Kimerling Webinar 12-21-17F - Photonics...Manufacturing Capacity Ramp Shortage of components “Shortages of high-end optics, such as EML and DFB laser chips, is the main limiting

1

Integrated PhotonicsGrand Challenges and Key Needs for 2018

LionelC.KimerlingMIT

AIMPhotonicsInstituteIPSR-InternationalWebinar:December21,2017

DataCenters– 3D/AugmentedReality/Automotive– 5G/IoT

integration– standardization– cross-marketplatforms- IntegratedPhotonicsTechnologysupplychain

Challenges and Needs for 2018

§ CriticalThemes(3-10)• FunctionalBlocks- Platforms– SystemLevelDesign

§ Economics(10-16)• Demand – Component-to-SystemCost- Reliability

§ Technology(17-30)• TxRx (DC)- RFSignalProcessing(5G)- e-pSynergy• Sense:samplingandsignalinterpretation

§ Manufacturing(31-34)• Standardization – Consolidation- Coordination

§ Successin2018(35-36)• Continuity:electronics-photonics-integration

Outline:Economics,Technology,Manufacturing 2

Supply Chain Coordination: Mobile 3D


Infraredlaserprojectorcomponents: i)avertical-cavitysurface-emittinglaseroredge-emittinglaser,ii)wafer-leveloptics,andiii)diffractiveopticalelements.

Technologies:multipointCMOSimaging;ToF mapping;structuredlight;phasedarrays.

Silicon Photonics Datacom Vision

SiliconPhotonicsisthe“futureproof”,modularsolutionforSM-WDMbandwidthdensityscaling.•increases:yield,reliability,density

•reduces:cost,timetomarket,power,latency

Cable– Board– Package- Chip

IntegratedPhotonicSystemsRoadmap2016

Integrated Photonics: 2018 Priorities

§ AutomatedDesign• validatedPDKmodels:e-pcircuitsandsystems• foundryinfrastructure:IPlicensing/indemnification

§ MonolithicIntegration• heterogeneousSMfunctionalblocks

§ OpticalPackaging• on-chip/off-chip;interposer;on-boardparallelism• partssupplychain;knownfailuremodes

§ Test• Design-for-Test;BIST;highthroughput


The Road to Silicon e-p Synergy


InP,SiN (GaN)areimportanttoanemergingheterogeneouse-pplatform.

10/17TWGupdates

700contributors

254organizations

16countries

Supply Chain Coordination


• Extendthistableto3Dwaveguide(industryexpectsthistohappenby2020)• Extendthistabletoindependentlyroutableopticallayers(verticallyintegratedWG)• Integrationlevelcomplexity tobeadded• Studycostscalingatsystemlevel

Ajey Jacob,GlobalFoundriesco-chair,MonolithicIntegrationTWG



Tobeaddedin2018:specificationofMaterialsandToolperformance



Outline:Economics,Technology,Manufacturing...Questions? 9

Longdiscussiononreliability.Agreedtokeepthecurrentnumbers.


Datacom Economics

§ WilltheDataCentermarket supporttherequiredR&Danddriveadoptionofintegratedphotonictechnology?

§ Keyneeds• platformsthatleverageR&Dinvestments• standardsthatlimitR&Drisk• manufacturinginfrastructureforhighvolumeramp

Economics 10

Case Study: Transceiver

HardwareServerRacks,Switches,OpticalTransceivers,Fibers,BuildingFacilities(Shell,PowerSupply,Cooling)

SoftwarePlatform-levelSoftware,Cluster-levelSoftware,Application-levelSoftware

Set-upandOperationDevelopment,Purchase,Installation,Electricity,Maintenance

+

Barroso,LuisAndre,JimmyClidaras,andUrs Hoelzle.TheDatacen`ter asaComputer:A`n IntroductiontotheDesignofWarehouse-ScaleMachines.Morgan&Claypool,2013.

Economics 11

ThetransceiverispartoftheDataCentersystem.W.YuandR.Kirchain,MIT

$ sales to support R&D costof one new product

$30M/product

0.15 $200M/product

R&D/SalesRatioR&Dcost RevenueToSupportOneProductR&D

For an estimated Silicon Photonics TAM of $200M,the industry product cycle is 1yr for one product!

For estimated Silicon Photonics revenues of $30M for one company, the product cycle is 3.3yrs!

Standardization Scenario

Economic 12W.YuandR.Kirchain,MIT

Can sales from the Data Center sector support all new industry TxRx products?

#ofDatacenters

BisectionBandwidth

Pb/s#oflayersoftransceivers

$/Gbps pertransceiver

$Mtransceiver

sales

#ofProductssuch salescansupport

Google 15 5.2 4 1 312 1.5Amazon 44 5.2 4 1 915.2 4.5Microsoft 36 5.2 4 1 748.8 2.8Facebook ~10 5.2 4 1 208 1.0

2channels4channels8channels

OSFPQSFP-DDCOBO

x x SiInP 36products >>200G

400G x

1. High R&D cost + Market Fragmentation will support 36 product cycles of 3.6 yrs.

Mega-DCscansupport10productseachyear.

Economics 13

Cross-Market Platform Scenario

=

W.YuandR.Kirchain,MIT

Manufacturing Capacity Ramp

§ Shortageofcomponents“Shortagesofhigh-endoptics,suchasEMLandDFBlaserchips,isthemainlimitingfactorfor100GbEmarketgrowthin2016.”– LightCounting.com

§ Limitedproductioncapacity• Highrisktomakeamulti-millioninvestmentbeforetheaccepted

solutionisannounced.• Ittakestime toaddequipmentandpeopleintoproductionline.

“Peopleassumedtheyhadtimetoramp…[but]theindustryhasneverseensucharampwithoptics .”– AndreasBechtolsheim

SamplesTestbyCustomer

ProductionCapacityExpansion

ComponentSupplierProductionCapacityExpansion

Production

ComponentProduction

Solutionwinnerisannounced.Orderisplaced. Componentorderisdelivered. Orderisfulfilled.

Economics 14W.YuandR.Kirchain,MIT

2.Productionramptimetohighvolumeproductionlimitsrevenue.

DC Scaling: Cost and Time

in use

solution A

solution B

Time

Cos

t

Economics 15

R&DcostsandproductionrampratedetermineDataCenterrevenueportionforintegratedphotonics.

• Costand$/Gb/swilldecreasewitheachnewproducttechnology.• Ramptimetohighvolumeproductionlimitsrevenue.

W.YuandR.Kirchain,MIT

$1/Gb/s

DataCenterConnectivityTAM

Year 2016 2018 2020

Revenues $1.2B $2.1B $5.1BLightcounting 2015

TxRx Economics Summary

§ Theopticaltransceiverisabottleneckduetocostandtime.• Costisi)devicecostwithii)fullimplementationcostofthattechnologysolution.

• Time isi)timetosampleplusii)ramptimetohighvolumeimplementation.

§ SupplyChaincoordinationiscriticaltohighvolumeproduction.• Vendorandupstreamsuppliercoordination– solutionwinner,timescalesandvolume.

§ Thewinningproductshouldhaveanoptimalcombinationof:• performance,costandmanufacturingscalability.

Economics...Questions? 16

Technology 2018

Buildingcross-marketplatforms§ Transceivers

• thetransitiontoon-boardopticalinterconnection• MTconnectors• opticalinterposerstechnologyandcost

§ AnalogRFopticalsignalprocessing• transceivers:phasemodulation• specialpurposeFFTprocessor:frequencychannelization

§ Driversforhighlevelphotonicintegration• coherentopticalcircuits• on-chipopticalnetworks

§ SensingandOpticalPhasedArrays(>2018AIMtargets)

Technology 17

Frontier: Board Level Photonics

Technology:TxRx 18

SequenceoflinecardimplementationsforincreasedbandwidthNicholasIlyadis,Broadcom

On-Board Optical Interconnection

§ Beforethebenefitsofsiliconphotonicscanberealized,newhighperformanceandcosteffectivesolutionstoopticalpackagingandconnectorization mustbedeveloped.

§ Optimumperformanceandfunctionalityfromsiliconphotonicdevicesandcircuitsrequiresinglemode(SM).

§ SMrequiresprecisionalignmentinsidethepackageandinopticalconnectors.• expanded-beam(10umexpandedto80um)opticalconnectorsrelievealignmentanddustlimitations

• earlyentryforMMatshortreach?

Technology:TxRx 19

Opticalinterfacesdegradeperformanceandincreasecost.

TomMarrapode,Molex

On-Board Optical Interconnection AIG

Technology:TxRx 20

OBOAIG(ApplicationInterestGroup):12companies,internationalPhase1completein2017;Phase2in2018

Phase1:3M,3MTS,Corning,Celestica,Molex,Promex Industries,USConec,USCompetitors

On-Board Optical Interconnection

Technology:TxRx 21

SystemRequirements

On-Boardopticalinterconnectionisanunsolvedsystemproblem.TerrySmith,3M

Challenge: Optical Interposer

Technology:TxRx 22

Thepurposeofaninterposerisi)tospreadaconnectiontoawiderpitch,ii)torerouteaconnectiontoadifferentconnection,iii)toenhancedreliabilityandassuresuccessfulassembly.

TerrySmith,3M

Assembly and Test Costs

Technology:TxRx 23

InterposerAssemblyDominatesPackageCost.W.YuandR.Kirchain,MIT

Functional Blocks

§ Transceiver• power,bandwidthdensity• modulationformat,polarization,spectralefficiency

§ RFOpticalSignalProcessor• power,bandwidthdensity• notchfilter,FFT

§ WDMFrontEnd• power,bandwidthdensity• temperaturestabilization,e-plambdalock

Technology:FunctionalBlocks 24

Interposer for FPGA Transceiver


SiliconOpticalInterposer LinkEvaluationBoard

D.Okamoto,et.al.,“Demonstrationof25-GbpsOpticalDataLinksonSiliconOpticalInterposerUsingFPGATransceiver”,ECOC2014.(PETRA,Japan)

• 25-Gbpserror-freedatalinkonasiliconopticalinterposerwithanFPGA• Transmitterpre-emphasisandreceiverequalization• Compatiblewithopticalinterconnectstandards:OIFCEI-25G,100GbE,400GbE• Optical-pin/MMneartermimplementation

TestSchematic

The Commercial RF Photonics Platform


SchematicdiagramofanInP-based500Gb/sPM-QPSKtransmitterPICandtheactiveblockPIContheright.• 10tunabledistributedfeedbacklasers• 40Mach-Zehnder modulators• allrequiredsenseandcontrolelectronics.

FredKish,Infinera)

Integrated RF photonic filter

§ 8dBRFgain§ noisefigure:15.6dB

§ spurious-freedynamicrange:116dB§ rejection>50dBinthestopbands

Technology:RFSignalProcessor 27

“LosslessintegratedRFphotonicfilterwithrecord-lownoisefigureand116dBofdynamicrange”,Liu,et.al.,CLEOPacificRim2017andOpt.Lett.42,4631-4634(2017)

• low-losssiliconnitridecircuit:ringresonatorsforpre-processingandopticalfilteringunits• lowbiasingofMach-Zehnder modulatorforlinkoptimizationtoachievelowNF

Heterogeneous RF Photonics Platform


A.Paolella,Harris,IPSR2016,RFPhotonicsChapter

Heterogeneousmaterialsintegrationchallenge:monolithic,continuousprocessflowwithassociatedeconomicadvantages

Functional Blocks

Technology:WDMFrontEnd 29

3mmx6mme-pchip

transmitter/receiverbanks;coupler,photodetector,ringmodulatorselectronic–photonicsystem-on-chip:>70Mtransistorsand850photoniccomponents

“Single-chipmicroprocessorthatcommunicatesdirectlyusinglight”,Sun,et.al.,Nature,528534(2015).

LSI Photonics: I/O for 32 bit Network

Single Wavelength per Tile ID• 64 λ WDM• Si/SiO2 HIC waveguide• 40 wg – 32 data, 8 metadata• Tile area used: 0.5mm2

Tile Transmitter- 40 modulators for each core- Single wavelength for all bit lines- SiGe EA modulator & driver

Tile Receiver- 63 ch. (N-1) receiver section per tile- 40 one bit data lines- 5um Ring Resonator Filters- SiGe Detector integrated w/Filters

SingleTile1mm2 AreaofaMulti-CoreProcessor

Transmitter40BitEncoding

Receiver64channel(l’s),40bits/ch.

0.5m

m

1.0mm

40BitDa

taBus

MODULATORSChannelDetectionSetw/Filters

SiGeEADevices

64λ NodeMulticoreCoreWDMScenarioat1mm2 pertile

30Technology:LSIScaling...Questions?

chip/package/board-levelnetworksdrivingLSIsiliconphotonics

31

BuildingtheIntegratedPhotonicsManufacturingEcosystem

Manufacturing

Manufacturing

32

q Yearsofprovensiliconphotonicsresultsq 300mmtoolsprovideoutstandingqualityphotonicsq 3Dstackingw/CMOSq Partnershipsdrivecontinuousrevitalizationinvestments

III-VFINs

InGaAs

Undamaged III-V FIN

Post S-MLD

Prior | Post CMP

IV-IV 65nm Si CMOS

Oxide

InP

Continuously Tunable Optical Orbital Angular Momentum Generator

300mm Si Photonics Wafer

95nm gap in Si95nm Si3N4 Taper on Si Waveguide 65nm

SiWaferProcessingHub

Albany,NYManufacturing

Test Assembly and Packaging Hub

AIMPhotonicsProprietary 33

1. Wafer-scale photonicspackaging• First-levelinterposermetallization• De-bondanddicingofwafers

2. Chip-scale test,assemblyandpackaging• Laminateandfiberattach• High-speedtestandBIST

70-80%ofthecostofaSi-photonicsystemisinthepackage

Rochester,NYManufacturing

WorkforceandIndustrySurveyReport

1Yearfromnow 3Yearfromnow 5 Yearfromnow

1Yearfromnow 3Years fromnow 5Years fromnowFunnel/vectorstudentsinrelatedareasintoIPstarttrainingfromearlyoninschoolcarriermarketappealofIPtodrawinterestshortcoursesforbroadEdlevel(online/pre-recorded)shortcoursesforspecializedskills(highereducation)

Offerlotsofhands-ontrainingtostudents(MS/PhDlevelfirstthenBS)heaviermarketingofIPappealofferdiversityinskillsthoughts--specialtytracksonBSandMSofferIPfocusprograms:MS;BS--tracksstudentsfromearlyondegree

HavestudentsreadytograduatewhohavebeendevotedtoIPfromthebeginning

EstablishworkingMPWmodelwithworkingEDPAtoolstoenableR&DventuresinSiliconPhotonics

Establishproductpackagingsolutionstotargetthevariousmarketsforopticalproducts

EstablishPackagingHVMcapabilitytosupportvolumegrowthtocompeteinworldwidemarkets.

Establishabaselineforfullintegratedphotonicsproduction.Provideinitialtrainingtoaccessproductionruns.

Engagestandardbodiesforpackageprocesses.SuccessfullyscaleoutPICsforlargervolumeproduction.

BroadenHVMapplications beyondthedatacom sector.

Manufacturing 34

Silicon Photonics: Fall AIM Tech Mtg

§ Chipfabrication• Ge-epiat45nmnode:compatiblethermalbudget• opticalI/Ooptions:v-groove,opticalpins• hermeticity• 300mmchallenges:test,CPK andcost

§ Board-levelInterconnection• TxRx:pluggable(reliability)vs.surfacemount(cost)• establishedsolutionsinsystemtest• systemrequirementfocus:interfaces(connectors)

§ Designatsystemlevelvs.chipshrink• chip-package-module-systemco-design

35

45nmisacompellingtransitionnodeforSiliconPhotonics.Connectorslimiton-boardopticalinterconnection.

Manufacturing

Key Technology Needs for 2018§ Design

• robustDesign-for-Yield;packagesimulation• functionalblocks:RF-OSP,TxRx,WDMe-pfrontend

§ MonolithicIntegration• systemrequirements forswitchandlaserintegration

§ Assembly• alignment processes,tolerancesandassociatedcosts

§ Connectors• Module-PCB andPCB-cableconnectors

§ Packaging• opticalrequirementsforembeddedpackage,vertical/edgeaccess;boardsurfacemount;hermeticity

§ Test• Design-for-Test;in-linemonitors

Manufacturing...Questions? 36

Thank Youand Happy Holidays

Acknowledgements

• AIM Photonics Institute members• IPSR International contributors• MIT Microphotonics Center members• iNEMI members• OSA/OIDA members• IEEE Photonics Society members• SPIE Photonics West participants• Photon Delta and the World Technology Mapping Forum TWGs

Documents

Kimerling Webinar 12-21-17F - Photonics...Manufacturing Capacity Ramp Shortage of components “Shortages of high-end optics, such as EML and DFB laser chips, is the main limiting