IT Industry Power Supply Technology and Skill Requirements

Dr. Scott D. StrandProgram Director, Platform Procurement EngineeringIBM

IBM Servers: Hardware Integration

New Server New Server ArchitectureArchitecture

xSeriesxSerieszSerieszSeries

pSeriespSeriesiSeriesiSeries

SSG - StorageSSG - Storage

"Bulletproof" reliabilityDynamic workload managementLeading-edge security

"Industry-standard" architecture NT / UNIX workloadsIndustry-leading SAN solutions

Leading RISC / UNIX performanceLarge SMP scalabilityIndustry-leading clustering

Leading price / performance"Industry-standard" architectureLeading integrated server management

xSeriesxSeries

Leading price / performanceScalable, building-block design

Leading single-system reliabilityLeading turnkey environmentSupport for mixed OS workloads

MicroprocessorsDDR Memory

I/O CardsRaid Cards

110V/220V AC

HardfilesCD-ROMFloppy

Fans

Typical Server Application

PS1 PS2

FANS

Server Drawer

e- Server

CoolingCoolingCostCost DensityDensityTechnologyTechnology

Power Supply Technology Drivers

Power SupplyPower Supply

1

0.8

0.6

0.3

0.20.15

0.1

1990 1994 1998 2002Year

0

0.2

0.4

0.6

0.8

1

1.2

Rel

ativ

e C

ost Semiconductors

Capacitors

Magnetics

Technology Cost Trend

Bulk Power (AC/DC) Cost Bulk Power (AC/DC) Cost

Magnetics12.7%

Capacitors12.0%

Semiconductors34.1%

Fans8.6%

PCB15.3%

Mechanical16.0%

Misc.1.3%

MagneticsCapacitors

SemiconductorsFans

PCBMechanical

Misc.

System Power Distribution

+12V30.0%

+3.3V/+5V30.0%

+2.5V8.0%

+1.8V8.0%

1.13V24.0%

+12V+3.3V/+5V

+2.5V +1.8V 1.13V

FansHard Disk Drives

CD - ROMPCI CardsHDD Asics Floppy Drive

DDR Memory

Microprocessors

High Speed Logic

Why 12V?

Power Density Trend

1.5 2 2.5 3

8

20

1980 1985 1990 1995 2000 2005Year

0

5

10

15

20

25

Wat

t/Cu.

In.

Power

System

Power

System

1

0.75

0.5

0.35

0.150.08

1980 1985 1990 1995 2000 2005Year

0

0.2

0.4

0.6

0.8

1

1.2

Rel

ativ

e Pr

ice

($)

Price Trend

Power Electronics Technology Trend

AC/DCBulk Power

Power Density = 20W/cu inch

+12V DC+350V DC-48V DC

AC Input

Plug-in VRM

Multiphase VRM Monolithic VRM

Power Density = 50W /cu in

DCTransformer

Power Density > 100W/cu in

+

+400V

AC

AC

L1+ 12V Output

+

T1

L3

C1 C2

Q1

Boost Stage Hard Switching

Forward ConverterHard Switching

Output Rectification by 100V Schottky Diodes

Q2

D1

D2

Traditional Topology for Low End Server No ZVS transition for Boost Stage = Larger Heatsinks required Single Switch Forward = Large Size Transformer required Simple Secondary Rectification = Large Size Inductor Required

No Current Share Experience demonstrated by hardware ModelsNo MicroController Experience for Server ApplicationLower Cost, Low Efficiency and Lower Power Density Approach

Note: The Conclusions are based on actual hardware experience.

Power TopologiesTechnology Circuits

Power Topologies

+

+400V

AC

AC

L1 L2

+ 12V Output

+T1

L3

L4

Q2

Q1

Q3

Q4

Q5

Q6

C1 C2

Q7 Q8

Boost Stage /ZVT switching ZVS Bridge Synchronization

Aux. Switch

Best of Breed Technology for Server Applications ZVS transition for High Efficiency Boost ZVS Bridge Forward dor high efficiency DC/DC Synchronous rectification with Current Doubler MicroController Experience for Server Applications

High Efficiency, High Density and Better Cooling Methods.

Technology Circuits

TechnologyCost

ChallengesPower Technology

Higher Reliability - MTBFHigher Power DensityHigher Transient Response - di/dt Higher EfficiencyLower Voltage - Higher CurrentVoltage/Current Distribution Increased Number Of Voltage DomainsAbility to Hot SwapError and Status ReportingIncreased Mobile Client Power NeedsLower CostShorter Development CyclesImproved Quality

More IntegrationHigher Switching FrequenciesLower Switching and Conduction Losses Topology Influences

RES/ZVS/ZCSBetter EMI DesignInnovative Design Lower Output ImpedanceThermal ManagementComponent Improvements

Integrated CircuitsBattery TechnologyPower SemiconductorsCapacitorsInterconnect

Future Power Technical Challenges

Technology Solutions

Technical Challenges and SolutionsPower Technology

CLASS ARCHITECTURESMobile Battery Technology Main Power Source

Efficient DC/DC Converters & Power Management

Low End Centralized Power SupplyPoint-Of-Load Regulator (uP or Memory)

Mid-Range Centralized Power Supply * Point-Of-Load Regulator (uP or Memory) * DC/DC Regulators Imbedded in PS

Fully Distributed Power Supply * +12V Bus Voltage * +12V Input DC/DC

Telco (-48V) Version

High End Fully Distributed Power Supply * +350V Bus Voltage * +350V Input DC/DC

Fully Distributed Power Supply * +48V Bus Voltage * +48V Input DC/DC

Power Architectures

Technology Challenges

Faster Semiconductors Require:

Higher CurrentHigher CurrentLower VoltageLower Voltage

IBM CMOS7S Copper Technology

Technology Challenges

Faster Semiconductors Cause:

High di/dtHigh di/dt

IBM SOI Technology

2003 2004 2005 20060.0

0.5

1.0

1.5

2.0Volts

0

200

400

600

800

1000

1200

1400Amps

Voltage vs. Current

2003 2004 2005 200650

100

150

200

250

300A/us

1000

1500

2000

2500

3000

3500

4000

MHz

Dynamic Load vs. Frequency

Power per Cell DecreasingFunction IncreasingN-Way Processors

Larger Chips/More IntegrationMulti-Chip ModulesHigher Operating Frequencies

Processor Power TrendsTechnology Challenges

Power Technology

High di/dt Requires A Fast Response Converter

di/dt Requirements are up to 250 Amps/uS with Year 2006 Requirements Expected To Reach 1000 Amps/nS(a 4000x increase!!)

Adding Low ESR, Expensive Capacitors Is No Longer Feasible For Future Low And Midrange Systems

System Thermal Requirements Call For High Efficiency Converters

Technology Challenges di/dt, efficiency

What Technical Capabilities Are Expected From Our Suppliers?

Simulation/Modeling CapabilitiesElectricalThermalMechanical

Innovative DesignsDC/DC For Next Generation ProcessorsHigh Density AC/DCImproved Efficiency

Common Industry Design TechniquesForm FactorConnectorCommunicationCurrent Sharing

Skills Expected of Our Suppliers

ProficiencySwitching power supply technology 4Analog circuit design and analysis techniques 3Understanding of magnetics 3Simulation skills 3

Basic understandingCommunication skills 5

WrittenOral

Teamwork experience and skills 5

Entry Level Engineer Expectations

ProficiencyPower supply design experience 5Analog circuit design and analysis 5Magnetic component design and implementation 5Analog simulation 5Digital design 4Digital simulation 3Verbal communication 5Written communication 5Teamwork experience and skills 5

Experienced Engineer Expectations