IoT solutions - Ai-Thinker

I o T s o l u t i o n s

Shenzhen B&T Techno logy Co. , L td

Shenzhen Ai-Thinker Technology Co., Ltd

Timel ine

WiFi module ser ies——Espress i f

ESP8266 series

on-board antenna, full certification

Tmall、Xiaomi Ecological Chain Certification

Standard UART Port, Intelligent Upgrade of Traditional Equipment

External antenna，full certification

DIP package

CP2102&CH340，RGB light+cool and warm

ESP8285 series

on-board antenna，DIP

Ultra small

on-board antenna (ESP8285 2M)

WiFi module ser ies——Espress i f

ESP32-S2 series

with PSRAM，support audio，video，Infra, touch press key，on-board /external antenna

Built-in 32M Flash，on-board /external antenna

ESP32 series

on-board antenna，single core version

With PSRAM，audio，support offline voice

offline audio development board ，single microphone

with camera，face recogition

ESP32 development board ，convenient for test


on-board antenna, full certification

WiFimodule ser ies——Real tek&Al lwinner&Pingtg

Realtek series

PWM，Good RF indicators, strong compatibility


Dual frequency WiFi +BLE low consumption

2.4G WiFi + BLE4.2

Allwinner series

Cold Start Fast connect , Ultra Low Power

Pingtg series

2.4G WiFi+BLE5.0

LoRa module ser ies

Module series

high frequency version，803~930MHz

low frequency version，welding ，SPI interface，spring antenna

low frequency version，external antenna ，SPI interface

low frequency version ，Ai-Thinker private protocol

LoRaWAN/LinkWan module，low frequency version

LoRaWAN /LinkWan module，high frequency verison

gateway series

support WiFi、4G、Ethernet, three ways to access , supporting POE power / DC adapters

high frequency version，803~930MHz

welding / external antenna (IPEX )，low frequency version, can provide spring antenna

high frequency version ，803~930MHz

Bluetooth module ser ies

Telink series：TLSR825X

BLE4.2，SMT/DIP， cool-warm switch

BLE5.0 ,Mesh，SMT/DIP, pin to pin with ESP-01M

pin to pin with ESP-12F

Through hole compatible stamp hole

Gateway series：ESP32

BT gateway+WiFi gatway

Phyplus series：PHY6212

Through hole compatible stamp hole

Compatible board antennas/through holes/stamp holes

DC，Micro USB，RJ45，Reset

Other ser ies module

2.4G series UWB series NB-IoT series Cat.1 series

NF-01-S

NF-03

NF-01-N

NF-02-PE

NF-04

NF-04-MI

NF-02-PA

BU01

NodeMCU-BU01

N92-S

N92-D

N92-SG

Ca-01

Module hardware compat ib i l i ty

LoRa gateway——RG-01

WiFi antenna*1；4G antenna*1；LoRa antenna*3；DC power supply and network interface *1

External interface

POE power supplyDC Adapter12V/1A

Power supply mode

Suitable for 410~525 MHz band communication, support 4G、 Ethernet, WiFi three access modes

Application range

The node module automatically joins the gateway, forms the star network, supports

three working modes to join the gateway

Node module

Outdoor-open environment, the transmission distance up to 3000 meters, support frequency hopping communication,Wake on Radio, CAD

channel detection

Long range transmission

Support for MQTT protocol connection servers, open MQTT protocol interfaces

Transmission Protocol

LoRa module——Ra-06

HDSC MCU+SX1278

Chip configuration

410MHz—525MHz

Communication frequency

Max 20dBm

Transmission power

Folder and Ipex, through hole are

compatible

Antenna

22.8*16*2.2mm

Module size

Can use with private protocol gateway or use alone

Application guidance

LoRaWAN module——Ra07/07H

ASR6501 built-in MCU

Chip configuration

410~525MHz


Max 21dBm

Transmission power

ARM Cortex M0 +core，48MHz basic

frequency

128KB Flash + 16KB SRAM

Integrate MCU

16*16*2.8mm

Module size

Wireless smoke detector , environmental monitoring, intelligent meter reading, intelligent

agriculture, intelligent farming, etc

Application guidance

LoRa module——Ra-01S

SX1268

Chip configuration

410~525MHz


Max 22dBm

Transmission power


compatible

Antenna

16*16*2.8mm

Module size

Wireless smoke detector , environmental monitoring, intelligent meter reading,

intelligent agriculture, intelligent farming, etc

Application

LoRa module——Ra-01SH

SX1262

Chip configuration

803MHz—930MHz


Max 22dBm

Transmission power


compatible

Antenna

16*16*2.8mm

Module size

Wireless smoke detector , environmental monitoring, intelligent meter reading,

intelligent agriculture, intelligent farming, etc

Application

2MB Memory 8285 module ——ESP-01M

ESP8285H16(2MB version)

Chip configuration

802.11 b/g/n ，1T1R，75Mbps@HT20

Communication protocol

UART/GPIO/PWM/ADC/I2C

Interface

on-board antenna

Antenna

18.0*18.0*2.8mm

Module size

support STA/AP/STA+AP

Operating mode

2MB Memory 8285 module——ESP-01F


Chip configuration

802.11 b/g/n ，1T1R，75Mbps@HT20



Interface

stamp hole welding

Antenna

11.0*10.0*2.0mm

Module size


Operating mode

2MB Memory 8285 module——ESP-12S


Chip configuration

802.11 b/g/n ，1T1R，75Mbps@HT20



Interface

on-board antenna

Antenna

24.0*16.0*3.0mm

Module size


Operating mode

ESP32-S

ESP32-D0WD（dual-core version）

Chip configuration

WIFI 802.11 b/g/n ，1T1R，HT40BR+EDR+BLE4.2



Interface

on-board antenna or IPEX

Antenna

25.0*18.0*3.0mm

Module size


Operating mode

ESP32-SL

ESP32-S0WD（single-core version）

Chip configuration




Interface


Antenna

25.0*18.0*3.0mm

Module size


Operating mode

ESP32-A1S

ESP32-D0WD+ES8388

Chip configuration



UART/GPIO/PWM/ADC/I2C/I2S/MIC

Interface


Antenna

31.5*19.0*3.0mm

Module size

8M PSRAM

Memory

ESP-12K

ESP32-S2，basic frequency rise to 240MHz，

320KB RAM，support to add PSRAM

Chip configuration

WIFI 802.11 b/g/n ，1T1R，HT40


UART/GPIO/PWM/SPI/I2C/I2S/LCD

/Camera IR/USB 1.1/ADC/DAC/Touch

sensor/temperature sensor

Interface


Antenna

31.0*17.9*3.0mm

Module size

8M PSRAM

Memory

ESP-12H

ESP32-S2F，basic frequency rise to 240MHz，

320KB RAM

Chip configuration

WIFI 802.11 b/g/n ，1T1R，HT40


UART/GPIO/PWM/SPI/I2C/I2S/LCD /Camera

IR/USB 1.1/ADC/DAC/Touch

sensor/temperature sensor

Interface


Antenna

24*16*3.0mm

Module size

4M Flash

Memory

BW15

RTL8720CF

Chip configuration

802.11 a/b/g/n ，2.4G 1T1R

BLE5.0



Interface


Antenna

24.0*16.0*3.0mm

Module size


Operating mode

BW16

RTL8720DN

Chip configuration

802.11 a/b/g/n ，2.4G/5.8G 1T1R

BLE5.0



Interface


Antenna

24.0*16.0*3.0mm

Module size


Operating mode

XW01

XR808CT0

Chip configuration

802.11 b/g/n ，2.4G 1T1R，75Mbps@HT20



Interface


Antenna

24.0*16.0*3.0mm

Module size


Operating mode

TG-12F

TG-7100C

Chip configuration

802.11 b/g/n ，1T1R，75Mbps@HT20

BLE5.0



Interface


Antenna

24.0*16.0*3.0mm

Module size


Operating mode

NodeMCU-8266（CH340 vers ion）

Distribution Network Mode

Support Android、IOS's Smart Config（APP）

AirKiss（wechat）one-click distribution

Second developmentSupports secondary development, integrates

Windows、Linux development environment

Interfaceprovide UART/PWM/I2C/GPIO interface，

Module interface all lead-out

Product characteristics• CH340 low cost

• add RGB three Color Lamps……

NodeMCU-32（CH340 vers ion）

Upgrade Support for OTA upgrades and remote

firmware upgrades（FOTA）





Product characteristics• CH340 low cost

• Compatible ESP32-S/ESP32-SL and ESP32-A1S packaging

NodeMCU-32-S2

Upgrade Support for OTA upgrades and remote

firmware upgrades（FOTA）





Product characteristics• Extended NodeMCU series style

• Easy for customer development

Bluetooth gateway——ESP32-G

Main ChipESP32

Module characteristicsBT gateway+WiFi gateway

InterfaceLAN，Micro USB，DC，Reset

Product characteristics• support USB(5V)power supply or power

adapter (12V)supply

TB-02

TLSR8250/TLSR8251

Chip configuration

BLE5.0，support Mesh


UART/PWM/GPIO/I2C

Interface

on-board antenna

Antenna

18.0*18.0*2.8mm

Module size

Support Tmall giene

Operating mode

TB-03F

TLSR8250

Chip configuration



UART/PWM/GPIO/I2C

Interface

on-board antenna

Antenna

24.0*16.0*3.0mm

Module size

Ultra Low Power

Design to reserved RTC clocks for ultra-low power sleep mode

Product characteristics

TB-04

TLSR8250

Chip configuration



UART/PWM/GPIO/I2C

Interface

stamp hole welding

Antenna

12.2*13.0*2.3mm

Module size

Ultra Low Power



PB-01

PHY6212

Chip configuration



UART/PWM/GPIO/I2C

Interface

stamp hole welding

Antenna

12.2*13.0*2.3mm

Module size

Ultra Low Power



PB-02

PHY6212

Chip configuration



UART/PWM/GPIO/I2C

Interface

on-board antenna or stamp hole welding

Antenna

12.2*18.6*2.3mm

Module size

Ultra Low Power



BU01

DW1000

Chip configuration

reach to 10cm

Positioning accuracy

SPI/GPIO

Interface

3.5G-6.5G on-board antenna

Antenna

23*13.2*2.7mm

Module size

Indoor positioning, school, prison, mine and other personnel positioning and material

positioning

Application

NodeMCU-BU01

Main chipSTM32F103C8T6

Module characteristicsWith reset key and firmware download key

Interfacestandard micro USB + 2.54mm pin header

provide UART/PWM/I2C/GPIO interface，


Product characteristics• Integrated temperature and humidity sensor

and acceleration sensor, easy to develop

BS01

SI4463

Chip configuration

410-525MHz

Operating frequency

SPI/IO

Interface

stamp hole welding or pin DIP

Antenna

17.3*17.0*2.5mm

Module size

Small size, lower reception sensitivity


Ca-01

UIS8910

Chip configuration

4G All Netcom Module

Operating frequency

Support second development

Develop

Built-in rich network protocols that integrate

multiple industrial standard interfaces and

support multiple drivers and software

capabilities

Protocol

24.0*24.0*2.3mm

Module size

support VOLTE

support SPI LCD

support SPI Camera

support 6*6 Array keyboard


C l o u d D e v e l o p m e n t G r o u p / A r c h i t e c t u r e C a p a b i l i t yMass Equipment Online and Concurrency

100 million+ devices online ,1 million devices concurrent

Multi-point deployment

The nearest control server control is selected according to the location of the home equipment. The response speed <30 ms.

Multi-user centre deployment

According to the APP online countries, select the corresponding user center to meet the customer's data territorial protection needs

Encryption

Encrypt transmission control instructions and control authority verification. Ensure control safety.

Template codeThe firmware and control end template code can be generated by the configuration model, and the product development can be standardized, which greatly reduces the difficulty of product development

Double ends SDKProvides control side SDK, and firmware SDK, and APP source code to facilitate customer expansion of IoT applications and equipment development

Upgrade

Firmware upgrade, differential upgrade and IOT upgrade are supported. Can meet the requirements of large-scale IoT upgrade scenarios

A P P d e v e l o p m e n t t e a m / p r o d u c t a r c h i t e c t u r e c a p a b i l i t y

Flexible Design ConceptBusiness model adopts the concept of dimension, classifies users, equipment, location and other related elements, in addition to the ordinary family model, but also can adapt to hotels, AirBnb and other applications.Hierarchical design structure, HTML5VUE Android/IOS native program, customer only need to relate to the business level of page design, business logic, relatively complex operating system access, security communication, mobile phone equipment access, etc.

Rapid developmentObject model code automatically created

After setting the function, attribute, method, event of the product, the user generates the APP and embedded frame code at the same time, and the user only needs to complete the specific device action and page display to complete the development of the new product and new function.

Constantly enriching reference code

Cooperate with module function, will have corresponding APP reference code

Demand for B customers

Standard version and custom version: standard version program can allow users to change page style, text, pictures and so on without recompiling, and also provide page source code for users to modify their own business logic. Customized versions allow advanced users to fully design and customize their applications without having to spend too much effort on the ground floor.

Cross-platform: a code set to support Android and IOS

Internationalization: third party service providers such as multi-language / docking Google platform / docking GoogleMap etc

Release and Update: Cooperate with users to publish and update their software in the application market - for example, when a new hardware is released; support content updates without using the application market - for example, when a new feature of an existing hardware is unlocked

APP开发组产品架构能力

产品开发

客户现场调研

需求设计

前期沟通

需求文档输出开发进度透明可视

售后服务

产品验收

规范化成果物交付1年质保，工单系统对接梳理完整的需求

Documents

IoT solutions - Ai-Thinker