Intel X79 Express Chipset - pub.rocpop/Documentatie_SMP/Intel... · 2014. 1. 9. · Intel® X79 Express Chipset Platform Controller Hub (PCH). • Describe reference thermal solutions

Document Number: 326202-002

Intel® X79 Express ChipsetThermal / Mechanical Specifications and Design Guidelines

September 2012

2 Thermal / Mechanical Specifications and Design Guidelines

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Thermal / Mechanical Specifications and Design Guidelines 3

Contents

1 Introduction ..............................................................................................................71.1 Definition of Terms ..............................................................................................81.2 Reference Documents ..........................................................................................8

2 Packaging Technology ...............................................................................................92.1 PCH Package ......................................................................................................92.2 Package Mechanical Requirements....................................................................... 10

3 Thermal Specifications ............................................................................................ 113.1 Thermal Design Power (TDP) .............................................................................. 113.2 Case Temperature ............................................................................................. 113.3 Storage Specifications........................................................................................ 12

4 Thermal Simulation ................................................................................................. 13

5 Thermal Methodology .............................................................................................. 155.1 Die Temperature Measurements .......................................................................... 15

5.1.1 Zero Degree Angle Attach Methodology ..................................................... 15

6 ATX Reference Thermal Solution.............................................................................. 176.1 Operating Environment ...................................................................................... 176.2 Mechanical Design Envelope ............................................................................... 186.3 Board-level Components Keepout Dimensions ....................................................... 186.4 Board Level Layout Considerations ...................................................................... 196.5 Thermal Solution Assembly................................................................................. 20

6.5.1 Active Thermal Solution .......................................................................... 206.5.2 Passive Thermal Solution......................................................................... 216.5.3 Extruded Heatsink Profiles ....................................................................... 226.5.4 Thermal Interface Material....................................................................... 22

6.5.4.1 Effect of Pressure on TIM Performance......................................... 226.5.5 Push Pin Fasteners ................................................................................. 23

6.6 Reliability Guidelines.......................................................................................... 23

A Thermal Solution Component Suppliers ................................................................... 25A.1 High-End Desktop (HEDT) Reference Thermal solution ........................................... 25A.2 Supplier Contact Information .............................................................................. 25

B Mechanical Drawings ............................................................................................... 27


Figures2-1 PCH Package Dimensions (Top View)..................................................................... 92-2 PCH Package Dimensions (Side View) .................................................................... 92-3 PCH Package Dimensions (Bottom View)...............................................................105-1 Thermal Solution Decision Flowchart ....................................................................165-2 Zero Degree Angle Attach Heatsink Modifications ...................................................165-3 Zero Degree Angle Attach Methodology (Top View) ................................................166-1 Heatsink Volumetric Envelope for the High-End Desktop (HEDT) Reference

PCH Thermal Solution.........................................................................................186-2 Board Level Layout Considerations .......................................................................196-3 High-End Desktop (HEDT) Active Reference Heatsink Assembly................................206-4 Passive Reference Heatsink Flow Boundary Conditions ............................................216-5 High-End Desktop (HEDT) Passive Reference Heatsink ............................................22B-1 PCH Package Drawing ........................................................................................28B-2 Keep In Zone for High-End Desktop (HEDT) PCH Thermal Solution ...........................29B-3 High-End Desktop (HEDT) PCH Thermal Solution Assembly......................................30B-4 High-End Desktop (HEDT) PCH thermal Solution – Extrusion....................................31

Tables1-1 Definition of Terms ............................................................................................. 83-1 Intel® X79 Express Chipset Configurations Thermal Design Power (TDP) ...................113-2 PCH Thermal Specification ..................................................................................123-3 Storage Conditions.............................................................................................126-1 Platform Controller Hub (PCH) Operating Conditions ...............................................176-2 Honeywell PCM45 F* TIM Performance as a Function of Attach Pressure....................236-3 Reliability Guidelines ..........................................................................................23A-1 High-End Desktop (HEDT) Reference Heatsink Enabled Component ..........................25A-2 Supplier Contact Information...............................................................................25B-1 Mechanical Drawing List......................................................................................27


Revision History

§

Revision Number Description Date

001 • Initial release of the document. November 2011

002• Added passive thermal reference solution to Chapter 6• Updated Figure B-1

September 2012



Introduction

1 Introduction

As the complexity of computer systems increases, so do the power dissipation requirements. Care must be taken to ensure that the additional power is properly dissipated. Typical methods to improve heat dissipation include selective use of ducting, and/or passive heatsinks.

The goals of this document are to:• Outline the thermal and mechanical operating limits and specifications for the

Intel® X79 Express Chipset Platform Controller Hub (PCH).

• Describe reference thermal solutions that meet the specifications of the Intel® X79 Express Chipset Platform Controller Hub (PCH).

Properly designed thermal solutions provide adequate cooling to maintain the PCH case temperatures at or below thermal specifications. This is accomplished by providing a low local-ambient temperature, ensuring adequate local airflow, and minimizing the case to local-ambient thermal resistance. By maintaining the PCH case temperature at or below the specified limits, a system designer can ensure the proper functionality, performance, and reliability of the component. Operation outside the functional limits can degrade system performance and may cause permanent changes in the operating characteristics of the component.

The simplest and most cost effective method to improve the inherent system cooling characteristics is through careful chassis design and placement of fans, vents, and ducts. When additional cooling is required, component thermal solutions may be implemented in conjunction with system thermal solutions. The size of the fan or heatsink can be varied to balance size and space constraints with acoustic noise.

This document addresses thermal design and specifications for the PCH component only. For thermal design information on other chipset components, refer to the respective component TMSDG.

Note: Unless otherwise specified, the term “Platform Controller Hub” or “PCH” will be used to refer to the any version of the Intel® X79 Express Chipset covered by this document.

Introduction


1.1 Definition of Terms

1.2 Reference DocumentsThe reader of this specification should also be familiar with material and concepts presented in the following documents.

§

Table 1-1. Definition of Terms

Term Definition

BLT Bond Line Thickness. Final settled thickness of the thermal interface material after installation of heatsink.

CTE Coefficient of Thermal Expansion. The relative rate a material expands during a thermal event.

FC-BGA

Flip Chip Ball Grid Array. A package type defined by a plastic substrate where a die is mounted using an underfill C4 (Controlled Collapse Chip Connection) attach style. The primary electrical interface is an array of solder balls attached to the substrate opposite the die. Note that the device arrives at the customer with solder balls attached.

PCH Platform Controller Hub. It is connected to the processor using DMI2 and PCI Express* providing enhanced storage capabilities.

Tcase_maxDie temperature allowed. This temperature is measured at the geometric center of the top of the die.

TDP Thermal design power. Thermal solutions should be designed to dissipate this target power level. TDP is not the maximum power that the PCH can dissipate.

Title Document # / Location

Intel® C600 Series Chipset and Intel® X79 Express Chipset Datasheet 326514

Intel® X79 Express Chipset Specification Update 326201

Various system thermal design suggestions (http://www.formfactors.or

g)


Packaging Technology

2 Packaging Technology

2.1 PCH PackageThe Platform Controller Hub (PCH) component uses a 27.0 mm square, 8-layer flip chip ball grid array (FC-BGA) package (see Figure 2-1, Figure 2-2 and Figure 2-3).

(

Figure 2-1. PCH Package Dimensions (Top View)

Figure 2-2. PCH Package Dimensions (Side View)

27.00 mm

27.00 mm

0.70 mm

HandlingExclusion

Area

11.96 mm

10.68 mm

Die

NOT TO SCALE

See Note 3

Seating Plane

See Note 1

PCH Die

NOTES:

1. Primary datum-C and seating plan are defined by the spherical crowns of the solder balls (shown before motherboard attach)

2. All dimensions and tolerances conform to ANSI Y14.5M-1994

3. The solder ball height post-SMT height is ~0.315 ± 0.1 mm. Top of die above the motherboard after reflow is about 2.293 ± 0.142 mm.

0.203

0.353 ± 0.1 mm

2.331 ±0.136 mm Substrate

0.82 ±0.047 mm

Packaging Technology


Notes:1. All dimensions are in millimeters.2. All dimensions and tolerances conform to ANSI Y14.5M-1994.

2.2 Package Mechanical RequirementsThe PCH package has a bare die that is capable of sustaining a maximum static normal load of 15 lbf (67N). These mechanical load limits must not be exceeded during heatsink installation, mechanical stress testing, standard shipping conditions and/or any other use condition.

Note: The heatsink attach solutions must not include continuous stress to the PCH package with the exception of a uniform load to maintain the heatsink-to-package thermal interface.

Note: These specifications apply to uniform compressive loading in a direction perpendicular to the die top surface.

Note: These specifications are based on limited testing for design characterization. Loading limits are for the package only.

§

Figure 2-3. PCH Package Dimensions (Bottom View)

27.00±0.04

27.00±0.04

AWAVAU

AT

ANAPAR

AMAL

AKAJ

AHAG

AFAE

ADAC

ABAA

YW

VU

TR

P

MN

L

JK

GH

F

CDE

BA

1 32 4 6 75 108 9

12131114

1716

15 19212018 22

23 252624

2928

27 3332

3130

3736

3534

3938


Thermal Specifications

3 Thermal Specifications

3.1 Thermal Design Power (TDP)Analysis indicates that real applications are unlikely to cause the PCH component to consume maximum power dissipation for sustained time periods. Therefore, in order to arrive at a more realistic power level for thermal design purposes, Intel characterizes power consumption based on known platform benchmark applications. The resulting power consumption is referred to as the Thermal Design Power (TDP). TDP is the peak power level to which the thermal solutions should be designed. TDP numbers assume standard ASPM power-management features use.

For PCH TDP specifications, see Table 3-1. FC-BGA packages have poor heat transfer capability into the board and have minimal thermal capability without thermal solution. Intel recommends that system designers plan for a heatsink for most Intel® X79 Express Chipset PCH configurations.

Notes:1. Use of 1 GbE MAC occupies 1 of available PCIe expansion ports.2. PCI bus subtractive decode disabled, directed to PCIe expansion ports3. TDP power (max) represents required thermal design solution capacity required to support 3-sigma

manufacturing variance.4. Idle power (typ) is representative average across volume distribution5. Configurations are typical usages for the purposes of identifying best approximate TDP values. Intel does

not quote power consumption on a per-port or per-feature basis.6. These specifications are based on both pre-silicon estimates and simulations, as well as verified using post-

Si correlation.

3.2 Case TemperatureTo ensure proper operation and reliability of the PCH, the case temperature must be following the thermal profile as specified in Table 3-2. System and/or component level thermal solutions are required to maintain these temperature specifications. Refer to Chapter 5 for guidelines on accurately measuring package case temperatures.

Table 3-1. Intel® X79 Express Chipset Configurations Thermal Design Power (TDP)

ConfigurationHigh-End Desktop

(HEDT) Config

Server Config

Lite/Low Power Config

Notes

AHCI SATA 6G ports 2 (6G) 2 (6G) Unused

AHCI SATA 3G ports 4 4 2

USB 14 6 6

PCI Express* expansion ports

81 6 4 See Note 1

1 GbE MAC Enabled Disabled Disabled

Legacy 32b PCI port Routed/used Unused2 Unused2 See Note 2

HD Audio Routed/used Unused Unused

TDP max (W) 7.8 6.7 5.4 See Note 3

Idle Power typ (W) 2.5 2.0 1.9 See Note 4

Thermal Specifications


Notes:1. When Tsensor < TCONTROL, which means the component thermal sensor reading is less than TCONTROL,

system fans can be under any condition.2. When Tsensor ≥ TCONTROL, which means component thermal sensor reading is larger than TCONTROL, The fan

speed must increase as necessary to try to maintain the Tsensor less than TCONTROL. In the case where maximum fan speed is reached and Tsensor cannot be maintained less than TCONTROL, the Tcase_max must still be maintained to be less than or equal.

3. TCONTROL value should be compared with the reading data from the digital thermal sensor embedded in package for system fan speed control.

Note: The PCH silicon has an on die thermal sensor which is intended for usage in fan speed control and thermal management to allow optimal acoustic without introducing thermal risk. When evaluating the thermal requirements under lower power and fan speeds, make sure to use engineering judgment on the airflow requirements taking the thermal sensor and fan speed control capability into account. The thermal solution should be designed to have sufficient head room to cover TDP under maximum ambient and altitude conditions; however, it is up to the thermal engineer to determine the quality, risk and cost regarding the acoustic solution.

3.3 Storage SpecificationsTable 3-3 includes a list of the specifications for device storage in terms of maximum and minimum temperatures and relative humidity. These conditions should not be exceeded in storage or transportation.

Notes:1. Refer to a component device that is not assembled in a board or socket that is not to be electrically

connected to a voltage reference or I/O signals.2. Specified temperature are based on data collected.Exceptions for surface mount reflow are specified in by

applicable JEDEC standard. Non-adherence may affect component reliability.3. TABSOLUTE STORAGE applies to the unassembled component only and does not apply to the shipping media,

moisture barrier bags, or desiccant.4. Intel branded board products are certified to meet the following temperature and humidity limits that are

given as an example only (Non-Operating Temperature Limit: -40 °C to 70 °C & Humidity: 50% to 90%, non-condensing with a maximum wet bulb of 28 °C) Post board attach storage temperature limits are not specified for non-Intel branded boards.

5. The JEDEC, J-JSTD-020 moisture level rating and associated handling practices apply to all moisture sensitive devices removed from the moisture barrier bag.

6. Nominal temperature and humidity conditions and durations are given and tested within the constraints imposed by Tsustained and customer shelf life in applicable Intel box and bags.

§

Table 3-2. PCH Thermal Specification

Parameter Thermal Specification

Tcase_max 92.7 °C

Tcase_min 5 °C

TCONTROL 85 °C

Table 3-3. Storage Conditions

Parameter Description Min Max Notes

TABSOLUTE STORAGEThe non-operating device storage temperature.Damage (latent or otherwise) may occur when subjected to for any length of time.

-55 °C 125 °C 1,2,3

TSUSTAINED STORAGEThe ambient storage temperature limit (in shipping media) for a sustained period of time. -5 °C 40 °C 4,5

RHSUSTAINED STORAGEThe maximum device storage relative humidity for a sustained period of time. 60% @ 24 °C 5,6

TIMESUSTAINED STORAGEA prolonged or extended period of time; typically associated with customer shelf life. 0 month 6 month 6


Thermal Simulation

4 Thermal Simulation

Intel provides thermal simulation models of the PCH and associated users’ guides to aid system designers in simulating, analyzing, and optimizing their thermal solutions in an integrated, system-level environment. The models are for use with the commercially available Computational Fluid Dynamics (CFD)-based thermal analysis tool FLOTHERM* (version 8.2 or higher) by Mentor Graphics, Inc. Contact your Intel field sales representative to order the thermal models and users’ guides.

§

Thermal Simulation



Thermal Methodology

5 Thermal Methodology

The system designer must make temperature measurements to accurately determine the thermal performance of the system. Intel has established guidelines for proper techniques to measure the PCH die temperatures. Section 5.1 provides guidelines on how to accurately measure the PCH die temperatures. Section 5.1.1 contains information on running an application program that will emulate anticipated maximum thermal design power. The flowchart in Figure 5-1 offers useful guidelines for thermal performance and evaluation.

5.1 Die Temperature MeasurementsTo ensure functionality and reliability, the Tcase of the PCH must be maintained at or between the maximum/minimum operating range of the temperature specification as noted in Table 3-2. The surface temperature at the geometric center of the die corresponds to Tcase. Measuring Tcase requires special care to ensure an accurate temperature measurement.

Temperature differences between the temperature of a surface and the surrounding local ambient air can introduce errors in the measurements. The measurement errors could be due to a poor thermal contact between the thermocouple junction and the surface of the package, heat loss by radiation and/or convection, conduction through thermocouple leads, and/or contact between the thermocouple cement and the heatsink base (if a heatsink is used). For maximum measurement accuracy, only the 0° thermocouple attach approach is recommended.

5.1.1 Zero Degree Angle Attach Methodology1. Mill a 3.3 mm (0.13 in.) diameter and 1.5 mm (0.06 in.) deep hole centered (with

0.7mm offset to left side refer to Figure 5-2) on the bottom of the heatsink base. 2. Mill a 1.3 mm (0.05 in.) wide and 0.5 mm (0.02 in.) deep slot from the centered

hole to one edge of the heatsink. The slot should be parallel to the heatsink fins (see Figure 5-2).

3. Attach thermal interface material (TIM) to the bottom of the heatsink base.

4. Cut out portions of the TIM to make room for the thermocouple wire and bead. The cutouts should match the slot and hole milled into the heatsink base.

5. Attach a 36 gauge or smaller calibrated K-type thermocouple bead or junction to the center of the top surface of the die using a high thermal conductivity cement. During this step, ensure no contact is present between the thermocouple cement and the heatsink base because any contact will affect the thermocouple reading. It is critical that the thermocouple bead makes contact with the die (see Figure 5-3).

6. Attach heatsink assembly to the PCH and route thermocouple wires out through the milled slot.

Thermal Methodology


NOTE: Not to scale.

NOTE: Not to scale.

§

Figure 5-1. Thermal Solution Decision Flowchart

Attachthermocouples

using recommendedmetrology. Setupthe system in the

desiredconfiguration.

Tdie >Specification?

No

YesHeatsinkRequired

SelectHeatsink

End

Start

Run the Powerprogram andmonitor thedevice die

temperature.

Attach deviceto board

using normalreflow

process.

Figure 5-2. Zero Degree Angle Attach Heatsink Modifications

Figure 5-3. Zero Degree Angle Attach Methodology (Top View)

Cement +Thermocouple Bead

Die

ThermocoupleWire

Substrate


ATX Reference Thermal Solution

6 ATX Reference Thermal Solution

Intel has developed two reference thermal solutions to meet the cooling needs of the PCH in a typical High-End Desktop (HEDT) system under operating environments and specifications defined in this document. This section describes the overall requirements for the torsional clip heatsink reference thermal solution including critical-to-function dimensions, operating environment, and validation criteria. Other chipset components may or may not need attached thermal solutions depending on your specific system local-ambient operating conditions.

6.1 Operating EnvironmentThe reference thermal solution for the PCH was designed assuming:

• Maximum local-ambient temperature of

— 55 °C at TDP— 35 °C at Idle

• Fixed speed fan that meets TDP power dissipation and idle condition acoustic limit

• Dual slot PEG cards installed in slots (4 & 6) above the heatsink

The approaching airflow temperature is assumed to be equal to the local-ambient temperature. The thermal designer must carefully select the location to measure airflow to obtain an accurate estimate. These local-ambient conditions are based on a 35 °C (under high fan speed condition) / 25 °C (under acoustic fan speed condition) external-ambient temperature at sea level altitude. (External-ambient refers to the environment external to the system.)

Note: The heatsink was designed considering all the boundary conditions in Table 6-1 but only the worst case would have been used to design the heatsink.

Table 6-1. Platform Controller Hub (PCH) Operating Conditions

Parameter Idle TDP

Fan Speed (RPM) for active reference solution 3000

Altitude (m) Sea Level Sea Level

Tsystem_ambient (oC) 25 35

Acoustic (BA) 3.0

TTV Tj-max (oC) 100

Tla (oC) 35 55

Heatsink Preload lbf [N] < 15 [66.7]



6.2 Mechanical Design EnvelopeWhile each design may have unique mechanical volume and height restrictions or implementation requirements, the height, width, and depth constraints typically placed on the PCH thermal solution in a HEDT system are shown in Figure 6-1.

When using heatsinks that extend beyond the PCH reference heatsink envelope shown in Figure 6-1, any motherboard components placed between the heatsink and motherboard cannot exceed height restriction under base area in the corresponding direction.

in

6.3 Board-level Components Keepout DimensionsThe location of hole patterns and keepout zones for the reference thermal solution are shown in Figure B-2.

Figure 6-1. Heatsink Volumetric Envelope for the High-End Desktop (HEDT) Reference PCH Thermal Solution

Mounting flange NE corner going north and SW corner going southAll dimensions are in mm.

TNB Heatsink

47.

00

44.6

HEDT PCH

Heatsink

DieFCBGA + Solder Balls

14.

95

Motherboard

HEDT PCHHeatsink 2

.30

TIM

Pin 1

15.24

ATX KOZ for Add-in Cards



6.4 Board Level Layout ConsiderationsAs mentioned in Section 6.1, the reference thermal solution assumes the x16 PEG slots are PCIe slots 4 and 6. This minimizes the obstruction of the PCH fan by the two slot PEG card. Intel recommends this layout to ensure sufficient inlet / exhaust to the reference PCH thermal solution and allow the installation of a PCIe card such as audio which has minimal impact to the PCH thermal solution performance. The reduction in thermal solution performance from the Recommended to Worst case layout is about 30%. See Figure 6-2.

Note: Heat pipe thermal solutions on the PCH would not necessarily be adversely impacted by PEG x16 in slots 5 and 6. (PCIe*).

Figure 6-2. Board Level Layout Considerations



6.5 Thermal Solution AssemblyThere are two reference thermal solutions for the PCH: an active thermal solution and a passive thermal solution. For a thermally constrained system, the active thermal solution is recommended.

6.5.1 Active Thermal SolutionThe active thermal solution is recommended for more thermally or acoustically constrained systems. The thermal resistance of this thermal solution is θsa=3.6 °C/W

The active thermal solution consists of the following items:

• 24 Fin aluminum extrusion (milled for axial fan and push pin features)

• 37 mm fan axial bracket fan

• Push pin fasteners

• Pre-applied Thermal Interface Material (TIM)

Figure 6-3 shows the active reference thermal solution assembly and associated components.

Full mechanical drawings of the thermal solution assembly and the heatsink extrusion are provided in Appendix B. Component part numbers and vendor contact information can be found in Appendix A.

Figure 6-3. High-End Desktop (HEDT) Active Reference Heatsink Assembly



6.5.2 Passive Thermal SolutionThe passive thermal solution is recommended for systems constrained by BOM costs. This thermal solution is designed assuming the following parameters (see Figure 6-4):

• Gap between PCIe connector and memory connector is 15.1 mm wide and 16.1 mm tall

• Air flow rate through this gap is 0.2 CFM

Note: Not drawn to scale

Under these conditions, the thermal resistance of this thermal solution is θsa = 10.3 °C/W. Smaller gaps or lower air flow rates could lead to a higher θsa.

The passive thermal solution consists of the following items:

• 10 Fin aluminum extrusion with 4 cross cuts (milled for push pin fasteners)

• Push pin fasteners

• Pre-applied Thermal Interface Material (TIM)

Figure 6-5 shows the passive reference thermal solution.

Full mechanical drawings of the thermal solution assembly and the heatsink extrusion are provided in Appendix B. Component part numbers and vendor contact information can be found in Appendix A.

Figure 6-4. Passive Reference Heatsink Flow Boundary Conditions

PCH

PCIe

Memory

70.4mm

7.6mm

107.4mm

15.5mm

18.3mm

44.6mm

46.7mm

8.05mm

Memory

Figure not to scale

55.6 mm

45°

Air flowvx = vy = -0.311m/s

vz = 0.254 m/s

x

y

z



The active and passive heatsink extrusions share the same Keepout Zone.

6.5.3 Extruded Heatsink ProfilesBoth the active and passive reference thermal solution use an extruded heatsink for cooling the PCH. Full mechanical drawing of both heatsink extrusions are provided in Appendix B.

6.5.4 Thermal Interface MaterialA thermal interface material (TIM) provides improved conductivity between the Die surface and heat sink. The reference thermal solution uses Honeywell PCM45F*, 0.25 mm (0.010 in.) thick, 20 mm x 20 mm (0.6 in. x 0.6 in.) square.

Note: Unflowed or “dry” Honeywell PCM45 F has a material thickness of 0.010 inch. The flowed or “wet” Honeywell PCM45F has a material thickness of ~0.003 inch after it reaches its phase change temperature.

6.5.4.1 Effect of Pressure on TIM Performance

As mechanical pressure increases on the TIM, the thermal resistance of the TIM decreases. This phenomenon is due to the decrease of the bond line thickness (BLT). BLT is the final settled thickness of the thermal interface material after installation of heatsink. The effect of pressure on the thermal resistance of the Honeywell PCM45 F TIM is shown in Table 6-2.

Intel provides both End of Line and End of Life TIM thermal resistance values of Honeywell PCM45F. The End of Line value represents the TIM performance post heatsink assembly while the End of Life value is the predicted TIM performance when the product and TIM reaches the end of its life. The heatsink clip provides enough pressure for the TIM to achieve End of Line thermal resistance of 0.19 °C cm2/W and End of Life thermal resistance of 0.39 °C cm2/W.

Figure 6-5. High-End Desktop (HEDT) Passive Reference Heatsink



6.5.5 Push Pin FastenersFor PCH based platforms the reference design is reusing the push pin design from a prior thermal solution. The push pin is integrated into the thermal solution design by the vendor. See Appendix A for part number and supplier information.

6.6 Reliability GuidelinesEach motherboard, heatsink and attach combination may vary the mechanical loading of the component. Based on the end user environment, the user should define the appropriate reliability test criteria and carefully evaluate the completed assembly prior to use in high volume.

The test profiles for PCH chipset reference solutions are unpackaged system level limits. The reference solution is to be mounted to a fully configured system. The environmental reliability requirements for the reference thermal solution are shown in Table 6-3. These could be considered as general guidelines.

Notes:1. It is recommended that the above tests be performed on a sample size of at least twelve assemblies from

three lots of material.2. Additional pass/fail criteria may be added at the discretion of the user.3. The reference PCH thermal solution is using a known TIM. The TIM degradation and reliability was

characterized on prior designs. As a result Temperature Cycle testing will not be done on this assembly.

§

Table 6-2. Honeywell PCM45 F* TIM Performance as a Function of Attach Pressure

Pressure on Thermal solution and package interface (PSI)

Thermal Resistance (°C × cm2)/W

End of Line End of Life

40 0.19 0.39

Table 6-3. Reliability Guidelines

Test (1) Example of Test Description Pass/Fail Criteria (2)

Mechanical Shock

System level unpackaged test:2 drops for + and - directions in each of 3 perpendicular axes (that is, total 12 drops).Profile: 25g, Trapezoidal waveform, velocity change depending on system weight.

Visual Check and Electrical Functional Test

Random Vibration

System level unpackaged test:Duration: 10 min/axis, 3 axesFrequency Range: 0.002 g2/Hz@5Hz,ramping to 0.01 g2/Hz @20 Hz, 0.01 g2/Hz @20 Hz to 500 HzPower Spectral Density (PSD) Profile: 2.20g RMS

Visual Check and Electrical Functional Test




Thermal Solution Component Suppliers

A Thermal Solution Component Suppliers

A.1 High-End Desktop (HEDT) Reference Thermal solution

Notes:1. The enabled components may not be currently available from all suppliers. Contact the supplier directly to

verify time of component availability.

A.2 Supplier Contact Information

§

Table A-1. High-End Desktop (HEDT) Reference Heatsink Enabled Component

Item Intel® PN CCI ITW

Heat sink with Fan E91324-001 00Z83250101 N/A

Push Pin E22771-001 N/A 83FT02-37-9909

Table A-2. Supplier Contact Information

Vendor Name Contact Phone Email

CCI Monica Chih 866-2-29952666, x1131(Taiwan) [email protected]

ITW Chak Chakir 1-512-576-8940 [email protected]

Thermal Solution Component Suppliers



Mechanical Drawings

B Mechanical Drawings

Table B-1 lists the mechanical and Package drawings included in this appendix.

Table B-1. Mechanical Drawing List

Drawing Description Figure Number

PCH Package Drawing Figure B-1

Keep In Zone for High-End Desktop (HEDT) PCH Thermal Solution Figure B-2

High-End Desktop (HEDT) PCH Thermal Solution Assembly Figure B-3

High-End Desktop (HEDT) PCH thermal Solution – Extrusion Figure B-4

Mechanical Drawings


Figure B-1. PCH Package Drawing


Mechanical Drawings

Figure B-2. Keep In Zone for High-End Desktop (HEDT) PCH Thermal Solution

13

45

67

8

BCD A

12

34

56

78

BCD A22

00 M

ISS

ION

CO

LLE

GE

BLV

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Mechanical Drawings


Figure B-3. High-End Desktop (HEDT) PCH Thermal Solution Assembly

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Mechanical Drawings

§

Figure B-4. High-End Desktop (HEDT) PCH thermal Solution – Extrusion

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