KYUNG LIM RESOURCES SEMICONDUCTOR CATALOGUE...Varian High Current 120-10, 160-10, 120XP, 160XP, E1000/HP, VIIsion 80/200, VIIsta80 Medium Current CF-3000, 350D/DE, 300XP, E220/500

SEMICONDUCTOR

CATALOGUE

52-1, Jalan Musytari An U5/AN,Subang Pelangi, 40150 Shah Alam,Selangor, Malaysia

Tel : +60-82-266 523Fax : +60-82-266 525

www.kylresources.com

KYUNG LIM RESOURCES

1. COMPANY INTRODUCTION PAGE1.1 Company Overview 41.2 Group Structure 61.3 Company History 71.4 Our Services 81.5 Awards & Recognition 9

2. PRODUCT INTRODUCTION2.1 SEMICONDUCTOR

2.1.1 Implanter Service 122.1.2 PVE Endura Support Plan 182.1.3 TEL Parts 232.1.4 DRM Y 203 272.1.5 AIN & Metal Heater 322.1.6 Robot Overhaul Service 422.1.7 Ceramic Parts 482.1.8 Loadlock Conversion 612.1.9 ETO to ENI Generator 652.1.10 Ceramic Bearing 722.1.11 Ceramic Bearing for HP / HP+ Pivot 802.1.12 Auto Mirror System 832.1.13 Heating Pipe 872.1.14 HP+ Robot Upgrade 922.1.15 AIM Convert 952.1.16 Flash Memory Driver 1002.1.17 HDP Upgrade 1032.1.18 Fast Vent Diffusion 1082.1.19 Heater & Bellows 1112.1.20 Ch B Sensor for Endura 117 2.1.21 Susceptor Housing 1212.1.22 Heat Exchanger Manifold 1262.1.23 PIEZOCON Gas Concentration Sensor 1312.1.24 Equipment Refurbishment & Upgrade Services 1452.1.25 Hook-Up Services 1502.1.26 Heat Jacket 1552.1.27 TMAH Chemical Distribution System 1652.1.28 Part Clearing & Coating 171

2.2 OTHERS2.2.1 Rubber Flooring 178

CONTENTS

1. COMPANY INTRODUCTION

4

1-1 Company Overview

KYUNG LIM RESOURCES (SARAWAK) SDN BHD

Company NameKyung Lim Holding Pte LtdKyung Lim Resources (Sarawak) Sdn. Bhd

CEO Jodie Chung

Establishment Year 2012

Nature of BusinessConsulting Services, Semiconductor Services, Chemical & Construction Materials Supply

Office

Headquarters:AT310 & AT410, Level 3 & 4, Tower A2, Block A, Icom Square, Lot 11056, Section 64, KTLD, Jalan Pending, 93450 Kuching, Sarawak, Malaysia.

Singapore Office:32, Ang Mo Kio Industrial Park 2, 06-08 Sing Industrial Complex, Singapore 569510

Contact No. 082-266 523 / 082-266 528

Fax No. 082-266 525 / 082-266 529

YOUR ONE-STOP SOLUTION PROVIDER

5

Company Overview


Kyung Lim Resources (KYL) is the first ever consulting company in Malaysia that integrate the solutions for

both corporate and engineering requirements, unlike no other. Our focus are mostly to facilitate foreign

investors performing manufacturing activities that intended to establish a viable business in Malaysia. Our

task force include preeminent partners and companies in various area of expertise. We utilize these

capabilities to develop a complete and competitive solutions at all stages of client’s investment process.

After a completed engagement, KYL provides ongoing support and follow-up with client and/or potential

investor to ensure that identified milestones and performance targets are met.

+50 EXPERTS

We work with more than 50 experts

from our partners and affiliates, with

unique expertise in corporate,

engineering, industrial and strategic

consulting.

3 COUNTRIES

We are present in Malaysia,

Singapore & South Korea and are

constantly developing.

7 OFFICES

We are operating in 7 offices

and are expending to deliver our

services worldwide.

+17 YEARS

We have been active in the market

for more than 17 years and have

established engagement with a

handful of foreign investors & local

government agencies throughout

the years.

1-1

6

Group Structure


KYUNG LIM HOLDING

KYUNG LIM RESOURCES

ACFM EnC

CONSULTING SERVICE Company Incorporation & Maintenance Account & Financing Development Order Planning & Permit Licensing & Incentives Environmental Permit

SUPPLY & TRADING Manpower Charcoal, Woodchips, Coal, Marble Industrial & Specialty Chemicals Lithium-Ion Battery Materials Electrical Equipment Wire & Cables Lighting & Accessories Welding Consumables Steel Structure Rubber Tiles Telecommunication Products Heating Jackets

SEMICONDUCTOR Equipment Installation & Maintenance Tool Financing Service Cleanroom and Utilities-related Design &

Construction High-Purity Chemical Regeneration System

SUPPLY & TRADING Industrial & Specialty Chemicals Lithium-Ion Battery Materials Cleanroom Facilities

ENGINEERING SERVICES Project Management Design Procurement Construction Commissioning Facility Maintenance

CLEANROOM FACILITY Semiconductor Facility-related Design &

Construction GMP Facility-related Design & Construction Chemical & Gas Supply System Utilities Supply Facility

1-2

7

Company History


ESTABLISHMENT of

ACFM EnC

BRANCH OFFICE

In Munich, Germany

(Semiconductor

Facility)

USD 60 MILLION

of Sales Turnover

ESTABLISHMENT

of Kyung Lim Resources

(Consultation & Supply

Chain Management)

SUPPLY & TRADING

of Construction Materials

ESTABLISHMENT

of Branch Offices in Johor &

Kuala Lumpur and Material

Gallery in Kuching

ESTABLISHMENT

of Kyung Lim Holding Pte

Ltd In Singapore

2002

2008

2009

2012

2015

2018

2019

2020SUPPLY & TRADING

of Specialty Chemicals

CONSULTATION

of Foreign Direct

Investment

1-3

8

Our Services


KYUNG LIM

RESOURCES

CONSULTING

SERVICES

SEMICONDUCTOR

SERVICES

SUPPLY &

TRADING

• Corporate Consulting Services• Industrial Engineering Consulting Services

• Equipment Refurbishment• Fabrication & Hook-up Services• Parts Cleaning & Coating• Other Equipment services

• Industrial & Specialty Chemicals• Construction Materials• Industrial Materials, Equipment & Machinery

VISIONTo be the preferred consulting company providing value added solutions in business establishment, manufacturing, engineering and supply chain management.

MISSIONTo be the leading consulting company which act as a one-stop solution centrein Malaysia, and thereafter in Southeast Asia

1-4

9

Awards & Recognization


Letter of Recommendationfrom OCI Malaysia Sdn. Bhd.

Letter of Recommendation from Huchems Fine Chemical Corp

Letter of Recommendation from SilterraMalaysia Sdn. Bhd.

Letter of Recommendation from SoulbrainE&I Malaysia Sdn. Bhd.

SILTERRA MALAYSIA SDN. BHD. (368948-D) Lot 8, Phase 2, Kulim Hi-Tech Park, 09000 Kulim, Kedah Darul Aman, Malaysia.

Tel : 604-401 5111 Fax : 604-401 5005 Website : www.silterra.com

28 September 2017

To Whom It May Concern,

Reference Letter for ACFM Engineering and Construction Sdn Bhd

We are providing this reference letter in good faith for our business partner, ACFM Engineering and

Construction Sdn Bhd (“ACFM EnC”), as a result of their excellent performance in providing EPC to our

company.

ACFM EnC has been an EPC provider to Silterra and has quickly proved itself as a reliable provider of

professional services related to but not limited to EPC.

Mr Charlie Yoon, the CEO of ACFM EnC, and his employees have successfully delivered a number of

projects and services for our business.

The breadth and depth of their knowledge combined with proven reliability qualifies them to implement

complex projects.

Given our experience from the contractual engagements with ACFM EnC, we are pleased to recommend

them as a supplier of professional services.

Yours sincerely,

SILTERRA MALAYSIA SDN. BHD.

Firdaus Abdullah

CEO

1-5

10

Awards & Recognization

Korea President Award

Round Table Meeting Among Korean Captains of Industry with Former Prime Minister of Malaysia


1-5

2. PRODUCT INTRODUCTION

2.1 SEMICONDUCTOR2.1.1 Implanter Service

Brand : KYL Resources Roles : Product & Service ProviderProducts : Engineering Services, Consultant, Semiconductor, Trading, Chemical

2-1-1 Implanter Service

13KYUNG LIM RESOURCES (SARAWAK) SDN BHD

Performing high quality service of Ion Implanter based on well trained and experienced of system installation, relocation, refurbishment and On-Site Support with trained products knowledge and we provides used tools including spare parts

PAID SERVICE

RELOCATION OVERHAUL SPARE PART

USED TOOLSREFURBISH




STARTUP & PROCESS ACCEPTANCE

SCHEDULE

TOOL STARTUP

OPTIONAL SUPPORT

POST STARTUP WARRANTY

OPTIONAL MAINTENANCE

TECHNICAL SUPPORT

3MTH WARRANTY

Resources and schedule (gantt chart) will be provided to customer.

Tool startup will include starting up machine (tier 1) functional tests to OEM BKMs (tier 2)

Optional support to customer for process qualification will also be provided (tier 3)

Post startup warranty will be provided

Optional PM service & maintenance is also available after warranty

Technical support will also be available from KYL engineering team

3 months warranty provided (labor and spare parts)




SERVICE AVAILABLE TOOL SUMMARY

Tools & Parts

Maker Model

Varian

High Current

120-10, 160-10, 120XP, 160XP, E1000/HP, VIIsion 80/200, VIIsta80

Medium Current

CF-3000, 350D/DE, 300XP, E220/500 Series, VIIsta 810

High Energy

G15XX Series & Kestrel 650/750

Axcelis

Medium Current

NV6200/8200P

High Energy

NV Series, GSD Series

AMAT Quantum Series

WARRANTY SUPPORT

Work on setting up systematic method of temporarily

using customer’s parts stock

KYL will procure part as soon as possible

Provide replacement parts in timely manner back to

customer

Parts in Ex-Stock Parts to Order

Compile a list of high usage parts with customer’s

engineering team

Stock agreed high usage parts at KYL Holding

Parts will be delivered to customer within 8hours from

KYL Holding




VARIAN IMPLANTER PARTS

Tools & Parts

525CCIG TILTER ALIGNMENT ZIG TVL FARADAY ASSY ESC

TILTER ROPLAT TC GAUGE CONTROLLER CARTRIDGE ASSEMBLY

POWER SUPPLY CHILLER WATER PUMP MKS CCIG

PROFILE CUP BEAM REDUCTER MANIPULATOR ASSY MANIPULATOR ASSY

MAGNET INTERLOCK SWITCH RETAINER ASSEMBLY ORIENT ASSY TILTER HEAD ASSY

CHAMBER TOP PLATE ROTARY FEED THRU PROFILER CUP ROPLAT CARTRIDGE




ACELIS IMPLANTER PARTS

Tools & Parts

GSD-HE GSD-160 GSD-200

MANIPULATOR HEAD DISC TEMPERATURE SENSING KIT LIGHT LINK CABLE

WAFER WALKOUT SENSOR AIR PRESSURE SENSOR KIT

2.1 SEMICONDUCTOR2.1.2 PVE Endura Support Plan


2-1-2 PVE Endura Support Plan


Most of engineer have more than 10 years experience of Endura™ systemRefurbished 3 Endura™ systems in Singapore

Vast experience in Technical Support, Chamber addition, Start up service

EXPERIENCED LEVEL• Unsurpassed experienced level on Endura ®• Far Superior Endura® customer field experience than OEM engineers

GUARANTEED SPECIFICATION• Unsurpassed experienced level on Endura ®• Far Superior Endura® customer field experience than OEM engineers

QUALIFICATION SUPPORT COMMITMENT• Technologists will fully support qualification of basic and device qualifications• Service provided without any additional cost to customer

PROVEN ALTERNATIVE to OEM• Capabilities proven at multiple customers worldwide• QT can be an alternative to OEM at SSMC without compromise in quality



STARTUP & PROCESS ACCEPTANCE

SCHEDULE

TOOL STARTUP

OPTIONAL SUPPORT

POST STARTUP WARRANTY

OPTIONAL MAINTENANCE

TECHNICAL SUPPORT

3MTH WARRANTY

Resources and schedule (gantt chart) will be provided to customer.

Tool startup will include starting up machine (tier 1) functional tests to OEM BKMs (tier 2)

Optional support to customer for process qualification will also be provided (tier 3)

Post startup warranty will be provided

Optional PM service & maintenance is also available after warranty

Technical support will also be available from KYL engineering team

3 months warranty provided (labor and spare parts)





Endura Product Snapshot

Wafer Size200 mm SNNF / JMF

150 mm SMF / JMF

Process

Co Std, ALPS Cu SIP, Encore

Ti Std, Coh, IMP, ALPS

TiN Dura, Coh, SIP, Std TxZ, HP+ Txz

TTN Dura, Coh, SIP

Al Std, Hot, ALPS II

Pedestal

Clamped Standard Heater / HTHU

Unclamped101 / A101 / B101 / MCA ESC / MCA+ /

LTESC

LoadlocksNarrow body with Tilt-out

Wide body with SMIF Compatibility

Specialized Service for Endura System

150mm / 200mm Endura™metalization semiconductor equipment Tool Refurbishment

Customized Upgrades - Chamber addition / Chamber Upgrade / Robot Upgrade

Tool Relocation , De-installation

Paid Maintenance Service

System Troubleshooting

Spare parts supply and services

Sub-components overhaul and repair




Refurbishment Timeline

ww-02System Auditww-01 ~ 00

Document Setting System Move In ww01Determine Chamber ConfigurationSend out Parts for CleaningOrder Parts for Chamberww02

Modify Chamber Configurationww03Install Missing Parts on ChamberLeak Check ChamberTest Power Suppliesww04

Install Chambers on MFComplete MF Refurbishment

Retrofit Remaining Parts onto Systemww05Power Up & TestTest InterlocksRobot Calibratioww06

Pump down to Base VacWager Cycling

Power Test

ww07Final TestCertificationSource Inspection

Work on setting up systematic method of temporarily

using customer’s parts stock

KYL will procure part as soon as possible

Provide replacement parts in timely manner back to

customer

Parts in Ex-Stock Parts to Order

Compile a list of high usage parts with customer’s

engineering team

Stock agreed high usage parts at KYL Holding

Parts will be delivered to customer within 8hours from

KYL Holdigs

Warranty Support

2.1 SEMICONDUCTOR2.1.3 TEL Parts


2-1-3 TEL Parts


TEL Part Lists

IFM (Intelligent Flow Meter) DSS(Dispense Sensing System) Tower interface Board LED Light System

DIC (DSS Indicator Controller) HSS (High Speed Shuttle) Optic Fiber FBD (Flow Ball Detector)

HOT PLATE

PCH CHP HHP

LHP PLATE HCL

PUMP ACT Controller


2-1-3


TEL Part Lists

ASML WTS AGV LED (Lot End Detector)

IIB (Intelligent Indicator Bubble System)

ACT-8 Bakes

LHP, HHP,DHP,CHP,PCH,PHP,HPH, ADH

ACT-12 Bakes

LHP, HCH,DHP,HEL,PHP,HPH, ADH

MARK-7,8 Bakes

LHP, DHP, ADH

TEL Parts


2-1-3


TEL Parts Repair Services

NIKON CONTROLLER – Repair & Sales

NAME PHOTO MODEL NAME O/SAPPLICAPABLE

MODEL

VAX STATIONVAX Station 4000

90/96OPEN VMS 5.5OPEN VMS 6.1

4425i, il1, il2, EX12

ALPHA STATIONAlpha Station

255/300OPEN VMS 6.2OPEN VMS 7.1

Il4, EX14

DMCC ETM25-SAOPEN VMS 7.1OPEN VMS 7.2

SF Series, S Series

ALPHA SERVER DS-10OPEN VMS 7.2OPEN VMS 7.3

SF Series, S Series

SYSTEM MODULE REPAIR

Drivers, Boards Process Plate Controllers AC / DC Power Supplies

TEL Parts

2.1 SEMICONDUCTOR2.1.4 DRM Y 203


2-1-4 DRM Y203


Plasma Spray Coating

Coating Material: Alumina (Al2CO3), Yttria (Y2O3), Alumina + Yttria, Aluminium, Titanium

ADHENSION MECHANISM

① Liquid Coating Material in Flight② Impact on Surface③ Transfer of heat to the base material④ Solidification and contraction of the coating material⑤ Mechanical Bonding⑥ Local diffusion or fusion (During heat treatment)

ADVANTAGES APPLICATION

ParticleReduction

LongerLifetime

Thick FilmStructure

VariousSubstrates

Semiconductor Parts

Industrial Equipment Parts

LCD Equipment Parts


2-1-4 DRM Y203


Erosion Properties of Materials

No Material Surface Treatment Method

Erosion Thick

1 Y2O3 (99.9%) Plasma Spray 6.1

2 Y2O3 (99.8%) Plasma Spray 7.2

3 Al2O3 (99.9%) Plasma Spray 8.1

4 B4C Plasma Spray 28.0

5 SiO2 (Quartz) - 39.0

6 Al2O3 (Alumite)

Anodizing 39.5

ONE STOP SOLUTION

Mac

hin

ing

An

od

izin

gP

lasm

a Sp

ray

Co

atin

g

• CNC Machining• Precision Machining

• Sulfuric, Oxalic Acid Method• Post Machining

• Masking & Sanding• Plasma Spray Coating


2-1-4 DRM Y203


Plasma Spray Coating Process

Bead Blasting APS Coating Part Clearing Baking

IncomingInspection

Pre-Treatment

Masking Bead Blasting Masking

FINAL INSPECTION

Baking Part ClearingPost

TreatmentAPS Coating

COATING EFFECT

• Uniformity of coating quality• Improvement adhesion intensity of

coating layer• Improve electrical function• Particle reduction• Protecting coating layer from moisture

• Reduce peeling offside & Arcing issue

• Yield Improvement• Improve capturing contamination• Resolve particle issue• Prolong coating lifetime


2-1-4 DRM Y203


TEL Parts Coating Services

Type Install Base Qualification Coating SpecCurrent Coating

Cycle

Brand New

Korea : H

Singapore : C

2004,

Under Eval

Substrate (Al anodizing)

Coating Material (Y2O3)

Thickness (200 ± 50um)

Roughness (- 4 ± 2um)

6~12months

Re-Coating

Korea : H

Singapore : C

2004,

2006

Upper Electrode Baffle Plate Depo Shield Ring

Bellows Cover Window Depo

2.1 SEMICONDUCTOR2.1.5 AIN & Metal Heater


2-1-5


AIN Heater Brand New

8” AIN HEATER SPECIFICATION

ITEMS SPECIFICATION REMARK

Setting Temp. 550

Temp. Uniformity < 1% @550 @ 5.5Torr Ar

Power 208VAC Max. 20A

Heating Rate < 18/min @ 25 Coolant

Cool Down Rate < 30/min

Electrical Resistivity 2.2 ~ 5 Ω 1 Zone

Leak Rate < 5 X 10-8 mbar l/sec

Leakage Current < 30mA @ 550

RF Element Capacitance 1.5 ± 0.5 nF @ 1kHz

Insulation > 40MΩ @ R.T

STRUCTURE OF HEATER

ITEMS MATERIALS DESCRIPTION

AlN Plate AlN Heating

AlN Shaft AlN Support

Al Mount Aluminum 6061 Assembly

Heating Rod Nickel Power Supply

RF Ground Rod Nickel RF Ground

Heating Element Molybdenum Heater

RF Ground Mesh Molybdenum Ground

AIN & Metal Heater


2-1-5 AIN & Metal Heater


AIN HEATER PROCESS FLOW

TUBE PROCESS TUBE JOINNINGPLATE PROCESS

Raw Powder

Granule Powder

Green Body

1st Sintering

Metal Insert

2nd Sintering

Machining

Plate Joinning

Raw Powder

Batching & Mixing

Spray Dying

CIP & Green Machining

Dewaxing & Sintering

Machining

Machining

Sintering

Nickel Rod Brazing

Brazing


2-1-5


ASSEMBLY OF GIGA-FILL AIN HEATER

AIN & Metal Heater

ConductionConvection

Radiation

Thermo-couple (K Type) : Temperature T2

Thermo-vision System : Temperature : T1

Window

Heating Test by IR Camera

ASSEMBLY OF GIGA-FILL AIN HEATER

T/C Monitoring System

Thermo Vision System

Heating Test System


2-1-5


AIN & Metal Heater

PART No. & INSTALL BASE

Material Size Maker Item P/N ProcessBrand New

Refurbishment

Install Base

Ceramic

200mm AMAT

Producer Heater

0200-355270010-038400040-355270040-363830040-370100040-450080040-473180040-516120040-612690040-704790040-815130040-815140040-86263

HTNTEOSBPSGNIT

SiONACL

O O

Korea: S, H, DUSA: TChina: H, S, GSingapore: C, S, TTaiwan: TJapan: SMalaysia: X

Gigafil Heater(CXZ)

0010-038430040-370100040-61269

BPSGTEOS

O O

300mm AMAT

Producer Heater

0010-116810010-119080040-031830040-040480040-490200040-070310040-070330040-824210041-016520040-539760040-840510040-84251

HTNTEOSBPSGNIT

SiONACL

O O Korea: S, HChina: SSingapore: C, UTaiwan: T

Producer Heater

0040-544490040-88097

HARP X O

Metal 200mm AMAT

DXZ Heater0040-321480040-39240

Ti O O Taiwan: T

WXZ Heater 0040-39180 Ti O O

TXZ Heater 0040-04542 W O O Korea: H


2-1-5


AIN & Metal Heater

Metal Heater Refurbishment Services

REFURBISHMENT PROCESS

FUNCTION TEST

Heating Simulation

Heat-Up Test Chamber


2-1-5


AIN & Metal Heater

Metal Heater Refurbishment Services

FEATURES

TYPES

SCHEME(DxZ Heater)

COMPONENTS(DxZ Heater)

DxZ Heater TxZ Heater


2-1-5


AIN & Metal Heater

AIN Heater Refurbishment Services

FEATURES

In case of applying Refurbishment- Not connect Heating Terminal ( Measurement Resistance is Zero or ∞.)- Shutdown Plasma ( RF Ground Terminal is not connected.)

200mm AIN Heater 300mm AIN HeaterAIN Producer Heater

Used Al Mounts of all heaters to be refurbished are changed into new one.


2-1-5


AIN & Metal Heater


PROCESS FLOW

Incoming Inspection

Cleaning of Heater

Manufacturing Accessory

Joining Terminal

Assembly of Al Mount

QC Final Inspection

2nd Cleaning

Packing

Shipping

ADVANTAGES OF REFURBISHMENT

Providing better quality by reducing Arching Issues

Providing better performance by increasing RF Ground Terminal Lifetime


2-1-5


AIN & Metal Heater


SCHEME (PRODUCER AIM HEATER)

Maker Equip.Wafer

Size

PartsMaterial Picture Remark

Description OEM Part No.

AMAT Producer 200mm PECVD Heater 0200-35527 AIN

AMAT Producer 300mm PECVD Heater 0040-07033 AIN

[PARTS INFORMATION]

[STURUCTURE OF HEATER]

ITEMS DESCRIPTION

AIN Plate Heating

AIN Shaft Support

AI Mount Assembly

Heating Terminal Power Supply

RF Ground Terminal RF Ground

2.1 SEMICONDUCTOR2.1.6 Robot Overhaul Service


2-1-6


Robot Overhaul Service

BUSINESS DESCRIPTION

Robot Repair & OverhaulTransport & Measurement Equipment for

LCD & Fab System

Robot Up - Grade

Robot Replacement for NEW ModelRobot Refurbishment

ADVANTAGES OF KYL

Capability to repair a wide range of semiconductor robots at competitive price with warranty

Capability to repair robot system controller

Support customers for controller PCBs

Service report comes with every repair or overhaul

Support customers with one-to-one robot exchange & supply parts in the robot systems.


2-1-6



Robot Types

DESCRIPTION MODEL

GENMARK ROBOT ASSEMBLY & CONTROLLER GB3, GB4, GB4P, PRE ALIGNER

BROOKS ROBOT ASSEMBLY MTR5, VTR5, Z-BOT

PRI (EQUIPE) ROBOT & PRE ALIGNER ASSY & CONTROLLER

ATM-100, ATM-200, PRE ALIGNER

MECS ROBOT ASSEMBLY & CONTROLLER UTS-100, 200, 800, 1000, 3400

FUSION ROBOT ASSEMBLY

YASGAWA ROBOT ASSEMBLY SV3

GENMARK ROBOT INSTALLAION STATE OF EACH SYSTEM

GB3 GB4 GB4P

GB8

GB7

GENUS SYSTEM (6000: CVD PROCESSGB3

GB4 CANON STEPPER (APT-5800: CVD PROCESS)AG (MEASUREMENT EQUIPMENT)FALCON SYSTEM (ETCH PROCESS)ULTRA TECH STEPPER (UTS: PHOTO PROCESS)4-POINT PROBE (OP2600: MEASUREMENT)


2-1-6



Robot Types

BROOKS ROBOT INSTALLAION STATE OF EACH SYSTEM

MAG7 VCE3 VCE4 VTR3 (Z-BOT) MTR5

FEATURES MTR5 VTR3 VTR5 VCE3 VCE4

Novellus System (CVD Process) O O O O

Genus System (7000: CVD Process) O O O

Gasonic System (Etch Process) O

LAM System (Etch Process) O O O O

Joosung System (CVD Process) O

BROOKS ROBOT INSTALLAION STATE OF EACH SYSTEM

ATM 100 ATM 200

PRE ALIGNER

FEATURES ATM 100 ATM 200Pre

Aligner

Therma Wave (Opti Probe 2600: Measurement Equipment)

O O

Laser Marking (Measurement Equipment)

O O O

Tencor (Surfcan: Measurement Equipment)

O O

Metra 2155M (Measurement Equipment)

O O

Lumonics (Measurement Equipment)

O O

AIT (Measurement Equipment) O O


2-1-6



Robot Types

MECS ROBOT INSTALLAION STATE OF EACH SYSTEM

UTS 100 UTS 800

UTS 3400 Robot Controller

FEATURES UTS100 UTS200 UTS800 UTS1000 UTS3400

W/J System(CVD Process)

O

Canon System(End Fab Process)

O

SEM(Measurement Equipment)

O

M511AE System O

MAS 1800 System(ETCH Process)

O

MAS 8000 System(ETCH Process)

O

Canon System(ETCH Process)

O

OTHER ROBOTS

HP / HP+ ROBOT VHP / VHP+ ROBOT

FUSION ROBOT YASGAWA ROBOT SV3YASGAWA ROBOT

XV-RCM4700

Other Robots

AMAT Robot


2-1-6



Robot Overhaul & Repair Flow Chart for Sample

Backup Robot Data

Pre-Inspection for Robot Driver

Initial Report

Dismantle Robot Driver

Change out Faulty Parts

Assemble back Robot Driver

Perform Calibration & Alignment

Perform Reliability Test without Arm Set for 12 hours

Perform Repeatability & Reliability Test with Arm Set for 24 hours

Final Visual Check for Any Loose Connection

Restore Back the Backup Data

Packing & Delivery

2.1 SEMICONDUCTOR2.1.7 Ceramic Parts


2-1-7


Ceramic Parts

LAM RAINBOW 4500

Upper Electrode:839-011907-001 / 839-011907-100 / 839-011907-111 (8-inch)839-011906-001 (6-inch)

Attachment Ring:716-011923-001 (8-inch)716-011543-001 (6-inch)

Plate Wafer Clamp:716-011563-xxx / 716-011580-xxx / 716-028721-xxx716-028678-xxx / 716-028668-xxx / 716-028688-xxx

Edge Ring:716-020904-016 (6-inch)716-020904-018 (8-inch)

Filler Ring:716-020905-001


2-1-7


Ceramic Parts

LAM RAINBOW 4500 XL

SiC Baffle Plate:716-140125-100

Upper Electrode:839-011907-100 / 839-011907-111

Upper Keyed Ring:716-140432- xxx

Confinement Rings (2 or 3):716-140236-xxx

Focus Ring:716-140118-001

Hot Edge Ring:716-140163-001 (Alox 6”) / 716-140139-008 (Alox 8”)716-140139-211 (poly silicon, 8”)716-442086-xxx (single crystalline silicon, 8”)


2-1-7


Ceramic Parts

LAM RAINBOX EXELAN

SiC Baffle Plate:716-140125-100

Upper Electrode:839-011907-100 / 839-011907-111

Confinement Ring:716-443083-004 (top)

Confinement Rings:716-443090-002 (middle)716-443084-003 (bottom)

Focus Ring:716-443129-001

Hot Edge Ring:716-443086-xxx (single crystalline silicon, 8”)


2-1-7


Ceramic Parts

LAM TCP9600 BAC

Upper Shaped Window716-330121-001 / 716-330121-201 / 716-330121-211716-330121-004 / 716-330121-014 / 716-330121-214716-330121-006 / 716-330121-016 / 716-330121-216

Plate Wafer Clamp:716-330167-x5x (5-inch) / 716-330167-x6x (6-inch)716-330167-x8x (8-inch)

Focus Ring:716-011830-006 (6-inch) / 716-011830-008 (8-inch)

Confinement Rings:716-011651-006 (6-inch) / 716-011651-008 (8-inch)

Filler Ring:716-330162-002


2-1-7


Ceramic Parts

LAM TCP9600 ESC

Upper Shaped Window716-330121-001 / 716-330121-201 / 716-330121-211716-330121-004 / 716-330121-014 / 716-330121-214716-330121-006 / 716-330121-016 / 716-330121-216

Focus Ring:716-330504-061 (6-inch jeida)716-330504-064 (6-inch)716-330504-081 (8-inch)

Filler Ring:716-031453-002


2-1-7


Ceramic Parts

LAM TCP9600PTX

Plate Shield 21 Holes:716-330892-007

Edge Ring:716-330045-001 / 716-330045-002 / 716-330045-003716-330045-004 / 716-330045-281

Insulator Ring:716-330915-001

Uniformity Ring:716-331051-002716-331051-003

Chamber Liner:715-330825-007* (alumina version)


2-1-7


Ceramic Parts

TEL UNITY ETCHERS

Silicon Focus Ring

Qtz

Qtz

Qtz


2-1-7


Ceramic Parts

AMAT SUPER-E & MxP(+)

Uni Insert:0200-102460200-00410

Si Top Ring:0200-366970200-01511

Si Insert Ring:0200-104460200-01509

Shadow Ring:0200-00176 / 0200-00637 / 0200-01119 0200-01216 / 0200-10151 / 0200-10176 0200-36696 / 0200-10243 / 0200-104450200-39346


2-1-7


Ceramic Parts

AMAT DPS

Single Ring:0200-10378 / 0200-35824

0200-39152

Capture Ring:0200-35335 / 0200-35323

0200-00247

Focus Ring:0200-00136 / 0200-358280200-10377 / 0200-39140

DPS Dome:0200-00175 / 0200-103240200-39137 / 0200-35267

0200-35956

Housing Gas Feed:0200-35290 / 0200-35295

Plug Gas Nozzle:0200-35291 / 0200-35296

Aperture Cover:0200-39...

Window End Point:0200-39133 / 0200-391350200-35292 / 0200-35293


2-1-7


Ceramic Parts

AMAT ULTIMA HDP

HDP Dome:0200-18062 / 0200-01006

Top Nozzle:0200-18086

Side Nozzle:0200-00635 / 0200-18082 0200-18093

Collar Ring:0200-18078 / 0200-180950200-18109

Cover Ring:0200-18077 / 0200-18081


2-1-7


Ceramic Parts

AMT DxZ

Lift Pins:0200-10284

Edge Ring:0200-10169

AlN Cover Plate:0200-34630 / 0200-36630 (non-dimpled)0200-01655 (wide pocket) / 0200-36631 (dimpled)

Pumping Ring:0200-09975

Chamber Insert:0200-10143

Isolator Pumping Plate:0200-10144

Liner Junction: 0200-10157

Sleeve Junction: 0200-10158

Liner Ceramic: 0200-10160

C-Shaped Ring: 0200-36415

Ceramic Pumping Insert: 0200-10164

Pumping Ring: 0200-36416

Ceramic Lead: 0200-10163

Pumping Ring: 0200-36417

Ceramic Cover: 0200-36418

Other DxZ Consumables:


2-1-7


Ceramic Parts

NOVELLUS CVD

Cover Plate

Alox Fork

Exclusion Ring

Focus Ring

2.1 SEMICONDUCTOR2.1.8 Loadlock Conversion


2-1-8


Loadlock Conversion

Loadlock Conversion

WIDEBODY LOADLOCK CONVERSION

Dismantle Narrowbody Loadlock

Install Widebody Loadlock

Configure Utility

Pumping Line with Valve

Vent Line with Valve

Install Front Panel

Install SMIF Interface

Handoff Calibration

Functional Test

Tool Release

WIDEBODY LOADLOCK ASSEMBLY

AMAT Centura 5200 / AMAT Endura 5500

Wafer Mapping Kit / Wafer Sliding Sensor /

Stage Rotation Kit


2-1-8


Loadlock Conversion

Loadlock Conversion

FRONT PANEL & UTILITY LINE

SMIF INTERFACE KIT – BOARD, CABLES & BRACKETS


2-1-8


Loadlock Conversion

Loadlock Final Check Sheet - Sample

2.1 SEMICONDUCTOR2.1.9 ETO to ENI Generator


2-1-9


ETO to ENI Generator

ETO VS ENI GENERAL INFORMATION

ETO to ENI Generator Retrofit

DESCRIPTION ETO ENI COMMENT

SIGNAL CABLE

TOP 0150-18040 TOP 0150-08598 Need To Replace

SIDE 0150-18041 SIDE 0150-08599 Need To Replace

BIAS 0150-18042 BIAS 0150-08600 Need To Replace

MW 0150-18043 RPS 0150-05646 Need To Replace

GENERATOR

TOP ETO TOP NOVA 50 Need To Replace

SIDE ETO SIDE NOVA 50 Need To Replace

BIAS ETO BIAS GHW 50 Need To Replace

MW Controller Ultima STD RPS Ultima Plus

Seriplex PCBSeriplex A/B Seriplex A/B Same

Seriplex C/D Seriplex C/D Same

Power Spec 3p 208v 125Amp 3p 208v 125Amp Same

PCW Supply 1/2 " QDC 1" FPT

PCW Return 1/2 " QDC 3/4" FPT

Dimension W*D*H (573*936*2046) W*D*H (56*94*109)

1. Seriplex Board : Same as ETO.

2. Generator Cable : Seriplex Connector is the same, Generator Connector is different Thus changes are needed

3. Software : Software Upgrade (above E 3.5)

4. As the Standard chamber uses microwave, ENI retrofit is not applicable (Applicable in PLUS chamber)

Frequency Max Pwr

Top RF 1.8 ~ 1.915MHz 5000W

Side RF 2.015 ~ 2.165MHz 5000W

Bias RF 13.56MHz 5000W

Frequency Max Pwr

Top RF 1.8 ~ 1.915MHz 5500W

Side RF 2.015 ~ 2.165MHz 5500W

Bias RF 13.56MHz 5500W

ENI

ETO

BENEFITS OF RF GENERATOR

PM procedure is much easier than ETO Max Power is much higher than ETO (Need

high RF power for better gap fill performance)

Cost reduction for customer



2-1-9 ETO to ENI Generator

ETO Generator




ETO Generator

ETO Generator Connection

TOP

SIDE

BIAS

M/W

TOP Gen.

MW Cont.

SIDE Gen.

BIAS Gen.

Power Deck.

DI Unit.




ENI Generator



ENI Generator

ENI Generator Connection

TOP

SIDE

BIAS

RPS

TOP Gen.

SIDE Gen.

BIAS Gen.




Retrofit Schedule for Generator

Contents D 1 D 2 D 3

Fab in the generator rack

De-installation utility & cable for old generator rack

Remove old generator rack

Positioning for new generator rack

Hook up the PCW (Customer)

Installation for new generator and other units

Hook up cables

Test of RF generator

Calibration for RF power

Seasoning test with wafer (Customer)

Confirming RF with run wafer (Customer)


2.1 SEMICONDUCTOR2.1.10 Ceramic Bearing

These ceramic bearings are used for semiconductor, PDP, LCD manufacturing equipment, plated equipment, synthetic fiber manufacturing equipment, optical film equipment, and all sorts of thermal treatment vacuum equipment.

With specification such as below• Deep grove ball bearing• Angular contact bearing• Thurs Bearing• Self-Aligning Ball Bearing


2-1-10


Ceramic Bearing

Ceramic Bearing

For the Atmosphere

For Vacuum Environment

For Corrosion Resistance

For High Temperature Resistance

PRODUCT FEATURES

Strong corrosion resistance:, strong acid, alkali, and salt water

Heat resistance: No hardness and strength change at high temperature

Non-magnetism, insulation resistance: Using possible at magnetic field, prevention

of generation electricity

A light weight: lighter 1/4 than general bearing

High rigidity: Hardness, Straight elasticity coefficient is higher than steel bearings

High Speed RevolutionL: The electro motion (ball) is so light that decrease the

centrifugal force when it revolute


2-1-10


Ceramic Bearing

PHYSICAL & CHEMICAL PROPERTIES

Property Unit Si3N4 ZrO2 SiC SUS440C SUS316L SUJ2

Density g/ 3.26 3.2 6.05 7.8 7.98 7.8

Hardness kg/ 1600 2800 1250 230 160 700

Toughness MN/m 6.0 2.5 7.0 - - 50

Bending Strength kg/ 100 50 120 - 24 -

Young’s Modulus 106kg/ 3.2 4.0 2.0 2.0 2.0 2.1

Specific Heat /g˚C 0.19 0.16 - 0.11 0.11 0.11

Thermal Expansion Coeff

*10-6/mm 3.5 4.2 9.0 10.1 10.5 10.9

Heat Shock Resistance T,˚C 900 400 280 - - -

Thermal Conductivity w/mK 29 120 3.0 - - -

Fatigue Life 100x 50x 80x 0.5x 1x 0.1x

Application Temp ˚C 1200 1500 800 260 260 180

Hydrochloric Good Good Excellent Fail Fail Poor

Hydrofluoric Acid Good Good Excellent Fail Fail Poor

Salt Water Excellent Excellent Excellent Fail Fail Poor

Magnetism Non Magnetism Weak Magnetism Strong

Conductivity / Insulation Insulator Conductivity

Performance and Use

Bearing

Pump

Nozzle

Bearing

DiesBearing

Bearing

KnifeBearing Bearing


2-1-10


Ceramic Bearing

PHYSICAL & CHEMICAL PROPERTIES

DescriptionCeramic Stainless Steel

Si3N4 ZrO3 SUS440C

Corrosion

Resistance

Sulphuric Acid 0.5ml/l (25) X

Sulphuric Acid 0.5ml/l (150) X

Hydrofluoric Acid 0.5ml/l (25) X

Non Permeability < 1.001 < 1.001 Strong Magnetism

Cost High <------> Low

DescriptionCeramic Material Remark

Si3N4 Al3O3 ZrO3 SiC SUJ2

Life Time (Hrs) X X -

Density (g/) 3.26 3.8 3.2 6.05 7.8

Tensile Strength (kg/mm2) 100-150 40-50 100-120 40-50 -

Toughness (Mpa*m1/2) 7-8 4-4.5 7-9 3-5 50-60

Vickers Hardness 1400 1800 1300 2500 700

Thermal Stress Resistance 900 200 350 400 -

Stability Temperature 1000 1600 800 1500 180

Chemical Characteristic X



2-1-10 Ceramic Bearing

Bearing Robot

BEARING HP Robot

QT-AMAT-1110HP/HP+ Hub Ceramic Bearing

QT-AMAT-1111HP/VHP Pivot Ceramic Bearing

QT-AMAT-1112HP Arm Ceramic Bearing

3

1

2

1 2 3




Bearing Robot

BEARING HP+ Robot

QT-AMAT-1113HP+/VHP/VHP+ArmUpper Bearing

QT-AMAT-1115Assy Left/Right Hand Pivot & Bearing

QT-AMAT-1114HP+/VHP/VHP+ Arm Lower Bearing

QT-AMAT-1110HP/HP+ Hub Ceramic Bearing

3

1 2

4

1 2

3

4




Bearing Robot

BEARING VHP+ Robot

QT-AMAT-1116VHP/VHP+ Hub Bearing

QT-AMAT-1113HP+/VHP/VHP+Arm Upper

Bearing

QT-AMAT-1114HP+/VHP/VHP+ Arm Lower

Bearing

1 2 3

12

3




Bearing Robot

OTHERS

QT-AMAT-1117Assy, Extended Reach

Wrist, HP+/VHP+ Robot

QT-AMAT-1119Producer Robot Wrist Large Ceramic Bearing

QT-AMAT-1118Assy,Transfer Wrist HP+/VHP Retrofit

QT-AMAT-1120Producer Robot Wrist

Small Ceramic Bearing

Type Parts No Q’ty Description Description

HP

QT-AMAT-1110

QT-AMAT-1111

QT-AMAT-1112

4

4

4

Hub Ceramic Bearing

Pivot Ceramic Bearing

Arm Ceramic Bearing

0190-70076

0190-70075

0190-70070

HP+

QT-AMAT-1110

QT-AMAT-1113

QT-AMAT-1114

QT-AMAT-1115

4

2

2

1

Hub Ceramic Bearing

Arm Upper Bearing

Arm Lower BearingAssy Left/Right Hand Pivot & Bearing

0190-70076

0190-75039

0190-007630190-75571,75572

VHP

QT-AMAT-1111

QT-AMAT-1113

QT-AMAT-1116

8

4

2

Pivot Ceramic Bearing

Arm Upper Bearing

Hub Bearing

0190-70075

0190-75039

0190-76106

VHP+

QT-AMAT-1113

QT-AMAT-1115

QT-AMAT-1116

4

1

2

Arm Upper BearingAssy Left/Right Hand Pivot & Bearing

Hub Bearing

0190-75039

0190-75571,75572

0190-76106

ProducerQT-AMAT-1119

QT-AMAT-1120

4

4

Producer Robot Wrist Large Ceramic Bearing

Producer Robot Wrist Small Ceramic Bearing

3060-01746

3060-01780

Assy

QT-AMAT-1527

QT-AMAT-1528

QT-AMAT-1529

QT-AMAT-1530

1

1

1

1

Assy Extended Reach Wrist HP+/VHP+ Robot

HP+ Robot Arm Set

Producer Robot Right Arm Assembly

Producer Robot Left Arm Assembly

0010-13242

0010-13266, 13267

0040-39728

0040-38937

CERAMIC BEARING CODE

2.1 SEMICONDUCTOR2.1.11 Ceramic Bearing for

HP / HP+ Pivot



2-1-11 Ceramic Bearing for HP/HP+ Pivot

Ceramic Bearing for HP/HP+ Pivot

BASIC INFORMATION

HPHP/VHP PIVOT

CERAMIC BEARING4 QT-AMAT-1111

0190-70075

3060-01190

0190-35018

HP+

LEFT HAND PIVOT &

BEARING

RIGHT HAND PIVOT &

BEARING

1

QT-AMAT-1116L

QT-AMAT-1116R

0010-75571

0010-02170

0010-75572

0010-02171

FEATURES

• Strong corrosion resistance : strong acid,

alkali, and salt water

• Heat resistance : No hardness and

strength change at high temperature

(<1,000)

• Non-magnetism, insulation resistance :

Using possible at magnetic field

• A light weight : lighter 1/4 than general

bearing

• High rigidity : Hardness, Straight elasticity

coefficient is higher than steel bearings

MATERIALS

BEARING – Hybrid• Inner & Outer: SUS 440 C• Retainer: SiC Ball Spacer• Ball: SiN4 Ceramic Ball• Cover: None• Cleanroom Assembly & Vacuum

Packing• High Vacuum Dynamic Grease Ball

Coating (10-9 Torr)

PIVOT• Pivot: SUS 316• Gear: 0.05mm wire cut



2-1-11 Ceramic Bearing for HP/HP+ Pivot

CERAMIC MATERIAL COMPARISON

DescriptionCeramic Stainless Steel

Si3N4 ZrO3 SUS440C

Corrosion

Resistance

Sulfuric Acid 0.5ml/l (25) X

Sulfuric Acid 0.5ml/l (150) X

Hydrofluoric Acid 0.5ml/l (25) X

Non-Permeability < 1.001 < 1.001 Strong Magnetism

Cost High <------> Low

DescriptionCeramic Material Remark

Si3N4 Al3O3 ZrO3 SiC SUJ2

Lifetime (Hrs) X X -

Density (g/) 3.26 3.8 3.2 6.05 7.8

Tensile Strength (kg/mm2) 100-150 40-50 100-120 40-50 -

Toughness (Mpa*m1/2) 7-8 4-4.5 7-9 3-5 50-60

Vickers Hardness 1400 1800 1300 2500 700

Thermal Stress Resistance 900 200 350 400 -

Stability Temperature 1000 1600 800 1500 180

Chemical Characteristic X

2.1 SEMICONDUCTOR2.1.12 Auto Mirror System



2-1-12 Auto Mirror System

Single HDD or even 2HDD does not provide Real Time Backup. If HDD were to fail, equipment will cease to run, which

heavily affects RF or Gas delivery -Wafer Scrap!! HDD replacement, software re-installation, unscheduled PM, backup

requires time-consuming & waste of materials.

The Auto Mirror uses Real Time Data Copy System: problems associated with failed HDD can be avoided. For example,

even though the Master HDD failed in the middle of a process, it still can continue without any downtime. Replace

the failed HDD after the completion of the process, continue Real Time copy and the system can continue running.

PROBLEMS OF NORMAL HDD

Water Scarp & rework

Storage location of the Backup Data

The time to do Backup

Parts Damage caused by Power On & Off: Pump, Heat Exchanger, Board, etc.

Receipt Re-Install & Data Loss with Wafer History & Event Log

Hardware Calibration Data: RF, MFC, Hand-Off, PID, etc.

Monitoring & receipt Fine Tuning during Backup Test, limited to some receipt.

When will the System back to Production

The Auto Mirror HDD system with it’s RAID-1 technology provides solution for the problems above. It is able to store important data and allows continuous running of the equipment even though if

there is HDD Crash or Fail

Auto Mirror System (Real Time Data Copy System)



Auto Mirror System

HARDWARE CONFIGURATION

IDE Type Auto Mirror

IDE/SCSI Front View

IDE/SCSI Rear View

SCSI Type Auto Mirror

The system consists of Auto Mirror & 2HDDHDD Type is compatible with both IDE & SCSI Type allowing

installation on all systems

BENEFITS

SAFETYBy using RAID-1 technology, Auto Mirror HDD System stores data

and resolves the normal equipment problems caused by HDD failure. If the running HDD fails or stop while the system is still

running, the Real Time copied HDD will continue running and thus there will be no downtime in the equipment and therefore no

wafer scrap.

USER FRIENDLYApplicable for all HDD.

No additional Items (card or software) is needed.No need of main power off during HDD exchange (with Auto

Mirror Systems).

FLEXIBILITYCompatible with all types of HDD

2-1-12



Auto Mirror System

Applications

USA & ASIA

AMAT 150 mm P5000/Centura

AMAT 200 mm Endura/ DxZ/ Producer/ HDP/DPS/ MxP/ CMP

NOVELLUS 200 mm Concept-2

NOVELLUS 300 mm Concept-3

TEL 200 mm MB2 , Track (ACT 8, ACT 10)

CANON 200 mm APCVD APT6000 ,STEPPER

NIKON 200 mm Stepper (Digital, HP)

ASML 200 mm Stepper

LAM 200 mm 47/94/96

MATTSON 200 mm Steag 2800/3000

THERMAWAVE 200 mm FTT 3260/ TP500

AMAT 300 mm CMP/ Producer SE

RUDOLPH 300 mm Metapulse300X

KOREA

ULTIMA 200 mm E/F HDP

NIKON 200 mm E/F Stepper (10C, 11D)

NOVELLUS 200 mm K6, K7 HDP Rorze

NOVELLUS 200 mm K5 Altus

GENUS 300 mm K12

2-1-12

2.1 SEMICONDUCTOR2.1.13 Heating Pipe



2-1-13 Heating Pipe

Heating Pipe for Exhaust Line

Description Flexible Heating Pipe

Input Voltage AC 200V

Electric Capacity 260 W

Temperature Control Max 200 ˚C

Pressure Max 0.8 MPa

Length 1 ~ 8 m

CONSTRUCTION OF HEATING PIPE

①②

③

④

⑤⑥ ⑥

⑦①

Flange NW40 or

Customer requests

② SUS Flexible Pipe

③ Heating layer

④ Thermal layer

⑤ Outer cover layer

⑥ Terminal cup

⑦ Lead cover



Heating Pipe

ADVANTAGES OF NEW EXHAUST LINE

Inside of the Pipe

New Exhaust PipeLine

① Unnecessary for elbow fitting based on high flexible in order to prevent the virulent powder accumulations.

② Longer pump maintenance cycle, also cost reduction.

③ Ultimate maintenance free based on best temperature

COMPARISON FOR SUS PIPE & HEATING PIPE

Metal DPS Chamber

Exhaust LineNormal SUS PIPE HEATING PIPE

After 1 month using After 6 months using

2-1-13



Heating Pipe

Exhaust Line

CURRENT CONDITION OF EXHAUST LINE

KYL HEATING PIPE FOR EXHAUST LINE

SUS Flexible Pipe

Temperature Controller

2-1-13



Heating Pipe

Exhaust Line

This exhaust pipe was heated by Heater Jacket

Inside Pipe

CURRENT CONDITION OF EXHAUST LINE

DISADVANTAGE• The present exhaust Line was accumulated

the virulent powder inside pipe wall by dropping fluid temperature down.

• The maintenance of pipe inside is often practiced one time / 1~3 months. (It depend on process)

• The complicated piping based on Equipand scrubber’s installation place strongly → Maintenance fee increasing

KYL HEATING PIPE FOR EXHAUST LINE

Inside Pipe

ADVANTAGE• No need elbow fitting based on high

flexible in order to prevent the virulent powder accumulations.

• Longer pump maintenance cycle, also cost reduction.

• Ultimate maintenance free based on best temperature

2-1-13

2.1 SEMICONDUCTOR2.1.14 HP+ Robot Upgrade



2-1-14 HP+ Robot Upgrade

HP+ Robot Upgrade

REQUIRED PARTS FOR HP+ UP GRADE

HP+ ROBOT CONFIGURATION

Part No Description QTY Price

0010-13272 UPPER/LOWER DRIVER 1 12,000

0010-13242 EXTENDED REACH WRIST ASSY 1 3,200

0010-13266 LEFT HAND LINKAGE 1 3,100

0010-13267 RIGHT HAND LINKAGE 1 3,100

0190-70076 BRG BALL 1/8" 6.00 BORE 6.50 O.D LVP GREASE 4 2,324

0010-13266LEFT HAND LINKAGE

0010-13267RIGHT HAND LINKAGE

0190-70076BRG BALL 1/8" 6.00

0010-13272UPPER/LOWER DRIVER

0010-13242EXTENDED REACH WRIST ASSY

1 2

3 4 5

14

2

3 5



HP+ Robot Upgrade

ADVANTAGES

• VHP type lubricant – VHP proven lubricant life

• Use Ceramic bearing - Reduce particle and vibration

• Hub locator pins – Locating pins help align wing to hub

• Adjustable elbow – Vertical arm leveling adjustability

• Improved linkage/Robot VHP design – High stiffness reduces droop

• Simplified bearing assembly – Bearing pre-load design improves serviceability

• Press fit bearing – Wrist assembly stiffened droop

• SST sleeve isolates bearing thermally – Thermal stability

Hub Bearing

Wing & Arm Design,Improved Elbow

Wrist Assembly

Positional Repeatability

Parameter Acceptable Tolerance (HP) Results (HP+) Standard Deviation

Rotation ± 0.010 in ± 0.006 in 0.002 in

Extension ± 0.010 in ± 0.007 in 0.002 in

Droop < 0.040 in < 0.020 in

2-1-14

2.1 SEMICONDUCTOR2.1.15 AIM Convert



2-1-15 AIM Convert

AIM Convert – Evaluation Apply 1.0

E-GATEWAY SPECIFICATION

Classification Item Specification

System

CPU Motorola MPC8247 233MHz (500 MIPS)

Flash Memory 4Mbytes Boot Flash

Ram 32MB SDRAM PC100, 16MB Storage Flash

Watchdog Timer H/W Watchdog * 2

NetworkPort 2 Ports

Interface 10/100 base T-Ethernet Interface

Serial

Port 2 Ports + 1 Console Port

Connector 8 Pin Modular Jack RI 45 (Female)

Baud Rate 400 bps to 1.5 Mbps

Data Bit 5 / 6 / 7 / 7 Bits

Stop Bit 1 or 2 Bits

Parity Odd / Even / None

Flow Control HW / SW / None

General

Power Supply Free Voltage (AC 85 ~ 264V, 50/60 Hz)

Power Consumption Max 6 Watts

Dimensions 220mm (W) * 170 mm (D) * 44mm (H)

E-Gateway Apply Example

Samsung Elec. 10 Line

Easy Set Up & Cut Down Expenses



AIM Convert

NETWORK LAYOUT

- Protocol Conversion

: Between Secs-1 and

HSMS

- Converting Logic

: Common Secs Protocol Use

: Secs-1 -> Secs-2 Convert

: Apply Example

-> Samsung (10 Line)

ADVANTAGES & DISADVANTAGES

Merits Demerits

AMAT Tool - EQP Company Warranty Enable

- Run Up Expenses

- Difficult Set Up

- Need EQP Engineer

(AMAT-1, QT-1, Host-1)

E-Gateway

- Easy Set Up

- Cut Down Expenses

- Need Minimum EQP Engineer

(QT-1, Host -1)

- EQP Company Warranty Enable

2-1-15



AIM Convert

ADVANCE PREPARATION

ETHERNET CABLE SPECIFICATION

PIN SIGNAL

1 TX+

2 TX -

3 RX +

4 NC

5 NC

6 RX -

7 NC

8 NC

ITEMSPECICIATION

10 BASE-T / 100 BASE-T

Delivery

Requirements

Data Delivery Speed 10 Mbps / 100 Mbps

Method of Delivery Base Band

Maximum Segment

Length100m (Nod – Herb)

Maximum Protocol Size 1500 bite

Protocol TCP / IP, UDP / IP

E- Gateway <-> Host

2-1-15



AIM Convert

RS-232 CABLE SPECIFICATION

PINRS-232

SG9000-S SG9000-M

1 RTS DCD

2 TX RTS

3 RX GND

4 DTR TX

5 DCD RX

6 CTS DSR

7 GND CTS

8 DSR DTR

ITEMSPECIFICATION

10 BASE-T / 100 BASE-T

Delivery

Requirements

Data Bit 5 / 6 / 7 / 8

Stop Bit 1 / 2

Start Bit 1

Parity Even / Odd / None

Speed (BPS)300/600/1200/1800/2400/3600/4800/7200/9600/19200/38400/57600/115200

Registration No registration

Delivery Range

RS-232C, Max 15m

DiagnosticsOperation status will be shown in each channel through Tx/Rx LED

E- Gateway <-> EQP

SG9000-S Cable

2-1-15

2.1 SEMICONDUCTOR2.1.16 Flash Memory Driver



2-1-16 Flash Memory Driver

KYL Flash Memory Driver is a solid-state SCSI dick drive based on non-volatile flash technology. Flash Memory driver provides the same storage functions as hard disk

drivers, plus the enhanced operating reliability of long life MTBF and rugged durability with the capacity from 64MB to 64GB in a standard 3.5 “ disk drive form

factor.

Designed for heavy duty operation, KYL Flash Memory Driver performs under conditions of extended temperature, high shock & vibration and rapid temperature

gradients.

FEATURES

• Easily replace rotating hard disk and tape drives with proven reliability solid-state flash memory

• Low power, small size and extended temperature operation

• No additional software drives requires for operation as a boot and data storage system

• Tape or disk emulation of industry standard magnetic storage systems

• Tested to MIL-STD-810F Specification



Current Condition of Exhaust Line

Flash Memory Driver

HARDWARE Host Computer with SCSI Interface

SOFTWARE BIOS & O/S with SCSI Support

INTERFACE & CONNECTORSCSI-250-Pin , 0.1” Pin Spacing4 Pin Power, 0.156” Pin Spacing

DATA TRANSFER RATESustained Read: 6.0 MB/Sec (128 blocks)Sustained Write: 5.2 MB/Sec (128 blocks)

CAPACITIES 64 MB to 64 GB

POWER REQUIREMENTS Voltage = 5V ± 5% @ 1.2A (typ)

DIMENSIONS

64 MB to 28 GB: 101.5 mm [3.995”] W * 146.1 mm [5.750”] D * 15.2mm [.600”] H40 MB to 64 GB: 101.5 mm [3.995”] W * 146.1 mm [5.750”] D * 15.2mm [.600”] H

OPERATING TEMPERATURESCommercial (C) : 0 to 70 Industrial (I): -40 to 85

2-1-16

2.1 SEMICONDUCTOR2.1.17 HDP Upgrade



2-1-17

RPS Upgrade for Ultima HDP

CENTURA 5200ULTIMA HDP

HDP Upgrade

OVERVIEW



HDP Upgrade


ULTIMA & ULTIMA PLUS COMPARISON

ULTIMA HDP ULTIMA HDP

Ultima Ultima Plus

Feature

The microwave clean hardware allows the Ultima chamber to be cleaned without having a plasma in the chamber.

A remote plasma takes place upstream from the process where NF3 is dissociated.

But long path (waveguide) often bring error what is called “plasma not detected error” (a large portion of downtime)

Top mount remote plasma cleaning method

(short path)

Short path has solved problem which has microwave system “plasma not detected error”

Upgrade

1. Higher NF3 clean efficiency -> Improved clean time (5%)2. More than 40% reduction in NF3 usage per wafer3. M/C Up Time Increase4. PM Cost Down5. Particle Decrease -> Yield IncreaseB

ENEF

ITS

2-1-17




RPS UPGRADE KIT DETAILS FOR ULTIMA PLUS

NO ITEMS QTY

1 Kit NSO Upper Chamber Ultima Plus Support 1

2 Source Condition Box with Balanced Side Coil 1

3 Cap Blank Assembly 1

4 Kit AE Box Connector 1

5 Top Coil Assembly 1

6 Kit Non-Applicator & Microwave Ultima 1.5 1

7 Side Match Assembly with Balanced 1

8 RPS Assembly MKS 1

9 Kit 24 Nozzle 2.55” Ultima 24

10 Gas Ring 24 Nozzle 1

11 Dome 1

12 Top Baffle 1

13 Top Nozzle Block 1

14 Teflon Ring 1

15 Mu Partition Cover Assembly 1

16 Top Mount Adaptor 1

17 RPS Extension 1

18 RPS MKS / AE Moune 1

19 Stand Off #1 1

20 Stand Off #2 2

21 RPS Mount Spring 4

22 Stud Clean Gas 3

23 RPS Mount Nut 3

24 Water Hose Clamp 1

25 Top Gas Line Sus 1

26 NF3 Gas Line Sus 1

27 RPS Control Cable 1

28 RPS Power Cable Hook Up (C/B) 1

29 Screw Kit 1

30 O-Ring Kit 1

HDP Upgrade2-1-17



RPS Upgrade for CxZ

HDP Upgrade

No Items Part No QT'Y

1 Gas Feed thru out put 0040-53913 1

2 Gas Feed thru in put 0040-01834 1

3 Gas feed thru Teflon 0021-06499 1

4 Ass'y in the us 0150-00918 1

5 ASTEX RPS 0920-00013 1

6 RPS Power cable 0150-02748 1

7 RPS Bottom feed thru 0021-06044 1

8 O-ring 3700-01812 1

9 adaptor gas line 0040-01783 1

10 RPS Gas feed thru line - 1

11 RPS Bottom Ceramic - 1

12 RPS V-Block valve - 1

13 Chamber lid cover Teflon - 1

14 Gas feedthrou bar - 1

15 Signal cable - 1

16 Circuit break 30A within cable - 1

HARDWARE

1. RPS clean hardware allows the CxZChamber

-> Process Kit no damage-> Process Kit lifetime longer with

ceramic heater

2. NF3 Usage Improvement-> More than 30% reduction in NF3

usage per wafer

BEN

EFIT

S

PROCESS

1. Particle Decrease -> Yield Increase

2. Higher NF3 clean efficiency -> Improved throughput

-> Improve clean efficiency 10%-> NF3 clean recipe time improve 10%

2-1-17

2.1 SEMICONDUCTOR2.1.18 Fast Vent Diffusion



Fast Vent Diffusion

FEATURES

Fast Vent Diffusion

Downstream Cleanliness Less than 0.03particles / liter , Greater than 0.01um at rated flow

Removal Rating > 0.003um

Reliability 100,000 cycle reliability at maximum rated inlet pressure at 25

Maximum Inlet Pressure 7 bar (100 psi)

Maximum Differential Pressure 8 bar (115 psi)

Maximum Operating Temperature 100 with Viton O-ring

400 with no O-ring

Warranty 5 YEAR OR 100,000 cycles

PER

FOR

MA

NC

E

OP

ERA

TIN

GC

ON

DIT

ION

Sintered nickel technology

Gentle flow characteristics in a clean diffuser /

filteration media that increases throughput with rapid

venting to atmosphere

0.003 um filtration technology in an integrated filter /

diffuser

Delivers ultra-clean, diffused gas to the process

chamber to minimize on-wafer defects

Available in a wide range of standard flange and connector

configurations

Compatible with most system designs for easy

installation or retrofit into loadlock chambers, cooling

chambers, transfers, and process chambers.

2-1-18



Fast Vent Diffusion

FEATURES

Fast Vent Diffusion

Loadlock Upper Loadlock Upper

Loadlock Lower Loadlock Lower

Diffuser Gas Line Install

Dismantle Slow Vent Line

Ventilation TimeCentura - Before(00:04:35) After(00:01:14) 4.0 %Endura - Before(00:07:29), After(00:02:57) 5.4 %

2-1-18

2.1 SEMICONDUCTOR2.1.19 Heater & Bellows



2-1-19

LIFT ASSEMBLYSELL & REPAIR

Heater & Bellows

BELLOWSSELL & REPAIR

SLIT VALVE ASSEMBLYSELL & REPAIR

0010-70302 Wafer Lift Assy PC1

0010-70271 Assy 101 Lift

0040-20194 Bellows 101 Coverage

0010-20753 Wafer Lift Assy PC2

0040-09077 Basic Bellows

0040-20155 Wafer Lift Bellows

0040-20146 Bellows Wafer Orient

0020-22910 Basic Bellows



VALVE ASSEMBLY REFURBISHMENT

AI HEATER SELL & REFURBISHMENT

AMAT AI HEATER

NOVELLUS AI HEATER

Heater & Bellows2-1-19



METAL HEATER SELL & REPAIR

NOVELLUS SUB ASSEMBLY REFURBISHMENT

AMAT Heater Refurbish

Novellus Heater Refurbish




Bellow Lists

CENTURA & P5000

EQUIPMENT OEM P/N DESCRIPTION

CENTURA

0040-18078 BELLOW,WELDMENT,HDP-CVD

0040-32052 WELDMENT, BELLOW, CATHODE, DPSGECO

0040-32053 WELDMENT, BELLOWS, WAFER LIFT

0040-36033 WELDMENT,.750 DIA BELLOWS,MOD II

0040-36299 WELDMENT,BELLOWS ASSY, LOWER,GIGA-FILL

0040-36300 WELDMENT, BELLOWS ASSY, UPPER, GIGA-FILL

P5000

0015-09055 BELLOWS ASSY SUSCEPTORHOLLOW

0015-09056 BELLOWS ASSY WAFER SOLID

0040-09004 BELLOWS WELDMENT

0040-09697 WELDMENT,BELLOWS ASSY, UPPER,WXZ

0040-09700 ASSY, BELLOWS, LOWER

0040-20146 WAFER ORIENT BELLOWS

0040-31998 WELDMENT, BELLOWS ASSY, UPPER, DXZ

0040-35909 WELDMENT,BELLOWS ASSY,LOWER,DXZ

0040-38825 WELDMENT BELLOWSE ASSY UPPER DXZ

0040-38826 WELDMENT BELLOWSE ASSY LOWER DXZ

0040-75904 BELLOWS WAFER ORIENT




Bellow Lists

EUDURA, PRODUCER & LAM

EQUIPMENT OEM P/N DESCRIPTION

ENDURA

0040-20068 BELLOWS LIFTER PVD

0040-20155 BELLOWS PRECLEAN

0040-20194 BELLOWS 101% TiN COVERAGE

0040-20283 BELLOWS,PRECLEAN

0040-20418 BELLOWS SLIT VALVE ASSY

PRODUCER

0040-36095 BELLOWS,HEATER LIFT

0040-38625 LOADLOCK BELLOWS ASSY

0040-39946 BELLOWS PIN LIFT

LAM

839-012255-001 BELLOWS ASSEMBLY


839-330743-003 BOTTOM ROD LIFTER BELLOWS ASSEMBLY





839-704204-002A BELLOWS ASS'Y




2.1 SEMICONDUCTOR2.1.20 Ch B Sensor for Endura



2-1-20

Ch.B Wafer Sensor Kit for Endura™

BACKGROUND

Ch B Sensor for Endura

• Wafer misalignment inside PVD chamber

- Wafer slippage on blade or PVD heater

- Wafer popping due to dechucking of ESC

• Wafer misalignment on transfer blade

• Wafer misalignment in cooldown chamber

• Wafer broken during lift down or buffer blade

• Increase of wafer loss and MTTR

The need for a solution

to prevent wafer misalignment

in cool down chamber

OPERATION FLOW

1 2 3 4 5

Sensor detects misaligned/mispla

ced wafer

Disconnect Solenoid Valve

cable in Lift Down

Display “Lifetime out”

error and disable lift motion

Buffer Robot blade deactivated due to disablement of lift

motion

Engineer to investigate and troubleshoot



COMPOSITION


Sensor Board Cable

Board Cover Sensor Bracket Hoop Sensor Bracket

Sensor Bracket & Sensor

Cable & Board

Power Cable Connection-Pneumatic Power Distribution Board

Solenoid v/v signal cable change

INSTALLATION

2-1-20



Product Information

PRODUCT FEATURES


Simple design with standard parts

Easy installation / de-installation

Convenient sensor operation with simple on/off switch

Minimum motion error with simple calibration

Easy and simple adjustment of sensor location

Easy and simple adjustment of sensor gain

PRODUCT ADVANTAGES

Prevent wafer breakage by detecting wafer misalignment in Ch.B and deactivate lift motion

Decrease wafer loss and minimize MTTR

Simple design for easy maintenance

High performance with low cost

2-1-20

2.1 SEMICONDUCTOR2.1.21 Susceptor Housing



2-1-21

Susceptor Support Shaft Housing (Collet)

Susceptor Housing

PROBLEMSSusceptor’s Unstable Rotation (Wobble & Jerk)

• Pre heat ring breakage due to contact with susceptor.

• Large size Particle increase.• After PM, Un-repeatability process data.• Limitation of improve uniformity.• System Up-time issue due to frequent

PM.

SOLUTIONNew design improve shaft housing installation

• Improve thickness uniformity.• Stable process result.• Good repeatability process data.• Cost deduction by process kit lifetime

increase.

KYL Service:

Provide part and installation service.

Chamber PM and Trouble shooting.

Provide the best solution.

NEW DESIGN: SUSCEPTOR SUPPORT SHAFT HOUSING (COLLECT)

Reduced diameter coupled with splines acts as spring:• Eliminates clearance between susceptor

support shaft and collet (currently = .005” nominal)

• Evaluator in customer site completed.• 3 Chambers installation completed



Susceptor Housing

WOBBLE MEASUREMENT TEST

SCOPE

RETURN

BRIEF HISTORY

TEST METHODOLOGY

TEST SETUP

RESULT

To improve the Rotation Design

To achieve a wobble of less than +/- 0.020 in both the Vertical and Horizontal directions.

A EPI rotation unit has been modified to include the newly designed Susceptor Support Shaft Housing that has a collet end. This collet feature was introduced to achieve a tight fit and a support point for the susceptor shaft into the housing. It is believed that the loose fitting of the susceptor shaft is contributing to the wobble issue.

• The Rotation units were installed and leveled as accurately as possible.• The Radial Distance of the susceptor from the chamber wall was

measured diagonally at four different points to ensure concentricity and leveling of the susceptor.

• One system 3 chambers A,B,C was installed in customer Fab.• Initially, the rotation unit equipped with the collet design housing

was tested for wobble.• The same rotation unit was then re-built with the regular susceptor

housing.• The same person and same tools were used for building the rotation

with the two different housings.• The same process kit (Susceptor shaft, susceptor, Preheat Ring) was

used for the two tests.• The Rotation Unit speed used for both the tests was 70 rpm (it was

easier to measure wobble at higher speed than at the normal operating speed of 34 rpm).

Measured total wobble in the horizontal direction:• Housing with collet wobble~0.015”• Regular Housing wobble~0.045”

2-1-21



Susceptor Housing

IMPROVE SHAFT HOUSING METAL CONTAMINATION RESULT

Chamber A Pass

Date Desc Na Al Fe Cu Ni Ca

21/09/2006 Dep <1 3.9 <1 <1 <1 1.0

21/09/2006 Flipped <1 3.9 <1 <1 <1 1.0

Chamber B Pass


21/09/2006 Dep <1 3.8 <1 <1 <1 1.0

21/09/2006 Flipped <1 3.6 <1 <1 <1 1.1

Chamber C Pass


22/09/2006 Dep <1 2.1 <1 <1 <1 1.0

22/09/2006 Flipped <1 2.0 <1 <1 <1 1.0

Standard & improve housing comparison

Chamber Intrinsics Check

Intrinsic Resistivity > 200ohm-cm

Chamber A Chamber B Chamber C

Point Resistivity (ohm.cm) Resistivity (ohm.cm) Resistivity (ohm.cm)1 1086 2258 9732 2508 4729 19423 2640 3038 17614 2182 3633 18175 1050 1337 8196 1002 1042 7097 2479 4428 18818 2463 4110 17919 1111 1329 864

Average 1836 2878 1395

IMPROVE SHAFT HOUSING INTRINSIC RESULT

2-1-21



Susceptor Housing

STANDARD & IMPROVEMENT OF HOUSING PARTICLE RESULT COMPARISON

Final Particle Added

Chamber S M L Area Total S M L Area Total Total Post-Total Pre

A 0 2 2 1 5 1 1 2 1 5 0

B 1 0 0 1 2 1 0 0 1 2 0

C 1 0 1 1 3 0 3 1 1 5 2

Pre Particle Measurement Post Particle Measurement

Final Particle Added

Chamber S M L Area Total S M L Area Total Total Post-Total Pre

A 1 0 3 3 7 3 2 4 5 14 7

B 2 0 0 2 4 1 3 3 4 11 7

C 1 3 2 1 7 2 5 5 4 16 9

Pre Particle Measurement Post Particle Measurement

Chamber Conditioning (Coat / Etch / Coat first followed by Etch / Coat) + Hot Particle Check (on lightly dope new welfares)

Standard Housing Installation

Improved Housing Installation

STANDARD & IMPROVEMENT OF HOUSING PROCESS RESULT COMPARISON

Ch A 8.42 0.75 3.19 1.56Ch B 8.37 0.81 3.22 1.45Ch C 8.45 0.74 3.23 1.48

Thk (um) %Chamber

ResultsRes (ohm-

cm)%

Ch A 8.39 0.42 3.19 0.93Ch B 8.41 0.35 3.22 0.94Ch C 8.42 0.68 3.23 1.48

Thk (um) %Chamber

ResultsRes (ohm-

cm)%

Standard Housing Installation

Improved Housing Installation

Remark: Ch A&B->Followed QT Procedure / Ch C -> Normal installation.

2-1-21

2.1 SEMICONDUCTOR2.1.22 Heat Exchanger Manifold



Heat Exchanger Manifold

ADVANTAGES OF KYL MANIFOLD

NO IMPROVED ITEM BEFORE AFTER

1Corrective Flow

Reading• Only using indicator• No actual flow rate indicator

• Actual flow rate reading

2Preventive Problem

• Low level sensing of interlock • Only happen at return line

• Able to set alarm for low pressure & high pressure flow

3Preventive

Manifold Leak

• Difficulties of detection due to manifold location is on below system

• Using manual valve O-ring type

• Manifold is place outside the mainframe. Easy to detect manifold hose.

• Using manual ball valve (no leakage)

COMPARISON OF MANIFOLD

Before

(Rev.1)

After

(Rev.2)Remarks

Durability Screw & Bolt TypeWelded Bracket & Holder

The Rev.1 bracket are joined together by screws but Rev.2 is welded type to make it more durable.

RigidnessMade of 5mm metal tube

Made of Stainless Block (5cm by 5cm)

Rev.2 is made of metal block with a 1 inch diameter bore compare to Rev.1 which is a hollow metal block

Non-Corrosive Nickel coated Stainless

Nickel coat is vulnerable to peeling due to long exposure to heat making the metal use easily rusted and corroded

Water-leak free0.2mm Port connectors are thin

0.5mm port connector and welded

Rev.2 is not difficult to welded due to its thickness

2-1-22



VIEW


TOP

A B C D

RETURN SUPPLY

A B C D

2-1-22



VIEW


FRONT

SIDE

RETURN SIDESUPPLY SIDE

2-1-22




WARNING DIAGRAM

ACTUAL VIEW INSTALLED IN THE SYSTEM

MANIFOLD ASSEMBLY PRESSURE DISPLAY ASSEMBLY

2-1-22

2.1 SEMICONDUCTOR2.1.23 PIEZOCON Gas

Concentration Sensor



Piezocon Gas Concentration Sensor

Piezocon Gas Concentration Sensor2-1-23

PIEZOCON® Gas Concentration Sensor

1-Channel PIEZOCON® ControllerDIN Rail & Panel Mount Versions

PIEZOCON® HeatSense® Heater Jacket Controller & Heater jacket, Used to minimize risk of

condensation within sensor head

What it does ?

The Piezocon® sensor measures the concentration of a precursor vapor into a binary mixture with carrier or pushing gas.

What it is used for ?

The Piezocon® sensor is used for monitoring and controlling delivery of precursor vapors or dopant gases.

How it is used ?

The Piezocon® sensor uses its concentration measurement to compute a corrected setpoint for the carrier gas MFC or liquid flow controller keeping the mass transfer rate of the precursor chemical vapor (g/min or moles/min) constant at the desired level.



Features


APPLICATION

2-1-23

1

2

3

4

5

6

7

• Silicon CVD Epitaxy: Si & SiGe• CVD Tools: Applied Materials from Centura,

ASM Epsilon, LPE, etc.

• Compound Semiconductor MO-CVD• MO-CVD Tools: ASET, Veeco Turbo Disk,

etc.• F/O MCVD: Alcatel, Corning, Hitachi Cables,

Lucent, Sumitomo Electrics, etc.

Diffusion doping : POCl3

Silicon Oxide Deposition : TEOS

Wafer Priming : HMDS

Fiber optic glass doping

Many other applications : Barrier layers, Seed metal layers, Dielectric etc.

BENEFITS FROM USING PIEZOCON SENSOR

1. Quantitative measurements (g/min or moles/min) that are directly meaningful to

the process engineers when bringing up and optimizing manufacturing process.

2. Real-time logging and display of critical delivery parameters:

MFC set point and carrier flow rate, precursor vapor / carrier gas concentration,

precursor mass transfer rate.

3. Provides significantly improved wafer-to-wafer and run-to-run process

reproducibility despite bubbler temperature and pressure variations,

or bubbler fill level change.

4. Facilitates tool-to-tool process matching.

5. Provides diagnostic capability to trace precursor delivery issues

6. Facilitates chemical refilling / recharging logistics.



ROCI Calculations

Piezocon Gas Concentration Sensor2-1-23

ITEMS WITHOUT PIEZOCON WITH PIEZOCON

Bubbler refilling frequency 1 time / week 0.78 time / week

Chemical level at time of refilling 30 % 10 %

Refilling duration 1 hour

Requalification duration 1 hour

Lost (non-productive) time 104 hours / year 80.9 hours / year

Cost of lost (non-productive) time $104,000 / year $80,889 / year

Associated labor cost $10,400 / year $8,089 / year

Estimated requalification cost $26,000 / year $20,222 / year

Reduction in out of specs wafer 1 wafer / week

Savings from reduction of out of Specs wafer

$78,000 / year

TOTAL $140,400 / year $109,281 / uyear

Assumptions:Wafer cost $1,500Tool downtime cost $1,000 / hourLabor cost $100 / hour

When precursors are generated from bubblers:



Characteristic by Application


PIEZOCON COMPETITIVE CHARTS

2-1-23

Liquid Vapor Controller PIEZOCON

Manufacturer QualiFlow (France) Lorex (USA)

Principle Dual thermal MFC Ultrasonic measurement

+Patented maximum likelihood TOF estimation

+Patent mixing rules (@physical property of gas

Accuracy +/- 4.0% of full scale 0.005% full scale

Sensor-to-Sensor reproducibility

- 0.0021%

Measurement repeatability

+/- 0.5% of full scale 0.0001% resolution

Concentration range - 0~100%

Pressure range 10 ~ 40 psi (517 ~ 2,068 torr) 50 ~ 8,000 torr

Gas flow range Up to 40 g/min 0 ~ 3 lpm (15, 50, 100 lpm)

Temperature range 15 ~ 35(43) deg. C 0 ~ 120 C

Measurement time/ measurement rate

10 s Up to 10Hz

Form factor - 124 mm VCR face-to-face

* LVC sensor is expensive in servicing and maintenance



Process


PIEZOCON CONTROL PROCESS

2-1-23

One-time Piezocon set-up1. measure and enter actual concentration in units of grams/SL at normal process conditions and2. enter the carrier gas MFC’s full scale flow rate in SLPM.

These two steps allow Piezocon to interpret tool’s existing recipe setpoint as desired mass flow rates. For example, measured and set 0.22 g/SL as operating concentration and 1 SLPM as MFC full scale.

0.22 g 1 SLGrams/min FS 0.22 g/min

SL min= =

For ever after, if the Piezocon receives a 2.0 Volt (40%) setpoint it interprets this as a command to maintain 0.4 x 0.22 g/min = 0.088 g/min delivery rate independent of changes in bubbler temperature,pressure and liquid level.

Given a setpoint of 0.088 g/min The Piezocon computes the corrected MFC setpoint as

POCl3 setpoint Corrected MFC Setpoint

Measured Concentration=

Suppose tool’s setpoint is 2 volts and measured concentration dropped from benchmarked 0.22 g/SL to 0.15 g/SL or 2.9333 Volts

0.088 g/min Corrected MFC Setpoint 0.587 SLPM

0.15 g/SL= =



Details


PIEZOCON GAS CONCENTRATION SENSOR

2-1-23



Details


TCS DELIVERY CONTROL

2-1-23

Bubbler temperature UP = =

Bubbler pressure = UP =

Bubbler liquid level = = DOWN

Precursor vapor / carrier gas Concentration UP DOWN DOWN

Flow rate = = =

Mass transfer rate UP DOWN DOWN

Mass transfer rate = concentration x flow rate



Details


TCS DELIVERY CONTROL (ON CENTURA)

2-1-23

Growth Rate Control with Piezocon Sensor Installed on Chamber A Only

(MFC Flow rates for Chambers B & C Were Manually Readjusted After Each Run

Based on Measured Thickness Data)

3.1

3.15

3.2

3.25

3.3

3.35

3.4

1 5 9

13

17

21

25

29

33

37

41

45

49

53

57

61

65

69

73

77

81

85

89

93

Wafer Sequence

mic

rons/m

inute

Ch A (Piezocon)

Ch B

Ch C

Piezocon Performance – normalized epitaxy thickness Before Installation – After Installation – Upon Desabling

E1 Normalized Thickness

0.90

0.91

0.92

0.93

0.94

0.95

0.96

0.97

0.98

0.99

1.00

1.01

1.02

1.03

1.04

1.05

1.06

1.07

1.08

1.09

1.10

0 200 400 600 800 1000

Data points

Norm

alized T

hic

kness

Centura Chamber -A- Thickness Piezocon Control

Center Point Data September 2002

0

5

10

15

20

25

30

35

40

45

50

8.5

5

8.6

4

8.7

3

8.8

2

8.9

1 9

9.0

9

9.1

8

9.2

7

9.3

6

9.4

5

9.5

4

9.6

3

9.7

2

9.8

1

9.9

9.9

9

microns

Fre

qu

en

cy

Mean = 9.246 um

Stdev = 0.016 um

USL = 10.05 um

LSL = 8.55 um

Cp = 15.99

n = 96

Centura Chamber -B- Thickness Standard Control, No Piezocon Control


0

2

4

6

8

10

12

14

8.5

5

8.6

4

8.7

3

8.8

2

8.9

1 9

9.0

9

9.1

8

9.2

7

9.3

6

9.4

5

9.5

4

9.6

3

9.7

2

9.8

1

9.9

9.9

9

microns

Fre

quen

cy

Mean = 9.143 um

Stdev = 0.076 um

USL = 10.05 um

LSL = 8.55 um

Cp = 3.289

n = 96

Centura Chamber -C- Thickness Standard Control, No Piezocon Control


0

1

2

3

4

5

6

7

8

8.5

5

8.6

4

8.7

3

8.8

2

8.9

1 9

9.0

9

9.1

8

9.2

7

9.3

6

9.4

5

9.5

4

9.6

3

9.7

2

9.8

1

9.9

9.9

9

microns

Fre

qu

ency

Mean = 8.971 um

Stdev = 0.105 um

USL = 10.05 um

LSL = 8.55 um

Cp = 2.384

n = 96

Control of TCS delivery on Centura tool with Piezocon.Epitaxy layer thickness distribution– chamber A with Piezocon; chambers B & C without Piezocon –



Details


CVE EPITTAXY PRECURSOR DELIVERY CONTROL (ON ASM EPSILON)

2-1-23

ASM Epsilon field upgrade with Piezocon: Schematics

Typical ASM Epsilon Configuration



Details


MIS SOLUTION FOR DELIVERY CONTROL OF DOPANT

2-1-23

MIS solution

The “Mixing Interface System” is designed to be installed between the premix tank or gas bulk delivery system and the gas delivery cabinet, minimizing costly and disruptive re-plumbing of the gas delivery system.

Direct Dopant Delivery Solutions

The Direct Dopant Delivery solution delivers the required dopant mass transfer (mg/min) rate with excellent stability and tank-to-tank reproducibility while avoiding any waste of chemical to vent.

ORIGINAL DELIVERY SYSTEM

The desired 0.95 mg/min deliver rate was only achieved when incoming concentration was precisely 3%, else the process would drift requiring frequent recipe adjustments to MFC #5’s set points, plus re-qualification of tool following every dopant cylinder change.



Details


DIRECT DOPANT DELIVERY SOLUTIONS

2-1-23

IMPROVED DELIVERY SYSTEM

The desired 0.95 mg/min is achieved regardless of the incoming concentration, meaning no process drift over the life of the dopant cylinder or no process shift following a cylinder change. Additionally, no dopant is wasted to vent and the BPR and MFC’s # 3 & 4 are eliminated.



VIEW


PIEZOCON SENSOR SPECIFICATION

2-1-23

ITEM DESCRIPTION

Range of Concentration 0% to 100% (binary mixture)

Repeatability of Measurement 0.0007% FS 1s for TMIn/H2, 0.7%conc @250torr[2,5]

Sensor to Sensor Reproducibility 0.0021% FS [3] for TMIn/H2, 0.7%conc 250torr[4,7]

Accuracy of Measurement 0.005% FS for TMIn/H2, 0.7%conc @250torr[4,6]

Maximum Operating Pressure 8000 torr (150 psia.)

Minimum Operating Pressure 75 to 100 torr (typical); 25 – 75 torr (special low pressure)

Range of Flow Rates 0 - 3lpm, - 15lpm, - 50lpm, - 100lpm

Temperature Range Sensor 0oC - 100oC

Temperature Range Controller 0oC - 40oC

Pressure Connections Standard VCR male (Cajon )

Leakage to Atmosphere <1x10-9 cc/sec of He

VCR face-to-face dimension 124mm (4.88”)

Weight (Sensor) 1.3Kg.

Weight (Electronics) 1.0Kg, 1-Channel Controller; 2.8Kg, 4-Channel Controller

A Bx x−



Set Up


HARDWARE DESCRIPTION

2-1-23

As semiconductor manufacturing processes become tighter each generation of devices around, the needs for precise control of process gas delivery become more apparent.

The PIEZOCON® gas concentration sensor is a very mature sensor with over 850 units in the field worldwide that demonstrates an excellent capability - repeatability, accuracy and matching - for controlling the delivery of precursors to CVD and MO-CVD tools.

The PIEZOCON® offers significant benefits to equipment and process engineers: diagnostic capability and precise delivery control for tool qualification and operation.

2.1 SEMICONDUCTOR2.1.24 Equipment Refurbishment

& Upgrade Services

Brand : KYL Resources Roles : Product & Service ProviderProducts : Engineering Services, Consultant,

Semiconductor, Trading, Chemical

We can provide any level of refurbishmentor installation that the customer’s require,or build up, refurbish, de-install, install andturn-on, to the most comprehensiverebuilding available anywhere

BUSINESS AREA

Refurbishment Installation, De-install Modify and Upgrade Retrofit General gas box

STRATEAGE

More than 14 years of experienced engineer’s support product manufacturing and maintenance of equipment.

Well organized and systemized network will useful from Fab-in to Prove-in build-up the hardware and Process support.

Overall Services

2-1-24Equipment Refurbishment

& Upgrade Services


Equipment Refurbishment

& Upgrade Services

EQUIPMENT

Services Provided

ENGINEER SERVICES

AMAT ENDURA AMAT CENTURA AMAT PRODUCER P5000 LAM RAINBOW & ALLIANCE

START UP & INSTALLATION RETROFITTING DE-INSTALLATION RELOCATION

[Equipment Start up Services]

• Tire 0 ~ Equipment Facility Hook-up• Tire 1 ~ Hardware Set-up and Verification• Tire 2 ~ Process Set-up using BKM Recipe

a. Mechanical & In-film particle checkb. Intrinsic properties testc. Process optimization

[Labor Services]

• PM & CM ~ Regular Preventive & Corrective maintenance service

• Hardware & process trouble shooting

[Part Services]

• Provide consumable and non-consumable parts

Kyung Lim has its own min-lab for refurbish work that comes with a utility / facility like in the fab

The work includes changing the cable refers to refurbish damaged, replace part of the old and not working, function test, calibration etc.




2-1-24


& Upgrade Services

EQUIPMENT REFURBISHMENT PROCEDURE

MF refurbishmentInstall chamber on MFInstall componentsGas Panel Configure

System Move In Remove Chamber from MF Parts Refurbishment System Facilitation

System final test Source Inspection Packing & Ship OutFunction Test

WW01 WW02

WW04WW05WW06

WW07WW08




2-1-24


& Upgrade Services

REFURBISHMENT FLOW




2-1-24

2.1 SEMICONDUCTOR2.1.25 Hook-Up Services

Hook-Up Services

In Semiconductor, LCD, Medicine Manufacture, PDP, Wafer, Module Factory and

etc., the sub main valve of the primary piping which interconnects to the secondary

piping of the in-line production equipment, this secondary piping is called Hook-up.




2-1-25

Hook-Up Services

WATER LINE

PCW DW, NW

WASTE LINE

PR, STRIPER,IPA, CR, AL

EXHAUST LINE

Heat/ General/ Acid/ Organic/ Combustible exhaust

DRAIN LINE UPW LINE

Ultrapure water (18.2ΩM)Acid, Organic, Neutral, ABS




2-1-25

Hook-Up Services

Organic, InorganicPN2, GN2, Par, PH2, PO2,PHe, CDA

Process Vacuum, Hi Vacuum

GAS LINE CHEMICAL LINE

VACUUM LINE

MATERIAL AND CONNECTION METHOD (GAS)

SUS316L Fitting SUS316L EP V/V Line Filter SUS316L BA Fitting




2-1-25

Hook-Up Services

MATERIAL AND CONNECTION METHOD (EXHAUST)

SUS+PTFE Coating SUS Pipe (AP) SUS Clamp SUS Duct

MATERIAL AND CONNECTION METHOD (DRAIN)

C-PVC Materials PVC Materials SUS 304 Fitting SUS 304 Flange

MATERIAL AND CONNECTION METHOD (PCW, NW, PV & UPW)

SUS 304 Pipe SUS 304 V/V PVDF Fitting PVDF V/V




2-1-25

2.1 SEMICONDUCTOR2.1.26 Heat Jacket

Heat Jacket

Hybrid PTFE Heat Jacket

JACKET APPLICATION• VacuumLine & various piping for processing of

semiconductor

• DIFFUSION, ETCH, CVD & PVD AREA

• PUMP FORE-LINE & EXHAUST-LINE

Division External Lining Insulation HeatingElement

Fastener Bimetal

Bimetal PTFE 100 % (Sheet Type)

PTFE 100% (Fabric Type)

E-GLASSFELT

Glass coatedNi-Cr heating

wire

Snap & Velcro, Hook and Loop

PEPI &Thermik

Fabric Type

(PTFE)

PTFE 100 % (Sheet Type)

PTFE 100% (Fabric Type)

E-GLASSFELT

Glass coatedNi-Cr heating

wire

Snap & Velcro, Hook and Loop

PEPI &Thermik

PTFE 100% SHEET

GLASS FIBER

Glass BraidNi-Cr heating wire

PTFE 100% FABRIC

E-GLASS FELT

Thermik Bimetal

Hybrid Heaters are the result of refinement from the PTFE cloth heater previously available. Hybrid Heaters wraps the outer surface with PTFESheet whilst maintaining the PTFE cloth inner surface, in doing so increased the durability as well as the adhesion to the vacuum line. Hybrid Heater offers excellent thermal uniformity with easy installation.

HYBRID TYPE DIFFUSION PART - CX 5000 LARGE VAC.

One Module Mini Temp Controller

Product No. : SC001A-CX5000-L

Line Heat Jacket

• Power : 100V, ACT : 150, Bimetal

• T/C : K-Type Sensors / Hubbell Connector

Mini Temp Controller TYPE

• Total Spec : 20A




2-1-26

Heat Jacket


Product No. : SC001A-CX5000-M

Line Heat Jacket





HYBRID TYPE DIFFUSION PART - CX 5000 MINI VAC.

HYBRID TYPE DIFFUSION PART – ALD_NIT VAC.

Product No. : SC001A-ALD_NIT

Line HeatJacket


• T/C : K-Type Sensors

Hubbell Connector



ALD PUMP Fore-Line Jacket

POWER: 208V, ACT 150 8CH Temp Controller





2-1-26

Heat Jacket

HYBRID TYPE DIFFUSION PART - FORMULA VAC.

One Module Mini TempController

Product No. : SC001A-FORMULA

Line Heat Jacket

• Power :115V, ACT : 180, Bimetal

• T/C : K-Type Sensors

Hubbell Connector



HYBRID TYPE DIFFUSION PART - 303i VAC.

Product No. : SC001A-303i

Line Heat Jacket


• T/C : K-Type Sensors / AMP Connector

• Temp Controller : Monitoring System Touch Monitor(Mitsubishi)


HYBRID TYPE DIFFUSION PART - CX 3000 Large VAC.

Product No. : SC001A-CX3000-L

Line Heat Jacket

• Power :100V, ACT : 150, Bimetal

• T/C : K-Type Sensors /

4CH Temp Controller






2-1-26

Heat Jacket

SILICONE RUBBER MOLDING TYPE DIFFUSION PART - CX 5000 Large BATCH VAC.

SILICONE RUBBER HEATING JACKET

Heating Solutions specifically designed for Gas & Vacuum line.

Silicone Rubber Molding Heaters are constructed with a

plate-typed heater injecting LSR (Liquid Silicone). The heaters

can be fastened with metal snap button or velco strips.

Division External Lining Insulation Heating Element

Fastener Bimetal

SILICONE RUBBER

(MOLDING TYPE)

SILICONE SHEET SILICONE SHEET Silicon rubber(LSR)

Ni-Cr heating wire Snap PEPI & Thermik

Silicon rubber

sheet

Silicon rubber (LSR) Heating

Wire

JACKET APPLICATION• Vacuum Line & various piping for processing of

semiconductor

• DIFFUSION, ETCH, CVD & PVD AREA

• PUMP FORE-LINE & EXHAUST-LINE

Product No. : SC001B-CX5000-L

Line Heat Jacket






2-1-26

Heat Jacket

SILICONE RUBBER MOLDING TYPE DIFFUSION PART - CX 3000 Large BATCH VAC.

Product No. : SC001B-CX3000-L

Line Heat Jacket



Product No. : SC001B-CX3000-M

Line Heat Jacket



SILICONE RUBBER MOLDING TYPE DIFFUSION PART - CX 3000 Mini BATCH VAC.

SILICONE RUBBER MOLDING TYPE DIFFUSION PART - FORMULA VAC.

Product No. : SC001B-FORMULA

Line Heat Jacket


• T/C : K-Type Sensors / Hubbell Connector Mini

Temp Controller TYPE

SILICONE RUBBER MOLDING TYPE DIFFUSION PART - 303i VAC.

Product No. : SC001B-303i

Line Heat Jacket







2-1-26

Heat Jacket

Temperature Controller Unit

MINI TEMPCONTROLLER

MINI TEMP CONTROLLER (MTC) is individually applied to the various heaters. The integrated temperature

control monitors and assures the accuracy of the set-point for each heater jacket. The electric current of

MTC is up to 3- Ampere and MTC is regulated by PID control.

Multi Channel (System) Controller

MULTI-CHANNELED SYSTEM CONTROLLER can be customized for various options. MCSC's channel can be

designed with 2-channel in mind, and can be expanded up to 16 channels. MCSC offers the PID control

(quick/slow), auto-tuning and alarm fuction. It can also be equipped with an optional 8-inch touch screen

display which provides integrated controling options.

THEMPERATURE CONTROLLER UNIT

1CH TYPE

MINI TYPE

3CH TYPE 4CH TYPE

4CH TYPE12CH TYPE8CH TYPE

2CH TYPE




2-1-26

Heat Jacket

VALVE OUT JACKET

Line Heat Jacket

• Power : 100V/115V, ACT : 190, 220 , Bimetal


NITRIDE NIT / 100V, 305W

FORMULA TEOS / 115V,

315W

INDY 303i / 100V,315W

NITRIDE NIT /100V, 141.4W

FORMULA TEOS / 115V,

176.2W

INDY 303i / 100V,161.6W

NITRIDE NIT / 100V/205W,50W,40W

FORMULA TEOS / 115V/205W, 50W,4

0W

INDY 303i / 100V/205W,125W,40W

Single Unit

PTFE

Line Heat Jacket

• Power : 100V/115V, ACT : 190, 220Bimetal


100V 102W 100V 102W

Original Ring heater Localization (Molding Type) Ring

Heater

VALVE RING HEATER




2-1-26

Heat Jacket

OTHER JACKETS

Elbow + Straight Jacket Bellows + Straight Jacket Valve Jacket

Straight Jacket

Straight Jacket Clamp Jacket(INSULATION) Right Angle Elbow Jacket

Elbow + Straight + ELbow Jacket

Clamp Jacket Valve +TJacket

Elbow Jacket

Flange Jacket Straight Jacket Elbow +Straight + Elbow Jacket




2-1-26

Heat Jacket

OTHER JACKETS

ClampJacket(INSULATION)

Clamp + StraightJacket

3 Way Valve Jacket

M1Jacket

Aluminum Block Valve Jacket

M1Jacket

Aluminum Block Valve Jacket

Gas Line Jacket

Vent Jacket

3 Way Valve Jacket PanelJacket

Bellows + Straight Jacket




2-1-26

2.1 SEMICONDUCTOR2.1.27 TMAH Chemical

Distribution System

TMAH Chemical Distribution

System

TMAH PROJECT ALLIANCES

Brand : KYL Resources Roles : Collaboration with partnersProducts : Engineering Services, Consultant,



2-1-27


System



TMAH BY HANTOK CHEMICALS


2-1-27


System

TMAH BY HANTOK CHEMICALS




2-1-27


System

CHEMICAL DISTRIBUTION BY STI

Applications

- Bulk chemical supply for semiconductor andFPD (TFT LCD, PDP, OLED)

- Supply of acid, alkali and solvent- Compatible for the drum charge system and

the tank lorry charge system

Features

- Turnkey Package1)Chemical delivery module2)Piping, cabling (signal)3)Valve manifold box (VMB)4)Monitoring system

- Easy to operate with touch screen- Automatic/semi-automatic/manual mode

with PLC- Optimal design by 3D CAD for easy

maintenance- Particle and metal impurities controlled to- Customer’s quality standard- CO2 fire extinguisher and auto fire damper- Provided for solvent- Warranty covers preventive maintenance

service- Every 6 months- ISO 9001 and ISO 14001 certified

Chemical Delivery System




2-1-27


System

CHEMICAL DISTRIBUTION BY STI




2-1-27

2.1 SEMICONDUCTOR2.1.27 Part Clearing & Coating

Brand : KTS Co., Ltd. (Korea)Roles : Agent Distributor (Malaysia)Products : Coating & Part Clearing, DC Motor

Manufacture, Automation Facility

Part Clearing & Coating

Spray Coating Mechanism

Adhesion Mechanism

Liquid coating material in flight Impact on surface Transfer of heat to the base material Solidification and contraction of the

coating material Mechanical bonding Local diffusion or fusion (during heat

treatment)


2-1-28


Special Material Coating

(UC/BONO/SH/Silicon)

• Reduced Porosity and micro crack inside the

coating layer

- better plasma & chemical resistance• Higher Surface Roughness (Ra)

compared to Y2O3 coating layer • Hold up more particle• Minimize gas residue trapped inside the

pore in coating layer

New Tech. & NANO Structure Coating (N1,

NOVA)

• Less than 1% Porosity High Density Coating

• Reduced Porosity and micro crack inside the coating layer

• Particle and Defect Control from part surface

• Excellent Plasma Resistance Surface

Corrosion &

Erosion Protection

PLASMA SPRAY COATING (Y2O3 / Al2O3)




2-1-28


COATING

UC Coating This coating has high hardness and density, compared to Y203 by reducing internal defects (loser porosity and micro crack) Improved chemical and plasma resistance

HD Coating Minimized condition change inside the chamber by making a coating layer that can material quality of Y203

Reduced particle from raw material & plasma damage and out gassing

HDS 1,2 Coating Coating which has big improvement on plasma resistance and surface stabilization by laminating high density coating on APS coating layerStabilized Particle Trend in chamber with improving plasma resistance

HP Treatment Shielded pore and connected channel with outside by sealing open pore and micro crack inside coating layerReduced out gassing with covering micro channel




2-1-28


ANODIZING




2-1-28


ANODIZING




2-1-28


U2 COATING AREA & SPECIFICATION




2-1-28

2.2 CIVIL,

STRUCTURAL

& ARCHITECTURE2.2.1 Rubber Flooring

Brand : RM LTD (KOREA)Roles : Sole Agent Distributor (Malaysia) Products : Rubber Tiles/Sheet

Rubber Flooring

ECO FRIENDLY

NOISE DEDUCTION GOOD SLIP RESISTENCE

VARIOUS PERFORMANCE & CHOICES

FIRE RESISTENCE LONG LIFETIME & HYGIENIC FRIENDLY

TILE STAIR TREAD

ROLL OTHER CHOICES

• Thickness : 3~9.5mm

• Extreme Durabil i ty

• Design : Solid, Chips, Cork chip

• Competes with Stone and Terazzo in

heavy traffic area

• Thickness : 1200, 1500, 1800, 2100mm

• One piece stair tread, easy installation

• Design : Solid, Chips

• Competes with Stone and Terazzo in

Education and Office

• Thickness : 2~5mm

• Embo, Smooth surface

• Design : Solid, Chips

• Competes with PVC and Linoleum in

Healthcare and Education

• ESD : 10^6~10^8

• Transit

• Marine : Certif icate on processing

• NBR for oi l resistance

• Sports Interlocking

• Cold welding

[FEATURES]

[TYPES]

Health care : Roll

- Bacteria, Fire, ESD

Education : Tile, Stair tread

- Low VOC

- Non slip

- Fire

Transportation :Roll

- Low VOC, Specification(Fire)

Sports : Tile

- Spike proof

IBS Building : Tile

- ESD ,VOC

[APPLICATION]

• Hospitals• Office Buildings• Corridors• Emergency Exits• Hospital Rooms• Intensive Care Units,

etc.

• Airports • Schools • Art Halls • Museums • Libraries • Subway Stations • Industrial Facilities • Power Stations, etc.• Sports Complex Indoor Floor• Ice Rink• Fitness Club, etc


2-2-1

Rubber Flooring


Tile type rubber flooring with multifunction

Rubber Tile: Solid Round 3T/ 4T

Rubber Tile: Solid Hammered 3T


Rubber Tile: Chip Hammered 3T



2-2-1

Rubber Flooring


Rubber Tile: Chip Round 3T/ 4T


Rubber Tile: Chip Stone 3.5T


Rubber Tile: Chip Cork 3T



2-2-1

Rubber Flooring


Rubber Tile: Stair 3T/ 5T


2100MM

Rubber Roll: Roll Solid Embo 2T/ 3T

RM5000 RM4300 RM1000 RM3700 RM4200 RM8000 RM4100

RM9000 RM32000 RM3000 Roll type rubber flooring suitable for health care

Rubber Tile: Roll Chip Embo 2T/ 3T

RC5043 RC4043 RC4143 RC8098 RC8191 RC8228 RC9091

RC9121 RC9221 RC1021 RC3021 RC2031

Roll type rubber flooring suitable for health care


2-2-1

183

Rubber Flooring


Rubber Floor for Sports : Chip Hammered 9T,9.5T

Rubber flooring for a wide range of sports facilities

Rubber Floor for Sports : Chip Hammered, 6T

Rubber flooring for a wide range of sports facilities


2-2-1

South Korea

East MalaysiaWest Malaysia

Singapore

Johor Office:

No. 4, Jalan Kempas2/3,

80250 Johor Bahru, Johor, Malaysia

Headquarters:

Block A2, ICOM Square,

Lot No. 11056, Section 64,

KLTD, Jalan Pending, 93450

Kuching, Sarawak, Malaysia.

Materials Gallery:

SL1, Lot 188, Soho East,

Jalan Wan Alwi, 93350

Kuching, Sarawak, Malaysia

Bintulu Office:

Industrial Lot 5 (2666) Lot

2544 Kidurong Gateway,

Tanjung Kidurong. 97000

Bintulu, Sarawak, Malaysia

Singapore:

32 Ang Mo Kio Industrial

Park 2, 06-07 Sing

industrial Complex,

Singapore 569510

South Korea:

No.1002, Cheonho-daero 83-

gil, Dongdaemun-gu, Seoul,

Republic of Korea

MALAYSIA OVERSEAS

KYUNGL LIM RESOURCES

CONTACT

Mr. Yoon Yo Gung (Charlie)CEO

E: [email protected]

T: +60-82-266 523 (ext:108)

M: +60-13-360 3866

Ms. Musfirah KaddirProject Manager


T: +60-3-266-523 (ext: 110)

M: +60-13-570 5591

Ms. Chloe Eunhae HanManager


M: +60-11-1423-1004

52-1, Jalan Musytari An

U5/AN, Subang Pelangi,

40150 Shah Alam, Selangor,

Malaysia

Tel : +60-82-266 523

Fax : +60-82-266 525

www.kylresources.com

Documents

KYUNG LIM RESOURCES SEMICONDUCTOR CATALOGUE...Varian High Current 120-10, 160-10, 120XP, 160XP, E1000/HP, VIIsion 80/200, VIIsta80 Medium Current CF-3000, 350D/DE, 300XP, E220/500