IPC-WHMA-A-620A

IPC/WHMA-A-620A

Requirements and Acceptancefor Cable and Wire HarnessAssemblies

ASSOCIATION CONNECTINGELECTRONICS INDUSTRIES

3000 Lakeside Drive, Suite 309S, Bannockburn, IL 60015-1249Tel. 847.615.7100 Fax 847.615.7105

www.ipc.org

IPC/WHMA-A-620AJuly 2006 A standard developed by IPC

Supersedes IPC/WHMA-A-620January 2002

The Principles ofStandardization

In May 1995 the IPCs Technical Activities Executive Committee (TAEC) adopted Principles ofStandardization as a guiding principle of IPCs standardization efforts.

Standards Should: Show relationship to Design for Manufacturability

(DFM) and Design for the Environment (DFE) Minimize time to market Contain simple (simplified) language Just include spec information Focus on end product performance Include a feedback system on use and

problems for future improvement

Standards Should Not: Inhibit innovation Increase time-to-market Keep people out Increase cycle time Tell you how to make something Contain anything that cannot

be defended with data

Notice IPC Standards and Publications are designed to serve the public interest through eliminating mis-understandings between manufacturers and purchasers, facilitating interchangeability and improve-ment of products, and assisting the purchaser in selecting and obtaining with minimum delay theproper product for his particular need. Existence of such Standards and Publications shall not inany respect preclude any member or nonmember of IPC from manufacturing or selling productsnot conforming to such Standards and Publication, nor shall the existence of such Standards andPublications preclude their voluntary use by those other than IPC members, whether the standardis to be used either domestically or internationally.

Recommended Standards and Publications are adopted by IPC without regard to whether their adop-tion may involve patents on articles, materials, or processes. By such action, IPC does not assumeany liability to any patent owner, nor do they assume any obligation whatever to parties adoptingthe Recommended Standard or Publication. Users are also wholly responsible for protecting them-selves against all claims of liabilities for patent infringement.

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Copyright 2006. IPC, Bannockburn, Illinois and Wire Harness Manufacturers Association, Eden Prairie, Minnesota. All rights reservedunder both international and Pan-American copyright conventions. Any copying, scanning or other reproduction of these materials withoutthe prior written consent of the copyright holder is strictly prohibited and constitutes infringement under the Copyright Law of the UnitedStates.

IPC/WHMA-A-620A

Requirements and

Acceptance for Cable

and Wire Harness

Assemblies

Developed by the IPC Task Group (7-31f) of the ProductAssurance Subcommittee (7-30) and the WHMA IndustryTechnical Guidelines Committee (ITGC)

Users of this publication are encouraged to participate in thedevelopment of future revisions.

Contact:

IPC3000 Lakeside Drive, Suite 309SBannockburn, Illinois60015-1219Tel 847 615.7100Fax 847 615.7105

Wiring Harness Manufacturers Assoc.7500 Flying Cloud Drive, Suite 900Eden Prairie, Minnesota55344Tel 952 835.4180Fax 952 835.4774

Supersedes:IPC/WHMA-A-620 -

January 2002

ASSOCIATION CONNECTINGELECTRONICS INDUSTRIES

This Page Intentionally Left Blank

Any document involving a complex technology draws materials from a vast number of sources. While the principal members of theIPC/WHMA-A-620 joint working group comprised of IPC Task Group (7-31f) of the Product Assurance Subcommittee (7-30) andthe WHMA Industry Technical Guidelines Committee (ITGC) are shown below, it is not possible to include all of those who assistedin the evolution of this standard. To each of them, the members of the IPC and WHMA extend their gratitude.

Product Assurance Committee IPC/WHMA-A-620 Joint Working Group

ChairMel ParrishSoldering Technology International

Technical Liaisons of theIPC Board of Directors

Peter BigelowIMI Inc.

Sammy YiFlextronics International

James MoffittMoffitt Consulting Services

Blen TalbotL-3 Communications

Brett MillerUSA Harness, Inc.

Ray SweeneyUnlimited Services

Members of the IPC/WHMA-A-620 Joint Working Group

Teresa M. Rowe, AAI Corporation

Riley L. Northam, ACI/EMPF

Constantino J. Gonzalez, ACME Training & Consulting

Frank M. Piccolo, Adeptron Technologies Corporation

Barry Morris, Advanced Rework Technology-A.R.T

Debbie Wade, Advanced Rework Technology-A.R.T

John Schimelfanick, Applied Engineering Products/Radiall

Richard Broga, Applied Engineering Products/Radiall

William G. Butman, AssemTech Skills Training Corp.

Bill Strachan, AsTA - Highbury College

Greg Hurst, BAE Systems

Gary Grandprey, BAE Systems Land & Armaments L.P.

Gerald Leslie Bogert, Bechtel Plant Machinery, Inc.

Linda Tucker, Blackfox Training Institute

Thomas A. Carroll, Boeing Space Systems

Marius Gheorghe, Cabletest International

Marlin C. Shelley, Cirris Systems Corporation

Bob Potysman, Delta Group Electronics

Gary Lawless, Delta Group Electronics

William E. McManes, DRS Test & Energy Management

Jon M. Roberts, DRS Test & Energy Management

Mary Muller, Eldec Corporation Division of the CraneAerospace Group

Leo P. Lambert, EPTAC Corporation

Deepak K. Pai, C.I.D.+, General Dynamics-AdvancedInformation Systems

Ken Bloomquist, General Dynamics-AES

Doug Rogers, Harris Corporation, GCSD

John Mastorides, Honeywell Aerospace Electronic Systems

William A. Novak, Honeywell Inc.

Don Youngblood, Honeywell Inc. Defense Avionics Systems

Joe Kane, Kanetic, Inc.

Blen F. Talbot, L-3 Communications

T. John Laser, L-3 Communications

Shelbie Merrill, L-3 Communications

Vijay Kumar, Lockheed Martin Missile & Fire Control

Hue T. Green, Lockheed Martin Space Systems CompanySpace & Strategic Missiles

Michael R. Green, Lockheed Martin Space SystemsCompany Space & Strategic Missiles

Gregg A. Owens, Manufacturing Technology Training CenterInc. (MTTC)

James H. Moffitt, Moffitt Consulting Services

Garry D. McGuire, NASA Marshall Space Flight Center

Robert D. Humphrey, NASA/Goddard Space Flight Center

Seppo J. Nuppola, Nokia Networks Oyj

Randy McNutt, Northrop Grumman

Bernard Icore, Northrop Grumman - ESSS

William A. Rasmus, Jr., Northrop Grumman Space Systems

Mahendra S. Gandhi, Northrop Grumman Space Technology

Peggi J. Blakley, NSWC - Crane

Joseph L. Sherfick, NSWC - Crane

Jan Saris, Oce-Technologies B.V.

Ken A. Moore, Omni Training Corp.

Vernon Judy, Sr., Qualastat Electronics

Lisa Maciolek, Raytheon Company

Patrick J. Kane, Raytheon System Technology

Ronnie Rice, RF Industries, Connector Division

Terry Saunders, Schindler Elevator Corporation

Acknowledgment

iiiIPC/WHMA-A-620A July 2006

Robert C. Boyd, Schleuniger, Inc.

Brian Baker, SGS U.S. Testing Company Consumer TestingServices

Terry Clitheroe, Solder Technologies

Herbert C. Grove, Souriau USA

Mel Parrish, STI Electronics, Inc.

Daniel L. Foster, STI Electronics, Inc.

Charles C. Myers, Sun Microsystems, Data Storage Group

Ronald W. Hotchkiss, Surge Technology, Inc.

Rick Stockwell, Technical Services for Electronics Inc.

Dave Luce, Tensolite

Susan Roder, Thomas Electronics

Rick Hawthorne, Tyco Electronics

Martha Schuster, U.S. Army Aviation & Missile Command

Sharon T. Ventress, U.S. Army Aviation & Missile Command

Anthony M. Monteiro, United Technologies HamiltonSundstrand

James Jenkins, BEST Electronic Training

Ray Sweeney, Unlimited Services

Brett A. Miller, USA Harness, Inc.

SPECIAL ACKNOWLEDGMENT

We would like to provide special acknowledgment to the following members for providing pictures and illustrations that are usedin this revision.

Randy McNutt, Northrop Grumman

James H. Moffitt, Moffitt Consulting Services

Seppo Nuppola, Nokia Networks Oyj

Ken A. Moore, Omni Training Corp.1

Mel Parrish, Soldering Technology International

Ray Sweeney, Unlimited Services

Blen F. Talbot, L-3 Communications

1. Figures 3-10, 4-7, 4-8, 4-16, 4-17, 4-18, 4-33, 4-36, 4-39, 4-41, 4-42,4-48, 4-50, 4-51, 4-53, 4-60, 4-61, 4-62, 4-63, 4-64, 4-66, 4-70, 4-71are Omni Training Corporation, used by permission.

Acknowledgment (cont.)

iv IPC/WHMA-A-620AJuly 2006

1 Requirements and Acceptance for Cableand Wire Harness Assemblies ................................... 1-1

1.1 Scope ........................................................................ 1-1

1.2 Purpose .................................................................... 1-1

1.3 Approach to This Document ................................. 1-1

1.4 Shall or Should ........................................................ 1-1

1.5 Uncommon or Specialized Designs ..................... 1-1

1.6 Terms and Definitions ........................................... 1-1

1.7 Classes of Products ............................................... 1-2

1.8 Document Hierarchy .............................................. 1-2

1.9 Tool and Equipment Control ................................ 1-2

1.10 Observable Criteria ................................................ 1-3

1.11 Defects and Process Indicators .......................... 1-3

1.12 Inspection Conditions ............................................ 1-3

1.12.1 Target ................................................................. 1-31.12.2 Acceptable ......................................................... 1-31.12.3 Process Indicator ............................................... 1-31.12.4 Defect ................................................................. 1-31.12.5 Disposition .......................................................... 1-31.12.6 Product Classification Implied

Relationships ...................................................... 1-31.12.7 Conditions Not Specified .................................... 1-3

1.13 Electrical Clearance .............................................. 1-3

1.14 Measurement Units and Applications ................ 1-4

1.15 Verification of Dimensions ................................... 1-4

1.16 Visual Inspection .................................................... 1-4

1.16.1 Lighting .............................................................. 1-41.16.2 Magnification Aids and Lighting .......................... 1-4

1.17 Electrostatic Discharge (ESD) Protection .......... 1-5

1.18 Contamination ......................................................... 1-5

1.19 Materials and Processes ....................................... 1-5

2 Applicable Documents ................................................ 2-1

2.1 IPC ............................................................................... 2-1

2.2 Joint Industry Standards ......................................... 2-1

2.3 Society of Automotive Engineers (SAE) ................ 2-1

2.4 American National Standards Institute(ANSI) ........................................................................... 2-2

2.5 International Organization for Standardization(ISO) ............................................................................. 2-2

2.6 ESD Association (ESDA) .......................................... 2-2

3 Preparation .................................................................... 3-1

3.1 Stripping ..................................................................... 3-2

3.2 Strand Damage and End Cuts ................................ 3-2

3.3 Conductor Deformation/Birdcaging ...................... 3-5

3.4 Twisting of Wires ...................................................... 3-7

3.5 Wire Insulation Damage .......................................... 3-8

4 Soldered Terminations ................................................ 4-1

4.1 Material, Components and Equipment ................. 4-2

4.1.1 Materials ........................................................ 4-24.1.1.1 Solder ............................................................ 4-24.1.1.2 Flux ................................................................ 4-24.1.1.3 Adhesives ...................................................... 4-34.1.1.4 Solderability ................................................... 4-34.1.1.5 Tools and Equipment .................................... 4-34.1.2 Gold Removal ................................................ 4-3

4.2 Cleanliness ................................................................ 4-4

4.2.1 Presoldering .................................................. 4-44.2.2 Postsoldering ................................................. 4-44.2.2.1 Particulate Matter .......................................... 4-44.2.2.2 Flux Residue .................................................. 4-54.2.2.2.1 Cleanable Flux ............................................... 4-54.2.2.2.2 No-Clean Process ......................................... 4-5

4.3 Solder Connection .................................................... 4-6

4.3.1 General Requirements ................................... 4-74.3.2 Soldering Anomalies ...................................... 4-84.3.2.1 Exposed Basis Metal ..................................... 4-84.3.2.2 Exposed Surface Finishes ............................. 4-84.3.2.3 Partially Visible or Hidden

Solder Connections ....................................... 4-8

Table of Contents

vIPC/WHMA-A-620A July 2006

4.4 Wire/Lead Preparation, Tinning ............................. 4-9

4.5 Wire Insulation ........................................................ 4-11

4.5.1 Clearance ........................................................ 4-114.5.2 Postsolder Damage ......................................... 4-13

4.6 Insulation Sleeving ................................................. 4-14

4.7 Birdcaged Wire (Soldered) .................................... 4-16

4.8 Connection Requirements .................................... 4-17

4.8.1 Turret Terminals .............................................. 4-194.8.2 Bifurcated Terminals ........................................ 4-214.8.2.1 Side Route Attachments ................................. 4-214.8.2.2 Bottom and Top Route Attachments .............. 4-234.8.2.3 Staked Wires ................................................... 4-244.8.3 Slotted Terminals ............................................ 4-254.8.4 Pierced/Perforated/Punched Terminals ........... 4-264.8.5 Hook Terminals ............................................... 4-274.8.6 Cup Terminals ................................................. 4-294.8.7 Series Connected Terminals ........................... 4-304.8.8 Lead/Wire Placement - AWG 30 and Smaller

Diameter Wires ................................................ 4-31

4.9 Solder Connection .................................................. 4-32

4.9.1 Turret Terminals .............................................. 4-344.9.2 Bifurcated Terminals ........................................ 4-354.9.3 Slotted Terminals ............................................ 4-374.9.4 Pierced/Perforated Terminals .......................... 4-384.9.5 Hook Terminals ............................................... 4-394.9.6 Cup Terminals ................................................. 4-40

5 Crimp Terminations (Contacts and Lugs) ................ 5-1

5.1 Stamped and Formed - Open Barrel ..................... 5-2

5.1.1 Insulation Support Crimp .................................. 5-35.1.2 Insulation Inspection Window ............................ 5-55.1.3 Conductor Crimp .............................................. 5-75.1.4 Crimp Bellmouth ............................................... 5-95.1.5 Conductor Brush ............................................. 5-115.1.6 Stamped and Formed Carrier Cutoff Tab ........ 5-13

5.2 Stamped and Formed - Closed Barrel ................ 5-14

5.2.1 Insulation Support Crimp ................................ 5-155.2.2 Conductor Crimp and Bellmouth .................... 5-17

5.3 Machined Contacts ................................................ 5-19

5.3.1 Insulation Clearance ........................................ 5-195.3.2 Insulation Support Style .................................. 5-225.3.3 Conductor Location ........................................ 5-235.3.4 Crimping ......................................................... 5-255.3.5 CMA Buildup ................................................... 5-27

5.4 Termination Ferrule Crimp ................................... 5-29

6 Insulation Displacement Connection (IDC) ............. 6-1

6.1 Mass Termination, Flat Cable ................................ 6-2

6.1.1 End Cutting ........................................................ 6-26.1.2 Notching ............................................................. 6-36.1.3 Planar Ground Plane Removal ........................... 6-46.1.4 Connector Position ............................................. 6-56.1.5 Connector Skew & Lateral Position .................... 6-86.1.6 Retention ............................................................ 6-9

6.2 Discrete Wire Termination .................................... 6-10

6.2.1 General ............................................................. 6-106.2.2 Position of Wire ................................................ 6-116.2.3 Overhang (Extension) ........................................ 6-126.2.4 Wire Holder ...................................................... 6-136.2.5 Damage in Connection Area ............................ 6-156.2.6 End Connectors ............................................... 6-166.2.7 Wiremount Connectors .................................... 6-186.2.8 Subminiature D-Connector (Series

Bus Connector) ................................................ 6-196.2.9 Modular Connectors (RJ Type) ......................... 6-21

7 Ultrasonic Welding ....................................................... 7-1

7.1 Insulation Clearance ................................................ 7-2

7.2 Weld Nugget .............................................................. 7-3

8 Splices ............................................................................ 8-1

8.1 Soldered Splices ....................................................... 8-2

8.1.1 Mesh .................................................................. 8-28.1.2 Wrap .................................................................. 8-48.1.3 Hook .................................................................. 8-58.1.4 Lap ..................................................................... 8-68.1.4.1 Two or More Conductors ................................... 8-78.1.4.2 Insulation Opening (Window) .............................. 8-98.1.5 Heat Shrinkable Solder Devices ....................... 8-11

8.2 Crimped Splices ...................................................... 8-13

8.2.1 Barrel ................................................................ 8-138.2.2 Double Sided ................................................... 8-16

8.3 Ultrasonic Weld Splices ........................................ 8-20

9 Connectorization .......................................................... 9-1

9.1 Hardware Mounting .................................................. 9-2

9.1.1 Jackpost - Height ............................................... 9-29.1.2 Jackscrews - Protrusion ..................................... 9-3

Table of Contents (cont.)

vi IPC/WHMA-A-620AJuly 2006

9.2 Strain Relief ............................................................... 9-4

9.2.1 Clamp Fit ......................................................... 9-49.2.2 Wire Dress ....................................................... 9-59.2.2.1 Straight Approach ............................................ 9-69.2.2.2 Side Approach ................................................. 9-7

9.3 Sleeving and Boots ................................................... 9-8

9.3.1 Position ............................................................ 9-89.3.2 Bonding ........................................................... 9-9

9.4 Connector Damage ................................................. 9-12

9.4.1 Criteria ........................................................... 9-129.4.2 Limits - Hard Face - Mating Surface .............. 9-139.4.3 Limits - Soft Face - Mating Surface

or Rear Seal Area .......................................... 9-149.4.4 Contacts ........................................................ 9-15

9.5 Installation of Contacts and Sealing Plugsinto Connectors ...................................................... 9-16

9.5.1 Installation of Contacts ................................... 9-169.5.2 Installation of Sealing Plugs ............................ 9-18

10 Molding/Potting ........................................................ 10-1

10.1 Molding ................................................................... 10-2

10.1.1 Mold Fill - Initial .............................................. 10-210.1.2 Mold Fill - Final ............................................... 10-410.1.3 Mismatch ....................................................... 10-810.1.4 Blow Through ................................................ 10-910.1.5 Terminal/Contact Position ............................ 10-1010.1.6 Fit ................................................................. 10-1210.1.7 Flashing ....................................................... 10-1410.1.8 Cracks, Flow Lines, Chill Marks (Knit Lines)

or Weld Lines ............................................... 10-1610.1.9 Color ............................................................ 10-1810.1.10 Wire Insulation, Jacket or Sleeving Damage . 10-1810.1.11 Curing .......................................................... 10-2010.1.12 Rework ........................................................ 10-21

10.2 Potting .................................................................. 10-22

10.2.1 Filling ............................................................. 10-2210.2.2 Fit to Wire or Cable ....................................... 10-2310.2.3 Curing ........................................................... 10-24

11 Cable Assemblies and Wires ................................. 11-1

11.1 Cable Measuring ................................................... 11-2

11.1.1 Reference Surfaces ........................................ 11-211.1.1.1 Straight/Axial Connectors ............................... 11-211.1.1.2 Right-Angle Connectors ................................. 11-211.1.2 Length ........................................................... 11-311.1.3 Breakout ........................................................ 11-4

11.2 Wire Measuring ..................................................... 11-5

11.2.1 Electrical Terminal Reference Location ........... 11-511.2.2 Length ........................................................... 11-6

12 Marking/Labeling ..................................................... 12-1

12.1 Content ................................................................... 12-2

12.2 Legibility ................................................................. 12-2

12.3 Permanency ........................................................... 12-4

12.4 Location and Orientation .................................... 12-4

12.5 Functionality .......................................................... 12-6

12.6 Marker Sleeve ....................................................... 12-7

12.6.1 Wrap Around ................................................. 12-712.6.2 Tubular ........................................................... 12-9

12.7 Flag Markers ...................................................... 12-10

12.7.1 Adhesive ...................................................... 12-1012.7.2 Tie Wrap ...................................................... 12-10

13 Coaxial and Twinaxial Cable Assemblies ............ 13-1

13.1 Stripping ................................................................. 13-2

13.2 Center Conductor Termination .......................... 13-4

13.2.1 Crimp .............................................................. 13-413.2.2 Solder ............................................................. 13-6

13.3 Solder Ferrule Pins .............................................. 13-8

13.3.1 General ........................................................... 13-813.3.2 Insulation ....................................................... 13-10

13.4 Coaxial Connector - Printed WireBoard Mount ........................................................ 13-11

13.5 Coaxial Connector - Center ConductorLength - Right Angle Connector ...................... 13-12

13.6 Coaxial Connector - CenterConductor Solder ............................................... 13-14

13.7 Coaxial Connector - Terminal Cover .............. 13-16

13.7.1 Soldering ....................................................... 13-1613.7.2 Press Fit ........................................................ 13-17

13.8 Shield Termination ............................................. 13-18

13.8.1 Clamped Ground Rings ................................ 13-1813.8.2 Crimped Ferrule ............................................ 13-19


viiIPC/WHMA-A-620A July 2006

13.9 Center Pin Position ............................................ 13-21

13.10 Semirigid Coax .................................................. 13-22

13.10.1 Bending and Deformation .......................... 13-2213.10.2 Surface Condition ...................................... 13-2513.10.3 Dielectric Cutoff ......................................... 13-2713.10.4 Dielectric Cleanliness ................................. 13-2913.10.5 Solder ........................................................ 13-30

13.11 Swage-Type Connector ................................... 13-32

13.12 Soldering and Stripping of Biaxial Wire ....... 13-33

13.12.1 Jacket and Tip Installation ......................... 13-3313.12.2 Ring Installation ......................................... 13-35

14 Securing .................................................................... 14-1

14.1 Tie Wrap/Lacing Application .............................. 14-2

14.1.1 Tightness ..................................................... 14-614.1.2 Damage ....................................................... 14-714.1.3 Spacing ....................................................... 14-8

14.2 Breakouts ............................................................... 14-9

14.2.1 Individual Wires ............................................ 14-914.2.2 Spacing ..................................................... 14-10

14.3 Routing ................................................................. 14-13

14.3.1 Wire Crossover .......................................... 14-1314.3.2 Bend Radius .............................................. 14-1414.3.3 Coaxial Cable ............................................ 14-1514.3.4 Unused Wire Termination .......................... 14-1614.3.5 Ties over Splices and Ferrules ................... 14-17

15 Harness/Cable Electrical Shielding ...................... 15-1

15.1 Braided ................................................................... 15-2

15.1.1 Direct Applied .............................................. 15-315.1.2 Prewoven .................................................... 15-5

15.2 Shield Termination ............................................... 15-6

15.2.1 Shield Jumper Wire ..................................... 15-615.2.1.1 Attached Lead ............................................. 15-615.2.1.1.1 Solder/Heat Shrinkable Solder Device ......... 15-715.2.1.1.2 Crimp ........................................................ 15-1115.2.1.2 Shield Braid ............................................... 15-1115.2.1.2.1 Woven ....................................................... 15-1115.2.1.2.2 Combed and Twisted ................................ 15-1215.2.1.3 Daisy Chain ............................................... 15-1215.2.2 No Shield Wire .......................................... 15-13

15.3 Shield Termination - Connector ...................... 15-15

15.3.1 Shrink and Crimp ........................................... 15-1515.3.2 Shield Jumper Wire Attachment ..................... 15-19

15.4 Shield Termination - Splicing ........................... 15-20

15.4.1 Solder ............................................................. 15-2015.4.2 Tie/Tape On ................................................... 15-22

15.5 Tapes - Barrier and Conductive,Adhesive or Nonadhesive ................................. 15-23

15.6 Conduit (Shielding) ............................................. 15-24

15.7 Shrink Tubing - Conductive Lined .................. 15-25

16 Cable/Wire Harness Protective Coverings ......... 16-1

16.1 Braid ........................................................................ 16-2

16.1.1 Direct Applied ................................................... 16-216.1.2 Prewoven ......................................................... 16-4

16.2 Sleeving/Shrink Tubing ....................................... 16-6

16.3 Spiral Plastic Wrap (Spiral Wrap Sleeving) ...... 16-7

16.4 Conduit (Containment Loom) ............................. 16-8

16.5 Tapes, Adhesive and Nonadhesive ................... 16-9

17 Finished Assembly Installation ............................. 17-1

17.1 General ................................................................... 17-2

17.2 Hardware Installation .......................................... 17-3

17.2.1 Threaded Fasteners ......................................... 17-317.2.2 Minimum Torque for Electrical Connections ..... 17-617.2.3 Wires ................................................................ 17-717.2.4 High Voltage Applications ............................... 17-10

17.3 Wire/Harness Installation ................................. 17-11

17.3.1 Stress Relief ................................................... 17-1117.3.2 Wire Dress ...................................................... 17-1217.3.3 Service Loops ................................................ 17-13

18 Solderless Wrap ....................................................... 18-1

18.1 Number of Turns ................................................... 18-2

18.2 Turn Spacing ......................................................... 18-3

18.3 End Tails, Insulation Wrap .................................. 18-4


viii IPC/WHMA-A-620AJuly 2006

18.4 Raised Turns Overlap .......................................... 18-6

18.5 Connection Position ............................................. 18-7

18.6 Wire Dress ............................................................. 18-9

18.7 Wire Slack ............................................................ 18-10

18.8 Plating ................................................................... 18-11

18.9 Damage ................................................................ 18-12

18.9.1 Insulation ........................................................ 18-1218.9.2 Wires and Terminals ....................................... 18-13

19 Testing ....................................................................... 19-1

19.1 Nondestructive Tests ........................................... 19-2

19.2 Testing After Rework or Repair ......................... 19-2

19.3 Intended Table Usage .......................................... 19-2

19.4 Electrical Test ....................................................... 19-3

19.4.1 Selection ......................................................... 19-3

19.5 Electrical Test Methods ...................................... 19-4

19.5.1 Continuity ......................................................... 19-419.5.2 Shorts .............................................................. 19-519.5.3 Dielectric Withstanding Voltage (DWV) ............. 19-619.5.4 Insulation Resistance (IR) .................................. 19-719.5.5 Voltage Standing Wave Ratio (VSWR) .............. 19-819.5.6 Insertion Loss ................................................... 19-819.5.7 Reflection Coefficient ........................................ 19-919.5.8 User Defined .................................................... 19-9

19.6 Mechanical Tests ............................................... 19-10

19.6.1 Selection ....................................................... 19-10

19.7 Mechanical Test Methods ................................ 19-11

19.7.1 Crimp Height (Dimensional Analysis) ............. 19-1119.7.1.1 Terminal Positioning ...................................... 19-1219.7.2 Pull Force (Tensile) ........................................ 19-1319.7.2.1 Without Documented Process Control .......... 19-1419.7.3 Crimp Force Monitoring ................................ 19-1619.7.4 Crimp Tool Qualification ................................ 19-1619.7.5 Contact Retention Verification ....................... 19-1619.7.6 Coaxial Shield Pull Force (Tensile) ................. 19-1719.7.7 RF Connector Shield Ferrule Torsion ............ 19-1819.7.8 User Defined ................................................. 19-18

Appendix A Terms and Definitions .............................. A-1

Appendix B Metric Conversion Table .......................... B-1

Appendix C Reproducible Test Tables ....................... C-1

Standard Improvement Form


ixIPC/WHMA-A-620A July 2006


x IPC/WHMA-A-620AJuly 2006

If a conflict occurs between the Englishand translated versions of this document,the English version will take precedence.

1.1 Scope This standard is a collection of visual, electricaland mechanical quality acceptability requirements for Cable,Wire and Harness Assemblies. It was prepared by the Indus-try Technical Guidelines Committee of the Wire HarnessManufacturers Association and the Product Assurance Com-mittee of IPC - Association Connecting Electronic Industries.IPC/WHMA-A-620 can be used as a stand-alone documentfor purchasing products; however it does not specify fre-quency of in-process inspection or frequency of end productinspection. No limit is placed on the number of process indi-cators or the number of allowable repair/rework of defects.Such information should be developed with a statistical pro-cess control plan (see IPC-9191).

1.2 Purpose This publication describes tests and accept-ability criteria for producing crimped, mechanically secured, orsoldered interconnections and the associated lacing/restraining criteria associated with cable and harness assem-blies. Any method that produces an assembly conforming tothe acceptability requirements described in this standard maybe used.

1.3 Approach to This Document The illustrations in thisdocument portray specific points noted in the title of eachsection. A brief description follows each illustration. The devel-opment committee recognizes that different parts of theindustry have different definitions for some terms used herein.For the purposes of this document, the terms cable and wireharness are used interchangeably.

Class 3 shall1 develop and implement a documented processcontrol system. A documented process control system, ifestablished, shall2 define process control and correctiveaction limits. This may or may not be a statistical processcontrol system. The use of statistical process control(SPC) is optional and should be based on factors suchas design stability, lot size, production quantities, and theneeds of the company.

Process control methodologies shall2be used in the planning, implementationand evaluation of the manufacturingprocesses used to produce cables andwire harness assemblies. The philoso-phy, implementation strategies, toolsand techniques may be applied in differ-

ent sequences depending on the specific company, opera-tion, or variable under consideration to relate process controland capability to end product requirements.

1.4 Shall or Should The word shall is used in the textof this document wherever a requirement is mandatory.

Where the word shall leads to a hardware defect for atleast one class, the requirements for each class are annotatedin text boxes located adjacent to that occurrence in the text.When this standard doesnt provide acceptance criteria for aspecific class, the text box will note Not Est for that class(see 1.5).

The word should reflects recommendations and is used toreflect general industry practices and procedures for guidanceonly.

1.5 Uncommon or Specialized Designs IPC/WHMA-A-620, as an industry consensus document, cannot address allof the possible product design combinations. However, thestandard does provide criteria for commonly used technolo-gies. Where uncommon or specialized technologies are used,it may be necessary to develop unique acceptance criteria.The development of unique criteria should include userinvolvement or consent and the criteria developed shouldinclude an agreed upon definition for acceptance of eachcharacteristic.

Whenever possible, new criteria or criteria on specializedproducts should be submitted, using the Standard Improve-ment Form included in this standard, to the IPC TechnicalCommittee to be considered for inclusion in upcoming revi-sions of this standard.

1.6 Terms and Definitions Terms are consistent with thedefinitions provided by IPC-T-50. For the understanding ofthis document, selected definitions pertaining specifically tocable and wire harness manufacturing are listed below and inAppendix A.

Manufacturer (Assembler) The individual, organization, orcompany responsible for the assembly process and verifica-tion operations necessary to ensure full compliance of assem-blies to this standard.

Objective Evidence Documentation in the form of hardcopy, computer data, video, or other media.

Process Control A system or method to continually steer anoperation in reducing variation in the processes or products tomeet or exceed the goal in quality and performance.

Supplier The individual, organization or company which pro-vides to the manufacturer (assembler) components (cables,

(1) Class 1-Not EstClass 2-Not EstClass 3-Defect

(2) Class 1-Not EstClass 2-DefectClass 3-Defect

1 Requirements and Acceptance for Cable and Wire Harness Assemblies

Foreword

1-1IPC/WHMA-A-620A July 2006

wire harnesses, electronic, electromechanical, mechanical,printed boards, etc.) and/or materials (solder, flux, cleaningagents, etc.).

User The individual, organization, company, contractuallydesignated authority or agency responsible for the procure-ment of electrical/electronic hardware, cables and wire har-nesses, etc. and having the authority to define the class ofproduct and any variation or restrictions to the requirements ofthis standard (i.e., the originator/custodian of the contractdetailing these requirements).

Wire Diameter (D) In this document, the outside diameterof the wire, including insulation if present.

1.7 Classes of Product Use of this standard requiresagreement on the class to which the product belongs. If theuser and manufacturer do not establish and document theacceptance class, the manufacturer may do so. Thus, acceptand/or reject decisions must be based on applicable docu-mentation such as contracts, drawings, specifications, stan-dards and reference documents. Criteria defined in this stan-dard reflect three Product Classes, which are as follows:

Class 1 General Electronic Products

Includes products suitable for applications where the majorrequirement is the function of the completed assembly.

Class 2 Dedicated Service Electronic Products

Includes products where continued performance andextended life is required, and for which uninterrupted serviceis desired but not critical. Typically, the end-use environmentwould not cause failures.

Class 3 High Performance Electronic Products

Includes products where continued performance orperformance-on-demand is critical, equipment downtime can-not be tolerated, end-use environment may be uncommonlyharsh, and the equipment must function when required, suchas life support systems and other critical systems.

1.8 Document Hierarchy In the event of conflict, the fol-lowing order of precedence applies:

1. Procurement as agreed between user and manufacturer.2. Master drawing or master assembly drawing reflecting the

users detailed requirements.3. When invoked by the user or per contractual agreement,

IPC/WHMA-A-620.4. Other documents to extent specified by the user.

The developing committee recognizes that some require-ments in IPC/WHMA-A-620 may differ from those in otherindustry standards such as IPC-A-610 and J-STD-001. When

IPC/WHMA-A-620 is cited or required by contract as a stand-alone document for inspection and/or acceptance, therequirements of J-STD-001 Requirements for Soldered Elec-trical and Electronic Assemblies or IPC-A-610 Acceptability ofElectronic Assemblies do not apply unless separately andspecifically required. When IPC/WHMA-A-620, J-STD-001,IPC-A-610 and/or other related documents are cited, theorder of precedence is to be defined in the procurementdocuments.

The user (customer) has the opportunity to specify alternateacceptance criteria.

1.9 Tool and Equipment Control

Each manufacturer shall1:

a. Select tools to be used for crimping, cabling, wiring, mea-suring, inspecting and in work preparation areas appropri-ate to the intended function.

b. Clean and properly maintain all tools and equipment.c. Examine all elements of tools for physical damage.d. Prohibit unauthorized, defective, or uncalibrated tools in

the work area.e. Document detailed operating procedures and maintenance

schedules for tools and equipment requiring calibration orset-ups.

f. Maintain records of tool and equipment calibration andfunctional testing.

g. Assure test fixtures, test adapters, and test equipment aremaintained to assure the integrity of the test.

h. Assure process tooling and process equipment are main-tained to assure acceptability of the product.

The manufacturer shall1 have a docu-mented calibration system in accor-dance with ANSI/NCSL Z540-1 or otherNational or International standard. Theminimum standard shall1 be:

a. Measurement standards used for calibrating tools aretraceable to National Institute of Standards and Technol-ogy (NIST) or other National or International standard. Cali-bration of tools is performed in an environment compatiblewith the environmental requirements of the tools.

b. Calibration intervals are based on the type of tool andrecords of the tools calibration. Intervals may be length-ened or shortened on the basis of stability demonstratedover previous calibration periods.

c. Procedures are generated and utilized for the calibration ofall tooling stated herein. Procedures include, as a mini-mum, standards to be used, parameters to be measured,accuracy, tolerances, environmental factors, and steps inthe calibration process. The procedures may be the sup-pliers specifications if judged adequate, and need nottherefore be rewritten, but are documented.

(1) Class 1-DefectClass 2-DefectClass 3-Defect


Foreword (cont.)

1-2 IPC/WHMA-A-620AJuly 2006

d. Records are maintained that document calibration.e. Tools are labeled to indicate, as a minimum:

(1) Date of calibration.(2) Calibration due date.(3) Any limitation of use. If not practical to place the label

directly on the tool, then the label is affixed to the toolcontainer or other location as documented in the pro-cedures.

(4) Tool identification.

1.10 Observable Criteria The acceptance criteria of thisstandard are based on visual inspection of the assemblies.Visual inspection may be supplemented by the measurementof characteristics appropriate to the product being assembled(e.g., go/no-go gauges, pull force measurements, torquemeasurement).

Many of the examples (figures) shown are grossly exagger-ated to clearly depict the condition being described.

In the case of a discrepancy, the written description orwritten criteria always takes precedence over the illus-trations.

1.11 Defects and Process Indicators Characteristics orconditions that do not conform to the requirements of thisstandard that are detectable by inspection or analysis areclassified as either defects or process indicators. Not all pro-cess indicators are specified by this standard. Process indica-tors should be monitored but the hardware need not be dis-positioned (see 1.12.3).

It is the responsibility of the user to define unique defect cat-egories applicable to the product. It is the responsibility of themanufacturer to identify defects and process indicators thatare unique to the assembly process.

1.12 Inspection Conditions For each section of thisdocument, target, acceptable and defect conditions are listedfor each product class. Where applicable, process indicatorconditions are also listed. The inspector shall not1 select theproduct class for the assembly underinspection. Documentation that speci-fies the applicable class for the assem-bly under inspection shall1 be providedto the inspector. The descriptions ofthese conditions follow.

1.12.1 Target A condition that is close to perfect (in thepast has sometimes been labeled as preferred). It is a desir-able condition, not always achievable, and may not be neces-sary to ensure reliability of the assembly in its service environ-ment.

1.12.2 Acceptable This characteristic indicates a conditionthat, while not necessarily perfect, will maintain the integrityand reliability of the assembly in its service environment.

1.12.3 Process Indicator A process indicator is a condi-tion (not a defect) that identifies a characteristic that does notaffect the form, fit, function or reliability of a product.

Such condition is a result of material, design and/oroperator/machine related causes that create a conditionthat neither fully meets the acceptance criteria nor is adefect.

Process indicators should be monitored as part of the pro-cess control system. If the number of process indicatorsindicates an abnormal variation in the process, identifies anundesirable trend, or displays other conditions that indicatethe process is (or is approaching) outof control, the process shall2 be ana-lyzed. This may result in action toreduce the variation and improveyields.

Disposition of individual process indicators is not requiredand affected product should be used as is.

1.12.4 Defect A defect is a condition that fails to meet theacceptance criteria of this documentand negatively affects the form, fit, func-tion, of the assembly in its end use envi-ronment. The manufacturer shall3document and disposition each defect.

1.12.5 Disposition Disposition is the determination of howdefects should be treated. Dispositions include, but are notlimited to, rework, use as is, scrap orrepair. User concurrence may berequired for use as is or repair dis-positions. Repairs shall4 be conductedin accordance with a documented pro-cedure.

1.12.6 Product Classification Implied Relationships Adefect for a Class 1 product means that the characteristic isalso a defect for Class 2 and 3. A defect for a Class 2 prod-uct means that the characteristic is also a defect for a Class 3product, but may not be a defect for a Class 1 product whereless demanding criteria may apply.

1.12.7 Conditions Not Specified Conditions that are notspecified as defective or as a process indicator are consid-ered acceptable unless it can be established that the condi-tion affects end user defined form, fit, function or reliability.

1.13 Electrical Clearance Electrical clearance spacingbetween conductors should be maximized whenever pos-sible. The minimum spacing between conductors andbetween conductive materials (such as conductive markings






Foreword (cont.)


or mounting hardware) and conductors should be defined onthe applicable drawings or documentation. When mixed volt-ages appear on the same assembly, the specific areas andappropriate clearances should be identified on the drawings.Failure to adhere to this criteria can cause equipment operat-ing problems and, in the case of high voltages or high powerapplications, potential severe damage/fire.

Although minimum electrical clearance distances are normallyfixed by the design/drawing (e.g., minimum spacing betweentwo terminal studs), it is possible to violate the minimum spac-ing by the installation method. For example, improper orienta-tion of an uninsulated terminal lug or an excessively long wirewrap/solder connection pigtail with orientation that places theconnections closer to nonelectrically common conductorscould violate the minimum spacing.

Electrical clearance distance is defined as the shortest point-to-point distance between uninsulated energized parts orbetween an energized part and ground. The minimum electri-cal clearance distance depends on the circuit voltage ratingand the normal volt-ampere rating. In cases where no mini-mum electrical clearance value is otherwise defined, the crite-ria in Table 1-1 may be used as a guideline.

1.14 Measurement Units and Applications All dimen-sions and tolerances as well as other forms of measurement(temperature, weight, force, etc.) in this standard areexpressed in SI (System International) units (with ImperialEnglish equivalent dimensions provided in brackets). Dimen-sions and tolerances use millimeters as the main form ofdimensional expression; micrometers are used when the pre-cision required makes millimeters too cumbersome. Celsius isused to express temperature. Weight is expressed in grams.Hard measurements are used for both SI and Imperial

English. Rounding may cause variations between the twoactual measurements. The order of precedence (SI or Impe-rial) is to be defined in the procurement documents.

1.15 Verification of Dimensions For the purposes ofdetermining conformance to this specification, all specifiedlimits in this standard are absolute limits as defined in ASTME29.

1.16 Visual Inspection

1.16.1 Lighting Illumination at the surface of workstationsshould be 1000 lm/m2 minimum. 1,000 lm/m2 at the worksurface is the accepted practice for the minimum level of illu-mination in which operators and inspectors should beexpected to perform their tasks. 1,000 lm/m2 is approximatelyequivalent to 100 foot-candles measured using a photo-graphic light meter.

1.16.2 Magnification Aids andLighting When required, magnifica-tion power for assembly inspectionshall1 be at least the minimum inspec-tion power specified in Table 1-2. Othermagnification powers within the inspection range may beused. The magnification power requirement is based on thegauge of the wire being inspected. For assemblies with mixedwire sizes, the greater magnification may be used for theentire assembly. If the presence of a defect cannot be deter-mined at the inspection power, the item is acceptable. Thereferee magnification power is intended for use only after adefect has been determined but is not completely identifiableat the inspection power.

The tolerance for magnification aids is 15% of the selectedmagnification power. Magnification aids should be maintainedand calibrated as appropriate (see IPC-OI-645). Supplementallighting may be necessary to assist in visual assessment.

Table 1-1 Electrical ClearanceVoltage Set* Clearance

Up to 64ABC

1.6 mm [0.062 in]3.2 mm [0.125 in]3.2 mm [0.125 in]

Over 64-600ABC

1.6 mm [0.062 in]3.2 mm [0.125 in]6.4 mm [0.25 in]

Over 600-1000ABC

3.2 mm [0.125 in]6.4 mm [0.25 in]12.7 mm [0.5 in]

Over 1000-3000 C 50 mm [2 in]

Over 3000-5000 C 75 mm [3 in]*Set A = Normal operating volt-ampere rating up to 50.*Set B = Normal operating volt-ampere rating of 50 to 2000.*Set C = Normal operating volt-ampere rating over 2000.

(1) Class 1-AcceptClass 2-Proc IndClass 3-Defect

Table 1-2 Magnification Aids1

Wire Size AWGDiameter mm [in]

Magnification PowerInspection

RangeMaximumReferee

larger than 14 AWG2 mm [0.081 in]

N/A 1.75X

14 to 22 AWG1.6 - 0.63 mm

[0.064 to 0.025 in]

1.5X - 3X 4X

smaller than 22 AWG

1.17 Electrostatic Discharge (ESD) Protection Assem-blies that contain components or parts sensitive to ESDshall1 be protected in accordance withANSI/ESD-S20.20-1999 or equivalent.

Note: This includes selection and use ofdevices such as connector covers, etc.

1.18 Contamination Assemblies produced in accordancewith this Standard shall2 be free of all extraneous matter(including but not limited to: wire clip-pings, insulation slugs, strands of shield-ing braid or any other item not requiredto be present). See 4.2 for cleanlinesscriteria specific to soldered assemblies.

1.19 Materials and Processes The materials and pro-cesses used to assemble/manufacture cable and wire har-ness assemblies shall3 be selected such that their combina-tions produce products acceptable tothis standard. When major elements ofthe proven processes are changed (e.g.,flux, cleaning media or system, solder-ing system, tooling, marking, etc.) vali-dation of the acceptabil ity of thechange(s) shall4 be performed anddocumented.






Foreword (cont.)


IPC-T-50 Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC-CH-65 Guidelines for Cleaning of Printed Boards and Assemblies

IPC-A-610 Acceptability of Electronic Assemblies

IPC-OI-645 Standard for Visual Optical Inspection Aids

IPC-TM-650 Test Methods Manual

IPC-SM-817 General Requirements for Dielectric Surface Mounting Adhesives

IPC-9191 General Guidelines for Implementation of Statistical Process Control (SPC)

J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies

J-STD-002 Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

J-STD-004 Requirements for Soldering Fluxes

J-STD-006 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic SolderingApplications

SAE ARP 1931A Glossary of Terms with Specific Reference to Electrical Wire and Cable

1. www.ipc.org2. www.ipc.org3. www.sae.org

2 Applicable Documents

Applicable Documents


2.1 IPC1

2.3 Society of Automotive Engineers (SAE)3

2.2 Joint Industry Standards2

ANSI/NCSL Z540-1-1994 General Requirements for Calibration Laboratories and Measuring and Test Equipment, 1994

ISO 8815 Aircraft Electrical Cables and Cable Harnesses - Vocabulary

ANSI/ESD-S20.20-1999 ESD Association Standard for the Development of an Electrostatic Discharge Control Program for Pro-tection of Electrical and Electronic Parts, Assemblies and Equipment

4. www.ansi.org5. www.iso.org6. www.esda.org

2 Applicable Documents

2.4 American National Standards Institute (ANSI)4


2.5 International Organization for Standardization (ISO)5

2.6 ESD Association (ESDA)6

This section provides requirements and acceptance criteria forpreparation of wires that will be used in the cable/wire harnessfabrication process.

The following topics are addressed in this section:

3.1 Stripping

3.2 Strand Damage and End Cuts

3.3 Conductor Deformation/Birdcaging

3.4 Twisting of Wires

3.5 Wire Insulation Damage

3 Preparation

Preparation


Wire Insulation may be removed using chemical, thermal or mechanical strippers. Chemical insulation stripping agents shall1: Be used only for solid wires.

Be neutralized or removed prior to tinning or soldering.

Strand damage can lead to degraded performance. The number of damaged (scraped, nicked or severed)strands in a single wire shall not2 exceed the limits of Table 3-1.

Damaged wires that do not exceed the limits specified in Table 3-1 are considered process indicators forClasses 2 & 3.

Note: See 13.1 and 16.1.2 for shield strand damage criteria.

Tools utilized to accomplish wire cuts shall3 be selected and used to provide repetitive and consistent wirecut terminations that meet the following criteria.

The process of wire cutting shall3 be performed such that the cut ends are uniform and all strands are thesame length.




3 Preparation

3.1 Stripping


3.2 Strand Damage and End Cuts

Target - Class 1,2,3

Wire conductor ends are cut perpendicular to the wire lon-gitudinal axis.

All of the strands of the strand group are the same length.

Wires are not scraped, nicked, cut, flattened, scored, orotherwise damaged.

Acceptable - Class 1,2,3

Strand groups cut approximately perpendicular to the wireend.

All of the strands of the strand group are approximately thesame length.

There are attached burrs that will not be dislodged duringprocess or operation.

Acceptable - Class 1Process Indicator - Class 2,3

Strands cut, broken, scraped or severed if the number ofdamaged or broken strands in a single wire does notexceed the limits in Table 3-1.

Figure 3-1

Figure 3-2

3 Preparation

3.2 Strand Damage and End Cuts (cont.)


Defect - Class 1,2,3

Variation in strand length within a strand group that preventsinstallation to the full depth of the crimp contact area.

As an exception to Table 3-1, partial or incomplete cuts ofstrand groups that are in the crimp contact area.

As an exception to Table 3-1, partial cuts of a strand groupthat are in a solder connection area or could prevent contactof the strand group for the full length of the required wraplength.

Damaged strands exceed the limits specified in Table 3-1.

Table 3-1 Allowable Strand Damage1,2

Number ofStrands

Maximum allowablestrands scraped, nickedor severed for Class 1,2

Maximum allowable strandsscraped, nicked or severed forClass 3 for wires that will notbe tinned before installation

Maximum allowable strandsscraped, nicked or severed forClass 3 for wires that will be

tinned prior to installationLess than 7 0 0 0

7-15 1 0 1

16-25 3 0 2

26-40 4 3 3

41-60 5 4 4

61-120 6 5 5

121 or more 6% 5% 5%Note 1: No damaged strands for wires used at a potential for 6 kV or greater.Note 2: For plated wires, a visual anomaly that does not expose basis metal is not considered to be strand damage.

Figure 3-3

3 Preparation

3.2 Strand Damage and End Cuts (cont.)


Disturbed wire strands should be restored to approximate their original lay.


Strands are not flattened, untwisted, buckled, kinked or oth-erwise deformed.

Original lay of strands is not disturbed.


Wire strands have separation (birdcaging, shown by arrow)but it does not exceed 1 strand diameter and does notextend beyond wire insulation outside diameter.

Where strands were straightened during the wire insulationremoval, they have been restored to approximate the origi-nal spiral lay of the wire.

Wire strands are not kinked.

Figure 3-4

Figure 3-5

3 Preparation

3.3 Conductor Deformation/Birdcaging


Acceptable - Class 1Process Indicator - Class 2Defect - Class 3

Wire strands have separation exceeding 1 strand diameterbut do not extend beyond wire insulation outside diameter.

Acceptable - Class 1Defect - Class 2,3

The general spiral lay of the strands has not beenmaintained.

Acceptable - Class 1Defect - Class 2,3

Wire strands extend beyond wire insulation outsidediameter.


Wire strands are kinked.

Figure 3-6

Figure 3-7

3 Preparation

3.3 Conductor Deformation/Birdcaging (cont.)


These criteria apply to all cable or harness bundles, whether they are twisted pairs of the same wire typeand size, or cables incorporating various wire types and sizes. The length of lay (or twist) as measuredfrom the midpoint of wires crossover through a complete spiral to the next crossover midpoint of the samewire shall1 be 8 to 16 times the outer diameter of the bundle (Figure 3-9).


The length of lay for each twist is 8 to 16 times the outerdiameter of the bundle.


The length of lay for each twist is less than 8 or more than16 times the outer diameter of the bundle.

Figure 3-8

Figure 3-9


3 Preparation

3.4 Twisting of Wires


Coatings added over insulation base material such as resin coatings over polyimide are not considered to be part of the insula-tion and these criteria are not intended to be applicable to those coatings.

These criteria are also applicable to post-assembly acceptance. Additional criteria for insulation damage as a result of solderingoperations are provided in 4.5.2.


Insulation has been trimmed neatly with no signs of pinch-ing, pulling, fraying, discoloration, charring or burning.


A slight, uniform impression in the insulation from the grip-ping of mechanical strippers.

Chemical solutions, paste, and creams used to strip solidwires do not cause degradation to the wire.

Slight discoloration of insulation resulting from thermal pro-cessing is permissible, provided it is not charred, cracked orsplit.

Figure 3-10

Figure 3-11

3 Preparation

3.5 Wire Insulation Damage



Any cuts, breaks, cracks or splits in insulation (not shown).

Insulation thickness is reduced by more than 20% (Figures3-12, 3-13).

Uneven or ragged pieces of insulation (frays, tails, and tags)are greater than 50% of the insulation outside diameter or1 mm [0.039 in] whichever is more (Figure 3-14).

Insulation is charred (Figure 3-15).

Figure 3-12

Figure 3-13

Figure 3-14

Figure 3-15

3 Preparation

3.5 Wire Insulation Damage (cont.)



3 Preparation


Soldered terminations can be used in cable/harness assemblyand for that reason may merit special consideration.

Criteria for forming soldered splices are provided in Section 8.

Criteria for heat shrinkable solder sleeves are provided in Sec-tions 8 (Splices) and 15 (Shield Terminations).

The following topics are addressed in this section:

4.1 Material, Components and Equipment

4.1.1 Materials4.1.1.1 Solder4.1.1.2 Flux4.1.1.3 Adhesives4.1.1.4 Solderability4.1.1.5 Tools and Equipment4.1.2 Gold Removal

4.2 Cleanliness

4.2.1 Presoldering4.2.2 Postsoldering4.2.2.1 Particulate Matter4.2.2.2 Flux Residue4.2.2.2.1 Cleanable Flux4.2.2.2.2 No-Clean Process

4.3 Solder Connection

4.3.1 General Requirements4.3.2 Soldering Anomalies4.3.2.1 Exposed Basis Metal4.3.2.2 Exposed Surface Finishes4.3.2.3 Partially Visible or Hidden Solder Connections

4.4 Wire/Lead Preparation, Tinning

4.5 Wire Insulation

4.5.1 Clearance4.5.2 Postsolder Damage

4.6 Insulation Sleeving

4.7 Birdcaged Wire (Soldered)

4.8 Connection Requirements

4.8.1 Turret Terminals4.8.2 Bifurcated Terminals4.8.2.1 Side Route Attachments4.8.2.2 Bottom and Top Route Attachments4.8.2.3 Staked Wires4.8.3 Slotted Terminals4.8.4 Pierced/Perforated/Punched Terminals4.8.5 Hook Terminals4.8.6 Cup Terminals4.8.7 Series Connected Terminals4.8.8 Lead/Wire Placement - AWG 30 and Smaller

Diameter Wires


4.9.1 Turret Terminals4.9.2 Bifurcated Terminals4.9.3 Slotted Terminals4.9.4 Pierced/Perforated Terminals4.9.5 Hook Terminals4.9.6 Cup Terminals

4 Soldered Terminations

Soldered Terminations


The materials and processes used to assemble/manufacture cable and wire harness assemblies shall1 beselected such that their use, in combination, produce products acceptable to this standard.

When major elements of the proven processes are changed, (e.g., flux, cleaning media or system, solderalloy or soldering system) validation of the acceptability of the change(s) shall2 be performed anddocumented.

Solder alloys shall3 be in accordance with J-STD-006 or equivalent. Solder alloys other than Sn60A, Pb36B, and Sn63A whichprovide the required electrical and mechanical attributes may be used if all other conditions of this standard are met and objec-tive evidence of such is available for review. Flux that is part of flux-cored solder wire shall3 meet therequirements of 4.1.1.2. Flux percentage is optional.

Solder alloys less than 0.1% lead by weight not listed by J-STD-006 may be used when such use is agreedupon by the manufacturer and the user.

Flux shall4 be in accordance with J-STD-004 or equivalent. Flux shall5 conform to flux activity levels L0 and L1 of flux materialsrosin (RO), resin (RE), or organic (OR), except organic flux activity level L1 shall not5 be used for no-clean soldering. When otheractivity levels or flux materials are used, data demonstrating compatibility shall5 be available for review.

Note: Flux or soldering process combinations previously tested or qualified in accordance with other speci-fications do not require additional testing. Type H or M fluxes shall not4 be used for tinning of strandedwires.

When an external flux is used in conjunction with flux cored solders, the fluxes shall4 be compatible.







4.1 Material, Components and Equipment


4.1.1 Material, Components and Equipment Materials

4.1.1.2 Material, Components and Equipment Materials Flux

4.1.1.1 Material, Components and Equipment Materials Solder

Electrically nonconductive adhesive materials used for attachment of components should conform to anacceptable document or standard, e.g., IPC-SM-817, or as otherwise specified. The adhesives selectedshall not1 be detrimental to the component or assembly they are used on. The material shall1 be cured.

Electronic/mechanical components (including terminals) and wires to be soldered shall2 meet the solderability requirements ofJ-STD-002 or equivalent. When a solderability inspection operation or pretinning and inspection operation is performed as part ofthe documented assembly process, that operation may be used in lieu of solderability testing.

The manufacturer should establish procedures to minimize part solderability degradation.

A wire or terminal not conforming to the solderability requirements may be reworked (e.g., by dipping in hotsolder) before soldering.

Tools and equipment used shall3 be selected and maintained such that no damage or degradation thatwould be detrimental to the designed function of parts or assemblies results from their use.

Gold shall4 be removed from the surface to be soldered when the thickness of gold exceeds 2.5 m [0.0001 in].

A double tinning process or dynamic solder wave may be used for gold removal.

These requirements may be eliminated if there is documented objective evidence available for review thatthere are no gold related solder embrittlement problems associated with the soldering process being used.




(4) Class 1-Not EstClass 2-Proc IndClass 3-Defect


4.1.1.3 Material, Components andEquipment Materials Adhesives


4.1.1.4 Material, Components andEquipment Materials Solderability

4.1.2 Material, Components and Equipment Gold Removal

4.1.1.5 Material, Components andEquipment Materials Tools and Equipment

The assembly should be clean of any matter that will inhibit compliance to the requirements of this standard.

Solder connections produced using processes and materials that are required to be cleaned, e.g., rosin/resin fluxes, shall1 becleaned in a manner that assures removal of residual flux and activators. Flux residue can degrade product performance over timebased upon environmental conditions. Methods and materials that are used to clean soldered assembliesshall1 be compatible with the product and assembly materials so that the cleaning process does notadversely affect performance characteristics.

Solder connections produced using no-clean processes need only be cleaned when required.


No visible particulate matter.


Dirt and particulate matter on assembly, e.g., solder splatter,solder balls, dirt, lint, dross, metallic particles, etc.



4.2 Cleanliness


4.2.1 Cleanliness Presoldering

4.2.2.1 Cleanliness Postsoldering Particulate Matter

4.2.2 Cleanliness Postsoldering


No visible flux residue.


Visible flux residue.

Flux residue may be present if it is flux residue that is not intended to be cleaned. (No illustrations.)

Acceptable - Class 1Process Indicator - Class 2,3

Flux residue does not inhibit visual inspection.

Flux residue does not inhibit access to test points of theassembly.


Wet, tacky, or excessive flux residues that may spread ontoother surfaces.

No-clean flux residue on any electrical mating surface.


4.2.2.2 Cleanliness Postsoldering Flux Residue


4.2.2.2.1 Cleanliness Postsoldering Flux Residue Cleanable Flux

4.2.2.2.2 Cleanliness Postsoldering Flux Residue No-Clean Process

These connection criteria apply regardless of which methods of soldering have been utilized.

There are specialized soldering finishes, (e.g., immersion tin, palladium, gold, etc.) that require the creation of special acceptancecriteria other than as stated in this document. The criteria should be based on design, process capability and performancerequirements.

Wetting cannot always be judged by surface appearance. The wide range of solder alloys in use may exhibit from low or near zerodegree contact angles to nearly 90 contact angles as typical. The acceptable solder connection must indicate evidence of wet-ting and adherence where the solder blends to the soldered surface.

The solder connection wetting angle (solder to lead and solder to terminal) is not to exceed 90 (Figure 4-1, A, B). As an excep-tion, the solder connection to a termination may exhibit a wetting angle exceeding 90 (Figure 4-1, C, D) when it is created by thesolder contour extending over the edge of the solderable termination area.

The primary difference between the solder connections created with processes using tin-lead alloys and processes using lead freealloys is related to the visual appearance of the solder. This standard provides visual criteria for inspection of both tin-lead andlead-free connections. Figures specific to lead-free connections will be identified with the symbol:

Acceptable lead free and tin-lead connections may exhibit similar appearances but lead free alloys are more likely to have:

Surface roughness (grainy or dull).

Greater wetting contact angles.

All other solder fillet criteria are the same.

Typical tin-lead connections have from a shiny to a satin luster, generally smooth appearance and exhibit wetting as exemplifiedby a concave meniscus between the objects being soldered. High temperature solders may have a dull appearance. Touch-up(rework) of soldered connections is performed with discretion to avoid causing additional problems, and to produce results thatexhibit the acceptability criteria of the applicable class.

Undesirable wetting conditions are typically nonwetting and dewetting.

Nonwetting is characterized as partial adherence of solder to a surface that it has contacted and basis metal remains exposed.Dewetting is a condition where molten solder coats a surface and then recedes to leave irregularly shaped mounds of solder onthe surface that are separated by areas covered with a thin film of solder and without leaving basis metal exposed.

Some solders may have a dull appearance (e.g., high temperature, some lead free alloys). These should not be considered defec-tive based upon their surface appearance.

Rework (touch-up) of soldered connection defects should only be performed if required by disposition (see 1.12.5).

90 90

q

q

q

>90

q

A B C D

Figure 4-1




The following general requirements are applicable to all terminals unless there is a specific requirement for a given terminal, e.g.,4.9.4.


Solder fillet appears generally smooth and exhibits goodwetting of the solder to the parts/wires being joined.

Outline of the part/wire is discernible.

Solder at the part/wire being joined has a feathered edge.

Fillet is concave in shape.


The acceptable solder connection indicates evidence ofwetting and adherence when the solder blends to the sol-dered surface, forming a contact angle of 90 or less,except when the quantity of solder results in a contourwhich is limited by the edge of the attached surfaces.

Solder wicking allows the wire to remain flexible in requiredareas.


Solder has not wetted to the termination where solder isrequired (nonwetting, dewetting).

Solder coverage does not meet requirements for the termi-nation type.

Nonsoldered.

Disturbed solder.

Cold solder.

Overheated solder.

Fractured.

Insufficient.

Inclusions (foreign material).

Solder that violates minimum electrical clearance (e.g.,bridges, solder splashes, solder balls, solder peaks).

Lead or wire extensions that violate minimum electricalclearance.

Contaminated solder connections (e.g., flux residues aftercleaning).

Solder wicking inhibits required flexibility where required.

Figure 4-2


4.3.1 Solder Connection General Requirements


Exposed basis metal is acceptable on wire or lead ends.

Exposed surface finish on wires, leads or terminals is acceptable provided it is not part of the required fillet area.

Partially visible or hidden solder connections are acceptable provided that the following conditions are met:

a. The design does not restrict solder flow to any connection element.b. The visible portion, if any, of the connection is acceptable.c. Process controls are maintained in a manner assuring repeatability of assembly techniques.


4.3.2 Solder Connection Soldering Anomalies


4.3.2.1 Solder Connection SolderingAnomalies Exposed Basis Metal

4.3.2.3 Solder Connection Soldering Anomalies Partially Visible or Hidden Solder Connections

4.3.2.2 Solder Connection SolderingAnomalies Exposed Surface Finishes

In this document, the term pretinning and tinning have the same meaning, as defined in IPC-T-50: The application of molten sol-der to a basis metal in order to increase its solderability.

Tinning is primarily performed to assure that the wire/lead to be soldered has a uniform and readily solderable surface. Tinning ofstranded wire has the added benefit of bonding the individual wire strands together, thereby allowing the wire to be formed toterminals or attachment points without separation of the individual strands. Limited solder wicking during tinning or soldering ofwire is permissible as long as the solder does not extend to a portion of the wire that is required to remain flexible.

Stranded wires shall1 be tinned when: Wires will be formed for attachment to solder terminals.

Wires will be formed into splices (other than mesh) and optional when heat shrinkablesolder devices are used.

Stranded wires shall not2 be tinned when: Wires will be used in crimp terminations.

Wires will be used in threaded fasteners.

Wires will be used in forming mesh splices.

The following criteria are applicable if tinning is required:


Stranded wire is uniformly coated with a thin coat of solderwith the individual strands of the wire easily visible.

Untinned length of strands from end of wire insulation is notgreater than 1 wire diameter (D).


The solder wets the tinned portion of the wire and pen-etrates to the inner strands of stranded wire.

Solder wicks up wire provided the solder does not extend toa portion of the wire that is required to remain flexible.

The tinning leaves a smooth coating of solder and the out-line of the strands are discernible.

Process Indicator - Class 2,3

Strands are not discernible but excess solder does notaffect form, fit or function.

Solder does not penetrate to the inner strands of the wire.

Figure 4-3




4.4 Wire/Lead Preparation, Tinning



Tinned wire pinholes, voids, dewetting/nonwetting exceed-ing 5% of the area required to be tinned.

Length of untinned strands from end of wire insulation isgreater than 1 wire diameter (D).

Note: J-STD-002 Solderability Tests for Component Leads,Terminations, Lugs, Terminals and Wires provides additionalinformation for assessing this requirement.


Strands are not discernible.

Defect - Class 2,3

Solder does not wet the tinned portion of the wire.

Stranded wire is not tinned prior to attachment to terminalsor forming splices (other than mesh).


Solder build-up or icicles within the usable wire area thataffect subsequent assembly steps.

Heavy tinning interferes with form, fit or function.

Solder wicking extends into the portion of wire that isrequired to remain flexible after soldering.

Figure 4-4

Figure 4-5


4.4 Wire/Lead Preparation, Tinning (cont.)



There is an insulation clearance (C) of 1 wire diameter (D)between the end of the wire insulation and the top of thesolder fillet.


The insulation clearance (C) is 2 wire diameters or lessincluding insulation or 1.5 mm [0.060 in] (whichever isgreater).

Insulation clearance (C) does not permit violation of mini-mum electrical clearance to adjacent conductors.

The wire insulation is in contact with the solder but does notinterfere with formation of an acceptable connection.

Figure 4-6

Figure 4-7

Figure 4-8


4.5 Wire Insulation


4.5.1 Wire Insulation Clearance

Acceptable - Class 1

Exposed bare wire providing there is no danger of violatingminimum electrical clearance to adjacent circuitry when thewire is moved.


The insulation clearance is greater than 2 wire diameters or1.5 mm [0.060 in], whichever is greater, but does not permitshorting to adjacent conductor.


The clearance between the end of the insulation and theconnection violates minimum electrical clearance betweennoncommon conductors.

Insulation interferes with formation of the solder connection.Figure 4-9


4.5.1 Wire Insulation Clearance (cont.)



Insulation is not melted, charred or otherwise damaged.


Slight melting of insulation.


Insulation charred.

Figure 4-10

Figure 4-11

Figure 4-12


4.5.2 Wire Insulation Postsolder Damage


Cleaning, if required, shall1 be accomplished prior to shrinking of the sleeving.

Heating processes used to shrink sleeve insulation shall not1 damage the connector, wire, sleeving, adja-cent components, nor reflow the solder connection.


Insulation sleeving overlaps the connector terminal andextends over the wire insulation 4 wire diameters (D).

Insulation sleeving is 1 wire diameter (D) from the pointwhere the connector terminal enters the connector insert (1).


Insulation sleeving overlaps the connector terminal and thewire insulation by a minimum of 2 wire diameters.

Insulation sleeving is more than 50% wire diameter and notmore than 2 wire diameters from the point where the con-nector terminal enters the connector insert.

Figure 4-13

Figure 4-14



4.6 Insulation Sleeving


Defect - Class 2,3

Insulation sleeving is damaged, i.e., split (A), charred (notshown).

Insulation sleeving overlaps the wire insulation by less than2 wire diameters (B).

Insulation sleeving is more than 2 wire diameters from thepoint where the connector terminal enters the connectorinsert (C).

Insulation sleeve is loose on the terminal (could slide orvibrate off, exposing more than the allowed amount of con-ductor or terminal) (D).

Insulation sleeving prevents movement of floating contact inthe insert, when movement is required.


Required sleeving is missing.

Figure 4-15


4.6 Insulation Sleeving (cont.)



No birdcaging.


Wire strands have separation (birdcaging) (see Figure 4-17)but it does not exceed 1 strand diameter and does notextend beyond wire insulation outside diameter.


Wire strands have separation exceeding 1 strand diameterbut do not extend beyond wire insulation outside diameter.

Defect - Class 2,3

Wire strands are birdcaged beyond wire insulation outsidediameter.

Figure 4-16

Figure 4-17


4.7 Birdcaged Wire (Soldered)


These criteria apply to both wires and component leads. The preferred wrap conditions achieve a mechanical connection betweenthe lead/wire and the terminal sufficient to assure that the lead/wire does not move during the soldering operation. Typically themechanical connection includes a 180 mechanical wrap to effect mechanical connection.

For Class 2 and 3, attachments should be positioned on the base of the solder terminatio