Integrated Dual RF Transmitter, Receiver, and Observation

Integrated Dual RF Transmitter, Receiver, and Observation Receiver

Data Sheet ADRV9009

Rev. B Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.

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FEATURES Dual transmitters Dual receivers Dual input shared observation receiver Maximum receiver bandwidth: 200 MHz Maximum tunable transmitter synthesis bandwidth:

450 MHz Maximum observation receiver bandwidth: 450 MHz Fully integrated fractional-N RF synthesizers Fully integrated clock synthesizer Multichip phase synchronization for RF LO and baseband

clocks JESD204B datapath interface Tuning range (center frequency): 75 MHz to 6000 MHz

APPLICATIONS 3G, 4G, and 5G TDD macrocell base stations TDD active antenna systems Massive multiple input, multiple output (MIMO) Phased array radar Electronic warfare Military communications Portable test equipment

GENERAL DESCRIPTION The ADRV9009 is a highly integrated, radio frequency (RF), agile transceiver offering dual transmitters and receivers, integrated synthesizers, and digital signal processing functions. The IC delivers a versatile combination of high performance and low power consumption demanded by 3G, 4G, and 5G macro cell time division duplex (TDD) base station applications.

The receive path consists of two independent, wide bandwidth, direct conversion receivers with state-of-the-art dynamic range. The device also supports a wide bandwidth, time shared observation path receiver (ORx) for use in TDD applications. The complete receive subsystem includes automatic and manual attenuation control, dc offset correction, quadrature error correction (QEC), and digital filtering, thus eliminating the need for these functions in the digital baseband. Several auxiliary functions, such as analog-to-digital converters (ADCs), digital-to-analog converters (DACs), and general-purpose inputs/outputs (GPIOs) for the power amplifier (PA), and RF front-end control are also integrated.

In addition to automatic gain control (AGC), the ADRV9009 also features flexible external gain control modes, allowing significant flexibility in setting system level gain dynamically.

The received signals are digitized with a set of four high dynamic range, continuous time Σ-Δ ADCs that provide inherent antialiasing. The combination of the direct conversion architecture, which does not suffer from out of band image mixing, and the lack of aliasing, relaxes the requirements of the RF filters when compared to traditional intermediate frequency (IF) receivers.

The transmitters use an innovative direct conversion modulator that achieves high modulation accuracy with exceptionally low noise.

The observation receiver path consists of a wide bandwidth, direct conversion receiver with state-of-the-art dynamic range.

The fully integrated phase-locked loop (PLL) provides high performance, low power, fractional-N RF frequency synthesis for the transmitter (Tx) and receiver (Rx) signal paths. An additional synthesizer generates the clocks needed for the converters, digital circuits, and the serial interface. A multichip synchronization mechanism synchronizes the phase of the RF local oscillator (LO) and baseband clocks between multiple ADRV9009 chips. Precautions are taken to provide the isolation required in high performance base station applications. All voltage controlled oscillators (VCOs) and loop filter components are integrated.

The high speed JESD204B interface supports up to 12.288 Gbps lane rates, resulting in two lanes per transmitter and a single lane per receiver in the widest bandwidth mode. The interface also supports interleaved mode for lower bandwidths, thus reducing the total number of high speed data interface lanes to one. Both fixed and floating point data formats are supported. The floating point format allows internal AGC to be invisible to the demodulator device.

The core of the ADRV9009 can be powered directly from 1.3 V regulators and 1.8 V regulators, and is controlled via a standard 4-wire serial port. Comprehensive power-down modes are included to minimize power consumption in normal use. The ADRV9009 is packaged in a 12 mm × 12 mm, 196-ball chip scale ball grid array (CSP_BGA).

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ADRV9009 Data Sheet

Rev. B | Page 2 of 127

TABLE OF CONTENTS Features .............................................................................................. 1

Applications ....................................................................................... 1

General Description ......................................................................... 1

Revision History ............................................................................... 2

Functional Block Diagram .............................................................. 4

Specifications ..................................................................................... 5

Current and Power Consumption Specifications ................... 14

Timing Diagrams ........................................................................ 15

Absolute Maximum Ratings .......................................................... 16

Reflow Profile .............................................................................. 16

Thermal Management ............................................................... 16

Thermal Resistance .................................................................... 16

ESD Caution ................................................................................ 16

Pin Configuration and Function Descriptions ........................... 17

Typical Performance Characteristics ........................................... 23

75 MHz to 525 MHz Band ........................................................ 23

650 MHz to 3000 MHz Band .................................................... 44

3400 MHz to 4800 MHz Band .................................................. 63

5100 MHz to 5900 MHz Band .................................................. 80

Transmitter Output Impedance ................................................ 95

Observation Receiver Input Impedance .................................. 95

Receiver Input Impedance......................................................... 96

Terminology .................................................................................... 97

Theory of Operation ...................................................................... 98

Transmitter .................................................................................. 98

Receiver........................................................................................ 98

Observation Receiver ................................................................. 98

Clock Input .................................................................................. 98

Synthesizers ................................................................................. 98

SPI ................................................................................................. 99

JTAG Boundary Scan ................................................................. 99

Power Supply Sequence ............................................................. 99

GPIO_x Pins ............................................................................... 99

Auxiliary Converters .................................................................. 99

JESD204B Data Interface .......................................................... 99

Applications Information ............................................................ 101

PCB Layout and Power Supply Recommendations ............. 101

PCB Material and Stackup Selection ..................................... 101

Fanout and Trace Space Guidelines ....................................... 103

Component Placement and Routing Guidelines ................. 104

RF and JESD204B Transmission Line Layout ...................... 110

Isolation Techniques Used on the ADRV9009-W/PCBZ ... 114

RF Port Interface Information ................................................ 116

Outline Dimensions ..................................................................... 127

Ordering Guide ........................................................................ 127

REVISION HISTORY 5/2019—Rev. A to Rev B. Replaced ADRV9009 Customer Card to ADRV9009-WPCBZ ..................................................... Throughout Changes to Features Section............................................................ 1 Changes to Figure 1 .......................................................................... 4 Changes to Specifications Section and Table 1 ............................. 5 Change to Figure 2 ......................................................................... 15 Changes to Table 3 and Thermal Resistance Section ................. 16 Changes to 75 MHz to 525 MHz Band Section, Figures and Captions ........................................................................................... 23 Deleted Figure 83 to Figure 85; Renumbered Sequentially ...... 34 Added Figure 78, Figure 79, and Figure 80; Renumbered Sequentially ..................................................................................... 35 Added Figure 90 .............................................................................. 37 Added Figure 125 to Figure 127 ................................................... 43 Changes to 650 MHz to 3000 MHz Band Section, Figures and Captions ........................................................................................... 44 Changes to 3400 MHz to 4800 MHz Band Section, Figures and Captions ........................................................................................... 63 Changes to 5100 MHz to 5900 MHz Band Section, Figures and Captions ........................................................................................... 80

Changes to Terminology Section ................................................. 97 Deleted Figure 432 ......................................................................... 98 Changes to Theory of Operation Section and Clock Input Section ................................................................................... 98 Changed Serial Peripheral Interface Section to SPI Section and AUX DAC_x Section to Auxiliary DAC x Section ......................... 99 Changes to Power Supply Sequence Section, GPIO_x Pins Section, Auxiliary DAC x Section, and JESD204B Data Interface Section ............................................................................. 99 Changes to Table 7 Title, Figure 430, and Figure 431................... 100 Changes to Overview Section, PCB Material and Stackup Selection Section, and Figure 432 Caption ............................... 101 Changes to Table 9 and Table 10 ................................................ 102 Changes to Fanout and Trace Space Guidelines Section ......... 103 Changes to Signals with Highest Routing Priority Section and Figure 434 ...................................................................................... 104 Change to Figure 435 Caption .................................................... 105 Changes to Signals with Second Routing Priority Section and Figure 436 ...................................................................................... 106 Changes to Figure 437 ................................................................. 107 Changes to Figure 438 ................................................................. 108


Data Sheet ADRV9009


Changes to Signals with Lowest Routing Priority Section and Figure 439 .......................................................................................109 Changes to RF Routing Guidelines Section and Figure 440 Caption ........................................................................110 Change to Figure 441 Caption .....................................................111 Changes to Transmitter Balun DC Feed Supplies Section .............................................................................112 Changes to Stripline Transmission Lines vs. Microstrip Transmission Lines Section .........................................................113 Moved Figure 444 to Isolation Techniques Used on the ADRV9009-W/PCBZ Section .....................................................114 Moved Figure 446 ..........................................................................115 Changes to Isolation Between JESD204B Lines Section ..........115 Changes to RF Port Interface Information Section ..................116

Deleted RF Port Interface Overview Section ............................ 117 Changes to Figure 448 Caption ................................................... 117 Moved Table 11 .............................................................................. 120 Changes to Figure 456 Caption to Figure 459 Caption ................ 121 Changes to General Receiver Path Interface Section ............... 122 Changes to Figure 463 .................................................................. 124 Changes to Figure 464 and Figure 465 ....................................... 125 Deleted Endnote 1, Table 12 to Endnote 1, Table 15; Renumbered Sequentially, and Endnote 2, Table 16 and Endnote 2, Table 17 ....................................................................... 126 Changes to Table 15 ...................................................................... 126 6/2018—Revision A: Initial Version


ADRV9009 Data Sheet


FUNCTIONAL BLOCK DIAGRAM

RX1_IN +RX1_IN –

RX2_IN +RX2_IN –

ORX1_IN +ORX1_IN –

ORX2_IN +ORX2_IN –

RF_EXT_LO_I/O+RF_EXT_LO_I/O–

TX1_OUT +TX1_OUT –

TX2_OUT +TX2_OUT –

Rx1Rx2

ORx2

LOSYNTH

LPF

LPF

LPF

GPIOS, AUXADCs, AND AUXDACs

GPIO_3P3_x GPIO_x AUXADC_0 THROUGH AUXADC_3

CLOCKGENERATION

SYNCINx±

SERDOUTx±

SERDINx±

SYNCOUTx±

SYSREF_IN±

GP_INTERRUPT

RXx_ENABLE

TXx_ENABLE

RESET

TEST

SCLKCS

SDO

SDIO

REF_CLK_IN +REF_CLK_IN –

DIGITALPROCESSING

DECIMATIONpFIRAGC

DC-OFFSETQECLOL

JESD204BCIF/RIF

LPF

DAC

DAC

ADC

ARMM3

ADC

ORx1

ADRV9009

1649

9-00

1

Tx1

Tx2

Figure 1.


Data Sheet ADRV9009


SPECIFICATIONS Electrical characteristics at VDDA1P31 = 1.3 V, VDDD1P3_DIG = 1.3 V, VDDA1P8_TX = 1.8 V, junction temperature (TJ) = full operating temperature range. LO frequency (fLO) = 1800 MHz, unless otherwise noted. The specifications in Table 1 are not de-embedded. Refer to the Typical Performance Characteristics section for input and output circuit path loss. The device configuration profile for the 75 MHz to 525 MHz frequency range is as follows: receiver = 50 MHz bandwidth (inphase quadrature (IQ) rate = 61.44 MHz), transmitter = 50 MHz transmitter large signal bandwidth and 100 MHz transmitter synthesis bandwidth (IQ rate = 122.88 MHz), observation receiver = 100 MHz bandwidth (IQ rate = 122.88 MHz), JESD204B rate = 9.8304 GSPS, and device clock = 245.76 MHz. Unless otherwise specified, the device configuration for all other frequency ranges is as follows: receiver = 200 MHz bandwidth (IQ rate = 245.76 MHz), transmitter = 200 MHz transmitter large signal bandwidth and 450 MHz transmitter synthesis bandwidth (IQ rate = 491.52 MHz), observation receiver = 450 MHz bandwidth (IQ rate = 491.52 MHz), JESD204B rate = 9.8304 GSPS, and device clock = 245.76 MHz.

Table 1. Parameter Symbol Min Typ Max Unit Test Conditions/Comments TRANSMITTERS

Center Frequency 75 6000 MHz Transmitter Synthesis

Bandwidth 450 MHz

Transmitter Large Signal Bandwidth

200 MHz

Peak-to-Peak Gain Deviation

1.0 dB 450 MHz bandwidth, compensated by programmable finite impulse response (FIR) filter

Gain Slope ±0.1 dB Any 20 MHz bandwidth span, compensated by programmable FIR filter

Deviation from Linear Phase 1 Degrees 450 MHz bandwidth Transmitter Attenuation

Power Control Range 0 32 dB Signal-to-noise ratio (SNR) maintained

for attenuation between 0 dB and 20 dB Transmitter Attenuation

Power Control Resolution 0.05 dB

Transmitter Attenuation Integral Nonlinearity

INL 0.1 dB For any 4 dB step

Transmitter Attenuation Differential Nonlinearity

DNL 0.04 dB Monotonic

Transmitter Attenuation Serial Peripheral Interface 2 (SPI 2) Timing

See Figure 4

Time from CS Going High to Change in Transmitter Attenuation

tSCH 19.5 24 ns

Time Between Consecutive Microattenuation Steps

tACH 6.5 8.1 ns A large change in attenuation can be broken up into a series of smaller attenuation changes

Time Required to Reach Final Attenuation Value

tDCH 800 ns Time required to complete the change in attenuation from start attenuation to final attenuation value

Maximum Attenuation Overshoot During Transition

−1.0 +0.5 dB

Change in Attenuation per Microstep

0.5 dB

Maximum Attenuation Change when CS Goes High

32 dB


ADRV9009 Data Sheet


Parameter Symbol Min Typ Max Unit Test Conditions/Comments Adjacent Channel Leakage

Ratio (ACLR) Long Term Evolution (LTE)

20 MHz LTE at −12 dBFS

−67 dB 75 MHz < f ≤ 2800 MHz −64 dB 2800 MHz < f ≤ 4800 MHz −60 dB 4800 MHz < f ≤ 6000 MHz

In Band Noise Floor 0 dB attenuation, in band noise falls 1 dB for each dB of attenuation for attenuation between 0 dB and 20 dB

−147 dBm/Hz 75 MHz < f ≤ 600 MHz −148 dBm/Hz 600 MHz < f ≤ 3000 MHz −149 dBm/Hz 3000 MHz < f ≤ 4800 MHz −150.5 dBm/Hz 4800 MHz < f ≤ 6000 MHz

Out of Band Noise Floor 0 dB attenuation, 3 × bandwidth/2 offset −147 dBm/Hz 75 MHz < f ≤ 600 MHz −153 dBm/Hz 600 MHz < f ≤ 3000 MHz −154 dBm/Hz 3000 MHz < f ≤ 4800 MHz −155.5 dBm/Hz 4800 MHz < f ≤ 6000 MHz

Interpolation Images −80 dBc Transmitter to Transmitter

Isolation 85 dB 75 MHz < f ≤ 600 MHz

75 dB 600 MHz < f ≤ 2800 MHz 70 dB 2800 MHz < f ≤ 4800 MHz 65 dB 4800 MHz < f ≤ 5700 MHz 56 dB 5700 MHz < f ≤ 6000 MHz

Image Rejection Within Large Signal

Bandwidth QEC active

70 dB 75 MHz < f ≤ 600 MHz 65 dB 600 MHz < f ≤ 4000 MHz 62 dB 4000 MHz < f ≤ 4800 MHz 60 dB 4800 MHz < f ≤ 6000 MHz

Beyond Large Signal Bandwidth

40 dB Assumes that distortion power density is 25 dB below desired power density

Maximum Output Power 0 dBFS, continuous wave (CW) tone into 50 Ω load, 0 dB transmitter attenuation

9 dBm 75 MHz < f ≤ 600 MHz 7 dBm 600 MHz < f ≤ 3000 MHz 6 dBm 3000 MHz < f ≤ 4800 MHz 4.5 dBm 4800 MHz < f ≤ 6000 MHz

Third-Order Output Intermodulation Intercept Point

OIP3 0 dB transmitter attenuation

29 dBm 75 MHz < f ≤ 600 MHz 27 dBm 600 MHz < f ≤ 4000 MHz 23 dBm 4000 MHz < f ≤ 6000 MHz

Carrier Leakage With LO leakage correction active, 0 dB attenuation, scales decibel for decibel with attenuation, measured in 1 MHz bandwidth, resolution bandwidth and video bandwidth = 100 kHz, rms detector, 100 trace average

Carrier Offset from LO −84 dBFS 75 MHz < f ≤ 600 MHz −82 dBFS 600 MHz < f ≤ 4800 MHz −80 dBFS 4800 MHz < f ≤ 6000 MHz

Carrier on LO −71 dBFS


Data Sheet ADRV9009


Parameter Symbol Min Typ Max Unit Test Conditions/Comments Error Vector Magnitude

(Third Generation Partnership Project (3GPP) Test Signals)

EVM

75 MHz LO 0.5 % 300 kHz RF PLL loop bandwidth, test equipment phase noise performance limited

1900 MHz LO 0.7 % 50 kHz RF PLL loop bandwidth 3800 MHz LO 0.7 % 300 kHz RF PLL loop bandwidth 5900 MHz LO 1.1 % 300 kHz RF PLL loop bandwidth

Output Impedance ZOUT 50 Ω Differential (see Figure 427) OBSERVATION RECEIVER ORx

Center Frequency 75 6000 MHz Gain Range 30 dB Third-order input intermodulation

intercept point (IIP3) improves decibel for decibel for the first 18 dB of gain attenuation, QEC performance optimi-zed for 0 dB to 6 dB of attenuation only

Analog Gain Step 0.5 dB For attenuator steps from 0 dB to 6 dB Peak-to-Peak Gain

Deviation 1 dB 450 MHz bandwidth, compensated by

programmable FIR filter Gain Slope ±0.1 dB Any 20 MHz bandwidth span, compens-

ated by programmable FIR filter Deviation from Linear Phase 1 Degree

s 450 MHz RF bandwidth

Observation Receiver Bandwidth

450 MHz

Observation Receiver Alias Band Rejection

60 dB Due to digital filters

Maximum Useable Input Level

PHIGH 0 dB attenuation, increases decibel for decibel with attenuation, CW corresponds to −1 dBFS at ADC

−11 dBm 75 MHz < f ≤ 3000 MHz −9.5 dBm 3000 MHz < f ≤ 4800 MHz −8 dBm 4800 MHz < f ≤ 6000 MHz

Integrated Noise −58.5 dBFS 450 MHz integration bandwidth −57.5 dBFS 491.52 MHz integration bandwidth

Second-Order Input Intermodulation Intercept Point

IIP2 62 dBm Maximum observation receiver gain, (PHIGH − 14 dB) per tone (see the Terminology section), 75 MHz < f ≤ 600 MHz

62 dBm Maximum observation receiver gain, (PHIGH − 8 dB) per tone (see the Terminology section), 600 MHz < f ≤ 3000 MHz

Third-Order Input Intermodulation Intercept Point

IIP3

Narrow Band 4 dBm 75 MHz < f ≤ 300 MHz, test condition: (PHIGH − 14) dB per tone

11 dBm 300 MHz < f ≤ 600 MHz, (PHIGH − 14) dB per tone

Third-order intermodulation product (IM3) product < 130 MHz at baseband, (PHIGH − 8) dB per tone



ADRV9009 Data Sheet


Parameter Symbol Min Typ Max Unit Test Conditions/Comments Wide Band


Third-Order Intermodulation Product

IM3 IM3 product < 130 MHz at baseband, two tones, each at (PHIGH − 12) dB

−70 dBc 600 MHz < f ≤ 3000 MHz −67 dBc 3000 MHz < f ≤ 4800 MHz −62 dBc 4800 MHz < f ≤ 6000 MHz

Fifth-Order Intermodulation Product (1800 MHz)

IM5 −80 dBc IM5 product < 50 MHz at baseband, two tones, each at (PHIGH − 12) dB, 600 MHz < f ≤ 6000 MHz

Seventh-Order Intermodulation Product (1800 MHz)

IM7 −80 dBc IM7 product < 50 MHz at baseband, two tones, each at (PHIGH − 12) dB, 600 MHz < f ≤ 6000 MHz

Spurious-Free Dynamic Range

SFDR 70 dB Non IMx related spurs, does not include HDx, (PHIGH − 9) dB input signal, 600 MHz < f ≤ 6000 MHz

Harmonic Distortion (PHIGH − 11) dB input signal Second-Order Harmonic

Distortion Product HD2 −80 dBc (PHIGH – 11) dB input signal 75 MHz < f ≤

600 MHz, (PHIGH – 9) dB input signal 600 MHz < f ≤ 6000 MHz, in band harmo-nic distortion falls within ±100 MHz

−80 dBc Out of band harmonic distortion falls within ±225 MHz

Third-Order Harmonic Distortion Product

HD3 −70 dBc In band harmonic distortion falls within ±100 MHz

−60 dBc Out of band harmonic distortion falls within ±225 MHz

Image Rejection QEC active Within Large Signal

Bandwidth 65 dB

Outside Large Signal Bandwidth

55 dB

Input Impedance 100 Ω Differential (see Figure 428) Isolation

Transmitter 1 (Tx1) to Observation Receiver 1 (ORx1) and Transmitter 2 (Tx2) to Observation Receiver 2 (ORx2)

100 dB 75 MHz < f ≤ 600 MHz

65 dB 600 MHz < f ≤ 5300 MHz 55 dB 5300 MHz < f ≤ 6000 MHz

Tx1 to ORx2 and Tx2 to ORx1

105 dB 75 MHz < f ≤ 600 MHz

65 dB 600 MHz < f ≤ 5300 MHz 55 dB 5300 MHz < f ≤ 6000 MHz RECEIVERS

Center Frequency 75 6000 MHz Gain Range 30 dB Analog Gain Step 0.5 dB Attenuator steps from 0 dB to 6 dB

1 dB Attenuator steps from 6 dB to 30 dB Bandwidth Ripple ±0.5 dB 200 MHz bandwidth, compensated by

programmable FIR filter ±0.2 dB Any 20 MHz bandwidth span, compens-

ated by programmable FIR filter


Data Sheet ADRV9009


Parameter Symbol Min Typ Max Unit Test Conditions/Comments Receiver Bandwidth 200 MHz Receiver Alias Band

Rejection 80 dB Due to digital filters

Maximum Useable Input Level

PHIGH 0 dB attenuation, increases decibel for decibel with attenuation, CW = 1800 MHz, corresponds to −1 dBFS at ADC

−11 dBm 75 MHz < f ≤ 3000 MHz −10.2 dBm 3000 MHz < f ≤ 4800 MHz −9.5 dBm 4800 MHz < f ≤ 6000 MHz

Noise Figure NF 0 dB attenuation, at receiver port 11.5 dB 75 MHz < f ≤ 600 MHz 12 dB 600 MHz < f ≤ 3000 MHz 13 dB 3000 MHz < f ≤ 4800 MHz 15.2 dB 4800 MHz < f ≤ 6000 MHz

Ripple 1.8 dB At band edge maximum bandwidth mode

Third-Order Input Intermodulation Intercept Point

IIP3

Difference Product IIP3D 12 dBm 75 MHz < f ≤ 600 MHz, (PHIGH − 12) dB per tone, 600 MHz < f ≤ 6000 MHz, (PHIGH − 10) dB per tone, two tones near band edge

Sum Product IIP3S 12 dBm 75 MHz < f ≤ 600 MHz, (PHIGH − 12) dB per tone, 600 MHz < f ≤ 6000 MHz, (PHIGH − 10) dB per tone, two tones at bandwidth/6 offset from the LO

Third-Order Harmonic Distortion Product

HD3 75 MHz < f ≤ 600 MHz, (PHIGH − 6) dB, 600 MHz < f ≤ 6000 MHz, (PHIGH − 4) dB, CW tone at bandwidth/6 offset from the LO

−65 dBc 75 MHz < f ≤ 600 MHz −66 dBc 600 MHz < f ≤ 4800 MHz −62 dBc 4800 MHz < f ≤ 6000 MHz

Second-Order Input Intermodulation Intercept Point

IIP2 62 dBm 75 MHz < f ≤ 600 MHz, (PHIGH − 12) dB per tone, 600 MHz < f ≤ 6000 MHz, (PHIGH − 10) dB per tone, 0 dB attenuation, complex

Image Rejection 75 dB QEC active, within 200 MHz receiver bandwidth

Input Impedance 100 Ω Differential (see Figure 429) Receiver to Receiver

Isolation 77 dB 75 MHz < f ≤ 600 MHz

65 dB 600 MHz < f ≤ 4800 MHz 61 dB 4800 MHz < f ≤ 6000 MHz

Receiver Band Spurs Referenced to RF Input at Maximum Gain

−95 dBm No more than one spur at this level per 10 MHz of receiver bandwidth

Receiver LO Leakage at Receiver Input at Maximum Gain

Leakage decreases decibel for decibel with attenuation for first 12 dB

−70 dBm 75 MHz < f ≤ 600 MHz −70 dBm 600 MHz < f ≤ 3000 MHz −65 dBm 3000 MHz < f ≤ 6000 MHz


ADRV9009 Data Sheet


Parameter Symbol Min Typ Max Unit Test Conditions/Comments LO SYNTHESIZER

LO Frequency Step 2.3 Hz 1.5 GHz to 2.8 GHz, 76.8 MHz phase frequency detector (PFD) frequency

LO Spur −85 dBc Excludes integer boundary spurs Integrated Phase Noise 2 kHz to 18 MHz

75 MHz LO 0.014 °rms Narrow PLL loop bandwidth (50 kHz) 1900 MHz LO 0.2 °rms Narrow PLL loop bandwidth (50 kHz) 3800 MHz LO 0.36 °rms Wide PLL loop bandwidth (300 kHz) 5900 MHz LO 0.54 °rms Wide PLL loop bandwidth (300 kHz)

Spot Phase Noise 75 MHz LO Narrow PLL loop bandwidth

10 kHz Offset −126.5 dBc/Hz 100 kHz Offset −132.8 dBc/Hz 1 MHz Offset −150.1 dBc/Hz 10 MHz Offset −150.7 dBc/Hz

1900 MHz LO Narrow PLL loop bandwidth 100 kHz Offset −100 dBc/Hz 200 kHz Offset −115 dBc/Hz 400 kHz Offset −120 dBc/Hz 600 kHz Offset −129 dBc/Hz 800 kHz Offset −132 dBc/Hz 1.2 MHz Offset −135 dBc/Hz 1.8 MHz Offset −140 dBc/Hz 6 MHz Offset −150 dBc/Hz 10 MHz Offset −153 dBc/Hz

3800 MHz LO Wide PLL loop bandwidth 100 kHz Offset −104 dBc/Hz 1.2 MHz Offset −125 dBc/Hz 10 MHz Offset −145 dBc/Hz 5900 MHz LO Wide PLL loop bandwidth 100 kHz Offset −99 dBc/Hz 1.2 MHz Offset −119.7 dBc/Hz 10 MHz Offset −135.4 dBc/Hz

LO PHASE SYNCHRONIZATION Phase Deviation 1.6 ps/°C Change in LO delay per temperature

change EXTERNAL LO INPUT

Input Frequency fEXTLO 150 8000 MHz Input frequency must be 2 × the desired LO frequency

Input Signal Power 0 12 dBm 50 Ω matching at the source 3 dBm fEXTLO ≤ 2 GHz, add 0.5 dBm/GHz above

2 GHz 6 dBm fEXTLO = 8 GHz

External LO Input Signal Differential

To ensure adequate QEC

Phase Error 3.6 ps Amplitude Error 1 dB Duty Cycle Error 2 % Even Order Harmonics −50 dBc

CLOCK SYNTHESIZER Integrated Phase Noise 1 kHz to 100 MHz

1966.08 MHz LO 0.4 °rms PLL optimized for close in phase noise


Data Sheet ADRV9009


Parameter Symbol Min Typ Max Unit Test Conditions/Comments Spot Phase Noise

1966.08 MHz 100 kHz Offset −109 dBc/Hz 1 MHz Offset −129 dBc/Hz 10 MHz Offset −149 dBc/Hz

REFERENCE CLOCK (REF_CLK_IN±)

Frequency Range 10 1000 MHz Signal Level 0.3 2.0 V p-p AC-coupled, common-mode voltage

(VCM) = 618 mV, for best spurious performance use <1 V p-p input clock

AUXILIARY CONVERTERS ADC

Resolution 12 Bits Input Voltage

Minimum 0.05 V Maximum VDDA_

3P3 − 0.05

V

DAC Resolution 10 Bits Includes four offset levels Output Voltage

Minimum 0.7 V 1 V voltage reference (VREF) Maximum VDDA_

3P3 − 0.3 V 2.5 V VREF

Output Drive Capability 10 mA DIGITAL SPECIFICATIONS

(COMPLEMENTARY METAL-OXIDE SEMICONDUCTOR (CMOS)) FOR SPI, GPIO_x, TXx_ENABLE, ORXx_ENABLE

Logic Inputs Input Voltage

High Level VDD_ INTERFACE × 0.8

VDD_ INTERFACE

V

Low Level 0 VDD_ INTERFACE × 0.2

V

Input Current High Level −10 +10 μA Low Level −10 +10 μA

Logic Outputs Output Voltage

High Level VDD_ INTERFACE × 0.8

V

Low Level VDD_ INTERFACE × 0.2

V

Drive Capability 3 mA


ADRV9009 Data Sheet


Parameter Symbol Min Typ Max Unit Test Conditions/Comments DIGITAL SPECIFICATIONS

(CMOS) FOR GPIO_3P3_x

Logic Inputs Input Voltage

High Level VDDA_ 3P3 × 0.8

VDDA_3P3 V

Low Level 0 VDDA_ 3P3 × 0.2

V

Input Current High Level −10 +10 μA Low Level −10 +10 μA

Logic Outputs Output Voltage

High Level VDDA_ 3P3 × 0.8

V

Low Level VDDA_ 3P3 × 0.2

V

Drive Capability 4 mA DIGITAL SPECIFICATIONS

(LOW VOLTAGE DIFFERENTIAL SIGNALING (LVDS))

Logic Inputs (SYSREF_IN±, SYNCINx±)

Input Voltage Range 825 1675 mV Each differential input in the pair Input Differential

Voltage Threshold −100 +100 mV

Receiver Differential Input Impedance

100 Ω Internal termination enabled

Logic Outputs (SYNCOUTx±)

Output Voltage High 1375 mV Low 1025 mV

Output Differential Voltage

225 mV Programmable in 75 mV steps

Output Offset Voltage 1200 mV SPI TIMING

SCLK Period tCP 20 ns SCLK Pulse Width tMP 10 ns CS Setup to First SCLK Rising

Edge tSC 3 ns

Last SCLK Falling Edge to CS Hold

tHC 0 ns

SDIO Data Input Setup to SCLK

tS 2 ns

SDIO Data Input Hold to SCLK

tH 0 ns

SCLK Rising Edge to Output Data Delay (3-Wire or 4-Wire Mode)

tCO 3 8 ns

Bus Turnaround Time, Read After Baseband Processor (BBP) Drives Last Address Bit

tHZM tH tCO ns

Bus Turnaround Time, Read After ADRV9009 Drives Last Data Bit

tHZS 0 tCO ns


Data Sheet ADRV9009


Parameter Symbol Min Typ Max Unit Test Conditions/Comments JESD204B DATA OUTPUT

TIMING AC-coupled

Unit Interval UI 81.38 320 ps Data Rate per Channel,

Nonreturn to Zero (NRZ) 3125 12,288 Mbps

Rise Time tR 24 39.5 ps 20% to 80% in 100 Ω load Fall Time tF 24 39.4 ps 20% to 80% in 100 Ω load Output Common-Mode

Voltage VCM 0 1.8 V AC-coupled

Differential Output Voltage VDIFF 360 600 770 mV Short-Circuit Current IDSHORT −100 +100 mA Differential Termination

Impedance 80 94.2 120 Ω

Total Jitter 15.13 ps Bit error rate (BER) = 10−15 Uncorrelated Bounded High

Probability Jitter UBHPJ 0.56 ps

Duty Cycle Distortion DCD 0.369 ps SYSREF_IN± Setup Time to

REF_CLK_IN± 2.5 ns See Figure 2

SYSREF_IN± Hold Time to REF_CLK_IN±

−1.5 ns See Figure 2

Latency tLAT_FRM REF_CLK_IN± = 245.76 MHz 116.5 Clock

cycles Observation receiver bandwidth = 450 MHz, IQ rate = 491.52 MHz, lane rate = 9830.4 MHz, number of converters (M) = 4, number of lanes (L) = 2, converter resolution (N) = 16, number of samples per converter (S) = 1

237.02 ns 89.4 Clock

cycles Receiver bandwidth = 200 MHz, IQ rate = 245.76 MHz, lane rate = 9830.4 MHz, M = 2, L = 2, N = 16, S = 1

364.18 ns JESD204B DATA INPUT TIMING AC-coupled

Unit Interval UI 81.38 320 ps Data Rate per Channel (NRZ) 3125 12288 Mbps Differential Voltage VDIFF 125 750 mV Termination Voltage (VTT)

Source Impedance ZTT 8.9 30 Ω

Differential Impedance ZRDIFF 80 105.1 120 Ω Termination Voltage VTT Ω

AC-Coupled 1.267 1.33 V Latency tLAT_DEFRM 74.45 Clock

cycles Device clock = 245.76 MHz, transmitter bandwidth = 200 MHz, IQ rate = 491.52 MHz, lane rate = 9830.4 MHz, M = 2, L = 2, N = 16, S = 1

153.5 ns 1 VDDA1P3 refers to all analog 1.3 V supplies, including: VDDA1P3_RF_SYNTH, VDDA1P3_BB, VDDA1P3_RX_RF, VDDA1P3_RX_TX, VDDA1P3_RF_VCO_LDO,

VDDA1P3_RF_LO, VDDA1P3_DES, VDDA1P3_SER, VDDA1P3_CLOCK_SYNTH, VDDA1P3_CLOCK_VCO_LDO, VDDA1P3_AUX_SYNTH, and VDDA1P3_AUX_VCO_LDO.


ADRV9009 Data Sheet


CURRENT AND POWER CONSUMPTION SPECIFICATIONS

Table 2. Parameter Min Typ Max Unit Test Conditions/Comments SUPPLY CHARACTERISTICS

VDDA1P31 Analog Supply 1.267 1.3 1.33 V VDDD1P3_DIG Supply 1.267 1.3 1.33 V VDDA1P8_TX Supply 1.71 1.8 1.89 V VDDA1P8_BB Supply 1.71 1.8 1.89 V VDD_INTERFACE Supply 1.71 1.8 2.625 V CMOS and LVDS supply, 1.8 V to 2.5 V nominal range VDDA_3P3 Supply 3.135 3.3 3.465 V

POSITIVE SUPPLY CURRENT LO at 2600 MHz 450 MHz Transmitter Bandwidth,

Observation Receiver Disabled Two transmitters enabled

VDDA1P31 Analog Supply 1520 mA VDDD1P3_DIG Supply 619 mA Transmitter QEC active VDDA1P8_TX Supply 455 mA Transmitter RF attenuation = 0 dB, full-scale CW

135 mA Transmitter RF attenuation = 15 dB, full-scale CW VDDA1P8_BB Supply 30 mA VDD_INTERFACE Supply 8 mA VDD_INTERFACE = 2.5 V VDDA_3P3 Supply 3 mA No Auxiliary DAC x or AUXADC_x enabled, if enabled,

AUXADC_x adds 2.7 mA and each Auxiliary DAC x adds 1.5 mA Total Power Dissipation 3.68 W Typical supply voltages, 0 dB transmitter attenuation,

transmitter QEC active 3.11 W Typical supply voltages, 15 dB transmitter attenuation,

transmitter QEC active 450 MHz Transmitter Bandwidth,

Observation Receiver Enabled Two transmitters enabled, one ORx enabled

VDDA1P31 Analog Supply 2073 mA VDDD1P3_DIG Supply 1541 mA Transmitter QEC tracking active, observation receiver QEC

enabled, transmitter LTE20 centered on LO, observation receiver LTE20 at −16 dBm centered on LO

2100 mA Transmitter two tone = −99 MHz and 100 MHz at −7 dBFS each, observation receiver one tone = 100 MHz at −16 dBm

VDDA1P8_TX Supply 455 mA Transmitter RF attenuation = 0 dB, full scale CW 135 mA Transmitter RF attenuation = 15 dB, full scale CW

VDDA1P8_BB Supply 63 mA VDD_INTERFACE Supply 8 mA VDD_INTERFACE = 2.5 V VDDA_3P3 Power Supply 3 mA No Auxiliary DAC x or AUXADC_x enabled, if enabled,

AUXADC_x adds 2.7 mA and each Auxiliary DAC x adds 1.5 mA Total Power Dissipation 5.66 W Typical supply voltages, 0 dB transmitter attenuation,

transmitter QEC active 5.08 W Typical supply voltages, 15 dB transmitter attenuation,

transmitter QEC active 200 MHz Receiver Bandwidth,

Observation Receiver Disabled Two receivers enabled

VDDA1P31 Analog Supply 1645 mA VDDD1P3_DIG Supply 984 mA Receiver QEC active VDDA1P8_TX Supply 0.4 mA VDDA1P8_BB Supply 68 mA VDD_INTERFACE Supply 8 mA VDDA_3P3 Supply 3 mA No Auxiliary DAC x or AUXADC_x enabled, if enabled,

AUXADC_x adds 2.7 mA and each Auxiliary DAC x adds 1.5 mA Total Power Dissipation 3.57 W Typical supply voltages, receiver QEC active

1 VDDA1P3 refers to all analog 1.3 V supplies, including: VDDA1P3_RF_SYNTH, VDDA1P3_BB, VDDA1P3_RX_RF, VDDA1P3_RX_TX, VDDA1P3_RF_VCO_LDO, VDDA1P3_RF_LO, VDDA1P3_DES, VDDA1P3_SER, VDDA1P3_CLOCK_SYNTH, VDDA1P3_CLOCK_VCO_LDO, VDDA1P3_AUX_SYNTH, and VDDA1P3_AUX_VCO_LDO.


Data Sheet ADRV9009


TIMING DIAGRAMS

REF_CLK_IN±

AT DEVICE PINS AT DEVICE COREREF_CLK_IN± DELAYIN REFERENCE TO SYSREF_IN±

CLK DELAY = 2nstH = –1.5nstS = +2.5ns

t’H = +0.5nst’S = +0.5ns

tS

tHtS

tH t’H

t’S t’S

t’H

1649

9-00

5

NOTES1. tH AND tS ARE THE HOLD AND SETUP TIMES FOR THE REF_CLK_IN± PINS. t’H AND t’S REFER TO THE DELAYED HOLD AND SETUP TIMES AT THE DEVICE CORE IN REFERENCE TO THE SYSREF_N± SIGNALS DUE TO AN INTERNAL BUFFER THAT THE SIGNAL PASSES THROUGH.

Figure 2. SYSREF_IN± Setup and Hold Timing

REF_CLK_IN±

SYSREF_IN±

VALID SYSREF INVALID SYSREFtH = –1.5nstS = +2.5ns

tS

tH

tS

tH

tS

tH

tS

tH

1649

9-00

6Figure 3. SYSREF_IN± Setup and Hold Timing Examples, Relative to Device Clock

tDCH

tSCH tACH

SCLK

SDIO

CS

TxATTENUATION

1649

9-00

7

Figure 4. Transmitter Attenuation Update via SPI 2 Port


ADRV9009 Data Sheet


ABSOLUTE MAXIMUM RATINGS Table 3. Parameter Rating VDDA1P31 to VSSA −0.3 V to +1.4 V VDDD1P3_DIG to VSSD −0.3 V to +1.4 V VDD_INTERFACE to VSSA −0.3 V to +3.0 V VDDA_3P3 to VSSA −0.3 V to +3.9 V VDDA1P8_TX to VSSA −0.3 V to +2.0 V VDD_INTERFACE Logic Inputs and

Outputs to VSSD −0.3 V to VDD_ INTERFACE + 0.3 V

JESD204B Logic Outputs to VSSA −0.3 V to VDDA1P3_SER

JESD204B Logic Inputs to VSSA −0.3 V to VDDA1P3_DES +0.3 V

Input Current to any Pin Except Supplies

±10 mA

Maximum Input Power into RF Port 23 dBm (peak) Maximum Transmitter Voltage

Standing Wave Ratio (VSWR) 3:1

Maximum TJ 110°C Storage Temperature Range −65°C to +150°C

1 VDDA1P3 refers to all analog 1.3 V supplies.

Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability.

REFLOW PROFILE The ADRV9009 reflow profile is in accordance with the JEDEC JESD204B criteria for Pb-free devices. The maximum reflow temperature is 260°C.

THERMAL MANAGEMENT The ADRV9009 is a high power device that can dissipate over 3 W depending on the user application and configuration. Because of the power dissipation, the ADRV9009 uses an exposed die package to provide the customer with the most effective method of controlling the die temperature. The exposed die allows cooling of the die directly. Figure 5 shows the profile view of the device mounted to a user printed circuit board (PCB) and a heat sink (typically the aluminum case) to keep the junction (exposed die) below the maximum TJ detailed in Table 3. The device is designed for a lifetime of 10 years when operating at the maximum TJ.

THERMAL RESISTANCE Thermal performance is directly linked to PCB design and operating environment. Careful attention to PCB thermal design is required.

θJA is the natural convection junction to ambient thermal resistance measured in a circuit board for surface-mount packages.

θJC_TOP is the conduction thermal resistance from junction to case where the case temperature is measured at the top of the package.

Thermal resistance data for the ADRV9009 mounted on both a JEDEC 2S2P test board and a 10-layer Analog Devices, Inc., evaluation board is listed in Table 4. Do not exceed the absolute maximum TJ rating in Table 3. Ten-layer PCB entries refer to the 10-layer Analog Devices evaluation board, which more accurately reflects the PCB used in customer applications.

Table 4. Thermal Resistance1, 2 Package Type θJA θJC_TOP θJB ΨJT ΨJB Unit BC-196-13 21.1 0.04 4.9 0.3 4.9 °C/W

1 For the θJC test, 100 µm thermal interface material (TIM) is used. TIM is assumed to have 3.6 thermal conductivity watts/(meter × Kelvin).

2 Using enhanced heat removal techniques such as PCB, heat sink, and airflow improves the thermal resistance values.

ESD CAUTION

CUSTOMER CASE (HEAT SINK)

CUSTOMER THERMAL FILLER

SILICON (DIE)

PACKAGE SUBSTRATE

CUSTOMER PCB 1649

9-00

8

Figure 5. Typical Thermal Management Solution


Data Sheet ADRV9009


PIN CONFIGURATION AND FUNCTION DESCRIPTIONS 1 2 3 4 5 6 7 8 9 10 11 12 13 14

A VSSA ORX2_IN+ ORX2_IN– VSSA RX2_IN+ RX2_IN– VSSA VSSA RX1_IN+ RX1_IN– VSSA ORX1_IN+ ORX1_IN– VSSA

BVDDA1P3_

RX_RF VSSA VSSA VSSA VSSA VSSARF_EXT_LO_I/O–

RF_EXT_LO_I/O+ VSSA VSSA VSSA VSSA VSSA VSSA

C GPIO_3P3_0 GPIO_3P3_3VDDA1P3_

RX_TX VSSAVDDA1P3_

RF_VCO_LDOVDDA1P3_

RF_VCO_LDOVDDA1P1_RF_VCO

VDDA1P3_RF_LO VSSA

VDDA1P3_AUX_VCO_

LDO VSSA VDDA_3P3 GPIO_3P3_9 RBIAS

D GPIO_3P3_1 GPIO_3P3_4 VSSA VSSA VSSA VSSA VSSA VSSA VSSAVDDA1P1_AUX_VCO VSSA VSSA GPIO_3P3_8 GPIO_3P3_10

E GPIO_3P3_2 GPIO_3P3_5 GPIO_3P3_6 VDDA1P8_BB VDDA1P3_BB VSSA REF_CLK_IN+ REF_CLK_IN– VSSAAUX_SYNTH_

OUT AUXADC_3 VDDA1P8_TX GPIO_3P3_7 GPIO_3P3_11

F VSSA VSSA AUXADC_0 AUXADC_1 VSSA VSSA VSSA VSSA VSSA VSSA AUXADC_2 VSSA VSSA VSSA

G VSSA VSSA VSSA VSSAVDDA1P3_

CLOCK_ SYNTH VSSAVDDA1P3_RF_SYNTH

VDDA1P3_AUX_SYNTH

RF_SYNTH_VTUNE VSSA VSSA VSSA VSSA VSSA

H TX2_OUT– VSSA VSSA VSSA VSSA VSSA VSSA VSSA VSSA VSSA GPIO_12 GPIO_11 VSSA TX1_OUT+

J TX2_OUT+ VSSA GPIO_18 RESETGP_

INTERRUPT TEST GPIO_2 GPIO_1 SDIO SDO GPIO_13 GPIO_10 VSSA TX1_OUT–

K VSSA VSSA SYSREF_IN+ SYSREF_IN– GPIO_5 GPIO_4 GPIO_3 GPIO_0 SCLK CS GPIO_14 GPIO_9 VSSA VSSA

L VSSA VSSA SYNCIN1– SYNCIN1+ GPIO_6 GPIO_7 VSSDVDDD1P3_

DIGVDDD1P3_

DIG VSSD GPIO_15 GPIO_8 SYNCOUT1– SYNCOUT1+

MVDDA1P1_

CLOCK_VCO VSSA SYNCIN0– SYNCIN0+ RX1_ENABLE TX1_ENABLE RX2_ENABLE TX2_ENABLE VSSA GPIO_17 GPIO_16VDD_

INTERFACE SYNCOUT0– SYNCOUT0+

NVDDA1P3_CLOCK_

VCO_LDO VSSA SERDOUT3– SERDOUT3+ SERDOUT2– SERDOUT2+ VSSAVDDA1P3_

SERVDDA1P3_

DES SERDIN1– SERDIN1+ SERDIN0– SERDIN0+ VSSA

PAUX_SYNTH_

VTUNE VSSA VSSA SERDOUT1– SERDOUT1+ SERDOUT0– SERDOUT0+VDDA1P3_

SERVDDA1P3_

DES VSSA SERDIN3– SERDIN3+ SERDIN2– SERDIN2+

ADRV900916499-900

Figure 6. Pin Configuration

Table 5. Pin Function Descriptions Pin No. Type Mnemonic Description A1, A4, A7, A8, A11, A14, B2 to

B6, B9 to B14, C4, C9, C11, D3 to D9, D11, D12, E6, E9, F1, F2, F5 to F10, F12 to F14, G1 to G4, G6, G10 to G14, H2 to H10, H13, J2, J13, K1, K2, K13, K14, L1, L2, M2, M9, N2, N7, N14, P2, P3, P10

Input VSSA Analog Supply Voltage (VSS).

A2, A3 Input ORX2_IN+, ORX2_IN− Differential Input for Observation Receiver 2. When unused, connect these pins to ground.


ADRV9009 Data Sheet


Pin No. Type Mnemonic Description A5, A6 Input RX2_IN+, RX2_IN− Differential Input for Main Receiver 2. When unused, connect these pins

to ground. A9, A10 Input RX1_IN+, RX1_IN− Differential Input for Main Receiver 1. When unused, connect these

pins to ground. A12, A13 Input ORX1_IN+, ORX1_IN− Differential Input for Observation Receiver 1. When unused, connect

these pins to ground. B1 Input VDDA1P3_RX_RF Observation Receiver Supply. B7, B8 Input RF_EXT_LO_I/O−,

RF_EXT_LO_I/O+, Differential External LO Input/Output. If these pins are used for the external LO, the input frequency must be 2× the desired carrier frequency. When unused, do not connect these pins.

C1 Input/ output

GPIO_3P3_0 GPIO Pin Referenced to 3.3 V Supply. The alternate function is AUXDAC_4. Because this pin contains an input stage, the voltage on the pin must be controlled. When unused, this pin can be tied to ground through a resistor (to safeguard against misconfiguration), or this pin can be left floating, programmed as outputs, and driven low.

C2 Input/ output

GPIO_3P3_3 GPIO Pin Referenced to 3.3 V Supply. Because this pin contains an input stage, the voltage on the pin must be controlled. When unused, this pin can be tied to ground through a resistor (to safeguard against misconfiguration), or these pins can be left floating, programmed as outputs, and driven low.

C13 Input/ output

GPIO_3P3_9 GPIO Pin Referenced to 3.3 V Supply. The alternative function is AUXDAC_9. Because this pin contains an input stage, the voltage on the pin must be controlled. When unused, this pin can be tied to ground through a resistor (to safeguard against misconfiguration), or these pins can be left floating, programmed as outputs, and driven low.

D1 Input/ output


D2 Input/ output


D13 Input/ output


D14 Input/ output


E1 Input/ output

GPIO_3P3_2 GPIO Pin Referenced to 3.3 V Supply. Because this pin contains an input stage, the voltage on the pin must be controlled. When unused, this pin can be tied to ground through a resistor (to safeguard against misconfiguration), or these pins can be left floating, programmed as outputs, and driven low.

E2 Input/ output


E3 Input/ output



Data Sheet ADRV9009


Pin No. Type Mnemonic Description E13 Input/

output GPIO_3P3_7 GPIO Pin Referenced to 3.3 V Supply. The alternative function is

AUXDAC_2. Because this pin contains an input stage, the voltage on the pin must be controlled. When unused, this pin can be tied to ground through a resistor (to safeguard against misconfiguration), or these pins can be left floating, programmed as outputs, and driven low.

E14 Input/ output


C3 Input VDDA1P3_RX_TX 1.3 V Supply for Transmitter/Receiver Baseband Circuits, Transimpedance Amplifier (TIA), Transmitter Transconductance (GM), Baseband Filters, and Auxiliary DACs.

C5, C6 Input VDDA1P3_RF_VCO_LDO RF VCO LDO Supply Inputs. Connect Pin C5 to Pin C6. Use a separate trace on the PCB back to a common supply point.

C7 Input VDDA1P1_RF_VCO 1.1 V VCO Supply. Decouple this pin with 1 μF. C8 Input VDDA1P3_RF_LO 1.3 V LO Generator for the RF Synthesizer. This pin is sensitive to

supply noise. C10 Input VDDA1P3_AUX_VCO_LDO 1.3 V Supply. C12 Input VDDA_3P3 General-Purpose Output Pull-Up Voltage and Auxiliary DAC Supply

Voltage. C14 Input/

output RBIAS Bias Resistor. Tie this pin to ground using a 14.3 kΩ resistor. This pin

generates an internal current based on an external 1% resistor. D10 Input VDDA1P1_AUX_VCO 1.1 V VCO Supply. Decouple this pin with 1 μF. E4 Input VDDA1P8_BB 1.8 V Supply for the ADC and DAC. E5 Input VDDA1P3_BB 1.3 V Supply for the ADC, DAC, and AUXADC. E7, E8 Input REF_CLK_IN+,

REF_CLK_IN− Device Clock Differential Input.

E10 Output AUX_SYNTH_OUT Auxiliary PLL Output. When unused, do not connect this pin. E12 Input VDDA1P8_TX 1.8 V Supply for Transmitter. F3, F4, F11, E11 Input AUXADC_0 to AUXADC_3 Auxiliary ADC Input. When unused, connect these pins to ground with a

pull-down resistor, or connect directly to ground. G5 Input VDDA1P3_CLOCK_SYNTH 1.3 V Supply Input for Clock Synthesizer. Use a separate trace on the

PCB back to a common supply point. G7 Input VDDA1P3_RF_SYNTH 1.3 V RF Synthesizer Supply Input. This pin is sensitive to supply noise. G8 Input VDDA1P3_AUX_SYNTH 1.3 V Auxiliary Synthesizer Supply Input. G9 Output RF_SYNTH_VTUNE RF Synthesizer VTUNE Output. H11 Input/

output GPIO_12 Digital GPIO, 1.8 V to 2.5 V. Because this pin contains an input stage, the

voltage on the pin must be controlled. When unused, this pin can be tied to ground through a resistor (to safeguard against misconfiguration), or it can be left floating, programmed as output, and driven low.

H12 Input/ output

GPIO_11 Digital GPIO, 1.8 V to 2.5 V. Because this pin contains an input stage, the voltage on the pin must be controlled. When unused, this pin can be tied to ground through a resistor (to safeguard against misconfiguration), or it can be left floating, programmed as output, and driven low.

J11 Input/ output


J12 Input/ output



ADRV9009 Data Sheet


Pin No. Type Mnemonic Description J3 Input/

output GPIO_18 Digital GPIO, 1.8 V to 2.5 V. The joint test action group (JTAG) function is

TCLK. Because this pin contains an input stage, the voltage on the pin must be controlled. When unused, this pin can be tied to ground through a resistor (to safeguard against misconfiguration), or it can be left floating, programmed as output, and driven low.

J7 Input/ output

GPIO_2 Digital GPIO, 1.8 V to 2.5 V. The user sets the JTAG function to 0. Because this pin contains an input stage, the voltage on the pin must be controlled. When unused, this pin can be tied to ground through a resistor (to safeguard against misconfiguration), or it can be left floating, programmed as output, and driven low.

J8 Input/ output


K5 Input/ output

GPIO_5 Digital GPIO, 1.8 V to 2.5 V. The JTAG function is TDO. Because this pin contains an input stage, the voltage on the pin must be controlled. When unused, this pin can be tied to ground through a resistor (to safeguard against misconfiguration), or it can be left floating, programmed as output, and driven low.

K6 Input/ output

GPIO_4 Digital GPIO, 1.8 V to 2.5 V. The JTAG function is TRST. Because this pin contains an input stage, the voltage on the pin must be controlled. When unused, this pin can be tied to ground through a resistor (to safeguard against misconfiguration), or it can be left floating, programmed as output, and driven low.

K7 Input/ output


K8 Input/ output


K11 Input/ output


K12 Input/ output


L5 Input/ output

GPIO_6 Digital GPIO, 1.8 V to 2.5 V. The JTAG function is TDI. Because this pin contains an input stage, the voltage on the pin must be controlled. When unused, this pin can be tied to ground through a resistor (to safeguard against misconfiguration), or it can be left floating, programmed as output, and driven low.

L6 Input/ output

GPIO_7 Digital GPIO, 1.8 V to 2.5 V. The JTAG function is TMS. Because this pin contains an input stage, the voltage on the pin must be controlled. When unused, this pin can be tied to ground through a resistor (to safeguard against misconfiguration), or it can be left floating, programmed as output, and driven low.

L11 Input/ output



Data Sheet ADRV9009


Pin No. Type Mnemonic Description L12 Input/

output GPIO_8 Digital GPIO, 1.8 V to 2.5 V. Because this pin contains an input stage, the

voltage on the pin must be controlled. When unused, this pin can be tied to ground through a resistor (to safeguard against misconfiguration), or it can be left floating, programmed as output, and driven low.

M10 Input/ output


M11 Input/ output


H14, J14 Output TX1_OUT+, TX1_OUT− Transmitter 1 Output. When unused, do not connect these pins. H1, J1 Output TX2_OUT−, TX2_OUT+ Transmitter 2 Output. When unused, do not connect these pins. J4 Input RESET Active Low Chip Reset.

J5 Output GP_INTERRUPT General-Purpose Digital Interrupt Output Signal. When unused, do not connect this pin.

J6 Input TEST Pin Used for JTAG Boundary Scan. When unused, connect this pin to ground.

J9 Input/ output

SDIO Serial Data Input in 4-Wire Mode or Input/Output in 3-Wire Mode.

J10 Output SDO Serial Data Output. In SPI 3-wire mode, do not connect this pin. K3, K4 Input SYSREF_IN+, SYSREF_IN− LVDS Input. K9 Input SCLK Serial Data Bus Clock. K10 Input CS Serial Data Bus Chip Select, Active Low.

L3, L4 Input SYNCIN1−, SYNCIN1+ LVDS Input. These pins form the sync signal associated with receiver channel data on the JESD204B interface. When unused, connect these pins to ground with a pull-down resistor, or connect these pins directly to ground.

L7, L10 Input VSSD Digital VSS. L8, L9 Input VDDD1P3_DIG 1.3 V Digital Core. Connect Pin L8 and Pin L9 together. Use a wide

trace to connect to a separate power supply domain. L13, L14 Output SYNCOUT1−, SYNCOUT1+ LVDS Output. These pins form the sync signal associated with transmitter

channel data on the JESD204B interface. When unused, do not connect these pins.

M1 Input VDDA1P1_CLOCK_VCO 1.1 V VCO Supply. Decouple this pin with 1 μF. M3, M4 Input SYNCIN0−, SYNCIN0+ LVDS Input. These pins form the sync signal associated with receiver

channel data on the JESD204B interface. When unused, connect these pins to ground with a pull-down resistor, or connect these pins directly to ground.

M5 Input RX1_ENABLE Receiver 1 Enable Pin. When unused, connect this pin to ground with a pull-down resistor, or connect this pin directly to ground.

M6 Input TX1_ENABLE Transmitter 1 Enable Pin. When unused, connect this pin to ground with a pull-down resistor, or connect this pin directly to ground.

M7 Input RX2_ENABLE Receiver 2 Enable Pin. When unused, connect this pin to ground with a pull-down resistor, or connect this pin directly to ground.

M8 Input TX2_ENABLE Transmitter 2 Enable Pin. When unused, connect this pin to ground with a pull-down resistor, or connect this pin directly to ground.

M12 Input VDD_INTERFACE Input/Output Interface Supply, 1.8 V to 2.5 V. M13, M14 Output SYNCOUT0−, SYNCOUT0+ LVDS Output. These pins form the sync signal associated with transmitter

channel data on the JESD204B interface. When unused, do not connect these pins.


ADRV9009 Data Sheet


Pin No. Type Mnemonic Description N1 Input VDDA1P3_CLOCK_

VCO_LDO 1.3 V Use Separate Trace to Common Supply Point.

N3, N4 Output SERDOUT3−, SERDOUT3+ RF Current Mode Logic (CML) Differential Output 3. When unused, do not connect these pins.

N5, N6 Output SERDOUT2−, SERDOUT2+ RF CML Differential Output 2. When unused, do not connect these pins. N8, P8 Input VDDA1P3_SER 1.3 V Supply for JESD204B Serializer. N9, P9 Input VDDA1P3_DES 1.3 V Supply for JESD204B Deserializer. N10, N11 Input SERDIN1−, SERDIN1+ RF CML Differential Input 1. When unused, do not connect these pins. N13, N12 Input SERDIN0+, SERDIN0− RF CML Differential Input 0. When unused, do not connect these pins. P1 Output AUX_SYNTH_VTUNE Auxiliary Synthesizer VTUNE Output. P4, P5 Output SERDOUT1−, SERDOUT1+, RF CML Differential Output 1. When unused, do not connect these

pins. P6, P7 Output SERDOUT0−,

SERDOUT0+, RF CML Differential Output 0. When unused, do not connect these pins.

P11, P12 Input SERDIN3−, SERDIN3+ RF CML Differential Input 3. When unused, do not connect these pins. P13, P14 Input SERDIN2−, SERDIN2+ RF CML Differential Input 2. When unused, do not connect these pins.


Data Sheet ADRV9009


TYPICAL PERFORMANCE CHARACTERISTICS The temperature settings refer to the die temperature

75 MHz TO 525 MHz BAND 15

0

1

2

3

4

5

6

7

8

9

10

11

12

13

14

75 125 175 225 325275 375 425 475 525

TR

AN

SM

ITT

ER

CW

OU

TP

UT

PO

WE

R (

dB

m)

TRANSMITTER LO FREQUENCY (MHz)

Tx1 = +110°CTx1 = +25°CTx1 = –40°CTx2 = +110°CTx2 = +25°CTx2 = –40°C

16499-510

Figure 7. Transmitter CW Output Power vs. Transmitter LO Frequency, Transmitter QEC and External LO Leakage Active, Transmitter 50 MHz/100 MHz Bandwidth

Mode, IQ Rate = 122.88 MHz, Attenuation = 0 dB, Not De-Embedded

0

–100

–90

–80

–70

–60

–50

–40

–30

–20

–10

TR

AN

SM

ITT

ER

IM

AG

E R

EJE

CT

ION

(d

Bc)

+110°C ATTN = 20dB+110°C ATTN = 15dB+110°C ATTN = 10dB+110°C ATTN = 5dB+110°C ATTN = 0dB


–40°C ATTN = 20dB–40°C ATTN = 15dB–40°C ATTN = 10dB–40°C ATTN = 5dB–40°C ATTN = 0dB

–25 –20 –15 –10 –5 5 10 15 20 25

BASEBAND OFFSET FREQUENCY ANDTRANSMITTER ATTENUATION (MHz) 1

6499-511

Figure 8. Transmitter Image Rejection vs. Baseband Offset Frequency and Transmitter Attenuation, QEC Trained with Three Tones Placed at 10 MHz, 48 MHz, and 100 MHz (Tracking On), Total Combined Power = −10 dBFS,

Correction Then Frozen (Tracking Turned Off), CW Tone Swept Across Large Signal Bandwidth, LO = 75.2 MHz

0

–110

–100

–90

–80

–70

–60

–50

–40

–30

–20

–10

TR

AN

SM

ITT

ER

IM

AG

E R

EJE

CT

ION

(d

Bc)




–25 –20 –15 –10 –5 5 10 15 20 25BASEBAND OFFSET FREQUENCY AND

TRANSMITTER ATTENUATION FREQUENCY (MHz)

16499-512


Correction Then Frozen (Tracking Turned Off), CW Tone Swept Across Large Signal Bandwidth, LO = 300 MHz

0

–110

–90

–70

–50

–30

–10

–25 –20 –15 –10 –5 5 10 15 20 25

TR

AN

SM

ITT

ER

IM

AG

E R

EJE

CT

ION

(d

Bc)

BASEBAND OFFSET FREQUENCY ANDTRANSMITTER ATTENUATION (MHz)




16499-513


Correction Then Frozen (Tracking Turned Off), CW Tone Swept Across Large Signal Bandwidth, LO = 525 MHz


ADRV9009 Data Sheet


0.5

–0.5

–0.4

–0.3

–0.2

–0.1

0.1

0

0.2

0.3

0.4

–50 –40 –30 –20 0–10 10 20 4030 50

TR

AN

SM

ITT

ER

PA

SS

BA

ND

FL

AT

NE

SS

(d

B)

BASEBAND OFFSET FREQUENCY (MHz)


16499-514

Figure 11. Transmitter Pass Band Flatness vs. Baseband Offset Frequency, Off Chip Match Response De-Embedded, LO = 300 MHz, Calibrated at 25°C

–75

–95

–93

–91

–89

–87

–85

–83

–81

–79

–77

75 125 175 225 325275 375 425 475 525

TR

AN

SM

ITT

ER

LO

LE

AK

AG

E (

dB

FS

)



16499-515

Figure 12. Transmitter LO Leakage vs. Transmitter LO Frequency, Transmitter Attenuation = 0 dB, Baseband Tone Frequency = 10 MHz, Tracked

0

140

120

100

80

60

40

20

0 100 200 300 500400 600

TR

AN

SM

ITT

ER

TO

RE

CE

IVE

R I

SO

LA

TIO

N (

dB

)

RECEIVER LO FREQUENCY (MHz)

Tx1 – Rx1Tx1 – Rx2Tx2 – Rx1Tx2 – Rx2

16499-516

Figure 13. Transmitter to Receiver Isolation vs. Receiver LO Frequency, Temperature = 25°C

0

120

100

80

60

40

20

110

90

70

50

30

10

0 100 200 300 500400 600

TR

AN

SM

ITT

ER

TO

TR

AN

SM

ITT

ER

ISO

LA

TIO

N (

dB

)


Tx1 – Tx2Tx2 – Tx1

16499-517

Figure 14. Transmitter to Transmitter Isolation vs. Transmitter LO Frequency, Temperature = 25°C

–140

–170

–160

–150

–165

–155

–145

0 1 2 3 54 6 7 8 109 11 12 13 1514 16 17 18 19 20

TR

AN

SM

ITT

ER

NO

ISE

(d

Bm

/Hz)

TRANSMITTER ATTENUATOR SETTING (dB)

525MHz = +110°C300MHz = +110°C75MHz = +110°C525MHz = +25°C300MHz = +25°C75MHz = +25°C525MHz = –40°C300MHz = –40°C75MHz = –40°C

16499-518

Figure 15. Transmitter Noise vs. Transmitter Attenuator Setting, Offset = 50 MHz

–40

–75

–65

–55

–70

–60

–50

–45

0 2 4 6 108 12 14 16 18 20

TR

AN

SM

ITT

ER

AD

JAC

EN

T C

HA

NN

EL

LE

AK

AG

E R

AT

IO (

dB

c)


Tx1 +110°C (LOWER)Tx1 +110°C (UPPER)Tx1 +25°C (LOWER)Tx1 +25°C (UPPER)Tx1 –40°C (LOWER)Tx1 –40°C (UPPER)


16499-519

Figure 16. Transmitter Adjacent Channel Leakage Ratio vs. Transmitter Attenuator Setting, Signal Offset = 0 MHz, LO = 75 MHz, LTE = 20 MHz, Peak to Average Ratio (PAR) = 12 dB, DAC Boost Normal, Upper Side and Lower Side, Performance Limited by Spectrum Analyzer at Higher Attenuation Settings


Data Sheet ADRV9009


–40

–75

–65

–55

–70

–60

–50

–45

0 2 4 6 108 12 14 16 18 20

TR

AN

SM

ITT

ER

AD

JAC

EN

T C

HA

NN

EL

LE

AK

AG

E R

AT

IO (

dB

c)




16499-520

Figure 17. Transmitter Adjacent Channel Leakage Ratio vs. Transmitter Attenuator Setting, Signal Offset = 0 MHz, LO = 300 MHz, LTE = 20 MHz,

PAR = 12 dB, DAC Boost Normal, Upper Side and Lower Side, Performance Limited by Spectrum Analyzer at Higher Attenuation Settings

–40

–75

–65

–55

–70

–60

–50

–45

0 2 4 6 108 12 14 16 18 20

TR

AN

SM

ITT

ER

AD

JAC

EN

T C

HA

NN

EL

LE

AK

AG

E R

AT

IO (

dB

c)




16499-521

Figure 18. Transmitter Adjacent Channel Leakage Ratio vs. Transmitter Attenuator Setting, Signal Offset = 0 MHz, LO = 525 MHz, LTE = 20 MHz,

PAR = 12 dB, DAC Boost Normal, Upper Side and Lower Side, Performance Limited by Spectrum Analyzer at Higher Attenuation Settings

50

0

10

20

30

5

15

25

35

40

45

0 2 8 14 26204 10 16 28226 12 18 3024 32

TR

AN

SM

ITT

ER

OIP

3, R

IGH

T (

dB

m)


+110°C+25°C–40°C

16499-522

Figure 19. Transmitter OIP3 Right vs. Transmitter Attenuator Setting, LO = 75 MHz, Total Root Mean Square (RMS) Power = −12 dBFS, 20 MHz/25 MHz Tones

50

0

10

20

30

5

15

25

35

40

45

0 2 8 14 26204 10 16 28226 12 18 3024 32

TR

AN

SM

ITT

ER

OIP

3, R

IGH

T (

dB

m)


+110°C+25°C–40°C

16499-523

Figure 20. Transmitter OIP3 Right vs. Transmitter Attenuator Setting, LO = 300 MHz, Total RMS Power = −12 dBFS, 20 MHz/25 MHz Tones

50

0

10

20

30

5

15

25

35

40

45

0 2 8 14 26204 10 16 28226 12 18 3024 32

TR

AN

SM

ITT

ER

OIP

3, R

IGH

T (

dB

m)


+110°C+25°C–40°C

16499-524

Figure 21. Transmitter OIP3 Right vs. Transmitter Attenuator Setting, LO = 525 MHz, Total RMS Power = −12 dBFS, 20 MHz/25 MHz Tones

50

0

10

20

30

5

15

25

35

40

45

1015

1520

510

2025

TR

AN

SM

ITT

ER

OIP

3, R

IGH

T (

dB

m)

BASEBAND TONE PAIR SWEPT ACROSS PASS BAND (MHz)


16499-525

Figure 22. Transmitter OIP3 Right vs. Baseband Tone Pair Swept Across Pass Band, LO = 75 MHz, Total RMS Power = −12 dBFS, Transmitter Attenuation = 4 dB


ADRV9009 Data Sheet


50

0

10

20

30

5

15

25

35

40

45

1015

1520

510

2025

TR

AN

SM

ITT

ER

OIP

3, R

IGH

T (

dB

m)

BASEBAND FREQUENCY OFFSET (MHz)


16499-526

Figure 23. Transmitter OIP3 Right vs. Baseband Frequency Offset, LO = 300 MHz, Total RMS Power = −12 dBFS, Transmitter Attenuation = 4 dB

50

0

10

20

30

5

15

25

35

40

45

1015

1520

510

2025

TR

AN

SM

ITT

ER

OIP

3, R

IGH

T (

dB

m)



16499-527

Figure 24. Transmitter OIP3 Right vs. Baseband Frequency Offset, LO = 525 MHz, Total RMS Power = −12 dBFS, Transmitter Attenuation = 4 dB

0

–20

–120

–100

–80

–60

–40

0 4 8 12 2016 24 28 32

TR

AN

SM

ITT

ER

HD

2 (d

Bc)


+110°C = (UPPER)+110°C = (HD2)+25°C = (UPPER)+25°C = (HD2)–40°C = (UPPER)–40°C = (HD2)

2 6 10 1814 22 26 30

16499-528

Figure 25. Transmitter HD2 vs. Transmitter Attenuator Setting, Baseband Frequency = 10 MHz, LO = 75 MHz, CW = −15 dBFS

0

–20

–120

–100

–80

–60

–40

0 4 8 12 2016 24 28 32

TR

AN

SM

ITT

ER

HD

2 (d

Bc)



2 6 10 1814 22 26 30

16499-529


0

–20

–120

–100

–80

–60

–40

0 4 8 12 2016 24 28 32

TR

AN

SM

ITT

ER

HD

2 (d

Bc)



2 6 10 1814 22 26 30

16499-530


0

–20

–100

–90

–80

–60

–40

–10

–70

–50

–30

0 4 8 12 2016 24 28 32

TR

AN

SM

ITT

ER

HD

3 (d

Bc)



2 6 10 1814 22 26 30

16499-531

Figure 28. Transmitter HD3 vs. Transmitter Attenuator Setting, LO = 75 MHz, CW = −15 dBFS, Baseband Frequency = 10 MHz


Data Sheet ADRV9009


0

–20

–120

–110

–100

–90

–80

–60

–40

–10

–70

–50

–30

0 4 8 12 2016 24 28 32

TR

AN

SM

ITT

ER

HD

3 (d

Bc)



2 6 10 1814 22 26 30

16499-532


0

–20

–120

–110

–100

–90

–80

–60

–40

–10

–70

–50

–30

0 4 8 12 2016 24 28 32

TR

AN

SM

ITT

ER

HD

3 (d

Bc)



2 6 10 1814 22 26 30

16499-533


0

–20

–120

–110

–100

–90

–80

–60

–40

–10

–70

–50

–30

0 4 8 12 2016 24 28 32

TR

AN

SM

ITT

ER

HD

3 IM

AG

E (

dB

c)A

PP

EA

RS

ON

SA

ME

SID

E A

S D

ES

IRE

D S

IGN

AL



2 6 10 1814 22 26 30

16499-534

Figure 31. Transmitter HD3 Image Appears on Same Side as Desired Signal vs. Transmitter Attenuator Setting, LO = 75 MHz, CW = −15 dBFS

0

–20

–120

–110

–100

–90

–80

–60

–40

–10

–70

–50

–30

0 4 8 12 2016 24 28 32

TR

AN

SM

ITT

ER

HD

3 IM

AG

E (

dB

c)A

PP

EA

RS

ON

SA

ME

SID

E A

S D

ES

IRE

D S

IGN

AL



2 6 10 1814 22 26 30

16499-535


0

–20

–130

–120

–110

–100

–90

–80

–60

–40

–10

–70

–50

–30

0 4 8 12 2016 24 28 32

TR

AN

SM

ITT

ER

HD

3 IM

AG

E (

dB

c)A

PP

EA

RS

ON

SA

ME

SID

E A

S D

ES

IRE

D S

IGN

AL



2 6 10 1814 22 26 30

16499-536


0.03

–0.02

–0.01

0

0.01

0.02

TR

AN

SM

ITT

ER

AT

TE

NU

AT

OR

ST

EP

ER

RO

R (

dB

)


0 4 8 12 2016 24 28 322 6 10 1814 22 26 30

+110°C+25°C–40°C

16499-537

Figure 34. Transmitter Attenuator Step Error vs. Transmitter Attenuator Setting, LO = 75 MHz, Baseband Frequency = 10 MHz, Backoff = 15 dBFS


ADRV9009 Data Sheet


0.03

–0.02

–0.01

0

0.01

0.02

TR

AN

SM

ITT

ER

AT

TE

NU

AT

OR

ST

EP

ER

RO

R (

dB

)


0 4 8 12 2016 24 28 322 6 10 1814 22 26 30

+110°C+25°C–40°C

16499-538


0.03

–0.02

–0.01

0

0.01

0.02

TR

AN

SM

ITT

ER

AT

TE

NU

AT

OR

ST

EP

ER

RO

R (

dB

)


0 4 8 12 2016 24 28 322 6 10 1814 22 26 30

+110°C+25°C–40°C

16499-539


–30

–50

–46

–42

–38

–34

–32

–48

–44

–40

–36

TR

AN

SM

ITT

ER

EV

M (

dB

)

TRANSMITTER ATTENUATION (dB)

0 10 20 255 15

+110°C+25°C–40°C

16499-540

Figure 37. Transmitter EVM vs. Transmitter Attenuation, LTE = 20 MHz, Signal Centered on DC, LO = 75 MHz

–30

–50

–46

–42

–38

–34

–32

–48

–44

–40

–36

TR

AN

SM

ITT

ER

EV

M (

dB

)


0 10 20 255 15

+110°C+25°C–40°C

16499-541


–30

–50

–46

–42

–38

–34

–32

–48

–44

–40

–36T

RA

NS

MIT

TE

R E

VM

(d

B)


0 10 20 255 15

+110°C+25°C–40°C

16499-542


0

–100

–80

–60

–40

–20

–10

–90

–70

–50

–30

OB

SE

RV

AT

ION

RE

CE

IVE

R L

O L

EA

KA

GE

(d

Bm

)

LO FREQUENCY (MHz)

75 225 425 525125 325275 475175 375

+110°C+25°C–40°C

16499-143

Figure 40. Observation Receiver LO Leakage vs. LO Frequency, LO = 75 MHz, 300 MHz, and 525 MHz, Attenuation = 0 dB


Data Sheet ADRV9009


25

0

5

15

20

10

OB

SE

RV

AT

ION

RE

CE

IVE

R N

OIS

E F

IGU

RE

(d

Bm

)

OBSERVATION RECEIVER ATTENUATOR SETTING (dB)

0 3 7 1091 54 82 6

+110°C+25°C–40°C

16499-144

Figure 41. Observation Receiver Noise Figure vs. Observation Receiver Attenuator Setting, LO = 75 MHz, Total Nyquist Integration Bandwidth

25

0

5

15

20

10

OB

SE

RV

AT

ION

RE

CE

IVE

R N

OIS

E F

IGU

RE

(d

Bm

)


0 3 7 1091 54 82 6

+110°C+25°C–40°C

16499-145


25

0

5

15

20

10

OB

SE

RV

AT

ION

RE

CE

IVE

R N

OIS

E F

IGU

RE

(d

Bm

)


0 3 7 1091 54 82 6

+110°C+25°C–40°C

16499-146


80

30

40

60

70

50

75

35

55

65

45

OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP2,

SU

M A

ND

DIF

FE

RE

NC

E P

RO

DU

CT

S (

dB

m)

f1 OFFSET FREQUENCY (MHz)

8081

9596

115116

120121

8586

105106

100101

9091

110111

IIP2 SUM +110°CIIP2 SUM +25°CIIP2 SUM –40°CIIP2 DIFF +110°CIIP2 DIFF +25°CIIP2 DIFF –40°C

16499-147

Figure 44. Observation Receiver IIP2, Sum and Difference Products vs. f1 (Where f1 is Frequency 1) Offset Frequency, Tones Separated by 1 MHz Swept

Across Pass Band at −25 dBm Each, LO = 75 MHz, Attenuation = 0 dB

80

40

60

70

50

75

55

65

45

OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP2,

SU

M A

ND

DIF

FE

RE

NC

E P

RO

DU

CT

S (

dB

m)


305306

320321

340341

355356

350351

345346

310311

330331

325326

315316

335336


16499-148

Figure 45. Observation Receiver IIP2, Sum and Difference Products vs. f1 Offset Frequency, Tones Separated by 1 MHz Swept Across Pass Band at

−25 dBm Each, LO = 300 MHz, Attenuation = 0 dB

80

40

60

70

50

75

55

65

45

OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP2,

SU

M A

ND

DIF

FE

RE

NC

E P

RO

DU

CT

S (

dB

m)


530531

545546

565566

380381

575576

570571

535536

555556

550551

540541

560561


16499-149




ADRV9009 Data Sheet


100

90

50

70

80

60

85

95

65

75

55

OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP2,

SU

M A

ND

DIF

FE

RE

NC

E P

RO

DU

CT

S (

dB

m)

OBSERVATION RECEIVER ATTENUATION (dB)

0 6 14 2018162 1084 12


16499-150

Figure 47. Observation Receiver IIP2, Sum and Difference Products vs. Observation Receiver Attenuation, LO = 75 MHz, Tone 1 = 95 MHz, Tone 2 = 96 MHz at

−25 dBm Plus Attenuation

100

90

50

70

80

60

85

95

65

75

55

OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP2,

SU

M A

ND

DIF

FE

RE

NC

E P

RO

DU

CT

S (

dB

m)


0 6 14 2018162 1084 12


16499-151

Figure 48. Observation Receiver IIP2, Sum and Difference Products vs. Observation Receiver Attenuation, LO = 300 MHz, Tone 1 = 320 MHz,

Tone 2 = 321 MHz at −25 dBm Plus Attenuation

95

90

50

70

80

60

85

65

75

55

OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP2,

SU

M A

ND

DIF

FE

RE

NC

E P

RO

DU

CT

S (

dB

m)


0 6 14 2018162 1084 12


16499-152

Figure 49. Observation Receiver IIP2, Sum and Difference Products vs. Observation Receiver Attenuation, LO = 525 MHz, Tone 1 = 545 MHz, Tone 2 = 546 MHz at


80

0

40

60

20

70

30

50

10

OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP2,

f1

– f2

(d

Bm

)

INTERMODULATION FREQUENCY (MHz)

7782

77107

77102

7792

7787

7797


16499-153

Figure 50. Observation Receiver IIP2, f1 − f2 (Where f2 is Frequency 2) vs. Intermodulation Frequency, LO = 75 MHz, Tone 1 = 77 MHz,

Tone 2 = Swept, −25 dBm Each, Attenuation = 0 dB

80

0

40

60

20

70

30

50

10

OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP2,

f1

– f2

(d

Bm

)


302307

302357

302347

302327

302317

302337

302352

302342

302322

302312

302332


16499-154

Figure 51. Observation Receiver IIP2, f1 − f2 vs. Intermodulation Frequency, LO = 300 MHz, Tone 1 = 302 MHz, Tone 2 = Swept, −25 dBm Each,

Attenuation = 0 dB

80

0

40

60

20

70

30

50

10

OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP2,

f1

– f2

(d

Bm

)

INTERMODULATION FREQUENCY

527532

527582

527577

527557

527547

527567

527572

527552

527542

527562


16499-155

Figure 52. Observation Receiver IIP2, f1 − f2 vs. Intermodulation Frequency, LO = 525 MHz, Tone 1 = 527 MHz, Tone 2 = Swept, −25 dBm Each, Attenuation = 0 dB


Data Sheet ADRV9009


90

50

70

80

60

85

65

75

55

OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP2,

f1

– f2

(d

Bm

)


0 6 14 2018162 1084 12


16499-156

Figure 53. Observation Receiver IIP2, f1 − f2 vs. Observation Receiver Attenuation, LO = 75 MHz, Tone 1 = 77 MHz, Tone 2 = 97 MHz at −25 dBm

Plus Attenuation

90

50

70

80

60

85

65

75

55

OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP2,

f1

– f2

(d

Bm

)


0 6 14 2018162 1084 12


16499-157

Figure 54. Observation Receiver IIP2, f1 − f2 vs. Observation Receiver Attenuation, LO = 300 MHz, Tone 1 = 302 MHz, Tone 2 = 322 MHz at


90

50

70

80

60

85

65

75

55

OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP2,

f1

– f2

(d

Bm

)


0 6 14 2018162 1084 12


16499-158

Figure 55. Observation Receiver IIP2, f1 − f2 vs. Observation Receiver Attenuation, LO = 525 MHz, Tone 1 = 527 MHz, Tone 2 = 547 MHz at −25 dBm Plus Attenuation

10

0

2

6

8

4

9

1

5

7

3

OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP3,

2f1

– f

2 (d

Bm

)

8081


9596

115116

130131

125126

8586

105106

100101

120121

9091

110111

ORx1 = +110°CORx1 = +25°CORx1 = –40°C

16499-159

Figure 56. Observation Receiver IIP3, 2f1 (Where 2f1 is 2 × f1) − f2 vs. Intermodulation Frequency, LO = 75 MHz, Attenuation = 0 dB, Tones Separated

by 1 MHz Swept Across Pass Band at −25 dBm Each

25

0

10

20

5

15

OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP3,

2f1

– f

2 (d

Bm

)


305306

320321

340341

355356

350351

310311

330331

325326

345346

315316

335336

ORx1 = +110°CORx1 = +25°CORx1 = –40°C

16499-160

Figure 57. Observation Receiver IIP3, 2f1 − f2 vs. f1 Offset Frequency, LO = 300 MHz, Attenuation = 0 dB, Tones Separated by 1 MHz Swept Across Pass Band

at −25 dBm Each

25

0

10

20

5

15

OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP3,

2f1

– f

2 (d

Bm

)


0 4 10862

IIP3 = +110°CIIP3 = +25°CIIP3 = –40°C

16499-161

Figure 58. Observation Receiver IIP3, 2f1 − f2 vs. Observation Receiver Attenuation, LO = 75 MHz, Tone 1 = 100 MHz, Tone 2 = 101 MHz at −24 dBm

Plus Attenuation


ADRV9009 Data Sheet


25

0

10

20

5

15

OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP3,

2f1

– f

2 (d

Bm

)

ATTENUATION (dB)

0 4 10862

IIP3 = +110°CIIP3 = +25°CIIP3 = –40°C

16499-162

Figure 59. Observation Receiver IIP3, 2f1 − f2 vs. Attenuation, LO = 300 MHz, Tone 1 = 345 MHz, Tone 2 = 346 MHz at −24 dBm Plus Attenuation

18

0

2

10

14

6

16

8

12

4

OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP3,

2f1

– f

2 (d

Bm

)

SWEPT PASS BAND FREQUENCY (MHz)

302307

302322

302342

302357

302352

302312

302332

302327

302347

302317

302337

ORx1 = +110°CORx1 = +25°CORx1 = –40°C

16499-163

Figure 60. Observation Receiver IIP3, 2f1 − f2 vs. Swept Pass Band Frequency, LO = 300 MHz, Attenuation = 0 dB, Tone 1 = 302 MHz, Tone 2 = Swept Across

the Pass Band, Tones Separated by 1 MHz Swept Across Pass Band at −19 dBm Each

22

0

12

20

8

16

10

18

14

OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP3,

2f1

– f

2 (d

Bm

)


0 4 10862

IIP3 = +110°CIIP3 = +25°CIIP3 = –40°C

16499-164

Figure 61. Observation Receiver IIP3, 2f1 − f2 vs. Observation Receiver Attenuation, LO = 300 MHz, Tone 1 = 302 MHz, Tone 2 = 352 MHz at


–70

–120

–115

–110

–105

–100

–95

–90

–85

–80

–75

–50 –40 –30 –20 0–10 10 20 30 5040

OB

SE

RV

AT

ION

RE

CE

IVE

R I

MA

GE

RE

JEC

TIO

N (

dB

c)

BASEBAND FREQUENCY OFFSET (MHz) AND ATTENUATION

+110°C = 10dB+25°C = 10dB–40°C = 10dB+110°C = 0dB+25°C = 0dB–40°C = 0dB

16499-165

Figure 62. Observation Receiver Image Rejection vs. Baseband Frequency Offset and Attenuation, CW Signal Swept Across the Pass Band, LO = 75 MHz

–70

–120

–115

–110

–105

–100

–95

–90

–85

–80

–75

–50 –40 –30 –20 0–10 10 20 30 5040

OB

SE

RV

AT

ION

RE

CE

IVE

R I

MA

GE

RE

JEC

TIO

N (

dB

c)

BASEBAND FREQUENCY OFFSET (MHz) AND ATTENUATION


16499-166


20

4

8

12

16

18

6

10

14

OB

SE

RV

AT

ION

RE

CE

IVE

R G

AIN

(d

B)


0 4 8 102 63 7 91 5

+110°C+25°C–40°C

16499-167

Figure 64. Observation Receiver Gain vs. Observation Receiver Attenuation, LO = 75 MHz


Data Sheet ADRV9009


20

4

8

12

16

18

6

10

14

OB

SE

RV

AT

ION

RE

CE

IVE

R G

AIN

(d

B)


0 4 8 102 63 7 91 5

+110°C+25°C–40°C

16499-168


0.5

–0.5

–0.1

0.1

0.3

0.4

–0.3

–0.2

–0.4

0

0.2

OB

SE

RV

AT

ION

RE

CE

IVE

R G

AIN

ST

EP

ER

RO

R (

dB

)

OBSERVATION RECEIVER ATTENUATOR (dB)

0 4 8 102 63 7 91 5

+110°C+25°C–40°C

16499-169

Figure 66. Observation Receiver Gain Step Error vs. Observation Receiver Attenuator, LO = 75 MHz

0.5

–0.5

–0.1

0.1

0.3

0.4

–0.3

–0.2

–0.4

0

0.2

OB

SE

RV

AT

ION

RE

CE

IVE

R G

AIN

ST

EP

ER

RO

R (

dB

)

0 4 8 102 63 7 91 5

+110°C+25°C–40°C

OBSERVATION RECEIVER ATTENUATOR (dB) 16499-170

Figure 67. Observation Receiver Gain Step Error vs. Observation Receiver Attenuator, LO = 325 MHz

0.5

–0.5

–0.1

0.1

0.3

0.4

–0.3

–0.2

–0.4

0

0.2

OB

SE

RV

AT

ION

RE

CE

IVE

R A

TT

EN

UA

TO

RG

AIN

ST

EP

ER

RO

R (

dB

)

0 4 8 102 63 7 91 5

+110°C+25°C–40°C

OBSERVATION RECEIVER ATTENUATOR (dB) 16499-171

Figure 68. Observation Receiver Attenuator Gain Step Error vs. Observation Receiver Attenuator, LO = 525 MHz

0.5

–1.0

–0.9

–0.8

–0.7

–0.6

–0.5

–0.4

–0.3

–0.2

–0.1

0

0.1

0.2

0.3

0.4

0.99

8

5.00

6

9.01

4

12.9

82

25.0

06

17.0

02

32.9

86

41.0

14

48.9

98

56.9

98

21.0

02

29.0

06

37.0

06

45.0

02

53.0

46

NO

RM

AL

IZE

D O

BS

ER

VA

TIO

N R

EC

EIV

ER

BA

SE

BA

ND

FL

AT

NE

SS

(d

B)


I RIPPLE = +110°CI RIPPLE = +25°CI RIPPLE = –40°CQ RIPPLE = +110°CQ RIPPLE = +25°CQ RIPPLE = –40°C

16499-172

Figure 69. Normalized Observation Receiver Baseband Flatness vs. Baseband Offset Frequency, LO = 75 MHz, Attenuation = 0 dB

0

–120

–40

–20

–80

–60

–100

OB

SE

RV

AT

ION

RE

CE

IVE

R D

C O

FF

SE

T (

dB

FS

)

0 105

+110°C+25°C–40°C

OBSERVATION RECEIVER ATTENUATION (dB) 16499-173

Figure 70. Observation Receiver DC Offset vs. Observation Receiver Attenuation, LO = 75 MHz, Baseband Frequency = 50 MHz


ADRV9009 Data Sheet


0

–120

–40

–20

–80

–60

–100

OB

SE

RV

AT

ION

RE

CE

IVE

R D

C O

FF

SE

T (

dB

FS

)

0 105

+110°C+25°C–40°C

OBSERVATION RECEIVER ATTENUATION (dB) 16499-174

Figure 71. Observation Receiver DC Offset vs. Observation Receiver Attenuation, LO = 325 MHz, Baseband Frequency = 50 MHz

0

–120

–40

–20

–80

–60

–100

OB

SE

RV

AT

ION

RE

CE

IVE

R H

D2

(dB

c)

–50 503010–10–30

HD2 RIGHT ATTN = 0 +110°CHD2 RIGHT ATTN = 10 +110°CHD2 LEFT ATTN = 0 +110°CHD2 LEFT ATTN = 10 +110°CHD2 RIGHT ATTN = 0 +25°CHD2 RIGHT ATTN = 10 +25°CHD2 LEFT ATTN = 0 +25°CHD2 LEFT ATTN = 10 +25°CHD2 RIGHT ATTN = 0 –40°CHD2 RIGHT ATTN = 10 –40°CHD2 LEFT ATTN = 0 –40°CHD2 LEFT ATTN = 10 –40°C

OFFSET FREQUENCY AND ATTENUATION (MHz) 16499-175

Figure 72. Observation Receiver HD2 vs. Offset Frequency and Attenuation, LO = 75 MHz, Tone Level = −21 dBm Plus Attenuation

0

–120

–40

–20

–80

–60

–100

OB

SE

RV

AT

ION

RE

CE

IVE

R H

D2

(dB

c)

–50 503010–10–30

HD2 RIGHT ATTN = 0 +110°CHD2 RIGHT ATTN = 10 +110°CHD2 LEFT ATTN = 0 +110°CHD2 LEFT ATTN = 10 +110°CHD2 RIGHT ATTN = 0 +25°CHD2 RIGHT ATTN = 10 +25°CHD2 LEFT ATTN = 0 +25°CHD2 LEFT ATTN = 10 +25°CHD2 RIGHT ATTN = 0 –40°CHD2 RIGHT ATTN = 10 –40°CHD2 LEFT ATTN = 0 –40°CHD2 LEFT ATTN = 10 –40°C

OFFSET FREQUENCY AND ATTENUATION (MHz) 16499-176

Figure 73. Observation Receiver HD2 vs. Offset Frequency and Attenuation, LO = 300 MHz, Tone Level = −22 dBm Plus Attenuation

–10

–150

–50

–30

–90

–70

–110

–130OB

SE

RV

AT

ION

RE

CE

IVE

R H

D3

(dB

c)

–50 503010–20–40 4020–10–30

FREQUENCY OFFSET FROM LO

HD3 RIGHT dBc = +110°CHD3 RIGHT dBc = +25°CHD3 RIGHT dBc = –40°CHD3 LEFT dBc = = +110°CHD3 LEFT dBc = +25°CHD3 LEFT dBc = –40°C

16499-177

Figure 74. Observation Receiver HD3 vs. Frequency Offset from LO, Tone Level = −21 dBm at Attenuation = 0 dB, LO = 75 MHz

–10

–150

–50

–30

–90

–70

–110

–130OB

SE

RV

AT

ION

RE

CE

IVE

R H

D3

(dB

c)

–50 503010–20–40 4020–10–30



16499-178


–10

–150

–50

–30

–90

–70

–110

–130OB

SE

RV

AT

ION

RE

CE

IVE

R H

D3

(dB

c)

–50 503010–20–40 4020–10525

–30



16499-179



Data Sheet ADRV9009


0

140

40

20

80

60

100

120

130

30

10

70

50

90

110

TR

AN

SM

ITT

ER

TO

OB

SE

RV

AT

ION

RE

CE

IVE

R I

SO

LA

TIO

N (

dB

)

0 600500300100 400200LO FREQUENCY (MHz)

Tx1 TO ORx1Tx2 TO ORx1Tx1 TO ORx2Tx2 TO ORx2

16499-180

Figure 77. Transmitter to Observation Receiver Isolation vs. LO Frequency, Temperature = 25°C

–80–85–90–95

–100–105–110–115–120–125–130–135–140–145–150–155–160–165–170

100 1k 10k 100k 1M 10M 100M

LO

PH

AS

E N

OIS

E (

dB

c/H

z)

FREQUENCY OFFSET (Hz)

100Hz = –110.00dBc/Hz1kHz = –120.75dBc/Hz10kHz = –126.54dBc/Hz100kHz = –132.76dBc/Hz1MHz = –150.09dBc/Hz10MHz = –151.09dBc/Hz100MHz = –150.74dBc/Hz

16499-077

Figure 78. LO Phase Noise vs. Frequency Offset, LO = 75 MHz, PLL Loop Bandwidth = 50 kHz

–80–85–90–95

–100–105–110–115–120–125–130–135–140–145–150–155–160–165–170

100 1k 10k 100k 1M 10M 100M

LO

PH

AS

E N

OIS

E (

dB

c/H

z)



16499-078


–80–85–90–95

–100–105–110–115–120–125–130–135–140–145–150–155–160–165–170

100 1k 10k 100k 1M 10M 100M

LO

PH

AS

E N

OIS

E (

dB

c/H

z)



16499-079


0

–100

–40

–20

–80

–90

–60

–30

–10

–70

–50

RE

CE

IVE

R L

O L

EA

KA

GE

(d

Bm

)

75 525475275125 375 425225 325175RECEIVER LO FREQUENCY (MHz)

+110°C+25°C–40°C

16499-581

Figure 81. Receiver LO Leakage vs. Receiver LO Frequency = 75 MHz, 300 MHz, and 525 MHz, Receiver Attenuation = 0 dB, RF Bandwidth =

50 MHz, Sample Rate = 61.44 MSPS

45

0

25

35

5

15

30

40

10

20

RE

CE

IVE

R N

OIS

E F

IGU

RE

(d

B)

0 20181682 12 146 104RECEIVER ATTENUATION (dB)

+110°C+25°C–40°C

16499-582

Figure 82. Receiver Noise Figure vs. Receiver Attenuation, LO = 75 MHz, RF Bandwidth = 50 MHz, Sample Rate = 61.44 MSPS, Integration

Bandwidth = 1 MHz to 25 MHz


ADRV9009 Data Sheet


45

0

25

35

5

15

30

40

10

20

RE

CE

IVE

R N

OIS

E F

IGU

RE

(d

B)


+110°C+25°C–40°C

16499-583



45

0

25

35

5

15

30

40

10

20

RE

CE

IVE

R N

OIS

E F

IGU

RE

(d

B)


+110°C+25°C–40°C

16499-584



20

0

12

16

2

4

8

14

18

6

10

RE

CE

IVE

R N

OIS

E F

IGU

RE

(d

B)

75 475175 375275RECEIVER LO FREQUENCY (MHz)

+110°C+25°C–40°C

16499-585

Figure 85. Receiver Noise Figure vs. Receiver LO Frequency, Receiver Attenuation = 0 dB, RF Bandwidth = 50 MHz, Sample Rate = 61.44 MSPS,

Integration Bandwidth = ±25 MHz

20

18

8

10

14

12

16

RE

CE

IVE

R N

OIS

E F

IGU

RE

(d

B)

–25 2515–15 5–5RECEIVER OFFSET FREQUENCY FROM LO (75MHz)

+110°C+25°C–40°C

16499-589

Figure 86. Receiver Noise Figure vs. Receiver Offset Frequency from LO, Integration Bandwidth = 200 kHz, LO = 75 MHz

20

18

8

10

14

12

16R

EC

EIV

ER

NO

ISE

FIG

UR

E (

dB

)


+110°C+25°C–40°C

16499-590


20

18

8

10

14

12

16

RE

CE

IVE

R N

OIS

E F

IGU

RE

(d

B)


+110°C+25°C–40°C

16499-591



Data Sheet ADRV9009


100

50

55

60

65

70

75

80

85

90

95

0 2 4 8 1612 20 24 286 1410 18 22 26 30

RE

CE

IVE

R I

IP2

(dB

m)

RECEIVER ATTENUATION (dB)

+110°C (SUM)+25°C (SUM)–40°C (SUM)+110°C (DIFF)+25°C (DIFF) –40°C (DIFF)

16499-592

Figure 89. Receiver IIP2 vs. Receiver Attenuation, LO = 75 MHz, Tones Placed at 82.5 MHz and 83.5 MHz, −23.5 dBm Plus Attenuation

110

50

60

70

80

90

100

0 2 4 8 1612 20 24 286 1410 18 22 26 30

RE

CE

IVE

R I

IP2

(dB

m)



16499-593

Figure 90. Receiver IIP2 vs. Receiver Attenuation, LO = 300 MHz, Tones Placed at 310 MHz and 311 MHz, −23.5 dBm Plus Attenuation

80

40

45

55

50

60

65

70

75

80.081.0

82.583.5

87.588.5

92.593.5

97.598.5

90.091.0

100.0101.0

95.096.0

102.5103.5

RE

CE

IVE

R I

IP2

SU

M A

ND

DIF

FE

RE

NC

EA

CR

OS

S B

AN

DW

IDT

H (

dB

m)



16499-594

Figure 91. Receiver IIP2 Sum and Difference Across Bandwidth vs. Swept Pass Band Frequency, Receiver Attenuation = 0 dB, LO = 75 MHz, 10 Tone Pairs,

−23.5 dBm Each

80

40

45

55

50

60

65

70

75

305.0306.0

307.5308.5

310.0311.0

315.0316.0

320.0321.0

312.5313.5

322.5323.5

317.5318.5

327.5328.5

325.0326.0

RE

CE

IVE

R I

IP2

SU

M A

ND

DIF

FE

RE

NC

EA

CR

OS

S B

AN

DW

IDT

H (

dB

m)



16499-595

Figure 92. Receiver IIP2 Sum and Difference Across Bandwidth vs. Swept Pass Band Frequency, Receiver Attenuation = 0 dB, LO = 300 MHz, 10 Tone Pairs,

−23.5 dBm Each

110

50

60

70

80

90

100

0 5 10 15 2520 30

RE

CE

IVE

R I

IP2

(dB

m)


Rx1 (SUM) = +110°CRx1 (DIFF) = +110°CRx1 (SUM) = +25°CRx1 (DIFF) = +25°CRx1 (SUM) = –40°CRx1 (DIFF) = –40°C


16499-596

Figure 93. Receiver IIP2 vs. Receiver Attenuation, LO = 75 MHz, Tones Placed at 77 MHz and 97 MHz, −23.5 dBm Plus Attenuation

80

40

45

50

55

65

75

60

70

79.577.0

82.077.0

84.577.0

87.077.0

97.077.0

92.077.0

94.577.0

89.577.0

99.577.0

RE

CE

IVE

R I

IP2

SU

M A

ND

DIF

FE

RE

NC

EA

CR

OS

S B

AN

DW

IDT

H (

dB

m)




16499-597

Figure 94. Receiver IIP2 Sum and Difference Across Bandwidth vs. Swept Pass Band Frequency, Receiver Attenuation = 0 dB, LO = 75 MHz, Tone 1 =

77 MHz, Tone 2 Swept, −23.5 dBm Each


ADRV9009 Data Sheet


50

0

5

10

15

20

25

30

35

40

45

0 5 10 15 2520 30

RE

CE

IVE

R I

IP3

(dB

m)

ATTENUATION (dB)

Rx1 = +110°CRx1 = +25°CRx1 = –40°CRx2 = +110°CRx2 = +25°CRx2 = –40°C

16499-598

Figure 95. Receiver IIP3 vs. Attenuation, LO = 300 MHz, Tone 1 = 325 MHz, Tone 2 = 326 MHz, −21 dBm Plus Attenuation

25

0

5

10

15

20

305.0306.0

307.5308.5

310.0311.0

312.5313.5

315.0316.0

317.5318.5

320.0321.0

322.5323.5

325.0326.0

327.5328.5

RE

CE

IVE

R I

IP3

(dB

m)



16499-599

Figure 96. Receiver IIP3 vs. Swept Pass Band Frequency, Receiver Attenuation = 0 dB, LO = 300 MHz, Tone 2 = Tone 1 + 1 MHz, −21 dBm Each

50

0

5

10

15

20

25

30

35

40

45

0 5 10 20 3025 35

RE

CE

IVE

R I

IP3

(dB

m)

ATTENUATION (dB)


16499-600


25

0

5

10

15

20

302.0304.5

302.0307.0

302.0309.5

302.0314.5

302.0312.0

302.0317.0

302.0319.5

302.0322.0

302.0324.5

302.0327.0

RE

CE

IVE

R I

IP3

(dB

m)



16499-601

Figure 98. Receiver IIP3 vs. Swept Pass Band Frequency, Receiver Attenuation = 0 dB, LO = 300 MHz, Tone 1 = 302 MHz, Tone 2 = Swept Across Pass Band,

−19 dBm Each

–10

–110

–90

–70

–50

–100

–80

–60

–40

–30

–20

–25 –20 –5 10–15 0 15–10 5 20 25

RE

CE

IVE

R I

MA

GE

(d

Bc)

BASEBAND FREQUENCY OFFSET

+110°C+25°C–40°C

16499-602

Figure 99. Receiver Image vs. Baseband Frequency Offset, Attenuation = 0 dB, RF Bandwidth = 50 MHz, Tracking Calibration Active,

Sample Rate = 61.44 MSPS, LO = 75 MHz

–10

–110

–90

–70

–50

–100

–80

–60

–40

–30

–20

–25 –20 –5 10–15 0 15–10 5 20 25

RE

CE

IVE

R I

MA

GE

(d

Bc)


+110°C+25°C–40°C

16499-603




Data Sheet ADRV9009


–10

–110

–90

–70

–50

–100

–80

–60

–40

–30

–20

–25 –20 –5 10–15 0 15–10 5 20 25

RE

CE

IVE

R I

MA

GE

(d

Bc)


+110°C+25°C–40°C

16499-604



0

–120

–80

–100

–60

–40

–20

0 155 2010 25 30

RE

CE

IVE

R I

MA

GE

(d

Bc)

ATTENUATOR SETTING (dB)

+110°C+25°C–40°C

16499-605

Figure 102. Receiver Image vs. Attenuator Setting, RF Bandwidth = 25 MHz, Tracking Calibration Active, Sample Rate = 61.44 MSPS, LO = 75 MHz,

Baseband Frequency = 25 MHz

0

–120

–80

–100

–60

–40

–20

0 155 2010 25 30

RE

CE

IVE

R I

MA

GE

(d

Bc)


+110°C+25°C–40°C

16499-606



25

–15

–5

–10

0

5

15

10

20

0 155 2010 25 30

RE

CE

IVE

R G

AIN

(d

B)

RECEIVER ATTENUATOR SETTING (dB)

+110°C+25°C–40°C

16499-607

Figure 104. Receiver Gain vs. Receiver Attenuator Setting, RF Bandwidth = 50 MHz, Sample Rate = 61.44 MSPS, LO = 75 MHz

25

–15

–5

–10

0

5

15

10

20

0 155 2010 25 30

RE

CE

IVE

R G

AIN

(d

B)


+110°C+25°C–40°C

16499-608


25

–15

–5

–10

0

5

15

10

20

0 155 2010 25 30

RE

CE

IVE

R G

AIN

(d

B)


+110°C+25°C–40°C

16499-609



ADRV9009 Data Sheet


10

14

12

16

18

22

20

24

75 275125 375175 475225 320 425 525

RE

CE

IVE

R G

AIN

(d

B)

LO FREQUENCY (MHz)

+110°C+25°C–40°C

16499-610

Figure 107. Receiver Gain vs. LO Frequency, RF Bandwidth = 50 MHz, Sample Rate = 61.44 MSPS

–0.5

–0.3

–0.4

–0.2

0

0.4

0.2

–0.1

0.3

0.1

0.5

0 123 186 24 279 15 21 30

RE

CE

IVE

R G

AIN

ST

EP

ER

RO

R (

dB

)


+110°C+25°C–40°C

16499-611

Figure 108. Receiver Gain Step Error vs. Receiver Attenuator Setting, LO = 75 MHz

–0.5

–0.3

–0.4

–0.2

0

0.4

0.2

–0.1

0.3

0.1

0.5

0 123 186 24 279 15 21 30

RE

CE

IVE

R G

AIN

ST

EP

ER

RO

R (

dB

)


+110°C+25°C–40°C

16499-612


–0.5

–0.3

–0.4

–0.2

0

0.4

0.2

–0.1

0.3

0.1

0.5

0 123 186 24 279 15 21 30

RE

CE

IVE

R G

AIN

ST

EP

ER

RO

R (

dB

)


+110°C+25°C–40°C

16499-613


0.5

–1.0

–0.9

–0.8

–0.7

–0.6

–0.5

–0.4

–0.3

–0.2

–0.1

0

0.1

0.2

0.3

0.4

0.99

8

3.99

8

6.99

8

9.99

8

18.9

94

12.9

82

25.0

06

27.9

98

15.9

86

22.0

06

NO

RM

AL

IZE

D R

EC

EIV

ER

BA

SE

BA

ND

FL

AT

NE

SS

(d

B)


I RIPPLE = +110°CI RIPPLE = +25°CI RIPPLE = –40°CQ RIPPLE = +110°CQ RIPPLE = +25°CQ RIPPLE = –40°C

16499-614

Figure 111. Normalized Receiver Baseband Flatness vs. Baseband Offset Frequency, LO = 75 MHz

–50

–110

–90

–100

–80

–70

–60

75 275125 375175 475225 325 425 525

RE

CE

IVE

R D

C O

FF

SE

T (

dB

FS

)


+110°C+25°C–40°C

16499-615

Figure 112. Receiver DC Offset vs. Receiver LO Frequency


Data Sheet ADRV9009


–70

–110

–100

–105

–95

–85

–75

–90

–80

RE

CE

IVE

R D

C O

FF

SE

T (

dB

FS

)

+110°C+25°C–40°C

0 155 2010 25 30

RECEIVER ATTENUATOR SETTING (dB) 16499-616

Figure 113. Receiver DC Offset vs. Receiver Attenuator Setting, LO = 75 MHz

–70

–110

–100

–105

–95

–85

–75

–90

–80

RE

CE

IVE

R D

C O

FF

SE

T (

dB

FS

)

+110°C+25°C–40°C

0 155 2010 25 30

RECEIVER ATTENUATOR SETTING (dB) 16499-617


–30

–150

–60

–40

–100

–80

–120

–70

–50

–110

–90

–130

–140

RE

CE

IVE

R H

D2,

LE

FT

(d

Bc)

–30 30200–20 10–10BASEBAND FREQUENCY OFFSET AND ATTENUATION (MHz)

ATTN = 15 +110°CATTN = 15 +25°CATTN = 15 –40°CATTN = 0 +110°CATTN = 0 +25°CATTN = 0 –40°C

16499-618

Figure 115. Receiver HD2, Left vs. Baseband Frequency Offset and Attenuation, Tone Level = −21 dBm at Attenuation = 0 dB, X-Axis is Baseband Frequency Offset

of Fundamental Tone, Not Frequency of HD2 Product (HD2 Product is 2 × Baseband Frequency), HD2 Canceller Disabled, LO = 75 MHz

–30

–150

–60

–40

–100

–80

–120

–70

–50

–110

–90

–130

–140

RE

CE

IVE

R H

D2,

LE

FT

(d

Bc)



16499-619

Figure 116. Receiver HD2 Left vs. Baseband Frequency Offset and Attenuation, Tone Level = −21 dBm at Attenuation = 0 dB, X-Axis is Baseband Frequency Offset

of Fundamental Tone, Not Frequency of HD2 Product (HD2 Product Is 2 × Baseband Frequency), HD2 Canceller Disabled, LO = 300 MHz

–30

–150

–60

–40

–100

–80

–120

–70

–50

–110

–90

–130

–140

RE

CE

IVE

R H

D2

LE

FT

(d

Bc)



16499-620

Figure 117. Receiver HD2 Left vs. Baseband Frequency Offset and Attenuation, Tone Level = −21 dBm at Attenuation = 0 dB, X-Axis is Baseband Frequency Offset

of Fundamental Tone, Not Frequency of HD2 Product (HD2 Product Is 2 × Baseband Frequency), HD2 Canceller Disabled, LO = 525 MHz

–10

–150

–130

–110

–90

–70

–50

–30

–25 –20 –15 –10 –5 5 10 15 2520

RE

CE

IVE

R H

D3,

LE

FT

AN

D R

IGH

T (

dB

c)

FREQUENCY OFFSET FROM LO AND ATTENUATION (MHz)

+110°C Rx2 (RIGHT)+110°C Rx1 (RIGHT)+25°C Rx2 (RIGHT)+25°C Rx1 (RIGHT)–40°C Rx2 (RIGHT)–40°C Rx1 (RIGHT)

+110°C Rx2 (LEFT)+110°C Rx1 (LEFT)+25°C Rx2 (LEFT)+25°C Rx1 (LEFT)–40°C Rx2 (LEFT)–40°C Rx1 (LEFT)

16499-621

Figure 118. Receiver HD3, Left and Right vs. Frequency Offset from LO and Attenuation, Tone Level = −16 dBm at Attenuation = 0 dB, LO = 75 MHz


ADRV9009 Data Sheet


–10

–150

–130

–110

–90

–70

–50

–30

–25 –20 –15 –10 –5 5 10 15 2520

RE

CE

IVE

R H

D3,

LE

FT

AN

D R

IGH

T (

dB

c)

FREQUENCY OFFSET FROM LO (MHz)



16499-622

Figure 119. Receiver HD3, Left and Right vs. Frequency Offset from LO, Tone Level = −17 dBm at Attenuation = 0 dB, LO = 300 MHz

–10

–150

–130

–110

–90

–70

–50

–30

–25 –20 –15 –10 –5 5 10 15 2520

RE

CE

IVE

R H

D3,

LE

FT

AN

D R

IGH

T (

dB

c)




16499-623


0

–50

–30

–40

–20

–10

–35

–45

–25

–15

–5

–65 –35–55 –25–45 –15 5–5

RE

CE

IVE

R E

VM

(d

B)

LTE 20MHz RF INPUT POWER (dBm)

+110°C+25°C–40°C

16499-624

Figure 121. Receiver EVM vs. LTE 20 MHz RF Input Power, LTE 20 MHz RF Signal, LO = 75 MHz, Default AGC Settings

0

–50

–30

–40

–20

–10

–35

–45

–25

–15

–5

–65 –35–55 –25–45 –15 5–5

RE

CE

IVE

R E

VM

(d

B)


+110°C+25°C–40°C

16499-625


0

–50

–30

–40

–20

–10

–35

–45

–25

–15

–5

–65 –35–55 –25–45 –15 5–5

RE

CE

IVE

R E

VM

(d

B)


+110°C+25°C–40°C

16499-626


0

100

60

80

40

20

70

90

50

30

10

0 300100 400200 500 600

RE

CE

IVE

R T

O R

EC

EIV

ER

IS

OL

AT

ION

(d

B)

LO FREQUENCY (MHz)

Rx1 TO Rx2Rx2 TO Rx1

16499-627

Figure 124. Receiver to Receiver Isolation vs. LO Frequency, Baseband Frequency = 10 MHz


Data Sheet ADRV9009


–80–85–90–95

–100–105–110–115–120–125–130–135–140–145–150–155–160–165–170

100 1k 10k 100k 1M 10M 100M

LO

PH

AS

E N

OIS

E (

dB

c/H

z)



16499-050


–80–85–90–95

–100–105–110–115–120–125–130–135–140–145–150–155–160–165–170

100 1k 10k 100k 1M 10M 100M

LO

PH

AS

E N

OIS

E (

dB

c/H

z)



16499-051

Figure 126. LO Phase Noise vs. Frequency Offset, LO = 300 MHz, PLL Loop

Bandwidth = 50 kHz

–80–85–90–95

–100–105–110–115–120–125–130–135–140–145–150–155–160–165–170

100 1k 10k 100k 1M 10M 100M

LO

PH

AS

E N

OIS

E (

dB

c/H

z)



16499-052



ADRV9009 Data Sheet



–3.00

–1.50

–2.00

–1.00

–0.50

–1.75

–2.50

–2.25

–2.75

–1.25

–0.75

–0.25

600

2000

1000

2400

1400

2800

3000

1800

1600800

2200

1200

2600

TR

AN

SM

ITT

ER

MA

TC

HIN

GC

IRC

UIT

PA

TH

LO

SS

(d

B)

LO FREQUENCY (MHz) 16499-631

Figure 128. Transmitter Matching Circuit Path Loss vs. LO Frequency, Can be Used for De-Embedding Performance Data

14

4

5

6

7

8

9

10

11

12

13

650 850 1050 1250 16501450 1850 2050 265024502250 2850

TR

AN

SM

ITT

ER

CW

OU

TP

UT

PO

WE

R (

dB

m)



16499-632

Figure 129. Transmitter CW Output Power vs. Transmitter LO Frequency, Transmitter QEC and External LO Leakage Active, Transmitter in 200 MHz/450 MHz Bandwidth Mode, IQ Rate = 491.52 MHz, 0 dB

Attenuation, Not De-Embedded

0

–100

–90

–80

–70

–60

–50

–40

–30

–20

–10

–100 0–50 50 100

TR

AN

SM

ITT

ER

IM

AG

E R

EJE

CT

ION

AC

RO

SS

LA

RG

E S

IGN

AL

BA

ND

WID

TH

(d

Bc)

BASEBAND FREQUENCY OFFSET AND ATTENUATION (MHz)

+110°C ATTN = 25+110°C ATTN = 20+110°C ATTN = 15+110°C ATTN = 10+110°C ATTN = 5+110°C ATTN = 0+25°C ATTN = 25+25°C ATTN = 20+25°C ATTN = 15+25°C ATTN = 10+25°C ATTN = 5+25°C ATTN = 0

–40°C ATTN = 25–40°C ATTN = 20–40°C ATTN = 15–40°C ATTN = 10–40°C ATTN = 5–40°C ATTN = 0

16499-633

Figure 130. Transmitter Image Rejection Across Large Signal Bandwidth vs. Baseband Frequency Offset and Attenuation, QEC Trained with Three Tones

Placed at 10 MHz, 50 MHz, and 100 MHz (Tracking On), Total Combined Power = −6 dBFS, Correction Then Frozen (Tracking Turned Off), CW Tone

Swept Across Large Signal Bandwidth

1.0

–1.0

–0.8

–0.6

–0.4

–0.2

0.2

0

0.4

0.6

0.8

–225 –175 –125 –75 –25 25 75 125 175 225

TR

AN

SM

ITT

ER

PA

SS

BA

ND

FL

AT

NE

SS

(d

B)



16499-634

Figure 131. Transmitter Pass Band Flatness vs. Baseband Offset Frequency, LO = 2600 MHz

–70

–90

–88

–86

–84

–82

–78

–80

–76

–74

–72

650 850 1050 1250 1450 1650 1850 2250 26502050 2450 2850

TR

AN

SM

ITT

ER

LO

LE

AK

AG

E (

dB

FS

)

BASEBAND LO FREQUENCY (MHz)

+110°C+25°C–40°C

16499-635

Figure 132. Transmitter LO Leakage vs. Baseband LO Frequency, Transmitter Attenuation = 0 dB

0

120

100

80

60

40

20

TR

AN

SM

ITT

ER

TO

RE

CE

IVE

R I

SO

LA

TIO

N (

dB

)

Tx2 TO Rx2 = +110°CTx2 TO Rx1 = +110°CTx1 TO Rx2 = +110°CTx1 TO Rx1 = +110°CTx2 TO Rx2 = +25°CTx2 TO Rx1 = +25°CTx1 TO Rx2 = +25°CTx1 TO Rx1 = +25°C

Tx2 TO Rx2 = –40°CTx2 TO Rx1 = –40°CTx1 TO Rx2 = –40°CTx1 TO Rx1 = –40°C

650 850 1050 1250 1450 1650 1850 2250 26502050 2450 2850

RECEIVER LO FREQUENCY (MHz) 16499-636

Figure 133. Transmitter to Receiver Isolation vs. Receiver LO Frequency


Data Sheet ADRV9009


0

120

100

80

60

40

20

TR

AN

SM

ITT

ER

TO

TR

AN

SM

ITT

ER

ISO

LA

TIO

N (

dB

)

600 1000 1400 1800 2200 2600 3000


Tx1 – Tx2Tx2 – Tx1

16499-637


–145

–175

–170

–165

–160

–155

–150

TR

AN

SM

ITT

ER

NO

ISE

(d

Bm

/Hz)

0 16 17 1811 12 13 14 154 6 8 9 101 2 3 5 7 19


2600MHz = +110°C1800MHz = +110°C650MHz = +110°C

2600MHz = +25°C1800MHz = +25°C650MHz = +25°C

2600MHz = –40°C1800MHz = –40°C650MHz = –40°C

16499-638

Figure 135. Transmitter Noise vs. Transmitter Attenuator Setting,

–40

–75

–65

–55

–70

–60

–50

–45

0 2 4 6 108 12 14 16 18 20

TRANSMITTER ATTENUATOR SETTING (dB)SIGNAL OFFSET 90MHz



16499-639

TR

AN

SM

ITT

ER

AD

JAC

EN

T C

HA

NN

EL

LE

AK

AG

E R

AT

IO (

dB

c)

Figure 136. Transmitter Adjacent Channel Leakage Ratio vs. Transmitter Attenuator Setting, Signal Offset 90 MHz, LO = 650 MHz, LTE20 PAR = 12 dB,

Upper Side and Lower Side

–40

–75

–65

–55

–70

–60

–50

–45

0 2 4 6 108 12 14 16 18 20

TR

AN

SM

ITT

ER

AD

JAC

EN

T C

HA

NN

EL

LE

AK

AG

E R

AT

IO (

dB

c)




16499-640

Figure 137. Transmitter Adjacent Channel Leakage Ratio vs. Transmitter Attenuator Setting, Signal Offset = 90 MHz, LO = 1850 MHz, LTE20 MHz,

PAR = 12 dB, Upper Side and Lower Side

–40

–75

–65

–55

–70

–60

–50

–45

0 2 4 6 108 12 14 16 18 20

TR

AN

SM

ITT

ER

AD

JAC

EN

T C

HA

NN

EL

LE

AK

AG

E R

AT

IO (

dB

c)




16499-641

Figure 138. Transmitter Adjacent Channel Leakage Ratio vs. Transmitter Attenuator Setting, Signal Offset = 90 MHz, LO = 2850 MHz, LTE20 MHz,

PAR = 12 dB, Upper Side and Lower Side

35

–5

0

10

20

30

5

15

25

0 2 8 14 26204 10 16 28226 12 18 24 30

TR

AN

SM

ITT

ER

OIP

3, R

IGH

T O

RU

PP

ER

SID

EB

AN

D (

dB

m)


+110°C+25°C–40°C

16499-642

Figure 139. Transmitter OIP3, Right or Upper Sideband vs. Transmitter Attenuator Setting, LO = 850 MHz, 15 dB Digital Backoff per Tone


ADRV9009 Data Sheet


40

35

–10

–5

0

10

20

30

5

15

25

0 2 8 14 26204 10 16 28226 12 18 24 30

TR

AN

SM

ITT

ER

OIP

3, R

IGH

T (

dB

m)


+110°C+25°C–40°C

16499-643

Figure 140. Transmitter OIP3, Right vs. Transmitter Attenuator Setting, LO = 1850 MHz, 15 dB Digital Backoff per Tone

40

35

–5

0

10

20

30

5

15

25

0 2 8 14 26204 10 16 28226 12 18 24 30

TR

AN

SM

ITT

ER

OIP

3, R

IGH

T (

dB

m)


+110°C+25°C–40°C

16499-644

Figure 141. Transmitter OIP3, Right vs. Transmitter Attenuator Setting, LO = 2650 MHz, 15 dB Digital Backoff per Tone

45

0

10

20

30

40

5

15

25

35

510

1015

1520

2025

2530

3035

3540

4045

4550

5055

5560

6065

6570

7075

7580

8590

9095

95100

TR

AN

SM

ITT

ER

OIP

3, R

IGH

T (

dB

m)



16499-645

Figure 142. Transmitter OIP3, Right vs. Baseband Tone Pair Swept Across Pass Band, LO = 850 MHz, 15 dB Digital Backoff per Tone

45

0

10

20

30

40

5

15

25

35

510

1015

1520

2025

2530

3035

3540

4045

4550

5055

5560

6065

6570

7075

7580

8590

9095

95100

TR

AN

SM

ITT

ER

OIP

3, R

IGH

T (

dB

m)



16499-646

Figure 143. Transmitter OIP3, Right vs. Baseband Tone Pair Swept Across Pass Band, LO = 1850 MHz 15 dB Digital Backoff per Tone

40

0

10

20

30

5

15

25

35

510

1015

1520

2025

2530

3035

3540

4045

4550

5055

5560

6065

6570

7075

7580

8590

9095

95100

TR

AN

SM

ITT

ER

OIP

3, R

IGH

T (

dB

m)



16499-647

Figure 144. Transmitter OIP3, Right vs. Baseband Tone Pair Swept Across Pass Band, LO = 2850 MHz,15 dB Digital Backoff per Tone

0

–20

–120

–100

–80

–60

–40

0 4 8 12 2016 24 28 32

TR

AN

SM

ITT

ER

HD

2 (d

Bc)



2 6 10 1814 22 26 30

16499-648

Figure 145. Transmitter HD2 vs. Transmitter Attenuator Setting, Baseband Frequency = 10 MHz, LO = 1850 MHz, Digital Backoff = 15 dB


Data Sheet ADRV9009


0

–20

–100

–90

–80

–60

–40

–10

–70

–50

–30

0 4 8 12 2016 24 28 32

TR

AN

SM

ITT

ER

HD

3 (d

Bc)

TRANSMITTER ATTENUATOR SETTING (dB)2 6 10 1814 22 26 30


16499-649

Figure 146. Transmitter HD3 vs. Transmitter Attenuator Setting, LO = 650 MHz, Digital Backoff = 15 dB

0

–20

–100

–90

–80

–60

–40

–10

–70

–50

–30

0 4 8 12 2016 24 28 32

TR

AN

SM

ITT

ER

HD

3 (d

Bc)


2 6 10 1814 22 26 30


16499-650


0

–20

–100

–90

–80

–60

–40

–10

–70

–50

–30

0 4 8 12 2016 24 28 32

TR

AN

SM

ITT

ER

HD

3 (d

Bc)


2 6 10 1814 22 26 30


16499-651


0

–20

–120

–100

–80

–60

–40

0 2 4 6 108 13 17 20

TR

AN

SM

ITT

ER

HD

3 IM

AG

E (

dB

c)A

PP

EA

RS

ON

SA

ME

SID

E A

S D

ES

IRE

D S

IGN

AL


1 3 5 97 11 15 1912 1614 18


16499-652

Figure 149. Transmitter HD3 Image Appears on Same Sideband as Desired Signal vs. Transmitter Attenuator Setting, LO = 1850 MHz Digital Backoff = 15 dB

0.025

–0.025

–0.010

–0.005

–0.020

–0.015

0

0.010

0.020

0.005

0.015

TR

AN

SM

ITT

ER

AT

TE

NU

AT

ION

ST

EP

ER

RO

R (

dB

)

TRANSMITTER ATTENUATION SETTING (dB)

0 4 8 12 2016 24 28 322 6 10 1814 22 26 30

+110°C+25°C–40°C

16499-653

Figure 150. Transmitter Attenuation Step Error vs. Transmitter Attenuator Setting, LO = 650 MHz

0

–10

–20

–30

–40

–50

–60

AM

PL

ITU

DE

(d

Bm

)

–70

–80

–90

–100SPAN 1.000GHz

SWEEP 1.007s (3001pts)#VBW 1.0kHzCENTER 650.0MHz#RES BW 1.0MHz 16

499-654

Figure 151. Amplitude vs. Frequency, Transmitter Output Spurious, Transmitter 1 = 650 MHz, LTE = 5 MHz, Offset = 10 MHz, RMS = −12 dBFS,

Temperature = 25°C


ADRV9009 Data Sheet


0

–10

–20

–30

–40

–50

–60

AM

PL

ITU

DE

(d

Bm

)

–70

–80

–90

–100SPAN 1.000GHz


499-655


Temperature = 25°C

0

–10

–20

–30

–40

–50

–60

AM

PL

ITU

DE

(d

Bm

)

–70

–80

–90

–100SPAN 1.000GHz


499-656

Figure 153. Amplitude vs. Frequency, Transmitter Output Spurious, Transmitter 1 = 1850 MHz, LTE = 5 MHz, Offset = 10 MHz, RMS −12 dBFS, Temperature = 25°C

0

–10

–20

–30

–40

–50

–60

AM

PL

ITU

DE

(d

Bm

)

–70

–80

–90

–100SPAN 1.000GHz


499-657


Temperature = 25°C

0

–10

–20

–30

–40

–50

–60

AM

PL

ITU

DE

(d

Bm

)

–70

–80

–90

–100SPAN 1.000GHz


499-658


Temperature = 25°C

0

–10

–20

–30

–40

–50

–60

AM

PL

ITU

DE

(d

Bm

)

–70

–80

–90

–100SPAN 1.000GHz

SWEEP 1.007s (3001pts)#VBW 1.0kHzCENTER 650.0MHz#RES BW 1.0MHz 16499-659


Temperature = 25°C

0

–3.00

–1.50

–2.00

–1.00

–0.50

–1.75

–2.50

–2.25

–2.75

–1.25

–0.75

–0.25

600

2000

1000

2400

1400

2800

3000

1800

160080

0

2200

1200

2600

OB

SE

RV

AT

ION

RE

CE

IVE

R M

AT

CH

ING

CIR

CU

IT P

AT

H L

OS

S (

dB

)


Figure 157. Observation Receiver Matching Circuit Path Loss vs. LO Frequency, Can Be Used for De-Embedding Performance Data


Data Sheet ADRV9009


0

–100

–90

–80

–70

–60

–40

–50

–30

–20

–10

650 850 1050 1250 1450 1650 1850 2250 26502050 2450 2850

OB

SE

RV

AT

ION

RE

CE

IVE

R L

O L

EA

KA

GE

(d

Bm

)


+110°C+25°C–40°C

16499-661

Figure 158. Observation Receiver LO Leakage vs. Transmitter LO Frequency,

24

14

15

16

17

18

20

19

21

22

23

650 850 1050 1250 1450 1650 1850 2250 26502050 2450 2850

OB

SE

RV

AT

ION

RE

CE

IVE

R N

OIS

E F

IGU

RE

(d

Bm

)

OBSERVATION RECEIVER LO FREQUENCY (MHz)

+110°C+25°C–40°C

16499-662

Figure 159. Observation Receiver Noise Figure vs. Observation Receiver LO Frequency, Total Nyquist Integration Bandwidth

80

40

60

70

50

75

55

65

45


656655

906905

846845

736735

696695

776775

886885

806805

826825

866865

796795

716715

676675

756755


16499-663

OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP2,

SU

M A

ND

DIF

FE

RE

NC

E P

RO

DU

CT

S (

dB

m)

Figure 160. Observation Receiver IIP2, Sum and Difference Products vs. Swept Pass Band Frequency, LO = 650 MHz, Attenuation = 0 dB

80

40

60

70

50

75

55

65

45


18061805

20662065

20062005

18861885

18461845

19261925

20462045

19661965

19861985

20262025

19461945

18661865

18261825

19061905


16499-664

OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP2,

SU

M A

ND

DIF

FE

RE

NC

E P

RO

DU

CT

S (

dB

m)

Figure 161. Observation Receiver IIP2, Sum and Difference Products vs. Swept Pass Band Frequency, LO =1800 MHz, Attenuation = 0 dB

80

40

60

70

50

75

55

65

45

OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP2,

SU

M A

ND

DIF

FE

RE

NC

E P

RO

DU

CT

S (

dB

m)


28562855

31163115

30563055

29362935

28962895

29762975

30963095

30163015

30363035

30763075

29962995

29162915

28762875

29562955


16499-665

Figure 162. Observation Receiver IIP2, Sum and Difference Products vs. Swept Pass Band Frequency, LO = 2850 MHz, Attenuation = 0 dB

75

65

50

55

60

70

ATTENUATION (dB)

0 6 102 84

INPUT IP2 SUM +110°CINPUT IP2 SUM +25°CINPUT IP2 SUM –40°CINPUT IP2 DIFF +110°CINPUT IP2 DIFF +25°CINPUT IP2 DIFF –40°C

16499-666

OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP2,

SU

M A

ND

DIF

FE

RE

NC

E P

RO

DU

CT

S (

dB

m)

Figure 163. Observation Receiver IIP2, Sum and Difference Products vs. Attenuation, Tone 1 = 1845 MHz, Tone 2 = 1846 MHz at −19 dBm Plus

Attenuation, LO = 1800 MHz


ADRV9009 Data Sheet


OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP2,

f1

– f2

(d

Bm

)


80

0

40

60

20

70

30

50

10

662 682 702 722 742 762 782


802 822 842 862 882 902

16499-667

Figure 164. Observation Receiver IIP2, f1 − f2 vs. f1 Offset Frequency, LO = 650 MHz, Tone 1 = 652 MHz, Tone 2 = Swept at −19 dBm Each, Attenuation = 0 dB

OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP2,

f1

– f2

(d

Bm

)


80

0

40

60

20

70

30

50

10


181

2

183

2

185

2

187

2

189

2

191

2

193

2

195

2

197

2

199

2

201

2

203

2

205

216499-668

Figure 165. Observation Receiver IIP2, f1 − f2 vs. f1 Offset Frequency, LO = 1800 MHz, Tone 1 = 1802 MHz, Tone 2 = Swept at −19 dBm Each, Attenuation =

0 dB

OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP2,

f1

– f2

(d

Bm

)


80

0

40

60

20

70

30

50

10


286

2

288

2

290

2

292

2

294

2

296

2

298

2

300

2

302

2

304

2

306

2

308

2

310

216499-669

Figure 166. Observation Receiver IIP2, f1 − f2 vs. f1 Offset Frequency, LO = 2850 MHz, Tone 1 = 2852 MHz, Tone 2 = Swept at −19 dBm Each,

Attenuation = 0 dB

80

75

65

50

55

60

70

OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP2,

f1

– f2

(d

Bm

)

ATTENUATION (dB)

0 6 102 84


16499-670

Figure 167. Observation Receiver IIP2, f1 − f2 vs. Attenuation, LO = 1800 MHz, Tone 1 = 1802 MHz, Tone 2 = 1902 MHz at −19 dBm

Plus Attenuation

25

0

10

20

5

15

OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP3,

2f1

– f

2 (d

Bm

)


ORx1 = +110°CORx1 = +25°CORx1 = –40°C

656655

676675

696695

716715

736735

756755

776775

796795

816815

836835

856855

875876

895896

915916

935936

16499-671

Figure 168. Observation Receiver IIP3, 2f1 − f2 vs. f1 Offset Frequency, LO = 650 MHz, Attenuation = 0 dB, Tones Separated by 1 MHz Swept Across Pass

Band at −19 dBm Each

25

0

10

20

5

15

OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP3,

2f1

– f

2 (d

Bm

)

ORx1 = +110°CORx1 = +25°CORx1 = –40°C

1805 1825 1845 1865 1885 1905 1925 1945 1965 1985 2005 2025 20451806 1826 1846 1866 1886 1906 1926 1946 1966 1986 2006 2026 2046


16499-672




Data Sheet ADRV9009


25

0

10

20

5

15

OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP3,

2f1

– f

2 (d

Bm

)


ORx1 = +110°CORx1 = +25°CORx1 = –40°C

28562855

28862885

29162915

29462945

29762975

30063005

30363035

30663065

30963095

16499-673

Figure 170. Observation Receiver IIP3, 2f1 − f2 vs. f1 Offset Frequency, LO = 2850 MHz, Attenuation = 0 dB, Tones Separated by 1 MHz Swept Across

Pass Band at −19 dBm Each

24

16

6

8

12

20

18

10

14

22

OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP3,

2f1

– f

2 (d

Bm

)

ATTENUATION (dB)

0 6 102 84

IIP3 = +110°CIIP3 = +25°CIIP3 = –40°C

16499-674

Figure 171. Observation Receiver IIP3, 2f1 − f2 vs. Attenuation, LO = 1800 MHz, Tone 1 = 1895 MHz, Tone 2 = 1896 MHz at −19 dBm Plus

Attenuation

25

0

10

20

5

15

OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP3,

2f1

– f

2 (d

Bm

)


ORx1 = +110°CORx1 = +25°CORx1 = –40°CORx2 = +110°CORx2 = +25°CORx2 = –40°C

662 692 722 752 782 812 842 872 902

16499-675

Figure 172. Observation Receiver IIP3, 2f1 − f2 vs. Intermodulation Frequency, LO = 650 MHz, Tone 1 = 652 MHz, Tone 2 = Swept at −19 dBm Each

25

0

10

20

5

15

OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP3,

2f1

– f

2 (d

Bm

)



1812 1842 1872 1902 1932 2022 20521962 1992

16499-676


30

25

0

10

20

5

15

OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP3,

2f1

– f

2 (d

Bm

)


2862 2892 2982 31022922 2952 30723012 3042


16499-677


24

16

6

8

12

20

18

10

14

22

OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP3,

2f1

– f

2 (d

Bm

)

ATTENUATION (dB)

0 6 102 84

IIP3 = +110°CIIP3 = +25°CIIP3 = –40°C

16499-678

Figure 175. Observation Receiver IIP3, 2f1 − f2 vs. Attenuation, LO = 1800 MHz, Tone 1 = 1802 MHz, Tone 2 = 1922 MHz at −19 dBm

Plus Attenuation


ADRV9009 Data Sheet


0

–20

–120

–100

–80

–60

–40

–225

–175

–125 –75 25–25 75 150

225

OB

SE

RV

AT

ION

RE

CE

IVE

RIM

AG

E R

EJE

CT

ION

(d

Bc)


+110°C = 11.5dB+110°C = 0dB+25°C = 11.5dB+25°C = 0dB–40°C = 11.5dB–40°C = 0dB

–200

–150

–100

0

–50 50 100

200

125

175

16499-679

Figure 176. Observation Receiver Image Rejection vs. Baseband Frequency Offset, CW Signal Swept Across the Pass Band, LO = 650 MHz

0

–20

–120

–100

–80

–60

–40

–225

–175

–125 –75 25–25 75 150

225



–200

–150

–100

0

–50 50 100

200

125

175

16499-680

OB

SE

RV

AT

ION

RE

CE

IVE

RIM

AG

E R

EJE

CT

ION

(d

Bc)


0

–20

–120

–100

–80

–60

–40

–225

–175

–125 –75 25–25 75 150

225



–200

–150

–100

0

–50 50 100

200

125

175

16499-681

OB

SE

RV

AT

ION

RE

CE

IVE

RIM

AG

E R

EJE

CT

ION

(d

Bc)


18

6

8

12

16

10

14

OB

SE

RV

AT

ION

RE

CE

IVE

R G

AIN

(d

B)


0 4 8 1211102 63 7 91 5

+110°C+25°C–40°C

16499-682


18

6

8

12

16

10

14O

BS

ER

VA

TIO

N R

EC

EIV

ER

GA

IN (

dB

)


+110°C+25°C–40°C

0 4 8 102 63 7 91 5

16499-683


18

6

8

12

16

10

14

OB

SE

RV

AT

ION

RE

CE

IVE

R G

AIN

(d

B)


+110°C+25°C–40°C

0 4 8 102 63 7 91 5

16499-684



Data Sheet ADRV9009


0.5

–0.5

–0.4

–0.3

–0.2

–0.1

0.1

0

0.2

0.3

0.4

0 1 2 3 54 6 7 98 10

TR

AN

SM

ITT

ER

PA

SS

BA

ND

FL

AT

NE

SS

(d

B)


+110°C+25°C–40°C

16499-685

Figure 182. Transmitter Pass Band Flatness vs. Observation Receiver Attenuator Setting, LO = 2600 MHz

0.5

0.4

–0.5

–0.4

–0.2

0

0.2

0.3

–0.3

–0.1

0.1

–225

–175

–125 –75 25–25 75 150

225

OB

SE

RV

AT

ION

RE

CE

IVE

RP

AS

S B

AN

D F

LA

TN

ES

S (

dB

)


+110°C+25°C–40°C

–200

–150

–100

0

–50 50 100

200

125

175

16499-686

Figure 183. Observation Receiver Pass Band Flatness vs. Baseband Frequency Offset, LO = 1800 MHz

OB

SE

RV

AT

ION

RE

CE

IVE

R D

C O

FF

SE

T (

dB

FS

)

ATTENUATION (dB)

+110°C+25°C–40°C

0 4 8 102 63 7 91 5

0

–20

–120

–100

–80

–60

–40

16499-687

Figure 184. Observation Receiver DC Offset vs. Attenuation, LO = 1850 MHz

0

–100

–80

–60

–40

–90

–70

–50

–30

–20

–10

–100 –75 –50 –25 0 25 50 10075

OB

SE

RV

AT

ION

RE

CE

IVE

R H

D2

(dB

c)

OFFSET FREQUENCY AND ATTENUATION (MHz)

+110°C = 0 (RIGHT)+110°C = 11.5 (RIGHT)+110°C = 0 (LEFT)+110°C = 11.5 (LEFT)+25°C = 0 (RIGHT)+25°C = 11.5 (RIGHT)

+25°C = 0 (LEFT)+25°C = 11.5 (LEFT)–40°C = 0 (RIGHT)–40°C = 11.5 (RIGHT)–40°C = 0 (LEFT)–40°C = 11.5 (LEFT)

16499-688

Figure 185. Observation Receiver HD2 vs. Offset Frequency and Attenuation, LO = 650 MHz, Tone Level = −20 dBm at 0 dB Attenuation

0

–120

–80

–100

–60

–40

–20

–100 –75 –50 –25 0 25 50 10075

OB

SE

RV

AT

ION

RE

CE

IVE

R H

D2

(dB

c)




16499-689


0

–20

–40

–60

–80

–100

–120–100 –75 –50 –25 0 25 50 75 100

OB

SE

RV

AT

ION

RE

CE

IVE

R H

D2

(dB

c)


HD2 RIGHT ATTENUATION = 0dB, +110°CHD2 RIGHT ATTENUATION = 11.0dB, +110°CHD2 LEFT ATTENUATION = 0dB, +110°CHD2 LEFT ATTENUATION = 11.5dB, +110°CHD2 RIGHT ATTENUATION = 0dB, +25°CHD2 RIGHT ATTENUATION = 11.5dB, +25°CHD2 LEFT ATTENUATION = 0dB, +25°CHD2 LEFT ATTENUATION = 11.5dB, +25°CHD2 RIGHT ATTENUATION = 0dB, –40°CHD2 RIGHT ATTENUATION = 11.5dB, –40°CHD2 LEFT ATTENUATION = 0dB, –40°CHD2 LEFT ATTENUATION = 11.5dB, –40°C

16499-068



ADRV9009 Data Sheet


0

–100

–30

–10

–70

–50

–40

–20

–60

–80

–90

OB

SE

RV

AT

ION

RE

CE

IVE

R H

D3

(dB

c)

–100 10050–25–75 7525–50

OFFSET FREQUENCY (MHz)

HD3 RIGHT dBc = +110°CHD3 RIGHT dBc = +25°CHD3 RIGHT dBc = –40°CHD3 LEFT dBc = +110°CHD3 LEFT dBc = +25°CHD3 LEFT dBc = –40°C

16499-690

Figure 188. Observation Receiver HD3 vs. Offset Frequency, LO = 650 MHz, Tone Level = −20 dBm at 0 dB Attenuation

0

–100

–30

–10

–70

–50

–40

–20

–60

–80

–90

OB

SE

RV

AT

ION

RE

CE

IVE

R H

D3

(dB

c)

–100 10050–25–75 7525–50



16499-691


0

–100

–30

–10

–70

–50

–40

–20

–60

–80

–90

OB

SE

RV

AT

ION

RE

CE

IVE

R H

D3

(dB

c)

–100 10050–25–75 7525–50OFFSET FREQUENCY (MHz)


16499-692


0

–100

–30

–10

–70

–50

–40

–20

–60

–80

–90

OB

SE

RV

AT

ION

RE

CE

IVE

R H

D3,

LE

FT

AN

D R

IGH

T (

dB

c)

–100 10050–25–75 75251850

–50


+110°C RIGHT = 11.5dBc+110°C RIGHT = 0dBc+110°C LEFT = 11.5dBc+110°C LEFT = 0dBc+25°C RIGHT = 11.5dBc+25°C RIGHT = 0dBc

+25°C LEFT = 11.5dBc+25°C LEFT = 0dBc–40°C RIGHT = 11.5dBc–40°C RIGHT = 0dBc–40°C LEFT = 11.5dBc–40°C LEFT = 0dBc

16499-693

Figure 191. Observation Receiver HD3, Left and Right vs. Offset Frequency, LO = 1850 MHz, Observation Receiver Attenuation = 0 dB and 11.5 dB

0

120

80

40

20

100

60

TR

AN

SM

ITT

ER

TO

OB

SE

RV

AT

ION

RE

CE

IVE

R I

SO

LA

TIO

N (

dB

)

LO FREQUENCY (MHz)

650

1450

2250

2850

2650

1050

1850

1250

2050

245085

0

1650


16499-694


0

–3.00

–1.00

–0.50

–0.75

–0.25

–1.50

–2.25

–1.75

–2.00

–1.25

–2.50

–2.75

RE

CE

IVE

R M

AT

CH

ING

CIR

CU

ITP

AT

H L

OS

S (

dB

)

LO FREQUENCY (MHz)

500

1500

2500

3000

1000

2000

1250

2250

275075

0

1750

16499-695

Figure 193. Receiver Matching Circuit Path Loss vs. LO Frequency, Can be Used for De-Embedding Performance Data


Data Sheet ADRV9009


0

–100

–40

–20

–30

–10

–60

–90

–70

–80

–50

RE

CE

IVE

R L

O L

EA

KA

GE

(d

Bm

)


650

1450

2250

2850

1050

1850

1250

2050

2450

2650850

1650

+110°C+25°C–40°C

16499-696

Figure 194. Receiver LO Leakage vs. Receiver LO Frequency, Receiver Attenuation = 0 dB, RF Bandwidth = 200 MHz, Sample Rate = 245.76 MSPS

45

0

30

40

10

20

25

35

15

5

RE

CE

IVE

R N

OIS

E F

IGU

RE

(d

Bc)

0 201262 168 14 18104

ATTENUATION (dB)

+110°C+25°C–40°C

16499-697

Figure 195. Receiver Noise Figure vs. Attenuation, LO = 650 MHz, Receiver Bandwidth = 200 MHz Bandwidth, Sample Rate = 245.76 MSPS, Integration

Bandwidth = 500 kHz to 100 MHz

45

0

30

40

10

20

25

35

15

5

RE

CE

IVE

R N

OIS

E F

IGU

RE

(d

Bc)

0 201262 168 14 18104

ATTENUATION (dB)

+110°C+25°C–40°C

16499-698

Figure 196. Receiver Noise Figure vs. Attenuation, LO = 1850 MHz, Receiver Bandwidth = 200 MHz Bandwidth, Sample Rate = 245.76 MSPS, Integration


45

0

30

40

10

20

25

35

15

5

RE

CE

IVE

R N

OIS

E F

IGU

RE

(d

Bc)

0 201262 168 14 18104


+110°C+25°C–40°C

16499-699

Figure 197. Receiver Noise Figure vs. Receiver Attenuation, LO = 2850 MHz, Receiver Bandwidth = 200 MHz Bandwidth, Sample Rate = 245.76 MSPS,

Integration Bandwidth = 500 kHz to 100 MHz

20

0

12

16

14

18

8

2

6

4

10

RE

CE

IVE

R N

OIS

E F

IGU

RE

(d

B)


650

1450

2250

2850

1050

1850

1250

2050

2450

2650850

1650

+110°C+25°C–40°C

16499-700

Figure 198. Receiver Noise Figure vs. Receiver LO Frequency, Receiver Attenuation = 0 dB, RF Bandwidth = 200 MHz, Sample Rate = 245.76 MSPS,

Integration Bandwidth = ±100 MHz

8

10

12

14

16

18

20

–100 –80 –60 –40 –20 0 20 40 60 80 100

RE

CE

IVE

R N

OIS

E F

IGU

RE

(d

B)

RECEIVER OFFSET FREQUENCY FROM LO (650MHz)

–40°C+25°C+110°C

16499-323

Figure 199. Receiver Noise Figure vs. Receiver Offset Frequency from LO, LO = 650 MHz


ADRV9009 Data Sheet


8

10

12

14

16

18

20

–100 –80 –60 –40 –20 0 20 40 60 80 100

RE

CE

IVE

R N

OIS

E F

IGU

RE

(d

B)


–40°C+25°C+110°C

16499-324


8

10

12

14

16

18

20

–100 –80 –60 –40 –20 0 20 40 60 80 100

RE

CE

IVE

R N

OIS

E F

IGU

RE

(d

B)


–40°C+25°C+110°C

16499-325


0

5

10

15

20

25

30

35

40

–20 –15 –10 –5 0 5 10

RE

CE

IVE

R

NO

ISE

FIG

UR

E (

dB

)

CW OUT OF BAND BLOCKER LEVEL (dBm)

–40°C+25°C+110°C

16499-326

Figure 202. Receiver Noise Figure vs. CW Out of Band Blocker Level, Receiver LO = 1685 MHz, Blocker = 2085 MHz

50

60

70

80

90

100

110

0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30

RE

CE

IVE

R I

IP2

(dB

m)

RECEIVER ATTENUATION (dB) 16499-327

–40°C (SUM)–40°C (DIFF)+25°C (SUM)+25°C (DIFF)+110°C (SUM)+110°C (DIFF)

Figure 203. Receiver IIP2 vs. Receiver Attenuation, LO = 1800 MHz, Tones Placed at 1845 MHz and 1846 MHz, −21 dBm Each at Attenuation = 0 dB

40

45

50

55

60

65

70

75

80

806 826 846 866 886 906805 825 845 865 885 905

800

RE

CE

IVE

R I

IP2

(dB

m)



16499-328

Figure 204. Receiver IIP2 Sum and Difference Across Bandwidth vs Swept Pass Band Frequency, LO = 800 MHz

40

45

50

55

60

65

70

75

80

1806 1826 1846 1866 1886 19061805 1825 1845 1865 1885 1905

1800

RE

CE

IVE

R I

IP2

(dB

m)



16499-329



Data Sheet ADRV9009


40

45

50

55

60

65

70

75

80

2906 2926 2946 2966 2986 30062905 2925 2945 2965 2985 3005

RE

CE

IVE

R I

IP2

(dB

m)


–40°C (DIFF)–40°C (SUM)

+25°C (SUM)+25°C (DIFF)+110°C (SUM)+110°C (DIFF)

16499-330


50

55

60

65

70

75

80

85

90

95

100

807 817 827 837 847 857 867 877 887 897 907

RE

CE

IVE

R I

IP2

(dB

m)


Rx1 –40°C (SUM)Rx1 –40°C (DIFF)Rx1 +25°C (SUM)Rx1 +25°C (DIFF)Rx1 +110°C (SUM)Rx1 +110°C (DIFF)Rx2 –40°C (SUM)Rx2 –40°C (DIFF)Rx2 +25°C (SUM)Rx2 +25°C (DIFF)Rx2 +110°C (SUM)Rx2 +110°C (DIFF)

16499-331

Figure 207. Receiver IIP2 vs. Swept Pass Band Frequency, LO = 1800 MHz, Tones Placed at 1802 MHz and 1892 MHz, −21 dBm Each at Attenuation = 0 dB

16499-332

100

95

90

85

80

75

70

65

60

55

50

807

812

822

827

832

837

842

847

852

857

862

867

872

877

882

887

892

897

902

907

RE

CE

IVE

R I

IP2

(dB

m)

TONE1 = 802MHz, TONE2 = SWEPT ACROSS PASSBANDATTENUATOR = 0

RX1 +110°C MAX OF IIP2_SUM_CFRX1 +110°C MAX OF IIP2_DIF_CFRX2 +110°C MAX OF IIP2_SUM_CFRX2 +110°C MAX OF IIP2_DIF_CFRX1 +25°C MAX OF IIP2_SUM_CFRX1 +25°C MAX OF IIP2_DIF_CFRX2 +25°C MAX OF IIP2_SUM_CFRX2 +25°C MAX OF IIP2_DIF_CFRX1 –40°C MAX OF IIP2_SUM_CFRX1 –40°C MAX OF IIP2_DIF_CFRX2 –40°C MAX OF IIP2_SUM_CFRX2 –40°C MAX OF IIP2_DIF_CF

Figure 208. Receiver IIP2 Sum and Difference Across Bandwidth vs. Swept Pass Band Frequency, Receiver Attenuation = 0 dB, LO = 800 MHz,

Tone 1 = 802 MHz, Tone 2 Swept, −21 dBm Each

50

55

60

65

70

75

80

85

90

95

100

RE

CE

IVE

R I

IP2

SU

MA

ND

DIF

FE

RE

NC

EA

CR

OS

S B

AN

DW

IDT

H (

dB

m)


1807 1817 1827 1837 1847 1857 1867 1877 1887 1897 1907

Rx1 –40°C MAX OF IIP2_SUM_CFRx1 –40°C MAX OF IIP2_DIF_CFRx1 +25°C MAX OF IIP2_SUM_CFRx1 +25°C MAX OF IIP2_DIF_CFRx1 +110°C MAX OF IIP2_SUM_CFRx1 +110°C MAX OF IIP2_DIF_CFRx2 –40°C MAX OF IIP2_SUM_CFRx2 –40°C MAX OF IIP2_DIF_CFRx2 +25°C MAX OF IIP2_SUM_CFRx2 +25°C MAX OF IIP2_DIF_CFRx2 +110°C MAX OF IIP2_SUM_CFRx2 +110°C MAX OF IIP2_DIF_CF

16499-332


Tone 1 = 1802 MHz, Tone 2 = Swept, −21 dBm Each

50

55

60

65

70

75

80

85

90

95

100

2907 2917 2927 2937 2947 2957 2967 2977 2987 2997 3007

RE

CE

IVE

R I

IP2

(dB

m)


Rx1 –40°C (SUM)Rx1 –40°C (DIF)Rx1 +25°C (SUM)Rx1 +25°C (DIF)Rx1 +110°C (SUM)Rx1 +110°C (DIF)Rx2 –40°C (SUM)Rx2 –40°C (DIF)Rx2 +110°C (SUM)Rx2 +110°C (DIF)

16499-333



0

5

10

15

20

25

30

35

40

45

0 2.5 5.0 7.5 10.0 12.5 15.0 17.5 20.0 22.5 25.0 30.0

RE

CE

IVE

R I

IP3

(dB

m)

ATTENUATION (dB)

Rx1 –40°CRx1 +25°CRx1 +110°CRx2 –40°CRx2 +25°CRx2 +110°C

27.5

16499-334

Figure 211. Receiver IIP3 vs. Attenuation, LO = 1800 MHz, Tone 1 = 1890 MHz, Tone 2 = 1891 MHz, −21 dBm Each at Attenuation = 0 dB


ADRV9009 Data Sheet


0

5

10

15

20

25

30

805 815 825 835 845 855 865 875 885 895 905 915 925806 816 826 836 846 856 866 876 886 896 906 916 926


RE

CE

IVE

R I

IP3

(dB

m)


16499-335

Figure 212. Receiver IIP3 vs. Swept Pass Band Frequency, Receiver Attenuation = 0 dB, LO = 800 MHz, Tone 2 = Tone 1 + 1 MHz, −21 dBm Each,

Swept Across Pass Band

0

5

10

15

20

25

30

1805 1815 1825 1835 1845 1855 1865 1875 1885 1895 1905 1915 19251806 1816 1826 1836 1846 1856 1866 1876 1886 1896 1906 1916 1926

RE

CE

IVE

R I

IP3

(dB

m)


Rx1 –40°CRx1 +25°CRx1 +110°CRx2 –40°CRx2 +25°C

Rx2 +110°C

16499-336

Figure 213. Receiver IIP3 vs. Swept Pass Band Frequency, Receiver Attenuation = 0 dB, LO = 1800 MHz, Tone 2 = Tone 1 + 1 MHz, −21 dBm

Each, Swept Across Pass Band

0

5

10

15

20

25

2905 2915 2925 2935 2945 2955 2965 2975 2985 2995 3005 3015 30252906 2916 2926 2936 2946 2956 2966 2976 2986 2996 3006 3016 3026

RE

CE

IVE

R I

IP3

(dB

m)



16499-337

Figure 214. Receiver IIP3 vs. Swept Pass Band Frequency, Receiver Attenuation = 0 dB, LO = 2900 MHz, Tone 2 = Tone 1 + 1 MHz, −21 dBm


0

10

20

30

40

50

60

0 2.5 5.0 7.5 10.0 12.5 15.0 17.5 20.0 22.5 25.0 27.5 30.0

RE

CE

IVE

R I

IP3

(dB

m)

ATTENUATION (dB)


16499-338

Figure 215. Receiver IIP3 vs. Attenuation, LO = 1800 MHz, Tone 1 = 1802 MHz, Tone 2 = 1892 MHz, −21 dBm Each at Attenuation = 0 dB

0

5

10

15

20

25

30

807 817 827 837 847 857 867 877 887 897 907

RE

CE

IVE

R I

IP3

(dB

m)



16499-339

Figure 216. Receiver IIP3 vs. Swept Pass Band Frequency, Receiver Attenuation = 0 dB, LO = 800 MHz, Tone 1 = 802 MHz, Tone 2 = Swept Across

Pass Band, −21 dBm Each

0

5

10

15

20

25

30

1807 1817 1827 1837 1847 1857 1867 1877 1887 1897 1907

RE

CE

IVE

R I

IP3

(dB

m)



16499-340

Figure 217. Receiver IIP3 vs. Swept Pass Band Frequency, Receiver Attenuation = 0 dB, LO = 1800 MHz, Tone 1 = 1802 MHz, Tone 2 = Swept

Across Pass Band, −21 dBm Each


Data Sheet ADRV9009


0

5

10

15

20

25

30

2907 2917 2927 2937 2947 2957 2967 2977 2987 2997 3007

RE

CE

IVE

R I

IP3

(dB

m)


Rx1 –40°CRx1 +25°CRx1 +110°CRx2 –40°CRx2 +110°C

16499-341

Figure 218. Receiver IIP3 vs. Swept Pass Band Frequency, Receiver Attenuation = 0 dB, LO = 2900 MHz, Tone 1 = 2902 MHz, Tone 2 = Swept

Across Pass Band, −21 dBm Each

–120

–100

–80

–60

–40

–20

0

–100 –75 –50 –25 0 25 50 75 100

RE

CE

IVE

R I

MA

GE

(d

Bc)

BASEBAND FREQUENCY OFFSET (Hz)

–40°C+25°C+110°C

16499-342



–120

–100

–80

–60

–40

–20

0

–100 –75 –50 –25 0 25 50 75 100

RE

CE

IVE

R I

MA

GE

(d

Bc)


–40°C+25°C+110°C

16499-343



–120

–100

–80

–60

–40

–20

0

–100 –75 –50 –25 0 25 50 75 100

RE

CE

IVE

R I

MA

GE

(d

Bc)


–40°C+25°C+110°C

16499-344



–120

–100

–80

–60

–40

–20

0

0 2.5 5.0 7.5 10.0 12.5 15.0

RE

CE

IVE

R I

MA

GE

(d

Bc)


–40°C+25°C+110°C

16499-345

Figure 222. Receiver Image vs. Attenuator Setting, RF Bandwidth = 200 MHz, Tracking Calibration Active, Sample Rate = 245.76 MSPS, LO = 1850 MHz

–15

–10

–5

0

5

10

15

20

25

0 5 10 15 20 25 30

RE

CE

IVE

R G

AIN

(d

B)


–40°C+25°C+110°C

16499-346

Figure 223. Receiver Gain vs. Receiver Attenuation, RF Bandwidth = 20 MHz, Sample Rate = 245.76 MSPS, LO = 1850 MHz


ADRV9009 Data Sheet


10

12

14

16

18

20

22

24

650

750

850

950

1050

1150

1250

1350

1450

1550

1650

1750

1850

1950

2050

2150

2250

2350

2450

2550

2650

2750

2850

RE

CE

IVE

R G

AIN

(d

B)

LO FREQUENCY (MHz)

–40°C+25°C+110°C

16499-347


–0.5

–0.4

–0.3

–0.2

–0.1

0

0.1

0.2

0.3

0.4

0.5

0 5 10 15 20 25 30

RE

CE

IVE

R G

AIN

ST

EP

ER

RO

R (

dB

)


–40°C+25°C+110°C

16499-349

Figure 225. Receiver Gain Step Error vs. Receiver Attenuator Setting over Temperature

0.10

NO

RM

AL

IZE

D R

EC

EIV

ER

BA

SE

BA

ND

FL

AT

NE

SS

(d

B)


0.050

–0.05–0.10–0.15–0.20–0.25–0.30–0.35–0.40–0.45–0.50–0.55–0.60–0.65–0.70–0.75–0.80–0.85–0.90–0.95–1.00

1.00

44.

492

7.99

611

.516

15.0

4418

.484

22.0

0425

.492

29.0

1232

.492

36.0

0439

.484

43.0

1246

.484

50.0

1253

.524

57.0

0460

.484

64.0

0467

.516

70.9

9674

.468

78.0

0481

.476

84.9

8888

.492

92.0

1295

.492

98.9

9610

2.48

410

6.00

410

9.46

811

2.91

6

NORMALIZED I RIPPLENORMALIZED I RIPPLENORMALIZED I RIPPLENORMALIZED Q RIPPLENORMALIZED Q RIPPLENORMALIZED Q RIPPLE

16499-350

Figure 226. Normalized Receiver Baseband Flatness vs. Baseband Offset Frequency, LO = 2600 MHz

–100

–95

–90

–85

–80

–75

–70

650 850 1050 1250 1450 1650 1850 2050 2250 2450 2650 2850

RE

CE

IVE

R

DC

OF

FS

ET

(d

BF

S)


–40°C+25°C+110°C

16499-351


–100

–95

–90

–85

–80

–75

–70

0 5 10 15 20 25 30

RE

CE

IVE

R

DC

OF

FS

ET

(d

BF

S)


–40°C+25°C+110°C

16499-352


–150

–130

–110

–90

–70

–50

–30

–60 –40 –20 0 20 40 60


RE

CE

IVE

R H

D2,

LE

FT

(d

Bc)

ATTN = 15 –40°CATTN = 0 –40°CATTN = 15 +25°CATTN = 0 +25°CATTN = 15 +110°CATTN = 0 +110°C

16499-353

Figure 229. Receiver HD2, Left vs. Baseband Frequency Offset and Attenuation, Tone Level = −15 dBm at Attenuation = 0, HD2 Correction

Configured for Low-Side Optimization, X-Axis = Baseband Frequency Offset of Fundamental Tone, Not the Frequency of the HD2 Product (HD2 Product =

2 × Baseband Frequency), LO = 650 MHz


Data Sheet ADRV9009


–150

–130

–110

–90

–70

–50

–30

–60 –40 –20 0 20 40 60

RE

CE

IVE

R H

D2,

LE

FT

(d

Bc)


ATTN = 15 –40°CATTN = 0 –40°CATTN = 15 +25°CATTN = 0 +25°CATTN = 15 +110°CATTN = 0 +110°C

16499-354

Figure 230. Receiver HD2, Left vs. Baseband Frequency Offset and Attenuation, Tone Level = −15 dBm at Attenuation = 0, HD2 Correction

Configured for Low-Side Optimization, X-Axis = Baseband Frequency Offset of the Fundamental Tone, Not the Frequency of the HD2 Product (HD2

Product = 2 × the Baseband Frequency), LO = 1850 MHz

–150

–130

–110

–90

–70

–50

–30

–10

10

–50 –40 –30 –20 –10 10 20 30 40 50

RE

CE

IVE

R H

D3,

LE

FT

AN

D R

IGH

T (

dB

c)


Rx1 –40°C HD3 (LEFT)Rx1 –40°C HD3 (RIGHT)Rx1 +25°C HD3 (LEFT)Rx1 +25°C HD3 (RIGHT)Rx1 +110°C HD3 (LEFT)Rx1 +110°C HD3 (RIGHT)Rx2 –40°C HD3 (LEFT)Rx2 –40°C HD3 (RIGHT)

Rx2 +25°C HD3 (LEFT)Rx2 +25°C HD3 (RIGHT)Rx2 +110°C HD3 (LEFT)Rx2 +110°C HD3 (RIGHT)

16499-356

Figure 231. Receiver HD3, Left and Right vs. Frequency Offset from LO, Tone Level = −15 dBm at Attenuation = 0, LO = 650 MHz

–150

–130

–110

–90

–70

–50

–30

–10

10

–50 –40 –30 –20 –10 10 20 30 40 50

RE

CE

IVE

R H

D3,

LE

FT

AN

D R

IGH

T (

dB

c)

FREQUENCY OFFSET FROM LO (MHz) 16499-357



Figure 232. Receiver HD3, Left and Right vs. Frequency Offset from LO, Tone Level = −15 dBm at Attenuation = 0, LO = 1850 MHz

–150

–130

–110

–90

–70

–50

–30

–10

10

–50 –40 –30 –20 –10 10 20 30 40 50

RE

CE

IVE

R H

D3

(dB

c)




Figure 233. Receiver HD3 vs. Frequency Offset from LO, Tone Level = −15 dBm at Attenuation = 0, LO = 2850 MHz

–150

–130

–110

–90

–70

–50

–30

–10

10

0 15 30 10 25 5 20 0 15 30 10 25 5 20 0 15 30 10 25 5 20 0 15 30–50 –40 –30 –20 –10 10 20 30 40 50

RE

CE

IVE

R H

D3,

LE

FT

AN

D R

IGH

T (

dB

c)




Figure 234. Receiver HD3, Left and Right vs. Frequency Offset from LO, Baseband Tone Held Constant, Tone Level Increased 1 for 1 as Attenuator is Swept from 0 dB to 30 dB, HD3 Right (High-Side): Tone on Same Side as HD3

Product, HD3 Left (Low-Side): Tone on Opposite Side as HD3 Product, CW Signal, LO = 1850 MHz, Tone Level = −15 dBm at Attenuation = 0 dB

–50

–45

–40

–35

–30

–25

–20

–15

–10

–5

RE

CE

IVE

R E

VM

(d

B)

0

–65 –55 –45 –35 –25 –15 –5 5

LTE20 RF INPUT POWER (dBm)

–40°C+25°C+110°C

16499-360

Figure 235. Receiver EVM vs. LTE20 RF Input Power, LTE = 20 MHz RF Signal, LO = 600 MHz


ADRV9009 Data Sheet


–50

–45

–40

–35

–30

–25

–20

–15

–10

–5

0

–65 –55 –45 –35 –25 –15 –5 5

RE

CE

IVE

R E

VM

(d

B)


–40°C+25°C+110°C

16499-361


–45

–40

–35

–30

–25

–20

–15

–10

–5

0

–65 –55 –45 –35 –25 –15 –5 5

RE

CE

IVE

R E

VM

(d

B)


–40°C+25°C+110°C

16499-362


0

10

20

30

40

50

60

70

80

90

RE

CE

IVE

RT

O R

EC

EIV

ER

IS

OL

AT

ION

(d

B)

LO FREQUENCY (MHz)

–40°C+25°C+110°C

650

750

850

950

1050

1150

1250

1350

1450

1550

1650

1750

1850

1950

2050

2150

2250

2350

2450

2550

2650

2750

2850

16499-363

Figure 238. Receiver to Receiver Isolation vs. LO Frequency

–70

–80

–90

–100

–110

LO

PH

AS

E N

OIS

E (

dB

)

–120

–130

–140

–150

–160

–170

FREQUENCY OFFSET (Hz)100M100 1k 10k 100k 1M 10M

16499-364

Figure 239. LO Phase Noise vs. Frequency Offset, LO = 1900 MHz, RMS Phase Error Integrated from 2 kHz to 18 MHz, Spectrum Analyzer Limits Far Out Noise


Data Sheet ADRV9009


3400 MHz TO 4800 MHz BAND

–4.0

–3.5

–3.0

–2.5

–2.0

–1.5

–1.0

–0.5

0

3400 3600 3800 4000 4200 4400 4600 4800 5000

TR

AN

SM

ITT

ER

PA

TH

LO

SS

(d

B)


Figure 240. Transmitter Path Loss vs. LO Frequency (Simulation), Can Be Used for De-Embedding Performance Data

0

1

2

3

4

5

6

7

8

9

10

3400 3600 3800 4000 4200 4400 4600 4800

TR

AN

SM

ITT

ER

CW

OU

TP

UT

PO

WE

R (

dB

m)


Tx1 = –40°CTx2 = –40°CTx1 = +25°CTx2 = +25°CTx1 = +110°CTx2 = +110°C

16499-366

Figure 241. Transmitter CW Output Power vs. Transmitter LO Frequency, Transmitter QEC and External LO Leakage Active, Transmitter in

200 MHz/450 MHz Bandwidth Mode, IQ Rate = 491.52 MHz, Attenuation = 0 dB, Not De-Embedded

–100

–90

–80

–70

–60

–50

–40

–30

–20

–10

0

–50–100 0 50 100

TR

AN

SM

ITT

ER

IM

AG

E R

EJE

CT

ION

AC

RO

SS

LA

RG

E S

IGN

AL

BA

ND

WID

TH

(d

Bc)

BASEBAND OFFSET FREQUENCY AND ATTENUATION (MHz)

–40°C ATTENUATION = 0dB–40°C ATTENUATION = 5dB–40°C ATTENUATION = 10dB–40°C ATTENUATION = 15dB–40°C ATTENUATION = 20dB–40°C ATTENUATION = 25dB

+25°C ATTENUATION = 0dB+25°C ATTENUATION = 5dB+25°C ATTENUATION = 10dB+25°C ATTENUATION = 15dB+25°C ATTENUATION = 20dB+25°C ATTENUATION = 25dB


16499-367

Figure 242. Transmitter Image Rejection Across Large Signal Bandwidth vs. Baseband Offset Frequency and Attenuation, QEC Trained with Three Tones

Placed at 10 MHz, 50 MHz, and 100 MHz (Tracking On), Total Combined Power = −6 dBFS, Correction Then Frozen (Tracking Turned Off), CW Tone

Swept Across Large Signal Bandwidth, LO = 3700 MHz

TR

AN

SM

ITT

ER

IM

AG

E R

EJE

CT

ION

AC

RO

SS

LA

RG

E S

IGN

AL

BA

ND

WID

TH

(d

Bc)

–100

–90

–80

–70

–60

–50

–40

–30

–20

–10

–50–100 0 50 100


–40°C ATTENUATION = 0dB–40°C ATTENUATION = 5dB–40°C ATTENUATION = 10dB–40°C ATTENUATION = 15dB–40°C ATTENUATION = 20dB–40°C ATTENUATION = 25dB



16499-368

Figure 243. Transmitter Image Rejection Across Large Signal Bandwidth vs. Baseband Offset Frequency and Attenuation, QEC Trained with Three Tones

(Tracking On), Total Combined Power = −6 dBFS, Correction Then Frozen (Tracking Turned Off), CW Tone Swept Across Large Signal Bandwidth,

LO = 4600 MHz

–1.0–0.9–0.8–0.7–0.6–0.5–0.4–0.3–0.2–0.1

0.00.10.20.30.40.50.60.70.80.91.0

–225 –175 –125 –75 –25 25 75 125 175 225

TR

AN

SM

ITT

ER

PA

SS

BA

ND

FL

AT

NE

SS

(d

B)



16499-369

Figure 244. Transmitter Pass Band Flatness vs. Baseband Offset Frequency, Off Chip Match Response De-Embedded, LO = 3600 MHz

–1.0–0.9–0.8–0.7–0.6–0.5–0.4–0.3–0.2–0.1

0.00.10.20.30.40.50.60.70.80.91.0

–225 –175 –125 –75 –25 25 75 125 175 225

TR

AN

SM

ITT

ER

PA

SS

BA

ND

FL

AT

NE

SS

(d

B)



16499-370

Figure 245. Transmitter Pass Band Flatness vs. Baseband Offset Frequency, Off Chip Match Response De-Embedded, LO = 4600 MHz


ADRV9009 Data Sheet


–90

–88

–86

–84

–82

–80

–78

–76

–74

–72

–70

3700 4600

TR

AN

SM

ITT

ER

LO

LE

AK

AG

E (

dB

FS

)



16499-371

Figure 246. Transmitter LO Leakage vs. Transmitter LO Frequency, Transmitter Attenuation = 0 dB

0

20

40

60

80

100

1203400 3600 3800 4000 4200 4400 4600 4800

TR

AN

SM

ITT

ER

TO

RE

CE

IVE

R

ISO

LAT

ION

(d

B)


Tx1 TO Rx1Tx1 TO Rx2Tx2 TO Rx1Tx2 TO Rx2

16499-372

Figure 247. Transmitter to Receiver Isolation vs. Receiver LO Frequency, Temperature = −40°C, +25°C, and +110°C

0

100

30

10

70

80

50

40

20

60

90

TR

AN

SM

ITT

ER

TO

TR

AN

SM

ITT

ER

ISO

LA

TIO

N (

dB

)

3400 4800460040003600 4200 44003800


Tx1 TO Tx2 0dBTx2 TO Tx1 0dB

16499-751


–145

–175

–165

–155

–160

–150

–170

TR

AN

SM

ITT

ER

NO

ISE

(d

Bm

/Hz)


0 6 14 192 104 12 16 181 85 1393 11 15 177

4600MHz = +110°C4600MHz = +25°C4600MHz = –40°C3600MHz = +110°C3600MHz = +25°C3600MHz = –40°C

16499-752

Figure 249. Transmitter Noise vs. Transmitter Attenuator Setting

40

–10

25

35

0

5

15

20

30

10

–5

TR

AN

SM

ITT

ER

OIP

3, R

IGH

T (

dB

m)

0 301262 168 14 1810 22 2624 28204


+110°C+25°C–40°C

16499-753

Figure 250. Transmitter OIP3, Right vs. Transmitter Attenuator Setting, LO = 3600 MHz, Total RMS Power = −12 dBFS

35

–10

25

0

5

15

20

30

10

–5

TR

AN

SM

ITT

ER

OIP

3, R

IGH

T (

dB

m)

0 301262 168 14 1810 22 2624 28204


+110°C+25°C–40°C

16499-754



Data Sheet ADRV9009


40

35

0

25

5

15

20

30

10

TR

AN

SM

ITT

ER

OIP

3 R

IGH

T (

dB

m)

510

95100

6570

3540

1520

8590

4550

7580

5560

2530



16499-755

Figure 252. Transmitter OIP3 Right vs. Baseband Tone Pair Swept Across Pass Band, LO = 3600 MHz, Total RMS Power = −12 dBFS

40

35

0

25

5

15

20

30

10

TR

AN

SM

ITT

ER

OIP

3 R

IGH

T (

dB

m)

510

95100

6570

3540

1520

8590

4550

7580

5560

2530



16499-756

Figure 253. Transmitter OIP3 Right vs. Baseband Tone Pair Swept Across Pass Band, LO = 4600 MHz, Total RMS Power = −12 dBFS

0

–20

–120

–60

–100

–80

–40

TR

AN

SM

ITT

ER

HD

2 (d

Bc)

0 3222102 3014 26186 24124 16 28208


+110°C = HD2+25°C = HD2–40°C = HD2+110°C = UPPER HD2+25°C = UPPER HD2 –40°C = UPPER HD2

16499-757


0

–20

–120

–60

–100

–80

–40

TR

AN

SM

ITT

ER

HD

2 (d

Bc)

0 3222102 3014 26186 24124 16 28208


+110°C = HD2+25°C = HD2–40°C = HD2+110°C = UPPER HD2+25°C = UPPER HD2 –40°C = UPPER HD2

16499-758


0

–20

–120

–60

–100

–80

–40

TR

AN

SM

ITT

ER

HD

3 (d

Bc)

0 3222102 3014 26186 24124 16 28208TRANSMITTER ATTENUATOR SETTING (dB)


16499-759


0

–20

–120

–60

–100

–80

–40

TR

AN

SM

ITT

ER

HD

3 (d

Bc)

0 3222102 3014 26186 24124 16 28208TRANSMITTER ATTENUATOR SETTING (dB)


16499-760



ADRV9009 Data Sheet


0

–20

–120

–60

–100

–80

–40

TR

AN

SM

ITT

ER

HD

3 IM

AG

E (

dB

c)A

PP

EA

RS

ON

SA

ME

SID

E A

S D

ES

IRE

D S

IGN

AL

0 20102 14 186 124 168TRANSMITTER ATTENUATOR SETTING (dB)


16499-761


0

–20

–120

–60

–100

–80

–40

TR

AN

SM

ITT

ER

HD

3 IM

AG

E (

dB

c)A

PP

EA

RS

ON

SA

ME

SID

E A

S D

ES

IRE

D S

IGN

AL

0 20102 14 186 124 168TRANSMITTER ATTENUATOR SETTING (dB)


16499-762


0.05

0.04

–0.05

0

–0.04

–0.02

0.02

0.03

–0.01

–0.03

0.01

TR

AN

SM

ITT

ER

AT

TE

NU

AT

OR

ST

EP

ER

RO

R (

dB

)

0 3222102 3014 26186 24124 16 28208


+110°C+25°C–40°C

16499-763

Figure 260. Transmitter Attenuator Step Error vs. Transmitter Attenuator Setting, LO = 3600 MHz

0.05

0.04

–0.05

0

–0.04

–0.02

0.02

0.03

–0.01

–0.03

0.01

TR

AN

SM

ITT

ER

AT

TE

NU

AT

OR

ST

EP

ER

RO

R (

dB

)

0 3222102 3014 26186 24124 16 28208


+110°C+25°C–40°C

16499-764


–30

–32

–50

–40

–48

–44

–36

–34

–42

–46

–38

EV

M (

dB

)

0 255 1510 20

TRANSMITTER ATTENUATION (dBm)

+110°C+25°C–40°C

16499-765

Figure 262. EVM vs. Transmitter Attenuation, LTE = 20 MHz Signal Centered on DC, LO = 3600 MHz

–30

–32

–50

–40

–48

–44

–36

–34

–42

–46

–38

EV

M (

dB

)

0 255 1510 20


+110°C+25°C–40°C

16499-766

Figure 263. EVM vs. Transmitter Attenuation, LTE = 20 MHz Signal Centered on DC, LO = 4600 MHz


Data Sheet ADRV9009


–10

–20

–100

–60

–80

–40

–30

–70

–90

–50

AM

PL

ITU

DE

(d

Bm

)

4100

5100

4300

4700

4500

4900

5000

4200

4600

4400

4800

FREQUENCY (MHz)

Tx OUTPUTANALYZER NO SIGNAL

16499-767

Figure 264. Amplitude vs. Frequency, Transmitter Output Spurious, Transmitter 1 = 4600 MHz, LTE = 5 MHz, Offset = 10 MHz, RMS Ripple in Noise

Floor Due to Spectrum Analyzer = −12 dBFS, Temperature = 25°C

–2.0

–1.8

–1.6

–1.4

–1.2

–1.0

–0.8

–0.6

–0.4

–0.2

0

3400 3600 3800 4000 4200 4400 4600 4800 5000

OB

SE

RV

AT

ION

RE

CE

IVE

R O

FF

CH

IPM

AT

CH

ING

CIR

CU

ITP

AT

H L

OS

S (

dB

)


Figure 265. Observation Receiver Off Chip Matching Circuit Path Loss vs. LO Frequency, Simulation, Can be Used for De-Embedding Performance Data

0

–10

–100

–50

–70

–30

–20

–60

–90

–80

–40

OB

SE

RV

AT

ION

RE

CE

IVE

R L

O L

EA

KA

GE

(d

Bm

)

LO FREQUENCY (MHz)

3600 4600

+110°C+25°C–40°C

16499-769

Figure 266. Observation Receiver LO Leakage vs. LO Frequency, from 3600 MHz to 4600 MHz

30

32

28

26

18

22

24

14

16

20

OB

SE

RV

AT

ION

RE

CE

IVE

R N

OIS

E F

IGU

RE

(d

B)


0 10987654321

+110°C+25°C–40°C

16499-770


34

32

14

24

16

28

30

20

18

22

26

OB

SE

RV

AT

ION

RE

CE

IVE

R N

OIS

E F

IGU

RE

(d

B)


0 10987654321

+110°C+25°C–40°C

16499-771


80

40

60

70

50

75

55

65

45OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP2,

SU

MA

ND

DIF

FE

RE

NC

E P

RO

DC

UT

S (

dB

m)


36063605

36663665

37463745

38263825

37863785

38063805

37663765

36263625

37063705

36863685

36463645

37263725


16499-772




ADRV9009 Data Sheet


80

40

60

70

50

75

55

65

45

OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP2,

SU

M A

ND

DIF

FE

RE

NC

E P

RO

DU

CT

S (

dB

m)


46064605

46664665

47464745

48264825

47864785

48064805

47664765

46264625

47064705

46864685

46464645

47264725


16499-773

Figure 270. Observation Receiver IIP2, Sum and Difference Products vs. f1 Offset Frequency, Tones Separated By 1 MHz Swept Across Pass Band at

−22 dBm Each, 4600 MHz, Attenuation = 0 dB

80

50

75

55

65

60

70

OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP2,

SU

M A

ND

DIF

FE

RE

NC

E P

RO

DU

CT

S (

dB

m)

ATTENUATION (dB)

0 108642


16499-774

Figure 271. Observation Receiver IIP2, Sum and Difference Products vs. Attenuation, LO = 3600 MHz, Tone 1 = 3645 MHz, Tone 2 = 3646 MHz at


80

50

75

55

65

60

70

OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP2,

SU

M A

ND

DIF

FE

RE

NC

E P

RO

DU

CT

S (

dB

m)

ATTENUATION (dB)

0 108642


16499-775



80

0

20

50

70

40

60

10

30

OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP2,

f1

– f2

(d

Bm

)


361

2

363

2

365

2

367

2

369

2

371

2

373

2

375

2

377

2

379

2

381

2

383

2

INTERMODULATION FREQUENCY (MHz) 16499-776

Figure 273. Observation Receiver IIP2, f1 − f2 vs. Intermodulation Frequency, LO = 3600 MHz, Tone 1 = 3602 MHz, Tone 2 Swept, −22 dBm Each,

Attenuation = 0 dB

80

0

20

50

70

40

60

10

30

OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP2,

f1

– f2

(d

Bm

)


4612

4632

4652

4672

4692

4712

4732

4752

4772

4792

4812

4832


Figure 274. Observation Receiver IIP2, f1 − f2 vs. Intermodulation Frequency, LO = 4600 MHz, Tone 1 = 4602 MHz, Tone 2 Swept, −22 dBm Each,

Attenuation = 0 dB

80

50

75

55

65

60

70

OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP2,

f1

– f2

(d

Bm

)

ATTENUATION (dB)

0 108642


16499-778

Figure 275. Observation Receiver IIP2, f1 − f2 vs. Attenuation, LO = 3600 MHz, Tone 1 = 3602 MHz, Tone 2 = 3702 MHz at −22 dBm Plus Attenuation


Data Sheet ADRV9009


80

50

75

55

65

60

70

OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP2,

f1

– f2

(d

Bm

)

ATTENUATION (dB)

0 108642


16499-779

Figure 276. Observation Receiver IIP2, f1 − f2 vs. Attenuation, LO = 4600 MHz, Tone 1 = 4602 MHz, Tone 2 = 4612 MHz at −22 dBm Plus

Attenuation

25

0

5

15

20

10

OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP3,

2f1

– f

2 (d

Bm

)

ORx1 = +110°CORx1 = +25°CORx1 = –40°C

3605 3625 3645 3665 3685 3705 3725 3745 3765 3785 3805 38253606 3626 3646 3666 3686 3706


3726 3746 3766 3786 3806 3826

16499-780



25

0

5

15

20

10

OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP3,

2f1

– f

2 (d

Bm

)


ORx1 = +110°CORx1 = +25°CORx1 = –40°C

4606 4626 4646 4666 4686 4706 4726 4746 4766 4786 4806 48264605 4625 4645 4665 4685 4705 4725 4745 4765 4785 4805 4825

16499-781



30

6

26

10

18

14

22

28

24

8

16

12

20

OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP3,

2f1

– f

2 (d

Bm

)

ATTENUATION (dB)

0 108642

INPUT IP3 = +110°CINPUT IP3 = +25°CINPUT IP3 = –40°C

16499-782


30

6

26

10

18

14

22

28

24

8

16

12

20O

BS

ER

VA

TIO

N R

EC

EIV

ER

IIP

3, 2

f1 –

f2

(dB

m)

ATTENUATION (dB)

0 108642


16499-783


30

0

10


25

20

5

15

OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP3,

2f1

– f

2 (d

Bm

)


361

2

363

2

365

2

367

2

369

2

371

2

373

2

375

2

377

2

379

2

381

2

383

216499-784

Figure 281. Observation Receiver IIP3, 2f1 − f2 vs. Intermodulation Frequency, LO = 3600 MHz, Tone 1 = 3602 MHz, Tone 2 = Swept,

−22 dBm Each


ADRV9009 Data Sheet


30

0

10

25

20

5

15

OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP3,

2f1

– f

2 (d

Bm

)


4612

4632

4652

4672

4692

4712

4732

4752

4772

4792

4812

4832


Figure 282. Observation Receiver IIP3, 2f1 − f2 vs. Intermodulation Frequency, LO = 4600 MHz, Tone 1 = 4602 MHz, Tone 2 = Swept, −22 dBm Each

OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP3,

2f1

– f

2 (d

Bm

)

ATTENUATION (dB)

0 108642

30

6

26

10

18

14

22

28

24

8

16

12

20

IIP3 = +110°CIIP3 = +25°CIIP3 = –40°C

16499-786

Figure 283. Observation Receiver IIP3, 2f1 − f2 vs. Attenuation, LO = 3600 MHz, Tone 1 = 3602 MHz, Tone 2 = 3722 MHz, −22 dBm Each Plus Attenuation

OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP3,

2f1

– f

2 (d

Bm

)

ATTENUATION (dB)

0 108642

30

6

26

10

18

14

22

28

24

8

16

12

20

IIP3 = +110°CIIP3 = +25°CIIP3 = –40°C

16499-787

Figure 284. Observation Receiver IIP3, 2f1 − f2 vs. Attenuation, LO = 4600 MHz, Tone 1 = 4602 MHz, Tone 2 = 4722 MHz at −22 dBm Plus

Attenuation Each

0

–100

–90

–80

–70

–60

–50

–40

–30

–20

–10

–225

–175

–125 –7

5 0

–25

–200

–150

–100 –5

0 25 75

125

225

17550

100

150

200



16499-788

OB

SE

RV

AT

ION

RE

CE

IVE

RIM

AG

E R

EJE

CT

ION

(d

Bc)

Figure 285. Observation Receiver Image Rejection vs. Baseband Frequency Offset, CW Signal Swept Across the Band, LO = 3600 MHz

0

–100

–90

–80

–70

–60

–50

–40

–30

–20

–10

–225

–175

–125 –7

5 0

–25

–200

–150

–100 –5

0 25 75 125

225

17550 100

150

200



16499-789

OB

SE

RV

AT

ION

RE

CE

IVE

RIM

AG

E R

EJE

CT

ION

(d

Bc)

Figure 286. Observation Receiver Image Rejection vs. Baseband Frequency Offset, CW Signal Swept Across the Band, LO = 4600 MHz

OB

SE

RV

AT

ION

RE

CE

IVE

R G

AIN

(d

Bm

)


0 1086421 9753

18

4

14

6

10

16

12

8

+110°C+25°C–40°C

16499-790



Data Sheet ADRV9009


OB

SE

RV

AT

ION

RE

CE

IVE

R G

AIN

(d

Bm

)


0 1086421 9753

18

4

14

6

10

16

12

8

+110°C+25°C–40°C

16499-791



0 1086421 9753

+110°C+25°C–40°C

0.5

–0.5

–0.4

–0.3

–0.2

–0.1

0.1

0

0.2

0.3

0.4

OB

SE

RV

AT

ION

RE

CE

IVE

R G

AIN

ST

EP

ER

RO

R (

dB

)

16499-792

Figure 289. Observation Receiver Gain Step Error vs. Observation Receiver Attenuator Setting, LO = 3600 MHz


0 1086421 9753

+110°C+25°C–40°C

0.5

–0.5

–0.4

–0.3

–0.2

–0.1

0.1

0

0.2

0.3

0.4

OB

SE

RV

AT

ION

RE

CE

IVE

R G

AIN

ST

EP

ER

RO

R (

dB

)

16499-793


–225

–175

–125 –7

5 0

–25

–200

–150

–100 –5

0 25 75 125

225

17550 100

150

200


+110°C+25°C–40°C

0.5

–0.5

–0.4

–0.3

–0.2

–0.1

0.1

0

0.2

0.3

0.4

OB

SE

RV

AT

ION

RE

CE

IVE

R P

AS

S B

AN

DF

LA

TN

ES

S (

dB

)

16499-794


–225

–175

–125 –7

5 0

–25

–200

–150

–100 –5

0 25 75 125

225

17550 100

150

200


+110°C+25°C–40°C

0.5

–0.5

–0.4

–0.3

–0.2

–0.1

0.1

0

0.2

0.3

0.4

OB

SE

RV

AT

ION

RE

CE

IVE

R P

AS

S B

AN

DF

LA

TN

ES

S (

dB

)

16499-795


OB

SE

RV

AT

ION

RE

CE

IVE

R D

C O

FF

SE

T (

dB

FS

)

ATTENUATION (dB)

0 105

0

–120

–40

–80

–20

–60

–100


16499-796



ADRV9009 Data Sheet


OB

SE

RV

AT

ION

RE

CE

IVE

R D

C O

FF

SE

T (

dB

FS

)

ATTENUATION (dB)

0 105

0

–120

–40

–80

–20

–60

–100


16499-797


0

–120

–80

–100

–60

–40

–20

–100 –75 –50 –25 0 25 50 10075

OB

SE

RV

AT

ION

RE

CE

IVE

R H

D2

(dB

c)




16499-798

Figure 295. Observation Receiver HD2 vs. Offset Frequency, LO = 3600 MHz, Tone Level = −20 dBm Plus Attenuation

0

–120

–80

–100

–60

–40

–20

–100 –75 –50 –25 0 25 50 10075

OB

SE

RV

AT

ION

RE

CE

IVE

R H

D2

(dB

c)




16499-799


0

–100

–30

–10

–70

–50

–40

–20

–60

–80

–90

OB

SE

RV

AT

ION

RE

CE

IVE

R H

D3,

LE

FT

AN

D R

IGH

T (

dB

c)

–90.0 90.045.0–22.5–67.5 67.522.5–45.0



16499-800

Figure 297. Observation Receiver HD3, Left and Right vs. Offset Frequency, LO = 3600 MHz, Tone Level = −20 dBm

0

–100

–30

–10

–70

–50

–40

–20

–60

–80

–90

OB

SE

RV

AT

ION

RE

CE

IVE

R H

D3,

LE

FT

AN

D R

IGH

T (

dB

c)

–90.0 90.045.0–22.5–67.5 67.522.5–45.0



16499-801


0

140

120

80

40

20

100

60

TR

AN

SM

ITT

ER

TO

OB

SE

RV

AT

ION

RE

CE

IVE

RIS

OL

AT

ION

(d

B)

LO FREQUENCY (MHz)

3400 4200 48003800 460040003600 4400


16499-802



Data Sheet ADRV9009


0

–2.0

–0.8

–0.4

–0.6

–0.2

–1.2

–1.8

–1.4

–1.6

–1.0

RE

CE

IVE

R O

FF

CH

IP M

AT

CH

ING

CIR

CU

IT P

AT

H L

OS

S (

dB

)

LO FREQUENCY (MHz)

3400 4200 50003800 46004000 48003600 4400

16499-803

Figure 300. Receiver Off Chip Matching Circuit Path Loss vs. LO Frequency, (Simulation), Can Be Used for De-Embedding Performance Data

0

–10

–100

–50

–70

–30

–20

–60

–90

–80

–40

RE

CE

IVE

R L

O L

EA

KA

GE

(d

Bm

)


3600 4600

+110°C+25°C–40°C

16499-804

Figure 301. Receiver LO Leakage vs. Receiver LO Frequency, Receiver Attenuation = 0 dB, RF Bandwidth = 200 MHz, Sample Rate = 245.76 MSPS

45

40

0

20

30

35

10

5

15

25

RE

CE

IVE

R N

OIS

E F

IGU

RE

(d

B)


0 2018161412108642

+110°C+25°C–40°C

16499-805

Figure 302. Receiver Noise Figure vs. Receiver Attenuation, LO = 3600 MHz, Receiver Bandwidth = 200 MHz, Sample Rate = 245.76 MSPS, Integration


45

40

0

20

30

35

10

5

15

25

RE

CE

IVE

R N

OIS

E F

IGU

RE

(d

B)


0 2018161412108642

+110°C+25°C–40°C

16499-806

Figure 303. Receiver Noise Figure vs. Receiver Attenuation, LO = 4600 MHz, Bandwidth = 200 MHz, Sample Rate = 245.76 MSPS, Integration Bandwidth

= 500 kHz to 100 MHz

RE

CE

IVE

R I

IP2

(dB

m)



120

50

80

100

60

110

70

90

0 282624222018161412108642 30

16499-807

Figure 304. Receiver IIP2 vs. Receiver Attenuation, LO = 3600 MHz, Tones Placed at 3645 MHz and 3646 MHz, −21 dBm Plus Attenuation

RE

CE

IVE

R I

IP2

(dB

m)



110

50

80

100

60

70

90

0 282624222018161412108642 30

16499-808



ADRV9009 Data Sheet


RE

CE

IVE

R I

IP2

SU

M A

ND

DIF

FE

RE

NC

E A

CR

OS

SB

AN

DW

IDT

H (

dB

m)


80

40

55

75

45

50

65

70

60

36063605

36863685

36663665

36463645

36263625

37063705

SWEPT PASS BAND FREQUENCY (MHz) 16499-809

Figure 306. Receiver IIP2 Sum and Difference Across Bandwidth vs. Swept Pass Band Frequency, Receiver Attenuation = 0 dB, LO = 3600 MHz, Six Tone

Pairs, −21 dBm Each Plus Attenuation

RE

CE

IVE

R I

IP2

SU

M A

ND

DIF

FE

RE

NC

E A

CR

OS

SB

AN

DW

IDT

H (

dB

m)


80

40

55

75

45

50

65

70

60

46064605

46864685

46664665

46464645

46264625

47064705



Pairs, −21 dBm Each

RE

CE

IVE

R I

IP2

(dB

m)

100

80

50

55

75

90

85

95

65

70

60

0 2015105 3025RECEIVER ATTENUATION

+110°C = Rx1 (DIFF)+110°C = Rx1 (SUM)+25°C = Rx1 (DIFF)+25°C = Rx1 (SUM)–40°C = Rx1 (DIFF)–40°C = Rx1 (SUM)


16499-811


RE

CE

IVE

R I

IP2

(dB

m)

100

80

50

55

75

90

85

95

65

70

60

0 2015105 3025RECEIVER ATTENUATION



16499-812

Figure 309. Receiver IIP2 vs. Receiver Attenuation, LO = 4600 MHz, Tones Placed at 4602 MHz and 4692 MHz, −21dBm Plus Attenuation

RE

CE

IVE

R I

IP2

SU

M A

ND

DIF

FE

RE

NC

E A

CR

OS

SB

AN

DW

IDT

H (

dB

m)

100

80

50

55

75

90

85

95

65

70

60

3612 3692367236523632 3682366236423622 37123702




16499-813



100

70

75

80

85

90

95

65

60

55

50

404612 4622 4632 4642 4652 4662 4672 4682 4692 4702 4712

RE

CE

IVE

R I

IP2

SU

M A

ND

DIF

FE

RE

NC

E A

CR

OS

SB

AN

DW

IDT

H (

dB

m)


Rx2 +25°C IIP2_SUM_CFRx2 +25°C IIP2_DIF_CFRx1 –40°C IIP2_SUM_CFRx1 –40°C IIP2_DIF_CFRx2 –40°C IIP2_SUM_CFRx2 –40°C IIP2_DIF_CF

Rx1 +110°C IIP2_SUM_CFRx1 +110°C IIP2_DIF_CFRx2 +110°C IIP2_SUM_CFRx2 +110°C IIP2_DIF_CFRx1 +25°C IIP2_SUM_CFRx1 +25°C IIP2_DIF_CF

16499-193




Data Sheet ADRV9009


RE

CE

IVE

R I

IP3

(dB

m)

45

30

0

5

25

40

35

15

20

10

0 2015105 3025ATTENUATION (dB)


16499-814


RE

CE

IVE

R I

IP3

(dB

m)

45

30

0

5

25

40

35

15

20

10

0 2015105 3025RECEIVER ATTENUATION SWEPT (dB)


16499-815

Figure 313. Receiver IIP3 vs. Receiver Attenuation Swept, LO = 4600 MHz, Tone 1 = 4695 MHz, Tone 2 = 4696 MHz, −21 dBm Plus Attenuation

RE

CE

IVE

R I

IP3

AC

RO

SS

BA

ND

WIT

H (

dB

m)

30

0

5

25

15

20

10 Rx1 = +110°CRx1 = +25°CRx1 = –40°CRx2 = +110°CRx2 = +25°CRx2 = –40°C

36053606

36853686

36653666

SWEPT PASS BAND FREQUENCY (dB)

36453646

36253626

37053706

16499-816

Figure 314. Receiver IIP3 Across Bandwidth vs. Swept Pass Band Frequency, Receiver Attenuation = 0 dB, LO = 3600 MHz, Tone 2 = Tone 1 + 1 MHz, −21 dBm


RE

CE

IVE

R I

IP3

(dB

m)

30

0

5

25

15

20

10 Rx1 = +110°CRx1 = +25°CRx1 = –40°CRx2 = +110°CRx2 = +25°CRx2 = –40°C

46054606

46854686

46654666

46454646

46254626

47054706

RECEIVER ATTENUATION (dB) 16499-817

Figure 315. Receiver IIP3 vs. Receiver Attenuation, Receiver Attenuation = 0 dB, LO = 4600 MHz, Tone 2 = Tone 1 + 1 MHz, −21 dBm Each, Swept Across Pass Band

50

45

40

0

20

30

35

10

5

15

25

RE

CE

IVE

R I

IP3

(dB

m)

0 30252015


105


16499-818

Figure 316. Receiver IIP3 vs. Receiver Attenuation, LO = 3600 MHz, Tone 1 = 3602 MHz, Tone 2 = 3692 MHz, −21 dBm Plus Attenuation

50

50

40

0

20

30

10

RE

CE

IVE

R I

IP3

(dB

m)

0 30252015


105


16499-819



ADRV9009 Data Sheet


RE

CE

IVE

R I

IP3

AC

RO

SS

BA

ND

WID

TH

(d

Bm

)

35

30

0

5

25

15

20

10


3612 3692367236523632 3712


Figure 318. Receiver IIP3 Across Bandwidth vs. Swept Pass Band Frequency, Receiver Attenuation = 0 dB, LO = 3600 MHz, Tone 1 = 3602 MHz, Tone 2 =

Swept Across Pass Band, −21 dBm Each

RE

CE

IVE

R I

IP3

AC

RO

SS

BA

ND

WID

TH

(d

Bm

)

35

30

0

5

25

15

20

10


4612 4692467246524632 4712


Figure 319. Receiver IIP3 Across Bandwidth vs. Swept Pass Band Frequency, Receiver Attenuation = 0 dB, LO = 4600 MHz, Tone 1 = 4602 MHz, Tone 2 =


0

–120

–100

–80

–60

–40

–20

RE

CE

IVE

R I

MA

GE

(d

Bc)

+110°C+25°C–40°C


–100 –75 0–25–50 25 75 10050

16499-822



0

–100

–80

–60

–40

–20

RE

CE

IVE

R I

MA

GE

(d

Bc)


+110°C+25°C–40°C

–100 –75 0–25–50 25 75 10050–120

16499-823

Figure 321. Receiver Image vs. Baseband Frequency Offset, Attenuation = 0 dB, RF Bandwidth = 200 MHz, Tracking Calibration Active, Sample Rate =

245.76 MSPS, LO = 4600 MHz

0

–120

–100

–80

–60

–40

–20

0 105 15 25 3020

RE

CE

IVE

R I

MA

GE

(d

Bc)


+110°C+25°C–40°C

16499-824



0

–120

–100

–80

–60

–40

–20

0 105 15 25 3020

RE

CE

IVE

R I

MA

GE

(d

Bc)


+110°C+25°C–40°C

16499-825




Data Sheet ADRV9009


25

–15

–10

–5

0

5

15

10

20

0 105 15 25 3020

RE

CE

IVE

R G

AIN

(d

Bc)


+110°C+25°C–40°C

16499-826


25

–15

–10

–5

0

5

15

10

20

0 105 15 25 3020

RE

CE

IVE

R G

AIN

(d

Bc)


+110°C+25°C–40°C

16499-827


24

10

12

14

16

18

22

20

3400

3800

3600

4000

4600

4800

4200

3700

3500

3900

4400

4500

4700

4300

4100

RE

CE

IVE

R G

AIN

(d

Bc)

LO FREQUENCY (MHz)

+110°C+25°C–40°C

16499-828


0 105 15 25 3020

RE

CE

IVE

RA

TT

EN

UA

TO

R G

AIN

ST

EP

ER

RO

R (

dB

)


+110°C+25°C–40°C

0.5

0.4

–0.5

0

–0.4

–0.2

0.2

0.3

–0.1

–0.3

0.1

16499-829

Figure 327. Receiver Attenuator Gain Step Error vs. Receiver Attenuator Setting, LO = 3600 MHz

0 105 15 25 3020

RE

CE

IVE

RA

TT

EN

UA

TO

R G

AIN

ST

EP

ER

RO

R (

dB

)


+110°C+25°C–40°C

0.5

0.4

–0.5

0

–0.4

–0.2

0.2

0.3

–0.1

–0.3

0.1

16499-830

Figure 328. Receiver Attenuator Gain Step Error vs. Receiver Attenuator Setting, LO = 4600 MHz

–50

–110

–100

–80

–60

–90

–70

RE

CE

IVE

R D

C O

FF

SE

T (

dB

FS

)


3400 4200 48003800 460040003600 4400

+110°C+25°C–40°C

16499-831



ADRV9009 Data Sheet


–70

–110

–105

–95

–75

–100

–85

–80

–90

RE

CE

IVE

R D

C O

FF

SE

T (

dB

FS

)


0 20 3010 155 25

+110°C+25°C–40°C

16499-832


–70

–110

–105

–95

–75

–100

–85

–80

–90

RE

CE

IVE

R D

C O

FF

SE

T (

dB

FS

)


0 20 3010 155 25

+110°C+25°C–40°C

16499-833


–30

–150

–130

–90

–40

–110

–60

–50

–70

–140

–100

–120

–80

RE

CE

IVE

R H

D2,

LE

FT

(d

Bc)


–60 20 60–20 0–40 40


16499-834

Figure 332. Receiver HD2, Left vs. Baseband Frequency Offset and Attenuation, Tone Level = −15 dBm at Attenuation = 0, X-Axis = Baseband Frequency Offset of the Fundamental Tone, Not the Frequency of the HD2

Product (HD2 Product = 2 × the Baseband Frequency), HD2 Canceller Disabled, LO = 3600 MHz

–30

–150

–130

–90

–40

–110

–60

–50

–70

–140

–100

–120

–80

RE

CE

IVE

R H

D2,

LE

FT

(d

Bc)


–60 20 60–20 0–40 40


16499-835

Figure 333. Receiver HD2, Left vs. Baseband Frequency Offset and Attenuation, Tone Level = −15 dBm at Attenuation = 0, X-Axis = Baseband Frequency Offset of the Fundamental Tone, Not the Frequency of the HD2

Product (HD2 Product = 2 × the Baseband Frequency), HD2 Canceller Disabled, LO = 4600 MHz

10

–150

–130

–90

–10

–110

–50

–30

–70

RE

CE

IVE

R H

D3,

LE

FT

AN

D R

IGH

T (

dB

c)

FREQUENCY OFFSET FROM LO AND ATTENUATION (MHz)–50 10 50–30 –20–40 3020–10 40

Rx2 = +110°C (RIGHT)Rx2 = +110°C (LEFT)Rx2 = +25°C (RIGHT)Rx2 = +25°C (LEFT)Rx2 = –40°C (RIGHT)Rx2 = –40°C (LEFT)


16499-836


10

–150

–130

–90

–10

–110

–50

–30

–70

RE

CE

IVE

R H

D3,

LE

FT

AN

D R

IGH

T (

dB

c)

FREQUENCY OFFSET FROM LO AND ATTENUATION (MHz)–50 10 50–30 –20–40 3020–10 40



16499-837



Data Sheet ADRV9009


0

–50

–45

–25

–5

–35

–15

–30

–10

–40

–20

RE

CE

IVE

R E

VM

(d

B)


–65 –25 5–45 –5–35–55 –15

+110°C+25°C–40°C

16499-838

Figure 336. Receiver EVM vs. LTE = 20 MHz RF Input Power, RF Signal = LTE 20 MHz, LO = 3600 MHz, Default AGC Settings

0

90

50

10

70

30

60

20

80

40

RE

CE

IVE

R T

O R

EC

EIV

ER

IS

OL

AT

ION

(d

B)

LO FREQUENCY (MHz)

3400

4200

4800

3800

4600

4000

3600

4400

4100

4700

3700

4500

3900

3500

4300

Rx1 TO Rx2 ISOLATIONRx2 TO Rx1 ISOLATION

16499-840


0

–45

–25

–5

–35

–15

–30

–10

–40

–20

RE

CE

IVE

R E

VM

(d

B)


–65 –25 5–45 –5–35–55 –15

+110°C+25°C–40°C

16499-839

Figure 338. Receiver EVM vs. LTE = 20 MHz RF Input Power, RF Signal = LTE 20 MHz, LO = 4600 MHz, Default AGC Settings

–70

–170

–130

–80

–160

–150

–110

–100

–140

–90

–120

PH

AS

E N

OIS

E (

dB

)


100 1M 100M10k 100k1k 10M

16499-841

Figure 339. Phase Noise vs. Frequency Offset, LO = 3800 MHz, RMS Phase Error Integrated from 2 kHz to 18 MHz, PLL Loop Bandwidth = 300 kHz,

Spectrum Analyzer Limits Far Out Noise


ADRV9009 Data Sheet



–2.5

–0.5

–1.5

–1.0

–2.0TR

AN

SM

ITT

ER

PA

TH

LO

SS

(d

B)

LO FREQUENCY (MHz)

5000 5800 60005400 56005200

16499-842

Figure 340. Transmitter Path Loss vs. LO Frequency (Simulation), Useful for De-Embedding Performance Data

10

0

8

4

6

2

1

9

5

7

3

TR

AN

SM

ITT

ER

CW

OU

TP

UT

PO

WE

R (

dB

m)


5100 59005500 57005300


16499-843

Figure 341. Transmitter CW Output Power vs. Transmitter LO Frequency, Transmitter QEC, and External LO Leakage Active, Bandwidth Mode =

200 MHz/450 MHz, IQ Rate = 491.52 MHz, Attenuation = 0 dB, Not De-Embedded

0

–100

–20

–60

–40

–80

–90

–10

–50

–30

–70

TR

AN

SM

ITT

ER

IM

AG

E R

EJE

CT

ION

(d

Bc)


–10

0

–90

–80

–70

–60

–50

–40

–30

–20

–10

10

20

30

40

50

60

70

80

90

100

–40°C = 20dB–40°C = 15dB–40°C = 10dB–40°C = 5dB–40°C = 0dB

+25°C = 20dB+25°C = 15dB+25°C = 10dB+25°C = 5dB+25°C = 0dB


16499-844

Figure 342. Transmitter Image Rejection vs. Baseband Offset Frequency, QEC Trained with Three Tones Placed at 10 MHz, 50 MHz, and 100 MHz (Tracking

On), Total Combined Power = −6 dBFS, Correction then Frozen (Tracking Turned Off), CW Tone Swept Across Large Signal Bandwidth, LO = 5100 MHz

0

–100

–20

–60

–40

–80

–90

–10

–50

–30

–70

TR

AN

SM

ITT

ER

IM

AG

E R

EJE

CT

ION

(d

Bc)


–100 –9

0

–80

–70

–60

–50

–40

–30

–20

–10 10 20 30 40 50 60 70 80 90 100

–40°C = 20dB–40°C = 15dB–40°C = 10dB–40°C = 5dB–40°C = 0dB



16499-845



–100 –20–40–60–80 0 80604020 100


+110 – 20+110 – 15+110 – 10+110 – 5+110 – 0

+25 – 20+25 – 15+25 – 10+25 – 5+25 – 0

–40 – 20–40 – 15–40 – 10–40 – 5–40 – 0

16499-226

0

–20

–40

–60

–80

–10

–30

–50

–70

–90

–100

TR

AN

SM

ITT

ER

IM

AG

E R

EJE

CT

ION

(d

Bc)



1.0

–1.0

0.6

–0.2

0.2

–0.6

–0.8

0.8

0

0.4

–0.4

TR

AN

SM

ITT

ER

PA

SS

BA

ND

FL

AT

NE

SS

(d

B)


–225 225175–25 75–125 125–75 25–175


16499-847

Figure 345. Transmitter Pass Band Flatness vs. Baseband Offset Frequency, Off Chip Match Response De-Embedded, LO = 5700 MHz, Measurements

Performed with Device Calibrated at 25°C


Data Sheet ADRV9009


–70

–90

–74

–82

–78

–86

–88

–72

–80

–76

–84

TR

AN

SM

ITT

ER

LO

LE

AK

AG

E (

dB

FS

)


5100 59005500


16499-848

Figure 346. Transmitter LO Leakage vs. Transmitter LO Frequency, Transmitter Attenuation = 0 dB

0

100

20

60

40

80

90

10

50

30

70

TR

AN

SM

ITT

ER

TO

RE

CE

IVE

R I

SO

LA

TIO

N (

dB

)


5000 60005800560054005200

Tx1 TO Rx1Tx1 TO Rx2Tx2 TO Rx1Tx2 TO Rx2

16499-849

Figure 347. Transmitter to Receiver Isolation vs. Receiver LO Frequency, Temperature = 25°C

0

100

90

50

10

70

30

60

20

80

40

TR

AN

SM

ITT

ER

TO

TR

AN

SM

ITT

ER

ISO

LA

TIO

N (

dB

)


5000 5800 60005400 56005200 57005300 55005100 5900

Tx1 TO Tx2Tx2 TO Tx1

16499-850


–150

–175

–160

–170

–155

–165

TR

AN

SM

ITT

ER

NO

ISE

(d

Bm

/Hz)


0 20141064 18161282

5100MHz = +110°C5100MHz = +25°C5100MHz = –40°C5500MHz = +110°C5500MHz = +25°C5500MHz = –40°C

16499-851

Figure 349. Transmitter Noise vs. Transmitter Attenuator Setting

–40

–75

–50

–70

–45

–60

–65

–55T

RA

NS

MIT

TE

RA

DJA

CE

NT

CH

AN

NE

LL

EA

KA

GE

RA

TIO

(d

Bc)


0 20141064 18161282

Tx2 = +110°C (LOWER)Tx2 = +110°C (UPPER)Tx2 = +25°C (LOWER)Tx2 = +25°C (UPPER)Tx2 = –40°C (LOWER)Tx2 = –40°C (UPPER)


16499-852

Figure 350. Transmitter Adjacent Channel Leakage Ratio vs. Transmitter Attenuator Setting, LO = 5100 MHz, LTE = 20 MHz, PAR = 12 dB, DAC Boost

Normal, Upper Side and Lower Side, Decreasing ACLR at Higher Attenuation Due to Spectrum Analyzer Noise Floor

–40

–75

–50

–70

–45

–60

–65

–55


0 20141064 18161282



16499-853

TR

AN

SM

ITT

ER

AD

JAC

EN

T C

HA

NN

EL

LE

AK

AG

E R

AT

IO (

dB

c)




ADRV9009 Data Sheet


–40

–70

–50

–45

–60

–65

–55


0 20141064 18161282



16499-854

TR

AN

SM

ITT

ER

AD

JAC

EN

T C

HA

NN

EL

LE

AK

AG

E R

AT

IO (

dB

c)



40

0

30

10

5

35

20

15

25

TR

AN

SM

ITT

ER

OIP

3, R

IGH

T (

dB

m)


0 3220141064 181612 2024 28262282

+110°C+25°C–40°C

16499-855


35

–5

0

30

10

5

20

15

25

TR

AN

SM

ITT

ER

OIP

3, R

IGH

T (

dB

m)


0 3220141064 181612 2024 28262282

+110°C+25°C–40°C

16499-856


TR

AN

SM

ITT

ER

OIP

3, R

IGH

T (

dB

m)


3220141064 181612 2024 282622820

+110°C+25°C–40°C

35

–5

0

30

10

5

20

15

25

16499-857


30

0

20

5

25

15

10

TR

AN

SM

ITT

ER

OIP

3, R

IGH

T (

dB

m)


510

95100

7580

5560

3540

2530

8590

6570

4550

1520


16499-858

Figure 356. Transmitter OIP3, Right vs. Baseband Frequency Offset, LO = 5100 MHz, Total RMS Power = −12 dBFS Power, Transmitter

Attenuation = 4 dB

30

0

20

5

25

15

10

TR

AN

SM

ITT

ER

OIP

3, R

IGH

T (

dB

m)


510

95100

7580

5560

3540

2530

8590

6570

4550

1520


16499-859

Figure 357. Transmitter OIP3, Right vs. Baseband Frequency Offset, LO = 5500 MHz, Total RMS Power = −12 dBFS, Transmitter Attenuation = 4 dB


Data Sheet ADRV9009


30

0

20

5

25

15

10

TR

AN

SM

ITT

ER

OU

TP

UT

, R

IGH

T (

dB

m)


510

95100

7580

5560

3540

2530

8590

6570

4550

1520


16499-860

Figure 358. Transmitter Output, Right vs. Baseband Frequency Offset, LO = 5900 MHz, Total RMS Power = −12 dBFS, Transmitter Attenuation = 4 dB

TR

AN

SM

ITT

ER

HD

2 (d

Bc)


3220141064 181612 2024 282622820

0

–120

–20

–100

–60

–80

–40

+110°C (HD2)+25°C (HD2)–40°C (HD2)+110°C (UPPER)+25°C (UPPER)–40°C (UPPER)

16499-861

Figure 359. Transmitter HD2 vs. Transmitter Attenuation Setting, Baseband Frequency = 10 MHz, LO = 5100 MHz, CW = −15 dBFS

TR

AN

SM

ITT

ER

HD

2 (d

Bc)


3220141064 181612 2024 282622820

0

–120

–20

–100

–60

–80

–40


16499-862


TR

AN

SM

ITT

ER

HD

2 (d

Bc)


3220141064 181612 2024 282622820

0

–120

–20

–100

–60

–80

–40


16499-863


TR

AN

SM

ITT

ER

HD

3 O

NO

PP

OS

ITE

SID

EB

AN

D (

dB

c)


3220141064 181612 2024 282622820

0

–110

–20

–100

–60

–80

–40

–10

–90

–50

–70

–30


16499-864

Figure 362. Transmitter HD3 on Opposite Sideband vs. Transmitter Attenuator Setting, LO = 5100 MHz, CW = −15 dBFS, Baseband Frequency = 10 MHz

TR

AN

SM

ITT

ER

HD

3 O

NO

PP

OS

ITE

SID

EB

AN

D (

dB

c)


3220141064 181612 2024 282622820

0

–110

–20

–100

–60

–80

–40

–10

–90

–50

–70

–30


16499-865

Figure 363. Transmitter HD3 on Opposite Sideband vs. Transmitter Attenuator Setting, LO = 5500 MHz, CW = −15 dBFS, Baseband Frequency = 10 MHz


ADRV9009 Data Sheet


TR

AN

SM

ITT

ER

HD

3 O

N O

PP

OS

ITE

SID

EB

AN

D (

dB

c)


3220141064 181612 2024 282622820

0

–120

–20

–100

–60

–80

–40


16499-866

Figure 364. Transmitter HD3 on Opposite Sideband vs. Transmitter Attenuator Setting, LO = 5900 MHz, CW = −15 dBFS, Baseband Frequency =

10 MHz

0

–40

–80

–20

–60

–100

–120

–30

–70

–10

–50

–90

–110

0 6 12 18 3230244 10 16 28222 8 14 2620

TR

AN

SM

ITT

ER

HD

3 IM

AG

E O

N S

AM

E S

IDE

BA

ND

AS

SIG

NA

L (

dB

c)



16499-247

Figure 365. Transmitter HD3 Image on Same Sideband as Signal vs. Transmitter Attenuator Setting, LO = 5100 MHz, CW = −15 dBFS

0

–40

–80

–20

–60

–100

–120

–30

–70

–10

–50

–90

–110

0 6 12 18 3230244 10 16 28222 8 14 2620

TR

AN

SM

ITT

ER

HD

3 IM

AG

E O

N S

AM

E S

IDE

BA

ND

AS

SIG

NA

L (

dB

c)



16499-248


0

–40

–80

–20

–60

–100

–120

–30

–70

–10

–50

–90

–110

0 6 12 18 3230244 10 16 28222 8 14 2620

TR

AN

SM

ITT

ER

HD

3 IM

AG

E O

N S

AM

E S

IDE

BA

ND

AS

SIG

NA

L (

dB

c)



16499-249


TR

AN

SM

ITT

ER

AT

TE

NU

AT

ION

ST

EP

ER

RO

R (

dB

)


3220141064 181612 2024 282622820

0.06

–0.03

0.05

–0.02

0.01

–0.01

0.03

0.04

0

0.02

+110°C+25°C–40°C

16499-867


TR

AN

SM

ITT

ER

AT

TE

NU

AT

OR

ST

EP

ER

RO

R (

dB

)


3220141064 181612 2024 282622820

0.07

0.06

–0.03

0.05

–0.02

0.01

–0.01

0.03

0.04

0

0.02

+110°C+25°C–40°C

16499-868



Data Sheet ADRV9009


TR

AN

SM

ITT

ER

AT

TE

NU

AT

OR

ST

EP

ER

RO

R (

dB

)


3220141064 181612 2024 282622820

0.09

0.08

0.07

0.06

–0.05

–0.04

–0.03

0.05

–0.02

0.01

–0.01

0.03

0.04

0

0.02

+110°C+25°C–40°C

16499-869


EV

M (

dB

)


25205 15100

–30

–50

–48

–46

–44

–42

–40

–38

–36

–34

–32+110°C+25°C–40°C

16499-870

Figure 371. EVM vs. Transmitter Attenuation, LTE Signal = 20 MHz Centered on DC, LO = 5100 MHz

EV

M (

dB

)


25205 15100

–30

–50

–48

–46

–44

–42

–40

–38

–36

–34

–32+110°C+25°C–40°C

16499-871

Figure 372. EVM vs. Transmitter Attenuation, LTE Signal = 20 MHz, Centered on DC, LO = 5500 MHz

EV

M (

dB

)


25205 15100

–30

–50

–48

–46

–44

–42

–40

–38

–36

–34

–32+110°C+25°C–40°C

16499-872

Figure 373. EVM vs. Transmitter Attenuation, LTE Signal = 20 MHz, Centered on DC, LO = 5900 MHz

0

–2.0

–0.4

–1.2

–0.8

–1.6

–1.8

–0.2

–1.0

–0.6

–1.4

OB

SE

RV

AT

ION

RE

CE

IVE

R P

AT

H L

OS

S (

dB

)

LO FREQUENCY (MHz)

5000 5800 60005400 56005200

16499-873

Figure 374. Observation Receiver Path Loss vs. LO Frequency, Can be Used for De-Embedding Performance Data

OB

SE

RV

AT

ION

RE

CE

IVE

R L

O L

EA

KA

GE

(d

Bm

)

LO FREQUENCY (MHz)

590058005300 5600 5700550054005200

+110°C+25°C–40°C

0

–100

–20

–60

–40

–80

–90

–10

–50

–30

–70

16499-874

Figure 375. Observation Receiver LO Leakage vs. LO Frequency LO = 5200 MHz, 5500 MHz, and 5900 MHz


ADRV9009 Data Sheet


OB

SE

RV

AT

ION

RE

CE

IVE

R N

OIS

E F

IGU

RE

(d

B)


1081 4 6 95 7320

+110°C+25°C–40°C

36

16

32

24

28

20

18

34

26

30

22

16499-875

Figure 376. Observation Receiver Noise Figure vs. Observation Receiver Attenuator Setting, 5200 MHz, Total Nyquist Integration Bandwidth

36

160 10

OB

SE

RV

AT

ION

RE

CE

IVE

R N

OIS

E F

IGU

RE

(d

B)


+110°C+25°C–40°C

18

20

22

24

26

28

30

32

34

1 2 3 4 5 6 7 8 9

16499-259


36

160 10

OB

SE

RV

AT

ION

RE

CE

IVE

R N

OIS

E F

IGU

RE

(d

B)


+110°C+25°C–40°C

18

20

22

24

26

28

30

32

34

1 2 3 4 5 6 7 8 9

16499-260


OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP2,

SU

M A

ND

DIF

FE

RE

NC

E P

RO

DU

CT

S (

dB

m)


59255926

57255726

57455746

57655766

57855786

58055806

58255826

58455846

58655866

58855886

59055906

57055706

80

40

70

50

60

75

55

65

45


16499-878

Figure 379. Observation Receiver IIP2, Sum and Difference Products vs. f1 Offset Frequency, Tones Separated by 1 MHz Swept Across Pass Band at −19 dBm Each,

LO = 5700 MHz, Attenuation = 0 dB

OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP2,

SU

M A

ND

DIF

FE

RE

NC

E P

RO

DU

CT

S (

dB

m)

ATTENUATION (dB)

1084 620

85

50

75

55

65

80

60

70


16499-879



OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP2,

f1

– f2

(d

Bm

)


57025942

57025742

57025762

57025782

57025802

57025822

57025842

57025862

57025882

57025902

57025922

57025722

80

0

60

20

40

70

30

50

10


16499-880

Figure 381. Observation Receiver IIP2, f1 − f2 vs. Intermodulation Frequency, LO = 5700 MHz, Tone 1 = 5702 MHz, Tone 2 = Swept, −19 dBm Each,

Attenuation = 0 dB


Data Sheet ADRV9009


OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP2,

2f1

– f

2 (d

Bm

)

ATTENUATION (dB)

1084 620

80

50

75

55

65

60

70


16499-881


OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP3,

2f1

– f

2 (d

Bm

)


57025942

57025742

57025762

57025782

57025802

57025822

57025842

57025862

57025882

57025902

57025922

57025722

200

–1200

–200

–1000

–600

0

–800

–400

ORx1 = +110°CORx1 = +25°CORx1 = –40°C

16499-882

Figure 383. Observation Receiver IIP3, 2f1 − f2 vs. Swept Pass Band Frequency, LO = 5700 MHz, Observer Receiver Attenuation = 0 dB, Tones

Separated by 1 MHz Swept Across Pass Band at −19 dBm Each

OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP3,

2f1

– f

2 (d

Bm

)

ATTENUATION (dB)

1084 620

30

6

24

8

16

28

12

20

22

14

26

10

18


16499-883


OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP3,

2f1

– f

2 (d

Bm

)


57025942

57025742

57025762

57025782

57025802

57025822

57025842

57025862

57025882

57025902

57025922

57025722

25

0

5

15

10

20

ORx1 = +110°CORx1 = +25°CORx1 = –40°C

16499-884

Figure 385. Observation Receiver IIP3, 2f1 − f2 vs. Swept Pass Band Frequency, LO = 5700 MHz, Tone 1 = 5702 MHz, Tone 2 = 5722 MHz at −22

dBm Each Plus Attenuation

OB

SE

RV

AT

ION

RE

CE

IVE

R I

IP3,

2f1

– f

2 (d

Bm

)

ATTENUATION (dB)

1084 620

30

6

24

8

16

28

12

20

22

14

26

10

18


16499-885


–225

–175

–125 –7

5 0

–25

–200

–150

–100 –5

0 25 75 125

225

17550 100

150

200


0

–100

–90

–80

–70

–60

–50

–40

–30

–20

–10 +110°C = 10dB+25°C = 10dB–40°C = 10dB+110°C = 0dB+25°C = 0dB–40°C = 0dB

16499-886

OB

SE

RV

AT

ION

RE

CE

IVE

RIM

AG

E R

EJE

CT

ION

(d

Bc)



ADRV9009 Data Sheet


–225

–175

–125 –7

5 0

–25

–200

–150

–100 –5

0 25 75 125

225

17550 100

150

200

BASEBAND FREQUENCY OFFSET AND OBSERVATIONRECEIVER ATTENUATION (MHz)

0

–100

–90

–80

–70

–60

–50

–40

–30

–20

–10

OB

SE

RV

AT

ION

RE

CE

IVE

RIM

AG

E R

EJE

CT

ION

(d

Bc)


16499-887

Figure 388. Observation Receiver Image Rejection vs. Baseband Frequency Offset and Observation Receiver Attenuation, CW Signal Swept Across the Pass Band,

LO = 5700 MHz

OB

SE

RV

AT

ION

RE

CE

IVE

R G

AIN

(d

B)

ATTENUATION (dB)

1084 620 95 731

18

4

12

16

8

10

14

6

+110°C+25°C–40°C

16499-888

Figure 389. Observation Receiver Gain vs. Attenuation, LO = 5200 MHz

OB

SE

RV

AT

ION

RE

CE

IVE

R G

AIN

(d

B)

ATTENUATION (dB)

1084 620 95 731

16

4

12

8

10

14

6

+110°C+25°C–40°C

16499-889

Figure 390. Observation Receiver Gain vs. Attenuation, LO = 5700 MHz

OB

SE

RV

AT

ION

RE

CE

IVE

R G

AIN

ST

EP

ER

RO

R (

dB

)


1084 620 95 731

0.5

–0.5

0.2

–0.2

0

0.4

0.1

–0.3

–0.1

0.3

–0.4

+110°C+25°C–40°C

16499-890


OB

SE

RV

AT

ION

RE

CE

IVE

R G

AIN

ST

EP

ER

RO

R (

dB

)


1084 620 95 731

0.5

–0.5

0.2

–0.2

0

0.4

0.1

–0.3

–0.1

0.3

–0.4

+110°C+25°C–40°C

16499-891


OB

SE

RV

AT

ION

RE

CE

IVE

R G

AIN

ST

EP

ER

RO

R (

dB

)


1084 620 95 731

0.5

–0.5

0.2

–0.2

0

0.4

0.1

–0.3

–0.1

0.3

–0.4

+110°C+25°C–40°C

16499-892



Data Sheet ADRV9009


OB

SE

RV

AT

ION

RE

CE

IVE

RP

AS

S B

AN

D F

LA

TN

ES

S (

dB

)


0.99

8

25.0

06

48.9

98

72.9

94

96.9

94

120.

994

145.

006

168.

998

192.

994

216.

998

241.

006

0.7

0.5

0.6

–0.5

0.2

–0.2

0

0.4

0.1

–0.3

–0.1

0.3

–0.4

+110°C+25°C–40°C

16499-893

Figure 394. Observation Receiver Pass Band Flatness vs. Baseband Offset Frequency, LO = 5700 MHz

0

–120

–100

–80

–60

–40

–20

OB

SE

RV

AT

ION

RE

CE

IVE

R H

D2

(dB

c)


–100 –75 0–25–50 25 75 10050

+110°C = 0dB (RIGHT)+110°C = 10dB (RIGHT)+110°C = 0dB (LEFT)+110°C = 10dB (LEFT)+25°C = 0dB (RIGHT)+25°C = 10dB (RIGHT)

+25°C = 0dB (LEFT)+25°C = 10dB (LEFT)–40°C = 0dB (RIGHT)–40°C = 10dB (RIGHT)–40°C = 0dB (LEFT)–40°C = 10dB (LEFT)

16499-894


0

–120

–100

–80

–60

–40

–20

OB

SE

RV

AT

ION

RE

CE

IVE

R H

D2

(dB

c)


–100 –75 0–25–50 25 75 10050

+110°C = 0dB (RIGHT)+110°C = 10dB (RIGHT)+110°C = 0dB (LEFT)+110°C = 10dB (LEFT)+25°C = 0dB (RIGHT)+25°C = 10dB (RIGHT)

+25°C = 0dB (LEFT)+25°C = 10dB (LEFT)–40°C = 0dB (RIGHT)–40°C = 10dB (RIGHT)–40°C = 0dB (LEFT)–40°C = 10dB (LEFT)

16499-895


0

–100

–30

–10

–70

–50

–40

–20

–60

–80

–90

OB

SE

RV

AT

ION

RE

CE

IVE

R H

D3,

LE

FT

AN

D R

IGH

T (

dB

c)

–90.0 90.045.0–22.5–67.5 67.522.5–45.0OFFSET FREQUENCY (MHz)


16499-896


0

–100

–30

–10

–70

–50

–40

–20

–60

–80

–90

OB

SE

RV

AT

ION

RE

CE

IVE

R H

D3,

LE

FT

AN

D R

IGH

T (

dB

c)

–90.0 90.045.0–22.5–67.5 67.522.5–45.0OFFSET FREQUENCY (MHz)


16499-897


0

90

80

40

20

10

60

70

50

30

TR

AN

SM

ITT

ER

TO

OB

SE

RV

AT

ION

RE

CE

IVE

R I

SO

LA

TIO

N (

dB

)

LO FREQUENCY (MHz)

5000 5800 60005400 56005200

TX1 TO ORX1TX2 TO ORX1TX1 TO ORX2TX2 TO ORX2

16499-898



ADRV9009 Data Sheet


0

–2.00

–0.80

–0.40

–0.60

–0.20

–1.20

–1.80

–1.40

–1.60

–1.00

RE

CE

IVE

R P

AT

H L

OS

S (

dB

)

LO FREQUENCY (MHz)

5000 5800 60005400 56005200

16499-899

Figure 400. Receiver Path Loss vs. LO Frequency, Can Be Used for De-Embedding Performance Data

0

–100

–40

–20

–30

–10

–60

–90

–70

–80

–50

RE

CE

IVE

R L

O L

EA

KA

GE

(d

Bm

)


5200 5700 58005400 560055005300

+110°C+25°C–40°C

16499-900

Figure 401. Receiver LO Leakage vs. Receiver LO Frequency, LO = 5200 MHz, 5500 MHz, and 5800 MHz, Receiver Attenuation = 0 dB, RF

Bandwidth = 200 MHz, Sample Rate = 245.76 MSPS

110

50

70

90

80

100

60

RE

CE

IVE

R I

IP2

(dB

m)

ATTENUATION (dB)

0 28 3010 22164 268 20142 246 1812


16499-901

Figure 402. Receiver IIP2 vs. Attenuation, LO = 5800 MHz LO, Tones Placed at 5845 MHz and 5846 MHz, −21 dBm Plus Attenuation

80

40

50

65

55

75

60

70

45

RE

CE

IVE

R I

IP2

SU

M A

ND

DIF

FE

RE

NC

E A

CR

OS

SB

AN

DW

IDT

H (

dB

m)

58055806

58855886

59055906

58255826

58655866

58455846



16499-902


Pairs, −21 dBm Plus Attenuation Each

110

50

70

90

80

100

60

RE

CE

IVE

R I

IP2

(dB

m)

RECEIVER ATTENUATION

0 25 3010 205 15

Rx1 IIP2 DIFF +110°CRx1 IIP2 SUM +110°CRx1 IIP2 DIFF +25°CRx1 IIP2 SUM +25°CRx1 IIP2 DIFF –40°CRx1 IIP2 SUM –40°C


16499-903


80

40

60

70

65

75

50

55

45

RE

CE

IVE

R I

IP2

SU

M A

ND

DIF

FE

RE

NC

E A

CR

OS

SB

AN

DW

IDT

H (

dB

m)

SWEPT PASS BAND FREQUENCY

58025802

58325802

58425802

58125802

58225802

58525802

58825802

58925802

59025802

58625802

58725802



16499-904


Tone 1 = 5802 MHz, Tone 2 Swept, −21 dBm Each


Data Sheet ADRV9009


45

0

25

35

30

40

15

20

5

10

RE

CE

IVE

R I

IP3

(dB

m)


0 15 205 10 25 30


16499-905


30

0

10

20

15

25

5

RE

CE

IVE

R I

IP3

AC

RO

SS

BA

ND

WID

TH

(d

Bm

)


58055806

58355836

58455846

58155816

58255826

58555856

58885886

58955896

59155916

59055906

58655866

58755876


16499-906

Figure 407. Receiver IIP3 Across Bandwidth vs. Swept Pass Band Frequency, Receiver Attenuation = 0 dB, LO = 5800 MHz, Tone 2 = Tone 1 + 1 MHz,

−21 dBm each, Swept Across Pass Band

60

0

20

40

30

50

10

RE

CE

IVE

R I

IP3

(dB

m)


0 15 205 10 25 30


16499-907


30

0

10

20

15

25

5

RE

CE

IVE

R I

IP3

AC

RO

SS

BA

ND

WID

TH

(d

Bm

)


58025812

58025842

58025852

58025822

58025832

58025862

58025892

58025902

58025922

58025912

58025872

58025882


16499-908

Figure 409. Receiver IIP3 Across Bandwidth vs. Swept Pass Band Frequency, Receiver Attenuation = 0 dB, LO = 5800 MHz, Tone 1 = 5802 MHz, Tone 2


–10

–110

–100

–80

–60

–40

–20

–90

–70

–50

–30

RE

CE

IVE

R I

MA

GE

(d

Bc)

+110°C+25°C–40°C


–100 –75 0–25–50 25 75 10050

16499-909



–10

–110

–100

–80

–60

–40

–20

–90

–70

–50

–30

RE

CE

IVE

R I

MA

GE

(d

Bc)

+110°C+25°C–40°C


–100 –75 0–25–50 25 75 10050

16499-910




ADRV9009 Data Sheet


0

–120

–100

–60

–20

–80

–40

RE

CE

IVE

R I

MA

GE

(d

Bc)

+110°C+25°C–40°C

ATTENUATOR SETTING (dB)0 10 152 25 3020

16499-911



0

–120

–100

–60

–20

–80

–40

RE

CE

IVE

R I

MA

GE

(d

Bc)

+110°C+25°C–40°C

ATTENUATOR SETTING (dB)0 10 152 25 3020

16499-912



0.5

–0.5

–0.4

0

0.4

–0.2

0.2

–0.1

0.3

–0.3

0.1

RE

CE

IVE

R G

AIN

ST

EP

ER

RO

R (

dB

c)

+110°C+25°C–40°C

RECEIVER ATTENUATOR SETTING (dB)0 10 152 25 3020

16499-913


0.5

–0.5

–0.4

0

0.4

–0.2

0.2

–0.1

0.3

–0.3

0.1

RE

CE

IVE

R G

AIN

ST

EP

ER

RO

R (

dB

c)

+110°C+25°C–40°C


16499-914


0.5

–0.5

–0.4

0

0.4

–0.2

0.2

–0.1

0.3

–0.3

0.1

RE

CE

IVE

R G

AIN

ST

EP

ER

RO

R (

dB

c)

+110°C+25°C–40°C


16499-915


0.5

0.4

0.3

0.2

0.1

0

–0.1

–0.2

–0.3

–0.4

–1.0

–0.5

–0.6

–0.7

–0.8

–0.9

0.99

4.50

28.

002

11.4

9814

.998

18.5

1422

.006

25.5

1429

.006

32.4

9835

.978

39.5

0242

.998

46.5

0249

.978

53.5

1856

.998

60.5

0664

.006

67.5

0271

.014

74.5

0677

.986

81.5

0284

.998

88.4

9891

.978

95.4

8698

.998

102.

514

105.

998

109.

502

113.

002

NO

RM

AL

IZE

D R

EC

EIV

ER

BA

SE

BA

ND

FL

AT

NE

SS

(d

B)

BASEBAND AND FREQUENCY (MHz) 16499-299

MAX OF NORMALIZED_I_RIPPLE –40°CMAX OF NORMALIZED_I_RIPPLE +25°CMAX OF NORMALIZED_I_RIPPLE +110°CMAX OF NORMALIZED_Q_RIPPLE –40°CMAX OF NORMALIZED_Q_RIPPLE +25°CMAX OF NORMALIZED_Q_RIPPLE +110°C

Figure 417. Normalized Receiver Baseband Flatness vs. Baseband and Frequency (Receiver Flatness)


Data Sheet ADRV9009


–30

–150

–140

–100

–80

–120

–130

–110

–50

–40

–70

–90

–60

RE

CE

IVE

R H

D2,

LE

FT

(d

Bc)

BASEBAND FREQUENCY OFFSET (MHz)–60 –20 0–40 40 6020


16499-916

Figure 418. Receiver HD2, Left vs. Baseband Frequency Offset, Tone Level = −15 dBm at Attenuation = 0 dB, X-Axis = Baseband Frequency Offset of the Fundamental Tone, Not the Frequency of the HD2 Product (HD2 Product =

2 × the Baseband Frequency), HD2 Canceller Disabled, LO = 5200 MHz

–30

–150

–140

–100

–80

–120

–130

–110

–50

–40

–70

–90

–60

RE

CE

IVE

R H

D2,

LE

FT

(d

Bc)

BASEBAND FREQUENCY OFFSET (MHz)–60 –20 0–40 40 6020


16499-917

Figure 419. Receiver HD2, Left vs. Baseband Frequency Offset, Tone Level = −15 dBm at Attenuation = 0 dB, X-Axis = Baseband Frequency Offset of the Fundamental Tone, Not the Frequency of the HD2 Product (HD2 Product =

2 × the Baseband Frequency), HD2 Canceller Disabled, LO = 5900 MHz

–10

–150

–110

–50

–30

–90

–130

–70

RE

CE

IVE

R H

D3,

LE

FT

AN

D R

IGH

T (

dB

c)

FREQUENCY OFFSET FROM LO (MHz)–50 –30 –10–20 10–40 30 40 5020

Rx2 = +110°C (RIGHT)Rx1 = +110°C (RIGHT)Rx2 = +25°C (RIGHT)Rx1 = +25°C (RIGHT)Rx2 = –40°C (RIGHT)Rx1 = –40°C (RIGHT)

Rx2 = +110°C (LEFT)Rx1 = +110°C (LEFT)Rx2 = +25°C (LEFT)Rx1 = +25°C (LEFT)Rx2 = –40°C (LEFT)Rx1 = –40°C (LEFT)

16499-918


–10

–150

–110

–50

–30

–90

–130

–70

RE

CE

IVE

R H

D3,

LE

FT

AN

D R

IGH

T (

dB

c)


–50 –30 –10–20 10–40 30 40 5020

Rx2 = +110°C (RIGHT)Rx1 = +110°C (RIGHT)Rx2 = +25°C (RIGHT)Rx1 = +25°C (RIGHT)Rx2 = –40°C (RIGHT)Rx1 = –40°C (RIGHT)

Rx2 = +110°C (LEFT)Rx1 = +110°C (LEFT)Rx2 = +25°C (LEFT)Rx1 = +25°C (LEFT)Rx2 = –40°C (LEFT)Rx1 = –40°C (LEFT)

16499-919


0

–45

–40

–30

–25

–35

–20

–10

–5

–15R

EC

EIV

ER

EV

M (

dB

)

+110°C+25°C–40°C

LTE 20 RF INPUT POWER (dBm)

–65 –45 –35–55 –15 –5 5–25

16499-920

Figure 422. Receiver EVM vs. LTE20 RF Input Power, LO = 5200 MHz, Default AGC Settings

0

–45

–40

–30

–25

–35

–20

–10

–5

–15

RE

CE

IVE

R E

VM

(d

B)

+110°C+25°C–40°C


–65 –45 –35–55 –15 –5 5–25

16499-921

Figure 423. Receiver EVM vs. LTE20 RF Input Power, LO = 5500 MHz, Default AGC Settings


ADRV9009 Data Sheet


0

–45

–40

–30

–25

–35

–20

–10

–5

–15

EV

M (

dB

)

+110°C+25°C–40°C


–65 –45 –35–55 –15 –5 5–25

16499-922

Figure 424. EVM vs. LTE20 RF Input Power, LO = 5800 MHz, Default AGC Settings

0

100

90

50

10

70

30

60

20

80

40

Rx

TO

Rx

ISO

LA

TIO

N (

dB

)

LO FREQUENCY (MHz)

5000 5800 60005400 56005200 57005300 55005100 5900

Rx1 TO Rx2Rx2 TO Rx1

16499-923


–20

–180

–120

–40

–160

–80

–140

–60

–100

LO

PH

AS

E N

OIS

E (

dB

)


100 1M 100M10k 100k1k 10M

16499-924

Figure 426. LO Phase Noise vs. Frequency Offset, LO = 5900 MHz, RMS Phase Error Integrated from 2 kHz to 18 MHz, PLL Loop Bandwidth > 300 kHz,

Spectrum Analyzer Limits Far Out Noise


Data Sheet ADRV9009


TRANSMITTER OUTPUT IMPEDANCE

M21FREQ = 100.0MHzS (1,1) = 0.143 / –7.865IMPEDANCE = 66.439 – j2.654

Tx PORT SIMULATED IMPEDANCE: SEDZ

FREQ (0Hz TO 6.000GHz)

S (

1,1)



M24FREQ = 1.000GHzS (1,1) = 0.164 / –84.046IMPEDANCE = 49.000 – j16.447

M25FREQ = 2.000GHzS (1,1) = 0.247 / 155.186IMPEDANCE = 31.131 – j6.860

M26FREQ = 3.000GHzS (1,1) = 0.368 / 150.626IMPEDANCE = 24.355 + j10.153

M27FREQ = 4.000GHzS (1,1) = 0.484 / –107.379IMPEDANCE = 25.118 + j30.329



M29

M28

M27

164

99-0

02

M26

M25 M21M22M23M24

Figure 427. Transmitter Output Impedance Series Equivalent Differential Impedance (SEDZ)

OBSERVATION RECEIVER INPUT IMPEDANCE


ORx PORT SIMULATED IMPEDANCE: SEDZ


S (

1,1)






M21FREQ = 4.000GHzS (1,1) = 0.116 / –104.276IMPEDANCE = 46.060 + j10.522



16

499

-00

3

M23M22

M21

M21

M20M19

M15M16M17M18

Figure 428. Observation Receiver Input Impedance SEDZ


ADRV9009 Data Sheet


RECEIVER INPUT IMPEDANCE


Rx PORT SIMULATED IMPEDANCE: SEDZ


S (

1,1)









M23

M22

M21M20 M19

M15M16M17M18

164

99-0

04

Figure 429. Receiver Input Impedance SEDZ


Data Sheet ADRV9009


TERMINOLOGY Large Signal Bandwidth Large signal bandwidth, otherwise known as instantaneous bandwidth or signal bandwidth, is the bandwidth over which there are large signals. For example, for Band 42 LTE, the large signal bandwidth is 200 MHz.

Occupied Bandwidth Occupied bandwidth is the total bandwidth of the active signals. For example, three 20 MHz carriers have a 60 MHz occupied bandwidth, regardless of where the carriers are placed within the large signal bandwidth.

Synthesis Bandwidth Synthesis bandwidth is the bandwidth over which digital predistortion (DPD) linearization is transmitted. Synthesis bandwidth is the 1 dB bandwidth of the transmitter. The power density of the signal outside the occupied bandwidth is assumed to be 25 dB below the signal in the occupied bandwidth, which also assumes that the unlinearized power amplifier (PA) achieves 25 dB ACLR.

Observation Bandwidth Observation bandwidth is the 1 dB bandwidth of the observation receiver. With the observation receiver sharing the transmitter LO, the observation receiver senses similar power densities, such as those in the occupied bandwidth and synthesis bandwidth of the transmitter.

Backoff Backoff is the difference (in dB) between full scale and the rms signal power.

PHIGH PHIGH is the largest signal that can be applied without overloading the ADC for the receiver or observation receiver input. This input level results in slightly less than full scale at the digital output because of the nature of the continuous time Σ-Δ ADCs, which, for example, exhibit a soft overload in contrast to the hard clipping of pipeline ADCs.


ADRV9009 Data Sheet


THEORY OF OPERATION The ADRV9009 is a highly integrated RF transmitter subsystem capable of configuration for a wide range of applications. The device integrates all RF, mixed-signal, and digital blocks necessary to provide all transmitter traffic and DPD observation receiver functions in a single device. Programmability allows the transmitter to be adapted for use in many TDD systems and 3G/4G/5G cellular standards. The ADRV9009 contains four high speed serial interface links for the transmitter chain, and two high speed links each for the receiver and observation receiver chains. The links are JESD204B, Subclass 1 compliant. The two receiver lanes can be reused for the observation receiver, providing a low pin count and a reliable data interface to field programmable gate arrays (FPGAs) or integrated baseband solutions.

The ADRV9009 also provides tracking correction of dc offset QEC errors and transmitter LO leakage to maintain high performance under varying temperatures and input signal conditions. The device also includes test modes that allow system designers to debug designs during prototyping and to optimize radio configurations.

TRANSMITTER The ADRV9009 transmitter section consists of two identical and independently controlled channels that provide all digital processing, mixed-signal, and RF blocks necessary to implement a direct conversion system while sharing a common frequency synthesizer. The digital data from the JESD204B lanes pass through a fully programmable, 128-tap FIR filter with variable interpolation rates. The FIR output is sent to a series of interpolation filters that provide additional filtering and interpolation prior to reaching the DAC. Each 14-bit DAC has an adjustable sample rate.

When converted to baseband analog signals, the inphase (I) and quadrature (Q) signals are filtered to remove sampling artifacts and are fed to the upconversion mixers. Each transmitter chain provides a wide attenuation adjustment range with fine granularity to optimize SNR.

RECEIVER The ADRV9009 receiver contains all the blocks necessary to receive RF signals and convert them to digital data usable by a BBP. Each receiver can be configured as a direct conversion system that supports up to a 200 MHz bandwidth. Each receiver contains a programmable attenuator stage, followed by matched I and Q mixers that downconvert received signals to baseband for digitization.

Gain control can be achieved by using the on-chip AGC or by allowing the BBP to make gain adjustments in a manual gain control mode. Performance is optimized by mapping each gain control setting to specific attenuation levels at each adjustable gain block in the receiver signal path. Additionally, each channel contains independent receive signal strength indicator (RSSI) measurement capability, dc offset tracking, and all circuitry necessary for self calibration.

The receivers include ADCs and adjustable sample rates that produce data streams from the received signals. The signals can be conditioned further by a series of decimation filters and a programmable FIR filter with additional decimation settings. The sample rate of each digital filter block is adjustable by changing decimation factors to produce the desired output data rate.

OBSERVATION RECEIVER The ADRV9009 contains an independent DPD observation receiver front end with two multiplexed inputs and a common digital back end that is shared with the traffic receiver. This configuration enables an efficient shared receiver and observation receiver mode where the device can support fast switching between receiver and observation receiver mode in TDD applications. The observation receiver shares the common frequency synthesizer with the transmitter.

The observation receiver is a direct conversion system that contains a programmable attenuator stage, followed by matched I and Q mixers, baseband filters, and ADCs.

The continuous time Σ-Δ ADCs have inherent antialiasing that reduces the RF filtering requirement.

The ADC outputs can be conditioned further by a series of decimation filters and a programmable FIR filter with additional decimation settings. The sample rate of each digital filter block is adjustable by changing decimation factors to produce the desired output data rate.

CLOCK INPUT The ADRV9009 requires a differential clock connected to the REF_CLK_IN± pins. The frequency of the clock input must be between 10 MHz and 1000 MHz and must have very low phase noise because this signal generates the RF LO and internal sampling clocks.

SYNTHESIZERS RF PLL

The ADRV9009 contains a fractional-N PLL to generate the RF LO for the signal paths. The PLL incorporates an internal VCO and loop filter, requiring no external components. The LOs on multiple chips can be phase synchronized to support active antenna systems and beamforming applications.

Clock PLL

The ADRV9009 contains a PLL synthesizer that generates all the baseband related clock signals and serialization/deserial-ization (SERDES) clocks. This PLL is programmed based on the data rate and sample rate requirements of the system.


Data Sheet ADRV9009


SPI The ADRV9009 uses an SPI interface to communicate with the BBP. This interface can be configured as a 4-wire interface with dedicated receiver and transmitter ports, or the interface can be configured as a 3-wire interface with a bidirectional data communications port. This bus allows the BBP to set all device control parameters using a simple address data serial bus protocol.

Write commands follow a 24-bit format. The first five bits set the bus direction and the number of bytes to transfer. The next 11 bits set the address where data is written. The final 8 bits are the data to be transferred to the specific register address.

Read commands follow a similar format with the exception that the first 16 bits are transferred on the SDIO pin and the final eight bits are read from the ADRV9009, either on the SDO pin in 4-wire mode or on the SDIO pin in 3-wire mode.

JTAG BOUNDARY SCAN The ADRV9009 provides support for JTAG boundary scan. Five dual function pins are associated with the JTAG interface. Use these pins, listed in Table 5, to access the on-chip test access port. To enable the JTAG functionality, set the GPIO_3 pin through the GPIO_0 pin to 1001, and then pull the TEST pin high.

POWER SUPPLY SEQUENCE The ADRV9009 requires a specific power-up sequence to avoid undesired power-up currents. In the optimal power-up sequence, the VDDD1P3_DIG and the VDDA1P3 supplies (VDDA1P3 includes all 1.3 V domains) power up first and at the same time. If these supplies cannot be powered up simultaneously, the VDDD1P3_DIG supply must power up first. Power up the VDDA_3P3, VDDA1P8_BB, VDDA1P8_TX, VDDA1P3_DES, and VDDA1P3_SER supplies after the 1.3 V supplies. The VDD_INTERFACE supply can be powered up at any time. Note that no device damage occurs if this sequence is not followed. However, failure to follow this sequence may result in higher than expected power-up currents. It is also recommended to toggle the RESET signal after power stabilizes, prior to configuration. The power-down sequence is not critical. If a power-down sequence is followed, remove the VDDD1P3_DIG supply last to avoid any back biasing of the digital control lines.

GPIO_x PINS The ADRV9009 provides 19, 1.8 V to 2.5 V GPIO signals that can be configured for numerous functions. When configured as outputs, certain pins can provide real-time signal information to the BBP, allowing the BBP to determine observation receiver

performance. A pointer register selects the information that is output to these pins. Signals used for manual gain mode, calibration flags, state machine states, and various observation receiver parameters are among the outputs that can be monitored on these pins. Additionally, certain pins can be configured as inputs and used for various functions, such as setting the observation receiver gain in real time.

Twelve 3.3 V GPIO_x pins are also included on the device. These pins provide control signals to external components.

AUXILIARY CONVERTERS AUXADC_x

The ADRV9009 contains an auxiliary ADC that is multiplexed to four input pins (AUXADC_x). The auxiliary ADC is 12 bits with an input voltage range of 0.05 V to VDDA_3P3 − 0.05 V. When enabled, the auxiliary ADC is free running. The SPI reads provide the last value latched at the ADC output. The auxiliary ADC can also be multiplexed to a built in, diode-based temperature sensor.

Auxiliary DAC x

The ADRV9009 contains 10 identical auxiliary DACs (auxiliary DAC x) that can be used for bias or other system functionality. The auxiliary DACs are 10 bits, have an output voltage range of approximately 0.7 V to VDDA_3P3 − 0.3 V, and have an output drive of 10 mA.

JESD204B DATA INTERFACE The digital data interface for the ADRV9009 uses JEDEC JESD204B Subclass 1. The serial interface operates at speeds of up to 12.288 Gbps. The benefits of the JESD204B interface include a reduction in required board area for data interface routing, resulting in smaller total system size. Four high speed serial lanes are provided for the transmitter and four high speed lanes are provided for the observation receiver. The ADRV9009 supports single-lane or dual-lane interfaces as well as fixed and floating point data formats for observation receiver data.

Table 6. Observation Path Interface Rates

Bandwidth (MHz)

Output Rate (MSPS)

JESD204B Lane Rate (Mbps)

Number of Lanes

200 245.76 9830.4 1 200 307.2 12288 1 250 307.2 12288 1 450 491.52 9830.4 2 450 491.52 4915.2 4


ADRV9009 Data Sheet


Table 7. Example Transmitter Interface Rates (Other Input Rates, Bandwidth, and JESD204B Lanes Also Supported)

Bandwidth (MHz)

Input Rate (MSPS)

Single-Channel Operation Dual-Channel Operation JESD204B Lane Rate (Mbps)

JESD204B Number of Lanes



200 245.76 9830.4 1 9830.4 2 200 307.2 12288 1 12288 2 250 307.2 12288 1 12288 2 450 491.52 9830.4 2 9830.4 4

I/Q DAC

TRANSMITHALF-BAND

FILTER 2(INTERPOLATION

FACTOR 1, 2)

TRANSMITHALF-BAND

FILTER 1(INTERPOLATION

FACTOR 1, 2)

TRANSMIT FIRFILTER

(INTERPOLATIONFACTOR 1, 2, 4)

QUADRATURECORRECTION

DIGITALGAIN JESD204B

1649

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Figure 430. Transmitter Datapath Filter Implementation

Table 8. Example Receiver Interface Rates (Other Output Rates, Bandwidth, and JESD204B Lanes Also Supported)

Bandwidth (MHz)

Output Rate (MSPS)

Single-Channel Operation Dual-Channel Operation JESD204B Lane Rate (Mbps)




80 122.88 4915.2 1 9830.4 1 100 153.6 6144 1 12288 1 100 245.76 9830.4 1 9830.4 2 200 245.76 9830.4 1 9830.4 2 200 245.76 4915.2 2 4915.2 4

RECEIVEHALF-BAND

FILTER3

ADC

RECEIVEHALF-BAND

FILTER2

RECEIVEHALF-BAND

FILTER1

FIRFILTER

(DECIMATIONFACTOR 1, 2, 4)

DCESTIMATION

DIGITALGAIN JESD204B

16

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Figure 431. Receiver and Observation Receiver Datapath Filter Implementation


Data Sheet ADRV9009


APPLICATIONS INFORMATION PCB LAYOUT AND POWER SUPPLY RECOMMENDATIONS Overview

The ADRV9009 device is a highly integrated RF agile transceiver with significant signal conditioning integrated on one chip. Due to the increased complexity of the device and its high pin count, careful PCB layout is important to get the optimal performance. This data sheet provides a checklist of issues to look for and guidelines on how to optimize the PCB to mitigate performance issues. The goal of this data sheet is to help achieve the optimal performance from the ADRV9009 while reducing board layout effort. This data sheet assumes that the user is an experienced analog and RF engineer with an understanding of RF PCB layout and RF transmission lines. This data sheet discusses the following issues and provides guidelines for system designers to achieve the optimal performance for the ADRV9009:

PCB material and stack up selection Fanout and trace space layout guidelines Component placement and routing guidelines RF and JESD204B transmission line layout Isolation techniques used on the ADRV9009-W/PCBZ Power management considerations Unused pin instructions

PCB MATERIAL AND STACKUP SELECTION Figure 432 shows the PCB stackup used for the ADRV9009-W/PCBZ. Table 9 and Table 10 list the single-ended and differential impedance for the stackup shown in Figure 432. The dielectric material used on the top and the bottom layers is 8 mil Rogers 4003C. The remaining dielectric layers are FR4-370 HR. The board design uses the Rogers laminate for the top layer and bottom layer for the low loss tangent at high frequencies. The ground planes under the Rogers laminate (Layer 2 and Layer 13) are the reference planes for the transmission lines routed on the outer surfaces. These layers are solid copper planes without any splits under the RF traces.

Layer 2 and Layer 13 are crucial to maintaining the RF signal integrity and, ultimately, the ADRV9009 performance. Layer 3 and Layer 12 route power supply domains. To keep the RF section of the ADRV9009 isolated from the fast transients of the digital section, the JESD204B interface lines are routed on Layer 5 and Layer 10. These layers have impedance control set to a 100 Ω differential. The remaining digital lines from the ADRV9009 are routed on Inner Layer 7 and Inner Layer 8. RF traces on the outer layers must be a controlled impedance to get the best performance from the device. The inner layers on this board use 0.5 ounce copper or 1 ounce copper. The outer layers use 1.5 ounce copper so the RF traces are less prone to pealing. Ground planes on this board are full copper floods with no splits except for vias, through-hole components, and isolation structures. The ground planes must route entirely to the edge of the PCB under the Surface-Mount Type A (SMA) connectors to maintain signal launch integrity. Power planes can be pulled back from the board edge to decrease the risk of shorting from the board edge.

1649

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Figure 432. ADRV9009-W/PCBZ Trace Impedance and Stackup

https://www.analog.com/EVAL-ADRV9008-9009?doc=ADRV9009.pdf





ADRV9009 Data Sheet


Table 9. ADRV9009-W/PCBZ Single Ended Impedance and Stackup1

Layer

Board Copper %

Starting Copper (oz.)

Finished Copper (oz.)

Single-Ended Impedance

Designed Trace Single-Ended (Inches)

Finished Trace Single-Ended (Inches)

Calculated Impedance (Ω)

Single-Ended Reference Layers

1 N/A 0.5 1.71 50 Ω ±10% 0.0155 0.0135 49.97 2 2 65 1 1 N/A N/A N/A N/A N/A 3 50 0.5 1 N/A N/A N/A N/A N/A 4 65 1 1 N/A N/A N/A N/A N/A 5 50 0.5 0.5 50 Ω ±10% 0.0045 0.0042 49.79 4, 6 6 65 1 1 N/A N/A N/A N/A N/A 7 50 0.5 0.5 50 Ω ±10% 0.0049 0.0039 50.05 6, 9 8 50 0.5 0.5 50 Ω ±10% 0.0049 0.0039 50.05 6, 9 9 65 1 1 N/A N/A N/A N/A N/A 10 50 0.5 1 50 Ω ±10% 0.0045 0.0039 49.88 9, 11 11 65 0.5 1 N/A N/A N/A N/A N/A 12 50 1 1 N/A N/A N/A N/A N/A 13 65 1 1 N/A N/A N/A N/A N/A 14 N/A 0.5 1.64 50 Ω ±10% 0.0155 0.0135 49.97 13 1 N/A means not applicable.

Table 10. ADRV9009-W/PCBZ Differential Impedance and Stackup1

Layer Differential Impedance

Designed Trace Differential (Inches)

Designed Gap Differential (Inches)

Finished Trace (Inches)

Finished Gap Differential (Inches)

Calculated Impedance (Ω)

Differential Reference Layers

1 100 Ω ±10% 0.008 0.006 0.007 0.007 99.55 2 50 Ω ±10% 0.0032 0.004 0.0304 0.0056 50.11 2 2 N/A N/A N/A N/A N/A N/A N/A 3 N/A N/A N/A N/A N/A N/A N/A 4 N/A N/A N/A N/A N/A N/A N/A 5 100 Ω ±10% 0.0036 0.0064 0.0034 0.0065 99.95 4, 6 6 N/A N/A N/A N/A N/A N/A N/A 7 100 Ω ±10% 0.0036 0.0064 0.0034 0.0066 100.51 6, 9 8 100 Ω ±10% 0.0038 0.0062 0.0034 0.0066 100.51 6, 9 9 N/A N/A N/A N/A N/A N/A N/A 10 100 Ω ±10% 0.0036 0.0064 0.003 0.007 100.80 9, 11 N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A 11 N/A N/A N/A N/A N/A N/A N/A 12 N/A N/A N/A N/A N/A N/A N/A 13 100 Ω ±10% 0.008 0.006 0.007 0.007 99.55 13 14 50 Ω ±10% 0.032 N/A 0.004 N/A 50.11 13 1 N/A means not applicable.




Data Sheet ADRV9009


FANOUT AND TRACE SPACE GUIDELINES The ADRV9009 uses a 196-ball chip scale package ball grid array (CSP_BGA), 12 mm × 12 mm package. The pitch between the pins is 0.8 mm. This small pitch makes it impractical to route all signals on a single layer. RF pins are placed on the outer edges of the ADRV9009 package. The location of the pins helps route the critical signals without a fanout via. Each digital signal is routed from the CSP_BGA pad using a 4.5 mil trace. The trace is connected to the CSP_BGA using a via in the pad structure. The signals are buried in the inner layers of the board for routing to other parts of the system.

The JESD204B interface signals are routed on two signal layers that use impedance control (Layer 5 and Layer 10). The spacing between the CSP_BGA pads is 17.5 mil. After the signal is on the inner layers, a 3.6 mil trace (50 Ω) connects the JESD204B signal to the FPGA mezzanine card (FMC) connector. The recommended CSP_BGA land pad size is 15 mil.

Figure 433 shows the fanout scheme of the ADRV9009-W/PCBZ. Like the CSP_BGA, the ADRV9009-W/PCBZ uses a via in the pad technique. This routing approach can be used for the ADRV9009 if there are no issues with manufacturing capabilities.

JESD INTERFACETRACE WIDTH = 3.6mil

4.5mil TRACE

AIR GAP = 17.5mil

PAD SIZE = 15mil

VIA SIZE = 14mil

16

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Figure 433. Trace Fanout Scheme on the ADRV9009-W/PCBZ (PCB Layer Top and Layer 5 Enabled)





ADRV9009 Data Sheet


COMPONENT PLACEMENT AND ROUTING GUIDELINES The ADRV9009 transceiver requires few external components to function, but those that are used require careful placement and routing to optimize performance. This section provides a checklist for properly placing and routing critical signals and components.

Signals with Highest Routing Priority

RF lines and JESD204B interface signals are the signals that are most critical and must be routed with the highest priority.

Figure 434 shows the general directions in which each of the signals must be routed so that they can be properly isolated from noisy signals.

The observation receiver and transmitter baluns and the matching circuits affect the overall RF performance of the

ADRV9009 transceiver. Make every effort to optimize the component selection and placement to avoid performance degradation. The RF Routing Guidelines section describes proper matching circuit placement and routing in more detail. Refer to the RF Port Interface Information section for more information.

To achieve the desired level of isolation between RF signal paths, use the technique described in the Isolation Techniques Used on the ADRV9009-W/PCBZ section in customer designs.

Install a 10 μF capacitor near the transmitter balun(s) VDDA1P8_TX dc feed(s) for RF transmitter outputs. The capacitor acts as a reservoir for the transmitter supply current. The Transmitter Balun DC Feed Supplies section discusses more details about the transmitter output power supply configuration.

VSSA ORX2_IN+ ORX2_IN– VSSA VSSA VSSA VSSA VSSA VSSA VSSA VSSA ORX1_IN+ ORX1_IN– VSSA

VDDA1P3_RX_RF

VSSA VSSA VSSA VSSA VSSA RF_EXT_LO_I/O–

RF_EXT_LO_I/O+

VSSA VSSA VSSA VSSA VSSA VSSA

GPIO_3p3_0 GPIO_3p3_3 VDDA1P3_RX_TX

VSSAVDDA1P3_

RF_VCO_LDOVDDA1P3_

RF_VCO_LDO VDDA1P1_RF_VCO

VDDA1P3_RF_LO

VSSAVDDA1P3_AUX_VCO_

LDO

VSSA VDDA_3P3 GPIO_3p3_9 RBIAS

GPIO_3p3_1 GPIO_3p3_4 VSSA VSSA VSSA VSSA VSSA VSSA VSSA VDDA1P1_AUX_VCO

VSSA VSSA GPIO_3p3_8 GPIO_3p3_10

GPIO_3p3_2 GPIO_3p3_5 GPIO_3p3_6 VDDA1P8_BB VDDA1P3_BB VSSA REF_CLK_IN+ REF_CLK_IN– VSSA AUX_SYNTH_OUT

AUXADC_3 VDDA1P8_TX GPIO_3p3_7 GPIO_3p3_11

VSSA VSSA AUXADC_0 AUXADC_1 VSSA VSSA VSSA VSSA VSSA VSSA AUXADC_2 VSSA VSSA VSSA

VSSA VSSA VSSA VSSAVDDA1P3_

CLOCK_SYNTH

VSSAVDDA1P3_RF_SYNTH

VDDA1P3_AUX_SYNTH RF_SYNTH_

VTUNEVSSA VSSA VSSA VSSA VSSA

TX2_OUT– VSSA VSSA VSSA VSSA VSSA VSSA VSSA VSSA VSSA GPIO_12 GPIO_11 VSSA TX1_OUT+

TX2_OUT+ VSSA GPIO_18 RESET GP_INTERRUPT

TEST GPIO_2 GPIO_1 SDIO SDO GPIO_13 GPIO_10 VSSA TX1_OUT–

VSSA VSSA SYSREF_IN+ SYSREF_IN– GPIO_5 GPIO_4 GPIO_3 GPIO_0 SCLK CS GPIO_14 GPIO_9 VSSA VSSA

VSSA VSSA SYNCIN1– SYNCIN1+ GPIO_6 GPIO_7 VSSD VDDD1P3_DIG

VDDD1P3_DIG

VSSD GPIO_15 GPIO_8 SYNCOUT1– SYNCOUT1+

VDDA1P1_

CLOCK_VCOVSSA SYNCIN0– SYNCIN0+ ORX1_

ENABLETX1_

ENABLEORX2_

ENABLETX2_

ENABLEVSSA GPIO_17 GPIO_16 VDD_

INTERFACESYNCOUT0– SYNCOUT0+

VDDA1P3_CLOCK_

VCO_ LDO

VSSA SERDOUT3– SERDOUT3+ SERDOUT2– SERDOUT2+ VSSA VDDA1P3_SER

VDDA1P3_DES

SERDIN1– SERDIN1+ SERDIN0– SERDIN0+ VSSA

AUX_SYNTH_VTUNE

VSSA VSSA SERDOUT1– SERDOUT1+ SERDOUT0– SERDOUT0+ VDDA1P3_SER

VDDA1P3_DES

VSSA SERDIN3– SERDIN3+ SERDIN2– SERDIN2+

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Figure 434. RF Input/Output, REF_CLK_IN±, and JESD204B Signal Routing Guidelines


Data Sheet ADRV9009


Figure 435 shows placement for ac coupling capacitors and a 100 Ω termination resistor near the REF_CLK_IN± pins. Shield the traces with ground flooding that is surrounded with vias staggered along the edge of the trace pair. The trace pair creates a shielded channel that shields the reference clock from any interference from other signals. Refer to the ADRV9009-W/PCBZ layout, including board support files included with the evaluation board software, for exact details.

Route the JESD204B interface at the beginning of the PCB design and with the same priority as the RF signals. The RF Routing Guidelines section outlines recommendations for

JESD204B interface routing. Provide appropriate isolation between interface differential pairs. The Isolation Between JESD204B Lines section provides guidelines for optimizing isolation.

The RF_EXT_LO_I/O− pin (B7) and the RF_EXT_LO_I/O+ pin (B8) on the ADRV9009 are internally dc biased. If an external LO is used, connect the LO via ac coupling capacitors.

TO ADRV9009BGA BALLS

AC COUPLINGCAPS

100ΩTERMINATIONRESISTOR

16

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Figure 435. REF_CLK_IN± Routing Recommendation




ADRV9009 Data Sheet


Signals with Second Routing Priority

Power supply quality has a direct impact on overall system performance. To achieve optimal performance, follow recommendations regarding ADRV9009 power supply routing. The following recommendations outline how to route different power domains that can be connected together directly and that can be tied to the same supply, but are separated by a 0 Ω placeholder resistor or ferrite bead (FB).

When using a trace to connect power to a particular domain, ensure that this trace is surrounded by ground.

Figure 436 shows an example of such traces routed on Layer 12 of the ADRV9009-W/PCBZ. Each trace is separated from any other signal by the ground plane and vias. Separating the traces from other signals is essential to providing necessary isolation between the ADRV9009 power domains.

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Figure 436. Layout Example of Power Supply Domains Routed with Ground Shielding (Layer 12 to Power)



Data Sheet ADRV9009


Each power supply pin requires a 0.1 μF bypass capacitor near the pin at a minimum. Place the ground side of the bypass capacitor in a way so that ground currents flow away from other power pins and the bypass capacitors.

For the domains shown in Figure 437, like the domains powered through a 0 Ω placeholder resistor or FB, place the 0 Ω placeholder resistors or FBs further away from the device. Space 0 Ω placeholder resistors or FBs apart from each other to ensure that the electric fields on the FBs do not influence each other. Figure 438 shows an example of how the FBs, reservoir capacitors, and decoupling capacitors are placed. It is

recommended to connect an FB between a power plane and the ADRV9009 at a distance away from the device (see Figure 438 for specific distances) The FB and the reservoir capacitor provide stable voltage for the ADRV9009 during operation by isolating the pin or pins that the network is connected to from the power plane. Then, shield that trace with ground and provide power to the power pins on the ADRV9009. Place a 100 nF capacitor near the power supply pin with the ground side of the bypass capacitor placed in a way so that ground currents flow away from other power pins and the bypass capacitors.


VDDA1P3_RX_RF


RF_EXT_LO_I/O+



VSSAVDDA1P3_

RF_VCO_LDOVDDA1P3_


VDDA1P3_RF_LO


LDO








CLOCK_SYNTH









VDDD1P3_DIG


VDDA1P1_


ENABLETX1_

ENABLEORX2_

ENABLETX2_



VDDA1P3_CLOCK_

VCO_ LDO


VDDA1P3_DES


AUX_SYNTH_VTUNE


VDDA1P3_DES


TRACE THROUGH 0.1Ω RESISTOR TO AP

TRACE THROUGH 0Ω TO AP

TRACE THROUGH0Ω TO AP


TRACE THROUGH0Ω TO 1.8V PLANE



TRACE THROUGH1Ω RESISTOR TO AP


TRACE THROUGH 0Ω RES. TO 1.3V ANALOG PLANE (AP)MAINTAIN LOWEST POSSIBLE IMPEDANCE

TRACE THROUGH FBTO 3.3V PLANE

TRACE THROUGH0Ω TO 1.8V PLANE

TRACE THROUGHFB TO INTERFACE SUPPLY

TRACE THROUGH 0ΩTO 1.3V JESD204B SUPPLY

TRACE THROUGH FBTO 1.3V JESD204B SUPPLY


WIDE TRACE TO1.3V DIGITAL SUPPLYHIGH CURRENT

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Figure 437. Power Supply Domains Interconnection Guidelines


ADRV9009 Data Sheet


DUT

0Ω RESISTOR

1µ + 100nF bypass

CAPS ORIENTED SUCH

THAT CURRENTS FLOW

AWAY FROM OTHER

POWER PINS

PLACEHOLDERS

FOR FERRITE BEADS

0Ω RESISTOR

PLACEHOLDERS

FOR FERRITE BEADS

RESERVOIRCAPACITORS

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Figure 438. Placement Example of 0 Ω Resistor Placeholders for FBs, Reservoir Capacitors, and Bypass Capacitors on the ADRV9009-W/PCBZ (Layer 12 to Power Layer and

Bottom Layer)



Data Sheet ADRV9009


Signals with Lowest Routing Priority

As a last step while designing the PCB layout, route signals shown in Figure 439. The following list outlines the recommended order of signal routing:

1. Use ceramic 1 μF bypass capacitors at the VDDA1P1_ RF_VCO pin, VDDA1P1_AUX_VCO pin, and VDDA1P1_CLOCK_VCO pin. Place them as close as possible to the ADRV9009 device with the ground side of the bypass capacitor placed in a way so that ground currents flow away from other power pins and the bypass capacitors, if possible.

2. Connect a 14.3 kΩ resistor to the RBIAS pin (C14). This resistor must have a 1% tolerance.

3. Pull the TEST pin (J6) to ground for normal operation. The device has support for JTAG boundary scan, and this pin is used to access that function. Refer to the JTAG Boundary Scan section for JTAG boundary scan information.

4. Pull the RESET pin (J4) high with a 10 kΩ resistor to VDD_ INTERFACE for normal operation. To reset the device, drive the RESET pin low.

When routing analog signals, such as GPIO_3P3_x/Auxiliary DAC x or AUXADC_x, it is recommended to route them away from the digital section (Row H through Row P). Do not cross the analog section of the ADRV9009, highlighted by a red dotted line in Figure 439, by any digital signal routing.

When routing digital signals from Row H and below, it is important to route them away from the analog section (Row A through Row G). Do not cross the analog section of the ADRV9009, highlighted by a red dotted line in Figure 439, by any digital signal routing.


VDDA1P3_RX_RF


RF_EXT_LO_I/O+



VSSAVDDA1P3_

RF_VCO_LDOVDDA1P3_


VDDA1P3_RF_LO


LDO








CLOCK_SYNTH









VDDD1P3_DIG


VDDA1P1_


ENABLETX1_

ENABLEORX2_

ENABLETX2_



VDDA1P3_CLOCK_

VCO_ LDO


VDDA1P3_DES


AUX_SYNTH_VTUNE


VDDA1P3_DES


1µF CAPACITOR

14.3kΩ RESISTOR

ALL DIGITALGPIO SIGNALSROUTED BELOWTHE RED LINE

1µF CAPACITOR

1µF CAPACITOR

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Figure 439. Auxiliary ADC, Analog, and Digital GPIO Signals Routing Guidelines


ADRV9009 Data Sheet


RF AND JESD204B TRANSMISSION LINE LAYOUT RF Routing Guidelines

The ADRV9009-W/PCBZ uses microstrip type lines for receiver, observation receiver, and transmitter RF traces. In general, it is not recommended to use any number of vias to route RF traces unless a direct line route is not possible. Differential lines from the balun to the receiver pins, observation receiver pins, and transmitter pins must be as short as possible. Also, make the length of the single-ended transmission line short to minimize the effects of parasitic coupling. These traces are the most critical when optimizing performance and are, therefore, routed before any other routing. These traces have the highest priority if trade-offs are needed.

Figure 440 and Figure 441 show pi matching networks on the single-ended side of the baluns. The observation receiver front

end is dc biased internally, so the differential side of the balun is ac-coupled. The system designer can optimize the RF performance with a proper selection of the balun, matching components, and ac coupling capacitors. The external LO traces and the REF_CLK_IN± traces may require matching components as well to ensure optimal performance.

All the RF signals mentioned previously must have a solid ground reference under each trace. Do not run any of the critical traces over a section of the reference plane that is discontinuous. The ground flood on the reference layer must extend all the way to the edge of the board. This flood length ensures signal integrity for the SMA launch when an edge launch connector is used.

Refer to the RF Port Interface Information section for more information on RF matching recommendations for the device.

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Figure 440. Pi Network Matching Components Available on Transmitter and Receiver



Data Sheet ADRV9009


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Figure 441. Pi Network Matching Components Available on Observation Receiver Inputs


ADRV9009 Data Sheet


Transmitter Balun DC Feed Supplies

Each transmitter requires approximately 200 mA supplied through an external connection. On the ADRV9008-2 and ADRV9009 evaluation boards, bias voltages are supplied at the dc feed of the baluns. Layout of both boards allows the use of external chokes to provide a 1.8 V power domain to the ADRV9009 outputs. This configuration is useful in scenarios where a balun used at the transmitter output is not capable of conducting the current necessary for the transmitter outputs to

operate. To reduce switching transients when attenuation settings change, power the balun dc feed or transmitter output chokes directly by the 1.8 V plane. Design the geometry of the 1.8 V plane so that each balun supply or each set of two chokes is isolated from the other. This geometry can affect transmitter to transmitter isolation. Figure 442 shows the layout configuration used on the ADRV9009-W/PCBZ.

Tx OUTPUT / BALUN1.8V SUPPLY FEED

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Figure 442. Transmitter Power Supply Planes (VDDA1P8_TX) on the ADRV9009-W/PCBZ

https://www.analog.com/ADRV9008-2?doc=ADRV9009.pdf




Data Sheet ADRV9009


Both the positive and negative transmitter pins must be biased with 1.8 V. This biasing is accomplished on the evaluation board through chokes and decoupling capacitors, as shown in Figure 443. Match both chokes and their layout to avoid potential current spikes. A difference in parameters between both chokes can cause unwanted emission at transmitter outputs. Place the decoupling capacitors that are near the transmitter balun as close as possible to the dc feed of the balun or the ground pin. Make orientation of the capacitor perpendicular to the device so that the return current forms as small a loop as possible with the ground pins surrounding the transmitter input. A combination network of capacitors provides a wideband and low impedance ground path, eliminates transmitter spectrum spurs, and dampens the transients.

DC FEED

CHOKES

DECOUPLING

CAPACITORS

1.8V TX POWER

DOMAIN FEED

CONDUCTING

RESISTORSBALUN

BALUN

DECOUPLING

CAPACITORS

TALISE TX OUTPUT

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ADRV9009 TX OUTPUT

Figure 443. Transmitter DC Chokes and Balun Feed Supply

JESD204B Trace Routing Recommendations

The ADRV9009 transceiver uses the JESD204B, high speed serial interface. To ensure optimal performance of this interface, keep the differential traces as short as possible by placing the ADRV9009 as close as possible to the FPGA or BBP, and route the traces directly between the devices. Use a PCB material with a low dielectric constant (<4) to minimize loss. For distances greater than 6 inches, use a premium PCB material such as RO4350B or RO4003C.

Routing Recommendations

Route the differential pairs on a single plane using a solid ground plane as a reference on the layers above and below these traces.

All JESD204B lane traces must be impedance controlled to achieve 50 Ω to ground. It is recommended that the differential pair be coplanar and loosely coupled. An example of a typical configuration is a 5 mil trace width and 15 mil edge to edge spacing, with the trace width maximized, as shown in Figure 444.

Match trace widths with pin and ball widths while maintaining impedance control. If possible, use 1 oz. copper trace widths of at least 8 mil (200 μm). The coupling capacitor pad size must match JESD204B lane trace widths. If the trace width does not match the pad size, use a smooth transition between different widths.

The pad area for all connector and passive component choices must be minimized due to a capacitive plate effect that leads to problems with signal integrity.

Reference planes for impedance controlled signals must not be segmented or broken for the entire length of a trace.

The REF_CLK_IN± signal trace and the SYSREF signal trace are impedance controlled for characteristic impedance (ZO) = 50 Ω.

Stripline Transmission Lines vs. Microstrip Transmission Lines

Stripline transmission lines have less signal loss and emit less electromagnetic interference than microstrip transmission lines. However, stripline transmission lines require the use of vias that add line inductance, increasing the difficulty of controlling the impedance.

Microstrip transmission lines are easier to implement if the component placement and density allow routing on the top layer. Microstrip transmission lines make controlling the impedance easier.

If the top layer of the PCB is used by other circuits or signals, or if the advantages of stripline transmission lines are more desirable than the advantages of microstrip transmission lines, implement the following recommendations:

Minimize the number of vias. Use blind vias where possible to eliminate via stub effects,

and use microvias to minimize via inductance. When using standard vias, use a maximum via length to

minimize the stub size. For example, on an 8-layer board, use Layer 7 for the stripline pair.

Place a pair of ground vias in proximity to each via pair to minimize the impedance discontinuity.


ADRV9009 Data Sheet


Route the JESD204B lines on the top side of the evaluation board as a differential 100 Ω pair (microstrip). For the ADRV9009-W/PCBZ, the JESD204B differential signals are routed on the inner layers of the board (Layer 5 and Layer 10) as differential 100 Ω pairs (stripline). To minimize potential coupling, these signals are placed on an inner layer using a via embedded in the component footprint pad where the ball connects to the PCB. The ac coupling capacitors (100 nF) on these signals are placed near the connector and away from the chip to minimize coupling. The JESD204B interface can operate at frequencies of up to 12 GHz. Ensure that signal integrity from the chip to the connector is maintained.

ISOLATION TECHNIQUES USED ON THE ADRV9009-W/PCBZ Isolation Goals

Significant isolation challenges were overcome in designing the ADRV9009-W/PCBZ. The following isolation requirements accurately evaluate the ADRV9009 transceiver performance:

Transmitter to transmitter: 75 dB out to 6 GHz Transmitter to receiver: 65 dB out to 6 GHz Receiver to receiver: 65 dB out to 6 GHz Transmitter to observation receiver: 65 dB out to 6 GHz

To meet these isolation goals with significant margin, isolation structures are introduced.

Figure 445 shows the isolation structures used on the ADRV9009-W/PCBZ. These structures consist of a combination of slots and square apertures. These structures are present on every copper layer of the PCB stack. The advantage of using square apertures is that signals can be routed between the openings without affecting the isolation benefits of the array of apertures. When using these isolation structures, make sure to place ground vias around the slots and apertures.

TxDIFFERENTIAL A

TxDIFFERENTIAL B

TxDIFFERENTIAL A

TxDIFFERENTIAL B

TIGHTLY COUPLEDDIFFERENTIAL Tx LINES

LOOSELY COUPLEDDIFFERENTIAL Tx LINES 1

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Figure 444. Routing JESD204B, Differential A and Differential B Correspond to Differential Positive Signals or Negative Signals (One Differential Pair)

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Figure 445. Isolation Structures on the ADRV9009-W/PCBZ








Data Sheet ADRV9009


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Figure 446. Current Steering Vias Placed Next to Isolation Structures

Figure 446 outlines the methodology used on the ADRV9009-W/PCBZ. When using slots, ground vias must be placed at the ends of the slots and along the sides of the slots. When using square apertures, at least one single ground via must be placed adjacent to each square. These vias must be through-hole vias from the top layer to the bottom layer. The function of these vias is to steer return current to the ground planes near the apertures.

For accurate slot spacing and square apertures layout, use simulation software when designing a PCB for the ADRV9009 transceiver. Spacing between square apertures must be no more than 1/10 of a wavelength.

Calculate the wavelength using Equation 1:

300( )

(MHz) R

Wavelength mFrequency E

(1)

where ER is the dielectric constant of the isolator material. For RO4003C material, microstrip structure (+ air), ER = 2.8. For FR4-370HR material, stripline structure, ER = 4.1.

For example, if the maximum RF signal frequency is 6 GHz, and ER = 2.8 for RO4003C material, microstrip structure (+ air), the minimum wavelength is approximately 29.8 mm.

To follow the 1/10 wavelength spacing rule, square aperture spacing must be 2.98 mm or less.

Isolation Between JESD204B Lines

The JESD204B interface uses eight line pairs that can operate at speeds of up to 12 GHz. When configuring the PCB layout, ensure that these lines are routed according to the rules outlined in the JESD204B Trace Routing Recommendations section. In addition,

use isolation techniques to prevent crosstalk between different JESD204B lane pairs.

Figure 447 shows a technique used on the ADRV9009-W/PCBZ that involves via fencing. Placing ground vias around each JESD204B pair provides isolation and decreases crosstalk. The spacing between vias is 1.24 mm.

Figure 447 shows the rule provided in Equation 1. JESD204B lines are routed on Layer 5 and Layer 10 so that the lines use stripline structures. The dielectric material used in the inner layers of the ADRV9009-W/PCBZ PCB is FR4-370HR.

For accurate spacing of the JESD204B fencing vias, use layout simulation software. Input the following data into Equation 1 to calculate the wavelength and square aperture spacing:

The maximum JESD204B signal frequency is approximately 12 GHz.

For FR4-370HR material, stripline structure, ER = 4.1, the minimum wavelength is approximately 12.4 mm.

To follow the 1/10 wavelength spacing rule, spacing between vias must be 1.24 mm or less. The minimum spacing recommendation according to transmission line theory is 1/4 wavelength.






ADRV9009 Data Sheet


1.24mm

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Figure 447. Via Fencing Around JESD204B Lines, PCB Layer 10

RF PORT INTERFACE INFORMATION This section details the RF transmitter and receiver interfaces for optimal device performance. This section also includes data for the ADRV9009 RF port impedance values (see Figure 448 and Figure 449 for impedance values) and examples of impedance matching networks used in the evaluation platform. This section also provides information on board layout techniques and balun selection guidelines.

The ADRV9009 is a highly integrated transceiver with transmit, receive, and observation (DPD) receive signal chains. External impedance matching networks are required on the transmitter and receiver ports to achieve the performance levels indicated in this data sheet.

It is recommended to use simulation tools in the design and optimization of impedance matching networks. To achieve the closest match between computer simulated results and measured results, accurate models of the board environment, surface-mount device (SMD) components (including baluns and filters), and ADRV9009 port impedances are required.

RF Port Impedance Data

This section provides the port impedance data for all transmitters and receivers in the ADRV9009 integrated transceiver. Note the following:

ZO is defined as 50 Ω. The ADRV9009 ball pads are the reference plane for this data. Single-ended mode port impedance data is not available.

However, a rough assessment is possible by taking the differential mode port impedance data and dividing both the real and imaginary components by 2.

Contact Analog Devices applications engineering for the impedance data in Touchstone format.


Data Sheet ADRV9009


0

5.0

–5.0

2.0

1.0

–1.0

–2.0

0.5

–0.5

0.2

–0.2

m26FREQUENCY = 3GHzS(1,1) = 0.368/150.626IMPEDANCE = 24.355 + j10.153

m27FREQUENCY = 4GHzS(1,1) = 0.484/107.379IMPEDANCE = 25.118 + j30.329m28FREQUENCY = 5GHzS(1,1) = 0.569/70.352IMPEDANCE = 35.932 + j56.936m29FREQUENCY = 6GHzS(1,1) = 0.614/36.074IMPEDANCE = 81.032 + j94.014

m21FREQUENCY = 100MHzS(1,1) = 0.143/–7.865IMPEDANCE = 66.439 – j2.654

m22FREQUENCY = 300MHzS(1,1) = 0.141/–25.589IMPEDANCE = 64.063 – j7.987m23FREQUENCY = 500MHzS(1,1) = 0.145/–42.661IMPEDANCE = 60.623 – j12.201m24FREQUENCY = 1GHzS(1,1) = 0.164/–84.046IMPEDANCE = 49.000 + j16.447

m25FREQUENCY = 2GHzS(1,1) = 0.247/–155.186IMPEDANCE = 31.131 – j6.860

M29

M28M27

M26

M25M24 M23

M22M21

FREQUENCY (0.000Hz TO 6.000Hz)

S91

,1)

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Figure 448. Transmitter 1 and Transmitter 2 SEDZ and Parallel Equivalent Differential Impedance (PEDZ) Data

0

5.0

–5.0

2.0

1.0

–1.0

–2.0

0.5

–0.5

0.2

–0.2


m16FREQUENCY = 300MHzS(1,1) = 0.390/–5.495IMPEDANCE = 112.803 – j9.931m17FREQUENCY = 500MHzS(1,1) = 0.388/–9.198IMPEDANCE = 110.398 – j16.107m18FREQUENCY = 1GHzS(1,1) = 0.377–18.643IMPEDANCE = 100.377 – j28.250


FREQUENCY (0Hz TO 6GHz)

M21

M23


m21FREQUENCY = 4GHzS(1,1) = 0.186/–104.336IMPEDANCE = 42.821 – j16.026m22FREQUENCY = 5GHzS(1,1) = 0.164/–173.106IMPEDANCE = 35.977 – j1.455m23FREQUENCY = 6GHzS(1,1) = 0.266/130.063IMPEDANCE = 32.890 + j14.399

S(1

,1)

M20

M19 M18

M17M16M15M22

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Figure 449. Receiver 1 and Receiver 2 SEDZ and PEDZ Data


ADRV9009 Data Sheet


0

5.0

–5.0

2.0

1.0

–1.0

–2.0

0.5

–0.5

0.2

–0.2


m16FREQUENCY = 300MHzS(1,1) = 0.389/–5.601IMPEDANCE = 112.639 – j10.091m17FREQUENCY = 500MHzS(1,1) = 0.385/–9.396IMPEDANCE = 109.556 – j16.156m18FREQUENCY = 1GHzS(1,1) = 0.362–19.087IMPEDANCE = 97.259 – j26.513


M22

FREQUENCY (0Hz TO 6GHz)

M21

M23


m21FREQUENCY = 4GHzS(1,1) = 0.116/104.276IMPEDANCE = 46.060 + j10.522m22FREQUENCY = 5GHzS(1,1) = 0.342/75.761IMPEDANCE = 46.551 + j34.914m23FREQUENCY = 6GHzS(1,1) = 0.525/53.007IMPEDANCE = 56.249 + j65.146

S(1

,1)

M20M19

M18M17

M16M15

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Figure 450. Observation Receiver 1 and Observation Receiver 2 SEDZ and PEDZ Data

0

5.0

–5.0

2.0

1.0

–1.0

–2.0

0.5

–0.5

0.2

–0.2


m2FREQUENCY = 750MHzS(1,1) = 0.074/–123.043IMPEDANCE = 45.753 – j5.744m3FREQUENCY = 1.5GHzS(1,1) = 0.147/–138.745IMPEDANCE = 39.362 – j7.804m4FREQUENCY = 3GHzS(1,1) = 0.292/–175.424IMPEDANCE = 5.273 – j547.733

m5FREQUENCY = 6GHzS(1,1) = 0.538/123.271IMPEDANCE = 18.885 – j23.935

m6FREQUENCY = 12GHzS(1,1) = 0.757/46.679IMPEDANCE = 40.002 – j103.036

M4

M3

M2M1

M5

FREQUENCY (100MHz TO 12GHz)

M6

350

300

250

200

150

100

50

00 42 6 8 10 12

R_P

ED

Z

FREQUENCY (GHz)L

_OR

_C_P

EX

_ST

AT

US

900

800

700

600

500

400

300

200

100

0

R_PEDZL_OR_C_PEX_STATUS

m7FREQUENCY = 5GHzL_OR_C_PE = 1.336m8FREQUENCY = 5GHzR_PEDZ = 31.172m9FREQUENCY = 5GHzX_STATUS = 1

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Figure 451. RF_EXT_LO_I/O± SEDZ and PEDZ Data


Data Sheet ADRV9009


0

5.0

–5.0

2.0

1.0

–1.0

–2.0

0.5

–0.5

0.2

–0.2

m1FREQUENCY = 100MHzS(1,1) = 0.999/–1.396IMPEDANCE = 159.977 – j4.099E3

m2FREQUENCY = 250MHzS(1,1) = 0.999/–3.480IMPEDANCE = 30.567 – j1.645E3m3FREQUENCY = 500MHzS(1,1) = 0.999/–6.952IMPEDANCE = 9.723 – j823.070m4FREQUENCY = 750MHzS(1,1) = 0.998/–10.431IMPEDANCE = 5.273 – j547.733


M4M3M2M1

M5

FREQUENCY (0.000Hz TO 1.100GHz)

13E+5

4.0E+4

6.0E+4

9.0E+4

1.1E+5

1.2E+5

8.0E+4

5.0E+4

7.0E+4

1.0E+5

0 0.3 0.5 0.7 0.90.1 0.2 0.4 0.6 0.8 1.0 1.1

R_P

ED

Z

FREQUENCY (GHz)

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0

L_O

R_C

_PE

X_S

TA

TU

S

R_PEDZL_OR_C_PEX_STATUS

m7FREQUENCY = 1GHzL_OR_C_PE = 0.389m8FREQUENCY = 1GHzR_PEDZ = 4.761E4m9FREQUENCY = 1GHzX_STATUS = 0

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Figure 452. REF_CLK_IN± SEDZ and PEDZ Data, On Average, the Real Part of the Parallel Equivalent Differential Impedance (RP) = Approximately 70 kΩ


ADRV9009 Data Sheet


Advanced Design System (ADS) Setup Using the DataAccessComponent and SEDZ File

Analog Devices supplies the port impedance as an .s1p file that can be downloaded from the ADRV9009 product page. This format allows simple interfacing to the ADS by using the DataAccessComponent. In Figure 453, Term 1 is the single-ended input or output, and Term 2 is the differential input or output RF port on the ADRV9009. The pi on the single-ended side and the differential pi configuration on the differential side allow maximum flexibility in designing matching circuits. The pi configuration is suggested for all design layouts because the pi configuration can step the impedance up or down as needed with appropriate component population.

Take the following steps to set up a simulation for impedance measurement and impedance matching:

1. The DataAccessComponent block reads the rf port.s1p file. This file is the device RF port reflection coefficient.

2. The two equations convert the RF port reflection coefficient to a complex impedance. The result is the RX_SEDZ variable.

3. The RF port calculated complex impedance (RX_SEDZ) defines the Term 2 impedance.

4. Term 2 is used in a differential mode, and Term 1 is used in a single-ended mode.

Setting up the simulation this way allows the user to measure the input reflection (S11), output reflection (S22), and through reflection (S21) of the three-port system without complex math operations within the display page.

For the highest accuracy, the electromagnetic momentum (EM) modeling result of the PCB artwork, S11, S22, and S21 of the matching components and balun must be used in the simulations.

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Figure 453. Simulation Setup in ADS with SEDZ .s1p Files and DataAccessComponent

Table 11. Sample Wire Wound DC Bias Choke Resistance vs. Size vs. Inductance Inductance (nH) Resistance (Size: 0603) (Ω) Resistance (Size: 1206) (Ω) 100 0.10 0.08 200 0.15 0.10 300 0.16 0.12 400 0.28 0.14 500 0.45 0.15 600 0.52 0.20


Data Sheet ADRV9009


Transmitter Bias and Port Interface

This section considers the dc biasing of the ADRV9009 transmitter outputs and how to interface to each transmitter port. The ADRV9009 transmitters operate over a range of frequencies. At full output power, each differential output side draws approxi-mately 100 mA of dc bias current. The transmitter outputs are dc biased to a 1.8 V supply voltage using either RF chokes (wire wound inductors) or a transformer center tap connection.

Careful design of the dc bias network is required to ensure optimal RF performance levels. When designing the dc bias network, select components with low dc resistance (RDCR) to minimize the voltage drop across the series parasitic resistance element with either of the suggested dc bias schemes suggested in Figure 454. The RDCR resistors indicate the parasitic elements. As the impedance of the parasitics increases, the voltage drop (ΔV) across the parasitic element increases, which causes the transmitter RF performance (PO,1dB and PO,MAX, for example) to degrade. The choke inductance (LC) must be at least 3× higher than the load impedance at the lowest desired frequency so that the LC does not degrade the output power (see Table 11).

The recommended dc bias network is shown in Figure 455. This network has fewer parasitics and fewer total components.

Figure 456 through Figure 459 show four basic differential transmitter output configurations. Except for cases in which impedance is already matched, impedance matching networks (balun single-ended port) are required to achieve optimum device performance from the device. In applications where the transmitter is not connected to another circuit that requires or can tolerate dc bias on the transmitter outputs, the transmitter outputs must be ac-coupled because of the dc bias voltage applied to the differential output lines of the transmitter.

The recommended RF transmitter interface, shown in Figure 454 to Figure 459, features a center tapped balun. This configuration offers the lowest component count of the options presented.

Descriptions of the transmitter port interface schemes are as follows:

In Figure 456, the center tapped transformer passes the bias voltage directly to the transmitter outputs.

In Figure 457, RF chokes bias the differential transmitter output lines. Additional coupling capacitors (CC) are added in the creation of a transmission line balun.

In Figure 458, RF chokes bias the differential transmitter output lines and connect to a transformer.

In Figure 459, RF chokes bias the differential output lines that are ac-coupled to the input of a driver amplifier.

If a transmitter balun that requires a set of external dc bias chokes is selected, careful planning is required. It is necessary to find the optimum compromise between the choke physical size, choke dc resistance, and the balun low frequency insertion loss. In commercially available dc bias chokes, resistance decreases as size increases. As choke inductance increases, resistance increases. It is undesirable to use physically small chokes with high inductance

because small chokes exhibit the greatest resistance. For example, the voltage drop of a 500 nH 0603 choke at 100 mA is roughly 50 mV.

Tx1 OR Tx2OUTPUTSTAGE

LC LCCB

TX1_OUT–/TX2_OUT–

TX1_OUT+/TX2_OUT+

1.8V

VDC = 1.8V

ΔV+

–RDCR

ΔV+

–RDCR

IBIAS = ~100mA

IBIAS = ~100mA

VBIAS = 1.8 – ΔV

VBIAS = 1.8 – ΔV

16

499

-464

Figure 454. RF DC Bias Configurations Showing Parasitic Losses Due to Wire

Wound Chokes

CB


IBIAS = ~100mA

1.8V

– ΔV +

– ΔV +

RDCR

RDCR

IBIAS = ~100mA

16

499

-46

5TX1_OUT–/TX2_OUT–

TX1_OUT+/TX2_OUT+

Figure 455. RF DC Bias Configurations Showing Parasitic Losses Due to

Center Tapped Transformers

CB


1.8V

164

99-

466TX1_OUT–/

TX2_OUT–

TX1_OUT+/TX2_OUT+

Figure 456. Using a Center Tapped Transformer


LC LCCB

1.8V

1.8V

1.8V

CC

CC

16

499

-46

7TX1_OUT–/TX2_OUT–

TX1_OUT+/TX2_OUT+

Figure 457. Using Bias Chokes and a Transmission Line Balun


LC LCCB


TX1_OUT+/TX2_OUT+

1.8V

1.8V

1.8V16

499-

468

Figure 458. Using Bias Chokes and a Transformer

DRIVERAMPLIFIER


LC LCCB


TX1_OUT+/TX2_OUT+

1.8V

1.8V

1.8V

CC

CC

1649

9-46

9

Figure 459. Using a Differential to Single-Ended Driver Amplifier


ADRV9009 Data Sheet


General Receiver Path Interface

The ADRV9009 has the following two types of receivers: receiver and observation receiver. These receivers include two main receive pathways (Receiver 1 and Receiver 2) and two observation or DPD receivers (Observation Receiver 1 and Observation Receiver 2). The receivers can support up to 200 MHz bandwidth, and the observation receivers can support up to 450 MHz bandwidth. The receiver channels and observation receiver channels are designed for differential use.

The ADRV9009 receivers support a wide range of operation frequencies. In the case of the receiver channels and observation receiver channels, the differential signals interface to an integrated mixer. The mixer input pins have a dc bias of approximately 0.7 V and may need to be ac-coupled, depending on the common-mode voltage level of the external circuit.

Important considerations for the receiver port interface are as follows:

The device to be interfaced (filter, balun, transmit receive (T/R) switch, external low noise amplifier (LNA), and external PA, for example).

The receiver and observation receiver maximum safe input power is 23 dBm (peak).

The receiver and observation receiver optimum dc bias voltage is 0.7 V bias to ground.

The board design (reference planes, transmission lines, and impedance matching, for example).

Figure 460 and Figure 461 show possible differential receiver port interface circuits. The options in Figure 460 and Figure 461 are valid for all receiver inputs operating in differential mode, though only the Receiver 1 signal names are indicated. Impedance matching may be necessary to obtain the performance levels described in this data sheet.

Given wide RF bandwidth applications, SMD balun devices function well. Decent loss and differential balance are available in a relatively small (0603, 0805) package.

RX1_IN–

RX1_IN+

RECEIVERINPUT

STAGE(MIXER OR LNA)

16

49

9-4

70

Figure 460. Differential Receiver Interface Using a Transformer

RX1_IN–

RX1_IN+

CC

CC

RECEIVERINPUT

STAGE(MIXER OR LNA)

16

49

9-4

71

Figure 461. Differential Receiver Interface Using a Transmission Line Balun

Impedance Matching Network Examples

Impedance matching networks are required to achieve the ADRV9009 data sheet performance levels. This section provides example topologies and components used on the ADRV9009-W/PCBZ.

Device models, board models, and balun and SMD component models are required to build an accurate system level simulation. The board layout model can be obtained from an EM simulator. The balun and SMD component models can be obtained from the device vendors or built locally. Contact Analog Devices applications engineering for ADRV9009 modeling details.

The impedance matching networks provided in this section are not evaluated in terms of mean time to failure (MTTF) in high volume production. Consult with component vendors for long-term reliability concerns. Consult with balun vendors to determine appropriate conditions for dc biasing.

Figure 464 shows three elements in parallel marked do not install (DNI). However, only one set of SMD component pads is placed on the board. For example, R202, L202, and C202 components only have one set of SMD pads for one SMD component. Figure 464 shows that in a generic port impedance matching network, the shunt or series elements can be resistors, inductors, or capacitors.




Data Sheet ADRV9009


16499-472

Figure 462. Impedance Matching Topology


ADRV9009 Data Sheet


DNI

TCM1-83X+

DNI

0Ω

0Ω

DNI

T303

C342

R310

R312

C322C320

TX2_BAL+

TX2_BAL–

RFO_2

1 6

3

2

5

4

AGND

18pF

C336

10pF

C348

27pF

C349

51pF

C350

75pF

C351

NC

AGND

J3041

AGND

AGNDAGND

DNIC341

0Ω

DNI

R311TX2_OUT–

TX2_OUT+

VDDA1P8_TX

TX2

VDDA1P8_TX

L329

DNI

C329

AGND0.1µF

C316

AGND0.1µF

C315

L31643nH

L31543nH

AGND0.1µF

C308

AGND0.1µF

C307

L30843nH

L30743nH

AGNDDNI

L327

DNI

C327

DNI

TCM1-83X+

DNI

0Ω

0Ω

DNI

T302

C338

R307

R309

C314C312

TX1_BAL+

TX1_BAL–

RFO_1

1 6

3

2

5

4

AGND

18pF

C337

51pF

C344

75pF

C345

10pF

C346

27pF

C347

NC

AGND

J303

5 4 3 2

5 4 3 2

1

AGND

AGNDAGND

DNIC339

0Ω

DNI

R308TX1_OUT–

TX1_OUT+

VDCA1P8_TX

TX1

VDCA1P8_TX

L325

DNI

C325

AGNDDNI

L323

DNI

C323

16499-473

Figure 463. Transmitter 1 and Transmitter 2 Generic Matching Network Topology


Data Sheet ADRV9009


AGND

C201DNI

C202

L202

R202

DNI

DNI

L201DNI

AGNDAGND

6 5 2RX1_DC

NC_6 GND GND_DC_FEED_RFGND

OVERLAP PADS

13

4

C203DNI

L203DNI

C230DNI

R230DNI

RX1_UNBALUNBAL_IN

BAL_OUT1

BAL_OUT2

0805 FOOTPRINT

T201DNI

RX1_BAL+

RX1_BAL–

C204DNI

C205

L205

R205

DNI

DNI

DNI

L204DNI

C206

L206

R206

DNI

DNI

DNI

C207DNI

L207DNI

RX1_IN+

RX1_IN–

DNI

AGND

C208DNI

C209

L209

R209

DNI

DNI

L208DNI

AGNDAGND

6 5 2RX2_DC

NC_6 GND GND_DC_FEED_RFGND

OVERLAP PADS

13

4

C210DNI

L210DNI

C231DNI

R231DNI

RX2_UNBALUNBAL_IN

BAL_OUT1

BAL_OUT2

0805 FOOTPRINT

T202DNI

RX2_BAL+

RX2_BAL–

C211DNI

C212

L212

R212

DNI

DNI

DNI

L211DNI

C213

L213

R213

DNI

DNI

DNI

C214DNI

L214DNI

RX2_IN+

RX2_IN–

DNI

RX1J201

4 532

1

AGND

RX2J202

4 532

1

AGND

164

99-

474

Figure 464. Receiver 1 and Receiver 2 Generic Matching Network Topology

ORX2

ORX1

DNI

0Ω

DNI DNI

18pF

TCM1-83X+

DNI10pF 27pF

TCM1-83X+

DNI

0Ω

0Ω

DNI

0Ω

0Ω 18pF 0Ω

DNI

DNI

C251

C250

C24610pFDNI

T207

C24727pF

T205

C245C244

J203

J204

C222

R223

C224DNI C225

R227

R226

C228

C215 C217

R216

R220

R219

C221C218

ORX1_BAL+

ORX2_UNBAL

ORX1_UNBAL

ORX2_BAL–

ORX1_BAL–

ORX2_IN+

ORX2_IN–

ORX1_IN+

ORX1_IN–

ORX2_BAL+

5

4

3

2

5

4

3

25432

5432

1

1

AGND

AGND AGND

NC

AGND

NC

AGND

AGNDAGND AGND

6 1

6 1

164

99-4

75

Figure 465. Observation Receiver 1 and Observation Receiver 2 Generic Matching Network Topology


ADRV9009 Data Sheet


Table 12 through Table 17 show the selected balun and component values used for three matching network sets. Refer to Figure 463 or Figure 465 for a wideband matching example that operates across the entire device frequency range with reduced performance.

The RF matching used in the ADRV9009-W/PCBZ allows the ADRV9009 to operate across the entire chip frequency range with slightly reduced performance. Components C, R, and L can be used in all frequency bands.

Table 12. Receiver 1 Evaluation Board Matching Components Frequency Band 201 202 203 204 205, 206 207 T201 625 MHz to 2815 MHz 22 nH 12 pF 62 nH 180 nH 39 pF 91 nH Johanson 1720BL15A0100 3400 MHz to 4800 MHz DNI 0 Ω DNI 18 nH 1.3 nH 0.4 pF Anaren BD3150L50100AHF 5300 MHz to 5900 MHz DNI 0.6 nH DNI DNI 0.4 pF 4.3 nH Johanson 5400BL15B200

Table 13. Receiver 2 Evaluation Board Matching Components Frequency Band 208 209 210 211 212, 213 214 T202 625 MHz to 2815 MHz 22 nH 12 pF 62 nH 180 nH 39 pF 91 nH Johanson 1720BL15A0100 3400 MHz to 4800 MHz DNI 0 Ω DNI 18 nH 1.3 nH 0.4 pF Anaren BD3150L50100AHF 5300 MHz to 5900 MHz DNI 0.6 nH DNI DNI 0.4 pF 4.3 nH Johanson 5400BL15B200

Table 14. Observation Receiver 1 Evaluation Board Matching Components Frequency Band 215 216 217 218 219, 220 221 T205 625 MHz to 2815 MHz DNI 0 Ω DNI 56 nH 5.6 pF 180 nH Johanson 1720BL15A0100 3400 MHz to 4800 MHz 0.3 pF 1.6 pF 2 nH 6.8 nH 1.7 nH 220 nH Anaren BD3150L50100AHF 5300 MHz to 5900 MHz 100 nH 6.8 pF 5.6 nH DNI 0.8 pF 1.5 nH Johanson 5400BL15B200

Table 15. Observation Receiver 2 Evaluation Board Matching Components Frequency Band 222 223 224 225 226, 227 228 T207 625 MHz to 2815 MHz DNI 0 Ω Do not install 56 nH 5.6 pF 180 nH Johanson 1720BL15A0100 3400 MHz to 4800 MHz 0.3 pF 1.6 pF 2 nH 6.8 nH 1.7 nH 220 nH Anaren BD3150L50100AHF 5300 MHz to 5900 MHz 100 nH 6.8 pF 5.6 nH DNI 0.8 pF 1.5 nH Johanson 5400BL15B200

Table 16. Transmitter 1 Evaluation Board Matching Components1

Frequency Band 314 313 312 309, 310 311 T302 T302 Pin 2, Bypass Capacitor C332

C307, C308, L307, L308

625 MHz to 2815 MHz 22 nH 4.7 pF 43 nH 0 Ω 0.2 pF Johanson 1720BL15B0050 33 pF DNI 3400 MHz to 4800 MHz DNI 0 Ω DNI 2.7 nH 0.2 pF Anaren BD3150L50100AHF 3.9 pF DNI 5300 MHz to 5900 MHz DNI 0 Ω DNI 0.9 nH 8.2 nH Johanson 5400BL14B100 1.8 pF DNI 1 These matches provide VDDA1P8_TX to the TXx_OUT± pins through the balun.

Table 17. Transmitter 2 Evaluation Board Matching Components1,

Frequency Band 322 321 320 317, 318 319 T303 T303 Pin 2, Bypass Capacitor C335

C315, C316, L315, L316

625 MHz to 2815 MHz 22 nH 4.7 pF 43 nH 0 Ω 0.2 pF Johanson 1720BL15B0050 33 pF DNI 3400 MHz to 4800 MHz DNI 0 Ω DNI 2.7 nH 0.2 pF Anaren BD3150L50100AHF 3.9 pF DNI 5300 MHz to 5900 MHz DNI 0 Ω DNI 0.9 nH 8.2 nH Johanson 5400BL14B100 1.8 pF DNI 1 These matches provide VDDA1P8_TX to the TXx_OUT± pins through the balun.



ADRV9009 Data Sheet


OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-275-GGAB-1. 03

-02

-20

15

-A

0.80

0.80 REF

0.44 REF

ABCDEFG

91011121314 8 7 56 4 23 1

BOTTOM VIEW

10.40 SQ

HJKLMNP

DETAIL A

TOP VIEW

DETAIL A

COPLANARITY0.12

0.500.450.40

BALL DIAMETER

SEATINGPLANE

12.1012.00 SQ11.90

A1 BALLPAD CORNER

1.271.181.09

7.755 REF

8.090 REF

0.910.840.77

0.390.340.29

PK

G-0

04

72

3

A1 BALLCORNER

PIN A1INDICATOR

Figure 466. 196-Ball Chip Scale Package Ball Grid Array [CSP_BGA]

(BC-196-13) Dimensions shown in millimeters

ORDERING GUIDE Model1 Temperature Range2 Package Description Package Option ADRV9009BBCZ −40°C to +85°C 196-Ball Chip Scale Package Ball Grid Array [CSP_BGA] BC-196-13 ADRV9009BBCZ-REEL −40°C to +85°C 196-Ball Chip Scale Package Ball Grid Array [CSP_BGA] BC-196-13 ADRV9009-W/PCBZ Pb-Free Evaluation Board, 75 MHz to 6000 MHz 1 Z = RoHS Compliant Part. 2 See the Thermal Management section.

©2018–2019 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D16499-0-5/19(B)


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Integrated Dual RF Transmitter, Receiver, and Observation