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LASER SYSTEMS FOR VARIOUS APPLICATIONS SUCH AS • LASER DOPED SELECTIVE EMITTER (LDSE)• PASSIVATED EMITTER REAR CONTACT CELLS (PERC) • LASER DIRECT CLEAVING- CELL CUTTING (LDC)
LUMION Laser systems for cSi-solar cell processing
THROUGHPUT
SUBSTRATE
ACCURACY
Width: 6449mm; Depth: 2145mm; Height: 2100mm; Weight: 2800kg
< +/-25 µm (1 sigma)
DIMENSIONS
Dimension up to 166 x 166 mmThickness: 0.1mm – 0.15mm mono or poly crystalline silicon square/ pseudo square
Up to 7500 wafer per hour
APPLICATIONS Laser Contact Opening for PERC, Laser Doped Selective Emitter, Front side LCO, Laser Direct Cleaving
InnoLas Solutions GmbHPionierstraße 6 82152 Krailling, Germany
Fon: +49 (89) 8105 9168 -1000Fax: +49 (89) 8105 9168 -1900
Specification subject to change. InnoLas Solutions GmbH, 10/ 2017
PRODUCT PRESENTATION
BENEFITS Cost effective design
Simple and easy wto maintain design Dedicated solution for cSi solar cell
proccessing
TECHNOLOGY Ultra high speed Galvo Scanner
Automatic calibration routines InnoLas μVIsion Windows 10 IoT Touch display
OPTIONS Integrated AOI with closed loop function Standalone buffer unit for inline solutions
AUTOMATION Fully automated stand-alone system Fully integrated PERC-module in printer line
