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17th Intersociety Conference on Thermal andThermomechanical Phenomena in Electronic Systems
ITherm 2018
Dr. Thomas Brunschwiler, General Chair, [email protected] Your Abstract at the ITherm Website: http://ieee-itherm.net/
Draft Papers Due: January 15, 2018
Component-Level Thermal Management• Single/Multi Chip Module & System in Package• 3D Packaging & Embedded Cooling• Hotspot & Impingement Cooling• Passive Two-Phase Cooling: Heat Pipes, Vapor
Chambers, & Thermosyphons• Pulsating/Oscillating & Non-conventional
Heat Pipes• Thermal Interface Materials and Heat Spreaders • Thermoelectricity & Peltier Devices• Novel Air Cooling Techniques & Heat Exchangers• Pumps, Compressors, Fans & Blowers• Single-Phase Liquid & Two-Phase Cold Plates• Boiling/Evaporation/Condensation, Microgap
CoolingSystem-Level Thermal Management• Data Center Energy Efficiency• Thermal Storage• Immersion Cooling, Refrigeration• Mobile, Internet of Things, MEMS• Telecommunication Systems• Automotive• Space and Aerospace• Power Electronics• LEDs• Photovoltaics• RF Electronics• Batteries
Mechanics & Reliability• Thermo-Mechanical Modeling and Simulation of Devices,
Components, Boards, and Systems• Mechanics and Reliability of Solder Joints & Interconnects• Materials Characterization, Processing, Constitutive Models• Failure Mechanics, Fatigue, Damage Modeling• Experimental Techniques for Packaging Deformations,
Strains, and Stresses• Shock, Drop, and Vibrational Analysis of Packages, Sub-
Systems, and Systems• TSV / 3D Reliability and Packaging Challenges• Mechanics Issues in Assembly and Manufacturing• Applied Reliability for Failure Detection and Characterization• Process-Structure-Property Correlations / Multi-Scale
Analyses for Degradation and Failure• Accelerated Stress Testing and Modelling• Lifetime Prognostics and Condition MonitoringEmerging Technologies and Fundamentals• Numerical Methods from Nano-to-Macro Scale• Experimental Methods from Nano-to-Macro Scale • Nanotechnology Including 1-D and 2-D Materials• Thermal Interface Materials and Phase Change Materials• Embedded Cooling• Transistor Technology• Novel Materials and Fabrication Techniques• Measurement and Instrumentation Techniques• Prognostic Health Management and Reliability Analysis• Flexible Electronics
Some Important Dates: Deadline for Abstracts: Sept. 18, 2017Notification of Acceptance: Oct. 16, 2017Draft Paper Submission: Jan. 15, 2018Reviews Returned: Feb. 5, 2018Final Paper Submission: Mar. 5, 2018
ITherm 2018 (www.ieee-itherm.net) is the leading international conference for scientific and engineering exploration ofthermal, thermomechanical and emerging technology issues associated with electronic devices, packages, and systems. Thefirst ITherm Conference was held in 1988, making this the 30th year of the Conference Series. ITherm 2018 will be held alongwith the 68th Electronic Components and Technology Conference (ECTC 2018, www.ectc.net), at the Sheraton Hotel andMarina in San Diego. Joint registrations are available at a discounted rate. All papers will be peer reviewed and published inthe ITherm proceedings. Student first authors will have the opportunity to apply for ITherm travel grants in order to make anoral presentation and participate in a Student Poster and Networking Session. In addition to paper presentations and vendorexhibits, ITherm 2018 will have panel discussions, keynote lectures by prominent speakers, invited Tech Talks, andprofessional short courses. Original papers are solicited in the following general areas of interest (but not limited to):
ITherm provides an opportunity for industrial and university participation in the form of financial support to ITherm 2018. All contributors will be given strong recognition both onsite and in the conference materials.
May 29 – June 1, 2018Sheraton Hotel & MarinaSan Diego, CA USA
Art-in-Science Exhibition and Competition:Showcase your scientific discovery and technical applications at ITherm through submission of original images and artwork
General inquiries To:Prof. Justin A. Weibel, Communication Chair, [email protected]
Program Inquiries To:Prof. Jeffrey C. Suhling, Program Chair,
[email protected]. Vadim Gektin, Vice Program Chair,
Celebrate ITherm’s 30th Anniversary!
Birth of VorticesJ. Jörg & M. Rietz
Art-in-Science Exhibition Winner, ITherm 2017
