ITRS MEMS

San Francisco, CAJuly 12, 2012

Presentation by Michael Gaitan, NIST

MEMS Technology Working Group

Akihiro KogaArthur Morris

Asif ChowdhuryBrian Jamieson

Buzz HardyChengkuo LeeChris Apanius

Chris van HoofChristian RembeChuck Richardson

Dave HowardDimitrios Peroulis

Dominique SchinabeckDon DeVoe

Edward ChiuFabio PasoliniFabrice Verjus

Fumihiko NakazawaGoro Nakatani

Hebert Bennett

ToshibaWispryAnalog DevicesSB MicrosystemsMEMSCAPNational U of SingaporePromeusIMECPolyTeciNEMIJazz SemiconductorPerdueAcutronicUniversity of MDAsian Pacific MicroST MicroKFM TechnologyFujitsuRohmNIST

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Brill

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Sal

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Pete

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enablingMNTToshibaIMECKIMMDelphiLexmarkNTUSolidusCaliperMEMS Industry GroupMEMStaffSonyAkusticaSEMI, MEMSmartSoftMEMSLETIMEMS Industry Group4m2cKnowles AcousticsVolant Technologies

Chair: Mike Gaitan (NIST), ChairCo-Chairs: Robert Tsai (TSMC) and Philippe Robert (LETI)

Raji BaskaranRakesh Kumar

Randy WagnerRobert De Nuccio

Ron LawesSacha RevelScott Bryant

Shawn BlantonStephane Donnay

Steve BreitSteve Greathouse

Steve WalshTakashi Mihara

Tetsu TanakaTony Stamper

Veljko MilanovicWei-Leun Fang

Wendy ChenXiaoming Wu

Yasutaka Nakashiba

IntelGlobal FoundriesNISTST MicroImperial CollegeAccutronicMANCEFCarnegie Mellon UniversityIMECCoventorPlexusMANCEFMicromachine CenterTohoku Univ.IBMMirrorcle TechnologiesNTHUKYECLexmarkRenesas Electronics

MEMS Technology Working Group

Akihiro KogaArthur Morris

Asif ChowdhuryBrian Jamieson

Buzz HardyChengkuo LeeChris Apanius

Chris van HoofChristian RembeChuck Richardson

Dave HowardDimitrios Peroulis

Dominique SchinabeckDon DeVoe

Edward ChiuFabio PasoliniFabrice Verjus

Fumihiko NakazawaGoro Nakatani

Hebert Bennett

ToshibaWispryAnalog DevicesSB MicrosystemsMEMSCAPNational U of SingaporePromeusIMECPolyTeciNEMIJazz SemiconductorPerdueAcutronicUniversity of MDAsian Pacific MicroST MicroKFM TechnologyFujitsuRohmNIST

Henne

van

Heeren

Hiroshi

Yamada

Ingri

d

De

Wolf

Jae

Sung

Yoon

Ji

m

Spall

Ji

m

Mrvos

Ji

anm

in

M

iao

John

Rychci

kJ

osh

Mol

ho

Karen

Li

ght

man

Kevi

n

Chau

Koji

Fukumot

oM

arci

e

Wei

nst

ei

nM

ark

Crockett

Mary

Ann

Maher

Mi

chel

Brill

ouet

Moni

ca

Takacs

Patri

c

Sal

omon

Pete

Loeppert

Raj

Gupt

a

enablingMNTToshibaIMECKIMMDelphiLexmarkNTUSolidusCaliperMEMS Industry GroupMEMStaffSonyAkusticaSEMI, MEMSmartSoftMEMSLETIMEMS Industry Group4m2cKnowles AcousticsVolant Technologies

Chair: Mike Gaitan (NIST), ChairCo-Chairs: Robert Tsai (TSMC) and Philippe Robert (LETI)

Raji BaskaranRakesh Kumar

Randy WagnerRobert De Nuccio

Ron LawesSacha RevelScott Bryant

Shawn BlantonStephane Donnay

Steve BreitSteve Greathouse

Steve WalshTakashi Mihara

Tetsu TanakaTony Stamper

Veljko MilanovicWei-Leun Fang

Wendy ChenXiaoming Wu

Yasutaka Nakashiba

IntelGlobal FoundriesNISTST MicroImperial CollegeAccutronicMANCEFCarnegie Mellon UniversityIMECCoventorPlexusMANCEFMicromachine CenterTohoku Univ.IBMMirrorcle TechnologiesNTHUKYECLexmarkRenesas Electronics

MEMS Industry Group

MEMS TWG

Subgroups: Devices,

Design and Simulation,

Packaging and Integration, and

Testing

Len Sheynblat, Qualcomm, Sensors System Integration Problems, MIG M2M Workshop, Spring 2012

Focus: MEMS in Mobile Devices

ITRS MEMS

• MEMS Device Technologies– Accelerometers – Gyroscopes– Microphones– RF MEMS– Emerging MEMS

• Technology Requirements– Device Performance– Design and Simulation– Packaging and Integration– Device Testing

MEMS Inertial Sensors

• MEMS Inertial Sensors continue to incrementally increase in performance and lower in cost.

• The integration of functionalities (tri axis accelerometer, gyroscope, magnetometer, and pressure sensor) towards the IMU has advanced to 9 DOF in the package.

• Driving down the cost of testing of the IMU continues to be a challenge.

Example - 9 DOF IMU Package Level

ST MicroelectronicsFeb 12, 2012

http://www.st.com/internet/com/press_release/p3273.jsp

MEMS Microphones• MEMS microphones are expected to

incrementally increase in performance and lower in cost.

• As the sensitivity of microphones advances to 68 db, testing in the factory environment is an issue.

• Advances in the ASIC include digital output and adaptive signal processing (such as noise cancellation).

• Testing of MEMS Microphones with adaptive signal processing is a challenge.

RF MEMS• RF MEMS are intended to lower the power

dissipation of the radio.• RF MEMS are sill in the process of increasing

their reliability and lowering cost before they can be adopted in mobile devices.

• RF MEMS are expected to increase in performance and reliability. – The biggest challenge in RF MEMS is enhancing

reliability and lifetime (# of operations)– Some of the future performance metrics have no

known solutions, (e.g., signal isolation requirements)

Grand ChallengesDifficult Challenges Potential Solutions

Integration of MEMS in the Package

Standardization for MEMS packaging to support integration.

Packages are needed that reduce or eliminate mechanical stress and enhancing hermeticity.

Package data that can be used to accurately predict the effect of the package on device performance.

Testing of MEMS More testing towards the wafer level.Validated tools to predict device device

performance from wafer tests.Methodologies for “Design for Test” or

“Design for NO Test.”

Validated accelerated life testing for MEMS

More knowledge of the physics of failure is required to develop accelerated life tests.

Need to share information. Individual solutions exist but are not being generalized across the industry.

MEMS Manufacturing

Packaging and

Testing

DeviceFabrication

MEMS Manufacturing Cost R&D Investment

Device andProcess

Development

Packaging and Testing

ITRS and iNEMI • The MEMS Technology Working Group is also

affiliated with iNEMI.

• The iNEMI MEMS will be expanded to include consumer health applications: the "Worried Well."

• TWG discussions include the concept of integration node.

• An iNEMI project on MEMS Testing Requirements is in discussion. The focus will likely be on defining performance metrics in data sheets.

MEDICAL MARKET- High Potential

Bubble Chart Ref: IBM Institute for Business Value,” The future of connected health devices”

3 BILLION POTENTIAL CUSTOMERS FOR

CONNECTED HEALTH DEVICES

Integration NodeAccelerometer

Tri-AxisAccelerometer

GyroscopeTri-Axis

Gyroscope

MagnetometerTri-Axis

Magnetometer

6 DOF Sensor

9 DOF Sensor

Pressure Sensor

10 DOF Sensor

Conclusions• Opportunities for industrial collaboration exist around issues at

the back end (packaging and test)

• MEMS Sensor Fusion creates challenges for testing in increasing complexity while still lowering cost.

• MEMS Testing requirements depend on the application (consumer electronics, automotive, medical, defense and aerospace).

• Our road mapping has so far been on near term (5 years). The concept of integration node might facilitate longer term road mapping of MEMS and other More than Moore Technologies.