62
IS42S86400B IS42S16320B, IS45S16320B Integrated Silicon Solution, Inc. — www.issi.com 1 Rev. H 12/01/2011 Copyright © 2011 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time with- out notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products. Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness.Products are not authorized for use in such ap- plications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that: a.) the risk of injury or damage has been minimized; b.) the user assume all such risks; and c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances FEATURES Clock frequency: 166, 143, 133 MHz Fully synchronous; all signals referenced to a positive clock edge Internal bank for hiding row access/precharge Power supply VDD VDDQ IS42/45S16320B 3.3V 3.3V IS42S86400B 3.3V 3.3V LVTTL interface Programmable burst length – (1, 2, 4, 8, full page) Programmable burst sequence: Sequential/Interleave Auto Refresh (CBR) Self Refresh 8K refresh cycles every 16ms (A2 grade) or 64 ms (Commercial, Industrial, A1 grade) Random column address every clock cycle Programmable CAS latency (2, 3 clocks) Burst read/write and burst read/single write operations capability Burst termination by burst stop and precharge command Available in 54-pin TSOP-II and 54-ball W-BGA (x16 only) Operating Temperature Range: Commercial: 0 o C to +70 o C Industrial: -40 o C to +85 o C Automotive, A1: -40 o C to +85 o C Automotive, A2: -40 o C to +105 o C OVERVIEW ISSI's 512Mb Synchronous DRAM achieves high-speed data transfer using pipeline architecture. All inputs and outputs signals refer to the rising edge of the clock input. The 512Mb SDRAM is organized as follows. 64M x 8, 32M x 16 512Mb SYNCHRONOUS DRAM DECEMBER 2011 KEY TIMING PARAMETERS Parameter -6 -7 -75E Unit Clk Cycle Time CAS Latency = 3 6 7 ns CAS Latency = 2 10 10 7.5 ns Clk Frequency CAS Latency = 3 166 143 Mhz CAS Latency = 2 100 100 133 Mhz Access Time from Clock CAS Latency = 3 5.4 5.4 ns CAS Latency = 2 6 6 5.5 ns IS42S86400B IS42/45S16320B 16Mx8x4 Banks 8M x16x4 Banks 54-pin TSOPII 54-pin TSOPII 54-ball W-BGA

IS42S86400B IS42S16320B, IS45S16320B12/01/2011 IS42S86400B, IS42/45S16320B DEVICE OVERVIEW The 512Mb SDRAM is a high speed CMOS, dynamic random-access memory designed to operate in

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Page 1: IS42S86400B IS42S16320B, IS45S16320B12/01/2011 IS42S86400B, IS42/45S16320B DEVICE OVERVIEW The 512Mb SDRAM is a high speed CMOS, dynamic random-access memory designed to operate in

IS42S86400B IS42S16320B, IS45S16320B

Integrated Silicon Solution, Inc. — www.issi.com 1Rev. H12/01/2011

Copyright©2011IntegratedSiliconSolution,Inc.Allrightsreserved.ISSIreservestherighttomakechangestothisspecificationanditsproductsatanytimewith-outnotice.ISSIassumesnoliabilityarisingoutoftheapplicationoruseofanyinformation,productsorservicesdescribedherein.Customersareadvisedtoobtainthelatestversionofthisdevicespecificationbeforerelyingonanypublishedinformationandbeforeplacingordersforproducts.

IntegratedSiliconSolution,Inc.doesnotrecommendtheuseofanyofitsproductsinlifesupportapplicationswherethefailureormalfunctionoftheproductcanreasonablybeexpectedtocausefailureofthelifesupportsystemortosignificantlyaffectitssafetyoreffectiveness.Productsarenotauthorizedforuseinsuchap-plicationsunlessIntegratedSiliconSolution,Inc.receiveswrittenassurancetoitssatisfaction,that:a.)theriskofinjuryordamagehasbeenminimized;b.)theuserassumeallsuchrisks;andc.)potentialliabilityofIntegratedSiliconSolution,Incisadequatelyprotectedunderthecircumstances

FEATURES• Clockfrequency:166,143,133MHz

• Fullysynchronous;allsignalsreferencedtoapositiveclockedge

• Internalbankforhidingrowaccess/precharge

• Powersupply

Vdd Vddq IS42/45S16320B 3.3V 3.3V

IS42S86400B 3.3V 3.3V

• LVTTLinterface

• Programmableburstlength–(1,2,4,8,fullpage)

• Programmableburstsequence:Sequential/Interleave

• AutoRefresh(CBR)

• SelfRefresh

• 8Krefreshcyclesevery16ms(A2grade)or64ms(Commercial,Industrial,A1grade)

• Randomcolumnaddresseveryclockcycle

• ProgrammableCASlatency(2,3clocks)

• Burstread/writeandburstread/singlewriteoperationscapability

• Burstterminationbyburststopandprechargecommand

• Availablein54-pinTSOP-IIand54-ballW-BGA(x16only)

• OperatingTemperatureRange:Commercial:0oCto+70oCIndustrial:-40oCto+85oCAutomotive,A1:-40oCto+85oCAutomotive,A2:-40oCto+105oC

OVERVIEWISSI's512MbSynchronousDRAMachieveshigh-speeddatatransferusingpipelinearchitecture.All inputsandoutputssignalsrefertotherisingedgeoftheclockinput.The512MbSDRAMisorganizedasfollows.

64M x 8, 32M x 16 512Mb SYNCHRONOUS DRAM DECEMBER 2011

KEY TIMING PARAMETERS

Parameter -6 -7 -75E Unit

ClkCycleTime CASLatency=3 6 7 – ns CASLatency=2 10 10 7.5 ns

ClkFrequency CASLatency=3 166 143 – Mhz CASLatency=2 100 100 133 Mhz

AccessTimefromClock CASLatency=3 5.4 5.4 – ns CASLatency=2 6 6 5.5 ns

IS42S86400B IS42/45S16320B

16Mx8x4Banks 8Mx16x4Banks

54-pinTSOPII 54-pinTSOPII

54-ballW-BGA

Page 2: IS42S86400B IS42S16320B, IS45S16320B12/01/2011 IS42S86400B, IS42/45S16320B DEVICE OVERVIEW The 512Mb SDRAM is a high speed CMOS, dynamic random-access memory designed to operate in

2 Integrated Silicon Solution, Inc. — www.issi.com Rev. H

12/01/2011

IS42S86400B, IS42/45S16320B

DEVICE OVERVIEWThe 512Mb SDRAM is a high speed CMOS, dynamicrandom-accessmemorydesignedtooperatein3.3VVddand3.3VVddq memorysystemscontaining536,870,912bits.Internallyconfiguredasaquad-bankDRAMwithasynchronousinterface.Each134,217,728-bitbankisor-ganizedas8,192rowsby1024columnsby16bits.Eachofthex8's134,217,728-bitbanksisorganizedas8,192rowsby2048columnsby8bits.

The512MbSDRAMincludesanAUTOREFRESHMODE,andapower-saving,power-downmode.Allsignalsareregisteredonthepositiveedgeoftheclocksignal,CLK.AllinputsandoutputsareLVTTLcompatible.

The512MbSDRAMhastheabilitytosynchronouslyburstdataatahighdataratewithautomaticcolumn-addressgeneration,theabilitytointerleavebetweeninternalbanksto hide precharge time and the capability to randomlychange column addresses on each clock cycle duringburstaccess.

Aself-timedrowprechargeinitiatedattheendoftheburstsequenceisavailablewiththeAUTOPRECHARGEfunctionenabled. Prechargeonebankwhileaccessingoneoftheotherthreebankswillhidetheprechargecyclesandprovideseamless,high-speed,random-accessoperation.

SDRAMreadandwriteaccessesareburstorientedstartingataselectedlocationandcontinuingforaprogrammednumber of locations in a programmed sequence. Theregistration of an ACTIVE command begins accesses,followedbyaREADorWRITEcommand.TheACTIVEcommandinconjunctionwithaddressbitsregisteredareusedtoselect thebankandrowtobeaccessed(BA0,BA1selectthebank;A0-A12selecttherow).TheREADor WRITE commands in conjunction with address bitsregisteredareusedtoselectthestartingcolumnlocationfortheburstaccess.

ProgrammableREADorWRITEburstlengthsconsistof1,2,4and8locationsorfullpage,withaburstterminateoption.

CLKCKECSRASCASWE

A9A8A7A6A5A4A3A2A1A0

BA0BA1

A10A12

COMMANDDECODER

&CLOCK

GENERATOR MODEREGISTER

REFRESHCONTROLLER

REFRESHCOUNTER

SELF

REFRESH

CONTROLLER

ROWADDRESS

LATCH MU

LTIP

LEX

ER

COLUMNADDRESS LATCH

BURST COUNTER

COLUMNADDRESS BUFFER

COLUMN DECODER

DATA INBUFFER

DATA OUTBUFFER

DQML DQMH

DQ 0-15

VDD/VDDQ

Vss/VssQ

13

13

10

13

13

10

16

16 16

16

1024(x 16)

8192

8192

8192

RO

W D

EC

OD

ER 8192

MEMORY CELLARRAY

BANK 0

SENSE AMP I/O GATE

BANK CONTROL LOGIC

ROWADDRESSBUFFER

A11

2

FUNCTIONAL BLOCK DIAGRAM (FOR 8MX16X4 BANKS SHOWN)

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Integrated Silicon Solution, Inc. — www.issi.com 3Rev. H12/01/2011

IS42S86400B, IS42/45S16320B

VDD

DQ0

VDDQ

NC

DQ1

VSSQ

NC

DQ2

VDDQ

NC

DQ3

VSSQ

NC

VDD

NC

WE

CAS

RAS

CS

BA0

BA1

A10

A0

A1

A2

A3

VDD

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

54

53

52

51

50

49

48

47

46

45

44

43

42

41

40

39

38

37

36

35

34

33

32

31

30

29

28

VSS

DQ7

VSSQ

NC

DQ6

VDDQ

NC

DQ5

VSSQ

NC

DQ4

VDDQ

NC

VSS

NC

DQM

CLK

CKE

A12

A11

A9

A8

A7

A6

A5

A4

VSS

PIN CONFIGURATIONS54 pin TSOP - Type II for x8

PIN DESCRIPTIONS

A0-A12 RowAddressInput

A0-A9,A11 ColumnAddressInput

BA0,BA1 BankSelectAddress

DQ0toDQ7 DataI/O

CLK SystemClockInput

CKE ClockEnable

CS ChipSelect

RAS RowAddressStrobeCommand

CAS ColumnAddressStrobeCommand

WE WriteEnable

DQM DataInput/OutputMask

Vdd Power

Vss Ground

Vddq PowerSupplyforI/OPin

Vssq GroundforI/OPin

NC NoConnection

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IS42S86400B, IS42/45S16320B

PIN CONFIGURATIONS54 pin TSOP - Type II for x16

PIN DESCRIPTIONSA0-A12 RowAddressInput

A0-A9 ColumnAddressInput

BA0,BA1 BankSelectAddress

DQ0toDQ15 DataI/O

CLK SystemClockInput

CKE ClockEnable

CS ChipSelect

RAS RowAddressStrobeCommand

CAS ColumnAddressStrobeCommand

VDD

DQ0

VDDQ

DQ1

DQ2

VSSQ

DQ3

DQ4

VDDQ

DQ5

DQ6

VSSQ

DQ7

VDD

DQML

WE

CAS

RAS

CS

BA0

BA1

A10

A0

A1

A2

A3

VDD

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

54

53

52

51

50

49

48

47

46

45

44

43

42

41

40

39

38

37

36

35

34

33

32

31

30

29

28

VSS

DQ15

VSSQ

DQ14

DQ13

VDDQ

DQ12

DQ11

VSSQ

DQ10

DQ9

VDDQ

DQ8

VSS

NC

DQMH

CLK

CKE

A12

A11

A9

A8

A7

A6

A5

A4

VSS

WE WriteEnable

DQML x16LowerByte,Input/OutputMask

DQMH x16UpperByte,Input/OutputMask

Vdd Power

Vss Ground

Vddq PowerSupplyforI/OPin

Vssq GroundforI/OPin

NC NoConnection

Page 5: IS42S86400B IS42S16320B, IS45S16320B12/01/2011 IS42S86400B, IS42/45S16320B DEVICE OVERVIEW The 512Mb SDRAM is a high speed CMOS, dynamic random-access memory designed to operate in

Integrated Silicon Solution, Inc. — www.issi.com 5Rev. H12/01/2011

IS42S86400B, IS42/45S16320B

PIN CONFIGURATION54-ball W-BGA for x16 (TopView)(11.00mmx13.00mmBody,0.8mmBallPitch)packagecode:B

1 2 3 4 5 6 7 8 9

A

B

C

D

E

F

G

H

J

VSS

DQ14

DQ12

DQ10

DQ8

DQMH

A12

A8

VSS

DQ15

DQ13

DQ11

DQ9

NC

CLK

A11

A7

A5

VSSQ

VDDQ

VSSQ

VDDQ

VSS

CKE

A9

A6

A4

VDDQ

VSSQ

VDDQ

VSSQ

VDD

CAS

BA0

A0

A3

DQ0

DQ2

DQ4

DQ6

DQML

RAS

BA1

A1

A2

VDD

DQ1

DQ3

DQ5

DQ7

WE

CS

A10

VDD

PIN DESCRIPTIONSA0-A12 RowAddressInputA0-A9 ColumnAddressInputBA0,BA1 BankSelectAddressDQ0toDQ15 DataI/OCLK SystemClockInputCKE ClockEnableCS ChipSelectRAS RowAddressStrobeCommandCAS ColumnAddressStrobeCommand

WE WriteEnableDQML x16LowerByteInput/OutputMaskDQMH x16UpperByteInput/OutputMaskVdd PowerVss GroundVddq PowerSupplyforI/OPinVssq GroundforI/OPinNC NoConnection

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IS42S86400B, IS42/45S16320B

PIN FUNCTIONS Symbol Type Function (In Detail)

A0-A12 InputPin AddressInputs:A0-A12aresampledduringtheACTIVEcommand(row-addressA0-A12)andREAD/WRITEcommand(columnaddressA0-A9(x16);A0-A9,A11(x8);withA10definingautoprecharge)toselectonelocationoutofthememoryarrayintherespectivebank.A10issampledduringaPRECHARGEcommandtodetermineifallbanksaretobeprecharged(A10HIGH)orbankselectedbyBA0,BA1(LOW).Theaddressinputsalsoprovidetheop-codeduringaLOADMODEREGISTERcommand.

BA0,BA1 InputPin BankSelectAddress:BA0andBA1defineswhichbanktheACTIVE,READ,WRITEorPRECHARGEcommandisbeingapplied.

CAS InputPin CAS,inconjunctionwiththeRASandWE,formsthedevicecommand.Seethe"CommandTruthTable"fordetailsondevicecommands.

CKE InputPin TheCKEinputdetermineswhethertheCLKinputisenabled.ThenextrisingedgeoftheCLKsignalwillbevalidwhenisCKEHIGHandinvalidwhenLOW.WhenCKEisLOW,thedevicewillbeineitherpower-downmode,clocksuspendmode,orselfrefreshmode.CKEisanasynchronousinput.

CLK InputPin CLKisthemasterclockinputforthisdevice.ExceptforCKE,allinputstothisdeviceareacquiredinsynchronizationwiththerisingedgeofthispin.

CS InputPin TheCSinputdetermineswhethercommandinputisenabledwithinthedevice.CommandinputisenabledwhenCSisLOW,anddisabledwithCSisHIGH.ThedeviceremainsinthepreviousstatewhenCSisHIGH.

DQML, InputPin DQMLandDQMHcontrolthelowerandupperbytesoftheI/Obuffers.Inread

DQMH mode,DQMLandDQMHcontroltheoutputbuffer.WhenDQMLorDQMHisLOW,thecorrespondingbufferbyteisenabled,andwhenHIGH,disabled.TheoutputsgototheHIGHimpedancestatewhenDQML/DQMHisHIGH.ThisfunctioncorrespondstoOEinconventionalDRAMs.Inwritemode,DQMLandDQMHcontroltheinputbuffer.WhenDQMLorDQMHisLOW,thecorrespondingbufferbyteisenabled,anddatacanbewrittentothedevice.WhenDQMLorDQMHisHIGH,inputdataismaskedandcannotbewrittentothedevice.ForIS42/45S16320Bonly.

DQM InputPin ForIS42S86400Bonly.

DQ0-DQ7(x8)or Input/Output DataontheDataBusislatchedonDQpinsduringWritecommands,andbufferedfor DQ0-DQ15(x16) outputafterReadcommands.

RAS InputPin RAS,inconjunctionwithCASandWE,formsthedevicecommand.Seethe"Com-mandTruthTable"itemfordetailsondevicecommands.

WE InputPin WE,inconjunctionwithRASandCAS,formsthedevicecommand.Seethe"Com-mandTruthTable"itemfordetailsondevicecommands.

Vddq PowerSupplyPin Vddq istheoutputbufferpowersupply.

Vdd PowerSupplyPin Vddisthedeviceinternalpowersupply.

Vssq PowerSupplyPin Vssqistheoutputbufferground.

Vss PowerSupplyPin Vssisthedeviceinternalground.

Page 7: IS42S86400B IS42S16320B, IS45S16320B12/01/2011 IS42S86400B, IS42/45S16320B DEVICE OVERVIEW The 512Mb SDRAM is a high speed CMOS, dynamic random-access memory designed to operate in

Integrated Silicon Solution, Inc. — www.issi.com 7Rev. H12/01/2011

IS42S86400B, IS42/45S16320B

GENERAL DESCRIPTION

READTheREADcommandselectsthebankfromBA0,BA1inputsandstartsaburstreadaccesstoanactiverow.InputsA0-A9(x16);A0-A9,A11(x8)providesthestartingcolumnlocation.WhenA10isHIGH,thiscommandfunctionsasanAUTOPRECHARGEcommand.Whentheautoprechargeisselected,therowbeingaccessedwillbeprechargedattheendoftheREADburst.TherowwillremainopenforsubsequentaccesseswhenAUTOPRECHARGEisnotselected.DQ’sreaddataissubjecttothelogiclevelontheDQMinputs twoclocksearlier.WhenagivenDQMsignalwasregisteredHIGH,thecorrespondingDQ’swillbeHigh-Z twoclocks later.DQ’swillprovidevaliddatawhentheDQMsignalwasregisteredLOW.

WRITEAburstwriteaccesstoanactiverowisinitiatedwiththeWRITEcommand.BA0,BA1inputsselectsthebank,andthestartingcolumnlocationisprovidedbyinputsA0-A9(x16);A0-A9,A11(x8).WhetherornotAUTO-PRECHARGEisusedisdeterminedbyA10.

TherowbeingaccessedwillbeprechargedattheendoftheWRITEburst, ifAUTOPRECHARGE isselected. IfAUTOPRECHARGEisnotselected,therowwillremainopenforsubsequentaccesses.

AmemoryarrayiswrittenwithcorrespondinginputdataonDQ’sandDQMinputlogiclevelappearingatthesametime.DatawillbewrittentomemorywhenDQMsignalisLOW.WhenDQMisHIGH,thecorrespondingdatainputswillbeignored,andaWRITEwillnotbeexecutedtothatbyte/columnlocation.

PRECHARGEThePRECHARGEcommand isused todeactivate theopenrowinaparticularbankortheopenrowinallbanks.BA0,BA1canbeusedtoselectwhichbankisprechargedor they are treated as “Don’t Care”. A10 determinedwhetheroneorallbanksareprecharged.Afterexecut-ing this command, the next command for the selectedbank(s)isexecutedafterpassageoftheperiodtRP,whichistheperiodrequiredforbankprecharging.Onceabankhasbeenprecharged,itisintheidlestateandmustbeactivatedpriortoanyREADorWRITEcommandsbeingissuedtothatbank.

AUTO PRECHARGETheAUTOPRECHARGEfunctionensuresthatthepre-chargeisinitiatedattheearliestvalidstagewithinaburst.Thisfunctionallowsforindividual-bankprechargewithoutrequiringanexplicitcommand.A10toenabletheAUTO

PRECHARGEfunctioninconjunctionwithaspecificREADorWRITEcommand.ForeachindividualREADorWRITEcommand,autoprechargeiseitherenabledordisabled.AUTOPRECHARGEdoesnotapplyexceptinfull-pageburst mode. Upon completion of the READ or WRITEburst,aprechargeofthebank/rowthat isaddressedisautomaticallyperformed.

AUTO REFRESH COMMANDThiscommandexecutestheAUTOREFRESHoperation.Therowaddressandbanktoberefreshedareautomaticallygeneratedduringthisoperation. Thestipulatedperiod(trc)isrequiredforasinglerefreshoperation,andnoothercom-mandscanbeexecutedduringthisperiod. Thiscommandisexecutedatleast8192timesforevery64ms.DuringanAUTOREFRESHcommand,addressbitsare“Don’tCare”.ThiscommandcorrespondstoCBRAuto-refresh.

BURST TERMINATETheBURSTTERMINATEcommand forcibly terminatestheburstreadandwriteoperationsbytruncatingeitherfixed-length or full-page bursts and the most recentlyregisteredREADorWRITEcommandpriortotheBURSTTERMINATE.

COMMAND INHIBITCOMMANDINHIBITpreventsnewcommandsfrombeingexecuted.Operationsinprogressarenotaffected,apartfromwhethertheCLKsignalisenabled

NO OPERATION WhenCSislow,theNOPcommandpreventsunwantedcommands from being registered during idle or waitstates.

LOAD MODE REGISTERDuringtheLOADMODEREGISTERcommandthemoderegisterisloadedfromA0-A12.Thiscommandcanonlybeissuedwhenallbanksareidle.

ACTIVE COMMANDWhen the ACTIVE COMMAND is activated, BA0, BA1inputsselectsabanktobeaccessed,andtheaddressinputsonA0-A12selectstherow.UntilaPRECHARGEcommand is issued to thebank, therowremainsopenforaccesses.

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CKE

Function n-1 n DQMH DQML

Datawrite/outputenable H × L L

Datamask/outputdisable H × H H

Upperbytewriteenable/outputenable H × L ×

Lowerbytewriteenable/outputenable H × × L

Upperbytewriteinhibit/outputdisable H × H ×

Lowerbytewriteinhibit/outputdisable H × × H

CKE A12, A11

Function n – 1 n CS RAS CAS WE BA1 BA0 A10 A9 - A0

Devicedeselect(DESL) H × H × × × × × × ×

Nooperation(NOP) H × L H H H × × × ×

Burststop(BST) H × L H H L × × × ×

Read H × L H L H V V L V

Readwithautoprecharge H × L H L H V V H V

Write H × L H L L V V L V

Writewithautoprecharge H × L H L L V V H V

Bankactivate(ACT) H × L L H H V V V V

Prechargeselectbank(PRE) H × L L H L V V L ×

Prechargeallbanks(PALL) H × L L H L × × H ×

CBRAuto-Refresh(REF) H H L L L H × × × ×

Self-Refresh(SELF) H L L L L H × × × ×

Moderegisterset(MRS) H × L L L L L L L V

COMMAND TRUTH TABLE

DQM TRUTH TABLE

Note:H=Vih,L=Vilx=VihorVil,V=ValidData.

Note:H=Vih,L=Vilx=VihorVil,V=ValidData.

Page 9: IS42S86400B IS42S16320B, IS45S16320B12/01/2011 IS42S86400B, IS42/45S16320B DEVICE OVERVIEW The 512Mb SDRAM is a high speed CMOS, dynamic random-access memory designed to operate in

Integrated Silicon Solution, Inc. — www.issi.com 9Rev. H12/01/2011

IS42S86400B, IS42/45S16320B

CKE

CurrentState/Function n–1 n CS RAS CAS WE Address

ActivatingClocksuspendmodeentry H L × × × × ×

AnyClocksuspendmode L L × × × × ×

Clocksuspendmodeexit L H × × × × ×

AutorefreshcommandIdle(REF) H H L L L H ×

SelfrefreshentryIdle(SELF) H L L L L H ×

PowerdownentryIdle H L × × × × ×

Selfrefreshexit L H L H H H × L H H × × × ×

Powerdownexit L H × × × × ×

Note:H=Vih,L=Vilx=VihorVil,V=ValidData.

CKE TRUTH TABLE

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Current State CS RAS CAS WE Address Command Action

Idle H X X X X DESL NoporPowerDown(2)

L H H H X NOP NoporPowerDown(2)

L H H L X BST NoporPowerDown

L H L H BA,CA,A10 READ/READA ILLEGAL(3)

L H L L A,CA,A10 WRIT/WRITA ILLEGAL(3)

L L H H BA,RA ACT Rowactivating

L L H L BA,A10 PRE/PALL Nop

L L L H X REF/SELF AutorefreshorSelf-refresh(4)

L L L L OC,BA1=L MRS Moderegisterset

RowActive H X X X X DESL Nop

L H H H X NOP Nop

L H H L X BST Nop

L H L H BA,CA,A10 READ/READA Beginread(5)

L H L L BA,CA,A10 WRIT/WRITA Beginwrite(5)

L L H H BA,RA ACT ILLEGAL(3)

L L H L BA,A10 PRE/PALL Precharge

Prechargeallbanks(6)

L L L H X REF/SELF ILLEGAL

L L L L OC,BA MRS ILLEGAL

Read H X X X X DESL Continuebursttoendto Rowactive

L H H H X NOP ContinuebursttoendRow Rowactive

L H H L X BST Burststop,Rowactive

L H L H BA,CA,A10 READ/READA Terminateburst, beginnewread(7)

L H L L BA,CA,A10 WRIT/WRITA Terminateburst, beginwrite(7,8)

L L H H BA,RA ACT ILLEGAL(3)

L L H L BA,A10 PRE/PALL Terminateburst Precharging

L L L H X REF/SELF ILLEGAL

L L L L OC,BA MRS ILLEGAL

Write H X X X X DESL Continuebursttoend Writerecovering

L H H H X NOP Continuebursttoend Writerecovering

L H H L X BST Burststop,Rowactive

L H L H BA,CA,A10 READ/READA Terminateburst,startread: DetermineAP(7,8)

L H L L BA,CA,A10 WRIT/WRITA Terminateburst,newwrite: DetermineAP(7)

L L H H BA,RA RAACT ILLEGAL(3)

L L H L BA,A10 PRE/PALL TerminateburstPrecharging(9)

L L L H X REF/SELF ILLEGAL

L L L L OC,BA MRS ILLEGAL

FUNCTIONAL TRUTH TABLE

Note:H=Vih,L=Vilx=VihorVil,V=ValidData,BA=BankAddress,CA+ColumnAddress,RA=RowAddress,OC=Op-Code

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Integrated Silicon Solution, Inc. — www.issi.com 11Rev. H12/01/2011

IS42S86400B, IS42/45S16320B

Current State CS RAS CAS WE Address Command Action

Readwithauto H × × × × DESL Continuebursttoend,PrechargePrecharging

L H H H x NOP Continuebursttoend,Precharge

L H H L × BST ILLEGAL

L H L H BA,CA,A10 READ/READA ILLEGAL(11)

L H L L BA,CA,A10 WRIT/WRITA ILLEGAL(11)

L L H H BA,RA ACT ILLEGAL(3)

L L H L BA,A10 PRE/PALL ILLEGAL(11)

L L L H × REF/SELF ILLEGAL

L L L L OC,BA MRS ILLEGAL

WritewithAuto H × × × × DESL Continuebursttoend,Write Precharge recoveringwithautoprecharge

L H H H × NOP Continuebursttoend,Write recoveringwithautoprecharge

L H H L × BST ILLEGAL

L H L H BA,CA,A10 READ/READA ILLEGAL(11)

L H L L BA,CA,A10 WRIT/WRITA ILLEGAL(11)

L L H H BA,RA ACT ILLEGAL(3,11)

L L H L BA,A10 PRE/PALL ILLEGAL(3,11)

L L L H × REF/SELF ILLEGAL

L L L L OC,BA MRS ILLEGAL

Precharging H × × × × DESL Nop,EnteridleaftertRP

L H H H × NOP Nop,EnteridleaftertRP

L H H L × BST Nop,EnteridleaftertRP

L H L H BA,CA,A10 READ/READA ILLEGAL(3)

L H L L BA,CA,A10 WRIT/WRITA ILLEGAL(3)

L L H H BA,RA ACT ILLEGAL(3)

L L H L BA,A10 PRE/PALL NopEnteridleaftertRP

L L L H × REF/SELF ILLEGAL

L L L L OC,BA MRS ILLEGAL

RowActivating H × × × × DESL Nop,EnterbankactiveaftertRCD

L H H H × NOP Nop,EnterbankactiveaftertRCD

L H H L × BST Nop,EnterbankactiveaftertRCD

L H L H BA,CA,A10 READ/READA ILLEGAL(3)

L H L L BA,CA,A10 WRIT/WRITA ILLEGAL(3)

L L H H BA,RA ACT ILLEGAL(3,9)

L L H L BA,A10 PRE/PALL ILLEGAL(3)

L L L H × REF/SELF ILLEGAL

L L L L OC,BA MRS ILLEGAL

FUNCTIONAL TRUTH TABLE Continued:

Note:H=Vih,L=Vilx=VihorVil,V=ValidData,BA=BankAddress,CA+ColumnAddress,RA=RowAddress,OC=Op-Code

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Current State CS RAS CAS WE Address Command Action

WriteRecovering H × × × × DESL Nop,EnterrowactiveaftertDPL

L H H H × NOP Nop,EnterrowactiveaftertDPL

L H H L × BST Nop,EnterrowactiveaftertDPL

L H L H BA,CA,A10 READ/READA Beginread(8)

L H L L BA,CA,A10 WRIT/WRITA Beginnewwrite

L L H H BA,RA ACT ILLEGAL(3)

L L H L BA,A10 PRE/PALL ILLEGAL(3)

L L L H × REF/SELF ILLEGAL

L L L L OC,BA MRS ILLEGAL

WriteRecovering H × × × × DESL Nop,EnterprechargeaftertDPL

withAuto L H H H × NOP Nop,EnterprechargeaftertDPL

Precharge L H H L × BST Nop,EnterrowactiveaftertDPL

L H L H BA,CA,A10 READ/READA ILLEGAL(3,8,11)

L H L L BA,CA,A10 WRIT/WRITA ILLEGAL(3,11)

L L H H BA,RA ACT ILLEGAL(3,11)

L L H L BA,A10 PRE/PALL ILLEGAL(3,11)

L L L H × REF/SELF ILLEGAL

L L L L OC,BA MRS ILLEGAL

Refresh H × × × × DESL Nop,EnteridleaftertRC

L H H × × NOP/BST Nop,EnteridleaftertRC

L H L H BA,CA,A10 READ/READA ILLEGAL

L H L L BA,CA,A10 WRIT/WRITA ILLEGAL

L L H H BA,RA ACT ILLEGAL

L L H L BA,A10 PRE/PALL ILLEGAL

L L L H × REF/SELF ILLEGAL

L L L L OC,BA MRS ILLEGAL

ModeRegister H × × × × DESL Nop,Enteridleafter2clocks

Accessing L H H H × NOP Nop,Enteridleafter2clocks

L H H L × BST ILLEGAL

L H L × BA,CA,A10 READ/WRITE ILLEGAL

L L × × BA,RA ACT/PRE/PALL ILLEGAL REF/MRS

FUNCTIONAL TRUTH TABLE Continued:

Note:H=Vih,L=Vilx=VihorVil,V=ValidData,BA=BankAddress,CA+ColumnAddress,RA=RowAddress,OC=Op-Code

Notes:1.AllentriesassumethatCKEisactive(CKEn-1=CKEn=H).2.Ifbothbanksareidle,andCKEisinactive(Low),thedevicewillenterPowerDownmode.AllinputbuffersexceptCKEwillbe

disabled.3.Illegaltobankinspecifiedstates;FunctionmaybelegalinthebankindicatedbyBankAddress(BA),dependingonthestateof

thatbank.4.Ifbothbanksareidle,andCKEisinactive(Low),thedevicewillenterSelf-Refreshmode.AllinputbuffersexceptCKEwillbe

disabled.5.IllegaliftRCDisnotsatisfied.6.IllegaliftRASisnotsatisfied.7.Mustsatisfyburstinterruptcondition.8.Mustsatisfybuscontention,busturnaround,and/orwriterecoveryrequirements.9.Mustmaskprecedingdatawhichdon’tsatisfytDPL.10.IllegaliftRRDisnotsatisfied.11.Illegalforsinglebank,butlegalforotherbanks.

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Integrated Silicon Solution, Inc. — www.issi.com 13Rev. H12/01/2011

IS42S86400B, IS42/45S16320B

CKE RELATED COMMAND TRUTH TABLE(1)

CKE Current State Operation n-1 n CS RAS CAS WE AddressSelf-Refresh(S.R.) INVALID,CLK(n-1)wouldexitS.R. H X X X X X X Self-RefreshRecovery(2) L H H X X X X Self-RefreshRecovery(2) L H L H H X X Illegal L H L H L X X Illegal L H L L X X X MaintainS.R. L L X X X X XSelf-RefreshRecoveryIdleAftertrc H H H X X X X IdleAftertrc H H L H H X X Illegal H H L H L X X Illegal H H L L X X X Beginclocksuspendnextcycle(5) H L H X X X X Beginclocksuspendnextcycle(5) H L L H H X X Illegal H L L H L X X Illegal H L L L X X X Exitclocksuspendnextcycle(2) L H X X X X X Maintainclocksuspend L L X X X X XPower-Down(P.D.) INVALID,CLK(n-1)wouldexitP.D. H X X X X X — EXITP.D.-->Idle(2) L H X X X X X Maintainpowerdownmode L L X X X X XAllBanksIdle RefertooperationsinOperativeCommandTable H H H X X X — RefertooperationsinOperativeCommandTable H H L H X X — RefertooperationsinOperativeCommandTable H H L L H X — Auto-Refresh H H L L L H X RefertooperationsinOperativeCommandTable H H L L L L Op-Code RefertooperationsinOperativeCommandTable H L H X X X — RefertooperationsinOperativeCommandTable H L L H X X — RefertooperationsinOperativeCommandTable H L L L H X — Self-Refresh(3) H L L L L H X RefertooperationsinOperativeCommandTable H L L L L L Op-Code Power-Down(3) L X X X X X XAnystate RefertooperationsinOperativeCommandTable H H X X X X Xotherthan Beginclocksuspendnextcycle(4) H L X X X X Xlistedabove Exitclocksuspendnextcycle L H X X X X X Maintainclocksuspend L L X X X X X

Notes:1.H:Highlevel,L:lowlevel,X:Highorlowlevel(Don’tcare).2.CKELowtoHightransitionwillre-enableCLKandotherinputsasynchronously.Aminimumsetup

timemustbesatisfiedbeforeanycommandotherthanEXIT.3.PowerdownandSelfrefreshcanbeenteredonlyfromthebothbanksidlestate.4.MustbelegalcommandasdefinedinOperativeCommandTable.5.Illegaliftxsrisnotsatisfied.

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ModeRegister

SetIDLE

SelfRefresh

CBR (Auto)Refresh

RowActive

ActivePowerDown

PowerDown

WRITEWRITE

SUSPENDREAD

READSUSPEND

WRITEASUSPEND

WRITEA READAREADA

SUSPEND

POWERON

Precharge

Automatic sequence

Manual Input

SELF

SELF exit

REFMRS

ACT

CKE

CKE

CKE

CKE

BST

Read

Write

Write

Precharge

RR

E (Precharge termination) PR

E (P

rech

arge

term

inat

ion)

Writ

e w

ithA

uto

Pre

char

ge Read w

ith

Auto P

recharge

Read

Write

BST

CKE

CKECKE

CKE

CKE

CKECKE

CKE

Read

STATE DIAGRAM

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Integrated Silicon Solution, Inc. — www.issi.com 15Rev. H12/01/2011

IS42S86400B, IS42/45S16320B

ABSOLUTE MAXIMUM RATINGS(1)

Symbol Parameters Rating Unit

Vdd max MaximumSupplyVoltage –1.0to+4.6 V Vddqmax MaximumSupplyVoltageforOutputBuffer –1.0to+4.6 V Vin InputVoltage –1.0toVdd+0.5 V Vout OutputVoltage –1.0toVddq+0.5 V Pd max AllowablePowerDissipation 1 W Ics outputShortedCurrent 50 mA Topr operatingTemperature Com. 0to+70 °C Ind. -40to+85 A1 -40to+85 A2 -40to+105 Tstg StorageTemperature –65to+150 °C

DC RECOMMENDED OPERATING CONDITIONS(Ta=0°Cto+70°CforCommercialgrade.Ta=-40°Cto+85°CforIndustrialandA1grade.Ta=-40°Cto+105°CforA2grade)

Symbol Parameter Min. Typ. Max. Unit

Vdd SupplyVoltage 3.0 3.3 3.6 V Vddq I/OSupplyVoltage 3.0 3.3 3.6 V Vih(1) InputHighVoltage 2.0 — Vddq +0.3 V Vil(2) InputLowVoltage -0.3 — +0.8 V

CAPACITANCE CHARACTERISTICS (AtTa=0to+25°C,Vdd=Vddq =3.3±0.3V)

Symbol Parameter Min. Max. Unit

Cin1 InputCapacitance:CLK 2.5 3.5 pF Cin2 InputCapacitance:Allotherinputpins 2.5 3.8 pF Ci/o DataInput/OutputCapacitance:DQS 4.0 6.0 pF

Note:

1.Vih (overshoot): Vih (max)=Vddq +1.2V (pulse width < 3ns).

2.Vil (undershoot): Vih (min)=-1.2V (pulse width < 3ns).3. AllvoltagesarereferencedtoVss.

Notes:1. StressgreaterthanthoselistedunderABSOLUTEMAXIMUMRATINGSmaycausepermanentdamageto

thedevice.Thisisastressratingonlyandfunctionaloperationofthedeviceattheseoranyotherconditionsabovethoseindicatedintheoperationalsectionsofthisspecificationisnotimplied.Exposuretoabsolutemaximumratingconditionsforextendedperiodsmayaffectreliability.

2. AllvoltagesarereferencedtoVss.

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DC ELECTRICAL CHARACTERISTICS 1 (RecommendedOperationConditionsunlessotherwisenoted.)

Symbol Parameter Test Condition -6 -7 -75E Unit

idd1(1) OperatingCurrent Onebankactive,CL=3,BL=1, 160 140 160 mA

tclk=tclk(min),trc=trc(min)

idd2p PrechargeStandbyCurrent CKE≤Vil(max),tck=15ns 4 4 4 mA (InPower-DownMode)

idd2ps PrechargeStandbyCurrent CKE≤Vil(max),CLK≤Vil(max) 4 4 4 mA (InPower-DownMode)

idd2n (2) PrechargeStandbyCurrent CS ≥ Vcc-0.2V,CKE≥ Vih(min) 35 35 35 mA

(InNonPower-DownMode) tck=15ns

Idd2ns PrechargeStandbyCurrent CS ≥ Vcc-0.2V,CKE≥ Vih(min)or 20 20 20 mA

(InNonPower-DownMode) CKE≤Vil(max),Allinputsstable

Idd3p ActiveStandbyCurrent CKE≤Vil(max),tck=15ns 6 6 6 mA

(Power-DownMode)

Idd3ps ActiveStandbyCurrent CKE≤Vil(max),CLK≤Vil(max) 6 6 6 mA

(Power-DownMode)

idd3n (2) ActiveStandbyCurrent CS ≥ Vcc-0.2V,CKE≥ Vih(min) 55 55 55 mA

(InNonPower-DownMode) tck=15ns

Idd3ns ActiveStandbyCurrent CS ≥ Vcc-0.2V,CKE≥ Vih(min)or 30 30 30 mA

(InNonPower-DownMode) CKE≤Vil(max),Allinputsstable

idd4 OperatingCurrent Allbanksactive,BL=4,CL=3, 180 150 180 mA

tck=tck(min)

idd5 Auto-RefreshCurrent trc=trc(min),tclk=tclk(min) 350 300 350 mA

idd6 Self-RefreshCurrent CKE≤ 0.2V 6 6 6 mA

Notes:1. Idd(max)isspecifiedattheoutputopencondition.2. Inputsignalsarechangedonetimeduring30ns.

DC ELECTRICAL CHARACTERISTICS 2 (RecommendedOperationConditionsunlessotherwisenoted.)

Symbol Parameter Test Condition Min Max Unit

iil InputLeakageCurrent 0V≤Vin≤Vcc,withpinsotherthan -5 5 µA

thetestedpinat0V

iol OutputLeakageCurrent Outputisdisabled,0V≤Vout≤Vcc, -5 5 µA

Voh OutputHighVoltageLevel Ioh=-2mA 2.4 — V

Vol OutputLowVoltageLevel Iol=2mA — 0.4 V

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IS42S86400B, IS42/45S16320B

AC ELECTRICAL CHARACTERISTICS (1,2,3)

-6 -7 -75E Symbol Parameter Min. Max. Min. Max. Min. Max. Units tck3 ClockCycleTime CASLatency=3 6 — 7 — — — ns tck2 CASLatency=2 10 — 10 — 7.5 — ns

tac3 AccessTimeFromCLK CASLatency=3 — 5.4 — 5.4 — — ns tac2 CASLatency=2 — 6 — 6 — 5.5 ns

tch CLKHIGHLevelWidth 2.5 — 2.5 — 2.5 — ns

tcl CLKLOWLevelWidth 2.5 — 2.5 — 2.5 — ns

toh3 OutputDataHoldTime CASLatency=3 2.7 — 2.7 — 2.7 — ns toh2 CASLatency=2 2.7 — 2.7 — 2.7 — ns

tlz OutputLOWImpedanceTime 0 — 0 — 0 — ns

thz3 OutputHIGHImpedanceTime 2.7 5.4 2.7 5.4 — — ns

thz2 OutputHIGHImpedanceTime 2.7 6 2.7 6 2.7 5.5 ns

tds InputDataSetupTime(2) 1.5 — 1.5 — 1.5 — ns

tdh InputDataHoldTime(2) 0.8 — 0.8 — 0.8 — ns

tas AddressSetupTime(2) 1.5 — 1.5 — 1.5 — ns

tah AddressHoldTime(2) 0.8 — 0.8 — 0.8 — ns

tcks CKESetupTime(2) 1.5 — 1.5 — 1.5 — ns

tckh CKEHoldTime(2) 0.8 — 0.8 — 0.8 — ns

tcms CommandSetupTime(CS,RAS,CAS,WE,DQM)(2) 1.5 — 1.5 — 1.5 — ns

tcmh CommandHoldTime(CS,RAS,CAS,WE,DQM)(2) 0.8 — 0.8 — 0.8 — ns

trc CommandPeriod(REFtoREF/ACTtoACT) 60 — 70 — 60 — ns

tras CommandPeriod(ACTtoPRE) 42 100K 49 100K 45 100K ns

trp CommandPeriod(PREtoACT) 18 — 20 — 15 — ns

trcd ActiveCommandToRead/WriteCommandDelayTime 18 — 20 — 15 — ns

trrd CommandPeriod(ACT[0]toACT[1]) 12 — 14 — 15 — ns

tdpl InputDataToPrecharge 12 — 14 — 15 — ns CommandDelaytime

tdal InputDataToActive/Refresh 30 — 35 — 30 — ns CommandDelaytime(DuringAuto-Precharge)

tmrd ModeRegisterProgramTime 12 — 14 — 15 — ns

tdde PowerDownExitSetupTime 6 — 7 — 7.5 — ns

txsr ExitSelf-RefreshtoActiveTime(4) 66 — 77 — 67.5 — ns

tt TransitionTime 0.3 1.2 0.3 1.2 0.3 1.2 ns

tref RefreshCycleTime(8192) Ta≤70oCCom.,Ind.,A1,A2 — 64 — 64 — 64 ms Ta≤85oCInd.,A1,A2 — 64 — 64 — 64 ms Ta>85oCA2 — — — 16 — — msNotes:1. Thepower-onsequencemustbeexecutedbeforestartingmemoryoperation.2. measuredwithtt =1ns.Ifclockrisingtimeislongerthan1ns,(tt/2-0.5)nsshouldbeaddedtotheparameter.3.Thereferencelevelis1.4Vwhenmeasuringinputsignaltiming.RiseandfalltimesaremeasuredbetweenVih(min.)andVil

(max).4.Self-RefreshModeisnotsupportedforA2gradewithTa>+85oC.

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OPERATING FREQUENCY / LATENCY RELATIONSHIPS

SYMBOL PARAMETER -6 -7 -75E UNITS

— ClockCycleTime CASLatency=3 6 7 — ns CASLatency=2 10 10 7.5 ns

— OperatingFrequency CASLatency=3 166 143 — MHz CASLatency=2 100 100 133 MHz

tcac CASLatency CASLatency=3 3 3 — cycle CASLatency=2 2 2 2 cycle

trcd ActiveCommandToRead/WriteCommandDelayTime CASLatency=3 3 3 — cycle CASLatency=2 2 2 2 cycle

trac RASLatency(trcd+tcac) CASLatency=3 6 6 — cycle CASLatency=2 4 4 4 cycle

trc CommandPeriod(REFtoREF/ACTtoACT) CASLatency=3 10 10 — cycle CASLatency=2 6 7 8 cycle

tras CommandPeriod(ACTtoPRE) CASLatency=3 7 7 — cycle CASLatency=2 5 5 6 cycle

trp CommandPeriod(PREtoACT) CASLatency=3 3 3 — cycle CASLatency=2 2 2 2 cycle

trrd CommandPeriod(ACT[0]toACT[1]) 2 2 2 cycle

tccd ColumnCommandDelayTime 1 1 1 cycle (READ,READA,WRIT,WRITA)

tdpl InputDataToPrechargeCommandDelayTime 2 2 2 cycle

tdal InputDataToActive/RefreshCommandDelayTime CASLatency=3 5 5 — cycle (DuringAuto-Precharge) CASLatency=2 4 4 4 cycle

trbd BurstStopCommandToOutputinHIGH-ZDelayTime CASLatency=3 3 3 — cycle (Read) CASLatency=2 2 2 2 cycle

twbd BurstStopCommandToInputinInvalidDelayTime 0 0 0 cycle (Write)

trql PrechargeCommandToOutputinHIGH-ZDelayTime CASLatency=3 3 3 — cycle (Read) CASLatency=2 2 2 2 cycle

twdl PrechargeCommandToInputinInvalidDelayTime 0 0 0 cycle (Write)

tpql LastOutputToAuto-PrechargeStartTime(Read) CASLatency=3 -2 -2 — cycle CASLatency=2 -1 -1 -1 cycle

tqmd DQMToOutputDelayTime(Read) 2 2 2 cycle

tdmd DQMToInputDelayTime(Write) 0 0 0 cycle

tmrd ModeRegisterSetToCommandDelayTime 2 2 2 cycle

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Integrated Silicon Solution, Inc. — www.issi.com 19Rev. H12/01/2011

IS42S86400B, IS42/45S16320B

AC TEST CONDITIONS

Input Load Output Load

Output Z = 50Ω

50 pF

1.4V

50Ω

3.0V

1.4V

0V

CLK

INPUT

OUTPUT

tCH

tCMH

tACtOH

tCMS

tCK

tCL

3.0V

1.4V

1.4V 1.4V

0V

AC TEST CONDITIONS

Parameter Rating ACInputLevels 0Vto3.0V InputRiseandFallTimes 1ns InputTimingReferenceLevel 1.4V OutputTimingMeasurementReferenceLevel 1.4V

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FUNCTIONAL DESCRIPTIONThe512MbSDRAMsarequad-bankDRAMswhichoperateat3.3Vandincludeasynchronousinterface(allsignalsare registeredon thepositiveedgeof theclocksignal,CLK).Eachofthe134,217,728-bitbanksisorganizedas8,192rowsby1024columnsby16bitsor8192rowsby2048columnsby8bits.

ReadandwriteaccessestotheSDRAMareburstoriented;accesses start at a selected location and continue fora programmed number of locations in a programmedsequence. Accesses begin with the registration of anACTIVEcommandwhichisthenfollowedbyaREADorWRITEcommand.TheaddressbitsregisteredcoincidentwiththeACTIVEcommandareusedtoselectthebankandrowtobeaccessed(BA0andBA1selectthebank,A0-A12 select the row).The address bits A0-A9 (x16); A0-A9,A11(x8)registeredcoincidentwiththeREADorWRITEcommandareusedtoselectthestartingcolumnlocationfortheburstaccess.

Prior to normal operation, the SDRAM must be initial-ized.Thefollowingsectionsprovidedetailedinformationcoveringdeviceinitialization,registerdefinition,commanddescriptionsanddeviceoperation.

InitializationSDRAMs must be powered up and initialized in apredefinedmanner.

The512MbSDRAMisinitializedafterthepowerisappliedtoVddandVddq(simultaneously)andtheclockisstablewithDQMHighandCKEHigh.

A100µsdelayisrequiredpriortoissuinganycommandotherthanaCOMMANDINHIBIToraNOP.TheCOMMANDINHIBITorNOPmaybeappliedduringthe100usperiodandshouldcontinueatleastthroughtheendoftheperiod.

WithatleastoneCOMMANDINHIBITorNOPcommandhavingbeenapplied,aPRECHARGEcommandshouldbeappliedoncethe100µsdelayhasbeensatisfied.Allbanksmustbeprecharged.ThiswillleaveallbanksinanidlestateafterwhichatleasteightAUTOREFRESHcyclesmustbeperformed. AftertheAUTOREFRESHcyclesarecomplete, the SDRAM is then ready for mode registerprogramming.

The mode register should be loaded prior to applyinganyoperationalcommandbecauseitwillpowerupinanunknownstate.

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Integrated Silicon Solution, Inc. — www.issi.com 21Rev. H12/01/2011

IS42S86400B, IS42/45S16320B

INITIALIzE AND LOAD MODE REGISTER(1)

DON'T CARE

CLK

CKE

COMMAND

DQM/DQML, DQMH

A0-A9, A11, A12

A10

BA0, BA1

DQ

tCH tCLtCK

tCMS tCMH tCMS tCMH tCMS tCMH

tCKS tCKH

T0 T1 Tn+1 To+1 Tp+1 Tp+2 Tp+3

tMRDtRCtRCtRP

ROW

ROW

BANK

tAS tAH

tAS tAH

CODE

CODEALL BANKS

SINGLE BANK

ALL BANKS

AUTOREFRESH

AUTOREFRESH

Load MODEREGISTER

T = 200µs Min.

Power-up: VCC

and CLK stablePrechargeall banks

AUTO REFRESH Program MODE REGISTER

NOP PRECHARGE NOP NOP NOP ACTIVE

T

(2, 3, 4)AUTO REFRESH

At least 8 Auto-Refresh Commands

CODE

tAS tAH

Notes:1.IfCSisHighatclockHightime,allcommandsappliedareNOP.2.TheModeregistermaybeloadedpriortotheAuto-Refreshcyclesifdesired.3.JEDECandPC100specifythreeclocks.4.OutputsareguaranteedHigh-Zafterthecommandisissued.

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AUTO-REFRESH CYCLE

Notes:1.CASlatency=2,3

tRP tRC tRC

DON'T CARE

CLK

CKE

COMMAND

DQM/DQML, DQMH

A0-A9, A11, A12

A10

BA0, BA1

DQ

tAS tAH

tCHtCLtCK

tCMS tCMH

tCKS tCKH

T0 T1 T2 Tn+1 To+1

ALL BANKS

SINGLE BANK

BANK(s)

ROW

ROW

BANK

High-Z

PRECHARGE NOP NOP NOP ACTIVEAutoRefresh

AutoRefresh

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IS42S86400B, IS42/45S16320B

SELF-REFRESH CYCLE

CLK

CKE

COMMAND

DQM/DQML, DQMH

A0-A9, A11, A12

A10

BA0, BA1

DQ

tAS tAH

BANK

tCLtCHtCK

tCMS tCMH

tCKS tCKH

ALL BANKS

SINGLE BANK

tCKS

Precharge allactive banks

CLK stable prior to exitingself refresh mode

Enter selfrefresh mode

Exit self refresh mode(Restart refresh time base)

T0 T1 T2 Tn+1 To+1 To+2

High-Z

AutoRefresh

AutoRefreshPRECHARGE NOP NOP NOP

tCKS

≥ tRAS

tRP tXSR

DON'T CARE

Note:1.Self-RefreshModeisnotsupportedforA2gradewithTa>+85oC.

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REGISTER DEFINITION

Mode RegisterThemode register isused todefine thespecificmodeofoperationof theSDRAM.Thisdefinition includestheselectionofaburstlength,abursttype,aCASlatency,anoperatingmodeandawriteburstmode,asshowninMODEREGISTERDEFINITION.

ThemoderegisterisprogrammedviatheLOADMODEREGISTERcommandandwillretainthestoredinformationuntilitisprogrammedagainorthedevicelosespower.

Mode register bitsM0-M2specify theburst length,M3specifiesthetypeofburst(sequentialorinterleaved),M4-M6specifytheCASlatency,M7andM8specifytheoperatingmode,M9specifiestheWRITEburstmode,andM10,M11,andM12arereservedforfutureuse.

Themode registermustbe loadedwhenallbanksareidle,andthecontrollermustwaitthespecifiedtimebeforeinitiatingthesubsequentoperation.Violatingeitheroftheserequirementswillresultinunspecifiedoperation.

MODE REGISTER DEFINITION

Latency Mode

M6 M5 M4 CAS Latency

0 0 0 Reserved 0 0 1 Reserved 0 1 0 2 0 1 1 3 1 0 0 Reserved 1 0 1 Reserved 1 1 0 Reserved 1 1 1 Reserved

1. To ensure compatibility with future devices,should program BA1, BA0, A12, A11, A10 = "0"

Write Burst Mode

M9 Mode

0 Programmed Burst Length

1 Single Location Access

Operating Mode

M8 M7 M6-M0 Mode

0 0 Defined Standard Operation — — — All Other States Reserved

Burst Type

M3 Type

0 Sequential 1 Interleaved

Burst Length

M2 M1 M0 M3=0 M3=1

0 0 0 1 1 0 0 1 2 2 0 1 0 4 4 0 1 1 8 8 1 0 0 Reserved Reserved 1 0 1 Reserved Reserved 1 1 0 Reserved Reserved 1 1 1 Full Page Reserved

Reserved

Address Bus (Ax)

Mode Register (Mx)

(1)

BA1 BA0 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0

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IS42S86400B, IS42/45S16320B

BURST DEFINITION

Burst Starting Column Order of Accesses Within a Burst

Length Address Type = Sequential Type = Interleaved

A 0

2 0 0-1 0-1

1 1-0 1-0

A 1 A 0

0 0 0-1-2-3 0-1-2-3

4 0 1 1-2-3-0 1-0-3-2

1 0 2-3-0-1 2-3-0-1

1 1 3-0-1-2 3-2-1-0

A 2 A 1 A 0

0 0 0 0-1-2-3-4-5-6-7 0-1-2-3-4-5-6-7

0 0 1 1-2-3-4-5-6-7-0 1-0-3-2-5-4-7-6

0 1 0 2-3-4-5-6-7-0-1 2-3-0-1-6-7-4-5

8 0 1 1 3-4-5-6-7-0-1-2 3-2-1-0-7-6-5-4

1 0 0 4-5-6-7-0-1-2-3 4-5-6-7-0-1-2-3

1 0 1 5-6-7-0-1-2-3-4 5-4-7-6-1-0-3-2

1 1 0 6-7-0-1-2-3-4-5 6-7-4-5-2-3-0-1

1 1 1 7-0-1-2-3-4-5-6 7-6-5-4-3-2-1-0

Full n=A0-A9(x16) Cn,Cn+1,Cn+2 NotSupported Page n=A0-A9,A11(x8) Cn+3,Cn+4... (y) (location0-y) …Cn-1, Cn…

BURST LENGTHReadandwriteaccessestotheSDRAMareburstoriented,withtheburst lengthbeingprogrammable,asshowninMODEREGISTERDEFINITION.Theburstlengthdeter-minesthemaximumnumberofcolumnlocationsthatcanbeaccessedforagivenREADorWRITEcommand.Burstlengthsof1,2,4or8locationsareavailableforboththesequentialandtheinterleavedbursttypes,andafull-pageburst is available for the sequential type.The full-pageburstisusedinconjunctionwiththeBURSTTERMINATEcommandtogeneratearbitraryburstlengths.

Reservedstatesshouldnotbeused,asunknownoperationorincompatibilitywithfutureversionsmayresult.

WhenaREADorWRITEcommandisissued,ablockofcolumnsequaltotheburstlengthiseffectivelyselected.Allaccessesforthatbursttakeplacewithinthisblock,mean-ingthattheburstwillwrapwithintheblockifaboundary

isreached.TheblockisuniquelyselectedbyA1-A9(x16)orA1-A9,A11(x8)whentheburstlengthissettotwo;byA2-A9(x16)orA1-A9,A11(x8)whentheburstlengthissettofour;andbyA3-A9(x16)orA1-A9,A11(x8)whentheburstlengthissettoeight.Theremaining(leastsig-nificant)addressbit(s)is(are)usedtoselectthestartinglocationwithintheblock.Full-pageburstswrapwithinthepageiftheboundaryisreached.

BurstTypeAccesseswithinagivenburstmaybeprogrammedtobeeithersequentialorinterleaved;thisisreferredtoasthebursttypeandisselectedviabitM3.

Theorderingofaccesseswithinaburstisdeterminedbytheburstlength,thebursttypeandthestartingcolumnaddress,asshowninBURSTDEFINITIONtable.

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DON'T CARE

UNDEFINED

CLK

COMMAND

DQ

READ NOP NOP NOP

CAS Latency - 3

tAC

tOH

DOUT

T0 T1 T2 T3 T4

tLZ

CLK

COMMAND

DQ

READ NOP NOP

CAS Latency - 2

tAC

tOH

DOUT

T0 T1 T2 T3

tLZ

CAS LATENCY

CAS LatencyTheCAS latency is thedelay, inclockcycles,betweentheregistrationofaREADcommandandtheavailabilityofthefirstpieceofoutputdata.Thelatencycanbesettotwoorthreeclocks.

IfaREADcommandisregisteredatclockedgen,andthelatencyism clocks,thedatawillbeavailablebyclockedgen + m.TheDQswillstartdrivingasaresultoftheclockedgeonecycleearlier(n + m -1),andprovidedthattherelevantaccesstimesaremet,thedatawillbevalidbyclockedgen + m.Forexample,assumingthattheclockcycletimeissuchthatallrelevantaccesstimesaremet,ifaREADcommandisregisteredatT0andthelatencyisprogrammedto twoclocks, theDQswillstartdrivingafterT1andthedatawillbevalidbyT2,asshowninCASLatency diagrams.The Allowable Operating FrequencytableindicatestheoperatingfrequenciesatwhicheachCASlatencysettingcanbeused.

Reservedstatesshouldnotbeusedasunknownoperationorincompatibilitywithfutureversionsmayresult.

CAS LatencyAllowable Operating Frequency (MHz)

Speed CAS Latency = 2 CAS Latency = 3

-6 100 166

-7 100 143

-75E 133 —

Operating ModeThenormaloperatingmodeisselectedbysettingM7andM8tozero;theothercombinationsofvaluesforM7andM8arereservedforfutureuseand/ortestmodes.TheprogrammedburstlengthappliestobothREADandWRITEbursts.

Testmodesandreservedstatesshouldnotbeusedbe-cause unknown operation or incompatibility with futureversionsmayresult.

Write Burst ModeWhenM9=0,theburstlengthprogrammedviaM0-M2appliestobothREADandWRITEbursts;whenM9=1,theprogrammedburstlengthappliestoREADbursts,butwriteaccessesaresingle-location(nonburst)accesses.

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CLK

CKE

ROW ADDRESS

BANK ADDRESS

CS

RAS

CAS

WE

A0-A12

BA0, BA1

HIGH

ACTIVATING SPECIFIC ROW WITHIN SPE-CIFIC BANK

DON'T CARE

CLK

COMMAND ACTIVE NOP NOP

tRCD

T0 T1 T2 T3 T4

READ orWRITE

CHIP OPERATION

BANK/ROW ACTIVATIONBeforeanyREADorWRITEcommandscanbe issuedtoabankwithintheSDRAM,arowinthatbankmustbe“opened.”ThisisaccomplishedviatheACTIVEcommand,whichselectsboththebankandtherowtobeactivated(seeActivatingSpecificRowWithinSpecificBank).

Afteropeningarow(issuinganACTIVEcommand),aREADorWRITEcommandmaybeissuedtothatrow,subjecttothetrcdspecification.Minimumtrcdshouldbedividedbytheclockperiodandroundeduptothenextwholenumberto determine the earliest clock edge after the ACTIVEcommandonwhichaREADorWRITEcommandcanbeentered.Forexample,atrcdspecificationof15nswitha143MHzclock(7nsperiod)resultsin2.14clocks,roundedto3.Thisisreflectedinthefollowingexample,whichcov-ersanycasewhere2<[trcd(MIN)/tck]≤3.(Thesameprocedureisusedtoconvertotherspecificationlimitsfromtimeunitstoclockcycles).

AsubsequentACTIVEcommandtoadifferentrowinthesamebankcanonlybeissuedafterthepreviousactiverowhasbeen“closed”(precharged).TheminimumtimeintervalbetweensuccessiveACTIVEcommands to thesamebankisdefinedbytrc.

AsubsequentACTIVEcommandtoanotherbankcanbeissuedwhilethefirstbankisbeingaccessed,whichresultsinareductionoftotalrow-accessoverhead.TheminimumtimeintervalbetweensuccessiveACTIVEcommandstodifferentbanksisdefinedbytrrd.

EXAMPLE: MEETING TRCD (MIN) WHEN 2 < [TRCD (MIN)/TCK] ≤ 3

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CLK

CKEHIGH

COLUMN ADDRESS

AUTO PRECHARGE

NO PRECHARGE

CS

RAS

CAS

WE

A0-A9

A10

BA0, BA1 BANK ADDRESS

A11, A12

READ COMMANDREADSREAD bursts are initiated with a READ command, asshownintheREADCOMMANDdiagram.

ThestartingcolumnandbankaddressesareprovidedwiththeREADcommand,andautoprechargeiseitherenabledordisabledforthatburstaccess.Ifautoprechargeisenabled,therowbeingaccessedisprechargedatthecompletionoftheburst.ForthegenericREADcommandsusedinthefol-lowingillustrations,autoprechargeisdisabled.

DuringREADbursts,thevaliddata-outelementfromthestarting column address will be available following theCASlatencyaftertheREADcommand.Eachsubsequentdata-outelementwillbevalidbythenextpositiveclockedge.TheCASLatencydiagramshowsgeneral timingforeachpossibleCASlatencysetting.

Uponcompletionofaburst,assumingnoothercommandshavebeeninitiated,theDQswillgoHigh-Z.Afull-pageburstwillcontinueuntilterminated.(Attheendofthepage,itwillwraptocolumn0andcontinue.)

DatafromanyREADburstmaybetruncatedwithasub-sequentREADcommand,anddatafromafixed-lengthREADburstmaybeimmediatelyfollowedbydatafromaREADcommand.Ineithercase,acontinuousflowofdatacanbemaintained.Thefirstdataelementfromthenewburstfollowseitherthelastelementofacompletedburstorthelastdesireddataelementofalongerburstwhichisbeingtruncated.

ThenewREADcommandshouldbeissuedx cyclesbeforetheclockedgeatwhichthelastdesireddataelementisvalid,wherex equalstheCASlatencyminusone.ThisisshowninConsecutiveREADBurstsforCASlatenciesoftwoandthree;dataelementn +3iseitherthelastofaburstoffourorthelastdesiredofalongerburst.The512MbSDRAMusesapipelinedarchitectureandthereforedoesnotrequirethe2n ruleassociatedwithaprefetcharchitec-ture.AREADcommandcanbeinitiatedonanyclockcyclefollowingapreviousREADcommand.Full-speedrandomreadaccessescanbeperformedtothesamebank,asshowninRandomREADAccesses,oreachsubsequentREADmaybeperformedtoadifferentbank.

DatafromanyREADburstmaybetruncatedwithasub-sequent WRITE command, and data from a fixed-lengthREADburstmaybeimmediatelyfollowedbydatafromaWRITEcommand(subjecttobusturnaroundlimitations).TheWRITEburstmaybeinitiatedontheclockedgeim-mediatelyfollowingthelast(orlastdesired)dataelementfromtheREADburst,providedthatI/Ocontentioncanbeavoided.Inagivensystemdesign,theremaybeapos-sibilitythatthedevicedrivingtheinputdatawillgoLow-ZbeforetheSDRAMDQsgoHigh-Z.Inthiscase,atleastasingle-cycledelayshouldoccurbetweenthelastreaddataandtheWRITEcommand.

TheDQMinputisusedtoavoidI/Ocontention,asshowninFiguresRW1andRW2.TheDQMsignalmustbeas-serted (HIGH)at least threeclocksprior to theWRITEcommand(DQMlatencyistwoclocksforoutputbuffers)tosuppressdata-out fromtheREAD.Once theWRITEcommandisregistered,theDQswillgoHigh-Z(orremainHigh-Z),regardlessofthestateoftheDQMsignal,providedtheDQMwasactiveontheclockjustpriortotheWRITEcommandthattruncatedtheREADcommand.Ifnot,thesecondWRITEwillbeaninvalidWRITE.Forexample,ifDQMwasLOWduringT4inFigureRW2,thentheWRITEsatT5andT7wouldbevalid,whiletheWRITEatT6wouldbeinvalid.

TheDQMsignalmustbede-assertedpriortotheWRITEcommand(DQMlatencyiszeroclocksforinputbuffers)toensurethatthewrittendataisnotmasked.

Afixed-lengthREADburstmaybefollowedby,ortruncatedwith,aPRECHARGEcommandtothesamebank(providedthatautoprechargewasnotactivated),andafull-pageburstmaybetruncatedwithaPRECHARGEcommandtothesamebank.ThePRECHARGEcommandshouldbeissuedx cyclesbeforetheclockedgeatwhichthelastdesireddataelement isvalid,wherex equals theCAS latencyminusone.ThisisshownintheREADtoPRECHARGE

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diagramforeachpossibleCASlatency;dataelementn +3iseitherthelastofaburstoffourorthelastdesiredofalongerburst.FollowingthePRECHARGEcommand,asubsequentcommandtothesamebankcannotbeissueduntiltrpismet.Notethatpartoftherowprechargetimeishiddenduringtheaccessofthelastdataelement(s).

In the case of a fixed-length burst being executed tocompletion, a PRECHARGE command issued at theoptimum time (asdescribedabove)provides thesameoperation that would result from the same fixed-lengthburstwithautoprecharge.ThedisadvantageofthePRE-CHARGEcommandisthatitrequiresthatthecommandandaddressbusesbeavailableattheappropriatetimetoissuethecommand;theadvantageofthePRECHARGEcommandisthatitcanbeusedtotruncatefixed-lengthorfull-pagebursts.

Full-pageREADburstscanbetruncatedwiththeBURSTTERMINATE command, and fixed-length READ burstsmaybetruncatedwithaBURSTTERMINATEcommand,providedthatautoprechargewasnotactivated.TheBURSTTERMINATEcommandshouldbeissuedx cyclesbeforetheclockedgeatwhichthelastdesireddataelementisvalid,wherex equalstheCASlatencyminusone.ThisisshownintheREADBurstTerminationdiagramforeachpossibleCASlatency;dataelementn +3isthelastdesireddataelementofalongerburst.

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DON'T CARE

CLK

DQM

COMMAND

ADDRESS

DQ

T0 T1 T2 T3 T4 T5

READ NOP NOP NOP NOP WRITE

BANK,COL n

BANK,COL b

DOUT n DIN b

tDS

tHZ

CAS Latency - 3

RW1 - READ to WRITE

RW2 - READ to WRITE

DON'T CARE

CLK

DQM

COMMAND

ADDRESS

DQ

T0 T1 T2 T3 T4 T5 T6

READ NOP NOP NOP NOP NOP WRITE

BANK,COL n

DIN b

tDS

tHZ

BANK,COL b

CAS Latency - 2

DOUT n DOUT n+1 DOUT n+2

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DON'T CARE

CLK

COMMAND

ADDRESS

DQ

T0 T1 T2 T3 T4 T5 T6

READ NOP NOP NOP READ NOP NOP

DOUT n DOUT n+1 DOUT n+2 DOUT n+3 DOUT b

BANK,COL n

BANK,COL b

CAS Latency - 2

DON'T CARE

CLK

COMMAND

ADDRESS

DQ

T0 T1 T2 T3 T4 T5 T6 T7

READ NOP NOP NOP READ NOP NOP NOP

DOUT n DOUT n+1 DOUT n+2 DOUT n+3 DOUT b

BANK,COL n

BANK,COL b

CAS Latency - 3

CONSECUTIVE READ BURSTS

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DON'T CARE

CLK

COMMAND

ADDRESS

DQ

T0 T1 T2 T3 T4 T5

READ READ READ READ NOP NOP

DOUT n DOUT b DOUT m DOUT x

BANK,COL n

BANK,COL b

CAS Latency - 2

BANK,COL m

BANK,COL x

DON'T CARE

CLK

COMMAND

ADDRESS

DQ

T0 T1 T2 T3 T4 T5 T6

READ READ READ READ NOP NOP NOP

DOUT n DOUT b DOUT m DOUT x

BANK,COL n

BANK,COL b

CAS Latency - 3

BANK,COL m

BANK,COL x

RANDOM READ ACCESSES

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DON'T CARE

CLK

COMMAND

ADDRESS

DQ

T0 T1 T2 T3 T4 T5 T6

READ NOP NOP NOP NOP NOP

DOUT n DOUT n+1 DOUT n+2 DOUT n+3

BANK a,COL n

CAS Latency - 2

x = 1 cycle

BURSTTERMINATE

DON'T CARE

CLK

COMMAND

ADDRESS

DQ

T0 T1 T2 T3 T4 T5 T6 T7

READ NOP NOP NOP NOP NOP NOP

DOUT n DOUT n+1 DOUT n+2 DOUT n+3

BANK,COL n

CAS Latency - 3

x = 2 cycles

BURSTTERMINATE

READ BURST TERMINATION

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ALTERNATING BANK READ ACCESSES

BANK 0 BANK 3 BANK 3 BANK 0

DON'T CARE

CLK

CKE

COMMAND

DQM/DQML, DQMH

A0-A9, A11, A12

A10

BA0, BA1

DQ

tCMS tCMH

tAS tAH

tAS tAH

tAS tAH

tRCD - BANK 0 CAS Latency - BANK 0 tRCD - BANK 0

tRAS - BANK 0

tRC - BANK 0

tCHtCLtCK

tCMS tCMH

tCKS tCKH

ACTIVE NOP READ NOP ACTIVE NOP READ NOP ACTIVE

ROW

ROW

BANK 0

ROW ROW

tRRD tRCD - BANK 3

tRP - BANK 0

COLUMN m(2) ROW COLUMN b(2) ROW

ENABLE AUTO PRECHARGE ENABLE AUTO PRECHARGE

T0 T1 T2 T3 T4 T5 T6 T7 T8

tAC

tOH tOH tOH tOH tOH

DOUT m DOUT m+1 DOUT m+2 DOUT m+3 DOUT b

tAC tAC tAC tAC tAC

tLZ

CAS Latency - BANK 3

Notes:1) CASlatency = 2, Burst Length = 42) x16: A11 and A12 = "Don't Care" x8: A12 = "Don't Care"

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READ - FULL-PAGE BURST

DON'T CARE

UNDEFINED

CLK

CKE

COMMAND

DQM/DQML, DQMH

A0-A9, A11, A12

A10

BA0, BA1

DQ

tCMS tCMH

ACTIVE NOP READ NOP NOP NOP NOP NOP BURST TERM NOP NOP

tAS tAH

tAS tAH

tAS tAH

ROW

ROW

BANK

COLUMN m(2)

tCHtCLtCK

tCMS tCMH

tCKS tCKH

BANK

tRCD CAS Latency

tAC tACtAC tACtAC tHZ

tLZ

tAC

tOH tOH tOH tOH tOH tOH

DOUT m DOUT m+1 DOUT m+2 DOUT m-1 DOUT m DOUT m+1

each row (x16) has512 locations(3)

Full pagecompletion

Full-page burst not self-terminating.Use BURST TERMINATE command.

T0 T1 T2 T3 T4 T5 T6 Tn+1 Tn+2 Tn+3 Tn+4

Notes:1) CASlatency = 2, Burst Length = Full Page2) x16: A11 and A12 = "Don't Care" x8: A12 = "Don't Care"3) x16: Each row has 1,024 locations. x8: Each row has 2,048 locations.

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READ - DQM OPERATION

DON'T CARE

UNDEFINED

CLK

CKE

COMMAND

DQM/DQML, DQMH

A0-A9, A11, A12

A10

BA0, BA1

DQ

tCMS tCMH

ACTIVE NOP READ NOP NOP NOP NOP NOP NOP

tAS tAH

tAS tAH

tAS tAH

ENABLE AUTO PRECHARGE

DISABLE AUTO PRECHARGE

ROW

ROW

BANK

tRCD CAS Latency

DOUT m DOUT m+2 DOUT m+3

COLUMN m(2)

BANK

tCHtCLtCK

tCMS tCMH

tCKS tCKH

tOHtOHtOH tACtAC

tACtHZ tHZtLZ tLZ

T0 T1 T2 T3 T4 T5 T6 T7 T8

Notes:1) CASlatency = 2, Burst Length = 42) x16: A11 and A12 = "Don't Care" x8: A12 = "Don't Care"

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DON'T CARE

CLK

COMMAND

ADDRESS

DQ

T0 T1 T2 T3 T4 T5 T6 T7

READ NOP NOP NOP NOP ACTIVE NOP

DOUT n DOUT n+1 DOUT n+2 DOUT n+3

BANK a,COL n

BANK a,ROW

BANK(a or all)

CAS Latency - 2

tRP

PRECHARGE

tRQL High-Z

DON'T CARE

CLK

COMMAND

ADDRESS

DQ

T0 T1 T2 T3 T4 T5 T6 T7

READ NOP NOP NOP NOP NOP ACTIVE

DOUT n DOUT n+1 DOUT n+2 DOUT n+3

BANK,COL n

BANK,COL b

CAS Latency - 3

tRP

tRQL

BANK a,ROW

PRECHARGE

High-Z

READ to PRECHARGE

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CLK

CKEHIGH

COLUMN ADDRESS

AUTO PRECHARGE

BANK ADDRESS

CS

RAS

CAS

WE

A0-A9

A10

BA0, BA1

NO PRECHARGE

A11, A12

WRITE COMMAND

ThestartingcolumnandbankaddressesareprovidedwiththeWRITEcommand,andautoprechargeiseitherenabledordisabledforthataccess.Ifautoprechargeisenabled,therowbeingaccessedisprechargedatthecompletionoftheburst.ForthegenericWRITEcommandsusedinthefollowingillustrations,autoprechargeisdisabled.

DuringWRITEbursts,thefirstvaliddata-inelementwillberegisteredcoincidentwiththeWRITEcommand.Subsequentdataelementswillberegisteredoneachsuccessiveposi-tiveclockedge.Uponcompletionofafixed-lengthburst,assumingnoother commandshavebeen initiated, theDQswillremainHigh-Zandanyadditionalinputdatawillbeignored(seeWRITEBurst).Afull-pageburstwillcon-tinueuntilterminated.(Attheendofthepage,itwillwraptocolumn0andcontinue.)

DataforanyWRITEburstmaybetruncatedwithasubse-quentWRITEcommand,anddataforafixed-lengthWRITEburstmaybe immediately followedbydata foraWRITEcommand.ThenewWRITEcommandcanbe issuedonanyclockfollowingthepreviousWRITEcommand,andthedataprovidedcoincidentwiththenewcommandappliestothenewcommand.

AnexampleisshowninWRITEtoWRITEdiagram.Datan +1iseitherthelastofaburstoftwoorthelastdesiredofa longerburst.The512MbSDRAMusesapipelinedarchitectureandthereforedoesnotrequirethe2n ruleas-sociatedwithaprefetcharchitecture.AWRITEcommandcanbeinitiatedonanyclockcyclefollowingapreviousWRITEcommand.Full-speedrandomwriteaccesseswithinapagecanbeperformedtothesamebank,asshowninRandomWRITECycles,oreachsubsequentWRITEmaybeperformedtoadifferentbank.

DataforanyWRITEburstmaybetruncatedwithasubse-quentREADcommand,anddataforafixed-lengthWRITEburstmaybeimmediatelyfollowedbyasubsequentREADcommand.OncetheREADcommandisregistered,thedatainputswillbeignored,andWRITEswillnotbeex-ecuted.AnexampleisshowninWRITEtoREAD.Datan +1iseitherthelastofaburstoftwoorthelastdesiredofalongerburst.

Data for a fixed-length WRITE burst may be followedby,or truncatedwith,aPRECHARGEcommandto thesamebank(providedthatautoprechargewasnotacti-vated), anda full-pageWRITEburstmaybe truncatedwithaPRECHARGEcommand to thesamebank.ThePRECHARGEcommandshouldbeissuedtdplaftertheclockedgeatwhichthelastdesiredinputdataelementisregistered.Theautoprechargemoderequiresatdplofatleastoneclockplustime,regardlessoffrequency.Inaddition,whentruncatingaWRITEburst,theDQMsignalmustbeusedtomaskinputdatafortheclockedgepriorto,andtheclockedgecoincidentwith,thePRECHARGEcommand.AnexampleisshownintheWRITEtoPRE-CHARGEdiagram.Datan+1iseitherthelastofaburstoftwoorthelastdesiredofalongerburst.FollowingthePRECHARGEcommand,asubsequentcommandtothesamebankcannotbeissueduntiltrpismet.

Inthecaseofafixed-lengthburstbeingexecutedtocomple-tion,aPRECHARGEcommand issuedat theoptimumtime(asdescribedabove)providesthesameoperationthatwouldresult fromthesamefixed-lengthburstwithautoprecharge.ThedisadvantageofthePRECHARGEcommandisthatitrequiresthatthecommandandaddressbusesbeavailableattheappropriatetimetoissuethecommand;theadvantageofthePRECHARGEcommandisthatitcanbeusedtotruncatefixed-lengthorfull-pagebursts.

Fixed-lengthorfull-pageWRITEburstscanbetruncatedwiththeBURSTTERMINATEcommand.Whentruncat-ingaWRITEburst,theinputdataappliedcoincidentwiththeBURSTTERMINATEcommandwillbeignored.Thelastdatawritten(providedthatDQMisLOWatthattime)willbe the inputdataappliedoneclockpreviousto theBURSTTERMINATEcommand.ThisisshowninWRITEBurstTermination,wheredatan isthelastdesireddataelementofalongerburst.

WRITESWRITEburstsareinitiatedwithaWRITEcommand,asshowninWRITECommanddiagram.

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CLK

COMMAND

ADDRESS

DQ

T0 T1 T2 T3

WRITE NOP NOP NOP

DIN n DIN n+1

BANK,COL n

DON'T CARE

CLK

COMMAND

ADDRESS

DQ

T0 T1 T2

WRITE NOP WRITE

DIN n DIN n+1 DIN b

BANK,COL n

BANK,COL b

DON'T CARE

WRITE BURST

WRITE TO WRITE

CLK

COMMAND

ADDRESS

DQ

T0 T1 T2 T3

WRITE WRITE WRITE WRITE

DIN n DIN b DIN m DIN x

BANK,COL n

BANK,COL b

BANK,COL m

BANK,COL x

RANDOM WRITE CYCLES

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DON'T CARE

CLK

COMMAND

ADDRESS

DQ

T0 T1 T2 T3 T4 T5

WRITE NOP READ NOP NOP NOP

DIN n DIN n+1 DOUT b DOUT b+1

BANK,COL n

BANK,COL b

CAS Latency - 2

WRITE to READ

WP1 - WRITE to PRECHARGE

DON'T CARE

CLK

DQM

COMMAND

ADDRESS

DQ

T0 T1 T2 T3 T4 T5 T6

WRITE NOP NOP NOP ACTIVE NOP

BANK a,COL n

BANK a,ROW

BANK(a or all)

tDPL

tRP

PRECHARGE

DIN n DIN n+1 DIN n+2

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IS42S86400B, IS42/45S16320B

CLK

COMMAND

ADDRESS

DQ

T0 T1 T2

WRITE

DIN n (DATA)

BANK,COL n

DON'T CARE

(ADDRESS)

BURSTTERMINATE

NEXTCOMMAND

WRITE Burst Termination

DON'T CARE

CLK

DQM

COMMAND

ADDRESS

DQ

T0 T1 T2 T3 T4 T5 T6

WRITE NOP NOP NOP NOP ACTIVE

BANK a,COL n

BANK a,ROW

BANK(a or all)

tDPL

tRP

PRECHARGE

DIN n DIN n+1

WP2 - WRITE to PRECHARGE

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DON'T CARE

CLK

CKE

COMMAND

DQM/DQMLDQMH

A0-A9, A11, A12

A10

BA0, BA1

DQ

tCMS tCMH

ACTIVE NOP WRITE NOP NOP NOP NOP BURST TERM NOP

tAS tAH

tAS tAH

tAS tAH

tDS tDH tDS tDH tDS tDH

ROW

ROW

BANK

tRCD

DIN m DIN m+1 DIN m+2 DIN m+3 DIN m-1

COLUMN m(2)

tCHtCLtCK

tDS tDH tDS tDH tDS tDH

tCMS tCMH

tCKS tCKH

BANK

Full page completed

T0 T1 T2 T3 T4 T5 Tn+1 Tn+2

WRITE - FULL PAGE BURST

Notes:1) Burst Length = Full Page2) x16: A11 and A12 = "Don't Care" x8: A12 = "Don't Care"

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DON'T CARE

CLK

CKE

COMMAND

DQM/DQMLDQMH

A0-A9, A11, A12

A10

BA0, BA1

DQ

tCMS tCMH

ACTIVE NOP WRITE NOP NOP NOP NOP NOP

tAS tAH

tAS tAH

tAS tAH

tDS tDH tDS tDH tDS tDH

ENABLE AUTO PRECHARGE

DISABLE AUTO PRECHARGE

ROW

ROW

BANK

tRCD

DIN m DIN m+2 DIN m+3

COLUMN m(2)

BANK

tCHtCLtCK

tCMS tCMH

tCKS tCKH

T0 T1 T2 T3 T4 T5 T6 T7

WRITE - DQM OPERATION

Notes:1) Burst Length = 42) x16: A11 and A12 = "Don't Care" x8: A12 = "Don't Care"

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ALTERNATING BANK WRITE ACCESSES

Notes:1) Burst Length = 42) x16: A11 and A12 = "Don't Care" x8: A12 = "Don't Care"

BANK 0 BANK 1 BANK 1 BANK 0

DON'T CARE

CLK

CKE

COMMAND

DQM/DQMLDQMH

A0-A9, A11, A12

A10

BA0, BA1

DQ

tCMS tCMH

tAS tAH

tAS tAH

tAS tAH

tDS tDH tDS tDH tDS tDH

tRCD - BANK 0 tRCD - BANK 0tDPL - BANK 1

tRAS - BANK 0tRC - BANK 0

tCHtCLtCK

tDS tDH tDS tDH tDS tDH tDS tDH tDS tDH

tCMS tCMH

tCKS tCKH

ACTIVE NOP WRITE NOP ACTIVE NOP WRITE NOP NOP ACTIVE

DIN m DIN m+1 DIN m+2 DIN m+3 DIN b DIN b+1 DIN b+2 DIN b+3

ROW

ROW

BANK 0

ROW ROW

tRRD tRCD - BANK 1

tDPL - BANK 0 tRP - BANK 0

COLUMN m(2) ROW COLUMN b(2) ROW

ENABLE AUTO PRECHARGE ENABLE AUTO PRECHARGE

T0 T1 T2 T3 T4 T5 T6 T7 T8 T9

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DON'T CARE

CLK

CKE

COMMAND

ADDRESS

DQ

T0 T1 T2 T3 T4 T5

NOP WRITE NOP NOP

BANK a,COL n

DIN n DIN n+1 DIN n+2

INTERNALCLOCK

DON'T CARE

CLK

CKE

COMMAND

ADDRESS

DQ

T0 T1 T2 T3 T4 T5 T6

READ NOP NOP NOP NOP NOP

BANK a,COL n

DOUT n DOUT n+1 DOUT n+2 DOUT n+3

INTERNALCLOCK

CLOCK SUSPENDClocksuspendmodeoccurswhenacolumnaccess/burstis inprogressandCKEisregisteredLOW.In theclocksuspendmode,theinternalclockisdeactivated,“freezing”thesynchronouslogic.

ForeachpositiveclockedgeonwhichCKEissampledLOW,thenextinternalpositiveclockedgeissuspended.Anycommandordatapresentontheinputpinsatthetime

ofasuspendedinternalclockedgeisignored;anydatapresentontheDQpinsremainsdriven;andburstcountersarenotincremented,aslongastheclockissuspended.(Seefollowingexamples.)

ClocksuspendmodeisexitedbyregisteringCKEHIGH;theinternalclockandrelatedoperationwillresumeonthesubsequentpositiveclockedge.

Clock Suspend During WRITE Burst

Clock Suspend During READ Burst

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CLOCK SUSPEND MODE

Notes:1) CASlatency = 3, Burst Length = 2, Auto Precharge is disabled.2) x16: A11 and A12 = "Don't Care" x8: A12 = "Don't Care"

DON'T CARE

CLK

CKE

COMMAND

DQM/DQMLDQMH

A0-A9, A11, A12

A10

BA0, BA1

DQ

tCMS tCMH

tAS tAH

tAS tAH

tAS tAH

tCHtCLtCK

tCMS tCMH

tCKS tCKH

COLUMN m(2)

T0 T1 T2 T3 T4 T5 T6 T7 T8 T9

READ NOP NOP NOP NOP NOP WRITE NOP

tCKS tCKH

BANK BANK

COLUMN n(2)

tAC tAC

tOH

tHZ

DOUT m DOUT m+1

tLZ

UNDEFINED

DIN e+1

tDS tDH

DIN e

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CLK

CKEHIGH

ALL BANKS

BANK SELECT

BANK ADDRESS

CS

RAS

CAS

WE

A0-A9, A11, A12

A10

BA0, BA1

DON'T CARE

CLK

CKE

COMMAND NOP NOP ACTIVE

≥ tCKStCKS

All banks idle

Enter power-down mode Exit power-down mode

tRCD

tRAS

tRC

Input buffers gated off

less than 64ms

PRECHARGE Command

POWER-DOWN

POWER-DOWNPower-downoccursifCKEisregisteredLOWcoincidentwithaNOPorCOMMANDINHIBITwhennoaccessesareinprogress.Ifpower-downoccurswhenallbanksareidle,thismodeisreferredtoasprechargepower-down;ifpower-downoccurswhenthereisarowactiveineitherbank, this mode is referred to as active power-down.Entering power-down deactivates the input and outputbuffers,excludingCKE,formaximumpowersavingswhileinstandby.Thedevicemaynotremaininthepower-downstatelongerthantherefreshperiod(64ms)sincenorefreshoperationsareperformedinthismode.

Thepower-downstateisexitedbyregisteringaNOPorCOMMANDINHIBITandCKEHIGHatthedesiredclockedge(meetingtcks).Seefigure"Power-Down".

PRECHARGEThePRECHARGEcommand(seefigure)isusedtodeac-tivatetheopenrowinaparticularbankortheopenrowinallbanks.Thebank(s)willbeavailableforasubsequentrowaccesssomespecifiedtime(trp)afterthePRECHARGEcommandisissued.InputA10determineswhetheroneorallbanksaretobeprecharged,andinthecasewhereonlyonebankistobeprecharged,inputsBA0,BA1selectthebank.Whenallbanksaretobeprecharged,inputsBA0,BA1aretreatedas“Don’tCare.”Onceabankhasbeenprecharged,it isintheidlestateandmustbeactivatedpriortoanyREADorWRITEcommandsbeingissuedtothatbank.

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POWER-DOWN MODE CYCLE

DON'T CARE

CLK

CKE

COMMAND

DQM/DQMLDQMH

A0-A9, A11, A12

A10

BA0, BA1

DQ

tAS tAH

BANK

tCHtCLtCK

tCMS tCMH

tCKS tCKH

PRECHARGE NOP NOP NOP ACTIVE

ALL BANKS

SINGLE BANK

ROW

ROW

BANK

tCKStCKS

Precharge allactive banks

All banks idleTwo clock cycles Input buffers gatedoff while in

power-down modeAll banks idle, enterpower-down mode Exit power-down mode

T0 T1 T2 Tn+1 Tn+2

High-Z

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DON'T CARE

CLK

COMMAND

BANK n

BANK m

ADDRESS

DQ

T0 T1 T2 T3 T4 T5 T6 T7

NOP NOP NOP NOP NOP NOP

DOUT a DOUT a+1 DOUT b DOUT b+1

BANK n,COL a

CAS Latency - 3 (BANK n)

CAS Latency - 3 (BANK m)

tRP - BANK n tRP - BANK m

READ - APBANK n

READ - APBANK m

Page Active READ with Burst of 4 Interrupt Burst, Precharge Idle

Page Active READ with Burst of 4 Precharge

Internal States

BANK n,COL b

DON'T CARE

CLK

COMMAND

BANK n

BANK m

ADDRESS

DQM

DQ

T0 T1 T2 T3 T4 T5 T6 T7

NOP NOP NOP NOP NOP NOP

DOUT a DIN b DIN b+1 DIN b+2 DIN b+3

BANK n,COL a

BANK m,COL b

CAS Latency - 3 (BANK n)

tRP - BANK n tDPL - BANK m

READ - APBANK n

WRITE - APBANK m

READ with Burst of 4 Interrupt Burst, Precharge Idle

Page Active WRITE with Burst of 4 Write-Back

Internal States Page Active

BURST READ/SINGLE WRITETheburstread/singlewritemodeisenteredbyprogrammingthewriteburstmodebit(M9)inthemoderegistertoalogic1.Inthismode,allWRITEcommandsresultintheaccessofasinglecolumnlocation(burstofone),regardlessoftheprogrammedburstlength.READcommandsaccesscolumnsaccordingtotheprogrammedburstlengthandsequence,justasinthenormalmodeofoperation(M9=0).

CONCURRENT AUTO PRECHARGEAnaccesscommand(READorWRITE)toanotherbankwhileanaccesscommandwithautoprechargeenabledisexecutingisnotallowedbySDRAMs,unlesstheSDRAMsupports CONCURRENT AUTO PRECHARGE. ISSI

SDRAMssupportCONCURRENTAUTOPRECHARGE.FourcaseswhereCONCURRENTAUTOPRECHARGEoccursaredefinedbelow.

READ with Auto Precharge1.InterruptedbyaREAD(withorwithoutautoprecharge):

AREADtobankmwill interruptaREADonbankn,CAS latency later.The PRECHARGE to bank n willbeginwhentheREADtobankmisregistered.

2.InterruptedbyaWRITE(withorwithoutautoprecharge):AWRITEtobankmwillinterruptaREADonbanknwhenregistered.DQMshouldbeusedthreeclockspriortotheWRITEcommandtopreventbuscontention.ThePRECHARGEtobanknwillbeginwhentheWRITEtobankmisregistered.

READ With Auto Precharge interrupted by a READ

READ With Auto Precharge interrupted by a WRITE

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DON'T CARE

CLK

COMMAND

BANK n

BANK m

ADDRESS

DQ

T0 T1 T2 T3 T4 T5 T6 T7

NOP NOP NOP NOP NOP NOP

DIN a DIN a+1 DOUT b DOUT b+1

BANK n,COL a

BANK m,COL b

CAS Latency - 3 (BANK m)

tRP - BANK ntRP - BANK m

WRITE - APBANK n

READ - APBANK m

Page Active WRITE with Burst of 4 Interrupt Burst, Write-Back Precharge

Page Active READ with Burst of 4 Precharge

Internal States tDPL - BANK n

DON'T CARE

CLK

COMMAND

BANK n

BANK m

ADDRESS

DQ

T0 T1 T2 T3 T4 T5 T6 T7

NOP NOP NOP NOP NOP NOP

BANK n,COL a

BANK m,COL b

tRP - BANK ntDPL - BANK m

WRITE - APBANK n

WRITE - APBANK m

Page Active WRITE with Burst of 4 Interrupt Burst, Write-Back Precharge

Page Active WRITE with Burst of 4 Write-Back

Internal States tDPL - BANK n

DIN a DIN a+1 DIN a+2 DIN b DIN b+1 DIN b+2 DIN b+3

WRITE with Auto Precharge3.InterruptedbyaREAD(withorwithoutautoprecharge):

AREADtobankmwillinterruptaWRITEonbanknwhenregistered, with the data-out appearing (CAS latency)later.ThePRECHARGEtobanknwillbeginaftertdplismet,wheretdplbeginswhentheREADtobankmisregistered.ThelastvalidWRITEtobanknwillbedata-inregisteredoneclockpriortotheREADtobankm.

4.InterruptedbyaWRITE(withorwithoutautoprecharge):AWRITEtobankmwillinterruptaWRITEonbanknwhenregistered.ThePRECHARGEtobanknwillbeginaftertdplismet,wheretdplbeginswhentheWRITEtobankmisregistered.ThelastvaliddataWRITEtobanknwillbedataregisteredoneclockpriortoaWRITEtobankm.

WRITE With Auto Precharge interrupted by a READ

WRITE With Auto Precharge interrupted by a WRITE

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SINGLE READ WITH AUTO PRECHARGE

DON'T CARE

UNDEFINED

CLK

CKE

COMMAND

DQM/DQMLDQMH

A0-A9, A11, A12

A10

BA0, BA1

DQ

tCMS tCMH

ACTIVE NOP NOP NOP READ NOP NOP ACTIVE NOP

tAS tAH

tAS tAH

tAS tAH

ROW

ROW

BANK

COLUMN m(2)

tCHtCLtCK

tCMS tCMH

tCKS tCKH

BANK

tRCD

tRAS

tRC

CAS Latency

tAC

tHZ

tOH

DOUT m

T0 T1 T2 T3 T4 T5 T6 T7 T8

tRP

ENABLE AUTO PRECHARGE

ROW

ROW

BANK

Notes:1) CASlatency = 2, Burst Length = 12) x16: A11 and A12 = "Don't Care" x8: A12 = "Don't Care"

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SINGLE READ WITHOUT AUTO PRECHARGE

DON'T CARE

UNDEFINED

CLK

CKE

COMMAND

DQM/DQMLDQMH

A0-A9, A11, A12

A10

BA0, BA1

DQ

tCMS tCMH

ACTIVE NOP READ NOP NOP PRECHARGE NOP ACTIVE NOP

tAS tAH

tAS tAH

tAS tAH

ROW

ROW

BANK

COLUMN m(2)

tCHtCLtCK

tCMS tCMH

tCKS tCKH

BANK

tRCD

tRAS

tRC

CAS Latency

tAC

tHZ

tOH

DOUT m

T0 T1 T2 T3 T4 T5 T6 T7 T8

tRP

DISABLE AUTO PRECHARGE

ROW

ROW

BANK

tLZ

ALL BANKS

SINGLE BANK

BANK

Notes:1) CASlatency = 2, Burst Length = 12) x16: A11 and A12 = "Don't Care" x8: A12 = "Don't Care"

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READ WITH AUTO PRECHARGE

DON'T CARE

UNDEFINED

CLK

CKE

COMMAND

DQM/DQMLDQMH

A0-A9, A11, A12

A10

BA0, BA1

DQ

tCMS tCMH

ACTIVE NOP READ NOP NOP NOP NOP NOP ACTIVE

tAS tAH

tAS tAH

tAS tAH

ROW

ROW

BANK

COLUMN m(2)

tCHtCLtCK

tCMS tCMH

tCKS tCKH

BANK

tRCD

tRAS

tRC

CAS Latency

tAC tAC tAC tAC

tOH

tHZ

tOH

DOUT m

tOH

DOUT m+1

tOH

DOUT m+2 DOUT m+3

T0 T1 T2 T3 T4 T5 T6 T7 T8

tRP

ENABLE AUTO PRECHARGE

ROW

ROW

BANK

tLZ

Notes:1) CASlatency = 2, Burst Length = 42) x16: A11 and A12 = "Don't Care" x8: A12 = "Don't Care"

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READ WITHOUT AUTO PRECHARGE

DON'T CARE

UNDEFINED

CLK

CKE

COMMAND

DQM/DQMLDQMH

A0-A9, A11, A12

A10

BA0, BA1

DQ

tCMS tCMH

ACTIVE NOP READ NOP NOP NOP PRECHARGE NOP ACTIVE

tAS tAH

tAS tAH

tAS tAH

ROW

ROW

BANK

COLUMN m(2)

tCHtCLtCK

tCMS tCMH

tCKS tCKH

BANK

tRCD CAS Latency

tAC tAC tAC tAC

tOH

tHZ

tOH

DOUT m

tOH

DOUT m+1

tOH

DOUT m+2 DOUT m+3

T0 T1 T2 T3 T4 T5 T6 T7 T8

DISABLE AUTO PRECHARGE

ROW

ROW

BANK

tLZ

tRAS

tRC

tRP

ALL BANKS

SINGLE BANK

BANK

Notes:1) CASlatency = 2, Burst Length = 42) x16: A11 and A12 = "Don't Care" x8: A12 = "Don't Care"

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Integrated Silicon Solution, Inc. — www.issi.com 55Rev. H12/01/2011

IS42S86400B, IS42/45S16320B

SINGLE WRITE WITH AUTO PRECHARGE

Notes:1) Burst Length = 12) x16: A11 and A12 = "Don't Care" x8: A12 = "Don't Care"

DON'T CARE

CLK

CKE

COMMAND

DQM/DQML, DQMH

A0-A9, A11, A12

A10

BA0, BA1

DQ

tCMS tCMH

tAS tAH

tAS tAH

tAS tAH

tDS tDH

tRCD

tRAS

tRC

tCHtCLtCK

tCMS tCMH

tCKS tCKH

ACTIVE NOP NOP NOP WRITE NOP NOP NOP ACTIVE NOP

tDPL tRP

COLUMN m(2) ROW

BANK BANK

ENABLE AUTO PRECHARGE

ROW

ROW

ROW

BANK

DIN m

T0 T1 T2 T3 T4 T5 T6 T7 T8 T9

Page 56: IS42S86400B IS42S16320B, IS45S16320B12/01/2011 IS42S86400B, IS42/45S16320B DEVICE OVERVIEW The 512Mb SDRAM is a high speed CMOS, dynamic random-access memory designed to operate in

56 Integrated Silicon Solution, Inc. — www.issi.com Rev. H

12/01/2011

IS42S86400B, IS42/45S16320B

SINGLE WRITE - WITHOUT AUTO PRECHARGE

Notes:1) Burst Length = 12) x16: A11 and A12 = "Don't Care" x8: A12 = "Don't Care"3) tras must not be violated.

DON'T CARE

CLK

CKE

COMMAND

DQM/DQMLDQMH

A0-A9, A11, A12

A10

BA0, BA1

DQ

tCMS tCMH

tAS tAH

tAS tAH

tAS tAH

tDS tDH

tRCD

tRAS

tRC

tCHtCLtCK

tCMS tCMH

tCKS tCKH

ACTIVE NOP WRITE NOP NOP PRECHARGE NOP ACTIVE NOP

tDPL(3) tRP

ROW

ROW

ROW

BANK

DIN m

COLUMN m(2) ROW

BANK BANK BANK

ALL BANKS

SINGLE BANK

T0 T1 T2 T3 T4 T5 T6 T7 T8

DISABLE AUTO PRECHARGE

Page 57: IS42S86400B IS42S16320B, IS45S16320B12/01/2011 IS42S86400B, IS42/45S16320B DEVICE OVERVIEW The 512Mb SDRAM is a high speed CMOS, dynamic random-access memory designed to operate in

Integrated Silicon Solution, Inc. — www.issi.com 57Rev. H12/01/2011

IS42S86400B, IS42/45S16320B

WRITE - WITH AUTO PRECHARGE

DON'T CARE

CLK

CKE

COMMAND

DQM/DQMLDQMH

A0-A9, A11, A12

A10

BA0, BA1

DQ

tCMS tCMH

tAS tAH

tAS tAH

tAS tAH

tRCD

tRAS

tRC

tCHtCLtCK

tCMS tCMH

tCKS tCKH

ACTIVE NOP WRITE NOP NOP NOP NOP NOP NOP ACTIVE

tDPL tRP

COLUMN m(2) ROW

BANK BANK

ENABLE AUTO PRECHARGEROW

ROW

ROW

BANK

tDS tDH tDS tDH tDS tDHtDS tDH

DIN m DIN m+1 DIN m+2 DIN m+3

T0 T1 T2 T3 T4 T5 T6 T7 T8 T9

Notes:1) Burst Length = 42) x16: A11 and A12 = "Don't Care" x8: A12 = "Don't Care"

Page 58: IS42S86400B IS42S16320B, IS45S16320B12/01/2011 IS42S86400B, IS42/45S16320B DEVICE OVERVIEW The 512Mb SDRAM is a high speed CMOS, dynamic random-access memory designed to operate in

58 Integrated Silicon Solution, Inc. — www.issi.com Rev. H

12/01/2011

IS42S86400B, IS42/45S16320B

WRITE - WITHOUT AUTO PRECHARGE

DON'T CARE

CLK

CKE

COMMAND

DQM/DQMLDQMH

A0-A9, A11, A12

A10

BA0, BA1

DQ

tCMS tCMH

tAS tAH

tAS tAH

tAS tAH

tRCD

tRAS

tRC

tCHtCLtCK

tCMS tCMH

tCKS tCKH

ACTIVE NOP WRITE NOP NOP NOP PRECHARGE NOP ACTIVE

tDPL(3) tRP

COLUMN m(2) ROW

DISABLE AUTO PRECHARGEROW

ROW

ROW

BANK

tDS tDH tDS tDH tDS tDHtDS tDH

DIN m DIN m+1 DIN m+2 DIN m+3

BANK BANK BANK

ALL BANKS

SINGLE BANK

T0 T1 T2 T3 T4 T5 T6 T7 T8

Notes:1) Burst Length = 42) x16: A11 and A12 = "Don't Care" x8: A12 = "Don't Care"3) tras must not be violated.

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Integrated Silicon Solution, Inc. — www.issi.com 59Rev. H12/01/2011

IS42S86400B, IS42/45S16320B

ORDERING INFORMATION - VDD = 3.3V

Commercial Range: 0oC to +70oC

Frequency Speed (ns) Order Part No. Package

166MHz 6 IS42S86400B-6TL 54-PinTSOPII,Alloy42leadframeplatedwithmatteSn

IS42S16320B-6TL 54-PinTSOPII,Alloy42leadframeplatedwithmatteSn

IS42S16320B-6BL 54-ballBGA,SnAgCuballs

143MHz 7 IS42S86400B-7TL 54-PinTSOPII,Alloy42leadframeplatedwithmatteSn

IS42S16320B-7TL 54-PinTSOPII,Alloy42leadframeplatedwithmatteSn

IS42S16320B-7BL 54-ballBGA,SnAgCuballs

133MHz 7.5 IS42S86400B-75ETL 54-PinTSOPII,Alloy42leadframeplatedwithmatteSn

IS42S16320B-75ETL 54-PinTSOPII,Alloy42leadframeplatedwithmatteSn

Industrial Range: -40oC to +85oC

Frequency Speed (ns) Order Part No. Package

166MHz 6 IS42S86400B-6TLI 54-PinTSOPII,Alloy42leadframeplatedwithmatteSn

IS42S16320B-6TLI 54-PinTSOPII,Alloy42leadframeplatedwithmatteSn

IS42S16320B-6BLI 54-ballBGA,SnAgCuballs

143MHz 7 IS42S86400B-7TLI 54-PinTSOPII,Alloy42leadframeplatedwithmatteSn

IS42S16320B-7TLI 54-PinTSOPII,Alloy42leadframeplatedwithmatteSn

IS42S16320B-7BLI 54-ballBGA,SnAgCuballs

133MHz 7.5 IS42S86400B-75ETLI 54-PinTSOPII,Alloy42leadframeplatedwithmatteSn

IS42S16320B-75ETLI 54-PinTSOPII,Alloy42leadframeplatedwithmatteSn

Automotive Range: -40oC to +85oC

Frequency Speed (ns) Order Part No. Package

166MHz 6 IS45S16320B-6BLA1 54-ballBGA,SnAgCuballs

143MHz 7 IS45S16320B-7TLA1 54-PinTSOPII,Alloy42leadframeplatedwithmatteSn IS45S16320B-7CTLA1 54-PinTSOPII,CuleadframeplatedwithmatteSn IS45S16320B-7CTNA1 54-PinTSOPII,CuleadframeplatedwithNiPdAu

IS45S16320B-7BLA1 54-ballBGA,SnAgCuballs

Automotive Range: -40oC to +105oC

Frequency Speed (ns) Order Part No. Package

143MHz 7 IS45S16320B-7TLA2 54-PinTSOPII,Alloy42leadframeplatedwithmatteSn IS45S16320B-7CTLA2 54-PinTSOPII,CuleadframeplatedwithmatteSn IS45S16320B-7CTNA2 54-PinTSOPII,CuleadframeplatedwithNiPdAu

IS45S16320B-7BLA2 54-ballBGA,SnAgCuballs

Notes:

1.PleasecontactISSIforleadedandcopperleadframepartsupport.

2.Partnumberswith"L"or"N"areleadfreeandRoHScompliant

Page 60: IS42S86400B IS42S16320B, IS45S16320B12/01/2011 IS42S86400B, IS42/45S16320B DEVICE OVERVIEW The 512Mb SDRAM is a high speed CMOS, dynamic random-access memory designed to operate in

60 Integrated Silicon Solution, Inc. — www.issi.com Rev. H

12/01/2011

IS42S86400B, IS42/45S16320B

ForAlloy42andCulead-frameswithmatteSnplating

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Integrated Silicon Solution, Inc. — www.issi.com 61Rev. H12/01/2011

IS42S86400B, IS42/45S16320B

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62 Integrated Silicon Solution, Inc. — www.issi.com Rev. H

12/01/2011

IS42S86400B, IS42/45S16320B

TO

P V

IEW

BO

TT

OM

VIE

W

PIN

A1

CO

RN

ER

B5.

503.

20±0

.1

0.10

C

90X

0.10

C

A

A

A1

C

t

D1

3.20±0.1

6.50e

e

E1 w

D

E

PIN

A1

IND

EX

H JF GEDCBAB HF GEDC JA

89

73

21

83

12

79

Nom

0.25

Min

A1

Sym

bol

A

11.0

6.40

6.40

13.0

10.9

12.9

E E1t D D1W

0.45

0.40

b

2.05

Dim

ensi

on in

mm

11.1

13.1

0.20

0.50

0.40

1.20

Max

0.80

e

b

0.1

A

54L

11x

13m

m W

-BG

A

Pack

age

Out

line

10/1

6/20

07