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The Solution for high reliability & high layer count multilayer Board
IS410High Performance FR-4
IS410
Aug. 2001 - 1 -
IS410
Product Offering
Tg 130 FR-4Rigid LaminateTg 130 FR-4
Rigid Laminatefor Double Side Rigid Board
Perf
orm
ance
ED130UVDE104DE104KF Application
FR402 &MLF21
for Low to Medium Layer Count Multilayer
for High Frequency/ Low Signal Loss
* a licensed technology ofHitachi Chemical Co., Ltd.
for High Speed/Impedance Control Multilayer
for Medium to High Layer Count Multilayer
for High Layer Count/Dimensional Stable Back Panels
for HDI Build-UpMultilayer
for Thermal Reliable IC Substrate & Telecom PWB
for Environment Friendly PWB
for High Signal Speed/ Signal Integrity Electronics
IS610
FR405
FR406& IS410
FR408
E-679* & G200
Isofoil® &Laserpreg™
Laminate & Ecofoil™ RCCF
Tg 140 Multifunctional
Tg 140 Multifunctional
Gigaver™
P95 for utmost thermalPerformance appl.
Tg 145 Low Dk & Df Laminate
Tg 145 Low Dk & Df Laminate
Tg 150 Multifunction Laminate
Tg 150 Multifunction Laminate
Tg 170 DimensionStable Laminate
Tg 170 DimensionStable Laminate
Tg 180 LowDk & Df Laminate
Tg 180 LowDk & Df Laminate
Tg 180 High Reliability Laminate
Tg 180 High Reliability Laminate
Laser Friendly Material
Laser Friendly Material
Halogen Free Green MaterialHalogen Free Green Material
Tg 190 Low LossAPPE Laminate
Tg 190 Low LossAPPE Laminate
Tg 260 Polyimide Laminate
Tg 260 Polyimide Laminate
Aug. 2001 - 2 -
IS410
Features and Applications� Features• Superior performance through multiple thermal
excursions - passes 6 cycle• Very reliable high layer count multilayer boards• Suitable for lead-free soldering process• Low Z-axis expansion & good dimensional stability• Excellent solder heat resistance and low moisture absorption• Standard FR-4 Epoxy Processing• UV Blocking & AOI capable
� Applications• Advanced computers, Servers, workstations, Networking, Telecommunications & Automotives
Aug. 2001 - 3 -
IS410
Thermal Performance� Higher Tg
Tg (°C) IS410 High Tg FR-4DSC 175 ± 5 170 ± 5TMA 170 ± 5 165 ± 5DMA 185 ± 5 180 ± 5
� Z-axis CTE ( ppm/°°°°C )Room Temp to Tg 55~70 65~75Tg to 288°C 150~250 180~280Room Temp to 288°C 120~140 120~150
� Solder dip @288°°°°C ( sec ) >300 60~180� Decomposition temp (TGA) 340~360 290~320� Time to delamination (TMA)
T288 (min) 20~40 1~10T260 (min) > 60 10~40
Aug. 2001 - 4 -
IS410
-10
10
30
50
70
Dim
ensi
on C
hang
e (µ
m)
25 75 125 175 225 275Temperature (°C)
Z-Axis Thermal Expansion
Std FR-4 4.3%
High Tg FR-4 3.7%
IS410 3.6%
Aug. 2001 - 5 -
IS410
Processing Advantages
� Standard FR-4 Processing
• Conventional FR-4 Epoxy Processability• No Additional Post-Bake or Processing Changes
� UV Blocking• Compatible with UV Curable Solder Masks
� AOI Fluorescence• Compatible with all Types of AOI Equipments for
Improved Productivity
Aug. 2001 - 6 -
IS410
Recommended Press Cycle
� Load and Center all Packages as Quickly as Possible
� Close Press and Apply 50 to 70 psi Kiss Pressure
� Adjust Stack Heat Rise to 1.5 to 2.5oC/min (80 ~ 140℃)
Using Proper Amount & Type of Padding
� Apply 250 ~ 350 psi Full Pressure when Outside of Stack
Reaches 100 to 120oC
� Once Center of Stack over 180oC, Cure for 60 minutes
� Cool Material under Moderate Pressure Slowly (3oC/min)
through 120oC, Cooling Rate may be Increased Below 150oC
Aug. 2001 - 7 -
IS410
Recommended Dual Stage Press Cycle
60
80
100
120
140
160
180
200
220
0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150
200oC
140oC 140oC
30min 10min 5min90min
Plat
en T
emp
(o c)
0
100
200
300
400
0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150
Pres
sure
(psi)
60 psi, Kiss pressure
300 psi, Full lamination pressure
30 min 95 min
Aug. 2001 - 8 -
IS410
time (s)17500 250.0 500.0 750.0 1000 1250 1500
1.000E5
100.0
1000
10000|n*| (Pa.s)
150.0
90.0
100.0
110.0
120.0
130.0
140.0
tem
pera
ture
(°C
)
Ramp = 2.0°C/min
Rheology
Aug. 2001 - 9 -
IS410
General Properties
Laminate Properties IS410 High Tg FR-4
Tg DSC 170-180 165-175
Peel Strength, 1/2 oz ( low profile) lb/in 5 - 7 6 - 8
Moisture Absorption ( wt % ) D24/23 0.10 – 0.15 0.15 – 0.20
Flammability UL-94 V-0 V-0
Dielectric Constant ( 500 MHz ) HP4291 4.1 - 4.3 4.1 - 4.3
Dissipation Factor ( 500MHz ) HP4291 0.015-0.025 0.015-0.025
Surface Resistivity ( megohms ) C96/35/90 1x106~ 1x107 1x106~ 1x107
Volume Resistivity (megohms.cm) C96/35/90 5x107~ 5x108 5x107~ 5x108
Aug. 2001 - 10 -
IS410
Diameter In Feed Speed Chipload SFPM( mil ) (in/min) (Krpm) (mil/rev)
10 70 100 0.7 262
15 100 95 1.05 373
20 100 92 1.09 484
25 130 84 1.55 550
30 140 70 2.0 550
40 155 52 3.0 550Most Processes Stack 2 To-DateMax Hit Count - 1000 Small Holes, 1500 Larger Holes
IS410 Typical Drill Parameters
Aug. 2001 - 11 -
IS410
Prepreg Parameters
Resin Content Resin Flow Gel Time(%) (%) (sec)
IS410 106 BS 75 ± 3 55 ± 5 70 ± 20
IS410 1080BS 63 ± 3 42 ± 5 70 ± 20
IS410 2113BS 57 ± 3 38 ± 5 70 ± 20
IS410 2313BS 55 ± 3 35 ± 5 70 ± 20
IS410 2116BS 53 ± 3 30 ± 5 70 ± 20
IS410 1652BS 50 ± 3 30 ± 5 70 ± 20
IS410 1506BS 48 ± 3 30 ± 5 70 ± 20
IS410 7628BS 44 ± 3 23 ± 5 70 ± 20
IS410 7628HRC 50 ± 3 30 ± 5 70 ± 20
Grade