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Document Number: 307504-004
Intel® 945G/945GZ/945GC/ 945P/945PL Express Chipset Family Thermal and Mechanical Design Guidelines (TMDG)
- For the Intel® 82945G/82945GZ/82945GC Graphics Memory Controller Hub (GMCH) and Intel® 82945P/82945PL Memory Controller Hub (MCH)
February 2008
2 Thermal and Mechanical Design Guidelines
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The Intel® 82945G/82945GZ/82945GC GMCH and Intel® 82945P/82945PL MCH may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Intel, Pentium, and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2005–2008, Intel Corporation. All rights reserved.
Thermal and Mechanical Design Guidelines 3
Contents 1 Introduction .....................................................................................................7
1.1 Terminology ..........................................................................................8 1.2 Reference Documents .............................................................................9
2 Product Specifications......................................................................................11 2.1 Package Description..............................................................................11
2.1.1 Non-Grid Array Package Ball Placement ......................................11 2.2 Package Loading Specifications...............................................................12 2.3 Thermal Specifications ..........................................................................13 2.4 Thermal Design Power (TDP)..................................................................13
2.4.1 Methodology...........................................................................14 2.4.2 Application Power....................................................................14 2.4.3 Specifications .........................................................................14
3 Thermal Metrology ..........................................................................................15 3.1 Case Temperature Measurements ...........................................................15
3.1.1 Thermocouple Attach Methodology.............................................15 3.2 Airflow Characterization ........................................................................16
4 Reference Thermal Solution..............................................................................19 4.1 Operating Environment .........................................................................19
4.1.1 ATX Form Factor Operating Environment ....................................19 4.1.2 Balanced Technology Extended (BTX) Form Factor Operating
Environment...........................................................................20 4.2 Mechanical Design Envelope...................................................................21 4.3 Thermal Solution Assembly....................................................................21 4.4 Environmental Reliability Requirements ...................................................24
Appendix A Enabled Suppliers ...........................................................................................25
Appendix B Mechanical Drawings .......................................................................................27
4 Thermal and Mechanical Design Guidelines
Figures
Figure 1. (G)MCH Non-Grid Array ......................................................................12 Figure 2. 0° Angle Attach Methodology (top view, not to scale)..............................16 Figure 3. 0° Angle Attach Heatsink Modifications (generic heatsink side and bottom
view shown, not to scale)...........................................................................16 Figure 4. Airflow Temperature Measurement Locations .........................................17 Figure 5. Processor Heatsink Orientation to Provide Airflow to (G)MCH Heatsink on an
ATX Platform............................................................................................20 Figure 6. Processor Heatsink Orientation to Provide Airflow to (G)MCH Heatsink on a
Balanced Technology Extended (BTX) Platform..............................................21 Figure 7. ATX GMCH Heatsink Installed on Board.................................................22 Figure 8. Balanced Technology Extended (BTX) GMCH Heatsink Installed on Board...23 Figure 9. (G)MCH Package Drawing ...................................................................28 Figure 10. (G)MCH Component Keep-Out Restrictions for ATX Platforms .................29 Figure 11. (G)MCH Component Keep-Out Restrictions for Balanced Technology
Extended (BTX) Platforms ..........................................................................30 Figure 12. (G)MCH Reference Heatsink for ATX Platforms – Sheet 1 .......................31 Figure 13. (G)MCH Reference Heatsink for ATX Platforms – Sheet 2 .......................32 Figure 14. (G)MCH Reference Heatsink for ATX Platforms – Anchor ........................33 Figure 15. (G)MCH Reference Heatsink for ATX Platforms – Ramp Retainer Sheet 1 ..34 Figure 16. (G)MCH Reference Heatsink for ATX Platforms – Ramp Retainer Sheet 2 ..35 Figure 17. (G)MCH Reference Heatsink for ATX Platforms – Wire Preload Clip ..........36 Figure 18. (G)MCH Reference Heatsink for Balanced Technology Extended (BTX)
Platforms.................................................................................................37 Figure 19. (G)MCH Reference Heatsink for Balanced Technology Extended (BTX)
Platforms – Clip ........................................................................................38 Figure 20. (G)MCH Reference Heatsink for Balanced Technology Extended (BTX)
Platforms – Heatsink Assembly ...................................................................39
Tables
Table 1. (G)MCH Loading Specifications..............................................................12 Table 2. (G)MCH Case Temperature Specifications .............................................13 Table 3. (G)MCH Thermal Design Power Specifications........................................14 Table 4. Reference Thermal Solution Environmental Reliability Requirements .........24 Table 5. (G)MCH ATX Intel Reference Heatsink Enabled Suppliers.........................25 Table 6. (G)MCH Balanced Technology Extended (BTX) Intel Reference Heatsink
Enabled Suppliers .....................................................................................26
Thermal and Mechanical Design Guidelines 5
Revision History
Revision Number
Description Date
-001 • Initial Release May 2005
-002 • Added Intel® 82945PL specifications October 2005
-003 • Added Intel® 82945GZ specifications December 2005
-004 • Added Intel® 82945GC specifications February 2008
§
6 Thermal and Mechanical Design Guidelines
Introduction
Thermal and Mechanical Design Guidelines 7
1 Introduction
As the complexity of computer systems increases, so do power dissipation requirements. The additional power of next generation systems must be properly dissipated. Heat can be dissipated using improved system cooling, selective use of ducting, and/or active/passive heatsinks.
The objective of thermal management is to ensure that the temperatures of all components in a system are maintained within functional limits. The functional temperature limit is the range within which the electrical circuits can be expected to meet specified performance requirements. Operation outside the functional limit can degrade system performance, cause logic errors, or cause component and/or system damage. Temperatures exceeding the maximum operating limits may result in irreversible changes in the operating characteristics of the component. The goal of this document is to provide an understanding of the operating limits of the Intel® 82945G/82945GZ/82945GC Graphics and Memory Controller Hub (GMCH) and Intel® 82945P/82945PL Memory Controller Hub (MCH), and discuss a reference thermal solution.
The simplest and most cost-effective method to improve the inherent system cooling characteristics of the (G)MCH is through careful design and placement of fans, vents, and ducts. When additional cooling is required, component thermal solutions may be implemented in conjunction with system thermal solutions. The size of the fan or heatsink can be varied to balance size and space constraints with acoustic noise.
This document presents the conditions and requirements to properly design a cooling solution for systems that implement the 82945G/82945GZ/82945GC GMCH or 82945P/82945PL MCH. Properly designed solutions provide adequate cooling to maintain the (G)MCH case temperature at or below thermal specifications. This is accomplished by providing a low local-ambient temperature, ensuring adequate local airflow, and minimizing the case to local-ambient thermal resistance. By maintaining the (G)MCH case temperature at or below those recommended in this document, a system designer can ensure the proper functionality, performance, and reliability of these components.
Note: Unless otherwise specified, the information in this document applies to the Intel® 82945G/82945GZ/82945GC Graphics and Memory Controller Hub (GMCH) and the Intel® 82945P/82945PL Memory Controller Hub (MCH). The term (G)MCH refers to the 82945G GMCH, 82945GZ GMCH, 82945GC GMCH, 82945P MCH, and 82945PL MCH.
Note: Unless otherwise specified, ICH7 refers to the Intel® 82801GB ICH7 and 82801GR ICH7R I/O Controller Hub 7 components.
Introduction
8 Thermal and Mechanical Design Guidelines
1.1 Terminology
Term Description
BGA Ball Grid Array. A package type defined by a resin-fiber substrate where a die is mounted and bonded. The primary electrical interface is an array of solder balls attached to the substrate opposite the die and molding compound.
FC-BGA Flip Chip Ball Grid Array. A package type defined by a plastic substrate where a die is mounted using an underfill C4 (Controlled Collapse Chip Connection) attach style. The primary electrical interface is an array of solder balls attached to the substrate opposite the die. Note that the device arrives at the customer with solder balls attached.
Intel® ICH7 Intel® I/O Controller Hub 7. The chipset component that contains the primary PCI interface, LPC interface, USB, ATA, and/or other legacy functions.
GMCH Graphic Memory Controller Hub. The chipset component that contains the processor and memory interface and integrated graphics device.
MCH Memory Controller Hub. The chipset component that contains the processor and memory interface. It does not contain an integrated graphics device.
TA The measured ambient temperature locally to the component of interest. The ambient temperature should be measured just upstream of airflow for a passive heatsink or at the fan inlet for an active heatsink.
TC The measured case temperature of a component. For processors, TC is measured at the geometric center of the integrated heat spreader (IHS). For other component types, it is generally measured at the geometric center of the die or case.
TC-MAX The maximum case/die temperature with an attached heatsink. This temperature is measured at the geometric center of the top of the package case/die.
TC-MIN The minimum case/die temperature with an attached heatsink. This temperature is measured at the geometric center of the top of the package case/die.
TDP Thermal Design Power. TDP is specified as the highest sustainable power level of most or all of the real applications expected to be run on the given product, based on extrapolations in both hardware and software technology over the life of the component. Thermal solutions should be designed to dissipate this target power level.
TIM Thermal Interface Material. TIM is the thermally conductive material installed between two surfaces to improve heat transfer and reduce interface contact resistance.
lfm Linear Feet per Minute. Unit of airflow speed.
ΨCA Case-to-ambient thermal characterization parameter (Psi). This is a measure of thermal solution performance using total package power. It is defined as (TC – TA) / Total Package Power. Heat source size should always be specified for Ψ measurements.
Introduction
Thermal and Mechanical Design Guidelines 9
1.2 Reference Documents
Document Comments
Intel® 945G/945GZ/945P/945PL Express Chipset Family Datasheet
http://developer.intel.com/design/chipsets/datashts/307502.htm
Intel® I/O Controller Hub 7 (ICH7) Datasheet http://developer.intel.com//design/chipsets/datashts/307013.htm
Intel® I/O Controller Hub 7 (ICH7) Thermal Design Guidelines http://developer.intel.com//design/chipsets/designex/307015.htm
Intel® Pentium® 4 Processor 670, 660, 650, 640, and 630 and Intel® Pentium® 4 Processor Extreme Edition Datasheet
http://developer.intel.com/design/pentium4/datashts/306382.htm
Intel® Pentium®4 Processors 570/571, 560/561, 550/551,540/541, 530/531 and 520/521 Supporting Hyper-Threading Technology Datasheet
http://developer.intel.com/design/Pentium4/datashts/302351.htm
Intel® Pentium® D Processor 840, 830 and 820 Datasheet http://developer.intel.com/design/PentiumD//datashts/307506.htm
Intel® Pentium® 4 Processor on 90 nm Process in the 775–Land LGA Package Thermal and Mechanical Design Guidelines
http://developer.intel.com/design/Pentium4/guides/302553.htm
Intel® Pentium® D® Processor and Intel® Pentium® Processor Extreme Edition 830 Thermal and Mechanical Design Guidelines
http://developer.intel.com/design/pentiumXE/designex/306830.htm
LGA775 Socket Mechanical Design Guide http://developer.intel.com/design/pentium4/guides/302666.htm
Various System Thermal Design Suggestions http://www.formfactors.org
§
Introduction
10 Thermal and Mechanical Design Guidelines
Product Specifications
Thermal and Mechanical Design Guidelines 11
2 Product Specifications
This chapter provides the package description and loading specifications. The chapter also provides component thermal specifications and thermal design power descriptions for the (G)MCH.
2.1 Package Description
The (G)MCH is available in a 34 mm [1.34 in] x 34 mm [1.34 in] Flip Chip Ball Grid Array (FC-BGA) package with 1202 solder balls. The die size is currently 9.6 mm [0.378in] x 10.6 mm [0.417in]. A mechanical drawing of the package is shown in Figure 9, Appendix B.
2.1.1 Non-Grid Array Package Ball Placement
The (G)MCH package uses a “balls anywhere” concept. The minimum ball pitch is 0.8 mm [0.031 in], but ball ordering does not follow a 0.8-mm grid. Board designers should ensure correct ball placement when designing for the non-grid array pattern. For exact ball locations relative to the package, contact your Field Sales Representative.
Product Specifications
12 Thermal and Mechanical Design Guidelines
Figure 1. (G)MCH Non-Grid Array
2.2 Package Loading Specifications
Table 1 provides static load specifications for the chipset package. This mechanical maximum load limit should not be exceeded during heatsink assembly, shipping conditions, or standard use conditions. Also, any mechanical system or component testing should not exceed the maximum limit. The chipset package substrate should not be used as a mechanical reference or load-bearing surface for the thermal and mechanical solution.
Table 1. (G)MCH Loading Specifications
Parameter Maximum Notes
Static 15 lbf 1,2,3
NOTES: 1. These specifications apply to uniform compressive loading in a direction normal to the
(G)MCH package. 2. This is the maximum force that can be applied by a heatsink retention clip. The clip must
also provide the minimum specified load on the (G)MCH package. 3. These specifications are based on limited testing for design characterization. Loading limits
are for the package only.
Product Specifications
Thermal and Mechanical Design Guidelines 13
2.3 Thermal Specifications
To ensure proper operation and reliability of the (G)MCH, the temperature must be at or below the maximum value specified in Table 2. System and component level thermal enhancements are required to dissipate the heat generated and maintain the (G)MCH within specifications. Chapter 3 provides the thermal metrology guidelines for case temperature measurements.
The (G)MCH must also operate above the minimum case temperature specification listed in Table 2.
Table 2. (G)MCH Case Temperature Specifications
Parameter Value
TC-MAX 82945G/82945GZ/82945GC GMCH: 99 °C
82945P/82945PL MCH : 103°C
TC-MIN 0 °C
NOTE: Thermal specifications assume an attached heatsink is present.
2.4 Thermal Design Power (TDP)
Thermal design power (TDP) is the estimated power dissipation of the (G)MCH based on normal operating conditions including VCC and TC-MAX while executing real worst-case power intensive applications. This value is based on expected worst-case data traffic patterns and usage of the (G)MCH and does not represent a specific software application. TDP attempts to account for expected increases in power due to variation in (G)MCH current consumption due to silicon process variation, processor speed, DRAM capacitive bus loading and temperature. However, since these variations are subject to change, the TDP cannot ensure that all applications will not exceed the TDP value.
The system designer must design a thermal solution for the (G)MCH such that it maintains TC below TC-MAX for a sustained power level equal to TDP. Note that the TC-
MAX specification is a requirement for a sustained power level equal to TDP, and that the case temperature must be maintained at temperatures less than TC-MAX when operating at power levels less than TDP. This temperature compliance is to ensure (G)MCH reliability over its useful life. The TDP value can be used for thermal design if the (G)MCH thermal protection mechanisms are enabled. Intel chipsets incorporate a hardware-based fail-safe mechanism to help keep the product temperature within specifications in the event of unusually strenuous usage above the TDP power limit.
Product Specifications
14 Thermal and Mechanical Design Guidelines
2.4.1 Methodology
2.4.1.1 Pre-Silicon
To determine TDP for pre-silicon products in development, it is necessary to make estimates based on analytical models. These models rely on extensive knowledge of the past chipset power dissipation behavior along with knowledge of planned architectural and process changes that may affect TDP. Knowledge of applications available today and their ability to stress various components of the chipset is also included in the model. Since the number of applications available today is beyond what Intel can test, only real world high-power applications are tested to predict TDP. The values determined are used to set specific data transfer rates. The projection for TDP assumes (G)MCH operation at TC-MAX. The TDP estimate also includes a margin to account for process variation.
2.4.1.2 Post-Silicon
Once the product silicon is available, post-silicon validation is performed to assess the validity of pre-silicon projections. Testing is performed on both commercially available and synthetic high power applications and power data is compared to pre-silicon estimates. Post-silicon validation may result in a small adjustment to pre-silicon TDP estimates.
2.4.2 Application Power
Designing to the TDP can ensure that a particular thermal solution meets the cooling needs of future applications. Testing with currently available commercial applications has shown that the components may dissipate power levels below the published TDP specification in Section 2.4.3. Intel strongly recommends that thermal engineers design to the published TDP specification to develop a robust thermal solution that will meet the needs of current and future applications.
2.4.3 Specifications The (G)MCH is estimated to dissipate the Thermal Design Power values provided in Table 3 when using two DIMMs of 667 MHz (553 MHz for the 82945PL/82945GZ) dual channel DDR2 with a 1066 MHz (800 MHz for the 82945PL/82945GZ/82945GC) processor system bus speed. For the 82945G/82945GZ/82945GC GMCH, the graphics core is assumed to run at 400 MHz. FC-BGA packages have limited heat transfer capability into the board and have minimal thermal capability without thermal solutions. Intel requires that system designers plan for an attached heatsink when using the (G)MCH.
Table 3. (G)MCH Thermal Design Power Specifications
Component System Bus Speed Memory Frequency TDP Value
82945G GMCH 1066 MHz 667 MHz 22.2 W
82945GZ GMCH 800 MHz 533 MHz 22.2 W
82945GC GMCH 800 MHz 667 MHz 22.2 W
82945P MCH 1066 MHz 667 MHz 15.2 W
82945PL MCH 800 MHz 533 MHz 15.2 W
§
Thermal Metrology
Thermal and Mechanical Design Guidelines 15
3 Thermal Metrology
The system designer must measure temperatures to accurately determine the thermal performance of the system. Intel has established guidelines for proper techniques of measuring (G)MCH component case temperatures.
3.1 Case Temperature Measurements
To ensure functionality and reliability, the (G)MCH is specified for proper operation when TC is maintained at or below the maximum temperature listed in Table 2. The surface temperature at the geometric center of the die corresponds to TC. Measuring TC requires special care to ensure an accurate temperature reading.
Temperature differences between the temperature of a surface and the surrounding local ambient air can introduce error in the measurements. The measurement errors could be due to a poor thermal contact between the thermocouple junction and the surface of the package, heat loss by radiation and/or convection, conduction through thermocouple leads, or contact between the thermocouple cement and the heatsink base (if a heatsink is used). To minimize these measurement errors a thermocouple attach with a zero-degree methodology is recommended.
3.1.1 Thermocouple Attach Methodology 1. Mill a 3.3 mm [0.13 in] diameter hole centered on bottom of the heatsink base.
The milled hole should be approximately 1.5 mm [0.06 in] deep.
2. Mill a 1.3 mm [0.05 in] wide slot, 0.5 mm [0.02 in] deep, from the centered hole to one edge of the heatsink. The slot should be in the direction parallel to the heatsink fins (see Figure 3).
3. Attach thermal interface material (TIM) to the bottom of the heatsink base.
4. Cut out portions of the TIM to make room for the thermocouple wire and bead. The cutouts should match the slot and hole milled into the heatsink base.
5. Attach a 36 gauge or smaller calibrated K-type thermocouple bead or junction to the center of the top surface of the die using a high thermal conductivity cement. During this step, make sure no contact is present between the thermocouple cement and the heatsink base because any contact will affect the thermocouple reading. It is critical that the thermocouple bead makes contact with the die (see Figure 2).
6. Attach heatsink assembly to the (G)MCH and route thermocouple wires out through the milled slot.
Thermal Metrology
16 Thermal and Mechanical Design Guidelines
Figure 2. 0° Angle Attach Methodology (top view, not to scale)
Figure 3. 0° Angle Attach Heatsink Modifications (generic heatsink side and bottom view shown, not to scale)
3.2 Airflow Characterization
Figure 4 describes the recommended location for air temperature measurements measured relative to the component. For a more accurate measurement of the average approach air temperature, Intel recommends averaging temperatures recorded from two thermocouples spaced about 25 mm [1.0 in] apart. Locations for both a single thermocouple and a pair of thermocouples are presented.
Thermal Metrology
Thermal and Mechanical Design Guidelines 17
Figure 4. Airflow Temperature Measurement Locations
Airflow velocity should be measured using industry standard air velocity sensors. Typical airflow sensor technology may include hot wire anemometers. Figure 4 provides guidance for airflow velocity measurement locations. These locations are for a typical JEDEC test setup and may not be compatible with chassis layouts due to the proximity of the processor to the (G)MCH. The user may have to adjust the locations for a specific chassis. Be aware that sensors may need to be aligned perpendicular to the airflow velocity vector or an inaccurate measurement may result. Measurements should be taken with the chassis fully sealed in its operational configuration to achieve a representative airflow profile within the chassis.
§
Thermal Metrology
18 Thermal and Mechanical Design Guidelines
Reference Thermal Solution
Thermal and Mechanical Design Guidelines 19
4 Reference Thermal Solution
The reference component thermal solution for the (G)MCH for ATX platforms uses two ramp retainers, a wire preload clip, and four custom MB anchors. The Intel Balanced Technology Extended (BTX) reference design uses a Z-clip attach for the (G)MCH heatsink. This chapter provides detailed information on operating environment assumptions, heatsink manufacturing, and mechanical reliability requirements for the (G)MCH.
4.1 Operating Environment
The operating environment of the (G)MCH will differ depending on system configuration and motherboard layout. This section defines operating environment boundary conditions that are typical for ATX and BTX form factors. The system designer should perform analysis on the platform operating environment to assess any impact to thermal solution selection.
4.1.1 ATX Form Factor Operating Environment
In ATX platforms, an airflow speed of 0.76 m/s [150 lfm] is assumed to be present 25 mm [1 in] in front of the heatsink air inlet side of the attached reference thermal solution. The system integrator should note that board layout may be such that there will not be 25mm [1in] between the processor heatsink and the (G)MCH. The potential for increased airflow speeds may be realized by ensuring that airflow from the processor heatsink fan exhausts in the direction of the (G)MCH heatsink. This can be achieved by using a heatsink providing omni directional airflow, such as a radial fin or “X” pattern heatsink. Such heatsinks can deliver airflow to both the (G)MCH and other areas like the voltage regulator, as shown in Figure 5. In addition, the (G)MCH board placement should ensure that the (G)MCH heatsink is within the air exhaust area of the processor heatsink.
Note that heatsink orientation alone does not ensure that 0.76 m/s [150 lfm] airflow speed will be achieved. The system integrator should use analytical or experimental means to determine whether a system design provides adequate airflow speed for a particular (G)MCH heatsink.
The local ambient air temperature, TA, at the (G)MCH heatsink in an ATX platform is assumed to be 47 °C. The thermal designer must carefully select the location to measure airflow to get a representative sampling. These environmental assumptions are based on a 35 °C system external temperature measured at sea level.
Reference Thermal Solution
20 Thermal and Mechanical Design Guidelines
Figure 5. Processor Heatsink Orientation to Provide Airflow to (G)MCH Heatsink on an ATX Platform
Proc_HS_Orient_ATX
Airflow Direction
Airflow
Direction
Airflow Direction
Airf
low
Dire
ctio
n
Airflow Direction
Airflow
Direction
Airflow Direction
Airf
low
Dire
ctio
n
(G)MCH Heatsink
TOP VIEW
Omi Directional FlowProcessor Heatsink(Fan Not Shown)
Other methods exist for providing airflow to the (G)MCH heatsink, including the use of system fans and/or ducting, or the use of an attached fan (active heatsink).
4.1.2 Balanced Technology Extended (BTX) Form Factor Operating Environment
The operating environment for the (G)MCH in typical BTX systems has not been profiled. This section provides operating environment conditions based on what has been exhibited on the Intel micro-BTX reference design. On a BTX platform, the (G)MCH obtains in-line airflow directly from the processor thermal module. Since the processor thermal module provides lower inlet temperature airflow to the processor, reduced inlet ambient temperatures are also often seen at the (G)MCH as compared to ATX. An example of how airflow is delivered to the (G)MCH on a BTX platform is shown in Figure 6.
The local ambient air temperature, TA, at the (G)MCH heatsink in the Intel micro-BTX reference design is predicted to be ~45 °C. The thermal designer must carefully select the location to measure airflow to get a representative sampling. These environmental assumptions are based on a 35 °C system external temperature measured at sea level.
Note: The local ambient air temperature is a projection based on anticipated power increases on a 2005 platform and may be subject to change in future revisions of this document.
Reference Thermal Solution
Thermal and Mechanical Design Guidelines 21
Figure 6. Processor Heatsink Orientation to Provide Airflow to (G)MCH Heatsink on a Balanced Technology Extended (BTX) Platform
Top View
Balanced TechnologyExtended (BTX) ThermalModule Assembly Over
Processor(G)MCH
Airflow Direction
Proc_HS_Orient
4.2 Mechanical Design Envelope
The motherboard component keep-out restrictions for the (G)MCH on an ATX platform are included in Appendix B, Figure 10. The motherboard component keep-out restrictions for the (G)MCH on a BTX platform are included in Figure 11.
System integrators should ensure no board or chassis components would intrude into the volume occupied by the (G)MCH thermal solution.
4.3 Thermal Solution Assembly
The reference thermal solution for the (G)MCH for an ATX platform is shown in Figure 7 and Appendix B and is an aluminum extruded heatsink that uses two ramp retainers, a wire preload clip, and four custom motherboard anchors. The heatsink is attached to the motherboard by assembling the anchors into the board, placing the heatsink over the (G)MCH and anchors at each of the corners, and securing the plastic ramp retainers through the anchor loops before snapping each retainer into the fin gap. The assembly is then sent through the wave process. Post wave, the wire preload clip is assembled using the hooks on each of the ramp retainers. The clip provides the mechanical preload to the package. A thermal interface material (Chomerics* T710) is pre-applied to the heatsink bottom over an area that contacts the package die.
The reference thermal solution for the (G)MCH for a BTX platform is shown in Figure 8. The heatsink is aluminum extruded and uses a Z-clip for attach. The clip is secured to the system motherboard via two solder-down anchors around the (G)MCH. The clip helps to provide a mechanical preload to the package via the heatsink. A thermal interface material (Chomerics* T710) is pre-applied to the heatsink bottom over an area in contact with the package die.
The ATX reference thermal solution differs from the BTX reference solution because a BTX platform requires a Support and Retention Mechanism (SRM) that helps to meet the mechanical requirements listed in Table 4.
Reference Thermal Solution
22 Thermal and Mechanical Design Guidelines
Figure 7. ATX GMCH Heatsink Installed on Board
Reference Thermal Solution
Thermal and Mechanical Design Guidelines 23
Figure 8. Balanced Technology Extended (BTX) GMCH Heatsink Installed on Board
Reference Thermal Solution
24 Thermal and Mechanical Design Guidelines
4.4 Environmental Reliability Requirements
The environmental reliability requirements for the reference thermal solution are shown in Table 4. These should be considered as general guidelines. Validation test plans should be defined by the user based on anticipated use conditions and resulting reliability requirements.
Table 4. Reference Thermal Solution Environmental Reliability Requirements
Test1 Requirement Pass/Fail Criteria2
Mechanical Shock
• 3 drops for + and - directions in each of 3 perpendicular axes (i.e., total 18 drops).
• Profile: 50 G trapezoidal waveform, 11 ms duration, 4.3 m/s [170 in/s] minimum velocity change.
• Setup: Mount sample board on test fixture. Include 550 g processor heatsink.
Visual\Electrical Check
Random Vibration
• Duration: 10 min/axis, 3 axes
• Frequency Range: 5 Hz to 500 Hz
• Power Spectral Density (PSD) Profile: 3.13 g RMS
Visual/Electrical Check
Thermal Cycling
• -40 °C to +85 °C, 900 cycles Thermal Performance
Unbiased Humidity
• 85 % relative humidity / 55 °C, 500 hours Visual Check
NOTES: 1. The above tests should be performed on a sample size of at least 12 assemblies from 3
different lots of material. 2. Additional Pass/Fail Criteria may be added at the discretion of the user.
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Enabled Suppliers
Thermal and Mechanical Design Guidelines 25
Appendix A Enabled Suppliers
Current suppliers for the Intel® 945G/945GZ/945GC/945P/945PL Express chipset (G)MCH reference thermal solution are listed in Table 5 and Table 6.
Table 5. (G)MCH ATX Intel Reference Heatsink Enabled Suppliers
Supplier Intel Part Number
Vendor Part Number
Contact Information
CCI (Chaun Choung Technology Corp)
C85366-001 (heatsink)
C85370-001 (ramp
retainer)
C85373-001 (wire clip)
00C863501A
334C863501A
334C863502A
Monica Chih - +886 (-2) -29952666 [email protected]
Harry Lin - (714) 739-5797 [email protected]
WiesonElectronic Co. C85376-001
(anchor) G2100C888-143 Rick Lin - +886 (-2) -
26471896 ext.6342 [email protected]
Foxconn/HonHai Precision
C85366-001 (heatsink)
C85370-001 (ramp
retainer)
C85373-001 (wire clip)
2Z802-016
3EE77-002
3KS02-066
Jack Chen – (714) 626-1233
Foxconn/HonHai Precision
C85376-001 (anchor)
2Z802-015 Jack Chen – (714) 626-1233
Note: These vendors and devices are listed by Intel as a convenience to Intel's general customer base, but Intel does not make any representations or warranties whatsoever regarding quality, availability, reliability, functionality, or compatibility of these devices. This list and/or these devices may be subject to change without notice.
Enabled Suppliers
26 Thermal and Mechanical Design Guidelines
Table 6. (G)MCH Balanced Technology Extended (BTX) Intel Reference Heatsink Enabled Suppliers
Supplier Intel Part Number
Vendor Part Number
Contact Information
CCI (Chaun Choung
Technology Corp.)
C57359-001 00C863401A Monica Chih - +886 (-2) -29952666 [email protected]
Harry Lin - (714) 739-5797 [email protected]
AVC (Asia Vital Components)
C57359-001 S909700001 David Chao - +886 (-2) -2299-6930 x619
Foxconn/HonHai Precision
C57359-001 2Z802-010 Jack Chen – (714) 626-1233
§
Mechanical Drawings
Thermal and Mechanical Design Guidelines 27
Appendix B Mechanical Drawings
The following table lists the mechanical drawings available in this document.
Drawing Name Page Number
(G)MCH Package Drawing 28
(G)MCH Component Keep-Out Restrictions for ATX Platforms 29
(G)MCH Component Keep-Out Restrictions for Balanced Technology Extended (BTX) Platforms
30
(G)MCH Reference Heatsink for ATX Platforms – Sheet 1 31
(G)MCH Reference Heatsink for ATX Platforms – Sheet 2 32
(G)MCH Reference Heatsink for ATX Platforms – Anchor 33
(G)MCH Reference Heatsink for ATX Platforms – Ramp Retainer Sheet 1 34
(G)MCH Reference Heatsink for ATX Platforms – Ramp Retainer Sheet 2 35
(G)MCH Reference Heatsink for ATX Platforms – Wire Preload Clip 36
. (G)MCH Reference Heatsink for Balanced Technology Extended (BTX) Platforms
37
(G)MCH Reference Heatsink for Balanced Technology Extended (BTX) Platforms – Clip
38
(G)MCH Reference Heatsink for Balanced Technology Extended (BTX) Platforms – Heatsink Assembly
39
NOTE: Unless otherwise specified, all figures in this appendix are dimensioned in millimeters. Dimensions shown in brackets are in inches.
Mech
an
ical D
raw
ing
ss
28
Ther
mal
and M
echan
ical
Des
ign G
uid
elin
es
Fig
ure
9.
(G)M
CH
Pack
ag
e D
raw
ing
Mech
an
ical D
raw
ing
s
Ther
mal
and M
echan
ical
Des
ign G
uid
elin
es
29
Fig
ure
10
. (G
)MC
H C
om
po
nen
t K
eep
-Ou
t R
est
rict
ion
s fo
r A
TX
Pla
tfo
rms
8X
PLA
TED
THRU
HOL
E8X
1.
42[.0
56] T
RACE
KEE
POUT
0.97
.038
[]
4 .157
5[
]
74 2.91
34[
]
47 1.85
[]
60.9
22.
398
[]
4X 8
.76 .345
[]
4X 8
.76 .345
[]
4X 1
.84
.072
[]
4X 5
.08
.200
[]
81 3.18
9[
]
60.6 2.38
6[
]
26.7
91.
055
[]
45.7
91.
803
[]
135
48 1.89
0[
]
67 2.63
8[
]
DETA
IL A
NO C
OMPO
NENT
S TH
IS A
REA
MAX
1.27
[.05
0]
COMP
ONEN
T HE
IGHT
(NON
-MCH
COM
PONE
NTS)
NOTE
S:1
HOL
E PL
ACEM
ENT
FABR
ICAT
ION
TO
LERA
NCE
PER
INTE
L 45
4979
, CLA
SS 1
,2,3
2. H
EATS
INK
COMP
ONEN
T HE
IGHT
NOT
TO
EXCE
ED
38
.1MM
ABO
VE M
OTHE
RBOA
RD S
URFA
CE.
COMP
ONEN
T CE
NTER
NORT
H
EAST
MAX
25 [1
.000
]CO
MPON
ENT
HEIG
HT
DETA
IL
ASC
ALE
8
Mech
an
ical D
raw
ing
ss
30
Ther
mal
and M
echan
ical
Des
ign G
uid
elin
es
Fig
ure
11
. (G
)MC
H C
om
po
nen
t K
eep
-Ou
t R
est
rict
ion
s fo
r B
ala
nce
d T
ech
no
log
y E
xte
nd
ed
(B
TX
) P
latf
orm
s
4X
8.76 .34
5[
]
4X
4.19 .16
5[
]
4X
1.85 .07
3[
]
4X
5.08 .20
0[
]
4X
2.1 .083
[]
8X
PLAT
ED TH
RU HO
LE0.9
7.03
8[
]
48.26 1.9
00[
]
55.88 2.2
00[
]
2X
3.3 .130
[]
2X
2.29 .09
0[
]
2X
2.54 .10
0[
]
2X
5.72 .22
5[
]
61.98 2.4
40[
]
46.48 1.8
30[
]B
8X
1.42[.0
56] TR
ACE K
EEPO
UT
DETA
IL A
NO CO
MPON
ENTS
THIS A
REA
MAX 1
.27[.05
0] COM
PONE
NT HE
IGHT
DETA
IL B
MAX 1
.78[.07
0] COM
PONE
NT HE
IGHT
NOTE
S:1
. HOL
E PLA
CEME
NT FA
BRICA
TION
TOL
ERAN
CE PE
R INT
EL 45
4979
, CLA
SS 1,2
,32. H
EATS
INK CO
MPON
ENT H
EIGHT
NOT T
O EXC
EED
26.9
MM AB
OVE M
OTHE
RBOA
RD SU
RFAC
E.
COMP
ONEN
T CEN
TER
SCAL
E 4
DETA
IL
ASC
ALE
8
DETA
IL
BSC
ALE
5
Mech
an
ical D
raw
ing
s
Ther
mal
and M
echan
ical
Des
ign G
uid
elin
es
31
Fig
ure
12
. (G
)MC
H R
efe
ren
ce H
eats
ink f
or
ATX
Pla
tfo
rms
– S
heet
1
2X
58.
6 2.30
7[
]
2X 8
0 3.15
0[
]
47 1.85
0[
]
36 1.41
7[
]
8X 2
.70.
15.1
06.0
05[
]7X
EQ
UAL
SPAC
ING
TYP
6
3.75
0.15
.148
.005
[]
TYP
35.5 1.
398
[]
2X
6
480.
151.
890
.005
[]
2X
659
.28
0.15
2.33
4.0
05[
]
4 .157
[]
16X
1.2
0.15
.047
.005
[]
14X
EQUA
LSP
ACIN
G
30.5 1.
201
[]
NOTE
S: 1.
THI
S DR
AWIN
G T
O B
E US
ED IN
CO
NJUN
CTIO
N W
ITH
SUPP
LIED
3D
DA
TABA
SE F
ILE.
ALL
DIM
ENSI
ONS
AND
TO
LERA
NCES
ON
THIS
DR
AWIN
G T
AKE
PREC
EDEN
CE O
VER
SUPP
LIED
FIL
E AN
D AR
E
APPL
ICAB
LE A
T PA
RT F
REE,
UNC
ONS
TRAI
NED
STAT
E UN
LESS
IN
DICA
TED
OTH
ERW
ISE.
2. T
OLE
RANC
ES O
N DI
MEN
SIO
NED
AND
UNDI
MEN
SIO
NED
FE
ATUR
ES U
NLES
S O
THER
WIS
E SP
ECIF
IED:
DI
MEN
SIO
NS A
RE IN
MIL
LIM
ETER
S.
TOLE
RANC
ES:
LI
NEAR
0
.25
AN
GUL
AR
13.
MAT
ERIA
L: 6
063-
T5 A
LUM
INUM
4. F
INIS
H: N
ONE
5 M
ARK
PART
WIT
H IN
TEL
P/N
AND
REVI
SIO
N AP
PRO
X
WHE
RE S
HOW
N PE
R IN
TEL
MAR
KING
STA
NDAR
D 16
4997
6 C
RITI
CAL
TO F
UNCT
ION
DIM
ENSI
ON
7. E
DGES
SHO
WN
AS S
HARP
R 0
.1 M
AX.
8. T
OO
LING
REQ
UIRE
D TO
MAK
E TH
IS P
ART
SHAL
L BE
THE
PR
OPE
RTY
OF
INTE
L, A
ND S
HALL
BE
PERM
ANEN
TLY
MAR
KED
W
ITH
INTE
L'S N
AME
AND
APPR
OPR
IATE
PAR
T NU
MBE
R.9.
ALL
SEC
OND
ARY
UNIT
DIM
ENSI
ONS
ARE
FO
R RE
FERE
NCE
ONL
Y.10
. ALL
DIM
ENSI
ONS
SHO
WN
SHAL
L BE
MEA
SURE
D FO
R FA
I11
. REM
OVE
ALL
BUR
RS O
R SH
ARP
EDG
ES A
ROUN
D PE
RIM
ETER
O
F PA
RT. S
HARP
NESS
OF
EDG
ES S
UBJE
CT T
O H
ANDL
ING
ARE
REQ
UIRE
D TO
MEE
T UL
1439
TES
T.
SEE
DETA
IL
A
SEE
DETA
IL
B
FULL
RO
UND
SEE
DETA
IL
A
SEE
DETA
IL
B
Mech
an
ical D
raw
ing
ss
32
Ther
mal
and M
echan
ical
Des
ign G
uid
elin
es
Fig
ure
13
. (G
)MC
H R
efe
ren
ce H
eats
ink f
or
ATX
Pla
tfo
rms
– S
heet
2
2X
6
0.6 .02
4[
]
TYP
6
2.75
0.1
.108
.003
[]
6
1.5
0.15
.059
.005
[]
6
6.72
0.15
.265
.005
[]
R0.5 .0
20[
]
2X 1
5 .591
[]
16 .630
[]
25.5 1.00
4[
]
66 2.59
84[
]
TYP
4 .157
5[
]
TYP
135
TYP
R1 .0
39[
]
TYP
DETA
IL
ASC
ALE
5
TYP.
NO B
URR
ALL
ARO
UND
DETA
IL
BSC
ALE
5
BOTT
OM
VIE
W
CHOM
ERIC
S:69
-12-
2235
0-T7
10
4X 4
5 X
1 [.
039]
5
0.1
[.003
]
Mech
an
ical D
raw
ing
s
Ther
mal
and M
echan
ical
Des
ign G
uid
elin
es
33
Fig
ure
14
. (G
)MC
H R
efe
ren
ce H
eats
ink f
or
ATX
Pla
tfo
rms
– A
nch
or
6
5.21
0.12
.205
.004
[]
4X
6
7.83
0.12
.308
.004
[]
2X 1
0.13
0.12
.399
.004
[]
2X
6
0.77
0.1
.030
.003
[]
7.62
0.15
.300
.005
[]
2.5
0.15
.098
.005
[]
0.64
0 -0.0
7.0
25+.
000
-.002
[]
6
5.08
0.12
.200
.004
[]
2X 3
.94
0.15
.155
.005
[]
2X 4
52
2X 4
.157
[]
2X 0
.50.
05.0
20.0
01[
]2X
0.7
5.0
30[
]
0.64
0 -0.0
7.0
25+.
000
-.002
[]
NOTE
S: 1.
THI
S DR
AWIN
G T
O B
E US
ED IN
CO
NJUN
CTIO
N W
ITH
SUPP
LIED
3D
DA
TABA
SE F
ILE.
ALL
DIM
ENSI
ONS
AND
TO
LERA
NCES
ON
THIS
DR
AWIN
G T
AKE
PREC
EDEN
CE O
VER
SUPP
LIED
FIL
E AN
D AR
E
APPL
ICAB
LE A
T PA
RT F
REE,
UNC
ONS
TRAI
NED
STAT
E UN
LESS
IN
DICA
TED
OTH
ERW
ISE.
2. T
OLE
RANC
ES O
N DI
MEN
SIO
NED
AND
UNDI
MEN
SIO
NED
FE
ATUR
ES U
NLES
S O
THER
WIS
E SP
ECIF
IED:
DI
MEN
SIO
NS A
RE IN
MIL
LIM
ETER
S.
FOR
FEAT
URE
SIZE
S <
10M
M: L
INEA
R .0
7
FOR
FEAT
URE
SIZE
S >
10M
M: L
INEA
R .0
8
ANG
LES:
0
.53.
MAT
ERIA
LS:
I
NSUL
ATO
R: P
OLY
CARB
ONA
TE T
HERM
OPL
ASTI
C, U
L 94
V-0,
BLA
CK (7
39)
(
REF.
GE
LEXA
N 34
12R-
739)
C
ONT
ACT:
BRA
SS O
R EQ
UIVA
LENT
UPO
N IN
TEL
APPR
OVA
L
CO
NTAC
T FI
NISH
: .00
0050
u" M
IN. N
ICKE
L UN
DER
PLAT
ING
;
SO
LDER
TAI
LS, 0
.000
100"
MIN
TIN
ONL
Y SO
LDER
(LEA
D FR
EE).
5. M
ARK
WIT
H IN
TEL
P/N
AND
REVI
SIO
N PE
R IN
TEL
MAR
KING
STAN
DARD
164
997;
PER
SEC
3.8
(PO
LYET
HYLE
NE B
AG)
6 C
RITI
CAL
TO F
UNCT
ION
DIM
ENSI
ON
7. A
LL D
IMEN
SIO
NS S
HOW
N SH
ALL
BE M
EASU
RED
FOR
FAI
8. N
OTE
REM
OVE
D9.
DEG
ATE:
FLU
SH T
O 0
.35
BELO
W S
TRUC
TURA
L TH
ICKN
ESS
(
GAT
E W
ELL
OR
GAT
E RE
CESS
ACC
EPTA
BLE)
10. F
LASH
: 0.1
5 M
AX.
11. S
INK:
0.2
5 M
AX.
12. E
JECT
OR
MAR
KS: F
LUSH
TO
-0.2
513
. PAR
TING
LIN
E M
ISM
ATCH
NO
T TO
EXC
EED
0.25
.14
. EJE
CTIO
N PI
N BO
SSES
, GAT
ING
, AND
TO
OLI
NG IN
SERT
S RE
QUI
RE
INTE
L'S A
PPRO
VAL
PRIO
R TO
TO
OL
CONS
TRUC
TIO
N.
A
LL E
JECT
ION
PIN
BOSS
ES A
ND G
ATE
FEAT
URES
SHO
WN
A
RE F
OR
REFE
RENC
E O
NLY.
15. E
DGES
SHO
WN
AS S
HARP
R 0
.1 M
AX.
16. T
OO
LING
REQ
UIRE
D TO
MAK
E TH
IS P
ART
SHAL
L BE
THE
P
ROPE
RTY
OF
INTE
L, A
ND S
HALL
BE
PERM
ANEN
TLY
MAR
KED
W
ITH
INTE
L'S N
AME
AND
APPR
OPR
IATE
PAR
T NU
MBE
R.17
. ALL
SEC
OND
ARY
UNIT
DIM
ENSI
ONS
ARE
FO
R RE
FERE
NCE
ONL
Y.
45 X
0.2
MIN
2X C
HAM
FER
ALL
ARO
UND
CONT
ACT
TO IN
SULA
TOR
INTE
RFAC
EAT
SUP
PLIE
RS O
PTIO
N
Mech
an
ical D
raw
ing
ss
34
Ther
mal
and M
echan
ical
Des
ign G
uid
elin
es
Fig
ure
15
. (G
)MC
H R
efe
ren
ce H
eats
ink f
or
ATX
Pla
tfo
rms
– R
am
p R
eta
iner
Sh
eet
1
2X 3
1.1 1.22
5[
]
6
20.
05.0
79.0
01[
]
661
.51
2.42
2[
]
6
70.4
92.
775
[]
2X 2
7.95 1.10
0[
]
3 .118
[]
NOTE
S: 1.
THI
S DR
AWIN
G T
O B
E US
ED IN
CO
NJUN
CTIO
N W
ITH
SUPP
LIED
3D
DA
TABA
SE F
ILE.
ALL
DIM
ENSI
ONS
AND
TO
LERA
NCES
ON
THIS
DR
AWIN
G T
AKE
PREC
EDEN
CE O
VER
SUPP
LIED
FIL
E AN
D AR
E
APPL
ICAB
LE A
T PA
RT F
REE,
UNC
ONS
TRAI
NED
STAT
E UN
LESS
IN
DICA
TED
OTH
ERW
ISE.
2. T
OLE
RANC
ES O
N DI
MEN
SIO
NED
AND
UNDI
MEN
SIO
NED
FE
ATUR
ES U
NLES
S O
THER
WIS
E SP
ECIF
IED:
DI
MEN
SIO
NS A
RE IN
MIL
LIM
ETER
S.
FOR
FEAT
URE
SIZE
S <
10M
M: L
INEA
R .0
7
FOR
FEAT
URE
SIZE
S BE
TWEE
N 10
AND
25
MM
: LIN
EAR
.08
FO
R FE
ATUR
E SI
ZES
BETW
EEN
25 A
ND 5
0 M
M: L
INEA
R .1
0
FOR
FEAT
URE
SIZE
S >
50M
M: L
INEA
R .1
8
ANG
LES:
0
.53.
MAT
ERIA
L:
A
) TYP
E: E
NVIR
ONM
ENTA
LLY
COM
PLIA
NT T
HERM
OPL
ASTI
C O
R
E
QUI
VALE
NT U
PON
INTE
L AP
PRO
VAL
(REF
. GE
LEXA
N 50
0ECR
-739
)
B) C
RITI
CAL
MEC
HANI
CAL
MAT
ERIA
L PR
OPE
RTIE
S
F
OR
EQUI
VALE
NT M
ATER
IAL
SELE
CTIO
N:
T
ENSI
LE Y
IELD
STR
ENG
TH (A
STM
D63
8) >
57
MPa
TEN
SILE
ELO
NGAT
ION
AT B
REAK
(AST
M D
638)
>=
46%
FLE
XURA
L M
ODU
LUS
(AST
M D
638)
311
6 M
Pa
10%
S
OFT
ENIN
G T
EMP
(VIC
AT, R
ATE
B): 1
54C
C
) CO
LOR:
APP
ROXI
MAT
ING
BLA
CK, (
REF
GE
739)
D
) REG
RIND
: 25%
PER
MIS
SIBL
E.
E) V
OLU
ME
- 1.7
3e+0
3 CU
BIC-
MM
(REF
)
W
EIG
HT -
2.16
GRA
MS
(REF
) 5
MAR
K PA
RT W
ITH
INTE
L P/
N, R
EVIS
ION,
CAV
ITY
NUM
BER
AN
D DA
TE C
ODE
APP
ROX
WHE
RE S
HOW
N PE
R IN
TEL
MAR
KING
STAN
DARD
164
997
6 C
RITI
CAL
TO F
UNCT
ION
DIM
ENSI
ON
7. A
LL D
IMEN
SIO
NS S
HOW
N SH
ALL
BE M
EASU
RED
FOR
FAI
8. N
OTE
REM
OVE
D9.
DEG
ATE:
FLU
SH T
O 0
.35
BELO
W S
TRUC
TURA
L TH
ICKN
ESS
(
GAT
E W
ELL
OR
GAT
E RE
CESS
ACC
EPTA
BLE)
10. F
LASH
: 0.1
5 M
AX.
11. S
INK:
0.2
5 M
AX.
12. E
JECT
OR
MAR
KS: F
LUSH
TO
-0.2
513
. PAR
TING
LIN
E M
ISM
ATCH
NO
T TO
EXC
EED
0.25
.14
. EJE
CTIO
N PI
N BO
SSES
, GAT
ING
, AND
TO
OLI
NG IN
SERT
S RE
QUI
RE
INTE
L'S A
PPRO
VAL
PRIO
R TO
TO
OL
CONS
TRUC
TIO
N.
A
LL E
JECT
ION
PIN
BOSS
ES A
ND G
ATE
FEAT
URES
SHO
WN
A
RE F
OR
REFE
RENC
E O
NLY.
15. E
DGES
SHO
WN
AS S
HARP
R 0
.1 M
AX.
16. T
OO
LING
REQ
UIRE
D TO
MAK
E TH
IS P
ART
SHAL
L BE
THE
P
ROPE
RTY
OF
INTE
L, A
ND S
HALL
BE
PERM
ANEN
TLY
MAR
KED
W
ITH
INTE
L'S N
AME
AND
APPR
OPR
IATE
PAR
T NU
MBE
R.17
. ALL
SEC
OND
ARY
UNIT
DIM
ENSI
ONS
ARE
FO
R RE
FERE
NCE
ONL
Y.
SEE
DETA
IL
C
5
SEE
DETA
IL
ASE
E DE
TAIL
A
SEE
DETA
IL
C
Mech
an
ical D
raw
ing
s
Ther
mal
and M
echan
ical
Des
ign G
uid
elin
es
35
Fig
ure
16
. (G
)MC
H R
efe
ren
ce H
eats
ink f
or
ATX
Pla
tfo
rms
– R
am
p R
eta
iner
Sh
eet
2
B
B
6
1.75 .0
69[
]
2.75 .1
08[
]
6
0.5 .0
20[
]
4 .157
[]
6
5.56 .2
19[
]
2X
6
2.9 .1
14[
]
6.4 .2
52[
]
6
3.15 .1
24[
]6
4.75
.187
[]
3 .118
[]
5.2 .2
05[
]
1.19 .0
47[
]
6.55 .2
58[
]
2X
6
5.76 .2
27[
]
2X D
ETAI
L
ASC
ALE
20
DETA
IL
CSC
ALE
10
SECT
ION
B-B
Mech
an
ical D
raw
ing
ss
36
Ther
mal
and M
echan
ical
Des
ign G
uid
elin
es
Fig
ure
17
. (G
)MC
H R
efe
ren
ce H
eats
ink f
or
ATX
Pla
tfo
rms
– W
ire P
relo
ad
Cli
p
A
A
AA
46.6
0.5
1.835
.019
[]
2X 9
0
TYP
R1.8 .0
71[
]
19.3
0.5
.760
.019
[]
27.3
0.5
1.07
5.0
19[
]
4
27.7 1.
090
[]
61.7
40.
52.
431
.019
[]
37.0
61.
459
[]
2.65 .1
04[
]
NOTE
S: 1.
THI
S DR
AW
ING
TO
BE
USED
IN C
OR
RELA
TIO
N W
ITH
SUPP
LIE
D 3D
DA
TABA
SE F
ILE.
ALL
DIM
ENSI
ONS
AND
TO
LERA
NCES
ON
THI
S
DRAW
ING
TAK
E PR
ECED
ENC
E O
VER
SU
PPLI
ED F
ILE
AND
ARE
APPL
ICAB
LE A
T P
ART
FREE
, UN
CONS
TRAI
NED
STAT
E UN
LESS
IN
DIC
ATED
OT
HERW
ISE
.2.
TO
LERA
NCE
S O
N D
IMEN
SIO
NED
AND
UNDI
MEN
SIO
NED
FE
ATUR
ES U
NLES
S O
THER
WIS
E SP
ECIF
IED:
DI
MEN
SIO
NS A
RE IN
MIL
LIM
ETE
RS.
TO
LERA
NCES
: LIN
EAR
0
.25
AN
GLE
S:
13.
MA
TERI
AL:
A)
TYP
E: A
STM
A22
8 M
USI
C W
IRE
1.
8 0
.1M
M
4
P
LATI
NG: E
LECT
RO-L
ESS
NICK
EL O
R EQ
UIVA
LENT
UPO
N
IN
TEL
APP
ROVA
L.
B) C
RITI
CAL
MEC
HANI
CAL
MAT
ERI
AL P
ROPE
RTIE
S
F
OR
EQ
UIVA
LENT
MAT
ERIA
L SE
LECT
ION
:
T
ENSI
LE Y
IELD
STR
ENG
TH (A
STM
D63
8) >
965
MPa
FLE
XUR
AL M
OD
ULUS
(AS
TM D
638)
210
GP
a 10
%
4 C
RITI
CAL
TO
FU
NCTI
ON
DIM
ENSI
ON
5. M
ARK
WIT
H IN
TEL
P/N
AND
REVI
SIO
N P
ER IN
TEL
MAR
KING
STAN
DARD
164
997;
PER
SEC
3.8
(PO
LYET
HYLE
NE B
AG)
6. R
EMO
VE A
LL S
HAR
P ED
GE
S AN
D BU
RRS.
7. A
LL D
IMEN
SIO
NS S
HOW
N SH
ALL
BE M
EASU
RED
FO
R FA
I8.
ALL
SEC
OND
ARY
UNIT
DIM
ENSI
ONS
ARE
FO
R R
EFER
ENC
E O
NLY.
FAR
SID
E
FA
R S
IDE
SECT
ION
A-A
A2 A3
A2 A3
A1
A2
A3
Mech
an
ical D
raw
ing
s
Ther
mal
and M
echan
ical
Des
ign G
uid
elin
es
37
Fig
ure
18
. (G
)MC
H R
efe
ren
ce H
eats
ink f
or
Bala
nce
d T
ech
no
log
y E
xte
nd
ed
(B
TX
) P
latf
orm
s
A24
.2 .953
[]
47.88 1.8
85[
]15
X EQ
UAL S
PACE
S(
)1.9
4 .08[]
2X 1
.17 .046
[]
3.40.2
.134
.007
[]
()
15 .591
[]
19 .748
[]
19 .748
[]
2X 1
.2 .047
[]
2X 7
.250.2
.285
.007
[]
30.2
.118
.007
[]
()
55.88 2.2
0[
]C 16
X 1.1
7 .046
[]
()
33 1.30
[]
B
30.2
5.11
8.00
9[
]
NOTE
S:1.
PROC
UREM
ENT
SPEC
IFIC
ATIO
N A0
2160
SHA
LL A
PPLY
2. RE
MOV
E AL
L BUR
RS A
ND S
HARP
EDG
ES3
. CRI
TICA
L TO
FUNC
TION
DIM
ENSI
ONS
3R0
TO
0.5[.0
20]
3
FULL
RR0
TO
FULL
0.08 [
.003]
0.25 [
.009]
BC
Mech
an
ical D
raw
ing
ss
38
Ther
mal
and M
echan
ical
Des
ign G
uid
elin
es
Fig
ure
19
. (G
)MC
H R
efe
ren
ce H
eats
ink f
or
Bala
nce
d T
ech
no
log
y E
xte
nd
ed
(B
TX
) P
latf
orm
s –
Cli
p
A
A
A
A
BB
2X
9027
.3 1.075
[]
47.36 1.8
65[
]
R
TYP
1.3 .051
[]
8.87
1.25
.349
.049
[]
4X R
1.8 .071
[]
3.8 .150
[]
62.6
12.4
65.03
9[
]
25.14 .99
0[
]
WIRE
TERM
INATIO
N WI
THIN
10.0
4.1 .161
[]
2X
26.16 1.0
30[
]
35.3 1.3
90[
]
()
1.80 .07
1[
]
()
3.80 .15
0[
]
()
10.27 .40
4[
]
NOTE
S:1. R
EMOV
E ALL
SHAR
P EDG
ES AN
D BUR
RS2. M
ATER
IAL: AS
TM A2
28 MU
SIC W
IRE
1.8 MM
STOC
K3. T
OTAL
WIRE
LENG
TH = 1
21.9 M
M4
CRITIC
AL TO
FUNC
TION D
IMENS
IONS
5. PLA
TING:
ELEC
TRO-
LESS
NICK
EL
4
4
FAR S
IDE
FAR S
IDE
FAR S
IDE
VIEW
A
SEE D
ETAIL
C
SECT
ION
B-BSC
ALE
10:1
DETA
IL C
SCAL
E 8:1
A3
A1
A2
A1
A3
A2
Mech
an
ical D
raw
ing
s
Ther
mal
and M
echan
ical
Des
ign G
uid
elin
es
39
Fig
ure
20
. (G
)MC
H R
efe
ren
ce H
eats
ink f
or
Bala
nce
d T
ech
no
log
y E
xte
nd
ed
(B
TX
) P
latf
orm
s –
Heats
ink A
ssem
bly
()
55.8
82.
200
[]
C
()
33 1.29
9[
]
B
()
19 .748
[]
()
19 .748
[]
NOTE
S:1. T
HIS DR
AWING
TO BE
USED
IN CO
NJUN
CTION
WITH
SUPP
LIED 3
D D
ATAB
ASE F
ILE. A
LL DIM
ENSIO
NS AN
D TOL
ERAN
CES O
N THIS
DRA
WING
TAKE
PREC
EDEN
CE OV
ER SU
PPLIE
D FILE
AND A
RE
APP
LICAB
LE AT
PART
FREE
, UNC
ONST
RAINE
D STA
TE UN
LESS
INDIC
ATED
OTHE
RWISE
.2. F
INISH
: NON
E3. A
LL SE
COND
ARY U
NIT DI
MENS
IONS A
RE FO
R REF
EREN
CE ON
LY. T
OLER
ANCE
S S
HALL
BE CA
LCUL
ATED
FROM
PRIM
ARY U
NITS T
O AVO
ID TR
UNCA
TION E
RROR
S.4. I
TEMS
WITH
OUT I
NTEL
PART
NUMB
ER SH
ALL B
E MAN
AGED
AND
PROC
URED
BY SU
PPLIE
R5
.ASSE
MBLY
TO BE
MAR
KED W
ITH IN
TEL P
/N AP
PROX
. WHE
RE SH
OWN.
6. ATT
ACH T
HERM
AL IN
TERF
ACE M
ATER
IAL W
HERE
SHOW
N. RE
MOVA
BLE P
ROTE
CTIVE
BAR
RIER A
PPLIE
D OVE
R INT
ERFA
CE M
ATER
IAL.
0.25
[.00
9]A
BC
1
2
3
5
