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Integrated in a compact aluminum case,the Intel RealSense D435 is an intelligentUSB-C powered 3D active infra-red globalshutter stereo depth camera. It combinesa conventional red/green/blue (RGB) colorsensor, a vertical-cavity surface-emittinglaser (VCSEL) projector and left- and right-side imagers for stereo vision.
The 3D camera has a minimum depth of0.2m and can scan environments up to10m wide with a resolution depth of up to1280x720 at 90 frames per second (fps).The system uses a 28nm Intel D4 visionprocessor for processing complex depthdata in real time and a Realtek color imageprocessor.
The infrared laser projector is tiny,measuring only 2.7mm x 1.8mm, usesVCSEL technology and can record 60fps.Omnivision supplies the three imagesensors; a CMOS 1080p RGB sensor andtwin 1-megapixel sensors for the left andright side imagers.
The components and sensors arecontained in ball grid array (BGA) andwafer level packaging, all mounted on twosingle-sided boards whose total surfacearea is less than 20cm².
Based on a complete teardown analysis ofthe RealSense D435, the report provideshigh definition pictures of the visionprocessor, VCSEL IR projector and imagesensor dies as well as the bill-of-material(BOM) and the manufacturing cost of thedepth module.
COMPLETE TEARDOW WITH
• Detailed teardown photos
• Component identification
• Die pictures
• PCB cross-sections
• Lens module cross sections and
analyses
• Intel vision processor physical analysis and cost estimate
• VCSEL and CMOS image sensor die
physical analyses and cost estimates
• Complete and priced bills-of-material
• Manufacturing process flow
• Manufacturing cost analysis
• Estimated cost and sales price
The 3D camera is using infrared active stereo depthand red/green/blue sensors, and a VCSEL projector.
REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT
Title: Intel RealSense D435
Pages: 90
Date: May 2018
Format: PDF & Excel fi le
Price: EUR 3,490
Intel RealSense D435 3D Active IR Stereo Depth Camera
IC – LED – RF – MEMS – IMAGING – PACKAGING – SYSTEM – POWER - DISPLAY
TABLE OF CONTENTS
Intel Company Profile, Camera Main Features and Main Chipset
Physical Analysis
• Camera Teardown
• Electronic Boards
Overview
High definition photos
Components markings and identification
• Die Pictures
• Sensors Board Cross Section
• Lens Modules Cross Section
Cost Analysis
• Accessing the BOM
• PCBs Cross Sections and Cost Analysis
• Omnivision OV9282 CIS Die Pictures and Cost Estimation
AUTHORS
Lacroix Electronics where he was in charge ofcomponents database. He holds a master degreein microelectronics from the University of Rennes.
Analysis Labo-ratory as fab support in physicalanalysis, and 3 years at Hirex Engineering inToulouse, in a DPA lab.
• VCSEL Die Pictures, Cross Section and Cost Estimation
• Estimation of the cost of the Lens Module
• BOM Cost - MCU Board
• BOM Cost - Sensors Board
• BOM Cost - Housing
• Material Cost Breakdown
• Accessing the Added Value (AV) cost
• MCU Board Manufacturing Flow and Added Value Cost
• Sensors Board Manufacturing Flow and Added Value Cost
• Details of the System Assembly AV Cost
• Added-Value Cost Breakdown
• Manufacturing Cost Breakdown
Estimation of the Selling Price - Intel
INTEL REALSENSE D435 3D ACTIVE IR STEREO DEPTH CAMERA
David Le Gac has joined SystemPlus Consulting as a costengineer in 2013 . He is incharge of reverse costing with afocus on boards and systems.He prev iously wo rked fo r
Yvon Le Goff has jo inedSystem Plus Consulting in2011, in order to setup theLaboratory . He previouslyworked during 25 years inAtmel Nantes Technological
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REVERSE COSTING® –STRUCTURE & PROCESS REPORTINTEL REALSENSE D435 3D ACTIVE IR STEREO DEPTH CAMERA
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