IPC a 600 Revision E

2005/11/22 PAGE 1Nan Ya PCB

IPC-A-600 Revision EAcceptablility of Printed Boards

Teaching Material

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: IPC-A-600E PCB

()1. IPC-A-600 5

2. 902.1 IPC-600E

2.2 IPC-600E

2.3 IPC-600E

2.3.1

2.3.2

2.3.3

2.3.4

2.3.5

2.3.6

2.3.7

2.3.8

2.3.9

3. 5

4.. 20



IPC(The Institute For Interconnecting And Packaging Electronic Circuits)

IPC-RB-276(IPC-6012)IPC-FC-250MIL-P-55110MIL-P-50884ANSI/J-STD-003..

IPC-A-600 1964IPC-A-600A 1970IPC-A-600B 1974IPC-A-600C 1978IPC-A-600D 1989IPC-A-600E 1995



IPC-A-600 E

1.01.11.21.31.41.51.6

1.71.81.92.03.04.05.0



1.4 Classification

Class 123

Class 1

Class 2

Class 3



1.5 Acceptance Criteria

Target Condition

Acceptable

Nonconforming



1.6 Reference 14

J-STD-003 PCBIPC-T-50 IPC-PC-90 IPC-FC-250 ()IPC-D-275 PCBIPC-RB-276 PCB (IPC-6012)IPC-D-325 PCBIPC-QE/SS-605 PCBIPC-AI-642 PCBIPC-SM-782 IPC-TM-650 PCBIPC-SM-840 PCBMIL-P-50884 PCBMIL P-55110 PCB



1.7 Dimensions And Tolerance

1.8 Terms And Definitions IPC-T-50

1.9 Workmanship



IPC-A-600E Class 2Class 3

Class 2Class 3Class 2Class 3

Cause Code



2.0 Externally Observable Characteristics 2.1 Board Edge

2.1.1 Burrs

79

50%100mil

2.1.2 Nicks

7A



2.1 Board Edge

50%100mil

2.1.3 Haloing

79



2.2 Base Material Surface and Subsurface

Class 2 Class 32.2.1 WeaveExposure

WeaveTexture

3mil 125mil 3

1%

2.2.2 Pits andMicrovoids

1F



2.3 Base Material Surface and Subsurface

5%

2.3.1 Measing/Crazin/

1%

25%

2.3.2 Delamination/

Blister/

141F



2.3 Base Material Surface

5mi

32mil

2.3.3 ForeignInclusions



2.4 Solder Coating and Fused Tin Lead

SMD2.4.1 Nonwetting

73

5%

5%2.4.2 Dewetting

73



2.5 Hole Plated Through General

2.5.1 Nodules/Burrs

2737

Pink Ring

2.5.2 Pink Ring

20



2.5 Holes- Plated Through General

Class 2 5%

Class 2Class 3

2.5.3 Plating VoidCopperPlating

26

Class 2 5%Class 3 5%

Class 2 5%Class 3 5%

2.5.4 Plating VoidFinishedCoating

26



2.6 Hole Unsupported

2.6.1 Haoling



2.7 Printed Contacts

S/M

Class 2 5mil

Class 2 5milClass3

2.7.1 SurfacePlating

6A

2.7.2 Burrs on

Edge- BoardContact

78



2.7 Printed Contacts

3M Tape

2.7.3 Adhesion ofOverplate

68



2.8 Marking

069..

2.8.1 General

62

2.8.1

Class 250%

2.8.2 EtchedMarking

39898A



2.8 Marking

2.8.1

Pad

2.8.3 Screened orInk StampedMarking

63



2.9 Solder Resist

2.9.1 CoverageOverConductors

5556575B5C5E5L5N5O

Pad 5mil

2.9.2 RegistrationLand

545B5N



2.9 Solder Resist

50mil SMD Pitch 2mil 50mil SMD Pitch 1mil

2.9.3 Registrationto Featuresother thanPTH LandsSMD

545B5N

10mil

2.9.4 Blister/

Delamination



2.9 Solder Resist

% 5 0 10 5

3M Tape

5 0

2.9.5 Adhesion(Flaking/Peeling)

585F5P

2.9.6 Skip

Coverage

555C5M



2.9 Solder Resist

2.9.7 Weave/Wrinkles/Ripples

ViaHoles

ViaHoles

ViaHoles

2.9.8 Tenting(ViaHoles)Via Holes

5051



2.9 Solder Resist

Class2

Class3 2.9.9 Soda

Strawing

Class2: 0.4milClass3: 0.7mil

2.9.10 Thickness



2.10 Dimension Characteristics

20% 500mil 10%

2.10.1.1 ConductorWidth

39

20%

2.10.1.2 ConductorSpacing

42




2.10.2 Annual Ring

32

Pad

Calss2 1/4

20%Class 3 2mil

2.10.3 Annual RingSupportHoles

32




Pad Calss2 Class 3 6mil

2.10.4 Annual RingUnsupportHoles

32

Pad Class2 1mil 1/4Class3 2mil

Class2 1mil

Class3 2mil

2.10.5 Annual RingIrregularShapedLands

32




1.5%2.10.6 Flatness

86



3.0 Internally Observable Characteristic3.1 Dielectric Material

3.1

3mil

3mil

3.1.1 LaminateVoid



3.1 Dielectric Material

/ /

3.1.2 RegistrationConductor toHoles

091584

Clearance

3.1.3 ClearanceHolesUnsupport toP/G PlanesClearance

091584




3.1.4 Delamination/Blister

0.1milClass2 1milClass3 0.5mil

3.1.53.1.5.13.1.5.2

EtchbackPositiveNegative




4mil 3.1.6 DielectricMaterialClearanceMetal Planes

Clearance

3.5mil3.1.7 Layer to

LayerSpacing




Thermal Stress

3.1.8 ResinRecession



3.2 Conductive Patterns

()

3.2.1 EtchingCharacteristic




3.2.2 Standard

Print & Etch

3942

3.2.3 ConductorCrackInternal Foil




Class2

Class2,3

3.2.4 ConductorCrackExternal Foil

0.25oz 1.2mil 1oz 1.8mil0.375oz 1.2mil 2oz 3mil

3.2.5 SurfaceConductorThickness

34

0.5oz 1.3mil 3oz 4.2mil

0.375oz 0.32mil 2oz 2.2mil0.5oz 0.5mil 3oz 3.6mil

3.2.6 FoilThickness

05

1oz 1mil 4oz 4.8mil



3.3 Plated Through Holes General

PadClass225% 90Class2,3 1mil

Class3 1milCalss2,325%

3.3.1 Annual RingInternalLayers

3.3.2 Lifted Land




3.3.3 PlatingCrack(Barrel)

3.3.4 PlatingCrack(Coner)




3.3.5 PlatingNodules

2737

3.3.6 CopperPlatingThickness

34




3.3.7 Plating Void

26

3.3.8 SolderCoatingThickness

72




Class 2 4milClass 3 3mil Clearance

Class 2 4milClass 3 3mil Clearance

3.3.9 Wicking

3.3.10 Inter PlaneSeparationVertical

25




3.3.11 Inter PlaneSeparationHorizontal

25



3.4 Plated Through Holes Drill

3.4.1 Burrs

3.4.2 Nailheading

1.5



5.0 Cleanliness Testing

IPC-TM-650 Method 2.3.252.3.261.56mg/cm2 6.4unNacl/sqinAlpha 600SMD



ANSI-J-STD-003

5.1 Solderability Testing

A. Edge Dip Test

SMD

B. Rotary Dip Test

PTH SMD

C. Solder Float Test

PTH SMD

D. Wave Solder Test

PTH SMD



5.1 Solderability Testing

5.1.1 PlatedThroughHole

73


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IPC a 600 Revision E