating elements: 108 W/m2
1μm
12 Charis Orfanidou
Silicon
Silicon
Silicon
La5Ca9Cu24O41
Set up problem
Isotherms
13
Silicon La5Ca9Cu24O41
Temperature Profiles
14 Charis Orfanidou
1K
0.5K
Conclusions
• Introducing La5Ca9Cu24O41 layers → “protecting” the adjacent operating elements due to the 1D heat conduction
• Although we are introducing thermal resistance in the device we reduce the T of the adjacent operating elements by almost 1 degree
• Each degree reduction of temperature in the electronic devices can increase their lifetime!
• Simulate layers of the order of nanometers • How much we can approach reality by using
COMSOL Multiphysics
Acknowledgements
16
Prof. Ioannis Giapintzakis Materials Science Group, Mechanical and Manufacturing Engineering Department, UCY
This work was supported by the European Commission through the ITN Marie Curie LOTHERM
Charis Orfanidou
THANK YOU FOR YOUR ATTENTION !!
Charis Orfanidou
Charis Orfanidou 18
Operating Temperature, κLCCO = {1, 100, 1} W/m*K
ΔT = 0.35 K
Charis Orfanidou 19
Operating Temperature, κLCCO = {1, 550, 1} W/m*K
ΔT = 0 K
445
455
465
475
485
495 1
14
9
11
61
11
95
12
99
17
42
18
00
20
16
20
99
24
11
25
23
28
49
30
74
32
20
37
59
39
01
44
91
46
82
53
62
56
13
63
23
65
94
72
50
Tem
pe
ratu
re (
K)
N cells
HS Temp (Si)
HS Temp (LCCO)
1st adjacent (3rd element) Temp (Si)
1st adjacent (3rd element) Temp (LCCO)