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7/30/2019 Integrated Ccts
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Indigent Group of UIT
M.Talha Meraj
Abdul Aleem Siddiqui
Faizan Hanif
M.Saad Abbas
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C o n t e n t s
Dual in-line package (DIP)
Small-outline integrated circuit (SOIC)
Thin Small-outline Package (TSOP) Thin Very Small-outline Package (TVSOP)
Quad Flat Package (QFP)
Thin Quad Flat Package (TQFP) Plastic Leaded Chip carrier (PLCC)
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D u a l i n - l i n e p a c k a g e ( D I P )
In microelectronics, a dual in-line package
(DIP or DIL) is an electronic device package
with a rectangular housing and two parallel
rows of electrical connecting pins. The
package may be through-hole mounted to a
printed circuit board or inserted in a socket.
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Where dip encased?
DIP is a chip encased in a hard
plastic casing with pins along
each of the sides of theplastic casing. In the picture
to the right, is an example
of a DIP found on a computer motherboard
that has been soldered into place.
http://www.computerhope.com/jargon/m/mothboar.htmhttp://www.computerhope.com/jargon/s/solder.htmhttp://www.computerhope.com/jargon/s/solder.htmhttp://www.computerhope.com/jargon/m/mothboar.htm7/30/2019 Integrated Ccts
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I C PA C K A G E S
Some DIPs use a small dot on the top surface
of the package to locate pin 1. The spacing
between pins (lead pitch) is typically 100 mils(
a mil is a thousandth of an inch). Dip packages
are still the most popular package for
breadboarding and educational
experimentation.
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D u a l i n - l i n e p a c k a g e ( D I P )
A DIP is usually referred to as a DIPn, where n
is the total number of pins.
Height: 200mils(5.1mm) Lead pitch: 100mils(2.54mm)
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Small-outl ine integrated circuit
A small-outline integrated circuit (SOIC) is a
surface-mounted integrated circuit (IC) package
which occupies an area about 3050% less than
an equivalent DIP, with a typical thickness that is70% less.
They are generally available in the same pin outs
as their counterpart DIP ICs. The convention fornaming the package is SOIC or sometimes just
SO followed by the number of pins.
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Small-outl ine integrated circuit
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T h i n S m a l l - o u t l i n e P a c k a g e
Thin small-outline packages, or TSOPs are a
type of surface mount IC package. They are
notably very low-profile (about 1mm) and
have tight lead spacing (as low as 0.5mm).
They are frequently used for RAM or Flash
memory ICs due to their high pin count and
small volume.
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T h i n S m a l l - o u t l i n e P a c k a g e
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T h i n S m a l l - o u t l i n e P a c k a g e
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T h i n S m a l l - o u t l i n e P a c k a g e
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Thin Very Small-outline Package
Height :1.2 mm
Lead Pitch:0.4mm
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Q u a d F l a t P a c k a ge
A QFP or Quad Flat Package is a surface
mount integrated circuit package with "gull
wings" leads extending from each of the four
sides.
Versions ranging from 32 to 304 pins with a
pitch ranging from 0.4 to 1.0 mm are
common.
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Q u a d F l a t P a c k a ge
A package related to QFP is PLCC which is
similar but has pins with larger pitch, 1.27 mm
(or 1/20 inch), curved up underneath a thicker
body to simplify socketing (soldering is alsopossible). It is commonly used for NOR Flash
memories and other programmable
components.
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Q u a d F l a t P a c k a ge
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T h i n Q u a d F l a t P a c k a g e
Height :
1.6 mm
Lead Pitch:
0.5mm
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P l a s t i c L e a d e d C h i p C a r r i e r
Height :
4.5 mm
Lead Pitch:
1.27mm
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