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A case study in the translation of basic research in nanotechnology
Alex Robinson
IRRESISTIBLE MATERIALS
Etching Metallization Doping
Background – The Need
Develop
Positive Tone Negative Tone
2
Moore’s Law
1965
Gordon Moore proposed in 1965 that the number of components that could be produced at minimum cost on a single chip would double every year for a decade
G.E. Moore, Electronics, 38 114 (1965)
3
Diffraction
Far field (Fraunhoffer) diffraction: L > d2/λ Large source/aperture/ image separation - plane waves
d
L
4
Clearly resolved Rayleigh Not resolved
Minimum resolvable separation is when the first minimum of one aperture's image is at the centre of the other’s image
Rayleigh’s Criterion: (∆l)min= 1.22 = k1 fλ d
λ NA
f = focal length of lens d = feature diameter NA = Numerical Aperture k1 = process constant
(∆l)min
157nm Lithography 2004 - Present
International Technology Roadmap for Semiconductors, 2001
157 nm Abandoned
EUV Delayed
5
More Moore
International Technology Roadmap for Semiconductors, Update 2010
The feature size required for microelectronic devices shrinks every year “Technology Node”
65 nm 45 nm 32 nm 22 nm 16 nm 11 nm
Year of Introduction 2007 2010 2013 2016 2019 2022
Resolution Definitions
DRAM halfpitch
MPU Gate in Resist
pitch
Gate width
pitch
6
Current Generation Lithography
Extending 193 nm Lithography to fill the gap has required every trick in the book
J.H. Bruning, Proc SPIE, vol. 6520, 652004 (2007).
7
Immersion Lithography
U. Takayuki, NEC Technical Journal, vol. 4, (2009)
8
Off Axis Illumination
R.P. Seisyan, Technical Physics, vol. 56, 1061 (2011)
8
Phase Shifting Mask
R.P. Seisyan, Technical Physics, vol. 56, 1061 (2011)
Optical Proximity Correction
Mask Layout Aerial Image Resist Pattern
OPC Serifs
Double Patterning
International Technology Roadmap for Semiconductors, 2011
9
Cost of Ownership for DP
http://www.newelectronics.co.uk/electronics-technology/the-economics-of-chip-manufacture-on-advanced-technologies/35562/
10
The Future – More of the Same?
Self Aligned Quadruple Patterning
K. Nakayama et al, Proc SPIE, vol. 8327, 83270V (2012)
11
Imprint?
http://spie.org/x33843.xml
12
Directed Self Assembly?
B. Rathsack et al, Proc. SPIE, vol. 8323, 83230B, (2012)
Parallel Electron Beam?
http://www.eetimes.com/electronics-news/4370573/ISPD--Semiconductors-aim-for-8-nm-node
MAPPER
13
Extreme Ultraviolet Lithography?
http://www.betasights.net/wordpress/?p=1079
13.5 nm light Multilayer Reflective Optics
High Vacuum Exposure
14
A New NGL Resist - The Original Idea 1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016
15
The Original Idea 1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016
The first demonstration of C60 as a resist was by Rao et al, who showed that exposure to 514.5 or 488.0 nm light to a dose of 5 W/cm2 caused a photopolymerisation of the molecules.
A.M. Rao, et al, Science, 259, 955 (1993)
hν
16
1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016
Fullerene Resists
Advantages of this Resist • Very high etch resistance (Etch Rate = 1/7.5 of silicon) • High resolution (<20 nm)
Disadvantages of this Resist: • Very low sensitivity10 mC/cm2 • Requires vacuum sublimation for coating
Tada and Kanayama found that the fullerene C60 demonstrates negative tone behaviour on irradiation with electrons
T. Tada, et al, Jpn. J. Appl. Phys., 35, L63 (1996)
R
R
17
1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016
Fullerene Resists
To improve the solubility and therefore allow spin coating fullerene derivatives were synthesised by the addition of one or more addends to a fullerene cage
Methano Diels Alder
R
R
RR
R
R
18
1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016
19
1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016
Triphenylene Resists
Several polysubstituted triphenylenes, are liquid crystalline materials, allowing the deposition of smooth films by spin coating.
20
R1 R2
R1
R2R1
R2
R1 R2
R1
R2R1
R2
C5H11O O
OC5H11
OC5H11C5H11O
C5H11O
X CH2
N C5H11O O
OC5H11
OC5H11O
C5H11O
X CH2
N
XCH2
N
C5H11O O
OC5H11
C5H11O
X CH2
N
O X CH2
N
OXCH2
N
O X CH2
N
C5H11O O
OC5H11O
C5H11O
X CH2
N
XCH2
N
O
O O
OO
O
X CH2
N
R
R
R
R
R
R
CO
CH2
N O
RO
OR
OR
OR
OR
H3C
H3C
O
O
T98.0R1 = C5H11OR2 = C5H11O
T98.6R1 = C5H11OR2 = C7H15O
T98.7R1 = C5H11OR2 = C9H19O
T98.1R1 = C5H11OR2 = C2H5O
T98.4R1 = C5H11OR2 = C4H9O
T98.2R1 = C5H11OR2 = C3H7O
T98.5R1 = C5H11OR2 = C6H13O
T98.8R1 = C6H13OR2 = C6H13O
T98.12R1 = C5H11OR2 = C1H3O T98.15
R1 = C5H11OR2 = OHT98.13
R1 = C7H15OR2 = C3H7O T98.14
R1 = C8H17OR2 = C2H5O
T98.10R1 = C8H17OR2 = C2H15O T98.11
R1 = C5H11OR2 = C5H10COOHT98.9
R1 = C7H15OR2 = C3H7O
SYMMETRIC
ASYMMETRIC
n n
n
n
n
n
n
n
n
n
R=
n1
n
n
LC02-01 - X=CH2, n = 5
LC02-04 - X=CO, n = 5
LC02-03 - X=CO, n = 3
LC02-02 - X=CH2, n = 7
LC02-05 - X=CH2, n = 5
LC02-07 - X=CO, n = 5 LC02-08 -
X=CO, n = 5
LC02-09 - X=CH2, n = 5
LC02-10 - R=C5H11, n = 4, n1 = 5
LC02-13 - R=C7H15, n = 4, n1 = 5
LC02-12 - R=C6H13, n = 4, n1 = 5
LC02-11 - R=C5H11, n = 4, n1 = 10
1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016
21
C5H11O OC5H11
OC5H11
OC5H11C5H11O
C5H11O
1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 Jez Arnold on Flickr, CC BY-SA 2.0
22
Unexposed Resist Exposed Resist
Photoacid Generator H+ ∆T
hν
CA Schematic after: H. Ito, Adv. Polym. Sci., 172, 37 (2005),
Chemical Amplification
23
1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016
24
O O OH
O
H+
+ R N
O
O
CH2CH
OH
CH2CH
O
CH2CH
O
R N+H+
-CH3OH
Positive Tone Negative Tone
1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016
Chemical Amplification
25
1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016
Chemical Amplification MF03-04MF03-04[CA]
0
20
40
60
80
100
120
1 10 100 1000
650 µC/cm2
Th
ickn
ess (
nm
)
Dose (µC/cm2)
MF03-04MF03-04[CA]
650 µC/cm2
7.5 µC/cm2
MF03-04:PAG:HMMM 1 mg :0.23 mg:1.5 mg 20 keV Exposure PEB = 100 °C / 60 s 10 s MCB Development
26
1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016
Chemical Amplification
MF03-04: PAG2* :HMMM 1 mg : 1.4 mg : 1.1 mg
Dose = 5 nC/cm
PEB = 100ºC/1 m Dev = MIBK:IPA [1:3]/10 s
* PAG2 = Tris(4-tert-butylphenyl)sulfonium perfluoro-1 butane
27
1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016
(Better) Chemical Amplification
MF03-04:CL05-03:PAG [1:2:1] Exposure = 20 keV PAB = None PEB = 100 °C for 60 s Develop = 5 s, Anisole Rinse = None
0
20
40
60
80
100
10-7
10-6
10-5
0.0001 0.001 0.01
MF03-04MF03-04:CL:PI (1:2:1)
No
ma
lis
ed
Fil
m T
hic
kn
es
s (
%)
Dose (C/cm2)
550 µC/cm28 µC/cm2
28
1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016
(Better) Chemical Amplification
25 nm linewidth, swelling
Dose = 200 pC/cm at 30 keV PAB = None PEB = 90 °C for 180 s Develop = 5 s, MCB:IPA [1:1] Rinse = None
29
1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016
Triphenylene Chemical Amplification Triphenylene Derivatives - C5/C0 and C5epoxide - Sensitivity is sub 10 µC/cm2 - PAB at 60°C for 10mins
C5H11O
HO
C5H11O OH
C5H11O
OH
C5H11O
O
C5H11O O
C5H11O
O
O
O
O
S+
S S+
SbF6-
SbF6-
30
1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016
01/10/06 31/03/08 Chemically Amplified Molecular Resists for Electron Beam Lithography
01/03/08 29/01/10 Fullerene Chemical Amplified Resists for Next Generation Lithography
01/09/09 30/11/09 Fullerene Chemical Amplified Resists for Next Generation Lithography: Proof of Concept and Knowledge Transfer Project
01/01/12 31/12/14 Conductive Resists for Nanofabrication on Insulating Substrates
31
1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016
(Even Better) C60 Chemical Amplification
12 nm Linewidth Dose = 300 pC/cm at 30 keV PAB = 75 ºC for 600s PEB = 90 °C for 180 s Dev = 10 s, MCB:IPA [1:1] Rinse = 10 s, IPA
20 nm Half Pitch Dose = 140 pC/cm PAB = 75 ºC for 600s PEB = 90 °C for 180 s Dev = 10 s, MCB:IPA [1:1] Rinse = None
32
1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016
First EUV Results
50 nm Half Pitch in CL2-4
1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016
The Irresistible Era
Irresistible Materials is a spin-out company formed to commercialise UoB research in materials for semiconductor fabrication.
The company was initially conceived in 2009/2010, formally established in 2011, and continues to operate and grow.
33
August 2011 – December 2012 Formally setup as a University spinout
Commercial Lead: David Ure
Alexandra McClelland, Researcher (0.6 FTE)
Leveraged EPSRC follow on fund, with small investment from Mercia Seed Fund, and strategic alliance with Nano-C.
During year managed to secure additional TSB grant, and develop nearer-term hardmask opportunity.
1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016
The Irresistible Era
34
1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016
35
£‐
£200,000
£400,000
£600,000
£800,000
£1,000,000
£1,200,000
£1,400,000
2008 2009 2010 2011 2012
Cumula&veValueofSupportReceivedbyIrresis&bleMaterials
Investments
SourceAccess
AlliancePartner
AlliancePartner
AcademicGrants
Patentsupport
Jan 2013 – April 2014
Experienced Chairman brought in: Stuart McIntosh
Obtained further cash investment from both Mercia, and UK / US angels, and EPSRC FoF support from UoB.
IM Team expanded: Alan Brown joined, Q1 2013, 0.6 FTE Tim O’Connell: P/T Finance Manager
Continued to develop technology and gain customer traction
1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016
The Irresistible Era
36
May 2014 – December 2014 Customer interest turning into evaluations
CEO hired – Mark Shepherd
Increase Technical Manpower – AB to 1.0 FTE
Investors have continued to support the business whilst customer traction turns into customer/partner commitment
Matching Innovate UK and ABIA grants
Now planning new investment round for 2015 – to see EUV resists through to point of “adoption” by major resist companies
37
1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016
The Irresistible Era
38
£‐
£500,000
£1,000,000
£1,500,000
£2,000,000
£2,500,000
£3,000,000
2008 2009 2010 2011 2012 2013 2014
Cumula&veValueofSupportReceivedbyIrresis&bleMaterials
Investments
CompanyGrants
SourceAccess
AlliancePartner
AcademicGrants
Patentsupport
1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016
Inflection Points Attracting Investor Support
Seed Funding (2011)
• Inflection: • Proof of
principle; • Evidence of
commercial need
• Commercial lead – DU
• Strong set of advisors and alliance partner
• Ability to lever grant support
Follow on Seed (2013)
• Inflection: • De-risked by
development of nearer-term opportunity
• Initial commercial interest
• Positive technical validation
• Experienced Chairman - SM
• Broader investor base
Bridge Financing (2014)
• Inflection: • Significant
commercial interest / evaluations
• Experienced CEO - MS
• Technological breakthroughs
39
1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016
Summary
When formed, little seed investment existed: needed to lever as much grant funding as possible.
Relationship with Nano-C was key
More money only becomes available as the company develops Function of both commercial and technical evolution
For academics – the Enterprise Training is extremely useful
40
1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016
Customer/End User Driven Technical Progress
41
IRRESISTIBLE MATERIALS
• Commercial Inertia • ‘Not Invented Here’ • Standard Processes • The little details that trip you up
42
1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014
The Path to Date
Electron Beam Resist
EUV Resist
Electron Beam Mask EUV is Back too!
Resist SoC 1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014
Spin on Carbon
Gap Fill Solvent Strip/High Temp
Conductive Electron Multibeam/ Conductive Resist
Low Temp Cure
C5Ep on Glass 100 nm pitch 4.6 mC/cm2
PMMA on Glass 200 nm pitch
139 µC/cm2
PMMA on Glass 200 nm pitch
345 µC/cm2
C5Ep on Glass 150 nm pitch
50 µC/cm2
1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016
43
Conductive Resists for Nanofabrication on Insulating Substrates
Started a new project to develop a resist to enable electron beam lithography on insulating substrates.
44
Dr A. Frommhold, F. Hasan, K. Virzbickas
School of Chemical Engineering, University of Birmingham
G. O'Callaghan, D. Zhao, O. Jones, J.A. Preece School of Chemistry, University of Birmingham, B15 2TT, UK
Mr D.X. Yang, Prof R.E. Palmer Nanoscale Physics Research Laboratory, University of Birmingham
Mr V. Veijins, Mr T. Lada, Mr J. Roth, Dr X. Xue Nano-C
Mr M. Shepherd, Mr D. Ure, Ms A. McClelland, Mr A. Brown, Irresistiblematerials
Dr Y. Ekinci, Ms. M. Vockenhuber Paul Scherrer Institute, Switzerland
Dr J. Bowen School of Chemical Engineering, UoB
Dr C. Szmanda, Dr J. Shelnut The Patent Practice of Szmanda & Shelnut, LLC
Dr R. Brainard CNSE Albany
Mr Jun Sung Chun, Mr Brian Sapp SEMATECH
Acknowledgements
www.irresistiblematerials.com