iNEMI Warpage Management ProgramCall for Sign-up Webinar

Project 1: Package Warpage Prediction and Characterization

Project 2: High Density Interconnect Socket Warpage Prediction and Characterization

June 24 and July 2/3, 2020

Listen to webinar recording: https://inemi.webex.com/inemi/lsr.php?RCID=d30426a7067141668272ce45fc7b1da4

Agenda

Introduction• Project Chairs & Companies Involved in Planning• iNEMI Project Development Process• How to Join

Project Briefing• Package Warpage Prediction and Characterization

• Background & Objectives• Project Scope• Schedule• Resource

• High Density Interconnect Socket Warpage Prediction and Characterization• Background & Objectives• Project Scope• Schedule• Resource

• Q&A

Note: All phones will be on mute until the end of the presentation

3

Wei Keat Loh IntelSenior Technology Development Engineering Manager Assembly and Test Technology Development (ATTD)

Focus on package design, solder joint & packaging level reliability, package warpage as well as assembly related mechanical-thermal-fluid flow interaction prediction capability. (PhD in Mechanical Engineering)

Ron KultermanFlexThermal Mechanical Lab Manager and Material Characterization and Failure Analysis

Electrical Engineering of University of Texas AustinOver 36 years in PCBA Mfg and Design at IBM, Solectron, Sun Microsystems, Flex.Incircuit and Functional Test, Dev/Mfg Engineering Liaison, Design Services with DFM/DFT

Introduction of Program Chairs

Package Warpage Prediction and Characterization Project (Phase 5)

High Density Interconnect Socket Warpage Prediction and Characterization ProjectRenn Chan Ooi, Intel üRenn Chan joined Intel Corp since 2005 and is Senior

Assembly & Packaging Analyst focusing on encapsulation and assembly technology challenges.

üReceived doctorate degree in Mechanical Engineering from University of Sheffield, UK in 2004.

ü Field of interest includes thermo-fluids analysis for assembly processes, imaging processing and assembly flow visualization.

Introduction of Project Chairs

4

Kang Eu Ong, IntelüKang Eu joined Intel Corp since 2004 and is Senior

Assembly & Packaging Analyst focusing on mechanical and assembly technology challenges.

üReceived master degree in Mechanical Engineering from University of Science Malaysia in 2004.

ü Field of interest includes mechanical analysis for electronic packaging and FEA process automation.

Companies Contributed to Project Planning

•Address knowledge gap(s) of industry:– Common problem– Best solved by working together– Timed success that aligns to business needs– Best manifested on complex far reaching issues– Often includes reliability testing & verification

•Requires teamwork across multiple levels of the supply chain:– Ensures efficient alignment of goals and investments of the varied team players;– Supports the company’s commercial interests.

•Delivers a coordinated industry wide response and capability set. – OEM/ODM/EMS/OSATs/Suppliers at multiple levels.

Sweet Spot for iNEMI Projects

CONCEPT

DEFINITION

PLANNING

LAUNCH

EXECUTION

CLOSURE

2

3

4

5

6

iNEMI Project Development Process

“ Project”Limited to committed Members

“ Initiative”Open for Industry input

1

------------------- iNEMI Technical Committee (TC) Approval

iNEMI Project Management Policy

• Two governing documents for projects• Statement of work (SOW): sets out

project scope, background, purpose, benefits, and outlines required resources, materials, processes, project schedule, etc.

• Project Statement (PS): signed by participating companies to secure commitment on resource and time contributions.

• iNEMI Project requires iNEMImembership• Signed membership agreement• Commitment to follow iNEMI By-laws and IP policy

8

Sign-Up Due on July 31, 2020

• iNEMI membership is required to join the project• Download SOW and PS from iNEMI web:• https://community.inemi.org/content.asp?admin=Y&contentid=653

• Sign the PS• Signature of representative of participants• Signature of manager approval• Send scanned PS to infohelp@inemi.org

• iNEMI VP of Operations will sign and approve your participation and send you back the completed PS with acceptance

• Join iNEMI membership, or questions, contact Haley Fu (haley.fu@inemi.org)

9

Package Warpage Prediction and Characterization (Phase 5)

Chair: Kang Eu Ong, Intel

Motivations

11

Package Warpage CharacteristicBoard Warpage Characteristic

Board Assembly Parameters

Material selections: solder paste, flux

• Packaging technology is aggressively evolving to meet new user demands and requirements.• Thin and mobility devices• Energy efficient & Highly integrated SOC/SIP/SOP/Embedded Technology• Higher interconnect density with finer BGA pitches• Higher package and board assembly yield expectations

• Dynamic warpage characteristic of electronic package is critical for seamless board assembly. Hence this effort is to understand the kind of dynamic warpage demonstrated in industry.

iNEMI: Warpage Characteristics of Organic Packages Phases

iNEMI Technology Roadmap 2013•Identify package warpage as key challenge

Phase 1 (2011-13)•Literature survey•Establish metrology correlation between sites and increase awareness

•Reaching out to industry for component donation

•(Forming & Storming)

Phase 2 (2013-2014)•Establish current technology package dynamic warpage (POP, PBGA, FCBGA)

•Measurement protocol (effect of “As Is”, “Bake” and Moisture Exposure Time (MET)) and sample size needed.

•(Norming)

Phase 3 (2015-2016)•Continue establishing technology package dynamic warpage (all kind)

•Dynamic warpage measurement metrology assessment.

•(Performing)

Phase 4 (2016-2017)•Continue establishing technology package dynamic warpage of new package technology (all kinds)

•Leverage previous characterization effort to study the impact of Low Temperature Solder on dynamic warpage requirement

•Collaborate with simulation software supplier to derive modeling approach to better predict the dynamic warpage

Package Technology For Dynamic Warpage Measurement

13

Generous Donation of Samples from Industry

Focusing on new and advance package technologies such as 3D packages, embedded die, silicon interposer etc.

Pictures are mainly for illustration only

14

Plethora of Dynamic Warpage Data

Common Warpage Characterizations

Modeling Multi-physics in Assembly Process

Incoming Materials

•Package Design –manufacturing variation

•Substrate warpage variation

•Die Warpage•Raw materials (different material characteristics)

Electronic Package Assembly

•Process Steps•Temperature exposure

•Time effect (Viscoelasticity and creep)

•Mechanical loading

SMT Assembly

•Reflow Temperature/Transient Thermal exposure and distribution

•Mechanical interaction

•Board level SJR•Yield

Chip Attach

•Mass Reflow

•TCB•Non-Conductive Paste or Film

Encapsulation & Molding

•Underfill•Injection or Compression Molding

•Molded Underfill

Lid Attach (if applicable)

•Mechanical loading

•Adhesive•Thermal Interface Material

Ball Attach

•Mechanical loading

•Reflow temperature

Test and Final Inspection

•Mechanical loading

•Coplanarity/Warpage

Predicting electronic package warpage and managing dynamic warpage still remain as a heavy lifting effort and difficult for industrial.

A practical warpage prediction model is critical to drive more advance package design and risk management.

Modeling Case Studies with Moldex3D and General FEA Tool in Phase 4

16

Coupled mold flow, curing kinetics, visco-elasticity and shrinkage and conjugate heat

transfer in one environment

Flow viscosity

Curing kinetics

PVTC

Viscoelasticity

Stage 1: Compute for1.In mold filling and

curing stage2.Induce residual

stress and shrinkage based on degree of cure and pressure

Stage 2: Compute for1.Post mold cure stage2.Subsequent Thermal

exposure stage

Filling Curing Post mold cure deformationNon-linear material + heat transfer +

displacement analysis

FEA

FEA

Project Scopes in Phase 5 SOW

• Characterize emerging electronic packaging technology dynamic warpage behavior to develop a better understanding of the package construction and latest material development. For example:• Silicon interposer with different package stiffeners and constructions for Heterogeneous Packaging Solution.• System in Package/Multi Chip Package (BGA) with different packaging types.• Embedded Package (embedded silicon, actives and passives).

Dynamic warpage characterization of latest packaging technology

• Derive a reliable modelling framework (model generation, material parameters, simulation capabilities) to predict package warpage• Material properties characterization – especially PVTC (Pressure Volume Temperature Cure) & Visco-

elasticity of polymer used in packaging – this will help us to understand the impact of curing process induced warpage (e.g. substrate, mold).

• Derive the parameter of PVTC and other non-linear properties for material model which is currently lack of due to the complexity and software capability.

• Provide opportunity for simulation software provider to validate or develop material model for further electronic packaging capability needs.

• Conduct experiment to quantify how warpage evolves during the assembly (substrate or package).

Package Warpage Prediction Framework

17

Phase 5 SOW High Level Schedule

18

Some pre-work has been completed during the definition phase 5 to obtain commitment from stakeholders.

Project IS / IS Not

19

This Project IS: This Project IS NOT:Warpage Characteristics of Organic Packages

Investigation of organic substrate based packages to establish dynamic warpage trends

Not the development of a specific standard(s)

Enticing participation by offering real evaluations through anonymous reporting

Not an evaluation of first level interconnects (C4 joints)

Characterize the existing package available in industry warpage behavior and compare to the 2017 iNEMI Warpage Allowable roadmap (i.e., the complete mapping of components over a complete temperature range)

Not a repeat of prior or existing work

Provide data, input, and make recommendations to identified standards for modifications / improvements to the standards

Not a Package reliability study

Not biased towards specific suppliers, geographies, or market segments (impartial)

End in mind

Business Impact• Establish current state of package warpage behavior in industry and

project the future roadmap of allowable package warpage• Establish the best use of FEA software in optimizing dynamic warpage

for any given package technology and identify areas of improvement• Based on above, it can lead to refinement of electronic industry

standards

Outcome of Project• Characterize the dynamic warpage behavior of latest and greatest

package technology.• Provide data, input, and make recommendations to identified

standards bodies for modifications / improvements to the standards• Establish potential areas of FEA development to improve dynamic

warpage predictive capability• Project report and sharing Project Results: it is expected that a

detailed summary of the evaluations will be provided to the full iNEMI membership at the conclusion of the project

20

Donations

• We would like you to provide:• ~10 units of organic packages which have gone through the complete package assembly process.

These packages do not need to be functionally or electrically perfect; it can be test vehicle or dummy package.

• If more than10 units provided, then we can run additional evaluation to look at effect of environment staging and bake.

• A brief description of package geometry, ball pitch and ball size used.

• As many designs, in as many design envelopes/market sectors as you can supply • Raw materials (mold, substrate build up etc.) for characterization and modeling parameter.

• There will be no:• Reverse engineering of the design or package construction (the packages provided will on be only used

for Dynamic warpage measurements)• No mention of your company in relationship to any design or suppliers (blind test)

• All units will be destroyed once the measurements have been completed unless otherwise instructed.

• You will receive in return:• The Dynamic Warpage Characteristic of your components (including room temperature through

assembly temperatures and back down again)• A summary of the Dynamic Warpage Characteristic of all package warpage data collected within your

design envelope (blind test, no names of companies or products will be provided)

21

High Density Interconnect Socket Warpage Prediction and Characterization

Chair: Renn Chan Ooi, Intel

Key Challenges in Large Sockets

Background• Increasing trend in pin count numbers à large sockets.• Majority of simulation computation consumed by flow analysis

in pin hole region.

Key Challenges• Ability to speed up computation is desired to shorten socket

design cycle.• Understanding of fiber filled material sensitivity on warpage. • Impact of socket design and process condition on warpage.

23

High density interconnect sockets (CPU)

Example socket flow simulation (source: Moldex 3D)

Materials• Base Resin• Filler properties

Housing Design• Pin hole region• Housing frame

Process Condition• Injection Molding• Chase cooling• Etc.

Socket Housing Warpage

Project Purpose & Scope

Project Purpose• Reduce the impact of socket warpage on PCBA yield and reliability. • Characterize the impact of molding and design on large size socket warpage.• Develop socket warpage measurement guideline and prediction methods for large size socket.

Project Scope• Conduct Literature survey on socket warpage related work.• Derive simplification on simulation gaps for dynamic warpage prediction and faster time to

market.• Establish framework with between material supplier to understand LCP material sensitivity and

potential high temperature re-crystallization.• Establish socket warpage measurement metrology and methods.• Demonstrate the impact of socket design and material properties on warpage.• Derive the expected socket warpage as a function of socket size (>50x50mm).

24

Project Scope: IS/IS NOT Analysis

25

This Project IS: This Project IS NOT:To investigate socket warpage for large size flip chip packages

To repeat of prior or existing work (required extensive literature survey)

To focus experiment on the impact of the materials, molding process and design features on socket warpage

To be an evaluation of socket interconnects (C4 joints)

To leverage donated sockets to derive key learning on factors that affect the socket warpage (i.e., the complete mapping of components over a complete temperature range).

To be biased towards specific suppliers, geographies, or market segments (impartial)

To collect data and develop recommendations for industry and potential standards To develop a specific standard(s)

To be a reliability study

Resource Requirement

26

Resource / Capability NeedsMaterial / Components LCP material for socket housing

PCB for socket SMTTest Vehicle Injection molding process and tooling for socket housing building

Socket pin insertion (stitching) and solder ball attachSMT reflow of socket on PCBPCB and socket TV design

Measurement & Test LCP materials properties readily available in simulation software database.

Room temp & dynamic warpage measurement of socketFA cross section on socket and housing

Simulation Software Simulation software and analysis for flow and warpage predictionSimulation analysis for pin grid area simplificationDynamic high temperature post mold warpage simulation; with thermal gradient

Key Tasks

Key Tasks• Task 1 – Project Plan, Industry & Literature Review• Task 2 – Material Selection• Task 3 – Material Framework Setup• Task 4 – Flow and Warpage Simulation 1• Task 5 – TV Setup with Selected Material• Task 6 – TV Building with Selected Material• Task 7 – Warpage Measurement • Task 8 – Flow & Warpage Simulation 2• Task 9 – Project Completion Summary

Tasks on Secondary Activities• Task 10 – Explore: Dynamic Warpage Measurement• Task 11 – Explore: Warpage Mitigation During SMT

27

Schedule & Milestones

28

Q&A