Upload
dangdien
View
213
Download
0
Embed Size (px)
Citation preview
© IMEC 2015
200mm
pilot
line Silicon
solar cell
line
Organic
solar cell
lineNERF
lab
300mm
pilot lineNano
Bio labs
▸ World-leading R&D in nano-electronics
▸ International top talent in a unique >1B€ leading-edge fab infrastructure
▸ Delivering industry relevant technology solutions serving ICT, Healthcare and Energymarkets
▸ 400 M€ R&D budget, 85%direct from industry
▸ 2300 people
▸ HQ in Leuven, Belgium
▸ 6 sites worldwide
IMEC
Belgium
Netherlands
Taiwan
office Japanoffice
USA
China
India
imec HQ
HISTORY
Established by state government of Flanders in 1984
Independent not-for-profit organization
Initial investment: 62M€
Initial staff: ~70
‣ World-leading research in nano-electronics
‣ Combining scientific knowledge with the innovative power of global partnerships in ICT, healthcare and energy
‣ Leading to Industry-relevant technology solutions
‣ Leveraging international top talent in a unique high-tech environmentcommitted to provide building blocks for a better life in a sustainable society
IMEC MISSION
IMEC HQ R&D CAMPUS
Leuven, Belgium
200mm
pilot line
4800 m2
24/7Silicon solar
cell line
Organic
solar cell
line NERF
lab
300mm
pilot line
4200 m2
24/7
Nano
biolabs
>1 B€ R&D Infrastructure
MEMS, Sensors, Photonics
CMORE
Lithography Devices Interconnects
CORE CMOS FLEXIBLEELECTRONICS
INTERNET OF HEALTH
Wearables
Life sciences
INTERNET OF POWER
Photovoltaics/storage
Power devices
INTERNET OF THINGS
Sensing &
connectivity solutions
IMEC INNOVATION PLATFORM
IC
Link
Flexible
partnership
Shared IPShared Risk/CostGeneric Building Blocks – Pre Competitive
Proprietary IPFull Cost
LVP/Tech Transfer
Open
+
Proprietary R&D
Prototype &
Product
Dev’t
Open Research
Programs
FLEXIBLE BUSINESS MODELS
EUV Sensors Electron Detectors
Bio-Photonic sensors
Hyperspectral image sensors
IMEC CONFIDENTIAL
PCR-on-chip
IMEC LOW VOLUME PRODUCTION
DNA Sequencing chip
© IMEC 2015
LamRESEARCH
SY
STE
M
Kuwait University
IDM
/Fo
un
dry
/OSA
TEq
uip
me
nt/
Ma
teria
ls
Fa
blit
e/l
ess
NEDI
IMEC R&D ECOSYSTEM
-Responsiveness
Operational
Excellence Innovation
Global
Partnerships
Unique
Infrastructure
Top
Talent
COMMITTED TO A CULTURE OF …
MEMS, Sensors, Photonics
CMORE
Lithography Devices Interconnects
CORE CMOS FLEXIBL
EELECTRONICS
INTERNET OF HEALTH
Wearables
Life sciences
INTERNET OF POWER
Photovoltaics/storage
Power devices
IMEC INNOVATION PLATFORM
INTERNET OF THINGS
Sensing &
connectivity solutions
© IMEC 2015
SENSOR
NETWORKS
WIRELESS
COMMUNICATION
SENSOR
TECHNOLOGIES
Interconnection becomes
massive & heterogeneousat
ultra-low Power & cost
© IMEC 2015
Dumb systems
Adaptive systems
Smart systems
Perceptive systems
act how they were hardwired
act how they were programmed
Heterogenoussmart systemsAct on all available data from own sensors and the cloud
act on theirown sensors
sensing communication&
IOT + CLOUD = PERCEPTIVE SYSTEMS
imec solutions for Ultra Low power & Cost
Sensors
Sensor I/F Processing ULP Radio
Power Management
Battery / Harvesting
IoT sensor Node
MultiSensorSOC
RF energy
transfer
Near Threshold Computing
Smart Algorithms
Core Logic
Configuration Memory
Data memory
Data memory Instruction memory
Instruction memory
Instruction memory
Reconfigurable memory
Reconfig. memory
PMIC
Memory
© IMEC 2015
IMEC’S 5G CONNECTIVITY SOLUTIONS
Cellular: Any band – 3 GbpsConnectivity:Any band – 10 Gbps
TX1
RX1
ReconfigurableRFIC in ≤ 28nm
CMOS
TX2
RX2
RX3RX4
AT
Reconfigurable FEM in SOI CMOS and/or 3D packaging
`
AT`
RF bandwidth 57-66GHzIndoor (WiGiG) & Outdoor (Backhaul)Up to 4.6Gbps speed10m (indoor)–300 mm (outdoor)
Scaldio Phara
© IMEC 2015
NEXT GENERATION RECONFIGURABLE RADIO TRANSCEIVER IN
28NM CMOS : A GIANT LEAP IN PERFORMANCE, POWER AND AREA
▸ Digital Transmitter
- ~50% lower power and area versus Direct Conversion Arch.
- Cellular (2G,.., LTE Advanced) and Connectivity (802.11a/b/g/j/n/ac) and 802.11p for V2V and V2I
▸ 0-6GHz Low-noise Frequency synthesizer
- 256-QAM up to 5-6GHz band for 802.11ac @ 13mW
- GSM phase noise spec
▸ Low power reconfigurable Receiver
- 0.4-6GHz, NF down to 1.8 dB, < 40mW, 0.6mm2
▸ Record efficiency ADC
- Up to 13 bit, 300MS/s @ ~3mW
© IMEC 2015
PHASED ARRAY RADIO IN 28NM: VERY ENERGY EFFICIENT
RF bandwidth 57-66GHzIF bandwidth 0-880MHzUp to 4.6Gbps speeds @ 1m (MCS12)1.5Gbps up to 10m (MCS6)Antenna interface loss 0.5dB @ 60GHzPDC < 1W for TX & RX together“Beamsteering time” < 500nsec
© 2014 InterDigital, Inc. All rights reserved. 68Creating the Living Network
MILLIMETER WAVE SMALL CELL BACKHAUL
• System-oriented approach to
develop future small cell platform
• High throughput over range
suitable for urban small cell
• 60GHz Phased Array with
electronic beamsteering reduces
installation cost an provides
interference management
• Leverage high volume WiGig
baseband
• Low-Cost, High Capacity, Scalable
design for today’s Small Cell
Backhaul and future 5G millimeter
wave access
INTERDIGITAL, IMEC AND PERASO DEMONSTRATE WORLD’S FIRST WIGIG®-BASED
MILLIMETER WAVE MESH BACKHAUL SYSTEM
0
200
400
600
0 1 2 3 4 5GbpsM
ete
rs
OpenFlow-based
Mesh Controller
Deployment Tools
EXPECTED RANGE
VS. RATE
InterDigital’s EdgeHaul™
Platform
Results assume QPSK and 16 antennas
Imec-InterDigital
Backhaul module with
integrated phased array
© IMEC 2015
ULTRA LOW POWER WIRELESS
World’s lowest power with state-of-the-art performance
400 MHz
medical
2.4 GHz proprietary1mW@1Mbps
802.15.6 & proprietary2.2mW@2Mbps
900MHz / 2.4GHz RFID150µW @100kbps
0.7V operation
Digital
transceiver
Personal Area
Network
ULP WiFi
for sensors
Sub-GHz
802.15.4g
IR UWB
radio
platform
6-9GHz, 6mW@1MbpsIndoor positioning & audio streaming
Body
Area
Network
radio
Event
Driven
radio
2.4GHz multi-standard5mW @1Mbps
90nm
9mW Rx150dB link budget
5mW Rx16QAM, OFDM
BLE SoC
ARM-Cortex
2.4GHz multi-standard3.7mW Rx 2.4GHz self-tuned
direct phase demodulation
multi-
standard
for IoT
Dual mode digital Tx
90nm CMOS 40nm CMOS 28nm CMOS
900MHz rectifier&PMU
RF power
transfer
© IMEC 2015
IMEC SENSOR CONNECTIVITY PROGRAMS
802.11ah sensor radio
Target the sensor node; not the router
Mandatory modes: BPSK, QPSK in 1-2MHz bandwidth
100kbps for >1km
TX<12mW@0dBm
RX<5 mWFocus on deep sleep
Sub-GHz radio for smart buildings
Regional ISM bands
802.15.4g, KNX, WMBUS
Smart utilities, M2M and home automation
1-400kbps Rx @4mW >13dBm Tx @3-50mW
Focus on deep sleep, >120dB link budget
2.4GHz multi-standard radio
SoC 40nm
BT-LE, ZigBee
ULP connectivity & healthcare
0.25-2Mbps
5mW @1Mbps
Complete SoC + SW stack
74
© IMEC 2015
WIFI FOR SENSORS
Lowest Power:
Target TX < 12 mW @ 0dBm
Target RX < 5 mW
>1 km distance
Pre-standard compliant System
IEEE 802.11ah Timeline
WG Letter BallotsIEEE-SA Sponsor
BallotsFinal 802.11 WG
Approval
Standards Board Final or continuous Process
Approval
Nov 2013 Nov 2015 Jan 2016 Mar 2016
Source: official IEEE 802.11 working group project timelines
© IMEC 2015
AUTOMOTIVE RADAR TODAY: MOSTLY 24 GHZ, SIGE
Short Range Radar (SRR)<30m – 150°
Blind Spot Monitoring, Park Assist
Medium Range Radar (MRR)80m – 90°
Autonomous Emergency Braking
Long Range Radar (LRR)250m – 20°
Adaptive Cruise Control
Short Range Radar (SRR)30m – 150°
Side Impact prevention
Innovative 79GHz radar with a 2 GHz bandwidth –comparison versus 24GHz radar :• radar and antenna size are much smaller versus 24GHz• higher accuracy in Doppler resolution at higher carrier frequency• higher range resolution / object separation by distance by higher BW
IMEC WORKS AT THE IC, ANTENNA MODULE,
PLATFORM, SYSTEM MODELLINGIC module platform
integrated circuit containing the core
functionality
carrier containing antennasand mounted ICs,
similar form factor to product
carrier containing module, components and connectors,
complemented with computation component (PC, FPGA or similar)
for demonstration
© IMEC 2015
IMEC MM-WAVE RADAR ICS
1.2
mm
1.1mm
Tx
Rx
2015
Tx
28nm CMOS2.16 x 1.26 mm260mW @ 0.9/0.95V
35 dB RX Gain6.2 dB RX NF75 to 83 GHz RX Tuning Range1.5dBm RX 1dB compression point
includes Tx-Rx spillover rejection
28nm CMOS1.1 x 1.2 mm120mW @ 0.9V
>11 dBm TX power>10% Tx efficiencyETSI mask compliantcovers 77 & 79 GHz
World’s first high-resolutionlow-power CMOS radar
TRX
lab ranging experimentsconfirm high resolution
PHADAR28A PHADAR28B
© IMEC 2015
2012: system design
2013: transmitter
2014: transceiver
2015:SoC integration
2016:MIMO radar
2015
2014
IMEC 79 GHZ RADAR ROADMAP
2012 20182013
2015
2017
2017:
complete solution
in 1cm x 1cm package
© IMEC 2015
RADAR
EVOLUTION
fixed
mobile
automotive today
imec 79 GHz automotive
imec 140 GHz with antenna-on-chip
yesterday
tomorrow
© IMEC 2015
140 GHZ FULLY-INTEGRATED PERSON-DETECTION SENSORJohn’s home!
Let’s cool down the place.Baby Jane approaching!
Let’s switch off and lock the door.
Miranda looks tired!
Let’s dim the lights.
Mike looks angry!
Let’s offer him a drink.
Natasha’s head too close!
Let’s reduce the heat.
Francis is too far from the left speaker!
Let’s increase its power.
low-cost,low-power, miniatureperson detection
and micro-Doppler sensor
Frank is drowsy!
Let’s suggest a break.
© IMEC 2015
building blocks&
system design2016 single-antenna
transceiver2017array
&demonstrator
2018
NEW 140 GHZ RADAR SENSOR PROGRAM
140 GHz IC R&D
system & app development platform
PA
on-chip antenna
measurement setup
frequency generation
transmitter
receiver
transceiver
antenna array
demo code
digital code
link budget
micro-Doppler parameters
demo platform
IC baseband integration
© IMEC 2015
IMEC IMAGE SENSORS
Machine Vision
High-end
transports,
security &
surveillance
Space, Physics &
Scientific
Life-Science
& Medical
Imaging
Industrial
Instrumentation High speed
Low noise
Low power
Radiation
Hard
Non-Visible
sensing
High QE
Spectral
sensing
Key features:
Desi
gn
in
novati
on
Pro
cess
Tech
no
logie
s
+
© IMEC 2015
IMAGER PLATFORMS
CMOS
module
FlexCIS
module
TDI
module
High-speed
module
BSI-3D
module
HSI
module
ARC
module
3 KEY
PLATFORMS›
© IMEC 2015
TECHNOLOGY MODULES
HSI
MODULE
ARC
MODULE
PASSIVE
CARRIER
WAFER
LIGHT
OX-OX
BONDING
10%
30%
50%
70%
90%
250 350 450 550 650 750 850
QE
Wavelength [nm]
MEASURED QE
UV
VIS
ARC
POST-PROCESSED
CAVITY FILTERL
TX [%]
FWHM ~
5-20nm
© IMEC 2015
IMEC DESIGNTECHNOLOGY
IMAGER PLATFORM
PROTOTYPES›
LOW-NOISE TDI PLATFORM
HIGH-SPEED HIGH-QE PLATFORM
MONOCHROME COLOR HSI
GLOBAL SHUTTER
2.5-5µm
2-8Mpix
1000fps
70dB DR
70-90% QE
OPTIONS:
CCD TDI IN CMOS
5µm
512 stages
>0.99995 CTE
>50kHz line rate
MONOCHROME HSI
OPTIONS:
© IMEC 2015
IMEC WAFER-LEVELPOST-PROCESSING
INTEGRATED
HYPERSPECTRAL FILTERS›
CONCEPTCOMMERCIAL
PARTNERS
TX [%]
FWHM ~
5-20nm
POST-PROCESSED
CAVITY FILTERL
CUSTOM
NARROW-
BAND FILTERS420nm-1000nm
IMPLEMENTATIONS
MOSAIC
LINE-SCAN
TILED
RGB | Hyperspectral
Vegetation monitoring applications● Genotyping● Phenotyping● Biodiversity● Invasive species● Environmental stress● Climate change
MEMS, Sensors, Photonics
CMORE
Lithography Devices Interconnects
CORE CMOS FLEXIBL
EELECTRONICS
INTERNET OF POWER
Photovoltaics/storage
Power devices
IMEC INNOVATION PLATFORM
INTERNET OF THINGS
Sensing &
connectivity solutions
INTERNET OF HEALTH
Wearables
Life sciences
© IMEC 2015
It is about truly personalized health and lifestyle solutions,
and making health management mobile, ubiquitous and convenient.
It is about advanced wearable platforms on new body
locations and advanced smart peripherals around us.
Expand beyond monitoring – opportunities for feedback, for
coaching, for stimulation, for treatment, for prevention.
VISION WEARABLES
© IMEC 2015
ApplicationsData
ScienceSystems
Circuits
& SensorsTechnology
INTEGRATED APPROACH: HELPING OUR
CUSTOMERS SHORTEN THEIR TIME-TO-MARKET FROM TECHNOLOGY BUILDING BLOCKS TO FULL APPLICATION VALIDATION
imec key strengths: we can provide all the necessary key ingredients that enable your product using customer components and unique imec components
© IMEC 2015
• Actimetry / Activity Monitoring
• Energy Expenditure (EE)
• Cardiorespiratory fitness (CRF)
• Health coaching
• Rehydration / dehydration
• Stress / relaxation
• Mental engagement / cognition
PERSONAL HEALTH:
PREVENTION THROUGH HEALTHIER
LIFESTYLE
KEY PERSONAL HEALTH
APPLICATIONS
BIO-IMPEDANCE
POSTURE
ACTIVITY
HEART RATE
HEART RATE VARIABILITY
MULTI-
PARAMETER
PATCH
imec TECHNOLOGY TO IMPROVE THE
CARE AND QUALITY OF LIFE
Day 1-1 Day 1-2 Day 2-1 Day 2-2 Day 3-2 Day 3-3
imec TECHNOLOGY
UNDERGOING CLINICAL TESTING
Day 1-1 Day 1-2 Day 2-1 Day 2-2 Day 3-1 Day 3-2 Day 4-1 Day 4-2
BODY FLUID
1. Prevent readmissions 2. Monitor treatment efficiency
BIO-IMPEDANCE
Day 1-1 Day 1-2 Day 2-1 Day 2-2 Day 3-2 Day 3-3
imec TECHNOLOGY
UNDERGOING CLINICAL TESTING
Day 1-1 Day 1-2 Day 2-1 Day 2-2 Day 3-1 Day 3-2 Day 4-1 Day 4-2
BODY FLUID
1. Prevent readmissions 2. Monitor treatment efficiency
BIO-IMPEDANCE
Belli
From Bloom.
A medical-grade smart
device designed for women
www.bloom.life
Empowered by imec’s ULP SOC
CAPTURING A 360˚ VIEW OF MATERNAL & FETAL HEALTH
Stress Calorie Expenditure
FetalHeart Rate
Contractions
FetalMovement
Activity
Heart RateVariability
Heart Rate
Sleep
© IMEC 2015
IMEC & SAMSUNG DEVELOP
SIMBAND PLATFORM
▸ ECG▸ HR, HRV▸ Blood Pressure▸ Bio-Z▸ GSR▸ Actimetry
Based on imec’s ULP multisensor SOC & algorithms
http://www.samsung.com/us/globalinnovation/innovation_areas/
© IMEC 2015
NeuroPro specific EEG system
created with imec circuits and
imec system electronics
FROM PLATFORM TO PRODUCT
“imec-inside”
imec generic EEG development platform
http://www2.imec.be/be_en/press/imec-news/neuropro.html
IMEC MULTI-SENSOR MIXED-SIGNAL SOC
World Lowest Power Sensor Hub for Bio-Medical Applications
Analog + DSP + Algorithms = 750uW in total
multi-sensor interface
embedded signal
processing
power management
A versatile platform for IoT and Wearable Devices
Interfacing with Various Sensors
Flexible to integrate Different Algorithms at Extreme Low Power
Managing batteries and generating supply voltage for the system Connected to
Different Platforms
Energy Efficient and Minimum Package Size
© IMEC 2015
AFE
extension
Dig
ital
Inte
rfac
eAFE
extension
Dig
ital
Inte
rfac
eAFE
extension
Dig
ital
Inte
rfac
e
AFE
extension
Dig
ital
Inte
rfac
e
Analog Expansion
I2C
Analog
What is inside MUSEIC?
Generic
AFE
Dedicated
AFE
Generic
Digital
Dedicated
Digital
Power Management
Standard Digital Interface
Well Established COTS Sensors
TemperatureoC
Flow
m3/h
Rotationo/h
Acceleration
mg
Pressure
Pa
I2C, SPI, or UART
Analog
Standard CompliantBiomedical Sensors
Electrocardiogram
ECG
ElectroEncephalogram
EEGElectromyogram
EMG
Photoplethysmograph
PPG
Bio-Impedance
Bio-Z
Galvanic Skin Response
GSR
AnalogSample Rate Conversion
Fourier Transform
FFT, DFT Wavelet Transform
CWT, DWT
Encryption
AES128
Supported with Dedicated HW
Accelerators
Accurate time stamping
Filters
FIR, CIC
Generic Digital
© IMEC 2015
Using MUSEIC for different applications
MUSEICGEN I
MotionSensor
BTLE
PressureSensor
FLASHStorage
Activity Monitoring Device
MUSEICGEN I
MotionSensor
BTLE
FLASHStorage
Portable EEG (up to 16 leads)
AnalogExtensio
n
AnalogExtensio
n
AnalogExtensio
n
MUSEICGEN I
MotionSensor
BTLE
FLASHStorage
ECG Patch (Bio-Z & 3-Lead ECG)
Display
EEGelectrodes
MUSEICGEN I
MotionSensor
BTLE
FLASHStorage
Sleep Monitoring (EEG, EOG, EMG)
AnalogExtensio
n
AnalogExtensio
n
EEGelectrodesEOG
Electrode
EMGElectrode
Battery
Battery Battery
Battery
ECGand Bio-Z electrode
© IMEC 2015
IMECs MULTI-SENSOR HUB (MUSEIC) ROADMAP
MUSEIC Gen 2 MUSEIC Gen 3
Available
MUSEIC Gen I
2016
7mm x 7mm
New Integrated Sensors:
Integrated PPG
Wide Band Bio-Impedance
Galvanic Skin Response sensor
New Power Management
Efficient LED Drivers
Integrated Power Management with
Buck & Boost converters
New Processor:
Cortex M0+
Sensors:
Biopotentials (ECG, EEG, etc)
Bioimpedance
High Resolution ADC (18b)
Medium Resolution ADC (12b)
Processor:
Cortex M0
1Mbit SRAM
Hardware Accelerators
2017-2018
New Integrated Sensors
New Power Management
Newer Technology Node
More Memory, Lower Power,
Higher Performance Processing
© IMEC 2015
CELL SORTER
In vivo probes
In vitro systems
Cyto-metry
Molecular diagnostics
IMEC’S LIFE SCIENCES
Si nanotechnology for personal
diagnostics
& therapy
BIOREACTORS
• 456 electrodes• On-chip amplification, filters,
analog-to-digital conversion for 52 channels
• Very-low-noise: 4 μVrms• Recording + stimulation
64-site probe
+
10 mm
2 m
100 kg
+
IMEC NEUROPROBES
Many passive probes+
Rack of electronics Integrated onto single chip
VALIDATION
4655 u
m
ch 20
ch 31
ch 37
ch 48
1.38 1.39 1.41time (s)
time (s)
Raw filtered data (0.3-6.0 kHz, 30 kS/s)
1.40 1.42
1.38 1.39 1.40 1.41 1.42
C.M. Lopez, et al. ISSCC Conf., 2013,
San Francisco
© IMEC 2015
PHOTONICS ON TOP OF CMOS
Full photonics chip combined with microfluidics
Not all layers are required for all applications
Back-end of line
Active CMOS (e.g.
pixel)
Bottom cladding
Waveguide layer
Integrated Filter
Top cladding
Microfluidics
Metal Reflector
© IMEC 2015
DEVELOPMENT OF SIN COMPONENT LIBRARY
Waveguides: low losses!
Splitters
Arrayed waveguide & Echelle gratings
Grating couplers
Evanescent couplers Mach-Zehnder & Fabry-Perot interferometers
© IMEC 2015
Granulocyte Red Blood cellLymphocyte
IMEC CELL SORTER
In flow on-chip imaging
& classification of blood cells
sorting speed up to 1000 cells/s per channel
In flow reconstruction of a granulocyte flowing at 1 mm/s
fluidic cell sorter on chip
© IMEC 2015
many $750k machines
single, disposable chip
DNA SEQUENCING ON-CHIP
Single molecule
DNA sequencing
© IMEC 2015
ACCELERATING PRODUCT INNOVATION
7x faster
3x smaller
2x cheaper
Enabled by imec’s photonic chip
PacBio RS II Sequel System
© IMEC 2015
imec PCR-on-ChipDNA amplification in 3 mins
DIAGNOSTICSFOR INFECTIOUS DISEASES
≈20x
faster
imec PCR-on-ChipDNA amplification in 3 mins
© IMEC 2015
•Microfluidic silicon platform fully developed•Mixers, Filters, Microreactors.
•On chip sample preparation•From blood to purified and amplified DNA
•Fast amplification (4 min)
•Multiplex amplification (more fragments in the same reactor)
•On chip selective amplification•Only DNA segments containing SNPs are amplified
•Miniaturized electrochemical detector•1 mL volume
•Dry chemistry
•DNA separation
•Heterogeneous integration of conductive polymer
valves and pumps.
A complex
microfluidic Si chip
Integration of pumps and valve with the
Silicon chip
ON CHIP DNA AMPLIFICATION
DNA
separation
DNA with SNPSNP
© IMEC 2015
Valu
e
80 millioncars/year
2000 milliondevices/year
80,000 millionpieces/year
10,000,000 millionpackages/year
Image: Best Home Appliance
© IMEC 2015
Valu
e
80 millioncars/year
2000 milliondevices/year
80,000 millionpieces/year
10,000,000 millionpackages/year
Image: Best Home Appliance
$100+ billion
OPPORTUNITY
for item level
electronics
Thin-film electronics
Made in very large volumes
on flat-panel display lines
THIN-FILM ELECTRONICS TECHNOLOGY
Form factor
Thin (<25μm) flexible plastic
substrates
Monolithic integration
Sensors, display segments, ...
© IMEC 2015
February 22-26, 2015
San Francisco, CA
“IGZO thin-film transistor based flexible NFC tags powered by
commercial USB reader device at 13.56MHz”
Getting closer to ISO14443 standard data rates
Thin-film RFID/NFC tags – item level IoT
Diode-load
Dual-gate M2
Dual-gate M3
Pseudo-CMOS
[1] Zero-VGS-load
[2] Diode-load
# TFTs/inv 2 2 2 4 2 2
Area [mm2]2.70x2.9
8(8.046)
3.91x3.87
(15.132)
2.70x3.14
(8.478)
4.69x3.36
(15.759)
7x10(70)
3.9x1.5(5.85)
# TFTs 218 218 218 436 1026 222
# VDD 2 3 3 3 2 2
Noise margin<7.4% VDD/2
~36% VDD/2
~40%VDD/2
~24%VBIAS/2
~15% VDD/2
11.6% VDD/2
Datarate
71.6kbit/s
11.3kbit/s
25.8kbit/s
43.9kbit/s
0.05kbit/s
3.2kbit/s
ISO15693
Yes Yes Yes Yes No No
Carrier PEN-film PEN-film PEN-film PEN-film Glass Glass
[1] H. Ozaki, et al., Symposium on VLSI Circuits Digest of Technical Papers, 2011[2] B.-D. Yang, et al., ETRI Journal, Volume 35, Number 4, August 2013
Thin-film ion sensors Thin-film photodetectors
• Printed solid-state ion-selective
electrodes
• pH, Cl-, Na+, K+
• pH: 2-10 pH range, 0.1 accuracy
• Quantum efficiency @ 550nm
• Linear response down to 3.5 nW/cm2
• Dark current <100pA/cm2
THIN-FILM SENSORS
MEMS, Sensors, Photonics
CMORE
Lithography Devices Interconnects
CORE CMOS
IMEC INNOVATION PLATFORM
INTERNET OF THINGS
Sensing &
connectivity solutions
INTERNET OF HEALTH
Wearables
Life sciences
FLEXIBL
EELECTRONICS
INTERNET OF POWER
Photovoltaics/storage
Power devices
© IMEC 2015
Page.4Ver1.6
Lower Loss Lower Cost Smaller Size
IGBT GaN-HEMT
Realization of conversion AC to AC
GaN-HEMT
IGBT GaN-HEMT
Power loss:60% decreaseHigher efficiency than IGBT(99.2% achieved)
Device cost: GaN SiCSystem cost: GaN SiC
Decrease loss by high frequency operationPossible to highly integrated from lateral structure
Merit of GaN power devices
AC F
ilter
3phasemotor
3phaseAC
GAN POWER DEVICES: THE POTENTIAL
SIZE REDUCTION EFFICIENT SWITCHING
© IMEC 2015
EFFICIENT POWER SWITCHING
8” GAN-ON-SI
8” GaN-on-Si
wafer
imec E-mode power device
Au free devices - Si foundry
compatible
Vth >2V, Vbd=200V
Ron = 7 Ohm.mm
Ids@10V > 450mA/mm
No hysteresis
© IMEC 2015
Available today
▸ NO2, NO; ppb sensitivity
▸ Miniaturized sensor on Si
- 8” process flow
- Small 1x2mm2
▸ Hand-held sensor demo with readout
▸ Trial test results in outdoor
environment
2 mm
GAN SENSOR
© IMEC 2015
KEY DRIVERS IN BATTERY RESEARCH
Form-factor
Safety
Fast charging
Volume,Weight
Lifetime
Solid state
Power Density
Energy Density
Mechanical flexibility
Reliability, Cyclability
© IMEC 2015
OUR APPROACH TO SOLID-STATE BATTERIES
WITH HIGH SPEED + HIGH CAPACITY
High speed:
How: Thin electrodes and electrolyte
Target: 80% capacity at 20C (3 min charging)
compared to current 80% at 2C (30 min) wet cell
High capacity:
How: 3D structure (micropillars)
Target: 60-120mAh/cm3
same as effective cell capacity of current wet cells 125-1
50 u
m
250nm
250nm<250nm
© IMEC 2015
OUR TARGET PERFORMANCE FOR SS BATTERY
Reach effective capacity of current wet batteries, but with fast charging capability (5-20C) and thus power
Exceed effective capacity of wet microbatteries (button cells)
3D TFB targets
3D TF SSB
0.5-10 mA.h/cm3
60 -120 mA.h/cm3
25-50 mA.h/cm3
TF-SSB
TF-SSB
Wet cells
cylindrical prismatic
Polymer-gel Button cell
Wet cells
© IMEC 2015
LamRESEARCH
SY
STE
M
Kuwait University
IDM
/Fo
un
dry
/OSA
TEq
uip
me
nt/
Ma
teria
ls
Fa
blit
e/l
ess
NEDI
IMEC R&D ECOSYSTEM