IPC/JEDEC INDUSTRY MAPPING

Agenda Item 6.2

4th JIC meeting Regensburg, Germany June 17, 2003

Minimum IPC Standards Tool Kit

MaterialsSM-840 Solder maskFD-2231 Flex materialFD-2232 Coated materialMF-150 Copper foilCF-148 Coated copper foilCC-830 Conformal coatingSM-817 Adhesive4101 Rigid materials4104 HDI materials

WorkmanshipA-600 Printed boardA-610 Printed board assemblyR-700 Modification and repair

Quality AssessmentTM-650 Test methodsSPC 91909191 Generic9192 Base materials9193Board9194 Assembly

Design2221 Generic2222 Rigid2223 Flex2224 PCMCIA2225 MCM-L2226 HDI2227 Discrete wiring

Performance6011 Generic6012 Rigid6013 Flex6014 PCMCIA6015 MCM-L6016 HDI6017 Discrete wiring

Component Mounting7071 Generic7072 Through-hole7073 Standard SMT7074 Fine pitch7075 Array product7076 Chip scale7077 Chip wire bonding7078 Flip chip

AttachmentJ-STD-001 Soldering requirementsJ-STD-002 Solderability testing of partsJ-STD-003 Solderability of boardsJ-STD-004 Solder FluxJ-STD-005 Solder pasteJ-STD-006 Solid solder

Minimum Tool Kit

IPC STANDARDS MAP

IPC STANDARDS MAP (cont.)

ASSEMBLY

• J-STD-001Soldering Electrical and Electronic Assemblies

• IPC-HDBK-001Handbook & Guide to Supplement J-STD-001

• IPC-9261

In-Process DPMO and Estimated Yield for PWAs • IPC-7912

Calculation of DPMO & Manufacturing Indices for PrintedBoard Assemblies

ACCEPTANCE

• IPC-DRM-40Through-Hole Solder Joint Evaluation Desk Reference Manual

• IPC-A-610Acceptability of Electronic Assemblies

• IPC-9191General Guidelines for Implementation of Statistical Process Control (SPC)

• IPC-DRM-SMT

Surface Mount Solder Joint Evaluation Desk Reference Manual

SOLDERABILITY

• IPC-WP-001Soldering Capability White Paper Report

• J-STD-002Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

• J-STD-003Solderability Tests for Printed Boards

• IPC-WP-005PWB Surface Finishes

• IPC-TR-461Solderability Evaluation of Thick & Thin Fused Coatings

• IPC-TR-462Solderability Evaluation of Printed Boards with Protective Coatings Over Long-Term Storage

SOLDERABILITY (cont.)

• IPC-TR-464Accelerated Aging for Solderability Evaluations

• IPC-TR-465-1Round Robin Test on Steam Ager Temperature Control Stability

• IPC-TR-465-2The Effect of Steam Aging Time and Temperature on Solderability Test Results

• IPC-TR-465-3Evaluation of Steam Aging on Alternative Finishes, Phase 11A

• IPC-TR-466Wetting Balance Standard Weight Comparison Test

ADVANCED• IPC-TR-001

An Introduction to Tape Automated Bonding Fine Pitch Technology

• IPC-WP-003Chip Mounting Technology

• J-STD-012Implementation of Flip Chip and Chip Scale Technology

• J-STD-013Implementation of Ball Grid Array & Other High Density Technology

• J-STD-026Semiconductor Design Standard for Flip Chip Applications

• J-STD-028Performance Standard for Construction of Flip Chip and Chip Scale Bumps

• IPC-SM-784Guidelines for Chip-on-Board Technology Implementation

• IPC-MC-790Guidelines for Multichip Module Technology Utilization

WIRE HARNESS

• IPC-WHMA-A-620Requirements & Acceptance for Cable & Wire

Harness Assemblies

OPTOELECTRONICS

• IPC-0040Optoelectronic Assembly and Packaging Technology

ASSEMBLY SUPPORT• SMC-WP-002

Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

• IPC-DRM-18Component Identification Desk Reference Manual

• IPC-DW-426Specification for Assembly of Discrete Wiring

• IPC-TR-581IPC Phase III Controlled Atmosphere Soldering Study

• IPC-TA-722Technology Assessment Handbook on Soldering

• IPC-TA-723Technology Assessment Handbook on Surface Mounting

• IPC-CM-770

Component Mounting Guidelines for Printed Boards

ASSEMBLY SUPPORT(cont.)• IPC-SM-780

Component Packaging and Interconnecting with Emphasis on Surface Mounting

• IPC-SM-785Guidelines for Accelerated Reliability Testing of Surface Mount

Attachments

• IPC-S-816SMT Process Guideline & Checklist

• IPC-AJ-820Assembly & Joining Handbook

• IPC-TP-1115Selection and Implementation Strategy for A Low-Residue No-

Clean Process

• IPC-1720Assembly Qualification Profile

ASSEMBLY SUPPORT(cont.)

• IPC-7095Design and Assembly Process Implementation for BGA's

• IPC-7525Stencil Design Guidelines

• IPC-7530Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes

• IPC-7711Rework of Electronic Assemblies

• IPC-7721Repair and Modification of Printed Boards and Electronic Assemblies

• IPC-9701Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments

• IPC-9851Equipment Interface Specification

ASSEMBLY MATERIALS

• J-STD-004Requirements for Soldering Fluxes

• J-STD-005Requirements for Soldering Pastes

• J-STD-006Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders

• IPC-TP-1043IPC Cleaning and Cleanliness Test Program Phase 3 Water Soluble Fluxes Part 1

• IPC-TP-1044IPC Cleaning and Cleanliness Test Program Phase 3 Water Soluble Fluxes Part 2

FLUX/SOLDER

ASSEMBLY MATERIALS (cont.)

ADHESIVES

• IPC-SM-817General Requirements for Dielectric Surface Mounting Adhesives

• IPC-CA-821General Requirements for Thermally Conductive Adhesives

• IPC-3406Guidelines for Electrically Conductive Surface Mount Adhesives

• IPC-3408General Requirements for Anisotropically Conductive Adhesives Films

ASSEMBLY MATERIALS (cont.)

• IPC-CC-830Qualification and Performance of Electrical Insulating

Compound for Printed Wiring Assemblies

• IPC-HDBK-830Guidelines for Design, Selection and Application of

Conformal Coatings

• IPC-SM-840Qualification and Performance of Permanent Solder

Mask

COAT/MASK

PCB / ACCEPTANCE• IPC-DW-425A

Design and End Product Requirements for Discrete Wiring Boards

• IPC-QE-605Printed Board Quality Evaluation Handbook

• IPC-TF-870Qualification and Performance of Polymer Thick Film Printed Boards

• IPC-MC-960Qualification and Performance Specification for Mass Lamination Panels for Multilayer Printed Boards

• IPC-1710

OEM Standard for Printed Board Manufacturers' Qualification Profile (MQP)

PCB / ACCEPTANCE (cont.)

• IPC-6011Generic Performance Specification for Printed Boards

• IPC-6012Qualification and Performance Specification for Rigid Printed Boards

• IPC-6013Qualification & Performance Specification for Flexible Printed Boards

• IPC-6015Qualification & Performance Specification for Organic Multichip Module Mounting and Interconnecting Structures

• IPC-6016Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards

• IPC-6018Microwave End Product Board Inspection and Test

PCB / ACCEPTANCE (cont.)

• IPC/JPCA-6202Performance Guide Manual for Single- and Double-Sided Flexible Printed Wiring Boards

• IPC/JPCA-6801Terms & Definitions, Test Methods, and Design Examples for Build-Up/High Density Interconnect (HDI) Printed Wiring Boards

• IPC-9191General Guidelines for Implementation of Statistical Process Control (SPC)

• IPC-9252Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards

• IPC-A-600Acceptability of Printed Boards

COMPONENTS

• J-STD-020Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

• J-STD-032Performance Standard for Ball Grid Array Balls

• J-STD-033 Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

• J-STD-035Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components

COMPONENTS (cont.)

• IPC-9501PWB Assembly Process Simulation for Evaluation of Electronic Components

• IPC-9502PWB Assembly Soldering Process Guideline for Electronic Components

• IPC-9503Moisture Sensitivity Classification for Non-IC Components

• IPC-9504Assembly Process Simulation for Evaluation of Non-IC Components (Preconditioning Non-IC Components)

CLEANING/ CLEANLINESS

• IPC-SC-60Post Solder Solvent Cleaning Handbook

• IPC-SA-61Post Solder Semi-Aqueous Cleaning Handbook

• IPC-AC-62Aqueous Post Solder Cleaning Handbook

• IPC-CH-65Guidelines for Cleaning of Printed Boards & Assemblies

• IPC-TR-468Factors Affecting Insulation Resistance Performance of Printed Boards

• IPC-TR-476Electrochemical Migration: Electrically Induced Failures in Printed Wiring Assemblies

CLEANING/ CLEANLINESS (cont.)

• IPC-TR-580Cleaning and Cleanliness Test Program Phase 1 Test Results

• IPC-TR-581IPC Phase III Controlled Atmosphere Soldering Study

• IPC-TR-582Cleaning & Cleanliness Test Program for: Phase 3-Low Solids Fluxes & Pastes Processed in Ambient Air

• IPC-TR-583An In-Depth Look At Ionic Cleanliness Testing

• IPC-SM-839Pre & Post Solder Mask Application Cleaning Guidelines

• IPC-9201Surface Insulation Resistance Handbook

LAMINATE

• IPC-FC-234PSA Assembly Guidelines for Single- & Double-Sided Flexible Printed Circuits

• IPC-4202Flexible Base Dielectrics for Use in Flexible Printed Circuitry

• IPC-4203Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films

• IPC-4204Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry

• IPC-4552Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards

FLEX

LAMINATE (cont.)

RIGID• IPC-4101

Specifications for Base Materials for Rigid and Multilayer Printed Boards

• IPC-4103Specification for Base Materials for High Speed/High Frequency Applications

• IPC-1730Laminator Qualification Profile

HDI• IPC-DD-135

Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip Modules

• IPC-4104Specification for High Density Interconnect (HDI) and Microvia Materials

• IPC-SM-840Qualification and Performance of Permanent Solder Mask

LAMINATE (cont.)

• IPC-CF-148Resin Coated Metal for Printed Boards

• IPC-CF-152IPC-CF-152Composite Metallic Materials Specification for Printed Wiring Boards

• IPC-1731Strategic Raw Materials Supplier Qualification Profile

• IPC-4562Metal Foil for Printed Wiring Applications

FOIL

FABRICATION

• IPC-DR-570General Specification for 1/8 inch Diameter Shank Carbide Drills for Printed Boards

• IPC-DR-572Drilling Guidelines for Printed Boards

• IPC-OI-645Standard for Visual Optical Inspection Aids

• IPC-TA-724Technology Assessment Series on Clean Rooms

• IPC-PE-740Troubleshooting for Printed Board Manufacture and Assembly

REINFORCEMENT

• IPC-4412Specification for Finished Fabric Woven from "E" Glass for Printed Boards

• IPC-SG-141Specification for Finished Fabric Woven from "S" Glass for Printed Boards

• IPC-A-142Specification for Finished Fabric Woven from Aramid for Printed Boards

• IPC-QF-143Specification for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards

• IPC-1731Strategic Raw Materials Supplier Qualification Profile

REINFORCEMENT (cont.)

• IPC-4110Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards

• IPC-4121Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications

• IPC-4130Specification & Characterization Methods for Nonwoven "E" Glass Mat

• IPC-4411Specification and Characterization Methods for Non-Woven Para-Aramid Reinforcement

ASSEMBLY

• IPC-D-279Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies

• IPC-D-326Information Requirements for Manufacturing Electronic Assemblies

• IPC-C-406Design & Application Guidelines for Surface Mount Applications Connectors

• IPC-C-408Design & Application Guidelines for the Use of Solderless Surface Mount Connectors

• IPC-SM-782Surface Mount Design & Land Pattern Standard

INTERFACES

• IPC-D-310Guidelines for Phototool Generation and Measurement Techniques

• IPC-A-311Process Controls for Phototool Generation and Use

• IPC-D-350Printed Board Description in Digital Form

• IPC-D-351Printed Board Drawings in Digital Form

• IPC-D-356Bare Substrate Electrical Test Data Format

• IPC-D-390Automated Design Guidelines

INTERFACES

• IPC-2511Generic Requirements for Implementation of Product Mfg. Description Data & Transfer Methodology

• IPC-2531Standard Recipe File Format Specification

• IPC-2541Generic Requirements for Electronics Manufacturing Shop Floor Equipment Communication (CAMX)

• IPC-2571Generic Requirements for Electronics Mfg. Supply Chain Communication - Product Data eXchange (PDX)

PCB• SMC-WP-004

Design for Success

• IPC-2252Design Guide for RF/Microwave Circuit Boards

• IPC-D-317Design Guidelines for Electronic Packaging Utilizing High Speed Techniques

• IPC-D-859Design Standard for Thick Film Multilayer Hybrid Circuits

• IPC-1902Grid Systems for Printed Circuits

• IPC-2141Controlled Impedance Circuit Boards & High Speed Logic Design

PCB (cont.)• IPC-2221

Generic Standard on Printed Board Design

• IPC-2222Sectional Standard on Rigid Organic Printed Boards

• IPC-2223Sectional Design Standard for Flexible Printed Boards

• IPC-2224Sectional Standard of Design of PWB for PC Cards

• IPC-2225Sectional Design Standard for Organic Multichip Modules (MCM-L) and

MCM-L Assemblies

• IPC-2315Design Guide for High Density Interconnects & Microvias

• IPC-2615Printed Board Dimensions and Tolerances

JEDEC: IEC PAS ACTIVITY

• EIA/JESD22-B102C – 47/1446/PAS IEC 62173 Ed. 1: – Solderability test method

• JESD22-B106-B– 47/1447/PAS: IEC 60749-15, Ed. 1: – Resistance to soldering temperature for through-hole mounted devices

• EIA/JESD-22-B107-A– 47/1448/PAS: IEC 62175, Ed. 1: – Marking Permanency– 47/1629/MCR: Published as part of IEC 60749-9, Ed. 1

• EIA/JESD22-B116– 47/1449/PAS: IEC 62176, Ed. 1: – Wire bond shear test method– 47/1482A/RVD Withdrawal of 47/1449/PAS

JEDEC: IEC PAS ACTIVITY

• JESD22-A110B-B– 47/1450/PAS: IEC 62177, Ed. 1: – Highly-accelerated temperature and humidity stress test (HAST)– 47/1627/MCR Published as part of IEC 60749-4, Ed. 1

• JESD22-A104-A– 47/1451/PAS: IEC 62178, Ed. 1:– Temperature cycling

• EIA/JESD22-A114-A– 47/1452/PAS: IEC 62179, Ed. 1: – Electrostatic discharge (ESD) sensitivity testing human body model (HBM)

• EIA/JESD22-A115-A– 47/1453/PAS: IEC 62180, Ed. 1: – Electrostatic discharge (ESD) sensitivity testing machine model (MM)

JEDEC: IEC PAS ACTIVITY

• JESD78– 47/1454/PAS: IEC 62181, Ed. 1: – IC latch-up test

• JESD22-A113-B– 47/1455/PAS: IEC 62182, Ed. 1: – Preconditioning of nonhermetic surface mount devices prior to reliability testing

• JESD22-A107-A– 47/1456/PAS: IEC 62183, Ed. 1: – Salt atmosphere– 47/1633/MCR: Published as part of IEC 60749-13, Ed. 1

• JESD22-B105-B– 47/1457/PAS: IEC 62184, Ed. 1: – Lead integrity

JEDEC: IEC PAS ACTIVITY

• JESD22-A106-A– 47/1458/PAS: IEC 62185, Ed. 1: – Thermal shock– 47/1631/MCR: Published as part of IEC 60749-11, Ed. 1

• JESD22-B104-A– 47/1459/PAS: IEC 62186, Ed. 1: – Mechanical shock– 47/1630/MCR: Published as part of IEC 60749-10. Ed. 1

• JESD22-B103-A– 47/1460/PAS: IEC 62187, Ed. 1: – A vibration, variable frequency– 47/1632/MCR: Published as part of IEC 60749-12, Ed. 1

• JESD22-A101-B– 47/1461/PAS: IEC 62161, Ed.1: – Test method A101-B – Steady state temperature humidity bias life test– 47/1680/MCR: Published as IEC 60749-5, Ed. 1

JEDEC: IEC PAS ACTIVITY• JESD22-C101

– 47/1462/PAS: IEC 60749-28, Ed. 1: – Test method C101 – Electrostatic Discharge (ESD) Sensitivity Testing –

Charged device model (CDM)

• JESD22-B101– 47/1463/PAS: IEC 62163, Ed. 1:– Test method B101 – External Visual– 47/1626/MCR: Published as part of IEC 60749-3, Ed. 1

• JEP118– 47/1464/PAS: IEC 62164, Ed. 1: – Guidelines for GaAs MMIC and FET life testing

• JEP110– 47/1465/PAS: IEC 62165, Ed. 1: – Guidelines for the measurement of thermal resistance of GaAs FETs

• EIA/JESD46-A– 47/1466/PAS: IEC 62166, Ed. 1: – Guidelines for user notification of product/process changes by semiconductor

suppliers

JEDEC: IEC PAS ACTIVITY• EIA/JESD48

– 47/1467/PAS: IEC 62167, Ed. 1: – Product discontinuance

• JEP 113-B– 47/1468/PAS: IEC 62168, Ed. 1: – Symbols and labels for moisture-sensitive devices

• IPC/JEDEC J-STD-033– 47/1469/PAS: IEC 62169, Ed. 1:– Standard for handling, packing, shipping and use of moisture/reflow sensitive

surface mount devices

• EIA/JESD59– 47/1470/PAS: IEC 62170, Ed. 1: – Bond wire modeling standard

• JEP114– 47/1471/PAS: IEC 62171, Ed. 1: – Guidelines for particle impact noise detection (PIND) testing, operator training

and certification– 47/1681/MCR: Published as 60749-16, Ed. 1

JEDEC: IEC PAS ACTIVITY

• JESD22-A102-B– 47/1472/PAS: IEC 62172, Ed. 1: – Accelerated moisture resistance – Unbiased autoclave

• JESD22-A108-A– 47/1474/PAS: IEC 62189, Ed. 1: – Bias Life

• J-STD-020A (IPC/JEDEC)– 47/1475/PAS: IEC 62190, Ed. 1: – Moisture/reflow sensitivity classification for nonhermetic solid state surface

mount devices– 47/1592/MCR: Publication Withdrawn – Topic is now covered by IEC 60749,

Amendment 2, Ed. 2 (2001-10) and IEC 60749, Ed. 2.2 (2001-12).

• J-STD-035– 47/1476/PAS: IEC 62191, Ed. 1: – Acoustic microscopy for nonhermetic encapsulated electronic components– 47/1593/MCR: Publication Withdrawn – Topic is now covered by IEC 60749,

Amendment 2, Ed. 2 (2001-10) and by IEC 60749, Ed. 2.2 (2001-12)

JEDEC: IEC PAS ACTIVITY

• JEP119– 47/1506/PAS: IEC 62201, Ed. 1: – A procedure for executing sweat

• EIA/JEP122– 47/1507/PAS: IEC 62202, Ed. 1: – Failure mechanisms and models for silicon semiconductor devices

• EIA/JEP128– 47/1508/PAS: IEC 62203, Ed. 1: – Guide for standard probe pad sizes and layouts for wafer-level electrical

testing

• EIA/JESD33-A– 47/1509/PAS: IEC 62204, Ed. 1: – Measuring and using the temperature coefficient of resistance to determine the

temperature of a metallization line

• JESD-A103-A– 47/1513/PAS: IEC 60749-6 Ed. 1: – High temperature storage life– 47/1628/MCR: Published as part of IEC 60749-6, Ed. 1

JEDEC: IEC PAS ACTIVITY

• EIA/JESD22-A105-B– 47/1514/PAS: IEC 62206, Ed. 1: – Test Method A105-B – Power and temperature cycling

• JESD22-A109– 47/1515/PAS: IEC 62207, Ed. 1: – Test Method A109 – Hermeticity– 47/1594/MCR: Publication Withdrawn – Topic is now covered by IEC 60749,

Amendment 2, Ed. 2 (2001-10) and by IEC 60749, Ed. 2.2 (2001-12)

• JESD22-A120– 47/1595/PAS: IEC 62307– Test Method for the Measurement of Moisture Diffusivity and Water Solubility in

organic Materials Used in Integrated Circuits

• JESD22-A118– 47/1635/PAS: IEC PAS 62336: – Accelerated Moisture Resistance – Unbiased HAST

IPC: IEC PAS ACTIVITY

• IPC-EIA/J-STD-012– IEC/PAS 62084– Flip chip and chip scale technology implementation

• IPC-EIA/J-STD-013– IEC/PAS 62085– Implementation of ball grid array and other high density technology

• IPC-2511– IEC/PAS 62119– Generic requirements for implementation of product manufacturing description

data and transfer methodology

• IPC-6202– IEC/PAS 62123 Ed. 1.0– Performance guide Manual for single- and double-sided flexible printed wiring

boards

• IPC-4130– IEC/PAS 62212– Specification and characterization methods for nonwoven "E" glass mat

IPC: IEC PAS ACTIVITY

• IPC-4411– IEC/PAS 62213

– Specification and characterization methods for nonwoven para-aramid reinforcement

• IPC-6011– IEC/PAS 62214– Generic performance specification for printed boards

• IPC-1710– IEC/PAS 62158 Ed. 1.0– Manufacturers qualification profile (MQP)

• IPC-1720– IEC/PAS 62159 Ed. 1.0– Assembly qualification profile (AQP)

IPC: IEC PAS ACTIVITY

• IPC-1730– IEC/PAS 62160 Ed. 1.0– Laminator qualification profile

• IPC-6013 (with amendment)– IEC/PAS 62249 /ED, 1,9 – Qualification and performance specification for flexible printed boards

• IPC-6012 (with amendment)– IEC/PAS 62250– Qualification and performance specification for rigid printed boards