Introducing DFSR, LGIntroducing DFSR, LG--SS--850L850L

October, 2011

/ Information Technology & Electronic Materials R&D

• Brief History

Introduction of LG Chem

LG Chem is the largest chemical company in Korea, and now extends its chemical expertise further into lithium-ion batteries and information & electronic materials industries.

1947 Founded Lucky Chemical Industrial Corp. 1947 Founded Lucky Chemical Industrial Corp.

Entered into

• Industrial Materials business in 1960s

• Petrochemicals business in 1970s

• Information & Electronic Materials in 1990s

1960~1990s

Corporate Spin-Off

(LG Chem, LG Life Science and LG Household &

Healthcare)

2001

Acquired LG Daesan Petrochemicals Ltd.2006 Acquired LG Daesan Petrochemicals Ltd.2006

Acquired LG Petrochemical Co., Ltd. 2007

Demerged Industrial Materials business (LG Hausys)2009

• 2010 Annual Revenue : US $ 18.1 Bil

• Workforce :16,100 employees (approx.)

Business ProfileBusiness Profile

Batteries for Mobile Applications

Batteries for Vehicle Applications

Batteries for Mobile Applications

Batteries for Vehicle Applications

Batteries

LCD Polarizer

Photosensitive Materials

OLED Materials

Toner, PCB Materials

LCD Polarizer

Photosensitive Materials

OLED Materials

Toner, PCB Materials

IT & Electronic Materials Petrochemicals & Polymers

NCC / Polyolefin

Synthetic Rubbers & Specialty Polymers

PVC

NCC / Polyolefin

Synthetic Rubbers & Specialty Polymers

PVC

Annual revenue :

USD 18.1 Bil74%

18%

8%

Toner, PCB Materials

3D Film Patterned Retarder

Toner, PCB Materials

3D Film Patterned Retarder

PVC

ABS / Engineering Plastics

Acrylates / Plasticizers

PVC

ABS / Engineering Plastics

Acrylates / Plasticizers

2010

Ochang Techno Park

Rechargeable Batteries,Display Materials,

LG Chem HQ (Seoul)

Domestic NetworkDomestic Network

8 Plants and 1 Research Park

ㅍ

Display Materials,Imaging Materials

Cheongju Complex

Electrolyte, PCM,

ICP, DFSR, DAF,Rechargeable Batteries

B

NCC, EO/EG, SM, BD, MTBE, B-1, LDPE, LLDPE, HDPE,PP, Synthetic Rubbers, PVC, VCM

Daesan Complex

Plasticizers

Gimcheon Plant

SAPResearch Park (Daejeon)

Ulsan Plant

Iksan Plant

ABS Compound,Engineering Plastics

Octanol, Butanol, Plasticizers, Acrylic Acids

Yeosu Complex

NCC, SM, LDPE, HDPE, PVC, VCM, ABS, SAN, EPS, Acrylate,OXO-alcohol, NPG, SBS, MBSSB Latex, BPA

Plasticizers

Naju Plant

Global NetworkGlobal Network

Manufacturing Subsidiaries (13) : China (9), Vietnam, India, Poland, USA

Marketing Subsidiaries (6) : China (2), USA, Brazil, Europe, India

Representative Offices (7) : Moscow, Istanbul, Ho Chi Minh City, Bangkok, Jakarta, Singapore, Tokyo

26 Subsidiaries around the world

LG DAGU : PVCLG BOHAI : VCM, EDC, C/A LGCC TJ : EP Comp’d, ABS Comp’dLG BOTIAN : SBS

LGCCI(Holding Company)LGCE BJ : Polarizer

LG YX : ABS, SBL, EP Comp’d

CPI : Li-ion Battery Cell / Pack

LGCE NJ : Polarizer, Battery

Beijing

Tianjin

Ningbo

Michigan

Poland

NanjingNew York

Frankfurt

EP Comp’d

LGCE TP : Polarizer

LGCC GZ : EP Comp’d, ABS Comp’d

LG VINA : DOP

LGPI : PS/EPS

LGCE WR : Polarizer

Polarizer, Battery

Taiwan

Guangzhou

Ho Chi Minh City

Mumbai

Poland New York

São Paulo

Hong Kong

Research Area: IT& Electronics Materials

LCD/

OLED

ApplicationsProducts

Photo Resist

Polarizer StrippersNotebook

OLED

Semiconductor

DisplayMaterials

SemiconductorMaterials

PDP Filter

OLEDMaterials

IC-Package DAF

Monitor

TV

DFSR

PDP

PrinterImagingMaterials

Materials

Color & Black Toner

Why DFSR?Why DFSR?

DFSRLiquid type PSR

Technical Issues:

• Surface Flatness for Chip Mounting

• Warpage Problem of Thin Core

• Registration of Smaller SRO

• SR Plugging of Narrow Pitch Circuit

• Crack Resistance

• Halogen Free, Less Solvent

* PSR: Photosensitive Solder Resist, DFSR: Dry Film type photosensitive Solder Resist

7~8 ㎛ surface roughness < 3 ㎛ surface roughness

Manufacturing ProcessManufacturing Process

Oven Release film lamination

PhotosensitiveCoating materials

Carrier film

Carrier Film (PET)

Photosensitive Film

Release Film (PE)

Width mm 495*

㎛Photosensitive Film ㎛ 15, 20, 25, 30, 35

Carrier Film ㎛ 25

Release Film ㎛ 28

* The film width can be altered on special request

DFSR ProcessDFSR Process

UV ExposureVacuum LaminationPre-bonding

UV

Post Cure DevelopmentPost UV Exposure

UV

UV

UV

LGC DFSR Development ConceptLGC DFSR Development Concept

ResinFormulationTechnology

Toughening Agent

For Crack Damping

Crosslinking Density

Improvement

Technology

Developability Thermal Stability Mechanical Stability Resin Flow ControlInterfacial Adhesion

Control

OR

Bead Mill 3-Roll Mill

FillerDispersionTechnology

Roller

Knife Out

Conditions

SR Thickness : 25 ㎛

SRO Formation & SR PluggingSRO Formation & SR Plugging

Φ80 ㎛ SRO 130㎛ (Mask 130㎛) L/S=44㎛/44㎛ (150mJ/cm2)

DevelopabilityThermal Stability

Mechanical Stability

Resin Flow Control

Interfacial Adhesion Control

Conditions

SR Thickness : 25 ㎛Core Thickness : 0.06tBlind Via Diameter : Φ125 ㎛ Core

Pattern Plugging

Dimple < 1um

< SRT & Flatness>

Photo Patterning & ENIG EvaluationPhoto Patterning & ENIG Evaluation

250 ㎛ 200 ㎛ 150 ㎛ 100 ㎛ 80 ㎛ 60㎛

X 300 X 1000

•Visual Inspection after ENIG : There is no color changing, haloing, & pattern striping

Before ENIG After ENIG

ENIG

TEST

•Adhesion test after ENIG: There is no plucking after tape test

Before ENIG After ENIG TEST

Storage Stability TestStorage Stability Test

0 hr

(Φ 88.9 μm)

6 hr

(Φ 87.3 μm)

12 hr

(Φ 87.9 μm)

24 hr

(Φ 89.3 μm)

36 hr

(Φ 89.7 μm)

48 hr

(Φ 88.5 μm)

SR Flatness Analysis (from Customer Evaluation)SR Flatness Analysis (from Customer Evaluation)

q DFSR thickness: 23㎛- The order of adhesion strength: LG DFSR > A = B = C

Measurement Data & Image [Unit : ㎛]

No. Test Item S/R Data

Average1 2 3

1Pattern

Flatness

LG-S-850L 0.4189 0.2718 0.3436 0.3448

DFSR A 0.5548 0.6912 0.6101 0.6187

LG-S-850L 1.3044 1.1472 1.3708 1.27412

Via hole

Flatness

LG-S-850L 1.3044 1.1472 1.3708 1.2741

DFSR A 1.2173 1.0116 1.0747 1.1012

S/R Pattern Via hole

LG-S-850L

× 1,000DFSR A

SR Contact Angle AnalysisSR Contact Angle Analysis

- Contact angle Measurement and Surface Energy

■ Measurement data [Unit : ˚ ]

No. Test Item S/RData

Average1 2 31 2 3

1 Contact Angle LG-S-850L 64.521 66.013 68.166 66.2

2 Surface Energy LG-S-850L 35.778 35.658 35.849 35.8

■ Measurement Image

S/R 1 2 3

×1,000

LG-S-850L

SR Surface Energy Analysis - upon baking and plasma treatment

Process Condition LG-S-850L DFSR A

Process Code Condition

FumeSurface Energy

Color Change Fume

Surface Energy

Color Change

TOC (ppm)

(Nm/m)(Yes

/No)

TOC (ppm)

(Nm/m)(Yes

/No)

Bake B1 125℃, 60min 5.5 59.2 No 6.9 55.8 No

90

Plasma(Ar) P1Power 300W, Time 120sec,

Gas 200sccm- 62.9 No - 62.8 No

Bake B2 125℃, 120min 11 59.6 No 13 59.1

Plasma(Ar) P2Power 300W, Time 300sec,

Gas 200sccm- 66.6 No - 69.1 No

Plasma(Ar) P3Power 400W, Time 400sec,

Gas 200sccm- 76.4 No - 77.3 No

Bake B3 175℃, 120min 107 67.1 No 76 61.4 No

1. Pasma (Ar): 200 sccm appliedSurface Energy

0

10

20

30

40

50

60

70

80

90

B1 P 1 B2 P 2 P 3 B3

Nm

/m

DFSR A

LG-S-850L2. Fume Analysis: Purge & Trap-GC/MSD

3. Surface Energy Analysis:

- Sessile drop technique,

- Probe: water and CH2l2

4. TOC: total organic content

Die Shear Test (from Customer Evaluation)

Die Shear Test- Shear ave. > 40kg, good destruction mode- No big shear change before and after PCT

LEG1 LEG2 LEG3 LEG4

SR A(DFSR) B(Ink) C(DFSR) LG DFSR

* unit: g

SR A(DFSR) B(Ink) C(DFSR) LG DFSR

Surface treatment Plasma [Ar]

Before PCT 43,725 52,731 48,223 54,373

After PCT 51,928 48,858 44,180 51,572

Destruction Mode All Good All Good All Good All Good

70000

Die sheer TEST result (before PCT)

70000

Die sheer TEST result (after PCT)

LEG4LEG3LEG2LEG1

60000

50000

40000

30000

20000

10000

0

LEG No.

Sh

ea

r Fo

rce

LEG4LEG3LEG2LEG1

60000

50000

40000

30000

20000

10000

0

LEG No.

Sh

ea

r F

orc

e

EMC Shear Test (from Customer Evaluation)EMC Shear Test (from Customer Evaluation)

EMC Molding Shear Test- The order of adhesion strength: LG DFSR > A = B = C- No big shear change before and after PCT

LEG1 LEG2 LEG3 LEG4

SR A(DFSR) B(Ink) C(DFSR) LG DFSR

Surface treatment Plasma [Ar]

Before PCT 16,794 21,130 17,998 25,962

After PCT 18,669 19,969 19,556 26,009

Destruction Mode All Good All Good All Good All Good

30000

EMC molding sheer test result (before PCT)

30000

EMC molding sheer test result (after PCT)

LEG4LEG3LEG2LEG1

25000

20000

15000

10000

5000

LEG No.

Sh

ea

r Fo

rce

LEG4LEG3LEG2LEG1

25000

20000

15000

10000

5000

LEG No.

Sh

ea

r Fo

rce

SR Thickness MeasurementSR Thickness MeasurementSR Thickness MeasurementSR Thickness Measurement

Unit L1 L2 L3 L7 L8 L9 L11 L12 L13 L17 L18 L19 L21 L22 L23 L27 L28 L29Condition

ü SR thickness change has been measured at various vacuum lamination condition

ü Pre-Treatment:

Vacuum Lamination → UV Exposure→ Post cure → X-section → Optical Measurement

Unit L1 L2 L3 L7 L8 L9 L11 L12 L13 L17 L18 L19 L21 L22 L23 L27 L28 L29

Temp ℃

Vacuum hpa

Vacuum Press Mpa

Vacuum Time sec

Temp ℃ 60 70 80 60 70 80 60 70 80 60 70 80 60 70 80 60 70 80

Press kgf/cm2

Time sec 10

80

2 3

0.2 0.30.2 0.3Vacuum

70

2 3

10

Press

Condition

2 3

0.2 0.3

60

8

(1) Test Material: DFSR : LG-S-850L 25㎛, Core Material: 500GA 0.15T, T/T

(2) Vacuum Lamination Condition:

Vacuum Part: Vacuum, Slap down condition fixed (10sec),

Press Part: Press & Time fixed (8kg, 10sec)

(3) UV Exposure & Development: 400mJ/㎠ (under mylar film), 60sec

(4) Post Cure: 160℃, 1 hour

SR Thickness measurement @CuSR Thickness measurement @Cu

22

23

24

25

Film

Thic

kness (

um

)

L9

16

17

18

19

20

21

LEGL1 L2 L3 L7 L8 L9 L11

L12L13

L17L18

L19L21

L22L23

L27L28

L29

Vacuum Lamination Variation

Film

Thic

kness (

um

)

L12

ü SR thickness depends on the vacuum lamination condition

ü SRT can be estimated by applying Cu etch ratio and by SR thickness reduction

upon various process

Vacuum Lamination Variation

Characteristics

ItemLG Chem

Unit & Condition LG–S-850L

Thickness ㎛ 25

SRO resolution Φ, ㎛ 50

Tg (TMA) ℃ 116

CTE (a1/a2) ppm/ppm 47/ 148CTE (a1/a2) ppm/ppm 47/ 148

Tensile Strength MPa 51

Elongation % 3.2

Modulus MPa 3056

Water Absorption 85 ℃, 85%, 24hr, % 0.5~0.6

Solder Resistance 260℃, 10 sec, 3 cycle Pass

Td (TGA) 5% weight Loss 342.7℃

NaOH 10wt%, 30 min Pass

* The above data has been taken from our lab test results and it is not the end property of the product.

Chemical

Resistance

HCl 10wt%, 30 min Pass

H2SO4 10wt%, 30 min Pass

IPA, 30 min Pass

PCT121℃, 100%, 2.1atm, 100hr

(146℃, 100%, 4.2atm, 24hr)Pass

Reliability Test at PKG level (from Customer Evaluation)

Item Unit & ConditionTest

ResultsComment

s

Precondition85℃/60% RH/168

HRspass

JEDEC LEV2

* Applied PKG: MCP, FC, FBGA LG DFSR-S-850L

PreconPrecondition

HRspass

LEV2

Pressure Cooker Test

w/ precondition

121℃, 2.1atm, 100% RH

312 HRs

pass

Temperature Cycle Test

w/ precondition

-65℃ ~ +150℃,

1000 Cyclespass

Condition C

High Temperature

Storage Test w/ precondition

150℃

1000 HRspass

85/85

/24

precondition1000 HRs

85℃/85 %RH Test

w/ Bias + precon

85℃/85 %RH

168 HRspass TC 500

Cycles

We will provide the solution for…We will provide the solution for…

Solution for Thin PCB

-Thin SR (thickness: ≤15㎛)

- Lower SRT (≤7㎛) & SRR (≤5~7㎛)

Solution for fine patterning

- Smaller SRO (≤50㎛)

- Contact & Direct Imaging

Solution for Warpage Control

- Lower SR thickness

- Lower CTE (＜50ppm/℃)

Solution for Heat dissipation Bring Variety in Green World

- Heat dissipation filler

- New resin system

Bring Variety in Green World

- Color tunable DFSR

DFSR R&D Roadmap

2010 2011 2012 2013 2014 2015

SR Thickness

12±2㎛

SR Thickness

@ Cu

Fine Pattern

SRO

7±2㎛

5±2㎛

Contact: 60 ㎛

UV-DI: 60 ㎛ UV-DI: 50 ㎛ UV-DI: 40 ㎛

High Performance

DFSR

Low CTE

Heat Dissipation