Kulicke & Soffa Model 4524 Manual Ball Bonder OPERATING …

DOCUMENT: Kulicke & Soffa Model 4524 Ball Bonder OPERATING PROCEDURES Version: 1.0

Kulicke & Soffa Model 4524 Manual Ball Bonder OPERATING MANUAL

Version: 1.0 March 2012

UNIVERSITY OF TEXAS AT ARLINGTON

Nanofabrication Research and Teaching

Facility

DOCUMENT: Kulicke & Soffa Model 4524Manual Ball Bonder OPERATING PROCEDURES Version: 1.0

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TABLE OF CONTENTS

1. Introduction…………………………………………….…………...2

1.1 Scope of Work…………………………………….…......3

1.2 Description…………………………………….…….……3

1.3 Safety……………………………………………....……..3

2. Hardware..............................……………………………….….....5

3. Requirements……………………………………..….….…….…..5

3.1 Training…………………………………….……..…...….5

3.2 System Restrictions………………………...……..…....5

4 Operating Procedures.………………………..…..…………......6

4.1 System Pre-Checks………………………….…...........6

4.2 Kulicke & Soffa Model 4524 Ball Bonder operation……7

4.3 Vertical wire Feed and Creating a Ball………………8

5 Recipes…….………………………..…..……………….…..……14

5.1 Recipe Guidelines......................................................14

1.0 INTRODUCTION

1.1 Scope

These procedures apply to the Kulicke & Soffa Model 4524 Manual Gold Ball Bonder. All maintenance should follow the procedures set forth in the manufacturer’s maintenance and operations manuals. This document is for reference only.

User’s must also receive training and be authorized by trained Nanofab staff before operating this equipment

1.2 Description

The Kulicke & Soffa Model 4524 Manual Gold Ball Bonder is an advanced bench-top gold ball bonder capable of ultrasonically bonding gold wires from 18 - 75 micron. A motorized Y axis with auto-stepback provides controlled wire length and repeatable loop formation. In addition, the system has a large working area and table motion, with excellent Z axis clearance, for bonding small through large devices. This system features electronic dial control for bonding parameters, ergonomic Multi Mouse for bonding head positioning and motorized Y table control, temperature controller to control the temperature of the heated work holder and an overhead microscope to provide up to 85° view of the working area.


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1.3 Safety

1.3.1 This tool is connected to HIGH VOLTAGES. The model 4524 must be connected to the Main Power source through a Earth Leakage Circuit Breaker. Never perform any maintenance functions while the 4524 is in operation. Always power down the system first and remove the AC plug from the wall as well. The Back Safety Cover should only be opened after powering down the machine. The safety panels should not be remove or bypassed or there is a risk of electrocution! Read carefully all warnings given in the Maintenance Manual before beginning any maintenance work. If you encounter any electrical malfunctions contact staff immediately.

1.3.2 Always keep your hands out of the Working Area while the Bonding Head is in operation.

1.3.3 Never touch the Heated Workholders with your hands or any material with low melting point. The maximum temperature of the Heated Workholder is limited to 250°C. Wait until the heated Workholders are less than 50°C before removing your sample.

1.3.4 Beware of touching tools such as tweezers, scissors, screw drivers as they may have

sharp edges

1.3.5 Specific Precautions for Negative Electric Flame Off ( N.E.F.O)

Do not touch the electrode or wire during bonding or when manually firing the N.E.F.O. The system produces a spark between the N.E.F.O electrode (wand) and the gold wire.

Persons with abnormal heart conditions or artificial heart simulation devices ( i.e pace makers) should not operate or service this equipment.

Do not open the N.E.F.O box, if it becomes necessary to open the N.E.F.O box unplug the machine power cable and wait at least five minutes.

Use High Voltage techniques at all times when handing the N.E.F.O box.

N.E.F.O Spark N.E.F.O. wand, tool tip and gold wire N.E.F.O wand


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2.0 HARDWARE

2.1 Gold wire only 18-76um diameter ( 0.7- 3.0 mil ). 90° wire feed .

2.2 Bonding Area 152 mm x 152 mm ( 6” x 6” ). Table motion 140 mm (5.5”) to 14 mm (0.55”). Z travel 9.1 mm (360 mil).

2.3 Ultrasonic System : High Q 60 kHz transducer. 1.3 Watts to 2.5 Watts.

Bonding Force : 10 – 60 gr . Bonding Time : 10 -100 ms / 10 -100ms .

2.4 Ball formation system: Negative EFO ( N.E.F.O ). Missing ball formation indicator and auto stop.

2.5 Manually height-adjustable heated Workholder with temperature control up to 250°C ±0.5°C .

2.6 Multi Mouse single hand integrated control for bonding positioning, Semi/Auto and Manual Z control, Stitch mode operation to perform any number of consecutive stitch bonds.

2.7 Microscope and eyepiece for zoom and focusing .Fiber optic illumination and spotlight .

3.0 REQUIREMENTS

3.1 Training

All users must be trained and authorized on the Kulicke & Soffa Model 4524 Manual Gold Ball Bonder to use this system. Training is supplied by a Nanofab staff member please contact the tool owner to schedule training.

3.2 System Restrictions

3.2.1 Users are not allowed to perform any maintenance functions, calibrations, machine adjustments, bonding tool tip or wire diameter changes. Contact staff for any process or maintenance issues that arise.

3.2.2 This requires a NanoFab Management System reservation before using.

http://nanofabreservation.uta.edu/

http://nanofabreservation.uta.edu/


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3.2.3 Read any posted NanoFAB Engineering Change Notices (ECN) for any hardware,

process or safety changes before running the tool.

3.2.4 Before running the bonding tool attach your device (chip) to a suitable electronic package or a larger size chip carrier using high temperature adhesives. http://www.henkel.com/com/content_data/180534_LT5013_SemiCondSingle.pdf http://www.ame.com.tw/English/Datasheet/ame8800.pdf

3.2.5 Do not change the BALL SIZE dial, it is set at 3 ( ~ 3x wire diameter)

3.2.6 Do not exceed the following Bonding Parameter Dial Change Limits :

o Power : 8 (note: For 1st bond in the device pad area you may want to use the minimum setting to produce a good bond with minimum device stress/force )

o Time : 6 o Force : 8

Top row = 1st

Bond settings Bottom row = 2nd

Bond settings

http://www.henkel.com/com/content_data/180534_LT5013_SemiCondSingle.pdf

http://www.ame.com.tw/English/Datasheet/ame8800.pdf


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3.2.7 Do not exceed the following Process Parameter Dial Change Limits:

o Loop : 10

(note: : Loop depends on application. Smaller pad to termination distance smaller Loop, longer pad to termination distance longer Loop.)

o Tail : ≥ 3 (note: Tail length needs to be at least 3 for the N.E.FO to generate a ball.)

o Ball = 3 (note: Do not change, Ball set at 3 for the N.E.FO to generate a ball.)

3.2.8 After powering ON the machine wait at least 30 minutes until the machine and

Workholder warms up. 3.2.9 If the system diagnostic SHORT or OPEN LED occurs before or during a bond

sequence notify Nanofab staff and proceed to section: 4.3 Vertical Wire Feed and Creating a Ball

3.2.10 The Multi Mouse is used to make fine adjustments to the position of the Workholder/Bonding pad under the capillary through a mechanical linkage at 6:1 ratio. The Multi Mouse motion is only Front to Back (not left to right).


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4.0 OPERATING PROCEDURES

4.1. System Pre-Checks

4.1.1. Check to ensure all Safety Panels and Covers are installed.

4.1.2. Check to ensure the Workholder is cool, if not let it cool 30 minutes before setting Workholder height or mounting a device.

4.1.3. Check to ensure the Workholder Heater and TC harness in connected to the panel

connectors.

4.1.4. Check to ensure the Workholder is at its minimum height by holding the top of the Workholder and turning the Workholder Base CCW until it stops.

Workholder Base Turning Workholder Base CCW

4.1.5. Check to ensure the capillary (white color bonding tool tip) is inserted.

4.1.6. If any System Pre-Checks are not in specification (except 4.1.2 ) call Nanofab staff

to check.


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4.2. Kulicke & Soffa Model 4524 Manual Gold Ball Operation: Workholder Height Adjustment / Heater Operation/ Bond and Process Dial Settings/ Device Bond Pads Wire Bonding

4.2.1. If you have not completed the System Pre-Checks in steps 4.1.1 – 4.1.5 then you must complete those before proceeding.

4.2.2. Turn the front panel Main Power switch ON. Check to ensure that the 1st and 2nd

indicators are both ON . Wait several seconds until the 2nd indicator goes out.

Check to ensure that the 1st and 2nd indicators are both ON. Wait several seconds until the 2nd indicator goes out.

4.2.3. Test the ultrasonic circuit/transducer is working by holding the TEST switch in the down position and check that the U/S indicator is ON. Release the TEST switch after the indicator goes ON.

Check to ensure that the U/S indicator is ON

4.2.4. Turn the work area spot lamp switch to ON.


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4.2.5. Turn the N.E.F.O. switch to ON. If the N.E.F.O. switch is not ON the spark and gold ball cannot be produced . If the system diagnostic SHORT or OPEN LED occurs at start up or during a bond sequence notify Nanofab staff and proceed to section: 4.3 Vertical Wire Feed and Creating a Ball

N.E.F.O. switch to ON SHORT or OPEN LED MOTOR/ BALL SIZE/ SET UP/ RESET

4.2.6. Check to ensure the MOTOR (Z motor) switch is set to ON.

Check to ensure the BALL SIZE dial is set at 3 (~ 3x wire diameter). Check to ensure the SET UP/ RESET switch is in the mid-position.

Note: SET UP / RESET switch is a three position switch:

SET UP = UP position is used for measuring bond force with gram gauge.

The switch in mid-position permits normal operations.

RESET = Down (momentary) position is used for resetting the bonder and also allows you to change the bond cycle ( 2nd to 1st bond cycle modes) .

4.2.7. Mount your chip holder/ device on the Workholder chuck by pressing the wafer

clamping thumb lever down. After placing the sample on the chuck release the lever to secure the chip from moving. To mount larger packages use a Phillips screwdriver to adjust the mounting brackets. Make sure there is good thermal contact between the chuck surface and your device/device package.

Lever

4.2.8. Set the Workholder to the minimum height by holding the top of the Workholder and turning the Workholder Base CCW until it stops.

Workholder Base Turning Workholder Base CCW


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4.2.9. Set the Workholder’s temperature controller to your process set point (80C° to 150C° should work) by pressing the temperature controller’s Set Button (Roman numeral I will go ON) and then press the arrow UP button to your temperature set point.

Press Set button ( I led will light) Press Set button Press Arrow UP

4.2.10. Carefully place the Workholder on the Y-table under the bonding capillary.

4.2.11. Looking into the eyepiece adjust the Microscope’s ZOOM and FOCUS knobs to

view the bonding pads under the tip of the capillary. Move the Workholder to obtain a good bonding area field of view.

Focus Adjust / Zoom Adjust Zoom Adjust Focus Adjust

Move Workholder for good Field of view Bond Area Field of view


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4.2.12. Check to ensure the gold ball is present (not missing) by looking directly under the

capillary or ZOOM up and inspect for the gold ball through the eyepiece.

4.2.13. If the gold ball is missing proceed to section: 4.3 Vertical Wire Feed and Creating a Ball

4.2.14. Check bonding parameter dial settings you want to use :

Note : the following are good starting bonding dial setting that have repeatable

bonding success. Normally the 1st bond is the device bond pad and the 2nd is the package termination bond pad. Try to achieve minimum settings on the 1st bond to produce good wire bonds while minimizing the stress on your device.

Top row = 1

st Bond settings Bottom row = 2

nd Bond settings

4.2.15. Perform the Manual Wokholder-Bond pad height adjustment .

(manually positioning the Workholder/Die Bond Pad several mm below the capillary). Set the SEMI AUTO/ MAN Z switch to SEMI AUTO position.

Bond # Search Power Time Force Loop

1st 0 2 3 3.5 3

2nd 0 5 3 5.5 3


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4.2.16. Set the LOOP dial to 1 (only for Bond pad height adjustment) and press the left Multi Mouse button. The bonding head/capillary will drop to several centimeters above the bonding pad.

LOOP = 1 LEFT Mouse button Capillary drops few cm above die

4.2.17. Set the Workholder-Bond pad several millimeters(2-3mm) below the capillary by holding the top of the Workholder and turning the Workholder Base CW until the Workholder-Bond pad raises to 2-3 mm below the capillary as shown.

Turning Workholder Base CW Capillary 2-3 mm above die

4.2.18. Adjust the Green fiber optic bull’s eye pattern-cross hair onto the location of the bonding pad target and directly under the capillary tip by adjusting X and Y thumbscrews as show.

X Adjustment Y Adjustment

Bull’s eye pattern-cross hair under capillary


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4.2.19. Press the press the left Multi Mouse button. The bonding head/capillary will raise to

several centimeters above the bonding pad. The Wokholder-Bond pad height and green fiber optic cross hairs are set. The 1st and 2nd bond cycle can be made.

LEFT Mouse button Capillary raises few cm above die 4.2.20. Set the SEMI AUTO/ MAN Z switch to MAN Z position.

Set the LOOP dial to 3 (Note: Loop depends on application. Pad to termination distance)

Switch to MAN Z Set the LOOP dial to 3 LOOP dial to 3 Note: Loop depends on application. Smaller pad to termination distance smaller Loop, longer pad to termination distance longer Loop.

4.2.21. Check to ensure the 1st indicator LED is ON. This indicates the start of the first bonding cycle. If the 2nd LED is ON press RESET switch down to change the bond cycle from 2nd to the 1st bond cycle mode. .

Note: SET UP / RESET switch is a three position switch:

SET UP = UP position is used for measuring bond force with gram gauge.

The switch in mid-position permits normal operations.

RESET = Down (momentary) position is used for resetting the bonder and also allows you to change the bond cycle ( 2

nd to 1

st bond cycle modes) .


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4.2.22. Looking into the eyepiece move the Multi Mouse from front to back (not left to right)

to make fine positioning of the green cross-hair onto the bonding pad.

4.2.23 Looking into the eyepiece VERY SLOWLY move the Manual Z side lever DOWN to lower the bonding head close the bonding pad. Continue pressing the Manual Z side lever down slowly and move the Multi Mouse to maneuver to the 1st bond pad directly under the capillary and green cross-hair. Continue dropping bonding head to contact the bond pad to make the 1st bond.

VERY SLOWLY move the Manual Z side lever DOWN Contact the bond pad to make the 1

st bond

4.2.24 Continually hold the Manual Z side level while making the 1st bond. After the 1st bond

is made slowly move Manual Z side lever UP to raise the bonding head to the Loop Height. Move the Multi Mouse to maneuver to the 2nd bond pad directly under the capillary and green cross-hair. Continue dropping bonding head to contact the bond pad to make the 2nd bond.

Continually hold the Manual Z side level down Slowly move Manual Z side lever UP Drop bonding head to make while making the 1

st bond to the Lopp Height contact for 2

nd bond pad

4.2.25 After the 2nd bond is made the bonding head raises to the Reset position and the N.E.F.O. then fires to create a ball for the next bonding cycle.


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4.2.25 To perform more bonds on the same device/device package repeat steps 4.20.20 to 4.20.25.

4.2.26 After you have completed wire bonding your device set Workholder’s temperature controller to room temperature( 20C°-25C°) by pressing the temperature controller’s Set Button( Roman numeral I will go ON) and then press the arrow DOWN button to room temperature. Wait about 30 minutes until the Workholder cools down before removing your device.

Press Set button Press Arrow Down to RT

4.2.27 To perform bonds on the a different device/device package repeat steps 4.2.7 to

4.20.25

4.2.28 After you have completed all your wire bonding runs shutdown the system by setting the LOOP dial to 1.

LOOP = 1

4.2.29 Turn the work area spot lamp switch to OFF position and the front panel Main power switch to OFF.

Spot lamp OFF Main Power OFF 4.2.30 Enter required information in the logbook.


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4.3. Kulicke & Soffa Model 4524 Manual Gold Ball Operation: Vertical Wire Feed and Creating a Ball.

4.3.1 Before continuing with this procedure go back a read : Section 1.3.5. Precautions for Negative Electric Flame Off ( N.E.F.O)

4.3.2 If a system diagnostic SHORT or OPEN LED occurs before or during a bond this signal indicates that the N.E.F.O. did not produce a spark because of a SHORT

(small gap exist between tail and wand) or an OPEN (large gap exists between tail and wand) circuit.

SHORT or OPEN LED

4.3.3 Check to ensure the gold ball exists (not missing) by looking directly under the capillary or ZOOM up and inspect for the gold ball through the eyepiece.

gold ball

4.3.4 If the gold ball is missing and the wire is threaded through the capillary tip you need to readjust the tail length and the gap between the wire and wand.

4.3.5 If the gold wire is NOT threaded through the capillary tip skip steps 4.3.6 to 4.3.12 and go to step 4.3.15 to vertically feed the wire loading through the capillary.

4.3.6 Set the CLAMP switch to the UP position to open the clamp.

CLAMP switch to the UP position


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4.3.7 Pull more wire through the capillary tip using the tweezers and bend the wire below the capillary tip towards the N.E.F.O. wand. If needed use the scissors to cut any excess wire below the wand.

4.3.8 Set the CLAMP switch to the DOWN position to close the clamp.

CLAMP switch to the DOWN position 4.3.9 Check to ensure the N.E.F.O. switch is in ON position.

4.3.10 To create the gold ball press the MANUAL SPARK switch momentarily to the

DOWN position. You should be able to hear a static electric spark occurring.

MANUAL SPARK switch to the DOWN position


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4.3.11 If no ball is created you may need to readjust and bend the wire to very close

proximity to the wand. You can also carefully move the N.E.F.O. solenoid to the right to get closer proximity and press the MANUAL SPARK switch simultaneously and momentarily to the DOWN position. You should be able to hear a static electric spark occurring.

Carefully move the N.E.F.O. solenoid to the right to get closer proximity and press the MANUAL SPARK DOWN

4.3.12 Check to ensure the gold ball sparking was successful (not missing) by looking

directly under the capillary or ZOOM up and inspect for the gold ball through the eyepiece.

inspect for the gold ball

4.3.13 If the N.E.F.O. fails to create a ball call staff to check.

4.3.14 If the gold ball sparking was successful press the RESET switch DOWN and continue to the 1st bonding cycle.

4.3.15 If the gold wire is NOT threaded through the Capillary Tip you need to vertically feed

the wire loading through the Capillary Tip. First check whether the gold spool wire is coming from the Spool Cup into Glass Tube then feed into the Fixed Tensioner. After the Fix Tensioner the wire is fed behind a 1”x1” Glass Plate then through the Kicker wire guide hole. If the gold wire is NOT fed through these parts of the system call staff to check.

Spool Cup Glass Plate Fixed Tensioner Glass Tube Kicker


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Spool Cup Glass Plate Fixed Tensioner Glass Tube Kicker

4.3.16 If the gold wire is fed through the Kicker wire guide hole as shown OK to continue

otherwise call staff to check.

Kicker wire guide hole Kicker wire guide hole and gold wire OK to continue


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4.3.17 After the gold wires passes through the Kicker wire guide hole it passes through two bonding head Guide Wire Rings then is fed through the jaws of the Clamp then finally through into the top of the Capillary opening and out the bottom of the Capillary as shown.

After Gold wire passes through the Kicker wire guide hole it passes through two bonding head Guide Wire Rings then is fed through the Clamp wire guide and Jaws of the Clamp then finally through into the top of the Capillary opening and out the bottom of the Capillary as shown

4.3.18 Check to ensure the gold wire is fed through the two bonding head guide wire rings.

If not then pass the wire through these rings. 4.3.19 Check to ensure the gold wire is fed through the Clamp Wire Guide and the Jaws of

the Clamp. If the wire is not fed through the clamp set CLAMP switch to the UP position to open the clamp. Use the tweezers feed the wire through the Clamp Wire Guide and the Jaws of the Clamp. After the wire is fed through the clamp pull some extra wire to feed through the capillary.

4.3.20 Set CLAMP switch to the DOWN position to close the clamp.

4.3.21 Using the tweezers carefully feed the wire through the top of the capillary and out

the bottom. You may get better results if you use the ultrasonic circuit/transducer circuit to vibrate the wire through the capillary by holding the TEST switch DOWN.


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4.3.22 When you pull some wire with the tweezers the CLAMP must be OPEN

4.3.23 You may find threading the Clamp Guide Hole 1st then feeding the Capillary 2nd and

Clamp Caws 3rd may be faster.

4.3.24 After you have successfully threaded the capillary go back to step 4.3.4 to create the gold ball.

5 RECIPES

5.1.1 Gold Ball Bond parameter settings will depend on the application.

5.1.2 The follow are good starting bond dial settings to produce good and repeatable wire bonds while minimizing the stress on your device.

5.1.3 The bonding temperature used is critical to whether the bond will be successful. Typically 80C° to 150C° will produce good Au on Au bonds.

Bond # Search Power Time Force Loop

1st 0 2 3 3.5 3

2nd 0 5 3 5.5 3

Documents

Kulicke & Soffa Model 4524 Manual Ball Bonder OPERATING …