India Semiconductor · PDF fileMaxim Integrated Products, Inc. Company Confidential 3 India Semiconductor Association CXO Conclave Maxim Integrated Products, Inc. Company Confidential

India Semiconductor Association CXO Conclave

Vijay Ullal Group President

Consumer & Automotive Solutions Maxim Integrated Products

Maxim Integrated Products, Inc. Company Confidential 3

India Semiconductor Association CXO Conclave


Semiconductor Industry Trends 1

Adapting to These Trends 2

Future Engagements in India 3

Q&A 4


Semiconductor Industry Trends

System-Level Solutions

Integration

Sensors – The Third Revolution

The End of Lateral Scaling?

Complex and Global Eco-system

Semiconductor Industry Trends 1


Why System Level Solutions?

Time-to-Market

Complexity

Expertise Performance

R&D Budgets


Why Integration? Smaller, lighter, faster, simpler, cheaper

1980s 2000s Today

Phones

Computers

Wireless Communications

Automobiles


Why Integration? Smaller, lighter, faster, simpler, cheaper

Automotive • Space, weight • Fewer parts = reliability

Energy • Simplicity, TTM

Computing • Size, simplicity Communications

Infrastructure • Size and power Consumer

• Space, cost. power

Mobile • Space, battery life

Medical/Industrial • Portability, reliability


Analog Integration An Irreversible Trend

Amp Data Converter

Interface Power

Building Blocks

System Solutions

Analog Integration

1 2 3




Sensors: The Third Revolution

Robots that never get tired or grumpy

• Example: cars that drive themselves

Gadgets & homes that are always aware

• Example: Phones & homes that adapt to the user

Systems that monitor & heal themselves

• Example: smart energy grid



Is Lateral Scaling Dead?

$0

$10

$20

$30

$40

$50

1980'S 2000'S

Development Costs, $M

$1

$10

$100

$1,000

$10,000

2um 65nm

Mask Costs, $K


Companies Receiving Initial Venture Funding


Complex and Global Eco-system

IDM

1960’s

IDM

1970’s

Semi Equip

IDM

1980’s

Semi Equip

EDA

IDM

1990’s

Semi Equip

EDA

Outsource Mfg.

IDM

2000’s

Semi Equip

EDA

Outsource Mfg.

SOC

IDM

2010’s

Semi Equip

EDA

Outsource Mfg.

SOC

Software


How is Maxim Adapting to These Trends?

Embracing and Leading the Integration Trend

Organizing by End-Market

Investing in Sensors

Developing 3D Technologies

Partnering Globally in R&D and Manufacturing

Refining Culture

Adapting to These Trends 2


High-Performance Analog Better designs start with better building blocks

High density, high efficiency

Highest ESD & fault protected transceivers

Industry leading temp accuracy Multichannel Low

power high precision

Most flexible supervisory products

Highest precision and smallest packages

Robust 8kV ESD rating, latch-up immunity

Lowest power with highest precision

Multichannel, low power, Automated Calibration


Embracing and Leading Analog Integration Solving Tough Technical Problems

Different Analog Processes

Different processes for each technology

Mixing Analog and Digital

Advanced process

for both types

Interference and Noise

Isolating analog and

digital crosstalk


Analog Integration – Mobile Power SoC 64% smaller with 37% fewer components

Applications Processor

Baseband Processor

Analog Integration

Competing Solution

Maxim Solution

IC Count 9 2

IC Size (mm2) 161 38

Component Count 121 76

Component Area (mm2) 321 117

Handset Motherboard


Embracing and Leading Analog Integration Other examples

Full system design with case Secure micro for data

encryption

Financial Terminals

USB camera on a card Full 1080P streaming

capabilities

IP TV Camera

Smart meter platform Industry leading accuracy to

0.1%

Smart Meters


Embracing and Leading in Analog Integration

18% 18% 20% 26% 28% 32% 33% 34%

82% 82% 80% 74% 72% 68% 67% 66%

CY06 CY07 CY08 CY09 CY10 CQ111 CQ211 CQ311

High Integration

Building Block

% of Maxim Business from Integration


Organized By End-Markets Technology, Business Unit and Sales

Americas & Global Distribution

Europe, Middle East & Africa

Japan

Korea

Pacific Rim

Customer Operations

Marketing

Sales Operations

Automotive

Battery & Industrial Power

Communications &

Timing

RF Solutions

System & Power Management

System Sensing &

Interconnect Products

Storage

Office of the CTO

Maxim Labs

Advanced IP Development

EDA

Process Development

3DHI & WLP

Communications & Power Solutions

Group

Audio

Automotive

Handheld Power

Human Interface

Sensing Solutions

Interface, Switch & Protection

Microcontrollers

Mixed Signal

Secure Info

Signal Processing and

Conditioning

Technology Development &

Innovation Group

Consumer & Automotive Solutions

Group

Industrial & Medical Solutions Group

Worldwide Sales & Marketing

Tunc Doluca

President & CEO


Investing in Sensors

Optical Sensors

Touch Sensors

Gesture Sensors

Inertial Sensors – SensorDynamics

Sensor Fusion - algorithms

Innovations in human interface will transform electronics


Investing in 3D Integration One size fits all process technologies are too complex

180

60

1989 1995 2003 2011

Including 180nm developed for Power SOC and other advanced cell phones

100

10

Tota

l Pro

cess

es

Including 1.2um developed to support high performance power for RF and data communications

Including 0.4um developed for audio DACs and cell phone

Including 3um designed for A/D and D/A


Investing in 3D Integration

Higher density Better heat transfer

Highest integration Most cost effective

Ease of routing As small as 1mm2

Specialized QFN Packages

System-in- Package

Wafer-Level Packages


Partnering Globally in R&D

Integration Tools and Processes

Internal Collaboration and

IP Sharing

Partner with Customers


Partnering Globally in R&D 40 Technology Centers Worldwide Over 2,000 Engineers covering greater than 28 technologies

Dallas, TX Bangalore, India

Catania, Italy

Milan, Italy

Other locations: Arizona, California, Colorado, Florida, Illinois, Indiana, North Carolina, Massachusetts, Michigan, Oregon, Rhode Island, Texas, Austria, France, Germany, Italy, Scotland, Turkey, UK, China, Philippines, Taiwan, Japan

Seoul, Korea

Shenzhen, China

Sunnyvale, CA


Partnering Globally in Manufacturing Flexible “Hybrid” Manufacturing Capacity to support $3.4B in revenue

Maxim Wafer Fabrication Facilities

Partner Foundries (Maxim Process) Merchant Foundries

Beaverton, Oregon

San Antonio, Texas

San Jose, California

Seiko-Epson Japan

Powerchip, Taiwan (200mm)

Powerchip, Taiwan (300mm)

TSMC, Taiwan Partner


Partnering Globally in Manufacturing High Volume Assembly and Test Capabilities

Maxim Assembly and Test Locations

Partner Assembly & Test Houses Maxim Bump Fab

Batangas, Philippines

Cavite, Philippines

Chonburi, Thailand

Dallas, Texas

ASE Taiwan

UTAC Thailand


Refining Our Culture

Core Values Build on Our Principles

Collaborate “One Maxim”

Maximize Your Potential

Make a Difference

Innovate “Be Bold”


Future for Maxim in India

Continue to attract the best R&D talent

Provide the right environment for this talent

Empower local leadership

Partner for firmware, software and algorithms

Partner with India’s top academic and research institutions

Future Engagements in India 3


Summary

The semiconductor industry continues to evolve with

> System level solutions leading to analog integration

> Sensors and changing economics of lateral scaling

> A more complex and global eco-system

We need to rapidly adapt to and lead these changes by

> Embracing and Leading the Integration Trend

> Organizing by End-Market

> Investing in Sensor and 3D Technologies

> Partnering Globally in R&D and Manufacturing

> Refining Our Culture

We will continue to invest in India as a major R&D Center

Documents

India Semiconductor · PDF fileMaxim Integrated Products, Inc. Company Confidential 3 India Semiconductor Association CXO Conclave Maxim Integrated Products, Inc. Company Confidential