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KDF Sales Presentation
For
Batch Sputtering Tools11-2021
Outline◼ Introduction to KDF
◼ Benefits of KDF and our systems
◼ 600i Series
◼ 900i Series
◼ 744i, 844i
◼ CiM Tool
◼ Cluster tool Ci series
◼ Process Applications
◼ Hardware Features and Options
◼ Software
◼ Sales and Service
◼ Summary
Introduction to KDF
◼ Founded in 1986.
◼ MRC sub-contracted batch tool
manufacturing to KDF beginning in
1989.
◼ Bought rights to MRC batch tool line
in 1997.
◼ Introduced 4 target large area 744
system in 1998.
◼ Introduced Gen 3.5 size 844 in 1999.
Introduction to KDF
◼ Introduced planetary pallet, ERPP,
for the 900 series in 2000.
◼ Introduced patented linear moving
magnet cathode,LMM™, in 2004.
◼ Introduced Cluster line in 2006.
◼ Continues to develop and upgrade all
aspects of hardware, software, and
process technology.
Markets-Applications
◼ Thin film solar
◼ Semiconductors
◼ Optical Networking
◼ Flat panel displays, OLEDs
◼ MEMS
◼ Hybrids
◼ Compound semiconductors- LEDs- MMICs
◼ Thin film batteries
◼ Digital x-ray detector arrays
◼ Decorative and hard coatings
◼ Medical electronics
Benefits
◼ Lowest cost of ownership
◼ Field proven designs with over 300 new KDF tools in production
◼ Worldwide system & process support for over 1000 MRC/KDF systems.
◼ Provides turnkey solutions to your fab, equipment, targets, & process.
◼ Design and manufacturer our own cathode. (core competence)
◼ Full application lab for process test and characterization.
◼ KDF is the MRC OEM provider
KDF i Batch Sputtering Tools
◼ 900 Down-Sputtering Series
12” x 12” deposition area
◼ 600 Side-Sputtering Series
13” x13” deposition area
◼ 744 Side-Sputtering System
19” x 19” deposition area
◼ 974 Down-Sputtering System
20” x 20” deposition area
◼ 844 Side-Sputtering System
26.5” x 30” deposition area
KDF Systems◼ Meets and complies with Semi S2-
0706 guidelines.
◼ CE option available.
◼ Designed to meet the demands for highest quality sputtered films.
◼ Designed to run in a high production environment.
◼ Designed for ▪ High-rate DC / RF Magnetron
Deposition
▪ High-rate Reactive Deposition
▪ RF Diode Deposition and Etch
▪ Substrate bias (DC, AC or RF)
Versatile High Throughput
Systems
◼ Dual pallet in-line processing design.
◼ 900 series system with pallet stacker
◼ Adjustable high rate (800 cpm) exchange slew speed
◼ High vacuum pumped loadlock.
◼ Single or multiple pass deposition.
◼ Limitless recipe stack configuration
Size / Wafer Capacity
System
Dep. area
100 mm
wafers
150 mm
wafers
200 mm
wafers
300 mm
wafers
600/900
12” x12”
9 4 1 1
744
19”x19”
16 9 4 1
974
20”x20”
20 9 4 1
844
26.5”x30”
42 16 9 4
KDF 600i Series Tools
◼ Three or four target positions.
◼ Customized pallet for non-standard substrates.
◼ Optional robotic loading
◼ Side-sputtering scheme minimizes in-film particulates
◼ Full pallet (9) 100 mm wafers
◼ Full pallet (4) 150 mm wafers
◼ Full pallet (1) 200 mm wafers
◼ Full pallet (1) 300 mm wafers
KDF 600i Series Tools
System
Pallet size
Hivac
Loadlock
Targets Target
size
603i13 x 13
No 3 5”x15”
643i13 x 13
Yes 3 5”x15”
643ix13 x 13
Yes 3 5”x17”
654i13 x 13
Yes 4 5”x15”
654ix13 x 13
Yes 4 5”x17”
600i Series Tool Design
◼ Vertical cathode to wafer orientation
◼ Gravitational removal of material flaking
away from substrate
◼ Minimal defects due to particulate
inclusion.
◼ Optional plasma coated shielding
◼ x series offers the option of extended
cathodes for improved uniformity
◼ Optional scan velocity profiling software
offers further uniformity improvement
◼ 13” x13” substrate area
654ix
603i
Opus
KDF 900i Series Tools
◼ Three or four target positions.
◼ Optional five target configuration
◼ No special fixturing needed for non-standard substrates in down-sputtering scheme with horizontal pallet.
◼ Planetary pallet option for uniformity < ± 1%
ERPP
KDF 900i Series ToolsSystem
Pallet size
Hivac
Loadlock
Targets Target
Size
903i12 x 12
No 3 5”x15”
943i12 x 12
Yes 3 5”x15”
943ix12 x 12
Yes 3 5”x17”
954i12 x 12
Yes 4 5”x15”
954ix12 x 12
Yes 4 5”x17”
974i20 x 20
Yes 4 5”x24.5”
900i Series Tool Design
◼ Cathode and substrate orientation are horizontal.
◼ Optional planetary substrate pallet provides film uniformity of ± 1%.
◼ Optional scan velocity profiling software offers further uniformity improvement.
◼ x series offers the option of extended cathodes for improved uniformity.
◼ 12” x 12” substrate area.
◼ 974 offers 20” x 20” substrate area
954i
974i
744i and 844i
◼ Vertical sputtering systems
◼ Designed for large substrate processing
▪ 200mm and 300mm wafers and OLEDs
▪ 744i up to Gen 2
▪ 844i up to Gen 3.5
◼ 19” x19” and 26.5”x 30” substrate area
◼ Compact footprint
◼ High-vacuum loadlock configured with a
substrate preheat
◼ AE Pinnacle 20 kW DC power supply
◼ AE 3.0 kW RF Solid State Power Supply
744i
844i
Cluster Ci
KDF Trademarks❑Cathodes
▪ Mark III™- New high uniformity cathode for dielectrics.
▪ Magterial Cathode™- High strength magnets for magnetic targets.
▪ Focest Cathode™- High rate, high uniformity cathode for Al
alloys.
▪ Inset Cathode™
- High uniformity, high utilization cathode
for metals.
▪ LMM™- Linear moving magnetron for RF and DC operation, full face erosion and low particle generation
KDF Trademarks
❑Tools▪ X Series™
- Sputtering tools with elongated cathodes.
❑Pallet▪ ERPP™
- Enhanced rotary planetary pallet for exceptional uniformity.
Processes
◼ Metal / Dielectric Multilayer Stacks with Uniformity ± 1%, Repeatability ± 3%
◼ Indium-Tin Oxide Processes for OLEDs with Transmission > 85%, Resistivity < 300 mohm-cm
◼ High Rate Reactive Processes for Dielectric Films
◼ Aluminum Nitride
◼ Collimated long throw TiW
Uniformity
Material Inset Planar AperturesPlanetary
900
systems
DC Mag.
Metal± 5%
± 7.5 -
10%± 3-5% ± 1-2%
DC Mag.
Non-metalNA
± 7.5 -
15%± 5% ± 1-2%
RF Mag.
Non-metalNA
± 10 -
15%± 5% ± 1-2%
Target Utilization
Cathode Type Target Utilization
RF Diode 30%
Planar
Magnetron
20-25%
Insets 40-60%
i Hardware - Vacuum
◼ CTI-8 or CTI-10 cryopumps on 3 or 4 target systems. Cryo torr and on-board
◼ Optional CTI in situ water pump
◼ Optional Osaka Mag-Lev turbopump.
◼ Pfeiffer and Edwards series of dry pumps.
◼ VAT throttling gate valve with programmable settings allowing for upstream and downstream gas control.
i Hardware - Vacuum◼ MKS multi-component “Smart”
vacuum gauges for high and low pressure monitoring.
◼ Alicat Scientific gas flow controllers channel 1 std. 2-4 optional and others available
◼ All process gas lines are welded, no bend, ultra clean stainless steel, and VCR sealed.
◼ Optional slow vent and slow rough
i Hardware - Power
◼ AE Pinnacle DC power supply.
◼ Optional Pinnacle Plus pulsed DC supply for reactive processes.
◼ AE RF Solid State Power Supply.
◼ New exclusive high reliability tuning network to computer interface with direct control switching (no manual switching required).
◼ New improved RF flex line designed for better cooling and power delivery.
i Hardware - Power◼ Optional AE pinnacle pulsed DC bias
◼ Optional RF bias
◼ Optional DC bias
◼ Optional water cooled RF etch station with backside gas cooling
◼ Optional heat lamps in etch station (heat over etch).
◼ Optional loadlock heat lamps with temperature and current servoing.
i Hardware - Cathodes
▪ Standard RF/DC planar magnetron cathodes.
▪ Optional KDF INSET high lifetime cathodes available.
▪ Optional KDF MK II high uniformity cathodes for dielectric films.
▪ LMM designed for reactive low particle deposition with full face erosion
▪ Optional KDF Magterial II dry magnets
▪ Picture frame bond for high power RF sputtering.
▪ Optional push on style gas ring
i Hardware - Mechanical
◼ New Ethernet pneumatic air package for all gripper and vacuum valve operation.
◼ Newly designed low pressure hydraulic system with embedded linear transducer for accurate cylinder positioning.
◼ Stepper motor, controller and encoder:▪ Programmable pallet carrier scans with high
accuracy and repeatability
▪ Wide range of scan speeds: 1-800 cm/min.
▪ Optional scan velocity profiling.
◼ Two standard stainless steel substrate pallets (optional customizing).
◼ Optional I/R insitu temperature monitoring.
i Hardware◼ Rockwell Automation PLC controller
coupled with digital and analog
modules manage system functions
within an ethernet IP network.
◼ Human interface on roll around cart
with industrial PC and UPS.
◼ Windows 10 running application
graphics and user interface.
◼ 24” flat panel touch screen display.
i Software◼ Extensive system interlocking and
fault management.
◼ Enhanced datalogging functions- date and time-stamped files- easy import to spreadsheets.
◼ Enhanced user configuration management for upgrades and option changes.
◼ Dynamic recipe editor- Context-based data entry
i Software
◼ Ability to backup and restore recipes,
datalogs and application
◼ Network connectability for alarm and
datalog remote viewing and
archiving.
◼ Standard configurable software
across all system platforms
◼ Easy data entry via touch screen or
integrated touchpad/keyboard.
i Software
◼ Optional process integration of
Inficon Transpector RGA and/or
MKS E-Vision RGA.
◼ Allows for process and fault
monitoring of gas peaks along
with integrated hivac step
i Software
◼ Pinnacle plus integration for
both sput and bias along with
pulse synchronization.
◼ Cosput
◼ Cryo pump regeneration
functions
▪ O3 regeneration
▪ Auto regen after process
i* Software Screens
◼ System Configuration
◼ Process Operating Screen
◼ Vacuum Operating Screen
* Typical configuration
i* Software Screens
◼ General Maintenance Screen
◼ Process Maintenance
◼ Motion Maintenance
◼ Vacuum Maintenance* Typical configuration
i* Software Screens
◼ Alarm Configuration Screen
◼ Target Life Configuration
◼ Carrier Position Configuration
◼ Process Recipe Screen* Typical configuration
Worldwide Sales and Service◼ HEADQUARTERS
KDF
10 Volvo Drive
Rockleigh, NJ 07647Tel. 201-784-5005Fax [email protected]
◼ EUROPEKDF UKTel. +44 7808 [email protected]
Worldwide Sales and Service◼ CHINA◼ Beijing Future Speeds Technology Ltd
Unit 501, Huatian Building,No.6 North Xiaomachang RoadBeijing, 100038, ChinaTel: 86-10-58891051/2/3/4Fax: 86-10-58891055Contact: Nancy ZhangMobile: 86-13910414550
◼ Email: [email protected]
◼ JAPAN ◼ Izumo Electric Co., Ltd.
4-6-8 Shiohama Kawasaki-ku Kawasaki-siKanagawa Japan #210-0826Tel: 044-288-0661Fax: 044288-0640Email: [email protected]: www.izumo-elec.com
Worldwide Sales and Service◼ ISRAEL ◼ G-Electronics
3, Tefutsot Israel StreetGivatayim 53583 IsraelTel: (972)-3-5714333Fax: (972)-3-5713985Email: [email protected]
◼ INDIA ◼ Electronic Enterprises ( India) Pvt Ltd.
216, Regal Industrial Estate, Acharya Donde Marg, Sewri, MUMBAI 400 015.G.S. Kolarkar : HyderabadTel: +91 40 23237214 Email: [email protected]. Joglekar: MumbaiTel: +91 22 24137096 Email: [email protected]. Raut : BangaloreTel: +91 80 23380451 Email: [email protected]
Worldwide Sales and Service◼ Singapore / Philippines / Malaysia
Premier SolutionsTel. (65) [email protected]
Worldwide Sales and Service◼ TAIWAN
KDF TaiwanNo. 218, Chung-Shan RoadHsinChu City, TaiwanTel. (886) 3-520-9637Fax (886) 3-520-9913Email: [email protected]
Service
◼ World wide Field support- free 1-year warranty service- after warranty paid service
◼ Telephone technical support at no cost
◼ Training courses - KDF factory or on site sessions
◼ Spare parts- typically delivered next business day
◼ ESP – External Support Program
Service - ESP
◼ Real time access to KDF software
enhancements and upgrades.
◼ Systems monitoring (on request) for
diagnosis.
◼ Live on line diagnostic help to
resolve problems.
◼ Preferred response time for ESP
customers.
◼ Significant savings over standard
service rates.
Conclusions
◼ KDF i Series Tools provide a wide
range of configurations and options
for versatile high-quality deposition.
◼ KDF systems low cost of ownership
along with one of the smallest
footprints in the industry make it
ideal for today’s end user.
◼ Hardware/software configurations
are easily adaptable to a large
variety of applications.
Conclusions
◼ KDF i Series Tools are used today in applications ranging from R&D to larger scale production.
◼ Utilizing our fully equipped application lab offering turn key process both before and after the sale, KDF can meet your thin film requirements now.
