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Renesas Electronics America Inc.© 2012 Renesas Electronics America Inc. All rights reserved.
IGBT Applications In HEV/EV
© 2012 Renesas Electronics America Inc. All rights reserved.2
Renesas Technology & Solution Portfolio
© 2012 Renesas Electronics America Inc. All rights reserved.3
Analog and Power Automotive Products
LED Backlight LCDs Scalable solutions for exterior lighting, relays, solenoids… Ultra-low key-off leakage current
performance Robust protection against short-circuit
conditions
Class-leading turn-off loss High-speed, short-circuit rated, and low
Vce(on) optimized 200A, 300A & 400A bare die
Low voltage family optimized for Qgd x Rds(on) Separate family optimized for pure
Rds(on) performance Low RTH packaging technology
Crash-sensing chipset for airbag applications Powertrain output load drivers,
direct gas injection… Battery management ICs, MOSFET
gate drivers Micro-isolator IGBT drivers for
high-voltage isolation Multi-chip Package devices for switch
input and load control
30V - 1500V in Application Optimized Processes
6 - 200mΩ Protected High-side Drivers
Products Addressing All Major Vehicle Systems600V Discrete Devices
© 2012 Renesas Electronics America Inc. All rights reserved.4
Challenge: Improve efficiency of HEV/EV automobiles.
Solution:Lower inverter losses by replacing MOSFET’s with IGBT’s in high-current applications.
‘Enabling The Smart Society’
© 2012 Renesas Electronics America Inc. All rights reserved.5
Agenda
The purposes of this presentation are: To discuss IGBT technology in general. To discuss the advances that have improved IGBT performance
and lowered costs. To discuss the definition and application of various IGBT
datasheet parameters. To discuss power losses in IGBT switching transistors. To discuss the use of IGBT transistors in HEV/EV applications.
This presentation will focus on applying IGBT transistors in 3-phase inverters for PMSM motor applications.
While the basic principles discussed in this presentation are applicable to IGBT’s used in traction motor inverters, this presentation will focus on lower power applications, which predominantly use MOSFET’s at present.
© 2012 Renesas Electronics America Inc. All rights reserved.7
Switching Applications In HEV/EV
There are many applications in an HEV/EV that require switching transistors: Inverter drives for PMSM motors. Switchmode DC-DC converters and battery chargers. Control of brushed DC motors.
The move to a 48V on-board supply and technological advances in IGBT design are making IGBT’s increasingly attractive in many of these applications.
Battery ChargerA/C
Compressor
Power Steering
Cooling Fan and Pump
Fuel Pump
Traction MotorInverter
Motor/Generator
Transmission Oil Pump
Mirror AdjustSeat Adjust
Windshield Wipers
Windshield Washer
Regenerative Braking Voltage Conversion
© 2012 Renesas Electronics America Inc. All rights reserved.9
IGBT Silicon Structure
Essentially, an IGBT is a PNP Darlington transistor in which the bipolar input transistor has been replaced with a MOSFET. An IGBT is applied like an NPN power transistor. Does not conduct in the reverse direction (a MOSFET does). Does not provide an inherent reverse diode (a MOSFET does). Conducting voltage drop is like a diode – a fixed voltage plus a voltage
that is proportional to the log of the current.– The conducting voltage drop for a MOSFET is like a resistor – a voltage that is
proportional to the current. Contains a parasitic thyristor structure that can latch “on”.
– Better control of geometries and doping levels has virtually eliminated this potential problem.
– Still need to prevent narrow gate pulses to insure full switching transitions.
Symbol
ModelStructure
© 2012 Renesas Electronics America Inc. All rights reserved.10
IGBT Technology Advances – Field Stop
PT Technology Punch Through
E-field “punches through” drift region to buffer –shortens tail current.
Thin drift region lowers VCE(SAT).
Expensive epitaxial layer grown on p+ substrate.
NPT Technology Non-Punch Through
E-field dissipates in drift region – lengthens tail current, raises EOFF.
Thick drift region raises VCE(SAT).
Injection layer realized by ion implantation, no epitaxial layer.
FS Technology Field Stop
E-field “punches through” drift region to buffer –shortens tail current.
Thinnest drift region yields lowest VCE(SAT).
No epitaxial layer. Wafers as thin as 80µm.
Drawing sizes reflect the relative wafer thickness of the technologies
© 2012 Renesas Electronics America Inc. All rights reserved.12
IGBT Technology Advances – Trench Gate
The IGBT saturation voltage, VCE(SAT), is a key figure of merit. One factor contributing to the IGBT saturation voltage is the MOSFET
channel voltage.– The channel voltage is directly proportional to the channel length and
inversely proportional to the channel width. By burying the gate structure in a vertical trench, the channel geometry
can be optimized to reduce the IGBT saturation voltage by as much as 0.2V – down as low as 1.35V (typ).
This increases the Gate-Emitter capacitance, CGE, by as much as a factor of 3, which in turn increases requirements on the gate drive circuit.
Planar Gate Trench Gate
© 2012 Renesas Electronics America Inc. All rights reserved.14
IGBT Datasheet Parameters
The basic voltage and current parameters hold no real surprises. The reverse collector-emitter breakdown voltage often is left off of IGBT datasheets. 15V to 30Vis typical. Thermal considerations will limit the max current to something well below the
current the ratings stated in a datasheet. VCE(SAT) is high for an NPN power transistor and low for a PNP power Darlington.
© 2012 Renesas Electronics America Inc. All rights reserved.15
IGBT Datasheet Parameters
Cies = CGC + CGE with C-E shorted. Coes = CGC + CCE with G-E shorted. Cres = CGC with E grounded. Also
known as the Miller capacitance.
Qg = Total gate charge transferred during a switching transition.
Qge = Charge transferred before the gate plateau voltage is reached (CGE).
Qgc = Charge transferred as VCE
changes during switching (CGC).
© 2012 Renesas Electronics America Inc. All rights reserved.16
IGBT Datasheet Parameters
tDON = turn-on delay = t3 – t1 tR = rise time = t4 – t3 tON = switch-on time = t7 – t1 tDOFF = turn-off delay = t9 – t8 tF = fall time = t10 – t9 tOFF = turn-off time = t11 – t8
EON =
ETOTAL = EON + EOFF
EOFF =
© 2012 Renesas Electronics America Inc. All rights reserved.17
IGBT Datasheet Parameters
The tail current is the final decay of IC, shown to the right of the center line in this graph.
The tail current decay time is a principle component of the switching “deadtime”.
The tail current decay time adds to the effective IGBT turn-off time and increases EOFF.
© 2012 Renesas Electronics America Inc. All rights reserved.19
IGBT Switching Loss
Switching Loss During each switching event, there are transition periods when
both IC and VCE are significantly non-zero. EON is the energy (in Joules) that is dissipated in the IGBT
during the turn-on transition. EOFF is the energy (in Joules) that is dissipated in the IGBT
during the turn-off transition. ETOTAL is the total energy (in Joules) that is dissipated in the
IGBT during one complete switching cycle (EON plus EOFF). The total switching loss (in Watts) is ETOTAL multiplied by the
number of switching cycles per second (PWM base frequency).
© 2012 Renesas Electronics America Inc. All rights reserved.20
IGBT Conduction Loss
On-state current flow through an IGBT switch is a function of the PWM duty cycle and the commutation angle of the motor drive current.
The IGBT conduction loss (in Watts) is the integral of VCE(SAT) x IC
over one commutation cycle (in Joules), multiplied by the number of commutation cycles per second.
The total IGBT power loss is the sum of the switching loss and the conduction loss.
Motor Phase Current High-Side / Low-Side IGBT Conduction Loss
© 2012 Renesas Electronics America Inc. All rights reserved.22
IGBT vs MOSFET Comparisons
IGBT Applied at higher voltages
where VCESAT is less significant. Lower conduction losses at
higher currents. Higher switching losses favor
low frequency switching applications.
MOSFET Applied at lower voltages
where RDSON is very low. Lower conduction losses at
lower currents. Lower switching losses favor
high frequency switching applications.
Rule of Thumb: If the supply voltage is less than 30V, the output power is less than
250W or the switching frequency is greater than 20kHz, use a MOSFET. If the supply voltage is greater than 200V or the output power is
greater than 1kW, and the switching frequency is 20kHz or less, use an IGBT.
The lower switching losses and lower VCE(SAT) of modern IGBT’s will allow IGBT’s to displace MOSFET’s in many HEV/EV applications, especially if the 48V on-board supply is adopted.
© 2012 Renesas Electronics America Inc. All rights reserved.23
IGBT vs MOSFET Comparisons
RJH60F7DPQ VCES = 600V, IC = 90A VCESAT @50A = 1.75V tr = 81ns, tf = 74ns VFD @20A = 2.1V trr = 90ns
RJK2061JPE VDSS = 200V, ID = +/-40A RDSON @20A = 0.075 Ohm tr = 7ns, tf = 10ns VFD @40A = 1.17V trr = 155ns
Critical IGBT Specs Critical MOSFET Specs
© 2012 Renesas Electronics America Inc. All rights reserved.24
IGBT vs MOSFET Comparisons Description of system used for calculations
48V on-board supply. Air-conditioning compressor powered by a
2.17HP, 3-phase PMSM motor. Max cooling: 5530 BTU/hr = 0.46 ton. Max motor phase current: 56APEAK / 40ARMS. 20kHz sinusoidal PWM.
IGBT Conduction Loss = 56.0W IGBT Switching Loss
EON = 0.218mJ EOFF = 0.120mJ PSW = (EON + EOFF) * 20000 = 6.76W
Diode Conduction Loss = 16.8W Diode Switching Loss = 2.42W Total Power Loss = 81.98W
IGBT losses per half/bridge MOSFET losses per half/bridge
MOSFET Conduction Loss = 114.0W MOSFET Switching Loss
EON = 0.019mJ EOFF = 0.016mJ PSW = (EON + EOFF) * 20000 = 0.70W
Diode Conduction Loss = 2.34W Diode Switching Loss = 4.17W Total Power Loss = 121.21W
© 2012 Renesas Electronics America Inc. All rights reserved.26
HEV/EV Applications
In an HEV/EV, many functions that run directly from engine power in a conventional auto must now run from battery power. Transmission oil pump (hydraulic pressure for the actuators). A/C compressor. Cooling fan (still needed for the A/C condenser coil, battery
cooling and traction drive inverter cooling). Coolant pump. Power steering.
These are higher power applications that might better use IGBT’s, especially the A/C compressor and power steering.
Particularly for EV’s, the trend is to run these applications directly from the traction drive battery. This is more efficient and the higher voltage favors the use of IGBT’s.
Traction drive inverters will always use IGBT’s. Low power body applications generally will use MOSFET’s.
© 2012 Renesas Electronics America Inc. All rights reserved.27
HEV/EV Applications Many HEV/EV body applications are switching to PMSM motors for
improved reliability (no brushes). Such applications often can use 6-step trapezoidal commutation, in which
one phase is driven (PWM), one phase is always grounded and one phase is always open.
For IGBT switches, it truly is necessary to generate PWM signals only for the high-side switch. The low-side switch should remain off during PWM.
1 2 3 4 5 6STEP 1 STEP 2 STEP 3
STEP 4 STEP 5 STEP 6
• Digital outputs low for switch on.• Analog trace – Phase A current.
© 2012 Renesas Electronics America Inc. All rights reserved.29
Conclusion
The Trench Gate and Field Stop technologies used in the newer IGBT transistors are allowing IGBT’s to displace MOSFET’s in many HEV/EV applications.
The move to a 48V on-board supply makes IGBT’s much more attractive.
When performing the system design on a new HEV/EV application, it makes sense to perform power loss calculations for both types of transistor.
In an increasing percentage of applications, it will be found that IGBT’s offer a more efficient, lower cost solution.
© 2012 Renesas Electronics America Inc. All rights reserved.31
Challenge: Improve efficiency of HEV/EV automobiles.
Solution:Lower inverter losses by replacing MOSFET’s with IGBT’s in high-current applications.
‘Enabling The Smart Society’
Do you agree that this solution is viable?